Hemispherical diamond window grinding and polishing device and grinding and polishing method thereof

Abstract

The present invention provides a hemispherical diamond window grinding and polishing device and a grinding and polishing method thereof. The device comprises: a rotating clamping mechanism for fixing and controlling the object to be polished to rotate; an abrasive particle conveying mechanism driven by a moving mechanism for conveying charged abrasive particles to the surface to be polished of the object to be polished; an electric field generating component comprising at least one moving electrode, which generates an electric field away from or close to the surface to be polished of the object to be polished in the area to be polished by the moving mechanism, drives the abrasive particles to be conveyed to the surface to be polished of the object to be polished by the electric field, and realizes grinding under the rotating motion of the object to be polished.

Description

Technical Field

[0001] The invention belongs to the field of diamond window material preparation, and in particular relates to a hemispherical diamond window grinding and polishing device and a grinding and polishing method thereof. Background Art

[0002] Diamond has shown great potential in many fields with its excellent physical properties. This material is not only extremely hard, but also has a low friction coefficient and high wear resistance, which makes it perform well in contact applications. Diamond's chemical stability and high thermal conductivity also provide guarantees for its high temperature environment. In addition, diamond's high electrical resistance and excellent transmittance make it very popular in diamond electronic and optical applications. For this reason, diamond is widely regarded as one of the key materials to promote the development of future science and technology.

[0003] Diamond window materials often require a flat and smooth surface with extremely high surface accuracy and extremely low roughness to ensure that the contact area is wide enough to improve the thermal conductivity. Currently, the main processing methods for diamonds include mechanical polishing, thermochemical polishing, laser polishing, ion beam polishing, and magnetic grinding polishing.

[0004] Relevant scientific research institutions at home and abroad have used the above-mentioned grinding method to carry out research on polishing of flat diamonds. However, there are relatively few studies on polishing of spherical diamonds, and corresponding hemispherical polishing and stress monitoring devices are even rarer. CN200510102769 discloses a polishing machine that can realize diamond curved surface polishing. However, there is no patent for a related device for monitoring the stress of the diamond window material surface during the polishing process. Therefore, it is of great significance to propose and develop a grinding, polishing, stress and roughness monitoring device for the surface of hemispherical diamond window materials. Summary of the invention

[0005] The invention provides a hemispherical diamond window grinding and polishing device and a grinding and polishing method thereof, which can grind hemispherical diamonds and improve the grinding effect and yield rate of hemispherical diamonds.

[0006] In one aspect, a hemispherical diamond window grinding and polishing device is provided, comprising:

[0007] A rotating clamping mechanism, used for fixing and controlling the grinding object to rotate;

[0008] an abrasive particle conveying mechanism, driven by a moving mechanism, for conveying charged abrasive particles to the surface to be polished of the object to be polished;

[0009] The electric field generating component includes at least one movable electrode, which generates an electric field in the area to be polished away from or close to the surface to be polished of the object to be polished through a movable mechanism, drives the abrasive particles to be transported to the surface to be polished of the object to be polished through the electric field, and realizes grinding under the rotational motion of the object to be polished.

[0010] Optionally, the moving mechanism comprises:

[0011] A support frame and a first movable member, wherein the support frame is provided with a movable track, the first movable member is provided on the support frame, and the first movable member can move along the movable track, the movable electrode is provided on the first movable member located on one side of the object to be polished, and a conformal electrode is provided on the other side of the object to be polished, and the polarity of the conformal electrode is opposite to that of the movable electrode.

[0012] Optionally, the rotating clamping mechanism comprises:

[0013] The rotating member comprises a power unit and a first transmission gear, wherein the power unit is used to drive the first transmission gear to rotate;

[0014] The fixing part includes a second transmission gear and a fixing column, one end of the fixing column is fixedly connected to the second transmission gear, and the other end of the fixing column is fixedly connected to the conformal electrode. The conformal electrode is provided with an adsorption part, and the adsorption part is used to adsorb the object to be polished. The first transmission gear is meshed with the second transmission gear.

[0015] Optionally, the abrasive particles are one or more of iron particles, cobalt particles, and nickel particles.

[0016] Optionally, the voltage between the movable electrode and the conformal electrode is 12-48V.

