A high-quality molding device and method for soft-rigid combined circuit board with anti-layer deviation

Abstract

The present invention discloses a high-quality molding device and method for soft and hard combination circuit boards with anti-layer deviation. The present invention relates to the technical field of producing soft and hard combination circuit boards, which includes a workbench fixed on a pad, a gantry fixed on the workbench, a hot pressing mechanism is arranged on the gantry, and a limiting mechanism for preventing the FPC board from sliding on the curing sheet is arranged on the workbench; a lifting mechanism for lifting the soft and hard combination circuit board is arranged between the limiting mechanism and the pad, and the lifting mechanism includes a lifting cylinder fixed on the pad, a lifting block is fixed on the action end of the lifting cylinder piston rod, and a plurality of lifting rods are fixed on the top surface of the lifting block, which pass through the workbench, the pad and the surrounding frame in sequence upward, and the top surface of the lifting rod is flush with the top surface of the pad; a turnover mechanism for turnover of soft and hard combination circuit boards is also arranged on the gantry. The beneficial effects of the present invention are: greatly improving the production quality of soft and hard combination circuit boards and improving the production efficiency of soft and hard combination circuit boards.

Description

Technical Field

[0001] The invention relates to the technical field of producing a soft-hard combination circuit board, in particular to a high-quality forming device and method for a soft-hard combination circuit board capable of preventing layer deviation. Background Art

[0002] As consumer electronic products develop towards thinness, integration, and multifunctionality, the requirements for the manufacturing process of rigid-flex boards are getting higher and higher. Rigid-flex boards have the characteristics of good electrical performance and fast transmission performance, and are widely used in consumer electronic products, industrial, medical electronic products, and military equipment. Rigid-flex boards are highly favored by these industries.

[0003] The structure of the rigid-flex circuit board 1 produced in a workshop is as follows Figure 1~Figure 2 As shown, it includes a printed circuit board 2, a layer of curing sheet 3 is hot pressed in the middle of the printed circuit board 2, and a layer of FPC board 4 is hot pressed on the top surface of the curing sheet 3, wherein the FPC board 4 is made of a flexible soft material. The method of producing such a soft and hard combined circuit board in the workshop is:

[0004] S1. A worker takes out a printed circuit board 2 and places it flat on the hot pressing table of the hot pressing machine;

[0005] S2. The worker places a curing sheet 3 in the middle of the printed circuit board 2, and then places an FPC board 4 on the top surface of the curing sheet 3, ensuring that the four outer edges of the FPC board 4 are flush with the four outer edges of the curing sheet 3 respectively;

[0006] S3, control the hot pressing head of the hot pressing machine to move downward, and press the hot pressing head onto the top surface of the FPC board 4. At this time, the heat on the hot pressing head is transferred to the FPC board 4, and the FPC board 4 then transfers the heat to the curing sheet 3. When the curing sheet 3 is heated, the curing sheet 3 fixes the FPC board 4 and the printed circuit board 2 together, thereby hot pressing and forming the first rigid-flexible circuit board 1;

[0007] S4, the worker takes the rigid-flexible circuit board 1 off the hot press table, and after taking it away, it is transferred to the next production process;

[0008] S5. The worker repeats the operations of steps S1 to S4 to continuously produce a plurality of rigid-flexible circuit boards 1.

[0009] However, although the method used in the workshop can produce a batch of rigid-flexible circuit boards 1, the following technical defects still exist in the technology:

[0010] I. In step S3, since the curing sheet 3 is heated and the material becomes soft, the FPC board 4 slides horizontally on the curing sheet 3 after being pressed, which leads to layer deviation between the printed circuit board 2 and the FPC board 4 [while the process requires that after hot pressing, the position between the printed circuit board 2 and the FPC board 4 does not change at all], thereby reducing the production quality of the soft-hard combination circuit board.

[0011] II. In step S4, when each hard-flex circuit board 1 is formed by hot pressing, it is necessary to manually transfer the hard-flex circuit board 1 from the hot pressing table to the next production process; and the entire operation is completed manually, which not only increases the work intensity of the workers, but also reduces the production efficiency of the subsequent hard-flex circuit boards 1.

[0012] Therefore, there is an urgent need for a molding device and method that can greatly improve the production quality and production efficiency of hard-flex circuit boards. Summary of the invention

[0013] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a high-quality forming device and method for hard-soft combined circuit boards that can greatly improve the production quality and production efficiency of hard-soft combined circuit boards and prevent layer deviation.

