Laser heating circuit and heating method

Abstract

The present disclosure provides a laser heating circuit and a heating method, wherein the laser heating circuit comprises: a driving unit and a heating unit, wherein the heating unit comprises a substrate, and a plurality of heating devices and a plurality of temperature detection devices arranged on the substrate, the driving unit is adapted to generate a heating control signal in response to an input control signal; and is adapted to determine the detected temperature of the surface of the material to be heated according to the first temperature detection signal, the position information of each heating device and each temperature detection device on the substrate, and compare the detected temperature with the target temperature to adjust the heating control signal; any heating device is used to respond to the heating control signal and output a heating beam corresponding to the heating control signal to the material to be heated; any temperature detection device is used to detect the temperature of the surface of the material to be heated, and output the corresponding first temperature detection signal to the driving unit. The above technical solution can improve the processing quality of the material to be heated.

Description

Technical Field

[0001] The present disclosure relates to the technical field of laser heating, and in particular to a laser heating circuit and a heating method. Background Art

[0002] Laser heating is the process of heating the material to be heated by laser energy. The working process is as follows: the laser beam is emitted from the laser, transmitted and focused, and irradiated to the surface of the material. Part of it is reflected, and part of it enters the interior of the material and is absorbed by the material, so that the temperature of the surface of the material rises rapidly.

[0003] Laser heating, a process that uses a laser beam to heat materials to extremely high temperatures, can provide high power density and precise temperature control. As a non-contact heating technology, laser heating has a wide range of applications in various industrial, scientific and medical applications.

[0004] However, in actual heating, existing laser heating solutions still have problems. Summary of the invention

[0005] In view of this, the present disclosure provides a laser heating circuit and a heating method, which can improve the processing quality of the material to be heated.

[0006] The present disclosure provides a laser heating circuit, comprising: a driving unit and a heating unit, wherein the heating unit comprises a substrate, and a plurality of heating devices and a plurality of temperature detection devices arranged on the substrate, wherein:

[0007] The driving unit is adapted to generate a heating control signal in response to an input control signal; and is adapted to determine the detected temperature of the surface of the material to be heated according to the first temperature detection signal, the position information of each heating device and each temperature detection device on the substrate, and compare the detected temperature with the target temperature to adjust the heating control signal;

[0008] Any heating device is used to respond to the heating control signal and output a heating light beam corresponding to the heating control signal to the material to be heated;

[0009] Any temperature detection device is used to detect the temperature of the surface of the material to be heated and output a corresponding first temperature detection signal to the driving unit.

[0010] In the above embodiment, by integrating a plurality of heating devices and a plurality of temperature detection devices on a substrate, the temperature of the surface of the material to be heated can be detected in real time while the material to be heated is being heated, thereby achieving consistency in the heating process and temperature detection and reducing time delay, thereby obtaining a first temperature detection signal representing the temperature of the surface of the material to be heated; since each heating device and each temperature detection device has different position information on the substrate, the detected temperature of the surface of the material to be heated can be determined more accurately, and then the intensity of the heating light beam can be accurately adjusted to improve the processing quality of the material to be heated.

[0011] Optionally, the plurality of temperature detection devices are disposed at different positions of the substrate, at least three of the plurality of temperature detection devices form a temperature detection area, and the plurality of temperature detection areas surround all the heating devices.

[0012] In the above embodiment, by arranging multiple temperature detection devices at different positions of the substrate, and making the temperature detection area formed by at least three temperature detection devices surround all the heating devices, it is possible to monitor the temperature of the entire heating surface of the material to be heated and the temperature of the heating point, so that the heating process can be better controlled and the processing quality of the material to be heated can be further improved; and by forming the temperature detection area, fewer temperature detection devices (for example, the number of temperature detection devices is less than the number of heating devices) can be used to realize the detection process of the temperature of the entire surface of the material to be heated.

[0013] Optionally, a plurality of different temperature detection regions share at least one temperature detection device, and the shared temperature detection device is located in a central region of the plurality of heating devices.

[0014] In the above embodiment, by using a temperature detection device shared by a plurality of different temperature detection areas, the number of temperature detection devices used can be reduced, and it is beneficial to determine the temperature value of the corresponding temperature detection area based on the temperature detection device.

