A method for mounting a flexible circuit board and a flexible circuit board

Abstract

The present invention provides a method for mounting a flexible circuit board and a flexible circuit board. The method comprises: providing a flexible circuit board substrate, an electronic structural component and a protective film; pre-processing the flexible circuit board substrate and the electronic structural component to obtain a pre-processed flexible circuit board substrate and a pre-processed electronic structural component; determining a mounting position according to the pre-processed flexible circuit board substrate; according to the mounting position and a preset mounting method, laminating the pre-processed electronic structural component on the pre-processed flexible circuit board substrate to obtain a first flexible circuit board substrate; performing connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate; laminating the protective film on the second flexible circuit board substrate to obtain a flexible circuit board. The present invention can improve the production efficiency of mounting electronic structural components on a flexible circuit board substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit boards, and also to a method for mounting a flexible circuit board and a flexible circuit board. Background Art

[0002] Flexible circuit boards, also known as soft circuit boards, are made of polyester film or polyimide as the substrate, and are made by etching copper foil to form circuits. They are highly reliable and extremely flexible printed circuits. Flexible circuit boards have the advantages of small size, light weight, high flexibility and excellent electrical properties, meeting the needs of high density, miniaturization, light weight, thinness and high reliability. Moreover, flexible circuit boards can be moved and stretched arbitrarily in three-dimensional space, thereby achieving the integration of component assembly and wire connection.

[0003] In order to increase the mechanical strength and stability of flexible circuit boards and prevent them from breaking or deteriorating in performance due to external forces such as bending and stretching during manufacturing, assembly or use, it is necessary to mount a reinforcement sheet on the flexible circuit board. The existing mounting method has low production efficiency and poor mounting effect. Summary of the invention

[0004] The technical problem to be solved by the present invention is to provide a method for mounting a flexible circuit board and a flexible circuit board, so as to improve the production efficiency of mounting a reinforcing sheet on the flexible circuit board.

[0005] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0006] A first aspect of the present invention provides a method for mounting a flexible circuit board, comprising:

[0007] Provide flexible circuit board substrates, electronic structural parts and protective films;

[0008] Pre-processing the flexible circuit board substrate and the electronic structural component respectively to obtain a pre-processed flexible circuit board substrate and a pre-processed electronic structural component;

[0009] Determining a mounting position according to the pre-processed flexible circuit board substrate;

[0010] According to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a first flexible circuit board substrate;

[0011] Performing connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate;

[0012] The protective film is laminated on the second flexible circuit board substrate to obtain a flexible circuit board.

[0013] Optionally, provide flexible circuit board substrates and electronic structural parts, including:

[0014] Provide flexible circuit board substrate rolls and electronic structural parts rolls;

[0015] Cutting the flexible circuit board substrate roll according to preset circuit board cutting conditions to obtain a flexible circuit board substrate;

[0016] The electronic structural component coil is cut according to preset electronic structural component cutting conditions to obtain electronic structural components.

[0017] Optionally, pre-processing the flexible circuit board substrate and the electronic structural component to obtain the pre-processed flexible circuit board substrate and the pre-processed electronic structural component includes:

[0018] Screening the flexible circuit board substrate according to preset circuit board screening conditions to obtain a screened flexible circuit board substrate;

[0019] Screening the electronic structural parts according to preset electronic structural parts screening conditions to obtain screened electronic structural parts;

[0020] The screened flexible circuit board substrate and the screened electronic structural component are cleaned to obtain a pre-treated flexible circuit board substrate and a pre-treated electronic structural component.

[0021] Optionally, determining a mounting position according to the pre-processed flexible circuit board substrate includes:

[0022] Get preset camera parameters;

[0023] Capturing an image of the preprocessed flexible circuit board substrate according to the preset camera parameters to obtain an image of the flexible circuit board substrate;

[0024] Preprocessing the flexible circuit board substrate image to obtain a preprocessed image;

[0025] Performing feature extraction on the preprocessed image to obtain a feature set;

[0026] The mounting position is determined according to the feature set.

[0027] Optionally, feature extraction is performed on the preprocessed image to obtain a feature set, including:

[0028] Determining a preset template according to the preprocessed flexible circuit board substrate;

[0029] Feature extraction is performed on the preprocessed image according to the preset template to obtain a feature set.

