A single crystal silicon wafer slicing device

Abstract

The present invention discloses a single crystal silicon wafer slicing device, which relates to the technical field of semiconductor material processing, and comprises: two symmetrically arranged roller bodies, both ends of the roller bodies are provided with roller seats, so that the roller bodies are rotatably arranged on the roller seats; a plurality of slicing wires which are transmission sleeved between the two roller bodies, and the slicing wires are used for slicing single crystal silicon rods; a nozzle which is sleeved on the outside of the slicing wires and is used for spraying liquid toward the single crystal silicon rods; wherein the single crystal silicon rods are adhered to the bottom of a base, and the base can move vertically and / or the roller seats can move vertically; wherein the nozzle can ensure that the liquid enters the cutting groove to the greatest extent, thereby improving the efficiency of cooling and chip removal, and reducing the influence of the heat and debris generated during the cutting process on the single crystal silicon rods and the slicing wires.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor material processing, in particular to a single crystal silicon wafer slicing device. Background Art

[0002] In the field of semiconductor material processing, monocrystalline silicon is the basic material for key components such as integrated circuits and solar cells. Its processing quality and efficiency directly affect the performance and cost of the final product. With the rapid development of science and technology, the requirements for the dimensional accuracy, surface quality and production efficiency of monocrystalline silicon wafers are increasing. In this context, the technological development and innovation of the slicing device, as an important equipment in the monocrystalline silicon processing process, are particularly important.

[0003] The slicing devices currently on the market generally consist of two core parts: wire cutting equipment and positioning equipment. These two parts work together to achieve efficient and accurate slicing of single crystal silicon rods. In addition, existing slicing devices usually set a nozzle above the single crystal silicon rod to achieve the purpose of cooling and chip removal by spraying liquid. However, although the inclined setting of this nozzle can guide the liquid to the cutting groove to a certain extent, due to the limitations of the spraying angle and force, only a small part of the liquid can effectively enter the cutting groove, resulting in low overall cooling and chip removal efficiency. In addition, the inclined spraying may also cause uneven liquid distribution, affecting the stability and consistency of the slicing quality. In addition, during the slicing process, in order to ensure the continuity and uniformity of the cutting, some wire cutting equipment needs to provide precise feeding motion. However, this feeding motion often leads to continuous changes in the cutting position. At this time, the positioning accuracy of the nozzle is difficult to guarantee, thereby affecting the cooling and chip removal effect.

[0004] In addition, during the operation of the wire cutting equipment, another problem that cannot be ignored is the slippage of the cutting wire. Due to the particularity of the material of the single crystal silicon rod and various complex factors in the cutting process, the cutting wire may be affected by uneven resistance or insufficient friction during high-speed rotation and feeding, resulting in slippage. This will not only reduce the cutting efficiency, but may also have a serious impact on the cutting quality. The existing tension wheel design is often difficult to accurately adjust and compensate for this problem, making it difficult to effectively solve the slippage problem.

[0005] Therefore, it is necessary to provide a single crystal silicon wafer slicing device to solve the above problems. Summary of the invention

[0006] In order to solve the above problems, the present invention provides the following technical solution: a single crystal silicon wafer slicing device, comprising:

[0007] Two symmetrically arranged roller bodies, both ends of the roller bodies are provided with roller seats so that the roller bodies can be rotatably arranged on the roller seats;

[0008] A plurality of slicing wires are provided between the two roller bodies and the slicing wires are used for slicing the single crystal silicon rods;

[0009] A nozzle, which is sleeved on the outside of the slicing wire and is used to spray liquid toward the single crystal silicon rod;

[0010] Wherein, the nozzle comprises:

[0011] A ring tube, the middle of which has a through hole so as to be sleeved on the outside of the split wire;

[0012] The spray holes are arranged in a plurality of circumferentially distributed manner, and one end of the plurality of spray holes are all gathered into the ring chamber of the ring cylinder;

[0013] A liquid supply pipe, one end of which is connected to an external liquid supply device, and the other end of which is connected to the annular chamber;

[0014] Wherein, the ring cylinder is fixedly connected to the roller seat;

[0015] Wherein, the single crystal silicon rod is adhered to the bottom of the base, and the base can move vertically and / or the roller seat can move vertically.

