A hollow large stroke adjustment platform for semiconductors

Abstract

The present invention relates to a semiconductor hollow large-stroke adjustment platform in the field of semiconductor manufacturing technology, comprising a base, an X-axis platform, a Y-axis platform and a Z-axis lifting platform. Each platform realizes large-stroke and high-resolution motion positioning through linear motor drive and high-precision guide rails. A cooling medium is filled in the guide rails and the linear motors. The cooling medium is pushed by a piezoelectric stack in a locking pump to cause the guide rails to produce controllable expansion and deformation, thereby realizing hydraulic locking of the platform. At the same time, the cooling medium is forced to circulate to effectively eliminate the heat generated by the linear motor when it is working. Each platform is provided with an embedded through hole to facilitate the integrated installation of various semiconductor manufacturing equipment. The controller realizes closed-loop control of platform adjustment, locking and cooling according to sensor signals such as temperature and displacement. The present invention improves thermal stability and equipment compatibility while improving the positioning accuracy and stability of the platform, thereby improving semiconductor manufacturing efficiency and product yield.

Description

Technical Field

[0001] The invention relates to a semiconductor hollow large-stroke adjustment platform, in particular to a semiconductor hollow large-stroke adjustment platform applied in the field of semiconductor manufacturing technology. Background Art

[0002] With the continuous development of integrated circuit manufacturing technology, chip size is getting smaller and smaller, and pin spacing is getting narrower and narrower, which puts higher precision requirements on chip welding, packaging, testing and other processes. Traditional semiconductor equipment adjustment platforms have problems such as small travel, poor rigidity, and poor thermal stability, which can no longer meet the requirements of advanced processes.

[0003] Chinese invention patent CN109702500B discloses a large-stroke, low-thickness, large-hollow parallel piezoelectric micro-motion platform, which uses four independent drive units to achieve large-stroke motion, and has the advantages of simple and compact structure, no displacement coupling, and easy integration of displacement sensors. However, the platform is mainly aimed at small displacement adjustment. Under large-stroke and high-load conditions, the output force of the piezoelectric driver is limited, and positioning accuracy and stability are difficult to guarantee.

[0004] Chinese invention patent CN112994513B discloses a hollow two-dimensional piezoelectric inertial impact drive platform, which improves the stability of impact drive through a friction coupling adjustment mechanism and adopts a hollow design to facilitate microscopic observation. However, the platform uses friction drive, which is prone to thermal drift and affects positioning accuracy. In addition, its two-dimensional motion range is limited and it is difficult to meet the needs of large stroke adjustment.

[0005] The existing semiconductor chip welding, packaging, and testing equipment have problems such as insufficient alignment accuracy, poor stability, slow speed, and difficulty in adapting to large-size chips. There is an urgent need for a new adjustment platform with high precision, large stroke, high rigidity, and high stability to improve semiconductor manufacturing efficiency and yield rate and reduce production costs. Summary of the invention

[0006] In view of the above-mentioned prior art, the technical problem to be solved by the present invention is how to achieve high-precision and large-stroke adjustment of the platform and improve the rigidity and stability of the platform, solve the heating problem of the linear motor, and facilitate the integration of various semiconductor manufacturing equipment.

[0007] To solve the above problems, the present invention provides a hollow large-stroke adjustment platform for semiconductors, including a base, an X-axis platform is slidably connected to the top of the base, a Y-axis platform is slidably connected to the top of the X-axis platform, and a Z-axis lifting platform is slidably connected to the top of the Y-axis platform. The X-axis platform, the Y-axis platform and the Z-axis lifting platform are all provided with embedded through holes, a first guide rail is fixedly connected between the base and the X-axis platform, a second guide rail is fixedly connected between the X-axis platform and the Y-axis platform, a first linear motor is fixedly connected between the base and the X-axis platform, and a second linear motor is fixedly connected between the X-axis platform and the Y-axis platform, expansion through holes are provided in the first guide rail and the second guide rail, and a plurality of expansion grooves are provided at the outer ends of the expansion through holes, a first locking pump and a second locking pump are fixedly connected to the movers of the first linear motor and the second linear motor, respectively, the first guide rail and the first linear motor, and the second guide rail and the second linear motor are respectively connected to the first locking pump and the second locking pump through pressure-resistant pipes, and the first guide rail, the second guide rail, the first linear motor, the second linear motor and the first locking pump are all filled with cooling medium.