[0030] Optionally, according to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a first flexible circuit board substrate, including:

[0031] Determining a preset mounting method according to the preprocessed electronic structural parts;

[0032] According to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a flexible circuit board substrate with the electronic structural component;

[0033] If the preset mounting method is hot pressing mounting, the flexible circuit board substrate with the electronic structural parts is baked to obtain a first flexible circuit board substrate.

[0034] Optionally, performing connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate includes:

[0035] Capturing an image of the first flexible circuit board substrate to obtain an initial image;

[0036] Extracting connection points from the initial image to obtain connection point data;

[0037] Performing connection point detection on the first flexible circuit board substrate according to preset detection conditions and the connection point data to obtain a detection result;

[0038] The first flexible circuit board substrate is screened according to the detection result to obtain a second flexible circuit board substrate.

[0039] Optionally, performing connection point detection on the first flexible circuit board substrate according to preset detection conditions and the connection point data to obtain a detection result includes:

[0040] Acquire a preset first detection condition and a preset second detection condition;

[0041] Performing a first connection point detection on the first flexible circuit board substrate according to the preset first detection condition and the connection point data to obtain a first result;

[0042] Performing a second connection point detection on the first flexible circuit board substrate according to the preset second detection condition and the connection point data to obtain a second result;

[0043] A detection result is obtained according to the first result and the second result.

[0044] Optionally, laminating the protective film on the second flexible circuit board substrate to obtain a flexible circuit board, comprising:

[0045] Performing a coating process on the second flexible circuit board substrate to obtain a flexible circuit board substrate with an adhesive;

[0046] The protective film is laminated on the flexible circuit board substrate with adhesive according to a preset film laminating position, and is placed in a laminating machine for laminating to obtain a flexible circuit board.

[0047] A second aspect of the present invention provides a flexible circuit board, wherein the flexible circuit board is prepared by using any of the above-mentioned flexible circuit board mounting methods.

[0048] The above solution of the present invention includes at least the following beneficial effects:

[0049] The above scheme of the present invention pre-processes the provided flexible circuit board substrate and electronic structural parts, determines the mounting position according to the pre-processed flexible circuit board substrate, and then bonds the pre-processed electronic structural parts to the pre-processed flexible circuit board substrate according to the mounting position and the preset mounting method to obtain a first flexible circuit board substrate, and performs connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate, and finally bonds a protective film to the second flexible circuit board substrate to obtain a flexible circuit board, thereby improving the production efficiency of mounting reinforcing sheets on flexible circuit board substrates. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 is a schematic flow chart of a method for mounting a flexible circuit board in an embodiment of the present invention;

[0051] Figure 2 Schematic diagram of the structure of a flexible circuit board in an embodiment of the present invention.

[0052] Explanation of reference numerals: 1-flexible circuit board substrate, 2-electronic structural component, 3-protective film. DETAILED DESCRIPTION

[0053] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0054] like Figure 1 As shown, an embodiment of the present invention provides a method for mounting a flexible circuit board, comprising the following steps:

[0055] Step 101, providing a flexible circuit board substrate, electronic structural parts and a protective film;

[0056] Step 102, pre-processing the flexible circuit board substrate and the electronic structural component respectively to obtain a pre-processed flexible circuit board substrate and a pre-processed electronic structural component;

[0057] Step 103, determining a mounting position according to the pre-processed flexible circuit board substrate;

[0058] Step 104, according to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a first flexible circuit board substrate;

[0059] Step 105, performing connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate;

[0060] Step 106 , laminating the protective film on the second flexible circuit board substrate to obtain a flexible circuit board.

[0061] The method for mounting a flexible circuit board proposed in an embodiment of the present invention pre-processes the provided flexible circuit board substrate and electronic structural parts, determines the mounting position according to the pre-processed flexible circuit board substrate, and then bonds the pre-processed electronic structural parts to the pre-processed flexible circuit board substrate according to the mounting position and a preset mounting method to obtain a first flexible circuit board substrate, and performs connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate, and finally bonds a protective film to the second flexible circuit board substrate to obtain a flexible circuit board, which can improve the production efficiency of mounting reinforcement sheets on flexible circuit board substrates.

[0062] It should be noted that the electronic structural component in this embodiment specifically refers to a reinforcing sheet.

[0063] In an optional embodiment of the present invention, providing a flexible circuit board substrate and an electronic structural component in step 101 includes:

[0064] Step 1011, providing a flexible circuit board substrate roll and an electronic structural component roll;

[0065] Specifically, the material of the electronic structural part roll can be polyimide, polyester, stainless steel, etc., which can be selected according to user needs or the function of the flexible circuit board. The flexible circuit board substrate roll can be polyimide or polyester film, which can be selected according to user needs.