[0014] The object of the present invention is achieved through the following technical solutions: a high-quality molding device for soft-hard combined circuit boards with anti-layer deviation, which comprises a workbench fixed on a pad, a gantry fixed on the workbench, a hot pressing mechanism is arranged on the gantry, and a limiting mechanism for preventing the FPC board from sliding on the curing sheet is arranged on the workbench;

[0015] The limiting mechanism is located directly below the hot pressing mechanism, and the limiting mechanism includes a pad fixedly mounted on the top surface of the workbench, a surrounding frame fixedly mounted on the top surface of the pad, and feed cylinders respectively located on the left and right sides of the pad. The surrounding frame is located directly below the hot pressing head of the hot pressing mechanism, and the inner cavity of the surrounding frame matches the outer edge contour of the printed circuit board, and the thickness of the surrounding frame is less than the thickness of the printed circuit board; the action ends of the piston rods of the two feed cylinders are fixedly connected with vertical plates, and the inner end surfaces of the two vertical plates are fixedly provided with U-shaped plates, and the U-shaped grooves of the two U-shaped plates are arranged opposite to each other on the left and right, and the bottom surface of the U-shaped plate is flush with the top surface of the surrounding frame;

[0016] A lifting mechanism for lifting the soft-hard combination circuit board is arranged between the limit mechanism and the pad, the lifting mechanism comprises a lifting cylinder fixedly arranged on the pad, a lifting block is fixedly arranged on the action end of the piston rod of the lifting cylinder, a plurality of lifting rods which sequentially penetrate the workbench, the pad and the surrounding frame upward are fixedly arranged on the top surface of the lifting block, and the top surface of the lifting rod is flush with the top surface of the pad;

[0017] The gantry is also provided with a turnover mechanism for rotating the soft-hard combined circuit board.

[0018] The hot pressing mechanism includes a through slot opened in the gantry, a bracket fixed on the gantry and located directly above the through slot, a hydraulic press is fixed on the top surface of the bracket, a piston rod of the hydraulic press passes through the bracket, and a hot pressing head is fixed on the extended end, an electric heating plate is fixed on the top surface of the hot pressing head, and the electric heating plate is connected to a power supply.

[0019] The surrounding frame is detachably fixed on the cushion block via screws.

[0020] The two U-shaped plates are arranged symmetrically with respect to the cushion block.

[0021] Two frames are fixedly arranged on the workbench, and cylinder bodies of two feed oil cylinders are respectively fixedly arranged on the two frames.

[0022] The turnover mechanism includes a roller conveyor fixed on the workbench and located on the right side of the pad, and a stepper motor fixed on the top surface of the gantry. The output shaft of the stepper motor passes downward through the top wall of the gantry, and a connecting plate is fixed on the extended end. The connecting plate extends to the right just above the roller conveyor, and a suction head is fixed on the extended end. The top port of the suction head is connected to the working port of the vacuum pump.

[0023] The vacuum pump is fixed on the top surface of the connecting plate.

[0024] A high-quality molding method for a rigid-flexible circuit board with anti-layer deviation, comprising the following steps:

[0025] S1. A worker takes out a printed circuit board and puts it into the inner cavity of the surrounding frame of the limiting mechanism. Since the inner cavity of the surrounding frame matches the outer edge contour of the printed circuit board, the printed circuit board is positioned. At this time, the top surface of the printed circuit board is located outside the surrounding frame.

[0026] S2. The worker controls the piston rods of the two feed cylinders of the limit mechanism to extend, and the piston rods drive the vertical plate to extend, and the vertical plate drives the U-shaped plate to move toward the printed board. When the piston rods of the two feed cylinders are fully extended, the two U-shaped plates are butted together. At this time, the area enclosed by the U-shaped grooves of the two U-shaped plates just matches the outer contour of the cured sheet;

[0027] S3. The worker places the curing sheet flat in the area surrounded by the U-shaped grooves of the two U-shaped plates, and ensures that the curing sheet is supported on the top surface of the printed circuit board; then the worker places the FPC board flat in the area surrounded by the U-shaped grooves of the two U-shaped plates, and ensures that the FPC board is placed flat on the top surface of the curing sheet. At this time, the FPC board is just below the hot pressing head of the hot pressing mechanism;