[0008] In the above-mentioned hollow large-stroke adjustment platform for semiconductors, high-precision large-stroke adjustment is achieved, and linear motor drive and high-precision guide rails are used to achieve high-resolution positioning within a large adjustment range to meet the processing requirements of chips of different sizes, improve the rigidity and stability of the platform, and introduce a hydraulic locking mechanism. After the platform is in place, it can be firmly locked to suppress external vibrations, ensure long-term and stable processing accuracy, solve the heating problem of the linear motor, adopt a hollow motor and guide rail structure, and have a built-in cooling medium circulation system to effectively suppress temperature rise and extend service life. It is easy to integrate a variety of semiconductor manufacturing equipment, and built-in through holes are opened on the platform to realize the rapid installation and replacement of equipment of various sizes, thereby improving the versatility and flexible production level.

[0009] As a further improvement of the present application, the movers of the first linear motor and the second linear motor are both hollow structures, and quick connectors are threadedly connected at both ends of the first guide rail, the second guide rail, the first linear motor and the second linear motor, and temperature sensors are provided in the first linear motor and the second linear motor.

[0010] As a further improvement of the present application, the first guide rail and the second guide rail both include an inner guide rail and an outer guide rail, and the outer ends of the inner guide rail and the outer guide rail are slidably connected with slide grooves, the slide grooves at the outer ends of the inner guide rail and the outer guide rail on the first guide rail are fixedly connected to the base and the X-axis platform, respectively, and the slide grooves at the outer ends of the inner guide rail and the outer guide rail on the second guide rail are fixedly connected to the Y-axis platform and the X-axis platform, respectively.

[0011] As a further improvement of the present application, a deformation sheet is fixedly connected to the inner rail and the outer rail at a position corresponding to the end of the expansion groove away from the expansion through hole, and the deformation sheet is made of elastic metal material.

[0012] As another improvement of the present application, the first locking pump and the second locking pump both include symmetrically arranged expansion tanks, and pump pipes are fixedly connected between the symmetrically arranged expansion tanks. The pump pipes connect the symmetrically arranged expansion tanks, and an impeller is rotatably connected inside the pump pipe. A plurality of permanent magnets are provided at the outer end of the impeller, and a coil is fixedly connected to the inner wall of the pump pipe.

[0013] As another improvement supplement of the present application, a controller is fixedly connected to the base, a plurality of piezoelectric stacks are fixedly connected in the expansion tank, the plurality of piezoelectric stacks are all electrically connected to the controller, the coil on the pump tube is also electrically connected to the controller, and the temperature sensors on the first linear motor and the second linear motor are electrically connected to the controller.

[0014] As another improved supplement of the present application, the inner guide rail and the outer guide rail on the second guide rail form a circulation loop with the first locking pump on the first linear motor.

[0015] As another improvement of the present application, the inner guide rail and the outer guide rail on the first guide rail and the second locking pump on the second linear motor form a circulation loop.

[0016] In summary, this application has the following beneficial effects:

[0017] 1. Improved the service life and reliability of the linear motor; this patent adopts a hollow linear motor structure filled with cooling medium, which can effectively cool the linear motor. At the same time, the impeller and coil in the pump pipe are used to actively drive the cooling medium to flow, and the temperature sensor is used to achieve intelligent temperature control to further enhance the heat dissipation effect. This design can effectively prevent the linear motor from performance degradation or damage due to high temperature, greatly improving its service life and reliability.

[0018] 2. It realizes the adjustment function of high precision, large stroke and high stability; the X, Y and Z three-axis platforms adopt sliding connection and linear motor drive, which can realize the adjustment function of large stroke and high precision. The design of connecting the inner rail and the outer rail to the slide groove respectively can ensure the smoothness of movement when the rail expands and contracts due to heat. At the same time, the cooling medium is squeezed by the locking pump piezoelectric stack, and the X and Y platforms are mechanically locked by locking the deformation piece and the slide groove. Compared with the locking method of the linear motor, this mechanical locking is more solid and reliable, and can effectively suppress interference such as external vibration, thereby obtaining higher positioning accuracy and stability.

