Spray disc processing method and processing equipment

Abstract

The present application provides a spray disc processing method and processing equipment, which belongs to the technical field of spray disc processing; comprising the following steps: obtaining image information of multiple micropores on the surface of the spray disc; performing feature extraction on the image information to obtain feature data of the micropores; inputting the feature data of the micropores into a trained processing prediction model to obtain micropore prediction values ​​output by the processing prediction model; calculating actual feature values ​​and predicted feature values; judging the state of the micropore processing equipment based on the calculated values, and adjusting based on the state judgment results; solving the technical problem of low spray disc processing efficiency in the prior art, and achieving the technical effect of improving the spray disc processing efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of spray disc processing, and in particular to a spray disc processing method and processing equipment. Background Art

[0002] As one of the three core equipment in semiconductor manufacturing, thin film deposition equipment is the basis of almost all subsequent processes. The thin film deposition process generally refers to the deposition of a functional thin film on a silicon wafer substrate. This process often involves the introduction of reaction gases, and the uniformity of the gas introduction will directly affect the growth quality of the thin film. The spray plate is a surface-type reaction source gas introduction device in the thin film deposition process. It is one of the key core components of semiconductor thin film deposition equipment and directly affects the reliability and stability of the equipment.

[0003] As the main component of the spray disc, the spray head has a vital impact on its performance. At present, vertical or horizontal processing machines are generally used to punch holes in the raw materials through micro-hole drills with a diameter of 0.3-3mm. However, in the processing of the spray disc, thousands of micro-holes are often required to be processed on the surface of the spray disc. Depending on the drilling depth and the drilling process, the drilling time of a first-order hole varies from 10 to 60 seconds. The number of holes in the spray head often reaches thousands. Taking 3,000 holes as an example, the drilling time alone takes 30 to 54 hours. The production efficiency of existing spray discs is too low.

[0004] Therefore, the problem of the prior art is that the processing efficiency of the spray disc is too low. Summary of the invention

[0005] The present application provides a spray disk processing method and processing equipment, which solves the technical problem of low processing efficiency of the spray disk, and adopts the following technical scheme, including: obtaining image information of multiple micropores on the surface of the spray disk; performing feature extraction on the image information to obtain feature data of the micropores; inputting the feature data of the micropores into a trained processing prediction model to obtain micropore prediction values ​​output by the processing prediction model; calculating actual feature values ​​and the predicted feature values; and judging the state of the micropore processing equipment based on the calculated values, and making adjustments based on the state judgment results.

[0006] Preferably, the state of the micro-hole processing equipment is judged, including: calculating the value obtained as the processing difference, that is, the difference between the actual characteristic value and the predicted characteristic value; constructing multiple intervals according to the processing difference; calculating the weighted proportion of multiple processing differences in multiple intervals; judging the state of the micro-hole processing equipment according to the weighted proportion; adjusting the micro-hole processing equipment accordingly according to the state judgment result; if the micro-hole processing equipment meets the preset requirements, continuing to process the next spray plate; if the micro-hole processing equipment does not meet the preset requirements, judging that the micro-hole processing equipment has processing abnormalities, replacing the micro-hole processing equipment as a whole, or replacing the electrodes used for processing separately.

[0007] Preferably, counting the weighted proportions of the plurality of processing differences in each interval includes: obtaining the weighted proportion H in the i-th interval i ; Weighted ratio H i It is calculated by the following method, H i =(sum i / sum) *α i ; Among them, sum i is the cumulative number of multiple processing differences in the i-th interval; sum is the total number of multiple processing differences; α i is the weighted value α corresponding to the i-th interval i .

[0008] As an advantage, the method further includes the following steps: establishing a plurality of intervals, wherein the plurality of intervals include a first interval, a second interval, a third interval, and a fourth interval, and obtaining a weighted ratio H of the corresponding intervals. i ; Among them, the first interval is the interval from the residual mean to the residual mean plus 5 times the standard deviation; the second interval is the interval from the residual mean minus 5 times the standard deviation to the residual mean; the third interval is the interval greater than the residual mean plus 5 times the standard deviation; the fourth interval is the interval less than the residual mean minus 5 times the standard deviation; the processing status of the micro-hole processing equipment is judged according to the weighted ratio of each interval.

[0009] Preferably, the identification of the micro-hole processing equipment according to the weighted ratio of each interval includes: obtaining a preset first threshold; calculating the sum of the third weighted ratio corresponding to the third interval and the fourth weighted ratio corresponding to the fourth interval; if the sum is not greater than the preset first threshold, it is determined that the processing state of the micro-hole processing equipment is normal, and a first execution signal is output, and the first execution signal is to continue normal processing; if the sum is greater than the preset first threshold, it is determined that the processing state of the micro-hole processing equipment is abnormal, and a first abnormal signal is output, and the first abnormal signal is used to determine that a processing abnormality exists.

[0010] Preferably, when the first abnormal signal is received, the following steps are further included: calculating the difference between the absolute values ​​of the third weighted ratio and the fourth weighted ratio; if the difference is greater than zero, that is, the absolute value of the third weighted ratio is greater than the absolute value of the fourth weighted ratio, outputting a second abnormal signal, the second abnormal signal indicating abnormal processing setting conditions; if the difference is not greater than zero, that is, the absolute value of the third weighted ratio is not greater than the absolute value of the fourth weighted ratio, outputting a third abnormal signal, the third abnormal signal indicating excessive electrode wear in the processing equipment.

[0011] Preferably, when a second abnormal signal is received, the method further includes the following steps: based on the second abnormal signal, outputting a second execution signal, wherein the second execution signal is to adjust processing parameters of the processing equipment so that the parameters meet the processing requirements.