[0016] Further, preferably, the number of the nozzles is an even number and is evenly distributed, and the spraying direction of each nozzle is configured to be able to gather at point P, and the minimum distance between point P and the single crystal silicon rod is 1 mm-5 mm.

[0017] Furthermore, preferably, each of the slice wires is provided with two nozzles located correspondingly on both sides of the single crystal silicon rod, and the nozzles on two adjacent slice wires are staggered to eliminate interference between the nozzles.

[0018] Furthermore, preferably, the distances between the two nozzles on each of the slice wires are the same.

[0019] Furthermore, preferably, an arc seat is fixed between the two roller seats at the ends of the roller body, and a plurality of pressure rollers are rotatably arranged on the arc seat for pressing the slicing wire onto the roller body.

[0020] Further, preferably, a worm wheel is sleeved on the end of one of the roller bodies, the worm wheel is transmission-connected to the worm, a mounting bin is provided in the roller seat for rotating the worm, and the worm is driven by a driver.

[0021] Further, as a preference, a central hole is provided on one side of the roller body, and a plurality of radial holes are also provided on the roller body, wherein the radial holes are connected to the central hole, and a tensioning head is sealingly and slidably provided in the radial holes, and the tensioning head can slide out of the radial hole and tension the slicing wire;

[0022] Wherein, the central hole is a blind hole, and fluid is pre-placed in the blind hole;

[0023] Wherein, an end cover is sealed and embedded in the opening of the central hole, and the depth to which one end of the end cover extends into the central hole is adjustable.

[0024] Further, as a preference, a central shaft is fixed in the middle of the central hole, a plurality of reset pull ropes corresponding to the radial holes are fixed on the central shaft, and the other ends of the reset pull ropes extend into the radial holes and are connected to the tensioning head;

[0025] The elastic moduli of the multiple reset pull ropes on the same central axis are different.

[0026] Further, preferably, a side of the tensioning head close to the outer surface of the roller body is a curved surface, and the roughness of the curved surface is greater than the roughness of the outer surface of the roller body.

[0027] Furthermore, preferably, two adjacent roller seats are fixedly connected by a connecting rod.

[0028] Compared with the prior art, the present invention provides a single crystal silicon wafer slicing device, which has the following beneficial effects:

[0029] In the present invention, the nozzle sleeve is arranged outside the slicing wire, and the liquid is sprayed directly toward the single crystal silicon rod, which can ensure that the liquid enters the cutting groove to the greatest extent, improve the efficiency of cooling and chip removal, and reduce the influence of heat and chips generated during the cutting process on the single crystal silicon rod and the slicing wire.

[0030] In the present invention, when the fluid in the central hole is adjusted, different numbers of tensioning heads will extend out of the radial holes. Therefore, the tensioning force on the slice wire can be increased step by step. At the same time, different numbers of tensioning heads will also increase different roughness when they extend out, thereby gradually improving the anti-slip effect and reducing the slippage of the slice wire. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 The figure is a schematic diagram of the overall structure of a single crystal silicon wafer slicing device;

[0032] Figure 2 It is a schematic diagram of the three-dimensional structure of a roller seat and a roller body in a single crystal silicon wafer slicing device;

[0033] Figure 3 It is a schematic diagram of the top view of the structure of a roller seat and a roller body in a single crystal silicon wafer slicing device;

[0034] Figure 4 for Figure 3 AA cross-sectional structural diagram;

[0035] Figure 5 for Figure 3BB cross-sectional structure diagram;

[0036] Figure 6 A schematic diagram of the distribution of nozzles and slicing wires in a single crystal silicon wafer slicing device;

[0037] Figure 7 It is a schematic diagram of the three-dimensional structure of a nozzle in a single crystal silicon wafer slicing device;

[0038] In the figure: 1. roller seat; 2. slicing wire; 3. connecting rod; 4. single crystal silicon rod; 5. base; 6. nozzle; 7. attachment frame; 8. driver; 9. roller body; 10. pressure roller; 11. arc seat; 91. center hole; 92. center axis; 93. tensioning head; 94. reset pull rope; 95. end cover; 101. installation bin; 102. worm gear; 103. worm; 61. ring cylinder; 62. liquid supply pipe; 63. through hole; 64. spray hole. DETAILED DESCRIPTION

[0039] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned description of the drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequential order. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, which is merely a way of distinguishing the objects of the same attributes when describing them in the embodiments of the present application. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, so that the process, method, system, product or equipment comprising a series of units need not be limited to those units, but may include other units that are not clearly listed or inherent to these processes, methods, products or equipment.