[0019] 3. A low-energy, high-reliability locking function is achieved; the traditional method of using a linear motor to lock the position of the platform requires the motor to be continuously powered to overcome the load. When locked for a long time or the load is large, it will cause a large energy consumption and the locking reliability is not high. This patent uses the piezoelectric stack in the locking pump to extrude the cooling medium and locks the deformation piece and the slide groove to achieve mechanical locking. The locking process only consumes a small amount of energy in an instant, and there is no need for continuous power supply after locking, which greatly reduces energy consumption. At the same time, the purely mechanical locking method is more reliable, less affected by electromagnetic interference, and can significantly improve the locking reliability.

[0020] 4. It is convenient for semiconductor equipment installation, debugging and daily maintenance. By setting embedded through holes in the base, X, Y and Z platforms, semiconductor equipment of various sizes can be easily fixed on the adjustment platform. At the same time, quick connectors are set at the linear motor and guide rail pipelines to achieve rapid infusion and discharge of cooling medium, reduce downtime and facilitate daily maintenance.

[0021] 5. Improved versatility and flexibility; this patent adopts modular design, and the three axial platforms of X, Y, and Z can be freely combined as needed, which can flexibly adapt to the size and motion travel requirements of different semiconductor devices, greatly improving the versatility of the adjustment platform. Hollow linear motors, guide rails, locking pumps, etc. are all standardized modules, which are easy to replace and can be optimized for different working conditions to obtain the best performance.

[0022] 6. It is intelligent and highly integrated. Temperature sensors are integrated on the locking pump and linear motor, and intelligent temperature monitoring and heat dissipation control can be realized with the controller. The piezoelectric stack is electrically connected to the controller, and the locking and unlocking actions can be automatically controlled according to the process requirements. The integrated design of mechanical locking, active heat dissipation, intelligent control and other functions greatly improves the automation and intelligence of the adjustment platform. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is the overall structure diagram of this application;

[0024] Figure 2 A top view of the present application;

[0025] Figure 3 For this application Figure 2 Middle AA section view;

[0026] Figure 4 For this application Figure 2 Middle BB section view;

[0027] Figure 5 For this application Figure 2 Middle CC section view;

[0028] Figure 6For this application Figure 2 Middle DD section view;

[0029] Figure 7 For this application Figure 4 Enlarged view of point E in the middle;

[0030] Figure 8 A partial exploded view of this application;

[0031] Fig. 9 This is the appearance structure diagram of this application.

[0032] Description of the numbers in the figure:

[0033] 1. Base; 2. X-axis platform; 3. Y-axis platform; 4. Z-axis lifting platform; 5. Embedded through hole; 6. First guide rail; 7. Second guide rail; 8. First linear motor; 9. Second linear motor; 10. Expansion through hole; 11. Expansion groove; 12. First locking pump; 13. Second locking pump; 14. Quick connector; 15. Inner guide rail; 16. Outer guide rail; 17. Deformation sheet; 18. Expansion box; 19. Pump pipe; 20. Impeller; 21. Piezoelectric stack; 22. Slide groove. DETAILED DESCRIPTION

[0034] Three implementation modes of the present application are described in detail below with reference to the accompanying drawings.

[0035] The first implementation method:

[0036] Figure 1-Figure 9 The invention shows a hollow large-stroke adjustment platform for semiconductors, comprising a base 1, an X-axis platform 2 is slidably connected to the top of the base 1, a Y-axis platform 3 is slidably connected to the top of the X-axis platform 2, a Z-axis lifting platform 4 is slidably connected to the top of the Y-axis platform 3, an embedded through hole 5 is opened in the X-axis platform 2, the Y-axis platform 3 and the Z-axis lifting platform 4, a first guide rail 6 is fixedly connected between the base 1 and the X-axis platform 2, a second guide rail 7 is fixedly connected between the X-axis platform 2 and the Y-axis platform 3, a first linear motor 8 is fixedly connected between the base 1 and the X-axis platform 2, and a second linear motor 8 is fixedly connected between the X-axis platform 2 and the Y-axis platform 3. A second linear motor 9 is connected, and expansion holes 10 are provided in the first guide rail 6 and the second guide rail 7. A plurality of expansion grooves 11 are provided at the outer ends of the expansion holes 10. The first linear motor 8 and the second linear motor 9 are fixedly connected to the movers with a first locking pump 12 and a second locking pump 13 respectively. The first guide rail 6 and the first linear motor 8 as well as the second guide rail 7 and the second linear motor 9 are connected to the first locking pump 12 and the second locking pump 13 respectively through pressure-resistant pipes, and the first guide rail 6, the second guide rail 7, the first linear motor 8, the second linear motor 9 and the first locking pump 12 are all filled with cooling medium.

