A hot pressing device for semiconductor processing

Abstract

The present invention relates to the technical field of hot pressing devices, and in particular to a hot pressing device for semiconductor processing, comprising a processing table and a pressing mechanism, wherein a bracket matched with the pressing mechanism is fixedly arranged on the processing table, a positioning mold for placing semiconductors is arranged on the processing table, a plurality of placement grooves for placing semiconductors are opened on the positioning mold, a support plate is arranged in the placement groove, a first spring is arranged between the support plate and the placement groove, a limiting mechanism matched with the support plate is arranged on the positioning mold, and a reset mechanism is arranged between the processing table and the positioning mold, the semiconductor is hot pressed by arranging the pressing mechanism and the hot pressing plate, the support plate and the semiconductor carried by the support plate are limited by arranging the limiting mechanism, and when the processing is completed, the limiting mechanism cancels the limitation of the support plate, so that the semiconductor is separated from the placement groove, the difficulty of collecting is reduced, and thus the processing efficiency of the hot pressing device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of hot pressing devices, and in particular to a hot pressing device for semiconductor processing. Background Art

[0002] A semiconductor is a material whose electrical conductivity is between that of a conductor and an insulator. At room temperature, the conductivity of a semiconductor is between that of a conductor (such as a metal) and an insulator (such as plastic or glass). The conductivity of a semiconductor can be adjusted by doping, illumination, electric field, etc. Common semiconductor materials include silicon, germanium and gallium arsenide, of which silicon is the most widely used. Semiconductors are widely used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting and other fields. An integrated circuit is a collection of circuits made of semiconductor materials, while a chip is an electronic product composed of one or more integrated circuits. It can be said that semiconductors are the cornerstone of modern electronic technology and are of great significance to scientific and economic development.

[0003] Existing hot pressing devices for semiconductor processing generally use a bearing device with a groove to carry and limit the semiconductor to prevent it from moving away from a preset position during hot pressing. In addition, in order to increase efficiency, existing hot pressing devices generally process multiple semiconductors at the same time.

[0004] However, in actual use, the semiconductor is in the groove of the supporting device after hot pressing, which makes it inconvenient to take out the processed semiconductor for collection, thus affecting the processing efficiency of the hot pressing device. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the prior art, such as it is inconvenient to take out and collect the semiconductors after processing, which affects the processing efficiency, and to propose a hot pressing device for semiconductor processing.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A hot pressing device for semiconductor processing is designed, comprising a processing table and a pressing mechanism, wherein a bracket matching with the pressing mechanism is fixedly arranged on the processing table, a positioning mold for placing semiconductors is arranged on the processing table, and a hot pressing plate is fixedly arranged on the pressing mechanism;

[0008] The positioning mold is provided with a plurality of placement grooves for placing semiconductors, a support plate is provided in the placement groove, a first spring is provided between the support plate and the placement groove, a support plate matched with the support plate is fixedly provided in the placement groove, a limiting mechanism matched with the support plate is provided on the positioning mold, a reset mechanism is provided between the processing table and the positioning mold, and a cylinder connected to the power of the positioning mold is fixedly provided on the processing table.

[0009] Furthermore, guide grooves are provided on both sides of the placement groove, guide plates matching the guide grooves are fixedly provided on both sides of the support plate, and the limiting mechanism is clamped with the guide plates.

[0010] Furthermore, the limiting mechanism includes a receiving groove opened in the guide groove, and a first clamping member and a second clamping member are slidably arranged in the two receiving grooves respectively, and the first clamping member and the second clamping member are relatively arranged to clamp the guide plates on both sides of the support plate.

[0011] Furthermore, a second spring is arranged between the first clamp and the second clamp and the accommodating groove, a connecting groove matching with the first clamp and the second clamp is opened at the lower end of the positioning mold, a first connecting plate is fixedly arranged between multiple first clamps, a second connecting plate is fixedly arranged between multiple second clamps, and the first connecting plate and the second connecting plate are both slidably arranged in the connecting groove.

[0012] Furthermore, a guide groove is provided at the lower end of the positioning mold, and a guide column matching the guide groove is fixedly arranged on the processing table.