[0017] Optionally, the abrasive particle conveying mechanism comprises:

[0018] A dripper and a container bottle, wherein the dripper is fixed on the first movable member and is provided with a retractable nozzle, and is used for conveying the abrasive particles stored in the container bottle to the surface to be polished.

[0019] Optionally, the device further comprises:

[0020] The monitoring component comprises a roughness detection unit and a stress detection unit, wherein the roughness detection unit is used to detect the roughness of the surface of the polished object, and the stress detection unit is used to detect the stress of the surface of the polished object.

[0021] Optionally, the roughness detection unit includes a white light interferometry roughness measuring instrument and a white light interferometry roughness measuring probe, and the stress detection unit includes a Raman spectrometer and a Raman spectrometer probe;

[0022] The moving mechanism also includes a second moving member, which is arranged on the support frame and can move along a moving track on the support frame; the white light interferometry roughness measurement probe and the Raman spectrum probe are arranged on the second moving member, and the second moving member can control the distance between the white light interferometry roughness measurement probe and the polished object, and the distance between the Raman spectrum probe and the polished object.

[0023] On the other hand, a method for grinding and polishing a hemispherical diamond window is provided, the method being applied to the hemispherical diamond grinding and polishing device as described above, comprising:

[0024] Using the electric field generating component to polish the surface to be polished of the object to be polished;

[0025] Obtain the stress on the surface of the polished object;

[0026] When the stress does not meet the requirement, removing the object to be polished and annealing the object to be polished;

[0027] The object to be polished is polished again, and when the roughness of the surface of the object to be polished is lower than the roughness threshold, the polishing is terminated.

[0028] Optionally, annealing the polished object comprises:

[0029] The polished object is annealed in an annealing furnace at a temperature of 800-1200° C. The annealing time is 0.5-1.5 h. The atmosphere in the annealing furnace is any one or more combinations of vacuum atmosphere, nitrogen atmosphere or argon atmosphere.

[0030] The technical solution provided by the embodiments of the present disclosure has the following beneficial effects:

[0031] In the disclosed embodiment, a hemispherical diamond window grinding and polishing device is provided, which includes a rotating clamping mechanism, an abrasive particle conveying mechanism and an electric field generating component, wherein the rotating clamping mechanism is used to control the rotation of the object to be polished (hemispherical diamond), the abrasive particle conveying mechanism is used to convey the abrasive particles, and the electric field generating component is used to generate an electric field, and control the abrasive particles to grind the surface to be polished by the electric field, thereby achieving a polishing effect. The abrasive particles are controlled by the electric field for grinding and polishing, and the grinding and polishing efficiency and effect during the grinding and polishing process can be controlled by adjusting the electric field strength, which can improve the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] Figure 1 A schematic structural diagram of a hemispherical diamond window grinding and polishing device provided in an embodiment of the present disclosure;

[0034] Figure 2 A structural schematic diagram of a rotating clamping mechanism provided in an embodiment of the present disclosure;

[0035] Figure 3 A schematic structural diagram of another hemispherical diamond window grinding and polishing device provided in an embodiment of the present disclosure;

[0036] Figure 4 A schematic diagram of the structure of an electric field generating component provided in an embodiment of the present disclosure;

[0037] Figure 5 A method flow chart of a method for polishing a hemispherical diamond window provided in an embodiment of the present disclosure.

[0038] The reference numerals are as follows:

[0039] 1: Rotating clamping mechanism; 11: Rotating member; 111: Power unit; 112: First transmission gear; 12: Fixed member; 121: Second transmission gear; 122: Fixed column;

[0040] 2: The object being polished;

[0041] 3: grinding particle conveying mechanism; 31: drip feeder; 32: container bottle;

[0042] 4: moving mechanism; 41: supporting frame; 411: moving track; 42: first moving member; 43: second moving member.

[0043] 5: electric field generating component; 51: mobile electrode; 52: conformal electrode; 521: adsorption component; 53: adjustable power supply;

[0044] 6: monitoring component; 61: roughness detection unit; 611: white light interferometry roughness measuring instrument; 612: white light interferometry roughness measuring probe; 62: stress detection unit; 621: Raman spectrometer; 622: Raman spectrometer probe. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] Figure 1 A schematic diagram of the structure of a hemispherical diamond window grinding and polishing device provided in an embodiment of the present disclosure. Figure 1 , the device comprises:

[0047] A rotating clamping mechanism 1, used for fixing and controlling the grinding object 2 to rotate;

[0048] an abrasive particle conveying mechanism 3, driven by a moving mechanism 4, for conveying charged abrasive particles to the surface to be polished of the object 2 to be polished;

[0049] The electric field generating component 5 includes at least one movable electrode 51, which generates an electric field away from or close to the surface to be polished of the object 2 to be polished in the area to be polished through the moving mechanism 4, and drives the abrasive particles to be transported to the surface to be polished of the object 2 to be polished through the electric field, so as to realize grinding under the rotational motion of the object 2 to be polished.