[0037] The semiconductor device is firmly mounted on the adjustment platform through the embedded through holes 5 on the base 1, the X-axis platform 2, the Y-axis platform 3 and the Z-axis lifting platform 4.

[0038] The first linear motor 8 drives the X-axis platform 2 to move along the first guide rail 6 in the X direction; the second linear motor 9 drives the Y-axis platform 3 to move along the second guide rail 7 in the Y direction; the Z-axis lifting platform 4 provides Z-direction height adjustment. The three-axis linkage can achieve large travel and high-precision spatial position adjustment.

[0039] Platform locking: When the X-axis platform 2 needs to be locked, the second locking pump 13 works to press the cooling medium into the expansion through hole 10 and the expansion groove 11 of the second guide rail 7, so that the guide rail expands and deforms and locks with the X-axis platform 2. Similarly, when locking the Y-axis platform 3, the first locking pump 12 presses the cooling medium into the first guide rail 6 to achieve locking.

[0040] Linear motor cooling: During the process of adjusting the platform to a large stroke, the first linear motor 8 and the second linear motor 9 generate a large amount of heat. The cooling medium circulates inside the linear motor and the guide rail, absorbs the heat generated by the motor, conducts it to each platform through the guide rail, and finally dissipates the heat through the platform surface, thereby effectively cooling the linear motor and ensuring its long-term stable operation.

[0041] The use of linear motor drive and high-precision guide rails can achieve high-precision adjustment of large strokes in the three directions of X, Y, and Z, meeting the precise positioning requirements of a variety of semiconductor process equipment.

[0042] The cooling medium is pressed into the guide rail by a locking pump to expand and deform the guide rail and lock it with the platform. This mechanical locking method has good rigidity and high stability, and can effectively suppress external vibration interference and ensure processing accuracy.

[0043] Filling the cooling medium into the hollow linear motor and guide rail and utilizing its flow and heat conduction to effectively cool the linear motor, avoid performance degradation caused by temperature rise, and improve the service life and reliability of the linear motor.

[0044] Through the sliding connection combination between the platforms, the platform stroke and size can be flexibly adjusted to meet the installation requirements of different semiconductor equipment. The guide rails, linear motors, locking pumps, etc. are all designed with standardized modules, which are easy to maintain and replace.

[0045] Furthermore, a one-way valve can be set in the first locking pump 12 and the second locking pump 13 to make the pressure and flow in the positive and negative directions of the locking pump different, thereby achieving an optimal match between the locking force and the locking speed. A cooling medium storage tank and a liquid replenishment pump can be set on the base 1 to replenish the loss of cooling medium in the guide rail and the linear motor, and adjust its pressure and flow rate.

[0046] The second implementation method:

[0047] Figure 1-Figure 9 It is shown that the movers of the first linear motor 8 and the second linear motor 9 are both hollow structures, and quick connectors 14 are threadedly connected at both ends of the first guide rail 6, the second guide rail 7, the first linear motor 8 and the second linear motor 9, and temperature sensors are provided in the first linear motor 8 and the second linear motor 9.

[0048] During operation, the cooling medium filled in the first linear motor 8 and the second linear motor 9 can absorb the heat generated by the motors, so that the motors are kept at a suitable operating temperature. The temperature sensor monitors the internal temperature of the motors in real time and feeds back the temperature signal to the controller, which adjusts the flow rate and flow velocity of the cooling medium accordingly to achieve precise temperature control. The quick connector 14 can be easily connected to the pressure-resistant pipe to form a circulation loop of the cooling medium. When maintenance or replacement of components is required, the quick connector 14 can be quickly disconnected to improve maintenance efficiency.