[0066] Step 1012, cutting the flexible circuit board substrate roll according to preset circuit board cutting conditions to obtain a flexible circuit board substrate;

[0067] Specifically, the preset circuit board cutting conditions may be set according to user requirements, including length, width, thickness and shape, etc. By setting the preset circuit board cutting conditions and cutting the flexible circuit board substrate coil according to the preset circuit board cutting conditions, a flexible circuit board substrate that meets user requirements can be obtained, thereby improving the qualification rate and user satisfaction of the final product. It should be noted that, due to product requirements, the flexible circuit board may have through holes or blind holes, etc., so the preset circuit board cutting conditions may also include data such as minimum line width, minimum line spacing, and minimum aperture. When cutting the flexible circuit board substrate coil, cutting parameters may also be set, and the cutting parameters may be input into the cutting device so that the cutting device cuts the flexible circuit board substrate coil according to the cutting parameters. Specifically, the cutting parameters may include cutting speed, cutting pressure, etc.

[0068] Step 1013 , cutting the electronic structural component coil according to preset electronic structural component cutting conditions to obtain electronic structural components.

[0069] Specifically, the application of electronic structural parts in flexible circuit board substrates is mainly to increase the mechanical strength and stability of the circuit board, and to prevent the circuit board from breaking or performance degradation due to external forces such as bending and stretching during manufacturing, assembly or use. Since the electronic structural parts may cover the entire flexible circuit board substrate, or only be mounted on a local specific area of ​​the flexible circuit board substrate, it is necessary to set preset electronic structural parts cutting conditions, and then cut the electronic structural parts roll according to the preset electronic structural parts cutting conditions to obtain electronic structural parts that meet the requirements, which is conducive to improving the efficiency and product quality during mounting. Here, the preset electronic structural parts cutting conditions can be determined according to user needs or the functions of the flexible circuit board, and can include dimensional information such as the length, width, thickness, and shape of the electronic structural parts.

[0070] In an optional embodiment of the present invention, step 102 includes:

[0071] Step 1021, screening the flexible circuit board substrate according to a preset circuit board screening condition to obtain a screened flexible circuit board substrate;

[0072] Specifically, the preset circuit board screening conditions may include a smooth appearance, no scratches, cracks, neat edges, no defects or burrs, and the length, width and thickness meet the length, width and thickness in the preset circuit board cutting conditions. Only the flexible circuit board substrates that meet the preset circuit board screening conditions are the screened flexible circuit board substrates, which has improved the accuracy of mounting and the product qualification rate.

[0073] Step 1022, screening the electronic structural components according to the preset electronic structural component screening conditions to obtain screened electronic structural components;

[0074] Specifically, the preset electronic structural parts screening conditions may include a flat surface, no bumps or impurities, the size and shape of the electronic structural parts match the reinforcement area reserved on the flexible circuit board substrate, the edges of the electronic structural parts are smooth, and there are no sharp corners, etc. Only electronic structural parts that meet the preset electronic structural parts screening conditions are screened electronic structural parts, so as to avoid electronic structural parts that do not meet the requirements from scratching the flexible circuit board substrate or affecting the mounting effect.

[0075] Step 1023 , cleaning the screened flexible circuit board substrate and the screened electronic structural component to obtain a pre-treated flexible circuit board substrate and a pre-treated electronic structural component.

[0076] Specifically, the screened flexible circuit board substrates and screened electronic structural parts are cleaned to remove surface stains to avoid the impact of surface dirt on subsequent mounting and testing, which is conducive to improving production efficiency, product qualification rate and detection accuracy.

[0077] In an optional embodiment of the present invention, step 103 includes:

[0078] Step 1031, obtaining preset camera parameters;

[0079] Specifically, before using a high-resolution CCD camera (a digital camera with a charge-coupled device image sensor) to photograph the flexible circuit board and obtain a clear and complete image of the flexible circuit board, it is necessary to set the preset camera parameters. The preset camera parameters may include exposure time, aperture size, focal length, etc. to ensure image quality. In a specific embodiment, the preset camera parameters include: resolution Pixels, exposure time is 10ms, aperture size is F2.8, focal length is 50mm. The image of the pre-processed flexible circuit board substrate is captured using the preset camera parameters, and the image obtained is relatively clear and complete. Other preset camera parameters can also be selected according to actual conditions and needs.