[0015] Optionally, the plurality of heating devices are arranged in an array on the substrate, with the position of the temperature detection device located at the center of the substrate as the starting point, along the package radius direction of the heating device, so that the heating devices located at different positions of the substrate constitute a plurality of heating areas, and one heating area corresponds to a heated area of ​​the material to be heated;

[0016] The driving unit is used to determine the temperature of each heating area based on the first temperature detected by the temperature detection device located at the center of the substrate contained in the first temperature detection signal, the second temperature detected by one of the other temperature detection devices, and the number of heating areas between the temperature detection device and the corresponding temperature detection device, and use the temperature of all the heating areas as the temperature of the surface of the material to be heated.

[0017] In the above embodiment, by taking the position of the temperature detection device in the central area as the starting point, along the package radius direction of the heating device, a plurality of different heating areas composed of the heating device can be determined, and one heating area corresponds to a heated area of ​​the material to be heated. Then, the driving unit can determine the temperature of any heating area based on the first temperature detected by the temperature detection device contained in the first temperature detection signal, the second temperature detected by one of the temperature detectors among the other temperature detection devices, and the heating area between the temperature detection device and the corresponding temperature detector. This can improve the accuracy of the detected temperature and determine the temperature of the entire surface of the material to be heated.

[0018] Optionally, the driving unit is used to determine the temperature difference between adjacent heating areas based on the difference between the first temperature and the second temperature, and the number of heating areas passed by the temperature detection device and the corresponding temperature detector, and determine the temperature of each heating area based on the first temperature and the position of the heating area and the temperature difference.

[0019] In the above embodiment, the parameters of the heating devices located at different positions on the substrate are consistent. When the heating control signal is obtained, the parameters of the heating light beams emitted by each heating device are basically consistent. In this way, the temperature difference between adjacent heating areas can be determined through the difference between the first temperature and the second temperature, and the number of heating areas traversed by the temperature detection device and the corresponding temperature detector. Then, the temperature of each heating area can be determined based on the first temperature as a reference according to the position and temperature difference of the heating area, which can improve the accuracy of the temperature of the surface of the material to be heated.

[0020] Optionally, the heating areas are located in different temperature detection areas;

[0021] The driving unit is used to determine the temperature value of each heating area within different temperature detection areas according to the first temperature and the second temperature, and the heating area between the temperature detection device and the corresponding temperature detection device, and take the average value of the temperature values ​​within the different temperature detection areas as the temperature of each heating area.

[0022] In the above embodiment, by using the average value of each temperature value in the heating area as the surface temperature of the material to be heated, the influence of heating devices at different positions on the temperature detector is taken into account, which can more truly reflect the current surface temperature of the material to be heated.

[0023] Optionally, the laser heating circuit further comprises: a first temperature detection device, which is integrated with the driving unit and is suitable for detecting the temperature of the driving unit and generating a second temperature detection signal, wherein the first temperature detection device is different from the temperature detection device;

[0024] a control unit, coupled to the first temperature detection device, adapted to determine a current temperature value of the drive unit according to the second temperature detection signal, and compare the current temperature value of the drive unit with a first preset temperature value to generate a first temperature control adjustment signal;

[0025] The temperature regulating unit is coupled to the control unit and is suitable for switching on or off the flow path of the cooling medium to the driving unit according to the first temperature control regulating signal, and regulating the flow rate of the cooling medium according to the temperature of the cooling medium and the current temperature value of the driving unit.

[0026] In the above embodiment, by providing a first temperature detection device and a temperature adjustment unit, the temperature of the driving unit can be adjusted in real time so that the driving unit operates at a safe temperature, thereby making the heating control signal generated by the driving unit more stable, thereby improving the processing quality.

[0027] Optionally, the laser heating circuit further comprises: a second temperature detection device, adapted to detect the temperature of the heating unit and generate a third temperature detection signal, wherein the second temperature detection device is different from the temperature detection device;

[0028] The control unit is coupled to the second temperature detection device and is further adapted to determine the current temperature value of the heating unit according to the third temperature detection signal, and compare the current temperature value of the heating unit with a second preset temperature value to generate a second temperature control adjustment signal;

[0029] The temperature regulating unit is also suitable for opening or closing the flow path of the cooling medium to the heating unit according to the second temperature control regulating signal, and adjusting the flow rate of the cooling medium according to the temperature of the cooling medium and the current temperature value of the heating unit.

[0030] In the above embodiment, by providing a second temperature detection device, the temperature of the heating unit can be adjusted in real time so that the heating unit operates at a safe temperature, thereby making the heating beam generated by the heating unit more stable, thereby improving the processing quality.