[0049] The first guide rail 6 and the second guide rail 7 both include an inner guide rail 15 and an outer guide rail 16, and the outer ends of the inner guide rail 15 and the outer guide rail 16 are slidably connected with a slide groove 22. The slide grooves 22 at the outer ends of the inner guide rail 15 and the outer guide rail 16 on the first guide rail 6 are fixedly connected to the base 1 and the X-axis platform 2, respectively, and the slide grooves 22 at the outer ends of the inner guide rail 15 and the outer guide rail 16 on the second guide rail 7 are fixedly connected to the Y-axis platform 3 and the X-axis platform 2, respectively.

[0050] A deformation sheet 17 is fixedly connected to the inner rail 15 and the outer rail 16 at a position corresponding to the end of the expansion groove 11 away from the expansion through hole 10 . The deformation sheet 17 is made of elastic metal material.

[0051] When the locking pump presses the cooling medium into the guide rail to cause it to expand and deform, the deformation pieces 17 made of elastic metal material arranged on the inner guide rail 15 and the outer guide rail 16 will deform synchronously to lock the guide rail and the slide groove 22. The design of locking the inner guide rail 15 and the outer guide rail 16 with the platform respectively can ensure reliable locking and precise positioning between the guide rail and the platform when the guide rail expands and contracts due to heat.

[0052] The first locking pump 12 and the second locking pump 13 both include symmetrically arranged expansion tanks 18 , and pump pipes 19 are fixedly connected between the symmetrically arranged expansion tanks 18 , and the pump pipes 19 connect the symmetrically arranged expansion tanks 18 .

[0053] An impeller 20 is rotatably connected inside the pump pipe 19 , a plurality of permanent magnets are arranged at the outer end of the impeller 20 , and a coil is fixedly connected to the inner wall of the pump pipe 19 .

[0054] A controller is fixedly connected to the base 1, and multiple piezoelectric stacks 21 are fixedly connected in the expansion box 18. The multiple piezoelectric stacks 21 are all electrically connected to the controller. The coil on the pump tube 19 is also electrically connected to the controller. The temperature sensors on the first linear motor 8 and the second linear motor 9 are electrically connected to the controller.

[0055] The controller changes the direction and magnitude of the current in the coil of the pump tube 19 and utilizes electromagnetic force to drive the impeller 20 to rotate forward and reverse, thereby realizing the circulation of the cooling medium between the locking pump and the guide rail and the linear motor.

[0056] When the guide rail needs to be locked, the controller controls the piezoelectric stack 21 to extend, squeezing the cooling medium in the expansion box 18 so that it is pressed into the expansion hole 10 and expansion groove 11 of the guide rail, and the guide rail expands and deforms and is locked with the platform; when unlocking, the piezoelectric stack 21 is controlled to contract to release the pressure in the guide rail.

[0057] The inner guide rail 15 and the outer guide rail 16 on the second guide rail 7 and the first locking pump 12 on the first linear motor 8 form a circulation loop.

[0058] The inner guide rail 15 and the outer guide rail 16 on the first guide rail 6 and the second locking pump 13 on the second linear motor 9 form a circulation loop.

[0059] The two cooling circulation loops correspond to the guide rails and motors in the X-axis direction and the Y-axis direction respectively, realizing independently controllable locking and cooling in the two directions.

[0060] The hollow linear motor design has a built-in temperature sensor that can monitor the temperature in real time when the motor is working. Combined with the forced circulation of the cooling medium, the motor temperature can be accurately controlled to increase the service life of the motor.

[0061] By arranging quick connectors 14 at both ends of the guide rail and the motor, the pressure-resistant pipe can be quickly connected or disassembled, which is convenient for forming a cooling circulation loop and also convenient for daily maintenance and overhaul of the system.

[0062] The design of the inner guide rail 15, the outer guide rail 16 and the slide groove 22 ensures that the guide rail can be reliably locked with the platform when it is deformed by thermal expansion and contraction, and the positioning accuracy is high.