[0012] Preferably, when a third abnormal signal is received, the following steps are also included: obtaining a preset second threshold; calculating the size of the fourth weighted ratio and the second threshold; if the fourth weighted ratio is greater than the second threshold, outputting a third execution signal, the third execution signal is to find the corresponding micropore and the electrode corresponding to the micropore, and directly replace the electrode; if the fourth weighted ratio is not greater than the second threshold, outputting a fourth execution signal, the fourth execution signal is to perform a replacement on all electrodes in the processing equipment.

[0013] Preferably, preprocessing operations are performed on the abnormal data in the acquired feature data, including: if there is abnormal data with sudden jumps in the current feature data acquisition process, the data with sudden jumps are eliminated and the data at that location is completed; if there is abnormal data with continuous jumps in the current feature data acquisition process, the data obtained by the current operation is abandoned.

[0014] The present application also provides a micro-hole processing equipment, including: a micro-hole processing device, a detection device, and a controller, wherein the micro-hole processing device is used to simultaneously process multiple micro-holes on the surface of a spray disk; the detection device is used to detect status information of the micro-holes on the surface of the spray disk; status information of the surface micro-holes; the controller is communicatively connected with the detection device and the micro-hole processing equipment, and is used to obtain characteristic data of the micro-holes on the surface of the spray disk from the detection device to execute the steps of the aforementioned spray disk processing method.

[0015] In summary, the present application includes at least one of the following beneficial technical effects:

[0016] 1. The present application provides a spray plate processing method for use in a micro-hole processing device including a plurality of electrodes. By using the processing method in the present application, a plurality of micro-holes can be successfully processed on the surface of the spray plate at one time. Processing a plurality of micro-holes at one time can greatly shorten the processing time of the spray plate, shortening the original processing time of a single spray plate of more than 50 hours to within a few hours, thereby greatly increasing the production efficiency of the spray plate.

[0017] 2. The present application provides a spray plate processing method, by which the processing conditions of microholes are judged and the state of the microhole processing equipment is appropriately adjusted so that the electrode processing state in the microhole processing equipment meets the requirements, so that the microholes processed by the processing method in the present application meet the consistency requirements, thereby improving the production efficiency and production quality of the spray plate.

[0018] 3. The present application provides a method for processing a spray plate, which adopts electric spark equipment for processing, thereby avoiding the risk of tool breakage that may occur during mechanical processing. At the same time, electrode processing also avoids the hole mouth burrs that may occur with mechanical processing (especially the internal burrs of multi-step holes, which are extremely difficult to remove), thereby improving the production efficiency and production quality of the spray plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of a process for processing a spray plate provided in one embodiment of the present invention:

[0020] Figure 2 A schematic diagram of a flow chart for judging the state of a micro-hole processing device provided in one embodiment of the invention;

[0021] Figure 3 A schematic diagram of processing difference distribution provided in one embodiment of the present invention;

[0022] Figure 4 This is a flow chart of step S400 in one embodiment of the present invention;

[0023] Figure 5 This is a flow chart of step S500 in one embodiment of the present invention;

[0024] Figure 6 This is a flow chart of step S700 in one embodiment of the present invention;

[0025] Figure 7 Schematic diagram of a micro-hole processing device in one embodiment of the present invention.

[0026] Description of reference numerals: 100, micro-hole processing device; 110, electrode. DETAILED DESCRIPTION

[0027] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0028] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] In the prior art, the spray head, as the main component of the spray disc, has a crucial impact on its performance. The method commonly used to prepare the spray head is precision micro-hole processing, using a vertical or horizontal processing machine to punch holes in the raw material through a micro-hole drill with a diameter of 0.3-3mm; in the prior art, during the processing of the spray disc, it is often necessary to machine thousands of micro-holes on the surface of the spray disc, and the quality requirements for a single micro-hole are also very high. Depending on the drilling depth and drilling process, the drilling time of a first-order hole varies from 10 to 60 seconds, and the number of holes in the spray head often reaches above 10 seconds. For example, 3,000 holes require 30 to 54 hours of drilling time alone, and a dedicated person is required to operate and observe during the drilling process. At the same time, since a very small diameter mechanical drill is used in mechanical processing, the drill is likely to break. Once the drill breaks, the entire spray disc will be scrapped, making the entire processing process a waste. At the same time, if the micro-hole processing of the spray head is done by machining, it is often accompanied by burrs on the hole mouth (especially the internal burrs of multi-step holes are difficult to remove). The combination of the above factors leads to too low production efficiency of a single spray disc.

[0030] In order to solve the problem of low efficiency, existing spray disc manufacturers have made many attempts, such as changing the processing method, optimizing the processing process, etc. However, under the premise of ensuring accuracy, no method that can significantly improve efficiency has been developed.

[0031] In the prior art, some manufacturers also use electric sparks to process micropores on the surface of the spray disk. However, when a single electrode 110 is used for processing in the prior art, its efficiency is not faster than that of a single mechanical cutting device, and the electric spark micropore processing equipment must also consider issues such as temperature and processing fluid flow direction; at the same time, the electrode 110 will also be worn out during use, and the wear will cause the processed hole to become smaller. Since the processing environment of the electric spark electrode at different positions on the surface of the spray disk is different, the consumption degree of the electric spark electrode is different when processing at different positions. This makes the consistency of the surface micropores when the electric spark electrode is used to process the micropores on the surface of the spray disk have problems, and the processed micropores on the surface of the spray disk do not meet the requirements. Therefore, even if electric spark processing is used, the spray disk processing efficiency is not significantly improved. The reason why no one uses multiple electrodes 110 to process the micropores on the surface of the spray disk at the same time is because the existing processing method cannot guarantee the consistency of processing.