[0031] Optionally, the control unit is further suitable for outputting a first alarm message when determining that the current temperature value of the driving unit is greater than the first preset temperature value; or outputting a second alarm message when determining that the current temperature value of the heating unit is greater than the second preset temperature value.

[0032] In the above embodiment, by outputting the first alarm information or the second alarm information, the operator can be reminded to promptly discover and handle the fault, thereby improving the operation safety.

[0033] Accordingly, an embodiment of the present disclosure further provides a laser heating method, which is applied to the laser heating circuit described in any of the above examples, and the laser heating method includes:

[0034] generating a heating control signal in response to an input control signal;

[0035] In response to the heating control signal, output a heating light beam corresponding to the heating control signal to the material to be heated, and synchronously detect the temperature of the surface of the material to be heated, and generate a first temperature detection signal;

[0036] According to the first temperature detection signal, the position information of each heating device and each temperature detection device on the substrate, the detection temperature of the surface of the material to be heated is determined, and the detection temperature is compared with the target temperature to adjust the heating control signal.

[0037] In the above embodiment, the temperature of the surface of the material to be heated can be detected in real time while the material to be heated is being heated, so as to achieve consistency in heating and temperature detection and reduce time delay, thereby being able to more accurately determine the detected temperature of the surface of the material to be heated based on the first temperature detection signal characterizing the temperature of the surface of the material to be heated and the position information of each heating device and each temperature detection device on the substrate, and then accurately adjust the intensity of the heating light beam, thereby improving the processing quality of the material to be heated. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0039] Figure 1 It is a structural schematic diagram of a laser heating circuit in the present disclosure;

[0040] Figure 2 It is a structural schematic diagram of a heating unit in the present disclosure;

[0041] Figure 3 is a schematic diagram of a temperature detection area in the present disclosure;

[0042] Figure 4 A schematic diagram of a regional temperature calibration principle in the present disclosure;

[0043] Figure 5 is a schematic structural diagram of another laser heating circuit in the present disclosure;

[0044] Figure 6 The figure is a flow chart of a laser heating method in the present disclosure. DETAILED DESCRIPTION

[0045] As described in the background technology, in actual heating, the existing laser heating solutions still have problems. This is because: the heating process and the temperature detection process are separated. In this case, the detected temperature cannot well reflect the real-time temperature of the material to be heated. This may cause the temperature of the material to be heated to exceed the set temperature, thereby reducing the processing quality.

[0046] In order to solve the above technical problems, the present disclosure provides a laser heating circuit, which integrates multiple heating devices and multiple temperature detection devices on a substrate. While heating the material to be heated, the surface temperature of the material to be heated can be detected in real time, thereby achieving consistency between the heating process and the temperature detection and reducing the time delay, so as to obtain a first temperature detection signal representing the surface temperature of the material to be heated. Since each heating device and each temperature detection device has different position information on the substrate, the detection temperature of the surface of the material to be heated can be determined more accurately, and then the intensity of the heating beam can be accurately adjusted to improve the processing quality of the material to be heated.

[0047] In order to enable those skilled in the art to better understand and implement the present disclosure, the specific schemes, principles, advantages, effects, etc. of the present disclosure are described in detail through specific embodiments with reference to the accompanying drawings.

[0048] In this disclosure, see Figure 1 and Figure 2 ,in, Figure 1 is a schematic diagram of the structure of a laser heating circuit in an embodiment of the present disclosure, Figure 2 Schematic diagram of the structure of a heating unit in an embodiment of the present disclosure. Figure 1 and Figure 2 As shown, the laser heating circuit 100 may include: a driving unit 110 and a heating unit 120, wherein the heating unit 120 may include a substrate 121, and a plurality of heating devices H and a plurality of temperature detection devices (eg Figure 2 Schematic diagram of temperature sensing devices D1 to D5), where:

[0049] The driving unit 110 is adapted to generate a heating control signal in response to an input control signal; and is adapted to determine the detected temperature of the surface of the material to be heated (not shown) according to the first temperature detection signal, the position information of each heating device and each temperature detection device on the substrate, and compare the detected temperature with the target temperature to adjust the heating control signal;

[0050] Any heating device H is used to respond to the heating control signal and output a heating light beam corresponding to the heating control signal to the material to be heated;

[0051] Any temperature detection device (for example, the temperature detection devices D1 to D5 ) is used to detect the temperature of the surface of the material to be heated, and output a corresponding first temperature detection signal to the driving unit 110 .