[0013] Furthermore, two movable grooves are provided in the guide groove, wedge blocks are slidably arranged in the movable grooves, slots matching with the wedge blocks are provided on the guide columns, and the two wedge blocks are fixedly connected to the first connecting plate and the second connecting plate respectively.

[0014] Furthermore, the reset mechanism includes a reset frame, on which a plurality of plug-in posts are fixedly provided, the plug-in posts are movably plugged into the processing table, and the plug-in posts are provided with an inclined surface which is aligned with the support plate.

[0015] Furthermore, a vertical plate is fixedly provided on the processing table, a guide rod matched with the vertical plate is fixedly provided on the reset frame, and a power structure is provided between the reset frame and the positioning mold.

[0016] Furthermore, the power structure includes a toggle member fixedly connected to the positioning mold, a turntable is rotatably provided on the processing table, a toggle column matching the toggle member is fixedly provided on the turntable, a gear is fixedly provided on the turntable, and a rack meshingly connected to the gear is fixedly provided on the reset frame.

[0017] Furthermore, an L-shaped plate is fixedly arranged on the processing table, the L-shaped plate is rotationally connected to the gear, and a torsion spring is arranged between the gear and the L-shaped plate.

[0018] The invention provides a hot pressing device for semiconductor processing, which has the following beneficial effects:

[0019] In the present invention, a pressing mechanism and a hot pressing plate are provided to perform hot pressing on the semiconductor, and a limiting mechanism is provided to limit the support plate and the semiconductor carried by the support plate. When the processing is completed, the limiting mechanism cancels the limit on the support plate, and the support plate drives the semiconductor to move upward under the action of the first spring, so that the semiconductor is separated from the placement groove, reducing the difficulty of collecting, thereby improving the processing efficiency of the hot pressing device;

[0020] Secondly, in the present invention, a reset mechanism is provided to press the support plate downward to reset it, thereby exposing the placement groove, thereby facilitating the placement of the semiconductor to be processed into the placement groove and limiting the position of the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic structural diagram of a hot pressing device for semiconductor processing proposed by the present invention;

[0022] Figure 2 It is a structural schematic diagram of the positioning mold of the present invention;

[0023] Figure 3 It is a schematic diagram of the enlarged structure of the A area of ​​the present invention;

[0024] Figure 4 It is a structural schematic diagram of the support plate of the present invention;

[0025] Figure 5 It is a structural schematic diagram of the wedge block of the present invention;

[0026] Figure 6 It is a structural schematic diagram of the mobile frame of the present invention;

[0027] Figure 7 It is a structural schematic diagram of the toggle member of the present invention;

[0028] Figure 8 It is a schematic structural diagram of the turntable of the present invention.

[0029] In the figure: 1. processing table; 2. pressing mechanism; 3. bracket; 4. positioning mold; 41. placement groove; 42. support plate; 43. first spring; 44. support plate; 45. guide plate; 5. limiting mechanism; 51. first clamp; 52. second clamp; 53. second spring; 54. first connecting plate; 55. second connecting plate; 56. guide groove; 57. guide column; 58. wedge block; 6. reset mechanism; 61. reset frame; 62. plug column; 63. vertical plate; 64. guide rod; 7. cylinder; 8. power structure; 81. toggle member; 82. turntable; 83. toggle column; 84. gear; 85. rack; 86. L-shaped plate. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0031] Reference Figure 1-8 A hot pressing device for semiconductor processing includes a processing table 1 and a pressing mechanism 2, a bracket 3 matched with the pressing mechanism 2 is fixedly arranged on the processing table 1, a positioning mold 4 for placing the semiconductor is arranged on the processing table 1, and a hot pressing plate is fixedly arranged on the pressing mechanism 2;

[0032] The positioning mold 4 is provided with a plurality of placement grooves 41 for placing semiconductors, a support plate 42 is provided in the placement groove 41, a first spring 43 is provided between the support plate 42 and the placement groove 41, a support plate 44 matched with the support plate 42 is fixedly provided in the placement groove 41, a limiting mechanism 5 matched with the support plate 42 is provided on the positioning mold 4, a reset mechanism 6 is provided between the processing table 1 and the positioning mold 4, and a cylinder 7 connected to the power of the positioning mold 4 is fixedly provided on the processing table 1.