[0040] Please refer to Figure 1-Figure 7 In an embodiment of the present invention, a single crystal silicon wafer slicing device is provided, comprising:

[0041] Two symmetrically arranged roller bodies 9, with roller seats 1 being arranged at both ends of the roller bodies 9 so that the roller bodies 9 can be rotatably arranged on the roller seats 1;

[0042] A plurality of slicing wires 2 are provided between the two roller bodies 9, and the slicing wires 2 are used for slicing the single crystal silicon rods 4;

[0043] A nozzle 6, which is sleeved on the outside of the slicing wire 2 and is used to spray liquid toward the single crystal silicon rod 4;

[0044] Wherein, the nozzle 6 comprises:

[0045] The ring tube 61 has a through hole 63 in the middle so as to be sleeved on the outside of the slice wire 2;

[0046] The spray holes 64 are arranged in a plurality of circumferentially distributed manner, and one end of the plurality of spray holes 64 are all gathered into the ring chamber of the ring cylinder 61;

[0047] A liquid supply pipe 62, one end of which is connected to an external liquid supply device, and the other end of which is connected to the annular chamber;

[0048] The roller body 9 is provided with an annular groove corresponding to the slice wire 2 for limiting the position of the slice wire 2;

[0049] Wherein, the annular cylinder 61 is fixedly connected to the roller seat 1;

[0050] The single crystal silicon rod 4 is adhered to the bottom of the base 5, and the base 5 can move vertically and / or the roller base 1 can move vertically.

[0051] During implementation, the single crystal silicon rod 4 is first adhered to the bottom of the base 5, and it is ensured that the base 5 or the roller seat 1 can move vertically so as to adjust the relative position between the single crystal silicon rod 4 and the slicing wire 2. At the same time, it is ensured that the liquid supply pipe 62 is connected to the external liquid supply device. Then, the slicing wire 2 is moved circumferentially through the roller body 9 and gradually approaches the single crystal silicon rod 4. As the slicing wire 2 moves circumferentially and feeds, the nozzle 6 (especially the nozzle holes 64 thereon) directly sprays liquid toward the single crystal silicon rod 4. These liquids are evenly sprayed through the circumferentially distributed nozzle holes 64 to ensure that they enter the cutting groove to the greatest extent, thereby achieving the purpose of cooling and chip removal.

[0052] It needs to be explained that the existing slicing device generally includes two parts, one part is the wire cutting equipment, and the other part is the positioning equipment. Of course, in order to spray liquid to the single crystal silicon rod 4 and the slicing wire 2 to achieve cooling and chip removal, a nozzle is often arranged above the single crystal silicon rod 4. Such nozzle is generally tilted to ensure that more liquid is brought into the cutting groove of the single crystal silicon rod 4. On the one hand, part of the slicing equipment is provided with feeding movement by the wire cutting equipment. At this time, the nozzle needs to be adjusted in angle to be able to spray at the cutting position (the cutting position is changing). On the other hand, since the nozzle sprays at an angle from top to bottom, only a small part of the liquid will enter the cutting groove, and the overall cooling and chip removal efficiency is low.

[0053] In this embodiment, the nozzle 6 is sleeved on the outside of the slicing wire 2, and the liquid is sprayed directly toward the single crystal silicon rod 4, which can ensure that the liquid enters the cutting groove to the greatest extent. The efficiency of cooling and chip removal is improved, and the influence of heat and chips generated during the cutting process on the single crystal silicon rod and the slicing wire is reduced.

[0054] Since the ring tube 61 is fixedly connected to the roller seat 1 (the ring tube 61 can be fixed to the roller seat 1 through the attachment frame 7), no matter whether the single crystal silicon rod 4 or the slicing wire 2 is feeding, the nozzle 6 can always maintain a stable spraying state and synchronization, thereby reducing the cutting quality problem caused by the deviation of the spraying position.