[0080] Step 1032, capturing an image of the preprocessed flexible circuit board substrate according to the preset camera parameters to obtain an image of the flexible circuit board substrate;

[0081] Specifically, the obtained preset camera parameters are used to shoot the pre-processed flexible circuit board substrate with a high-resolution CCD camera to obtain a clear and complete image of the flexible circuit board substrate.

[0082] Step 1033, preprocessing the flexible circuit board substrate image to obtain a preprocessed image;

[0083] Specifically, the flexible circuit board substrate image is preprocessed by at least one of filtering, denoising, contrast enhancement, etc., so as to improve the image clarity and recognition accuracy, as well as the accuracy of the subsequent mounting position.

[0084] Step 1034, extracting features from the preprocessed image to obtain a feature set;

[0085] Specifically, an edge detector can be used to extract edge information of the flexible circuit board substrate in the preprocessed image. The edge is usually an important part of the key feature point or mark; or a corner detector can be used to detect the corner feature on the flexible circuit board substrate in the preprocessed image. The corner point is usually the point with the most dramatic change in the image and has high recognition and stability; or, if the specific shape and position of the key feature point or mark are known, these features can be directly used as templates for matching. These templates can be binary images, grayscale images or areas of specific shapes. The preprocessed image is subjected to feature extraction by any of the above methods to obtain key feature points or marks on the flexible circuit board substrate. These feature points or marks can be specific patterns, hole positions, edges, etc. on the flexible circuit board substrate. The most stable and significant feature points or marks are selected from the extracted features as a feature set for subsequent determination of the mounting position. In addition, the features in the feature set can also be optimized to improve the accuracy and robustness of the matching.

[0086] Step 1035, determining the mounting position according to the feature set.

[0087] Specifically, according to the feature set, the coordinates of the electronic structural parts in the preprocessed image are converted to the coordinates in the actual image, and the precise position where the electronic structural parts should be attached is calculated according to the converted coordinates combined with the size and shape of the electronic structural parts. The specific steps include:

[0088] Determine the image coordinate system: The preprocessed image usually has a known coordinate system, which is based on the pixel positions of the image itself.

[0089] Establishing the world coordinate system: The world coordinate system is a coordinate system established relative to the actual physical environment (such as the flexible circuit board substrate) and has a wider range of applicability. The origin of the world coordinate system can be selected at a fixed point on the flexible circuit board substrate (such as the upper left corner, center point, etc.), and the direction of the coordinate axis is determined according to actual needs.

[0090] Calculate the transformation matrix: The transformation matrix is ​​used to map points in the image coordinate system to the world coordinate system. This matrix can be obtained through camera calibration, image processing algorithms, etc. The transformation matrix usually includes transformation factors such as translation, rotation, and scaling.

[0091] Apply the transformation matrix: multiply the coordinates of the electronic structural component in the preprocessed image by the transformation matrix to obtain its coordinates in the world coordinate system (i.e., the flexible circuit board substrate), i.e., the transformed coordinates.

[0092] Determine the parameters of electronic structural parts: The size (length, width), shape (rectangular, circular, etc.) and alignment (such as center point alignment, edge alignment, etc.) of electronic structural parts are key parameters for calculating the position.

[0093] Calculate the mounting position: Calculate the mounting position of the electronic structure in the flexible circuit board substrate based on the converted coordinates and the size (length, width) of the electronic structure. If the center point alignment method is used, the mounting position is the converted coordinates plus half of the width and length of the electronic structure (for rectangular electronic structures).

[0094] In a specific embodiment, a rectangular electronic component is 5 mm wide and 10 mm long and needs to be mounted at a specified position on a flexible circuit board substrate. The coordinates of the electronic component in the preprocessed image are (100, 200). Given the camera calibration results and the size information of the flexible circuit board substrate, the transformation matrix between the image coordinate system and the world coordinate system can be calculated. The transformation matrix is ​​applied to transform (100, 200) into coordinates in the world coordinate system. Assume that the result is If the center point alignment method is used, the placement position of the electronic structure is , that is, the position of the center point of the electronic structural component in the world coordinate system. According to the calculated mounting position, the electronic structural component is accurately mounted on the flexible circuit board substrate using automated equipment or manual labor.