[0033] In the present invention, the semiconductor is accommodated and positioned by the placement groove 41, so as to prevent the semiconductor from moving away from the preset position during hot pressing. The first spring 43 is provided for buffering to prevent the semiconductor from being damaged during the hot pressing process. The position of the support plate 42 is limited by the limiting mechanism 5 to prevent it from being pushed upward by the first spring 43 and blocking the placement groove 41. When the semiconductor hot pressing process is completed, the limiting mechanism 5 cancels the limit on the support plate 42, and the support plate 42 drives the semiconductor upward under the action of the first spring 43, so that the semiconductor is separated from the placement groove, reducing the difficulty of collecting, thereby improving the processing efficiency of the hot pressing device.

[0034] Reference Figure 4 Furthermore, in the present embodiment, guide grooves are provided on both sides of the placement groove 41, guide plates 45 matching the guide grooves are fixedly provided on both sides of the support plate 42, and the limiting mechanism 5 is engaged with the guide plate 45. The position of the guide plate 45 is limited by the limiting mechanism 5 to prevent it from being pushed upward by the first spring 43 to block the placement groove 41, so that the placement groove 41 leaks out, which is convenient for placing semiconductors.

[0035] Reference Figure 4In this embodiment, the limiting mechanism 5 includes a receiving groove opened in the guide groove, and a first clamping member 51 and a second clamping member 52 are respectively slidably arranged in the two receiving grooves. The first clamping member 51 and the second clamping member 52 are relatively arranged to clamp the guide plates 45 on both sides of the support plate 42. A first clamping member 51 and a second clamping member 52 are arranged in a placement groove 41, and the guide plates 45 on both sides of the support plate 42 are limited by the first clamping member 51 and the second clamping member 52. The first clamping member 51 and the second clamping member 52 are both provided with limiting parts, and the limiting parts are both provided with inclined surfaces.

[0036] Reference Figure 4 Furthermore, in the present embodiment, a second spring 53 is provided between the first clamp 51 and the second clamp 52 and the accommodating groove, a connecting groove matching with the first clamp 51 and the second clamp 52 is provided at the lower end of the positioning mold 4, a first connecting plate 54 is fixedly provided between the plurality of first clamps 51, a second connecting plate 55 is fixedly provided between the plurality of second clamps 52, the first connecting plate 54 and the second connecting plate 55 are both slidably provided in the connecting groove, the first clamp 51 and the second clamp 52 are pushed by the second spring 53 to prevent the first clamp 51 and the second clamp 52 from being misaligned with the two guide plates 45, and the plurality of first clamps 51 and the plurality of second clamps 52 are respectively controlled by the first connecting plate 54 and the second connecting plate 55.

[0037] Reference Figure 5 In this embodiment, a guide groove 56 is provided at the lower end of the positioning mold 4, and a guide column 57 matched with the guide groove 56 is fixedly provided on the processing table 1. The moving trajectory of the positioning mold 4 is limited by the cooperation between the guide groove 56 and the guide column 57, so as to prevent the positioning mold 4 from deviating from the preset trajectory.

[0038] Reference Figure 5 It should be noted that, in the present embodiment, two movable grooves are provided in the guide groove 56, wedge blocks 58 are slidably arranged in the movable grooves, slots matching with the wedge blocks 58 are provided on the guide columns 57, and the two wedge blocks 58 are fixedly connected with the first connecting plate 54 and the second connecting plate 55 respectively. After the hot pressing process is completed, the cylinder 7 drives the positioning mold 4 to move, and at this time the two wedge blocks 58 are both in contact with the slots. The movement of the two wedge blocks 58 drives the first connecting plate 54 and the second connecting plate 55 to move respectively, driving the first clamping member 51 and the second clamping member 52 in the placement groove 41 to move apart, canceling the restriction on the two guide plates 45, so that the support plate 42 is pushed upward by the first spring 43 to drive the semiconductor to move upward and disengage from the placement groove 41, so as to facilitate the removal and collection of the semiconductor.