[0032] In order to solve the above problems, the present application provides a spray plate processing method for processing micropores on the surface of the spray plate, by controlling a micropore processing device having multiple electric spark electrodes 110 to synchronously process the micropores on the surface of the spray plate, so that the micropore processing device can complete the processing of multiple or even all micropores at one time, so as to improve the processing efficiency of the micropores on the surface of the spray plate while ensuring the consistency of the micropore processing;

[0033] S101, use Figure 7 The micro-hole processing device in the processing equipment first moves the device to a specified position; and positions the device through a positioning part in the processing device;

[0034] S102, making multiple electrodes 110 in the device move synchronously along a first direction, the first direction is the axial direction of the spray disk, the number of electrodes 110 in the processing device is preferably half or more of the number of micropores on the surface of the spray disk; preferably, the number of electrodes 110 in the processing device is the same as the number of micropores to be processed on the surface of the spray disk; by setting multiple electrodes 110, multiple micropores can be processed at one time, which greatly shortens the time required for processing and greatly improves the efficiency of processing micropores on the surface of the spray disk. In one embodiment, the number of electrodes 110 is the same as the number of micropores on the surface of the spray disk, and all micropores on the surface of the spray disk can be processed at one time.

[0035] like Figure 1-Figure 2As shown, in the process of electrospark machining of a micro-hole machining device, in order to solve the problem of consistency during machining of multiple electrospark electrodes 110, the present application provides a method for machining a spray plate, including: obtaining image information of multiple micro-holes on the surface of the spray plate; extracting features from the image information to obtain feature data of the micro-holes; inputting the feature data of the micro-holes into a trained machining prediction model to obtain a micro-hole prediction value output by the machining prediction model; calculating a machining difference between an actual feature value and a predicted feature value; judging the state of the micro-hole machining device based on the machining difference, and adjusting based on the state judgment result, specifically:

[0036] S201, in the present application, an image of the micropores on the surface of the spray plate is obtained by a high-precision image acquisition device. The image acquisition device uses a CCD camera and other equipment, and can be equipped with a professional light source to complete the shooting of the surface of the spray plate. The captured image is then transmitted to a judgment unit, which processes the micropore image data to obtain multiple feature data, and on this basis obtains the actual feature value of the micropore; the actual feature value includes but is not limited to the following data: the number of the micropore on the surface, the number corresponds to the position of the micropore in the x direction, the x act ; The position of the microhole in the y direction, y act ; Micropore diameter, d act ; Micropore roundness, CR act ; and the position of the microhole axis tp act .

[0037] S202, input the feature data into the trained processing prediction model, and the prediction model predicts the real-time processing data of the current microhole based on the input image feature data, mainly the position information and number information of the microhole, and records it as the microhole prediction value; the processing prediction model may specifically include but is not limited to the BP (Back Propagation) neural network model. The BP neural network model is a multi-layer feedforward neural network model trained according to the error back propagation algorithm, and is one of the most widely used neural network models.

[0038] Since the aperture size of the micropore is related to the various characteristics of the electrode 110, the main control logic in the micropore processing equipment is currently: according to the difference between the set value of the electrode 110 loss in the process and the electrode 110 loss value in the actual processing, the electrode 110 diameter in the micropore processing equipment is controlled within the specified range. The electrode 110 diameter control method usually adopts the proportional integral differential (PID) control algorithm. The PID control algorithm is a classic industrial process control method, which has the advantages of high anti-interference, strong stability, and good control effect. Under the control of the PID control algorithm, the micropore processing process is a nonlinear coupling process with hysteresis and nonlinearity. The processing prediction model needs to have a good fitting ability for the nonlinear system. The neural network is essentially a nonlinear system that can approximate any complex nonlinear function. Therefore, the BP neural network model is selected, and its fitting result can also achieve better accuracy with the training of the model.

[0039] S203, calculating the actual eigenvalue and the predicted eigenvalue according to the obtained actual eigenvalue and the preset eigenvalue, and the calculation process may be calculating the difference between the two or calculating the ratio between the two.

[0040] S204, based on the calculated values, the state of the micro-hole processing equipment is judged, and adjustments are made based on the state judgment results; the actual processing conditions of the micro-holes on the surface of the spray plate are analyzed according to the analysis results of the calculated values, and the actual conditions of the electrode 110 can be obtained by reverse calculation based on the micro-hole processing conditions; by judging the state of a single electrode 110 in the electric spark equipment and the processing difference when the electrode 110 is taken as a whole, whether the electrode 110 needs to be replaced or the electrode 110 needs to be adjusted as a whole. In some embodiments, adjusting the electrode 110 in the micro-hole processing equipment includes directly replacing a single or multiple electrodes 110, adjusting the processing position of a single or multiple electrodes 110, and adjusting the processing parameters of the processing equipment.

[0041] In other embodiments, processing conditions in the micro-hole processing equipment that may affect the shape of the micro-hole are adjusted, including but not limited to external conditions such as voltage, electrode 110 rotation speed, temperature, etc. By adjusting the external conditions, the shape of the micro-hole meets the processing requirements.

[0042] For further information, please refer to Figure 2, the state of the micro-hole processing equipment is judged, including the following steps: constructing multiple intervals according to the processing difference; calculating the weighted proportion of multiple processing differences in multiple intervals; judging the state of the micro-hole processing equipment according to the weighted proportion; adjusting the micro-hole processing equipment accordingly according to the state judgment result; if the micro-hole processing equipment meets the preset requirements, continue to process the next spray plate; if the micro-hole processing equipment does not meet the preset requirements, select a corresponding disposal method according to the state of the electrode 110, and adjust the electrode 110 in the micro-hole processing equipment individually or as a whole, so that the micro-hole processing equipment meets the preset processing requirements, specifically:

[0043] S301, setting the calculated value as a processing difference, where the processing difference is the difference between the actual characteristic value and the predicted characteristic value, and constructing multiple intervals according to the processing difference;

[0044] In an embodiment of the present application, the intervals are multiple intervals constructed based on the mean and standard deviation of the test set differences. The intervals are divided by the mean and standard deviation of the differences, and multiple processing differences are distributed in different intervals according to their sizes.

[0045] S302, calculating the weighted proportion of multiple processing differences within multiple intervals; the proportion is calculated by the ratio of the number of processing differences within the interval to the total number of processing differences, and different types of processing differences can be calculated separately.