[0050] In the disclosed embodiment, a hemispherical diamond window grinding and polishing device is provided, which includes a rotating clamping mechanism, an abrasive particle conveying mechanism and an electric field generating component, wherein the rotating clamping mechanism is used to control the rotation of the object to be polished (hemispherical diamond), the abrasive particle conveying mechanism is used to convey the abrasive particles, and the electric field generating mechanism is used to generate an electric field, and control the abrasive particles to grind the surface to be polished by the electric field, thereby achieving a polishing effect. The abrasive particles are controlled by the electric field for grinding and polishing, and the grinding and polishing efficiency and effect during the grinding and polishing process can be controlled by adjusting the electric field strength, which can improve the yield rate.

[0051] It is worth noting that the surface roughness of the hemispherical diamond polished by the hemispherical diamond window polishing device of the present invention can be less than 0.1 μm.

[0052] In the embodiment of the present disclosure, the moving mechanism 4 includes:

[0053] A support frame 41 and a first movable member 42, wherein the support frame 41 is provided with a movable track 411, the first movable member 42 is provided on the support frame 41, and the first movable member 42 can move along the movable track 411, the movable electrode 51 is provided on the first movable member 42 located on one side of the polished object 2, and a conformal electrode is provided on the other side of the polished object 2, and the polarity of the conformal electrode is opposite to that of the movable electrode 51.

[0054] In the embodiment of the present disclosure, the shape of the conformal electrode is consistent with the shape of the object being polished. For example, if the object being polished is a hemispherical diamond, the conformal electrode is a hemispherical electrode.

[0055] In the embodiment of the present disclosure, the mobile electrode can be moved by the moving assembly, so that the mobile electrode can be controlled to form an electric field in any area on the surface of the object to be polished, so as to grind the object to be polished. In addition, a conformal electrode is provided on the other side of the object to be polished, and the shape of the conformal electrode can be set according to the shape of the object to be polished. For example, the conformal electrode is a hemispherical electrode, so as to ensure the stability of the electric field formed between the conformal electrode and the mobile electrode.

[0056] In the embodiment of the present disclosure, the movable electrode is a positive electrode, and the conformal electrode is a negative electrode.

[0057] In the embodiment of the present disclosure, however, the direction of the electric field formed by the moving electrode and the conformal electrode is perpendicular to the surface to be polished, which is the normal vector direction of the surface to be polished.

[0058] Figure 2 This is a schematic diagram of a rotary clamping mechanism provided by an embodiment of the present disclosure. Figure 2 , the rotating clamping mechanism 1 comprises:

[0059] The rotating member 11 comprises a power unit 111 and a first transmission gear 112, wherein the power unit 111 is used to drive the first transmission gear 112 to rotate;

[0060] The fixing member 12 includes a second transmission gear 121 and a fixing column 122, one end of the fixing column 122 is fixedly connected to the second transmission gear 121, and the other end of the fixing column 122 is fixedly connected to the conformal electrode 52. An adsorption member 521 is provided on the conformal electrode 52, and the adsorption member 521 is used to adsorb the polished object 2. The first transmission gear 112 is meshed with the second transmission gear 121.

[0061] In one example, the fixing member and the conformal electrode may be connected via a suction cup.

[0062] In the embodiment of the present disclosure, by setting the rotating clamping mechanism in the above manner, the fixing function and the rotating function of the rotating clamping mechanism can be realized.

[0063] In the embodiment of the present disclosure, there are multiple rotating members 11. On the one hand, the rotating members can bear the weight, and the bearing effect of multiple rotating members is better and more stable. On the other hand, multiple rotating members can ensure the rotation speed.

[0064] In the embodiment of the present disclosure, the power unit 111 may be a motor.