[0055] Furthermore, the number of the spray holes 64 is an even number and is evenly distributed, and the spray directions of the spray holes 64 are configured to be able to gather at point P, and the minimum distance between point P and the single crystal silicon rod 4 is 1 mm-5 mm.

[0056] Among them, since the spray direction of the spray holes 64 is configured to gather at point P, the liquid sprayed from each spray hole will form a relatively concentrated liquid flow near point P. This concentrated liquid flow can cool the cutting groove and remove chips more effectively, because the energy (i.e., the impact force and cooling effect of the liquid) is concentrated to the greatest extent at point P. By accurately controlling the number, distribution and spray direction of the spray holes 64, it can be ensured that the position of point P accurately corresponds to the center or key area of ​​the cutting groove. This control helps to reduce liquid waste and ensure that the heat and chips generated during the cutting process are handled promptly and effectively.

[0057] In addition, the minimum distance between point P and the single crystal silicon rod 4 is set to 1mm-5mm, which is an optimized distance range. This distance ensures that the liquid can fully contact the cutting groove and the surface of the single crystal silicon rod, and avoids the waste caused by the liquid directly impacting the surface of the single crystal silicon rod due to the close distance. Within this distance range, the ejected liquid can effectively wash away the debris generated during the cutting process and prevent them from adhering to the surface of the single crystal silicon rod or the cutting groove. This helps to improve the cutting quality and reduce the difficulty of subsequent cleaning and processing.

[0058] Furthermore, each of the slicing wires 2 is provided with two nozzles 6 located correspondingly on both sides of the single crystal silicon rod 4, and the nozzles 6 on two adjacent slicing wires 2 are staggered to eliminate interference between the nozzles 6, and the spacing between the two nozzles 6 on each slicing wire 2 is the same.

[0059] Each slicing wire 2 is provided with two nozzles 6, which are respectively located on both sides of the single crystal silicon rod 4, which ensures that both sides of the cutting groove can be fully sprayed with liquid. This comprehensive spraying method helps to more evenly reduce the temperature of the cutting groove and more effectively remove the debris generated during the cutting process.

[0060] In addition, the nozzles 6 on two adjacent slicing wires 2 are staggered, and this layout avoids physical interference between the nozzles 6. During the cutting process, the slicing wires 2 need to be closely arranged to ensure the continuity and accuracy of the cutting, and the staggered nozzles 6 can ensure that each nozzle 6 can work normally without being affected by the adjacent nozzles 6 without sacrificing the cutting efficiency.

[0061] In addition, the distances between the two nozzles 6 on each slice wire 2 are the same, which helps to maintain the consistency of the spraying effect.

[0062] In this embodiment, an arc seat 11 is fixed between the two roller seats 1 at the ends of the roller body 9 , and a plurality of pressure rollers 10 are rotatably arranged on the arc seat 11 for pressing the slicing wire 2 onto the roller body 9 .

[0063] Among them, the pressure roller 10 presses the slicing wire 2 tightly against the roller body 9, effectively preventing the slicing wire from vibrating and deflecting during the cutting process. This stability is crucial to ensure the accuracy and consistency of the cutting grooves, and helps to improve the cutting quality. Appropriate pressing force can reduce the risk of wear and breakage of the slicing wire 2 during the cutting process. This not only helps to extend the service life of the slicing wire 2, but also reduces the replacement cost and maintenance difficulty.

[0064] In the slicing device, since the nozzle 6 continuously sprays liquid to the single crystal silicon rod 4 to achieve cooling and chip removal, the liquid may splash or overflow to other parts of the device during the cutting process. Therefore, by adding a water retaining design to the arc seat 11, it is possible to effectively prevent the liquid from splashing or overflowing to the key area of ​​the device. This water retaining design can be a raised edge, an inclined plane or an additional waterproof cover, depending on the structure of the device and actual needs.

[0065] In this embodiment, a worm gear 102 is sleeved on the end of one of the roller bodies 9 , and the worm gear 102 is transmission-connected to a worm 103 . An installation bin 101 is provided in the roller seat 1 for rotating the worm 103 , and the worm 103 is driven by a driver 8 .