[0046] S303, judging the state of the micro-hole processing equipment according to the weighted ratio, and adjusting the micro-hole processing equipment accordingly according to the state judgment result; specifically:

[0047] If the micro-hole processing equipment meets the preset requirements, the processing of the next spray plate will continue;

[0048] If the micro-hole processing equipment does not meet the preset requirements, it is determined that the micro-hole processing equipment has processing abnormalities, and the micro-hole processing equipment is replaced as a whole, or the electrodes used for processing are replaced separately.

[0049] Further, based on step S302, in the embodiment of the present application, calculating the weighted proportion of the processing difference in each interval includes: respectively counting the weighted proportions of multiple processing difference values ​​in each interval; the weighted proportion H in the i-th interval i It is calculated by the following method: Calculate the cumulative number of multiple processing differences in the i-th interval i , divided by the total number of multiple processing differences sum, and then multiplied by the weighted value α corresponding to the i-th interval i , that is, Hi=(sum i / sum) *α i Among them, the weight value α iIt can be set as needed, and the weighted value can be selected and set according to the process parameters for different stability requirements. The weighted value depends on the material of the electrode 110, the location of the electrode 110, the equipment processing time, the material of the processing fluid, and other factors that may affect the processing. According to the actual processing situation, a set of weighted systems can be established after many experiments, and the weighted system can be directly imported when using it.

[0050] Further, based on step S301, establishing multiple intervals includes: counting the weighted proportions of multiple processing differences in each interval includes: establishing multiple intervals, the multiple intervals include a first interval, a second interval, a third interval and a fourth interval, and obtaining the weighted proportions H of the corresponding intervals. i ; Among them, the first interval is the interval from the residual mean to the residual mean plus 5 times the standard deviation; the second interval is the interval from the residual mean minus 5 times the standard deviation to the residual mean; the third interval is the interval greater than the residual mean plus 5 times the standard deviation; the fourth interval is the interval less than the residual mean minus 5 times the standard deviation, specifically:

[0051] In the embodiment of the present application, multiple intervals are established, including the first interval, the second interval, the third interval and the fourth interval. The first interval is the interval from the residual mean to the residual mean plus 5 times the standard deviation, the second interval is the interval from the residual mean minus 5 times the standard deviation to the residual mean, the third interval is the interval greater than the residual mean plus 5 times the standard deviation, and the fourth interval is the interval less than the residual mean minus 5 times the standard deviation. The multiple processing differences obtained by the above operation can be statistically analyzed to obtain the actual processing difference distribution, and the processing state of the micro-hole processing equipment can be judged according to the processing difference distribution. Among them, the type of difference distribution specifically includes but is not limited to the normal distribution, such as Figure 3 The figure shows a schematic diagram of the difference distribution, where 5σ means the difference mean plus 5 times the standard deviation, that is, the difference mean +5σ, and -5σ means the difference mean minus 5 times the standard deviation, that is, the difference mean -5σ, where σ is the standard deviation of multiple differences. It should be noted here that the critical values ​​0, 5σ and -5σ can belong to any of the intervals on both sides.

[0052] For further information, please refer to Figure 4 , according to the weighted ratio of each interval, the micro-hole processing equipment is identified and executed in step S400, including: obtaining a preset first threshold; calculating the sum of the absolute value of the third weighted ratio corresponding to the third interval and the absolute value of the fourth weighted ratio corresponding to the fourth interval; if the sum is not greater than the preset first threshold, it is determined that the processing state of the micro-hole processing equipment is normal, and a first execution signal is output, and the first execution signal is to continue normal processing; if the sum is greater than the preset first threshold, it is determined that the processing state of the micro-hole processing equipment is abnormal, and a first abnormal signal is output, specifically:

[0053] S401, obtaining a preset first threshold value P 1 , calculate the third weighted ratio H corresponding to the third interval 3 The fourth weighted ratio H corresponding to the fourth interval 4 The sum of |H 3 |+|H 4 |With P 1 relationship; if |H 3 |+|H 4 |>P 1 , it is determined that the micro-hole processing equipment electrode 110 does not meet the preset requirements. 3 |+|H 4 |≤P 1 , it is determined that the micro-hole processing equipment meets the preset requirements. Among them, according to different stability requirements, the first threshold value P can be set according to the process parameters. 1 adjustments.

[0054] In one embodiment, σ represents the mean deviation of the aperture, then H 1 and H 3 Represents the part with larger aperture, H 2 and H 4 Represents the part with smaller aperture. If |H 3 |+|H 4 |>P 1 , it is determined that the micro-hole processing equipment electrode 110 does not meet the preset requirements, H 3 and H 4 Represents the number of surface micropores that exceed the deviation value. The first threshold P 1 Represents the upper limit of tolerance for the micropore diameter deviation. 3 and H 4 The sum of the absolute values ​​exceeds the first threshold value P 1 When H 3 and H 4 The sum of does not exceed the first threshold P 1 When , it means that there is no abnormality in the processing equipment. At this time, the first execution signal can be output, and the first execution signal represents that the processing equipment can continue to perform normal processing; it can be imagined that σ can also represent other predicted values.

[0055] For further information, please refer to Figure 5When the first abnormal signal is received, step S500 is executed, including the following steps: calculating the difference between the absolute value of the third weighted ratio and the fourth weighted ratio; if the difference is greater than zero, outputting a second abnormal signal, the second abnormal signal is abnormal processing setting conditions; if the difference is not greater than zero, outputting a third abnormal signal, the third abnormal signal is excessive electrode wear in the processing equipment, specifically:

[0056] S501, when the judgment unit receives the first abnormal signal, the absolute value difference between the third weighted ratio and the fourth weighted ratio is calculated, and the micro-hole processing equipment is judged and adjusted according to the difference.