[0063] The permanent magnet impeller 20 and the coil are used in a seal-free design, and the cooling medium is driven to circulate by electromagnetic force, which has no mechanical wear and has higher system reliability.

[0064] The locking pump is driven by a piezoelectric stack 21, which has a fast response speed, a strong locking force and a compact structure.

[0065] Independent cooling circuits are used in the X and Y movement directions to control the locking state and cooling effect respectively, which provides higher flexibility.

[0066] Furthermore, the inner guide rail 15 and the outer guide rail 16 can adopt a multi-stage sleeve structure, and microspheres are filled between the two-stage sleeves to achieve precise guidance and support of the guide rails during movement. A plurality of ribs can be arranged on the wall of the expansion box 18, and the ribs abut against the piezoelectric stack 21, which can not only limit the displacement of the piezoelectric stack 21, but also prevent the piezoelectric stack 21 from being excessively deformed and damaged. The inner wall of the pump pipe 19 is coated with wear-resistant material, and a metal rubber sealing ring is arranged between the pump pipe 19 and the impeller 20 to extend the service life of the locking pump and improve the sealing performance. The temperature sensor adopts a platinum resistor, which has the characteristics of high temperature measurement accuracy, good stability, wide application range, etc., and has high reliability. A safety valve is arranged between the first guide rail 6, the second guide rail 7 and the locking pump, which automatically releases pressure when the cooling medium pressure exceeds the set value to prevent the locking force from being too large and damaging the guide rails.

[0067] The third implementation method:

[0068] Figure 1-Figure 9 It is shown that a method for adjusting and locking a hollow large-stroke adjustment platform for semiconductors comprises the following steps;

[0069] S1. Fill the cooling medium into the first guide rail 6, the second guide rail 7, the first linear motor 8, the second linear motor 9 and the first locking pump 12;

[0070] S2. The semiconductor device to be adjusted is fixed on the base 1, the X-axis platform 2, the Y-axis platform 3 and the Z-axis lifting platform 4, and some parts of the semiconductor device are embedded in the embedded through hole 5;

[0071] S3. Control the first linear motor 8 and the second linear motor 9 to start, drive the X-axis platform 2 to move along the first guide rail 6 in the X direction, and the Y-axis platform 3 to move along the second guide rail 7 in the Y direction, and adjust the semiconductor device to the target position;

[0072] S4. Using the telescopic movement of the piezoelectric stack 21, the pressure of the cooling medium in the first locking pump 12 and the second locking pump 13 is changed, thereby driving the inner guide rail 15 and the outer guide rail 16 to expand or contract, thereby locking or unlocking the X-axis platform 2 and the Y-axis platform 3;

[0073] S5. In the process of adjusting the platform, the coil in the pump tube 19 on the first linear motor 8 and the second linear motor 9 is driven by the controller to drive the impeller 20 to rotate, so that the cooling medium circulates in the linear motor and the guide rail, absorbs the heat generated when the motor is working, and conducts the heat to the base 1 and each axis platform through the guide rail and the slide groove 22, thereby realizing cooling and heat dissipation of the linear motor.

[0074] Step S1, a cooling medium such as oil or coolant is filled into the first guide rail 6, the second guide rail 7, the first linear motor 8, the second linear motor 9 and the first locking pump 12, and the cooling medium can be quickly injected and discharged through the quick connector 14. The cooling medium plays multiple roles such as transmitting pressure, heat conduction and lubrication.

[0075] Step S2, the semiconductor device to be debugged is firmly fixed on the base 1, the X-axis platform 2, the Y-axis platform 3 and the Z-axis lifting platform 4 by means of screws or the like. The probe, CCD camera and other components on the semiconductor device can be partially embedded in the embedded through holes 5 of each platform, making the device installation more compact and firm.

[0076] Step S3, the controller sends a control signal, and the mover of the first linear motor 8 moves linearly on the first guide rail 6, thereby driving the X-axis platform 2 to move in the X direction; the second linear motor 9 drives the Y-axis platform 3 to move in the Y direction along the second guide rail 7; the Z-axis lifting platform 4 can also adjust the height in the Z direction. The three-axis linkage enables the semiconductor equipment to be accurately moved to the spatial position required for welding, packaging, testing and other processes.