[0052] Combination Figure 1 and Figure 2 , briefly describing the working principle of the laser heating circuit 100 in the embodiment of the present disclosure:

[0053] When it is necessary to heat the material to be heated, in response to the input control signal (the control signal can be manually input or obtained from other devices), the driving unit 110 can generate a heating control signal corresponding to the control signal, and output it to multiple heating devices H (that is, one heating control signal includes multiple sub-heating control signals corresponding one to one to the heating devices), or output it to some heating devices H, and then in response to the heating control signal, the heating device H outputs a heating light beam to the material to be heated according to the set light power, thereby changing the surface temperature of the material to be heated.

[0054] At the same time, the temperature detection devices D1 to D5 can detect the temperature of the surface of the material to be heated, and output a first temperature detection signal (the number of first temperature detection signals is multiple, or one temperature detection device corresponds to one temperature detection signal) to the driving unit 110, so that the temperature detection devices D1 to D5 can be driven to perform a temperature detection process while heating the material to be heated. Since multiple heating devices H and multiple temperature detection devices (such as temperature detection devices D1 to D5) are integrated on the substrate 121, the time delay between the two can be reduced, so that the consistency of heating and temperature detection can be achieved, so that based on the first temperature detection signal representing the temperature of the surface of the material to be heated, since each heating device and each temperature detection device has different position information on the substrate, the detected temperature of the surface of the material to be heated can be determined more accurately, and then the intensity of the heating beam can be accurately adjusted so that the temperature of the material to be heated is the target temperature, thereby improving the processing quality of the material to be heated.

[0055] It should be noted that, first, the heating beam in the embodiment of the present disclosure may refer to any light source having energy, for example, the heating beam may be a laser; second, Figure 2 The distribution positions, quantities, sizes, etc. of the illustrated multiple heating devices H and multiple temperature detection devices (for example, temperature detection devices D1 to D5) on the substrate 121 are only illustrative, and are used to indicate that the multiple heating devices H and the multiple temperature detection devices can be integrated, and should not be construed as a limitation on the present invention. In some embodiments, the number of heating devices H is greater than the number of temperature detection devices D.

[0056] In some embodiments of the present disclosure, the plurality of temperature detection devices are disposed at different positions of the substrate, at least three of the plurality of temperature detection devices form a temperature detection area, and the plurality of temperature detection areas surround all the heating devices.

[0057] In this way, when any heating device emits a heating beam, since all the heating devices are surrounded by multiple temperature detection areas, the temperature detection devices in the temperature detection areas can detect the temperature of the corresponding heating areas. Since multiple temperature detection devices are arranged at different positions of the substrate, each temperature detection device can detect the temperature at different positions of the material to be heated, and each temperature detection device can detect the temperature of one point of the material to be heated, so as to realize the monitoring of the temperature of the entire heating surface of the material to be heated and the heating point, so as to better control the heating process and further improve the processing quality of the material to be heated.

[0058] Furthermore, by forming a temperature detection area, fewer temperature detection devices can be used (for example, the number of temperature detection devices is less than the number of heating devices, combined with Figure 2 5 temperature detection devices and 18 heating devices are shown in the figure), which realizes the detection process of the temperature of the entire surface of the heated material, so there is no need to make the temperature detection devices and the heating devices correspond one to one.

[0059] As an optional example, combining Figure 2 , see Figure 3 A schematic diagram of a temperature detection area according to an embodiment of the present disclosure is shown in FIG. Figure 2 and Figure 3 As shown, the temperature detection devices D1 to D5 are disposed at different positions of the substrate 121 , wherein the temperature detection devices D2 to D5 are disposed at four corners of the substrate 121 , and the temperature detection device D1 is located at the center of the substrate 121 .

[0060] Furthermore, at least three of the multiple temperature detection devices form a temperature detection area, for example, the temperature detection devices D1 to D3 form a temperature detection area, the temperature detection devices D1, D2 and D5 form a temperature detection area, the temperature detection devices D1, D3 and D4 form a temperature detection area, the temperature detection devices D1, D5 and D4 form a temperature detection area, and multiple (for example, 4) temperature detection areas surround all the heating devices H (that is, all the temperature detection areas can cover all the heating devices H), so that the temperature detection process of the entire heating surface of the heated material can be realized.

[0061] In some embodiments of the present disclosure, there is a temperature detection device (for example Figure 3 The schematic D1) is located in the central area of ​​the plurality of heating devices H, which facilitates the temperature determination operation based on the temperature detection device D1.

[0062] More specifically, a plurality of different temperature detection regions share at least one temperature detection device, and the shared temperature detection device is located in a central region of the plurality of heating devices.