[0057] S502, in the embodiment of the present application, if the difference |H 3 |-|H 4 |≤0 ， This means that the micropore diameter deviation value is often too small. The size of the micropore diameter on the surface of the spray plate is closely related to the diameter of the electrode 110 in the micropore processing equipment. When the micropore diameter deviates, that is, the diameter of the electrode 110 does not meet the requirements. This may be caused by a variety of reasons. The most likely possibility is that the electrode 110 is consumed during the processing, resulting in a decrease in its diameter, which leads to the deviation of the micropores on the surface of the hole. When the above situation occurs, the micropore processing equipment can no longer be controlled to directly process, and it needs to be adjusted to output the third abnormal information. The third abnormal information indicates that the electrode 110 in the processing equipment is excessively worn and needs to be replaced.

[0058] S503, in the embodiment of the present application, if the difference |H 3 |-|H 4 |>0, it means that the micropore diameter has a large deviation value, that is, the micropore diameter is larger than the preset required value. The large micropore diameter is caused by abnormal processing setting conditions during the processing of the electrode 300. The second abnormality information is output for this abnormality.

[0059] Further, based on step S503, when the second abnormal signal is received, the following steps are further included: based on the second abnormal signal, outputting a second execution signal, specifically:

[0060] S601, based on the second abnormal signal, it is determined that the deviation of the aperture is caused by the problem of setting the processing parameters of the electrospark machining equipment. At this time, a second execution signal is output on this basis. The second execution signal specifically adjusts the processing parameters of the machining equipment so that the processing parameters meet the machining requirements.

[0061] For further information, please refer to Figure 6 , based on step S502, when the third abnormal signal is received, the following steps are also included:

[0062] Obtain a preset second threshold; calculate the size of the fourth weighted ratio and the second threshold; if the fourth weighted ratio is greater than the second threshold, output a third execution signal; if the fourth weighted ratio is not greater than the second threshold, output a fourth execution signal, and execute step S700, specifically:

[0063] S701, when it is determined that the aperture deviation is caused by the loss of the electrode 110, the aperture deviation of the micropores on the surface of the spray plate caused by the loss of the electrode 110 can be solved by replacing the electrode 110. 3 The value of the second threshold P 2 For comparison, if H 3 ≤P 2 , output a third execution signal, the third execution signal is specifically for the H 3 The deviation values ​​within the interval are counted, and the corresponding micropores and the electrodes 110 corresponding to the micropores are found, and the electrodes 110 are directly replaced; at this time, the number of electrodes 110 that need to be replaced is small, and directly replacing the electrodes 110 saves more time.

[0064] S702, if H 3 >P 2， At this time H 3 The value is large, which means that most of the electrodes 110 in the micro-hole processing equipment are in a too thin state, and the fourth execution signal is output. The fourth execution signal is specifically to replace all the electrodes in the processing equipment. Since there are a large number of abnormal electrodes 110 in this case, replacing the electrodes 110 at this time will waste a lot of time. Therefore, in order to save time, the equipment is directly replaced as a whole, and then the replaced equipment is reused.

[0065] Furthermore, the spray plate processing process also includes: pre-processing the abnormal data in the acquired feature data, including: if there is abnormal data with a sudden jump in the current feature data acquisition process, the data with a sudden jump is eliminated and the data at that location is supplemented; if there is abnormal data with a continuous jump in the current feature data acquisition process, the data obtained by the current operation is abandoned, specifically:

[0066] During the data acquisition process, data acquisition abnormalities may occur due to certain reasons, which is reflected in the data set as sudden jumps in data. These data may be too large relative to the predicted values, so as to affect the overall calculation. By setting a jump detection threshold, when the jump value exceeds the threshold, it is determined that a data abnormality has occurred. If it is an occasional abnormality, the abnormality is ignored and the missing data is re-extracted to supplement. If the jump abnormality occurs continuously, that is, three consecutive data have jump abnormalities, the current data acquisition process is abandoned and the data is acquired again after the problem is eliminated.

[0067] Furthermore, the method for processing micropores on the surface of the spray plate further includes: sequentially numbering the plurality of micropores on the surface of the spray plate; sequentially obtaining the measured value of each micropore according to the micropore number, and obtaining the processing difference between the measured value and the predicted value. △ x and △ y; among them, △x =x nom -x act ; △ y=y nom -y act ;x nom ,y nom is the predicted position of the micropore; X act ,y act is the actual position of the micropore; get the preset threshold x max , and y max ; if | △ x|≥x max , it is determined that the electrode 110 at this position is excessively offset in the x direction, and the position of the electrode 110 needs to be adjusted in the x direction. The adjustment direction depends on △ The positive or negative value of x; if | △ y|≥y max , it is determined that the electrode 110 at this position is excessively offset in the y direction, and the position of the electrode 110 needs to be adjusted in the x direction. The adjustment direction depends on △ The positive and negative values ​​of y; where x max and max They are the preset position deviation thresholds of the microhole in the x and y directions, specifically:

[0068] In one embodiment, the micropores on the surface of the spray disk are first numbered. A system similar to a coordinate system is first established on the surface of the spray disk. The micropores are numbered according to their positions in the x and y directions, in the order of {1-1, 2-1, n-1...n-2...nn}. Then, specific information of the micropores on the surface of the spray disk is obtained in sequence according to the numbers, and the measurement value of each micropore is obtained by analysis. The judgment unit is provided with a preset value corresponding to the micropores on the surface of the spray disk, and the preset value is compared and calculated with the micropore measurement value.

[0069] Compared with the aforementioned aperture deviation value, the position value can also be judged and calculated in the same way as before. If | △ x|≥x max , it is determined that the electrode 110 at this position is excessively offset in the x direction, and the position of the electrode 110 needs to be adjusted in the x direction. The adjustment direction depends on △ The positive or negative value of x; if | △ y|≥y max , it is determined that the electrode 110 at this position is excessively offset in the y direction, and the position of the electrode 110 needs to be adjusted in the x direction. The adjustment direction depends on △ The positive or negative value of y.