[0065] In the embodiment of the present disclosure, the first transmission gear 112 and the second transmission gear 121 are bevel gears. Bevel gears can ensure a better transmission effect. In addition, bevel gears are conducive to load-bearing.

[0066] In the embodiment of the present disclosure, there are multiple fixing posts 122 to ensure the fixing effect.

[0067] See again Figure 1 In the disclosed embodiment, the abrasive particles are one or more of iron particles, cobalt particles, and nickel particles.

[0068] In the disclosed embodiment, the electric field has a better control effect on the above-mentioned particles, thereby ensuring a better grinding and polishing effect.

[0069] In the embodiment of the present disclosure, electrophoresis technology can be used to make the abrasive particles have positive charges.

[0070] In the embodiment of the present disclosure, the voltage between the mobile electrode 51 and the conformal electrode 52 is 12-48V.

[0071] The magnitude of the electric field force on the abrasive particles is 0-7000g, and the electric field force on the abrasive particles is also the force applied by the abrasive particles to the surface to be polished.

[0072] In the disclosed embodiment, the greater the voltage between the positive electrode and the negative electrode, the greater the electric field strength will be, the greater the electric field force on the abrasive particles will be, and the higher the grinding and polishing efficiency will be. However, the greater the voltage, the worse the grinding and polishing effect will be. Using the voltage within the above range, the grinding and polishing effect and the grinding and polishing effect can be ensured at the same time.

[0073] In the embodiment of the present disclosure, the abrasive particle conveying mechanism 3 comprises:

[0074] The dripper 31 and the container bottle 32, wherein the dripper 31 is fixed on the first moving member 42, and the dripper 31 is provided with a retractable nozzle, and the dripper 31 is used to transport the abrasive particles stored in the container bottle 32 to the surface to be polished.

[0075] In the embodiment of the present disclosure, a dropper and a container bottle are provided to deliver abrasive particles to the surface to be polished of the polished object, and the dropper is provided on the first movable member, and the movable electrode is also provided on the first movable member, so that the dropper can directly deliver the abrasive particles to the electric field between the movable electrode and the conformal electrode, and the abrasive particles can be directly moved to the surface to be polished under the action of the electric field. The dropper also has a retractable nozzle, and when abrasive particles need to be added, the dropper extends the nozzle to ensure that the dropper can accurately deliver the abrasive particles. When abrasive particles do not need to be added, the dropper can retract the nozzle to avoid damage to the dropper during the polishing process.

[0076] In the disclosed embodiment, the electric field generating structure 5 further includes an adjustable power supply 53, which is used to supply power to the movable electrode 51 and the conformal electrode 52. Meanwhile, the adjustable power supply 53 can facilitate adjusting the voltage between the movable electrode 51 and the conformal electrode 52.

[0077] In the embodiment of the present disclosure, the device further includes:

[0078] The monitoring component 6 includes a roughness detection unit 61 and a stress detection unit 62 . The roughness detection unit 61 is used to detect the roughness of the surface of the polished object 2 , and the stress detection unit 62 is used to detect the stress of the surface of the polished object 2 .

[0079] In the disclosed embodiment, the roughness of the object being polished during the polishing process is obtained through the roughness detection unit, and the voltage between the mobile electrode and the conformal electrode is adjusted according to the obtained roughness information, thereby adjusting the polishing effect during the polishing process, which plays a role in improving the polishing efficiency and the yield rate. The stress of the object being polished during the polishing process is obtained through the stress detection unit. When the stress is too large, it will affect the quality of the object being polished. The stress of the object being polished can be reduced before polishing, thereby further ensuring the quality of the object being polished.

[0080] In the embodiment of the present disclosure, the roughness detection unit 61 includes a white light interferometer roughness measurement instrument 611 and a white light interferometer roughness measurement probe 612, and the stress detection unit 62 includes a Raman spectrometer 621 and a Raman spectrometer probe 622;

[0081] The moving mechanism 4 also includes a second moving member 43, which is arranged on the support frame 41 and can move along the moving track 411 on the support frame 41; the white light interferometry roughness measurement probe 612 and the Raman spectrum probe 622 are arranged on the second moving member 43, and the second moving member 43 can control the distance between the white light interferometry roughness measurement probe 612 and the polished object 2, and the distance between the Raman spectrum probe 622 and the polished object 2.