[0063] That is, the temperature detection device D1 is the intersection of multiple temperature detection areas, which can reduce the number of temperature detection devices used and is conducive to determining the temperature value of the corresponding temperature detection area based on the temperature detection device.

[0064] In some embodiments of the present disclosure, the temperature detection devices D1 to D5 may acquire the surface temperature of the material to be heated in a non-contact manner.

[0065] In a specific embodiment, the temperature detecting devices D1 to D5 may be infrared temperature sensors, more specifically, single-point infrared temperature sensors.

[0066] In some embodiments of the present disclosure, the heating device H may be a laser.

[0067] In some embodiments of the present disclosure, the substrate 121 may be a printed circuit board, and the driving unit 110 and the heating unit 120 may transmit signals between each other through the printed circuit board.

[0068] In some embodiments of the present disclosure, Figure 2 and Figure 3 , see Figure 4 A schematic diagram of a regional temperature calibration principle in an embodiment of the present disclosure is shown in FIG. Figure 4 As shown, the plurality of heating devices H are arranged in an array on the substrate 121 (for example, in an array of 3 rows and 6 columns. It can be understood that Figures 2 to 4The arrangement of the heating devices H shown is only an example to indicate that multiple heating devices may be arranged on the substrate, and should not be construed as a limitation to the present invention).

[0069] Starting from the position of the temperature detection device D1 at the center of the substrate 121, along the package radius direction of the heating device H, the heating devices H at different positions of the substrate 121 form a plurality of heating areas (for example, Figure 4 There are four heating zones shown, and each heating zone includes multiple heating devices H, or each heating zone can be considered as an arc with the temperature detection device D1 as the center and the center length between the temperature detection device D1 and the heating device H as the radius, so that the outermost heating zone covers all the heating devices H located at the outermost periphery of the substrate 121), and one heating zone corresponds to a heated area of ​​the material to be heated.

[0070] In other words, by causing a plurality of heating zones to be formed, the temperatures of different heating zones of the material to be heated can be determined.

[0071] In this case, the driving unit 110 is used to determine the temperature of each heating area based on the first temperature detected by the temperature detection device D1 included in the first temperature detection signal, the second temperature detected by one of the other temperature detection devices (one of the temperature detection devices D2 to D5), and the number of heating areas between the temperature detection device D1 and the corresponding temperature detection device, and use the temperature of the heating area as the temperature of the surface of the material to be heated.

[0072] Specifically, for any temperature detection device, what it detects is the temperature of one point of the material to be heated, or the temperature of the point and its vicinity, and the temperature of an area cannot be obtained. By taking the temperature detection device D1 in the central area as a reference, multiple concentric heating areas with different areas can be determined. In this way, the driving unit 110 can obtain a first temperature based on the temperature detection device D1 in the central area, and a second temperature obtained by another temperature detection device on one of the diameters, and determine the temperature of any heating area by modeling. Since each heating area corresponds to the material to be heated, the temperature of the corresponding area of ​​the material to be heated can be determined, which can improve the accuracy of the detected temperature.

[0073] It should be noted that, first, Figure 4 The illustrated heating area is only an example, which is used to indicate that the temperature of the area on the surface of the material to be heated can be determined based on the temperature detection device in the central area and another temperature detection device on the same diameter; secondly, the number and arrangement of the heating devices are also examples, which are used to indicate that multiple heating devices can be set on the substrate.

[0074] More specifically, the driving unit 110 is used to determine the temperature difference between adjacent heating areas based on the difference between the first temperature and the second temperature, and the number of heating areas passed by the temperature detection device and the corresponding temperature detector, and to determine the temperature of each heating area based on the first temperature and the position of the heating area and the temperature difference.

[0075] As an optional example, the temperature detection devices D1 to D3 constitute a temperature detection area, and the detection temperatures of the temperature detection devices D1 to D3 can be determined. For example, the detection temperatures corresponding to the temperature detection devices D1 to D3 are TD1, TD2 and TD3 respectively.

[0076] For ease of understanding, the temperature detection devices D1 and D2 are used to determine the temperature of the heating area as an example for explanation.

[0077] Depend on Figure 4 It can be seen that there are 5 heating areas between the temperature detection devices D1 and D2, and the temperature difference between adjacent heating areas is DT=(TD2-TD1) / 5. Then, based on the first temperature TD1, the temperature of each heating area is determined according to the position of the heating area and the temperature difference.