[0070] The processing method of the spray plate of the present application also includes the following steps: processing to obtain a spray plate blank, reserving at least one positioning portion on the blank; performing rough processing on the surface of the spray plate; performing pre-processing on the position of the micro-hole to be processed on the surface of the spray plate; removing the positioning portion reserved for processing the spray plate; and cleaning the spray plate after processing. Specifically:

[0071] The spray plate blank is roughly processed by a machine tool or a machining center to obtain a rough outline of the spray plate. The preliminary outline of the spray plate has at least one more positioning part than the spray plate after processing. In some embodiments, the preferred processing method of the spray plate is: when processing the blank, a circle is reserved at the edge of the blank, and a plurality of positioning holes for positioning are punched on the reserved edge of the blank, and the positioning holes are the positioning parts;

[0072] After the rough processing of the spray disc surface is completed, the position calibration device is controlled to perform pre-processing on the spray disc surface. The function of the pre-processing is to process the position of the micro-holes on the spray disc surface, and to process the preliminary shape on the spray disc surface through equipment such as a laser marking machine to facilitate subsequent processing;

[0073] After completing the processing of the micropores on the surface of the spray plate, remove the positioning portion of the edge reserved for the blank;

[0074] Clean the surface of the spray disc and complete the processing of the spray disc.

[0075] Furthermore, in the step of performing electrospark micro-hole machining on the surface of the spray plate, the rotation speed of the electrode 110 is controlled to be 1-20 r / min, the feed speed is 5-20 mm / min, and the pressure of the working fluid is 1-10 MPa.

[0076] Furthermore, the micropores on the surface of the spray plate have multiple types. According to the different micropore shapes, the micropores on the surface of the spray plate can be divided into multiple order holes. For example, a single micropore with a constant diameter is a first-order micropore, a single micropore with two diameters is a second-order hole, and a single micropore with three diameters is a third-order hole. As the number of orders increases, the processing time and difficulty of the spray plate also increase significantly. In order to solve the problem of the difficulty of processing multi-order holes, the spray plate processing method provided by the present application also includes the following steps, specifically:

[0077] Control the micro-hole processing equipment to complete the electrospark processing of the first-order hole; control the micro-hole processing equipment to complete the processing of the micro-holes on the surface of the spray plate according to the previous steps, and process the through hole with a diameter that meets the first-order hole through the micro-hole processing equipment.

[0078] On the basis of the first-order hole, the processing mode of the micro-hole processing equipment is adjusted to complete the second-order hole processing, and the diameter of the second-order hole is greater than the diameter of the first-order hole; in some embodiments, the spray plate that has completed the first-order hole processing is adhered to obtain the information of the micropores on the surface of the spray plate, and then the processing method as in the above steps is executed to obtain the processing state of the electrode 110 in the micro-hole processing equipment, and the micro-hole processing equipment is adjusted according to the processing state and the preset processing value, so that the electrode 110 in the micro-hole processing equipment can process micropores of different diameters, thereby obtaining a spray plate with a second-order hole. It can be imagined that not only the processing of the second-order hole, but also the processing of similar third-order holes and even more multi-order holes can adopt the above method, which can greatly improve the processing efficiency of the spray plate; and the secondary processing of the micro-hole processing equipment is based on the processing result of the first-order hole of the spray plate, and on the basis of the first-order spray plate processing, it can also greatly improve the processing effect of the spray plate; at the same time, compared with the mechanical processing method in the prior art, the present application can avoid damage to the micropore itself and reduce the processing difficulty.

[0079] Further, the spray plate is cleaned by the following steps: the spray plate after processing is sequentially cleaned by ultrasonic cleaning with clean water, degreasing cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitrogen drying, hot water cleaning, and nitrogen drying; the above steps are repeated until the cleaning of the spray plate is completed. Specifically:

[0080] In some embodiments, after the spray plate is processed to meet the requirements of the external dimensions and micropore roughness, chemical cleaning is performed to remove the stains and working fluids remaining on the surface during the processing. Different cleaning schemes can be selected according to different materials. The cleaning process used in this embodiment is as follows: ultrasonic cleaning with clean water, degreasing cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitric acid cleaning, cold water cleaning, nitrogen drying, hot water cleaning, nitrogen drying, and the above two steps are repeated 3 times to complete the cleaning of the spray head.

[0081] In one embodiment, the electrode 110 is selected to have a diameter of 0.3-3 mm, and the material is tungsten wire (copper electrodes are prohibited). The rotation speed of the electrode 110 is 1-20 r / min, and the feed speed is 5-20 mm / min. The electrode 110 maintains a rotary motion so that the punching remains uniform. The electrode 110 is guided by the guide channel on the mounting seat 100 to ensure that the feed direction is when the electrode 110 is subjected to electrospark machining. After the high-pressure working fluid flows out of the liquid outlet channel, it rushes out from the gap between the workpiece and the electrode 110, taking away the metal debris, carbon black and other electro-erosion products generated during the electrospark process. The flow of the high-pressure working fluid has a cooling effect on the electrode 110 and the workpiece, and can also suspend the electrode 110 in the micropore hollow to avoid contact with the workpiece and cause a short circuit. The working fluid is generally kerosene, saponified liquid and deionized water. The pressure of the working fluid is 1-10MPa. During operation, the electrode 110 and the workpiece are connected to the positive and negative poles of the pulse power supply respectively, and the processing speed and inner hole roughness of the EDM drilling are controlled by controlling the electrical parameters of the pulse power supply. The micro-hole processing speed under this process can reach 5-20mm / min, the processing accuracy can reach within 0.05mm, and the roughness can reach below Ra0.5. After the EDM drilling is completed, only the upper and lower surfaces need to be finely polished or sandblasted according to the processing requirements to meet the processing requirements of the parts, and no additional deburring work is required.