[0082] In the disclosed embodiment, a white light interferometer roughness meter and a Raman spectrometer are used to detect the polished object, which can ensure the accuracy of the roughness and stress obtained. The white light interferometer roughness measurement probe and the Raman spectrometer are set in the above manner. On the one hand, the distance between the white light interferometer roughness measurement probe and the Raman spectrometer and the polished object is adjustable, so as to ensure that the probe can accurately focus on the hemispherical diamond window to ensure the measurement effect. On the other hand, the probe can follow the second moving part to move on the moving track, so as to detect different areas on the surface of the polished object.

[0083] In the embodiment of the present disclosure, the wavelength of the laser emitted by the laser used in the Raman spectrometer is 532nm or 633nm. Using the laser with the above wavelength can ensure a better detection effect.

[0084] In the disclosed embodiment, the Raman spectrometer detects the Raman peak of the polished object through Raman detection, and determines the stress magnitude of the polished object according to the peak shift of the Raman peak.

[0085] In the embodiment of the present disclosure, the moving angle of the second moving member on the moving track is 0° to 120°, that is, the moving angle of the probe is 0° to 120°.

[0086] It is worth noting that the hemispherical diamond window grinding and polishing device provided by the present disclosure may also be equipped with a control system. The control system adjusts the pressure between the abrasive particles and the diamond surface by adjusting the size of the electric field, thereby regulating the removal efficiency of the diamond surface polishing, thereby improving the surface roughness and yield of the hemispherical diamond window product.

[0087] Figure 3 A schematic diagram of the structure of another hemispherical diamond window grinding and polishing device provided in an embodiment of the present disclosure. Figure 3 ,exist Figure 3 In the embodiment, another arrangement of the moving mechanism and the electric field generating component is provided. Figure 3 The device shown is suitable for grinding the inner surface of the object to be polished.

[0088] Figure 4 A schematic diagram of the structure of an electric field generating component provided by an embodiment of the present disclosure. Figure 4 , the electric field generating component is Figure 3 The electric field generating components in.

[0089] Among them, the movable electrode is the positive electrode and the conformal electrode is the negative electrode.

[0090] In the disclosed embodiment, when the outer surface of the hemispherical diamond material is polished, a negative electrode is arranged on one side of the inner surface of the hemispherical diamond window material, and a positive electrode is arranged on one side of the outer surface. When the inner surface of the hemispherical diamond material is polished, a positive electrode is arranged on one side of the inner surface of the hemispherical diamond window material, and a negative electrode is arranged on one side of the outer surface.

[0091] Figure 5 A method flow chart of a method for grinding and polishing a hemispherical diamond window provided in an embodiment of the present disclosure. Figure 5 The method steps include:

[0092] S101, using the electric field generating assembly to polish the surface to be polished of the object to be polished.

[0093] In one example, step S101 includes:

[0094] In the first step, the object to be ground is fixed on the rotating clamping mechanism.

[0095] Before the object to be polished is fixed on the rotating clamping mechanism, the object to be polished needs to be cleaned. In one example, the cleaning process is as follows:

[0096] The polished object was ultrasonically cleaned with acetone and anhydrous ethanol for 10 minutes respectively, and then the polished object was cleaned with deionized water for 15 minutes. After being cleaned, the polished object was blown dry with dry nitrogen and fixed on the rotating clamping mechanism with a suction cup.

[0097] In the embodiment of the present disclosure, the object to be polished is a hemispherical diamond.

[0098] In another example, for an object that has been surface-polished, the cleaning process is as follows:

[0099] First, a 10% hydrofluoric acid solution was used to separate the hemispherical diamond window material sample that had been polished from the silicon ball. The hemispherical diamond window material was cleaned by ultrasonic cleaning with acetone and anhydrous ethanol for 10 minutes respectively, and then cleaned with deionized water for 15 minutes. The cleaned material was blown dry with dry nitrogen and fixed on the rotating clamping mechanism with a suction cup.

[0100] The second step is to turn on the electric field generating component to generate an electric field to control the abrasive particles to grind the object being polished.

[0101] In one example, during the grinding process, the positive and negative electrodes are first energized, the initial voltage is set to 24V, and then the abrasive particle conveying mechanism is turned on. After the abrasive particles are sprayed on the surface of the object to be polished, the dripper of the abrasive particle conveying mechanism is retracted; the height of the electric field generating component is set, and the speed of the rotating clamping mechanism is set to 80r / min; the grinding pressure is 3000g; the grinding time is 10min; after the grinding time is over, the electric field generating component is retracted.