[0039] Reference Figure 6When the support plate 42 is moved downward, the inclined surface abuts against the support plate 42, and the support plate 42 abuts against the inclined surfaces on the first clamping member 51 and the second clamping member 52 when the support plate 42 moves downward. The first clamping member 51 and the second clamping member 52 are forced to move apart. At this time, the second spring 53 undergoes elastic deformation and will not hinder the support plate 42 from moving downward until the support plate 42 is separated from the limiting portion. The second spring 53 resets and drives the first clamping member 51 and the second clamping member 52 to reset, thereby limiting the support plate 42. When the inclined surface of the column 62 is separated from the support plate 42, the support plate 42 moves upward under the action of the first spring 43 and abuts against the limiting portions of the first clamping member 51 and the second clamping member 52, thereby limiting and fixing the support plate 42.

[0040] Reference Figure 6 In addition, in this embodiment, a vertical plate 63 is fixedly provided on the processing table 1, a guide rod 64 cooperating with the vertical plate 63 is fixedly provided on the reset frame 61, and a power structure 8 is provided between the reset frame 61 and the positioning mold 4. When the positioning mold 4 moves, the reset frame 61 is driven to move under the action of the power structure 8.

[0041] Reference Figure 7 , in detail, in the present embodiment, the power structure 8 includes a toggle member 81 fixedly connected to the positioning mold 4, a turntable 82 is rotatably arranged on the processing table 1, a toggle column 83 matching with the toggle member 81 is fixedly arranged on the turntable 82, a gear 84 is fixedly arranged on the turntable 82, and a rack 85 meshing with the gear 84 is fixedly arranged on the reset frame 61. When the semiconductor processing is completed, the positioning mold 4 is driven forward by the cylinder 7. At this time, the toggle member 81 cooperates with the toggle column 83 on the turntable 82 to drive the turntable 82 to rotate, drive the gear 84 to move, and the gear 84 drives the rack 85 and the reset frame 61 to move, and the reset frame 61 and the plug column 62 move in a direction away from the positioning mold 4; after the semiconductor is taken out, the cylinder 7 drives the positioning mold 4 to move backward, the turntable 82 is driven by the toggle member 81 to rotate in the opposite direction, and drives the reset frame 61 and the plug column 62 to move toward the direction of the positioning mold 4, and the inclined surface of the plug column 62 abuts against the support plate 42 and moves downward to reset the support plate 42.

[0042] Reference Figure 8 In more detail, in this embodiment, an L-shaped plate 86 is fixedly provided on the processing table 1, and the L-shaped plate 86 is rotatably connected to the gear 84. A torsion spring is provided between the gear 84 and the L-shaped plate 86. When the turntable 82 is driven to rotate by the toggle member 81, the torsion spring is elastically deformed by the force. When the turntable 82 is not driven, the torsion spring resets and drives the turntable 82 and the reset frame 61 to move and reset.

[0043] Working method: When working, the semiconductor is accommodated and positioned by the placement groove 41, so as to prevent the semiconductor from moving away from the preset position during hot pressing. The semiconductor is hot pressed by the pressing mechanism 2. After the hot pressing is completed, the cylinder 7 drives the positioning mold 4 to move. At this time, the two wedge blocks 58 are both in contact with the slots. The movement of the two wedge blocks 58 drives the first connecting plate 54 and the second connecting plate 55 to move respectively, driving the first clamping member 51 and the second clamping member 52 in the placement groove 41 to move apart, canceling the restriction on the two guide plates 45, so that the support plate 42 is pushed up by the first spring 43 to drive the semiconductor to move up and separate from the placement groove 41, so as to facilitate the removal and collection of the semiconductor;

[0044] When the positioning mold 4 is driven forward by the cylinder 7, the toggle member 81 cooperates with the toggle column 83 on the turntable 82 to drive the turntable 82 to rotate, drive the gear 84 to move, and the gear 84 drives the rack 85 and the reset frame 61 to move, and the reset frame 61 and the plug column 62 move in the direction away from the positioning mold 4; after the semiconductor is taken out, the cylinder 7 drives the positioning mold 4 to move backward, and the turntable 82 is driven by the toggle member 81 to rotate in the opposite direction, driving the reset frame 61 and the plug column 62 to move in the direction of the positioning mold 4, and the inclined surface of the plug column 62 abuts against the support plate 42 and moves downward, resetting the support plate 42 to expose the placement groove 41, thereby facilitating the placement of the semiconductor to be processed into the placement groove 41.