[0082] The spray plate processing method of the embodiment of the present application includes two parts: offline training and online prediction. Among them, the offline training part includes: obtaining the historical feature data of the micropores on the surface of the spray plate, performing preprocessing operations on the abnormal data in the historical feature data, performing model training on the processing prediction model to be trained according to the historical feature data after the preprocessing operation, and storing the trained processing prediction model and test set. The online prediction part includes: obtaining the online feature data of the micropore processing equipment on the surface of the spray plate (corresponding to the feature data of the micropores after one processing is completed in the above embodiment), performing model prediction based on the online feature data and the trained processing prediction model stored offline, obtaining the predicted value of the micropore feature data, calculating the processing difference between the actual feature value of the micropore and the predicted feature value of the micropore, and according to the actual processing difference and the test set difference stored offline, performing processing identification and control on the micropore processing equipment by the micropore feature data.

[0083] In summary, the spray plate processing method of the embodiment of the present application can automatically obtain the micropore prediction value as the reference value based on the real-time feature data and the trained micropore feature prediction model, without the need for in-depth understanding of the internal reaction mechanism of the micropore processing process, reducing the reliance on professional experience. In addition, the micropore processing prediction value as the reference value is obtained based on the real-time feature data, so it can respond to the changes in the feature data of different process results in a timely manner, and can be used universally when executing different processes. Multiple intervals are constructed based on the test set difference, and the offset of the processing difference can be identified based on the weighted ratio of the processing difference in different intervals, thereby realizing the identification of processing anomalies. The thresholds and weighted values ​​used in the abnormality judgment and adjustment process can be adjusted according to different process requirements, and can adapt to processes of different durations and different sensitivity requirements, meeting the different requirements for processing accuracy of different equipment models, plant configurations, process recipes, etc. By judging the difference between the third weighted ratio and the fourth weighted ratio, the fluctuation of the processing state can be analyzed, and different operation judgments can be output according to the impact of the fluctuation on the process, so as to prompt the user whether to deal with the abnormal situation and what kind of treatment to take, avoid process failure or secondary rework, and improve the production efficiency and yield rate of micro-hole processing equipment.

[0084] The embodiment of the present application also proposes a micro-hole processing equipment, including: a micro-hole processing device 100, a detection device, and a controller, wherein the micro-hole processing device 100 is used to simultaneously process multiple micro-holes on the surface of a spray disk; the detection device is used to detect status information of the micro-holes on the surface of the spray disk; status information of the surface micro-holes; the controller is communicatively connected with the detection device and the micro-hole processing equipment, and is used to obtain characteristic data of the micro-holes on the surface of the spray disk from the detection device to execute the steps of the aforementioned spray disk processing method.

[0085] Specifically, in the micro-hole processing equipment of the embodiment of the present application, the micro-hole processing device includes a plurality of electrodes for electrospark processing, and the number of electrospark electrodes is multiple, and the number is half or more of the number of micro-holes on the surface of the spray disk, and preferably the same as the number of micro-holes on the surface of the spray disk. The micro-hole processing device 100 in the present application can process multiple micro-holes on the surface of the spray disk at one time; the detection device is used to detect the state information of the micro-holes on the surface of the spray disk, and the detection device is preferably a high-precision image acquisition device, which can obtain the information of the micro-holes on the surface of the spray disk by shooting. The controller is connected to the detection device and the micro-hole processing equipment in communication, and is used to obtain the characteristic data of the micro-holes on the surface of the spray disk from the detection device to execute the steps of the aforementioned spray disk processing method.

[0086] An embodiment of the present application also proposes a readable storage medium, on which one or more computer programs are stored. The one or more computer programs include instructions. When the program or instructions are executed by a processor in a micro-hole processing device including multiple application programs, the processor in the micro-hole processing device can execute the various processes of the above-mentioned spray plate processing method embodiment.

[0087] The readable storage medium of the embodiment of the present application, when identifying processing anomalies of processing equipment, first obtains the processing value of the processing equipment, and extracts features of the processing value to obtain real-time feature data, inputs the real-time feature data into the trained processing prediction model, obtains the predicted characteristic value output by the processing prediction model, and identifies processing anomalies of the processing equipment according to the processing difference between the actual characteristic value and the predicted characteristic value. The embodiment of the present application can automatically obtain the predicted characteristic value as the reference value based on the processing value and the trained processing prediction model, without having an in-depth understanding of the internal reaction mechanism of the processing process, reducing the dependence on professional experience. In addition, the predicted characteristic value as the reference value is obtained based on the processing value, so it can respond to the changes in the processing data due to different process results in a timely manner, and can be used universally when executing different processes.

[0088] The systems, devices, modules or units described in the above embodiments may be implemented by computer chips or entities, or by products with certain functions. A typical implementation device is a computer. Specifically, the computer may be, for example, a personal computer, a laptop computer, a cellular phone, a camera phone, a smart phone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.

[0089] For the convenience of description, the above device is described in various units according to their functions. Of course, when implementing the present application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0090] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems, or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program codes.

[0091] The present application is described with reference to the flowcharts and / or block diagrams of the methods, devices (systems), and computer program products according to the embodiments of the present application. It should be understood that each process and / or box in the flowchart and / or block diagram, as well as the combination of the processes and / or boxes in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0092] These computer program instructions may also be stored in a computer-readable memory capable of directing a computer or other programmable data processing device to operate in a specific manner, so that the instructions stored in the computer-readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0093] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0094] In a typical configuration, a computing device includes one or more processors (CPU), input / output interfaces, network interfaces, and memory.

[0095] Memory may include non-permanent storage in a computer-readable medium, random access memory (RAM) and / or non-volatile memory in the form of read-only memory (ROM) or flash RAM. Memory is an example of a computer-readable medium.

[0096] Computer readable media include permanent and non-permanent, removable and non-removable media that can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, program modules or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices or any other non-transmission media that can be used to store information that can be accessed by a computing device. As defined in this article, computer readable media does not include temporary computer readable media (transitory media), such as modulated data signals and carrier waves.

[0097] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0098] The present application may be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application may also be practiced in distributed computing environments where tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules may be located in local and remote computer storage media, including storage devices.