[0077] Step S4, when locking the X-axis platform 2, the controller controls the piezoelectric stack 21 in the second locking pump 13 to extend, push the expansion tank 18 of the second locking pump 13, and then squeeze the cooling medium therein, so that it enters the inner guide rail 15 and the outer guide rail 16 of the second guide rail 7 along the pipeline. The pressure in the guide rail increases, causing the guide rail to expand and deform, and finally locks through the extrusion of the deformation piece 17 on the inner guide rail 15 and the outer guide rail 16 and the slide groove 22 on the X-axis platform 2. When locking the Y-axis platform 3, a similar process is implemented by the first locking pump 12 and the first guide rail 6. When unlocking is required, the controller controls the piezoelectric stack 21 to contract, release the cooling medium pressure, and the inner guide rail 15, the outer guide rail 16 and the deformation piece 17 are reset under the action of elasticity to release the lock of the platform.

[0078] Step S5, when the platform is adjusted for X, Y, and Z axis motion, the first linear motor 8 and the second linear motor 9 are in a state of frequent start and stop, and their coils will generate a lot of heat. In order to effectively cool the motor, the controller controls the coil in the pump pipe 19 on the motor to be energized, generating electromagnetic force to drive the impeller 20 to rotate, and the impeller 20 continuously pushes the cooling medium in the pipeline to flow, and the cooling medium continuously absorbs the heat of the motor and the guide rail, and continuously conducts the heat to the base 1, the X-axis platform 2, and the Y-axis platform 3 through the guide rail and the slide 22, and finally dissipates heat through convection between the platform surface and the outside air, thereby achieving efficient and stable cooling of the linear motor.

[0079] The hydraulic locking method is adopted, and the piezoelectric stack 21 is used to change the pressure of the cooling medium, so that the guide rail expands and deforms and locks with the platform. The locking force is large, the positioning accuracy is high, and the response speed is fast, which can significantly improve the locking stability of the platform under high load conditions.

[0080] The inner guide rail 15 and the outer guide rail 16 are locked and connected to the platform slide groove 22 respectively, which not only ensures the free expansion and contraction of the guide rails during thermal expansion and contraction, but also can reliably lock the platform, and the positioning accuracy is long-lasting and stable.

[0081] By utilizing the flow heat transfer of the cooling medium, the heat dissipation problem of the linear motor can be effectively solved, the temperature rise of the motor can be reduced, and the service life can be extended.

[0082] The embedded through holes 5 are arranged on each platform to facilitate the compact installation of various semiconductor devices and the combination of various modules, thereby improving the standardization and generalization level of the platform.

[0083] Automatic control of locking, unlocking and cooling is achieved through a controller, a piezoelectric stack 21, a temperature sensor, etc. The platform has a high degree of intelligence, which can improve work efficiency and reduce labor costs.

[0084] Furthermore, in step S4, the expansion deformation of the inner guide rail 15 and the outer guide rail 16 is precisely controlled by adjusting the expansion and contraction amount and pump chamber pressure of the piezoelectric stack 21 in the first locking pump 12 and the second locking pump 13 according to the required locking force and positioning accuracy. In step S5, the cooling circuit of the linear motor and the locking circuit are respectively set and can be independently controlled without interfering with each other. If necessary, a separate cooling medium can be used to optimize the cooling effect. In step S3, the adjustment movement of the semiconductor device is monitored in real time by a displacement sensor such as a laser ruler and compared with a preset value. The controller issues a feedback instruction accordingly to further improve the adjustment accuracy and automation. The temperature, flow rate, and pressure parameters of the cooling medium are obtained by simulation optimization or table lookup according to the power and operating conditions of the linear motor. The controller controls the coil current in the pump tube 19 to realize closed-loop control, so that the temperature field of the motor is evenly distributed, the thermal stress is small, and the service life is long.

[0085] In view of current practical needs, the above-mentioned implementation mode adopted in this application is not limited to the scope of protection. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the scope of protection of the present invention.