[0078] For example, each heating area can be numbered according to the distance from the temperature detection device D1. The temperature T1 of the nearest heating area (i.e., the first heating area) is T1= TD1+DT*1, the temperature T2 of the second heating area is T2= TD1+DT*2, ..., and the temperature T5 of the fifth heating area is T5= TD1+DT*5.

[0079] In this way, when more heating zones are formed, Tn= TD1+DT*n, where n is the number of each heating zone.

[0080] It should be noted that the reason why the above-mentioned temperature determination method can be adopted is that the parameters of the heating devices located at different positions on the substrate are consistent. When the heating control signal is obtained, the parameters of the heating light beams emitted by each heating device are basically the same. Therefore, the temperature value of each heating area can be determined based on the number of heating areas passed by the temperature detection device and the corresponding temperature detector, and the temperature detected by the temperature detection device and the corresponding temperature detector.

[0081] See next Figure 4, the same heating area is located in different temperature detection areas, and the temperature value of the same heating area should be the same, or the temperature difference is within a certain range, so the driving unit 110 can be used to determine the temperature value of each heating area in different temperature detection areas according to the first temperature and the second temperature, and the heating area between the temperature detection device and the corresponding temperature detection device, and take the average value of the temperature values ​​in different temperature detection areas as the temperature of each heating area.

[0082] For example, Figure 4 As shown, assuming that for the first heating area, the temperature obtained by the temperature detection devices D1 and D2 is A, and the temperature obtained by the temperature detection devices D1 and D3 is B, it can be determined that the temperature of the heating area is (A+B) / 2.

[0083] In other words, by obtaining the temperature values ​​of the same heating area in different temperature detection areas, and taking the average value of the temperature values ​​of the same heating area in different temperature detection areas as the temperature of the surface of the material to be heated, the influence of the heating devices at different positions on the temperature detector is taken into account, and the current temperature of the surface of the material to be heated can be more truly reflected. In some embodiments of the present disclosure, the inventors further found that if the local temperature of the driving unit and the heating unit is too high, it will affect the stability of the heating beam, causing the power of the heating beam to change, which will affect the processing quality.

[0084] Based on this, see Figure 5 FIG. 1 is a schematic diagram of another structure of a laser heating circuit in an embodiment of the present disclosure, as shown in FIG. Figure 5 As shown, the laser heating circuit 100 may further include:

[0085] a first temperature detection device 130, which is integrated with the driving unit 110 and is suitable for detecting the temperature of the driving unit 110 and generating a second temperature detection signal, wherein the first temperature detection device 130 and the temperature detection device are different;

[0086] a control unit 140, coupled to the first temperature detection device 130, adapted to determine a current temperature value of the drive unit 110 according to the second temperature detection signal, and compare the current temperature value of the drive unit 110 with a first preset temperature value to generate a first temperature control adjustment signal;

[0087] The temperature regulating unit 150 is coupled to the control unit 140, and is suitable for switching on or off the flow path of the cooling medium to the driving unit 110 according to the first temperature control regulating signal, and adjusting the flow rate of the cooling medium according to the temperature of the cooling medium and the current temperature value of the driving unit 110.

[0088] Specifically, during the process of heating the material to be processed, the first temperature detection device 130 can detect the temperature of the drive unit 110 in real time, for example, the temperature of the circuit board and lines inside the drive unit 110, and then output a second temperature detection signal corresponding to the temperature of the drive unit 110 to the control unit 140. The control unit 140 can generate a first temperature control adjustment signal to the temperature adjustment unit 150 based on the relationship between the current temperature value of the drive unit 110 contained in the second temperature detection signal and the first preset temperature value.

[0089] At this time, the temperature adjustment unit 150 can, according to the first temperature control adjustment signal, enable (for example, the current temperature value of the drive unit 110 exceeds the first preset temperature value) or disconnect (for example, the current temperature value of the drive unit 110 is lower than the first preset temperature value) the flow path of the cooling medium to the drive unit 110, and when the flow path is enabled, adjust the flow rate of the cooling medium according to the temperature of the cooling medium and the current temperature value of the drive unit 110 to quickly cool down the drive unit 110, so that the drive unit 110 can operate at a safe temperature, so that the heating control signal generated by the drive unit 110 is more stable, thereby improving the processing quality.