[0095] In an optional embodiment of the present invention, step 1034 includes:

[0096] Step 10341, determining a preset template according to the pre-processed flexible circuit board substrate;

[0097] Specifically, firstly, a preset template for matching needs to be designed based on the design drawings or actual samples of the flexible circuit board substrate. This preset template can be a collection of key feature points such as specific patterns, hole positions, edge shapes, etc. on the circuit board.

[0098] Step 10342: extract features from the preprocessed image according to the preset template to obtain a feature set.

[0099] Specifically, the preprocessed image is matched according to the specific pattern, hole position, edge shape and other features in the preset template as a template to extract a feature set. The specific matching method can be to first set the matching parameters such as the search range, matching threshold, similarity measurement method, etc., match the preset template with the preprocessed image according to these matching parameters, search for the area in the image that is most similar to the preset template, and give the matching result. According to the matching result, the specific position of the key feature point or mark in the image is marked as the initial feature set; the most stable and significant feature point or mark is selected from the initial feature set as the final feature set, which is used as the basis for subsequent template matching.

[0100] In an optional embodiment of the present invention, step 104 includes:

[0101] Step 1041, determining a preset mounting method according to the preprocessed electronic structural component;

[0102] Specifically, if the pre-treated electronic structural component is a hot-pressing electronic structural component, the corresponding preset mounting method is hot-pressing mounting; if the pre-treated electronic structural component is a pressure-sensitive electronic structural component, the corresponding preset mounting method is cold-pressing mounting.

[0103] Step 1042, according to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a flexible circuit board substrate with the electronic structural component;

[0104] Specifically, for thermocompressible electronic structural parts, after placing the electronic structural parts at the designated position of the flexible circuit board substrate, the heat-hardening glue of the electronic structural parts is melted and tightly fitted on the flexible circuit board substrate by heating and pressurizing. For pressure-sensitive electronic structural parts, there is no need to heat them, and the electronic structural parts are directly pressed on the flexible circuit board substrate by a cold press or similar equipment. It should be noted that automatic mounting equipment can be used to realize automatic grasping, positioning and mounting of electronic structural parts. Here, the mounting equipment parameters can be set, and the mounting equipment parameters can be input into the controller of the automatic mounting equipment to complete the mounting. The mounting equipment parameters include: mounting accuracy, such as ±0.05mm; mounting speed, such as 3000 pieces / hour; mounting pressure, which needs to be adjusted according to the type and thickness of the electronic structural parts, generally ranging from 0.1 to 0.5MPa. The automatic mounting equipment can use pressure sensing or laser positioning technology to ensure that the electronic structural parts are tightly fitted to the flexible circuit board substrate without defects such as bubbles and offsets.

[0105] Step 1043: If the preset mounting method is hot pressing mounting, the flexible circuit board substrate with electronic structural parts is baked to obtain a first flexible circuit board substrate.

[0106] Specifically, for hot-pressed electronic components, the heat-hardening adhesive of the electronic components may not be fully aged due to the low pressure or short time during pressing. Therefore, the flexible circuit board substrate with the electronic components attached needs to be placed in a high temperature environment for a long time for baking to fully age the adhesive and increase the adhesion between the electronic components and the flexible circuit board substrate.

[0107] In an optional embodiment of the present invention, step 105 includes:

[0108] Step 1051, capturing an image of the first flexible circuit board substrate to obtain an initial image;

[0109] Specifically, a high-resolution CCD camera can be used to capture images of the first flexible circuit board substrate, and the captured images can be converted into grayscale to convert the color images into grayscale images. Since grayscale images require less computational effort during processing and can retain sufficient image information, processing efficiency can be improved. The grayscale images can then be filtered using methods such as Gaussian filtering or median filtering to remove noise and interference in the image and improve image quality.

[0110] Step 1052, extracting connection points from the initial image to obtain connection point data;

[0111] Specifically, the initial image can be extracted through the following steps to obtain the connection point data:

[0112] (1) Calculate the gradient of each pixel (x, y) in the initial image in the x and y directions and The formula is: , ,in, is the gradient of the pixel (x, y) in the x direction, is the gradient of the pixel point (x, y) in the y direction, is the grayscale value of the pixel (x, y).

[0113] (2) By , and obtain the covariance matrix M of each pixel (x, y) in the initial image.

[0114] (3) By The corner point response function is calculated, where R is the corner point response function, is the determinant of M, is the trace of M, is an empirical constant ranging from 0.04 to 0.06.