[0066] In this embodiment, a central hole 91 is formed on one side of the roller body 9, and a plurality of radial holes are formed on the roller body 9, the radial holes are connected to the central hole 91, and a tensioning head 93 is sealed and slidably provided in the radial holes, and the tensioning head 93 can slide out of the radial hole and tension the slicing wire 2;

[0067] Wherein, the central hole 91 is a blind hole, and fluid is pre-placed in the blind hole;

[0068] An end cover 95 is sealed and embedded in the opening of the central hole 91 , and the depth to which one end of the end cover 95 extends into the central hole 91 is adjustable.

[0069] Then, the driving state of the fluid on the tensioning head 93 can be adjusted by adjusting the position of the end cover 95. When tensioning is required, the tensioning head 93 is extended out of the radial hole to support and tension the segmented wire 2.

[0070] Specifically, tensioning heads 93 are provided in a sealed and sliding manner in a plurality of radial holes provided on the roller body 9. These tensioning heads 93 can extend out of the radial holes when necessary to support and tension the slicing wires 2, so that the tightness of the slicing wires 2 can be adjusted according to actual needs during the cutting process to ensure the cutting effect.

[0071] More specifically, the center hole 91 is a blind hole, and a fluid (such as gas or liquid) is preset inside. This fluid generates a driving force on the tensioning head 93 in some way (such as pressure difference or external force). When the tension of the slicing wire 2 needs to be adjusted, the fluid pressure or volume in the center hole 91 is changed by adjusting the position of the end cap 95, thereby driving the tensioning head 93 to extend out of the radial hole. This is very useful for processing single crystal silicon rods of different diameters, hardnesses or cutting speeds, and can ensure stability and consistency during the cutting process.

[0072] It should be noted that appropriate tension of the slicing wire 2 helps improve the cutting quality. Too tight or too loose slicing wire 2 may cause uneven cutting or cracks.

[0073] In this embodiment, a central shaft 92 is fixed in the middle of the central hole 91, and a plurality of reset pull ropes 94 corresponding to the radial holes are fixed on the central shaft 92, and the other ends of the reset pull ropes 94 extend into the radial holes and are connected to the tensioning head 93;

[0074] The multiple reset pull cords 94 on the same central axis 92 have different elastic moduli.

[0075] In addition, a side of the tensioning head 93 close to the outer surface of the roller body 9 is an arc surface, and the roughness of the arc surface is greater than the roughness of the outer surface of the roller body 9 .

[0076] In this embodiment, in order to solve the problem of the slicing wire 2 slipping, the slicing wire 2 can be tensioned. At the same time, the higher roughness of the arc surface of the tensioning head 93 can be used to help alleviate the slipping problem of the slicing wire 2.

[0077] It should be noted that, in this embodiment, the elastic moduli of the multiple reset ropes 94 on the same central axis 92 are different, and the roughness of the arc surface is greater than the roughness of the outer surface of the roller body 9. Therefore, when the fluid changes in the central hole 91 are used to adjust different numbers of tensioning heads 93 extending out of the radial holes, the overall roughness will also increase.

[0078] Specifically, the central axis 92 is fixed in the middle of the central hole 91 and plays the important role of connecting multiple reset ropes 94, so that all reset ropes 94 can be extended and retracted based on the same central point, thereby ensuring uniform distribution of tension.

[0079] One end of the reset rope 94 is fixed on the central shaft 92, and the other end extends into the radial hole and is connected to the tensioning head 93. When the fluid pressure in the central hole 91 changes, the reset rope 94 will expand and contract to different degrees according to its elastic modulus. Since the elastic moduli of the multiple reset ropes 94 on the same central shaft 92 are different, different numbers of tensioning heads 93 can be extended out of the radial holes to meet different tensioning requirements.

[0080] In addition, the side of the tensioning head 93 close to the outer surface of the roller body 9 is designed as an arc surface, which helps to better fit the shape of the sliced ​​wire 2 and can also increase the friction by increasing the contact area, thereby helping to alleviate the slipping problem of the sliced ​​wire 2. At the same time, the roughness of the arc surface is greater than the roughness of the outer surface of the roller body 9, further enhancing the anti-slip effect.