[0090] Furthermore, the laser heating circuit 100 may further include:

[0091] a second temperature detection device 160, adapted to detect the temperature of the heating unit 120 and generate a third temperature detection signal, wherein the second temperature detection device 160 is different from the temperature detection device (the difference here may include: different setting positions, the second temperature detection device 160 is set on the back of the heating unit 120, while the temperature detection device is set on the heating beam exit surface of the heating unit 120; the second temperature detection device 160 and the temperature detection device are of different types, for example, the second temperature detection device 160 is a direct contact temperature measurement, while the temperature detection device is a non-contact temperature measurement, and the temperature detection device is a temperature measurement method by vertical light emission);

[0092] The control unit 140 is coupled to the second temperature detection device 160, and is further adapted to determine the current temperature value of the heating unit 120 according to the third temperature detection signal, and compare the current temperature value of the heating unit 120 with the second preset temperature value to generate a second temperature control adjustment signal;

[0093] The temperature regulating unit 150 is also suitable for opening or closing the flow path of the cooling medium to the heating unit 120 according to the second temperature control regulating signal, and adjusting the flow rate of the cooling medium according to the temperature of the cooling medium and the current temperature value of the heating unit 120.

[0094] Specifically, during the process of heating the material to be processed, the second temperature detection device 160 can detect the temperature of the heating unit 120 in real time, for example, the temperature of the heating device H inside the heating unit 120, and then output a third temperature detection signal corresponding to the temperature of the heating unit 120 to the control unit 140. The control unit 140 can generate a second temperature control adjustment signal to the temperature adjustment unit 150 based on the relationship between the current temperature value of the heating unit 120 contained in the third temperature detection signal and the second preset temperature value.

[0095] At this time, the temperature adjustment unit 150 can, according to the second temperature control adjustment signal, enable (for example, the current temperature value of the heating unit 120 exceeds the second preset temperature value) or disconnect (for example, the current temperature value of the heating unit 120 is lower than the second preset temperature value) the flow path of the cooling medium to the driving unit 110, and when the flow path is enabled, the flow rate of the cooling medium is adjusted according to the temperature of the cooling medium and the current temperature value of the driving unit 110 to quickly cool down the heating unit 120, so that the heating unit 120 can operate at a safe temperature, so that the heating light beam generated by the heating unit 120 is more stable, thereby improving the processing quality.

[0096] In the embodiment of the present disclosure, the cooling medium may include at least one of water, ethylene glycol, fluorinated liquid and air.

[0097] In a specific embodiment, the temperature regulating unit may be a water chiller system, in which case the cooling medium is water.

[0098] In some embodiments of the present disclosure, in order to further improve the heating stability of the laser heating circuit, the processing quality of the material to be processed can be improved.

[0099] The control unit is further adapted to output a first alarm message when determining that the current temperature value of the driving unit is greater than the first preset temperature value; or output a second alarm message when determining that the current temperature value of the heating unit is greater than the second preset temperature value.

[0100] By outputting the first alarm information and / or the second alarm information, the operator can be reminded to promptly discover and handle the fault, thereby improving operational safety.

[0101] It can be understood that the above describes multiple embodiment schemes provided by the embodiments of the present disclosure, and the various optional methods introduced in each embodiment scheme can be combined and cross-referenced with each other without conflict, thereby extending a variety of possible embodiment schemes, which can all be considered as embodiment schemes disclosed and disclosed by the present disclosure.

[0102] The embodiments of the present disclosure also provide a laser heating method, which can be applied to the laser heating circuit described in any of the aforementioned examples.

[0103] In some embodiments of the present disclosure, see Figure 6 A flow chart of a laser heating method in an embodiment of the present disclosure is shown in FIG. Figure 6 As shown, the following steps may be included:

[0104] S11, generating a heating control signal in response to the input regulation signal.

[0105] S12, in response to the heating control signal, outputting a heating light beam corresponding to the heating control signal to the material to be heated, and synchronously detecting the temperature of the surface of the material to be heated, and generating a first temperature detection signal.

[0106] S13, determining the detected temperature of the surface of the material to be heated according to the first temperature detection signal, the position information of each heating device and each temperature detection device on the substrate, and comparing the detected temperature with the target temperature to adjust the heating control signal.

[0107] By adopting the laser heating method in the above example, the temperature of the surface of the material to be heated can be detected in real time while the material to be heated is being heated, so as to achieve consistency in heating and temperature detection and reduce time delay. Therefore, based on the first temperature detection signal characterizing the temperature of the surface of the material to be heated and the position information of each heating device and each temperature detection device on the substrate, the detected temperature of the surface of the material to be heated can be determined more accurately, and then the intensity of the heating beam can be accurately adjusted, thereby improving the processing quality of the material to be heated.