[0102] The abrasive particles are nickel particles that are positively charged after electrophoresis.

[0103] In another example, for the object to be polished that has undergone surface grinding and polishing, during the grinding process, the electric field generating component is turned on, the positive and negative electrodes are energized, the initial voltage is set to 24V, and then the abrasive particle conveying mechanism is turned on to convey the abrasive particles. After the abrasive particles are sprayed on the surface of the object to be polished, the dropper of the abrasive particle conveying mechanism is retracted; the height of the electric field generating component is set, and the speed of the rotating clamping mechanism is set to 50r / min; the grinding pressure is 7000g; the grinding time is 15min; after the grinding and polishing time is over, the electric field generating component is retracted.

[0104] S102, obtaining stress on the surface of the polished object.

[0105] In one example, step S102 includes:

[0106] The stress detection unit extends the Raman spectrum probe and takes an average of 10 measurement points on the polishing area of ​​the polished surface for stress detection. The laser in the Raman detector uses a 633nm wavelength laser with a test range of 500-1800cm -1 , by adjusting the distance between the probe and the hemispherical diamond window, ensure the probe is accurately focused. The residual stress on the surface of the hemispherical diamond window material is calculated based on the peak shift of the Raman test.

[0107] In another example, for the object to be polished after surface grinding and polishing, step S102 includes:

[0108] The stress detection unit extends the Raman spectrometer probe and takes an average of 10 measurement points on the polishing area of ​​the polished object surface for stress detection. The laser in the Raman spectrometer uses a 532nm wavelength laser with a test range of 500-1800 cm -1 , by adjusting the distance between the probe and the hemispherical diamond window, ensure the probe is accurately focused. The residual stress on the surface of the hemispherical diamond window material is calculated based on the peak shift of the Raman test.

[0109] S103: When the stress does not meet the requirement, remove the object to be polished and anneal the object to be polished.

[0110] Among them, the stress threshold of stress is 80Mpa. When the stress measured at multiple measuring points is greater than the safety stress, the stress of the polished object does not meet the requirement.

[0111] In one example, step S103 includes:

[0112] The polished object is annealed in an annealing furnace at a temperature of 800-1200° C. The annealing time is 0.5-1.5 h. The atmosphere in the annealing furnace is any one or more combinations of vacuum atmosphere, nitrogen atmosphere or argon atmosphere.

[0113] Exemplarily, the polished object is annealed in an annealing furnace at a temperature of 1200° C., the annealing time is 45 minutes, and the atmosphere in the annealing furnace is any one or more combinations of vacuum atmosphere, nitrogen atmosphere or argon atmosphere.

[0114] In the embodiment of the present disclosure, when the stress of the object being polished does not meet the requirement, annealing the object being polished under the above environment can effectively reduce the stress of the object being polished.

[0115] After the annealing is completed, the stress of the polished object is detected again to ensure that the stress of the polished object is lower than the stress threshold.

[0116] In another example, for the object to be polished after surface grinding and polishing, step S103 includes:

[0117] The polished object is annealed in an annealing furnace at a temperature of 1000° C. The annealing time is 1 hour. The atmosphere in the annealing furnace is any one or more combinations of a vacuum atmosphere, a nitrogen atmosphere, or an argon atmosphere.

[0118] S104, polishing the object to be polished again, and ending the polishing when the roughness of the surface of the object to be polished is lower than a roughness threshold.

[0119] In one example, step S104 includes:

[0120] Five measuring points are selected on the surface of the polished object for roughness detection. When the detected roughness is lower than the roughness threshold, polishing is terminated.

[0121] Among them, the roughness threshold is 1nm.

[0122] After polishing, clean the polished object again. The cleaning steps are as follows:

[0123] Use acetone and anhydrous ethanol to ultrasonically clean the polished object for 10 minutes respectively, and then use deionized water to clean it for 15 minutes. After cleaning, the polished object can be blown dry with dry nitrogen.