[0115] (4) If R is greater than the preset value T, the corresponding pixel point is a corner point. The detected corner points are marked on the initial image. According to the marked corner point positions, the connection point data between the electronic structural parts and the flexible circuit board substrate can be extracted, such as position, quantity, shape, size (length, width, etc.), color, etc.

[0116] Here, the position (x, y coordinates) of each connection point is recorded through the coordinates of each pixel point in the image to obtain the position data of the connection point; the total number of connection points is counted to obtain the quantity data of the connection points; since the connection points are usually point-shaped and do not directly have shape characteristics, the contact shape of the electronic structural component and the substrate can be inferred based on the relative position relationship between the connection points, that is, the shape data of the connection point is obtained; for the contact area between the electronic structural component and the substrate, the length, width and other information of the connection point can be indirectly obtained by measuring the distance between the connection points or calculating the area of ​​the contact area, and the size data of the connection point can be obtained; the color information of the connection point area is extracted through the color channel of the image to obtain the color data of the connection point.

[0117] Step 1053, performing connection point detection on the first flexible circuit board substrate according to preset detection conditions and the connection point data to obtain a detection result;

[0118] Specifically, according to the preset preliminary verification criteria (such as the number, shape, and position of the connection points), the extracted connection point data is preliminarily verified to screen out possible abnormal points. Then, according to the preset detection conditions and the connection point data, the connection point detection of the first flexible circuit board substrate is performed to obtain the detection result. The detection result needs to include the number, shape, and position of the connection points of the first flexible circuit board substrate, as well as the abnormal connection points.

[0119] Step 1054 , screening the first flexible circuit board substrate according to the detection result to obtain a second flexible circuit board substrate.

[0120] Specifically, the test results can be compared with the preset qualified conditions. If the number, shape, position, etc. of the connection points of the first flexible circuit board substrate in the test results correspond to the number, shape, and position of the connection points in the preset qualified conditions, and the abnormal connection points in the test results are smaller than the abnormal connection points in the preset qualified conditions, then the first flexible circuit board substrate corresponding to the test result is the second flexible circuit board substrate.

[0121] In an optional embodiment of the present invention, step 1053 includes:

[0122] Step 10531, obtaining a preset first detection condition and a preset second detection condition;

[0123] Specifically, the preset first detection condition includes the position and number of the connection points; the preset second detection condition includes the shape, size (length, width, etc.), color, etc. of the connection points.

[0124] Step 10532, performing a first connection point detection on the first flexible circuit board substrate according to the preset first detection condition and the connection point data to obtain a first result;

[0125] Specifically, the positions and number of connection points in the connection point data are compared with the positions and number of connection points in the first detection condition to obtain a first result, which may include: the positions and number of connection points in the connection point data, the positions and number of connection points in the first detection condition, and the comparison result. The first connection point detection is a detection of the number of connection points to ensure that all necessary connection points exist.

[0126] Step 10533, performing a second connection point detection on the first flexible circuit board substrate according to the preset second detection condition and the connection point data to obtain a second result;

[0127] Specifically, the shape, size, color, etc. of the connection point in the connection point data are compared with the shape, size (length, width, etc.), color, etc. of the connection point in the preset second detection condition to obtain a second result, which may include: the shape, size, color of the connection point in the connection point data, the shape, size (length, width, etc.), color of the connection point in the preset second detection condition, and the comparison result. The second connection point detection is based on the first detection and is a test of the quality of the connection point, including checking the firmness of the connection point, whether there is a cold solder joint, a leaky solder joint, and other problems. This can be achieved by analyzing the shape, size, color, and other features of the connection point.

[0128] Step 10534, obtaining a detection result according to the first result and the second result.

[0129] Specifically, the test result may be a test report generated by evaluating the quality of the connection point based on the first result and the second result.

[0130] In an optional embodiment of the present invention, step 106 includes:

[0131] Step 1061, coating the second flexible circuit board substrate to obtain a flexible circuit board substrate with an adhesive;

[0132] Specifically, a thin layer of adhesive may be evenly coated on the second flexible circuit board substrate or the protective film to bond the protective film to the second flexible circuit board substrate.

[0133] Step 1062, laminating the protective film on the flexible circuit board substrate with adhesive according to a preset film laminating position, and placing the protective film in a laminating machine for laminating to obtain a flexible circuit board.