[0045] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A hot pressing device for semiconductor processing, comprising a processing table (1) and a pressing mechanism (2), wherein a bracket (3) matching with the pressing mechanism (2) is fixedly arranged on the processing table (1), characterized in that: The processing table (1) is provided with a positioning mold (4) for placing a semiconductor, and the pressing mechanism (2) is fixedly provided with a hot pressing plate; The positioning mold (4) is provided with a plurality of placement grooves (41) for placing semiconductors, a support plate (42) is provided in the placement groove (41), a first spring (43) is provided between the support plate (42) and the placement groove (41), a support plate (44) matching with the support plate (42) is fixedly provided in the placement groove (41), a limiting mechanism (5) matching with the support plate (42) is provided on the positioning mold (4), a reset mechanism (6) is provided between the processing table (1) and the positioning mold (4), and a cylinder (7) connected to the power of the positioning mold (4) is fixedly provided on the processing table (1); A guide groove (56) is provided at the lower end of the positioning mold (4), and the limiting mechanism (5) includes a receiving groove provided in the guide groove (56), and a first clamping member (51) and a second clamping member (52) are slidably provided in the two receiving grooves respectively, and the first clamping member (51) and the second clamping member (52) are relatively arranged to clamp the guide plates (45) on both sides of the support plate (42); A second spring (53) is provided between the first clamp (51) and the second clamp (52) and the accommodating groove; a connecting groove matching with the first clamp (51) and the second clamp (52) is provided at the lower end of the positioning mold (4); a first connecting plate (54) is fixedly provided between a plurality of the first clamps (51); a second connecting plate (55) is fixedly provided between a plurality of the second clamps (52); and the first connecting plate (54) and the second connecting plate (55) are both slidably provided in the connecting groove; The reset mechanism (6) comprises a reset frame (61), a plurality of plug posts (62) are fixedly arranged on the reset frame (61), the plug posts (62) are movably plugged into the processing table (1), and the plug posts (62) are provided with an inclined surface which is aligned with the support plate (42); A vertical plate (63) is fixedly arranged on the processing table (1), a guide rod (64) matching with the vertical plate (63) is fixedly arranged on the reset frame (61), and a power structure (8) is arranged between the reset frame (61) and the positioning mold (4); The power structure (8) comprises a toggle member (81) fixedly connected to the positioning mold (4); a turntable (82) is rotatably arranged on the processing table (1); a toggle column (83) matched with the toggle member (81) is fixedly arranged on the turntable (82); a gear (84) is fixedly arranged on the turntable (82); and a rack (85) meshingly connected with the gear (84) is fixedly arranged on the reset frame (61).

2. A hot pressing device for semiconductor processing according to claim 1, characterized in that: Guide grooves (56) are provided on both sides of the placement groove (41), guide plates (45) matching the guide grooves (56) are fixedly provided on both sides of the support plate (42), and the limiting mechanism (5) is clamped with the guide plates (45).

3. A hot pressing device for semiconductor processing according to claim 1, characterized in that: A guide column (57) matching the guide groove (56) is fixedly arranged on the processing table (1).

4. A hot pressing device for semiconductor processing according to claim 3, characterized in that: The guide groove (56) is provided with two movable grooves, and wedge blocks (58) are slidably arranged in the movable grooves. The guide columns (57) are provided with slots that match the wedge blocks (58). The two wedge blocks (58) are fixedly connected to the first connecting plate (54) and the second connecting plate (55) respectively.

5. A hot pressing device for semiconductor processing according to claim 1, characterized in that: An L-shaped plate (86) is fixedly arranged on the processing table (1), the L-shaped plate (86) is rotationally connected to the gear (84), and a torsion spring is arranged between the gear (84) and the L-shaped plate (86).

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