[0124] In an embodiment of the present disclosure, a method for polishing a hemispherical diamond window is provided, in which an electric field is generated by an electric field generating component, and the electric field is used to control abrasive particles to polish the surface of the object being polished, thereby achieving a polishing effect. In this method, the stress of the object being polished during the polishing process is obtained. When the stress is too large, it will affect the quality of the object being polished. After reducing the stress of the object being polished, polishing is performed again, thereby ensuring the quality of the object being polished and improving the polishing effect and yield rate of the object being polished.

[0125] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A hemispherical diamond window grinding and polishing device, characterized in that: include: A rotating clamping mechanism is used to fix and control the rotation of the object being polished; an abrasive particle conveying mechanism, driven by a moving mechanism, for conveying charged abrasive particles to the surface to be polished of the object to be polished; The electric field generating component includes at least one movable electrode, which generates an electric field in the area to be polished away from or close to the surface to be polished of the object to be polished through a movable mechanism, drives the abrasive particles to be transported to the surface to be polished of the object to be polished through the electric field, and realizes grinding under the rotational motion of the object to be polished.

2. The hemispherical diamond window grinding and polishing device according to claim 1, characterized in that: The moving mechanism comprises: A support frame and a first movable member, wherein the support frame is provided with a movable track, the first movable member is provided on the support frame, and the first movable member can move along the movable track, the movable electrode is provided on the first movable member located on one side of the object to be polished, and a conformal electrode is provided on the other side of the object to be polished, and the polarity of the conformal electrode is opposite to that of the movable electrode.

3. The hemispherical diamond window grinding and polishing device according to claim 2, characterized in that: The rotary clamping mechanism comprises: The rotating member comprises a power unit and a first transmission gear, wherein the power unit is used to drive the first transmission gear to rotate; The fixing part includes a second transmission gear and a fixing column, one end of the fixing column is fixedly connected to the second transmission gear, and the other end of the fixing column is fixedly connected to the conformal electrode. The conformal electrode is provided with an adsorption part, and the adsorption part is used to adsorb the object to be polished. The first transmission gear is meshed with the second transmission gear.

4. The hemispherical diamond window grinding and polishing device according to claim 1, characterized in that: The abrasive particles are one or more of iron particles, cobalt particles, and nickel particles.

5. The hemispherical diamond window grinding and polishing device according to claim 2, characterized in that: The voltage between the movable electrode and the conformal electrode is 12-48V.

6. The hemispherical diamond window grinding and polishing device according to claim 2, characterized in that: The abrasive particle conveying mechanism comprises: A dripper and a container bottle, wherein the dripper is fixed on the first movable member and is provided with a retractable nozzle, and is used for conveying the abrasive particles stored in the container bottle to the surface to be polished.

7. The hemispherical diamond window grinding and polishing device according to claim 2, characterized in that: The device also includes: The monitoring component comprises a roughness detection unit and a stress detection unit, wherein the roughness detection unit is used to detect the roughness of the surface of the polished object, and the stress detection unit is used to detect the stress of the surface of the polished object.

8. The hemispherical diamond window grinding and polishing device according to claim 7, characterized in that: The roughness detection unit includes a white light interferometer roughness measuring instrument and a white light interferometer roughness measuring probe, and the stress detection unit includes a Raman spectrometer and a Raman spectrometer probe; The moving mechanism also includes a second moving member, which is arranged on the support frame and can move along a moving track on the support frame; the white light interferometry roughness measurement probe and the Raman spectrum probe are arranged on the second moving member, and the second moving member can control the distance between the white light interferometry roughness measurement probe and the polished object, and the distance between the Raman spectrum probe and the polished object.

9. A method for grinding and polishing a hemispherical diamond window, characterized in that: The method is applied to the hemispherical diamond window grinding and polishing device as claimed in claim 8, comprising: Using the electric field generating component to polish the surface to be polished of the object to be polished; Obtain the stress on the surface of the polished object; When the stress does not meet the requirement, removing the object to be polished and annealing the object to be polished; The object to be polished is polished again, and when the roughness of the surface of the object to be polished is lower than the roughness threshold, the polishing is terminated.

10. The method for grinding and polishing a hemispherical diamond window according to claim 9, characterized in that: Annealing the polished object comprises: The polished object is annealed in an annealing furnace at a temperature of 800-1200° C. The annealing time is 0.5-1.5 h. The atmosphere in the annealing furnace is any one or more combinations of vacuum atmosphere, nitrogen atmosphere or argon atmosphere.

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