[0108] Although the embodiments of the present disclosure are disclosed as above, the present invention is not limited thereto. Any person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A laser heating circuit, characterized in that: include: A driving unit and a heating unit, wherein the heating unit comprises a substrate, and a plurality of heating devices and a plurality of temperature detection devices arranged on the substrate, wherein the plurality of heating devices are arranged in an array on the substrate, starting from the position of the temperature detection device located at the center of the substrate, along the package radius direction of the heating device, so that the heating devices located at different positions of the substrate constitute a plurality of heating areas, and one heating area corresponds to a heated area of ​​the material to be heated, and the heating areas are located in different temperature detection areas, wherein: The driving unit is adapted to generate a heating control signal in response to an input control signal; and is adapted to determine the detected temperature of the surface of the material to be heated according to the first temperature detection signal, the position information of each heating device and each temperature detection device on the substrate, and compare the detected temperature with the target temperature to adjust the heating control signal; the driving unit is used to determine the difference between the first temperature and the second temperature according to the first temperature detected by the temperature detection device located at the center of the substrate contained in the first temperature detection signal and the second temperature detected by one of the other temperature detection devices, and to determine the temperature difference between adjacent heating areas according to the number of heating areas passed between the temperature detection device located at the center of the substrate and the corresponding temperature detection device, and to determine the temperature value of each heating area in different temperature detection areas based on the first temperature as a reference and according to the position of the heating area and the temperature difference, and to take the average value of the temperature values ​​in different temperature detection areas as the temperature of each heating area; Any heating device is used to respond to the heating control signal and output a heating light beam corresponding to the heating control signal to the material to be heated; Any temperature detection device is used to detect the temperature of the surface of the material to be heated and output a corresponding first temperature detection signal to the driving unit.

2. The laser heating circuit according to claim 1, characterized in that: The plurality of temperature detection devices are arranged at different positions of the substrate, at least three of the plurality of temperature detection devices form a temperature detection area, and the plurality of temperature detection areas surround all the heating devices.

3. The laser heating circuit according to claim 2, characterized in that: A plurality of different temperature detection areas share at least one temperature detection device, and the shared temperature detection device is located in a central area of ​​the plurality of heating devices.

4. The laser heating circuit according to claim 1, characterized in that: Also includes: a first temperature detection device, integrated with the driving unit, adapted to detect the temperature of the driving unit and generate a second temperature detection signal, wherein the first temperature detection device is different from the temperature detection device; a control unit, coupled to the first temperature detection device, adapted to determine a current temperature value of the drive unit according to the second temperature detection signal, and compare the current temperature value of the drive unit with a first preset temperature value to generate a first temperature control adjustment signal; The temperature regulating unit is coupled to the control unit and is suitable for switching on or off the flow path of the cooling medium to the driving unit according to the first temperature control regulating signal, and regulating the flow rate of the cooling medium according to the temperature of the cooling medium and the current temperature value of the driving unit.

5. The laser heating circuit according to claim 4, characterized in that: Also includes: a second temperature detection device, adapted to detect the temperature of the heating unit and generate a third temperature detection signal, wherein the second temperature detection device is different from the temperature detection device; The control unit is coupled to the second temperature detection device and is further adapted to determine the current temperature value of the heating unit according to the third temperature detection signal, and compare the current temperature value of the heating unit with a second preset temperature value to generate a second temperature control adjustment signal; The temperature regulating unit is also suitable for opening or closing the flow path of the cooling medium to the heating unit according to the second temperature control regulating signal, and adjusting the flow rate of the cooling medium according to the temperature of the cooling medium and the current temperature value of the heating unit.

6. The laser heating circuit according to claim 5, characterized in that: The control unit is further adapted to output a first alarm message when determining that the current temperature value of the driving unit is greater than the first preset temperature value; or output a second alarm message when determining that the current temperature value of the heating unit is greater than the second preset temperature value.

7. A laser heating method, characterized in that: Applied to the laser heating circuit according to any one of claims 1 to 6, the laser heating method comprises: generating a heating control signal in response to an input control signal; In response to the heating control signal, output a heating light beam corresponding to the heating control signal to the material to be heated, and synchronously detect the temperature of the surface of the material to be heated, and generate a first temperature detection signal; According to the first temperature detection signal, the position information of each heating device and each temperature detection device on the substrate, the detection temperature of the surface of the material to be heated is determined, and the detection temperature is compared with the target temperature to adjust the heating control signal.

Images