[0099] Technical effects:

[0100] 1. The present application provides a spray plate processing method for use in a micro-hole processing device including a plurality of electrodes. By using the processing method in the present application, a plurality of micro-holes can be successfully processed on the surface of the spray plate at one time. Processing a plurality of micro-holes at one time can greatly shorten the processing time of the spray plate, shortening the original processing time of a single spray plate of more than 50 hours to within a few hours, thereby greatly increasing the production efficiency of the spray plate.

[0101] 2. The present application provides a spray plate processing method, by which the processing conditions of microholes are judged and the state of the microhole processing equipment is appropriately adjusted so that the electrode processing state in the microhole processing equipment meets the requirements, so that the microholes processed by the processing method in the present application meet the consistency requirements, thereby improving the production efficiency and production quality of the spray plate.

[0102] 3. The present application provides a method for processing a spray plate, which adopts electric spark equipment for processing, thereby avoiding the risk of tool breakage that may occur during mechanical processing. At the same time, electrode processing also avoids the hole mouth burrs that may occur with mechanical processing (especially the internal burrs of multi-step holes, which are extremely difficult to remove), thereby improving the production efficiency and production quality of the spray plate.

[0103] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0104] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A method for processing a spray plate, characterized in that: include: Acquire image information of multiple micropores on the surface of the spray plate; Extracting features from the image information to obtain feature data of the micropores; Inputting the characteristic data of the micropores into the trained processing prediction model to obtain the micropore prediction value output by the processing prediction model; Calculate the actual eigenvalues ​​and the predicted eigenvalues; The state of the micro-hole processing equipment is judged based on the calculated value, including: setting the calculated value as a processing difference, that is, the difference between the actual characteristic value and the predicted characteristic value; constructing multiple intervals according to the processing difference, and establishing multiple intervals includes the following steps: establishing multiple intervals, including a first interval, a second interval, a third interval and a fourth interval, and obtaining a weighted ratio H of the corresponding intervals i ; wherein the first interval is the interval from the residual mean to the residual mean plus 5 times the standard deviation; the second interval is the interval from the residual mean minus 5 times the standard deviation to the residual mean; the third interval is the interval greater than the residual mean plus 5 times the standard deviation; the fourth interval is the interval less than the residual mean minus 5 times the standard deviation; calculating the weighted proportions of the plurality of processing differences in the plurality of intervals, calculating the weighted proportions of the processing differences in each interval includes: obtaining the weighted proportion H in the i-th interval i , weighted ratio H i It is calculated by the following method, H i =(sum i / sum)*α i ; Among them, sum i is the cumulative number of multiple processing differences in the i-th interval; sum is the total number of multiple processing differences; α i is the weighted value α corresponding to the i-th interval i ; Judging the state of the micro-hole processing equipment according to the weighted ratio, and adjusting the micro-hole processing equipment accordingly according to the state judgment result; If the micro-hole processing equipment meets the preset requirements, the processing of the next spray plate will continue; If the micro-hole processing equipment does not meet the preset requirements, the micro-hole processing equipment is judged to be abnormal, and the micro-hole processing equipment is replaced as a whole, or the electrode used for processing is replaced separately, and adjustments are made based on the status judgment result; Identifying the micro-hole processing equipment according to the weighted ratio of each interval includes: Obtaining a preset first threshold; Calculate the sum of the absolute value of the third weighted ratio corresponding to the third interval and the absolute value of the fourth weighted ratio corresponding to the fourth interval; If the sum is not greater than a preset first threshold, it is determined that the processing state of the micro-hole processing equipment is normal, and a first execution signal is output, wherein the first execution signal is to continue normal processing; If the sum is greater than a preset first threshold, it is determined that the processing state of the micro-hole processing equipment is abnormal, and a first abnormal signal is output, where the first abnormal signal is used to determine that there is a processing abnormality; When the first abnormal signal is received, the method further includes the following steps: Calculating a difference between the absolute values ​​of the third weighted ratio and the fourth weighted ratio; If the difference is greater than zero, a second abnormal signal is output, and the second abnormal signal indicates that the processing setting condition is abnormal; If the difference is not greater than zero, a third abnormal signal is output, the third abnormal signal indicating that there is excessive electrode wear in the processing equipment.

2. The method for processing a spray plate according to claim 1, characterized in that: When the second abnormal signal is received, the following steps are also included: Based on the second abnormal signal, a second execution signal is output, and the second execution signal is used to adjust the processing parameters of the processing equipment.

3. The method for processing a spray plate according to claim 1, characterized in that: When the third abnormal signal is received, the following steps are also included: Obtaining a preset second threshold; Calculating the magnitude of the fourth weighted ratio and the second threshold; If the fourth weighted ratio is greater than the second threshold, a third execution signal is output, wherein the third execution signal is to find the corresponding micropore and the electrode corresponding to the micropore, and replace the corresponding electrode; If the fourth weighted ratio is not greater than the second threshold, a fourth execution signal is output, and the fourth execution signal is to replace all electrodes in the processing equipment.

4. The method for processing a spray plate according to claim 1, characterized in that: Also includes: Preprocessing operations are performed on abnormal data in the acquired feature data, including: If there is abnormal data with sudden jumps during the current feature data acquisition process, the data with sudden jumps will be removed and the data at that location will be supplemented; If abnormal data with continuous jumps appears during the current feature data acquisition process, the data obtained in the current operation will be abandoned.

5. A micro-hole processing device, characterized in that: include: A micro-hole processing device, comprising a plurality of electrodes, and used for processing a plurality of micro-holes on the surface of the spray plate at the same time; A detection device, the detection device is used to detect status information of micropores on the surface of the spray plate; A controller is communicatively connected with the detection device and the micro-hole processing equipment, and is used to obtain characteristic data of micro-holes on the surface of the spray disk from the detection device to execute the steps of the spray disk processing method according to any one of claims 1 to 4.

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