[0134] Specifically, the function of the protective film is to protect the surface of the flexible circuit board substrate from the influence of the external environment, such as moisture, dust, chemicals, etc., to improve the durability and reliability of the product. Automatic protective film attaching equipment can be used to ensure that the protective film fits perfectly with the flexible circuit board substrate. The automatic protective film attaching equipment takes the protective film out of the tray and accurately aligns it to the specified position of the flexible circuit board substrate. The protective film is evenly attached to the surface of the flexible circuit board substrate through a robot or a pressing device.

[0135] A specific embodiment of the method for mounting a flexible circuit board provided in an embodiment of the present invention is as follows:

[0136] In this embodiment, the electronic structural component is taken as a reinforcing sheet for specific description.

[0137] Step 111, providing a flexible circuit board substrate, a reinforcing sheet and a protective film.

[0138] According to user needs or the functions that the flexible circuit board needs to achieve, select the flexible circuit board substrate, reinforcement sheet and protective film of corresponding materials.

[0139] Step 112, preprocessing.

[0140] According to the preset screening conditions, the flexible circuit board substrate, reinforcement sheet, etc. are screened to avoid the influence of material, size and other factors on the subsequent mounting effect and product qualification rate. The screened flexible circuit board substrate and reinforcement sheet are cleaned to avoid the influence of surface dirt on subsequent mounting and testing, which is conducive to improving production efficiency, product qualification rate and detection accuracy.

[0141] Step 113, determine the mounting position.

[0142] By collecting images of the pre-processed flexible circuit board substrate, the mounting position of the reinforcing sheet is determined according to the obtained flexible circuit board substrate image.

[0143] Step 114 , attaching a reinforcing sheet to the flexible circuit board substrate.

[0144] Select the corresponding mounting method according to the hot-pressing reinforcement sheet or the pressure-sensitive reinforcement sheet. For example, for the hot-pressing reinforcement sheet, select the hot-pressing mounting method; for the pressure-sensitive reinforcement sheet, select the cold-pressing mounting method; and then attach the reinforcement sheet to the flexible circuit board substrate according to the corresponding mounting method.

[0145] In addition, for the hot-pressed reinforcing sheet, after the reinforcing sheet is attached to the flexible circuit board substrate, the flexible circuit board substrate needs to be placed in a high-temperature environment for a long time for baking to allow the glue to fully age and increase the adhesion between the reinforcing sheet and the flexible circuit board substrate.

[0146] Step 115, connection point detection.

[0147] Perform image acquisition on the flexible circuit board substrate with a reinforcement sheet to obtain an initial image, obtain connection point data based on the initial image, and then perform connection point detection on the flexible circuit board substrate with a reinforcement sheet based on preset detection conditions and the connection point data. If the position, quantity, shape, size, and color of the connection points in the detection results are consistent with the position, quantity, shape, size, and color of the connection points in the preset detection conditions, or the error is less than a preset value, the corresponding flexible circuit board substrate with a reinforcement sheet is qualified and subsequent processing is performed, otherwise it needs to be repaired until it is qualified.

[0148] Step 116, attaching a protective film.

[0149] In order to protect the surface of the flexible circuit board substrate from being polluted by moisture, dust, chemicals, etc., a protective film needs to be attached to the other side of the flexible circuit board substrate where the reinforcement sheet is not mounted, so as to improve the neatness and safety of the flexible circuit board substrate.

[0150] The method for mounting a flexible circuit board provided in the embodiment of the present invention can not only improve the efficiency of mounting a reinforcing sheet on a flexible circuit board, but also detect the mounting quality through connection point detection, which is beneficial to improving the product qualification rate and customer satisfaction.

[0151] An embodiment of the present invention provides a flexible circuit board, and the flexible circuit board is prepared by using the mounting method of a flexible circuit board as described in any one of the above embodiments.

[0152] In this embodiment, the flexible circuit board includes a flexible circuit board substrate 1, an electronic structure 2 and a protective film 3, wherein the electronic structure 2 and the protective film 3 are respectively arranged on the first surface and the second surface of the flexible circuit board substrate 1. The electronic structure is a reinforcing sheet.

[0153] It should be noted that the electronic structural part 2 can completely cover the flexible circuit board substrate 1, or the electronic structural part 2 can be set in the area of ​​the flexible circuit board substrate 1 where the mechanical strength needs to be strengthened, and the specific size (such as length, width, thickness, shape, etc.) of the electronic structural part 2 can be determined according to actual needs. The protective film 3 can completely cover the flexible circuit board substrate 1, or it can selectively cover a specific area on the flexible circuit board substrate 1, which not only achieves the purpose of protection, but also ensures the normal function and use of the flexible circuit board.