Claims

1. A hollow large stroke adjustment platform for semiconductors, characterized in that: The invention comprises a base (1), wherein the top of the base (1) is slidably connected to an X-axis platform (2), the top of the X-axis platform (2) is slidably connected to a Y-axis platform (3), the top of the Y-axis platform (3) is slidably connected to a Z-axis lifting platform (4), the X-axis platform (2), the Y-axis platform (3) and the Z-axis lifting platform (4) are all provided with embedded through holes (5), a first guide rail (6) is fixedly connected between the base (1) and the X-axis platform (2), a second guide rail (7) is fixedly connected between the X-axis platform (2) and the Y-axis platform (3), a first linear motor (8) is fixedly connected between the base (1) and the X-axis platform (2), and a second linear motor (8) is fixedly connected between the X-axis platform (2) and the Y-axis platform (3). The invention relates to a linear motor (9), wherein the first guide rail (6) and the second guide rail (7) are each provided with an expansion through hole (10), and the outer end of the expansion through hole (10) is provided with a plurality of expansion grooves (11); the first linear motor (8) and the second linear motor (9) are respectively fixedly connected to the movers thereof with a first locking pump (12) and a second locking pump (13); the first guide rail (6) and the first linear motor (8) and the second guide rail (7) and the second linear motor (9) are respectively connected to the first locking pump (12) and the second locking pump (13) via a pressure-resistant pipe; and the first guide rail (6), the second guide rail (7), the first linear motor (8), the second linear motor (9) and the first locking pump (12) are each filled with a cooling medium; The first guide rail (6) and the second guide rail (7) both comprise an inner guide rail (15) and an outer guide rail (16); the outer ends of the inner guide rail (15) and the outer guide rail (16) are both slidably connected with a slide groove (22); the slide grooves (22) at the outer ends of the inner guide rail (15) and the outer guide rail (16) on the first guide rail (6) are respectively fixedly connected to the base (1) and the X-axis platform (2); and the slide grooves (22) at the outer ends of the inner guide rail (15) and the outer guide rail (16) on the second guide rail (7) are respectively fixedly connected to the Y-axis platform (3) and the X-axis platform (2); A deformation sheet (17) is fixedly connected to the inner guide rail (15) and the outer guide rail (16) at a position corresponding to the end of the expansion groove (11) away from the expansion through hole (10), and the deformation sheet (17) is made of an elastic metal material; The first locking pump (12) and the second locking pump (13) both comprise symmetrically arranged expansion tanks (18), and a pump pipe (19) is fixedly connected between the symmetrically arranged expansion tanks (18), and the pump pipe (19) connects the symmetrically arranged expansion tanks (18).

2. The semiconductor hollow long-stroke adjustment platform according to claim 1, characterized in that: The movers of the first linear motor (8) and the second linear motor (9) are both hollow structures; both ends of the first guide rail (6), the second guide rail (7), the first linear motor (8) and the second linear motor (9) are threadedly connected with quick connectors (14); and the first linear motor (8) and the second linear motor (9) are both provided with temperature sensors.

3. The semiconductor hollow long-stroke adjustment platform according to claim 1, characterized in that: An impeller (20) is rotatably connected inside the pump pipe (19), a plurality of permanent magnets are provided at the outer end of the impeller (20), and a coil is fixedly connected to the inner wall of the pump pipe (19).

4. The semiconductor hollow long-stroke adjustment platform according to claim 1, characterized in that: A controller is fixedly connected to the base (1), and a plurality of piezoelectric stacks (21) are fixedly connected inside the expansion box (18). The plurality of piezoelectric stacks (21) are all electrically connected to the controller. The coil on the pump tube (19) is also electrically connected to the controller. The temperature sensors on the first linear motor (8) and the second linear motor (9) are electrically connected to the controller.

5. The semiconductor hollow long-stroke adjustment platform according to claim 1, characterized in that: The inner guide rail (15) and the outer guide rail (16) on the second guide rail (7) form a circulation loop with the first locking pump (12) on the first linear motor (8).

6. The semiconductor hollow long-stroke adjustment platform according to claim 1, characterized in that: The inner guide rail (15) and the outer guide rail (16) on the first guide rail (6) form a circulation loop with the second locking pump (13) on the second linear motor (9).

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