[0081] In summary, since the elastic moduli of the multiple reset pull ropes 94 on the same central shaft 92 are different, different numbers of tension heads 93 will extend out of the radial holes when adjusting the fluid in the central hole 91. Therefore, the tensioning force on the slice wire 2 can be increased step by step. At the same time, different numbers of tension heads 93 will also increase different roughness when extending, thereby gradually improving the anti-slip effect.

[0082] In order to improve the stability between the roller seats 1, two adjacent roller seats 1 are fixedly connected by a connecting rod 3.

[0083] What is described above is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A single crystal silicon wafer slicing device, characterized in that: include: Two roller bodies (9) are symmetrically arranged, and roller seats (1) are arranged at both ends of the roller bodies (9) so that the roller bodies (9) can be rotatably arranged on the roller seats (1); A plurality of slicing wires (2) are provided between two roller bodies (9) and the slicing wires (2) are used for slicing single crystal silicon rods (4); A nozzle (6) is sleeved on the outside of the slicing wire (2) and is used to spray liquid toward the single crystal silicon rod (4); The nozzle (6) comprises: A ring tube (61) having a through hole (63) in the middle thereof so as to be sleeved on the outside of the segmented wire (2); A plurality of spray holes (64) are arranged to be distributed in a circumferential manner, and one end of each of the plurality of spray holes (64) converges into an annular chamber of the annular cylinder (61); A liquid supply pipe (62), one end of which is connected to an external liquid supply device, and the other end of which is connected to the annular chamber; Wherein, the ring cylinder (61) is fixedly connected to the roller seat (1); The single crystal silicon rod (4) is adhered to the bottom of the base (5), and the base (5) can move vertically and / or the roller base (1) can move vertically; The number of the spray holes (64) is an even number and is evenly distributed, and the spray directions of the spray holes (64) are configured to be able to converge at a point P, and the minimum distance between the point P and the single crystal silicon rod (4) is 1 mm to 5 mm; A central hole (91) is provided on one side of the roller body (9), and a plurality of radial holes are also provided on the roller body (9), the radial holes being in communication with the central hole (91), and a tensioning head (93) being sealingly slidably provided in the radial hole, the tensioning head (93) being able to slide out of the radial hole and tension the slicing wire (2); The central hole (91) is a blind hole, and fluid is pre-placed in the blind hole; An end cover (95) is sealed and embedded in the opening of the central hole (91), and the depth to which one end of the end cover (95) extends into the central hole (91) is adjustable.

2. A single crystal silicon wafer slicing device according to claim 1, characterized in that: Each slicing wire (2) is provided with two nozzles (6) which are located on both sides of the single crystal silicon rod (4) respectively, and the nozzles (6) on two adjacent slicing wires (2) are arranged in a staggered manner so as to eliminate interference between the nozzles (6).

3. The single crystal silicon wafer slicing device according to claim 2, characterized in that: The distance between the two nozzles (6) on each slice wire (2) is the same.

4. The single crystal silicon wafer slicing device according to claim 1, characterized in that: An arc seat (11) is fixed between the two roller seats (1) at the ends of the roller body (9), and a plurality of pressing rollers (10) are rotatably arranged on the arc seat (11) for pressing the sliced ​​wire (2) onto the roller body (9).

5. The single crystal silicon wafer slicing device according to claim 1, characterized in that: A worm wheel (102) is sleeved on the end of one of the roller bodies (9), and the worm wheel (102) is drivingly connected to a worm (103). A mounting chamber (101) is provided in the roller seat (1) for rotating the worm (103), and the worm (103) is driven by a driver (8).

6. The single crystal silicon wafer slicing device according to claim 1, characterized in that: A central shaft (92) is fixed in the middle of the central hole (91), and a plurality of reset pull ropes (94) corresponding to the radial holes are fixed on the central shaft (92), and the other ends of the reset pull ropes (94) extend into the radial holes and are connected to the tensioning head (93); The multiple reset pull ropes (94) on the same central axis (92) have different elastic moduli.

7. The single crystal silicon wafer slicing device according to claim 1, characterized in that: A side of the tensioning head (93) close to the outer surface of the roller body (9) is an arc surface, and the roughness of the arc surface is greater than the roughness of the outer surface of the roller body (9).

8. The single crystal silicon wafer slicing device according to claim 1, characterized in that: Two adjacent roller seats (1) are fixedly connected by a connecting rod (3).

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