[0154] The flexible circuit board of the embodiment of the present invention has a simple structure, good mechanical strength and a wider range of applications.

[0155] It should be noted that, in the above-mentioned embodiments, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0156] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for mounting a flexible circuit board, It is characterized in that include: Provide flexible circuit board substrates, electronic structural parts and protective films; Pre-processing the flexible circuit board substrate and the electronic structural component respectively to obtain a pre-processed flexible circuit board substrate and a pre-processed electronic structural component; Determining a mounting position according to the pre-processed flexible circuit board substrate; According to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a first flexible circuit board substrate; Performing connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate; Laminating the protective film on the second flexible circuit board substrate to obtain a flexible circuit board; The method of pre-processing the flexible circuit board substrate and the electronic structural component to obtain the pre-processed flexible circuit board substrate and the pre-processed electronic structural component comprises: Screening the flexible circuit board substrate according to preset circuit board screening conditions to obtain a screened flexible circuit board substrate; Screening the electronic structural parts according to preset electronic structural parts screening conditions to obtain screened electronic structural parts; Cleaning the screened flexible circuit board substrate and the screened electronic structural component to obtain a pre-treated flexible circuit board substrate and a pre-treated electronic structural component; Wherein, determining the mounting position according to the pre-processed flexible circuit board substrate includes: Get preset camera parameters; Capturing an image of the preprocessed flexible circuit board substrate according to the preset camera parameters to obtain an image of the flexible circuit board substrate; Preprocessing the flexible circuit board substrate image to obtain a preprocessed image; Performing feature extraction on the preprocessed image to obtain a feature set; Determine the placement position according to the feature set; The method of performing connection point detection on the first flexible circuit board substrate to obtain a second flexible circuit board substrate includes: Capturing an image of the first flexible circuit board substrate to obtain an initial image; Extracting connection points from the initial image to obtain connection point data; Performing connection point detection on the first flexible circuit board substrate according to preset detection conditions and the connection point data to obtain a detection result; The first flexible circuit board substrate is screened according to the detection result to obtain a second flexible circuit board substrate.

2. The method for mounting a flexible circuit board according to claim 1, It is characterized in that Provide flexible circuit board substrates and electronic structural parts, including: Provide flexible circuit board substrate rolls and electronic structural parts rolls; Cutting the flexible circuit board substrate roll according to preset circuit board cutting conditions to obtain a flexible circuit board substrate; The electronic structural component coil is cut according to preset electronic structural component cutting conditions to obtain electronic structural components.

3. The method for mounting a flexible circuit board according to claim 1, It is characterized in that Perform feature extraction on the preprocessed image to obtain a feature set, including: Determining a preset template according to the preprocessed flexible circuit board substrate; Feature extraction is performed on the preprocessed image according to the preset template to obtain a feature set.

4. The method for mounting a flexible circuit board according to claim 1, It is characterized in that According to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a first flexible circuit board substrate, including: Determining a preset mounting method according to the preprocessed electronic structural parts; According to the mounting position and the preset mounting method, the pre-processed electronic structural component is mounted on the pre-processed flexible circuit board substrate to obtain a flexible circuit board substrate with the electronic structural component; If the preset mounting method is hot pressing mounting, the flexible circuit board substrate with the electronic structural parts is baked to obtain a first flexible circuit board substrate.

5. The method for mounting a flexible circuit board according to claim 1, It is characterized in that Performing connection point detection on the first flexible circuit board substrate according to preset detection conditions and the connection point data to obtain a detection result, including: Acquire a preset first detection condition and a preset second detection condition; Performing a first connection point detection on the first flexible circuit board substrate according to the preset first detection condition and the connection point data to obtain a first result; Performing a second connection point detection on the first flexible circuit board substrate according to the preset second detection condition and the connection point data to obtain a second result; A detection result is obtained according to the first result and the second result.

6. The method for mounting a flexible circuit board according to claim 1, It is characterized in that The protective film is laminated on the second flexible circuit board substrate to obtain a flexible circuit board, comprising: Performing a coating process on the second flexible circuit board substrate to obtain a flexible circuit board substrate with an adhesive; The protective film is laminated on the flexible circuit board substrate with adhesive according to a preset film laminating position, and is placed in a laminating machine for laminating to obtain a flexible circuit board.

7. A flexible circuit board, It is characterized in that The flexible circuit board is prepared by the flexible circuit board mounting method according to any one of claims 1 to 6.

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