[0028] S4, the piston rod of the hydraulic press controlling the hot pressing mechanism extends downward, the piston rod drives the hot pressing head to move downward, the hot pressing head enters the enclosure frame, and just presses on the top surface of the FPC board; the power connected to the electric heating plate is turned on, the electric heating plate generates heat, the heat is transferred to the hot pressing head, the hot pressing head transfers the heat to the FPC board, and the FPC board transfers the heat to the curing sheet. When the curing sheet is heated, the curing sheet fixes the FPC board and the printed circuit board together, so as to form the required soft and hard combined circuit board by hot pressing;

[0029] S5, transfer the soft and hard combined circuit board to the next production process, and the specific operation steps are as follows:

[0030] S51, control the piston rod of the hydraulic press to retract upward, the piston rod drives the hot pressing head to move upward, and the hot pressing head is separated from the soft and hard combination circuit board; then control the piston rods of the two feed cylinders to retract, the piston rods drive the vertical plate to move away from the soft and hard combination circuit board, the vertical plate drives the U-shaped plate to move synchronously, and the U-shaped plate is separated from the soft and hard combination circuit board;

[0031] S52, the stepper motor of the control turnover mechanism is started, the stepper motor drives the connection plate to rotate, the connection plate drives the suction head and the vacuum pump to rotate synchronously, and when the suction head moves to the top of the soft-hard combination circuit board, the controller controls the stepper motor to turn off;

[0032] S53, the piston rod of the lifting cylinder of the lifting mechanism extends upward, the piston rod drives the lifting block to move upward, the lifting block drives multiple lifting rods to move upward, the lifting rods lift the hard-soft circuit board upward until the top surface of the hard-soft circuit board contacts the bottom surface of the suction head, at this time, the controller controls the lifting cylinder to close, and at the same time, the controller controls the vacuum pump to start, the vacuum pump evacuates the suction head, and the hard-soft circuit board is adsorbed and fixed under negative pressure;

[0033] S54, the vacuum pump of the control turnover mechanism is started, and the vacuum pump evacuates the suction head. Under negative pressure, the rigid-flexible circuit board is adsorbed and fixed on the suction head; the piston rod of the control lifting cylinder is retracted downward, and the piston rod drives the lifting block to move downward, and the lifting block drives the ejecting rod to move downward, and the ejecting rod is separated from the rigid-flexible circuit board;

[0034] S55, control the stepper motor to start, the stepper motor drives the connection plate to rotate in the opposite direction, the connection plate drives the suction head and the vacuum pump to rotate synchronously, the suction head drives the soft and hard combination circuit board to rotate synchronously, when the soft and hard combination circuit board moves to the top of the roller conveyor, the controller controls the stepper motor to turn off; finally, control the vacuum pump to turn off, at this time, the soft and hard combination circuit board falls onto the roller conveyor, and the roller conveyor transports the soft and hard combination circuit board to the next process;

[0035] S6. The worker repeats the operations of steps S1 to S5 to continuously produce a plurality of rigid-flexible circuit boards, and directly delivers the produced rigid-flexible circuit boards to the next process.

[0036] The present invention has the following advantages: the production quality of the soft-hard combination circuit board is greatly improved, and the production efficiency of the soft-hard combination circuit board is greatly improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a structural schematic diagram of a hard-and-soft circuit board;

[0038] Figure 2 for Figure 1 A top view of

[0039] Figure 3 It is a structural schematic diagram of the present invention;

[0040] Figure 4 for Figure 3 The main cross-sectional diagram of

[0041] Figure 5 for Figure 4 AA section view;

[0042] Figure 6 It is a structural schematic diagram of a U-shaped plate;

[0043] Figure 7 for Figure 6 A top view of

[0044] Figure 8 It is a structural schematic diagram of the jacking mechanism;

[0045] Fig. 9 It is a structural schematic diagram of a hot pressing mechanism;

[0046] Fig.10 It is a structural diagram of the turnover mechanism;

[0047] Fig.11 A schematic diagram for realizing the positioning of the printed circuit board;

[0048] Fig.12 for Fig.11 BB cross-sectional view;

[0049] Fig.13 It is a schematic diagram of two U-shaped plates butted together;

[0050] Fig.14 for Fig.13 CC section view;

[0051] Fig.15 A schematic diagram of placing the FPC board flat in the area surrounded by the U-shaped grooves of the two U-shaped boards;

[0052] Fig.16 for Fig.15 DD cross-sectional view;

[0053] Fig.17 for Fig.15 A partial enlarged view of part E;

[0054] Fig.18 A schematic diagram of a thermal press head pressing on the top surface of an FPC board;

[0055] Fig.19 for Fig.18 A partial enlarged view of the F part;

[0056] Fig. 20 It is a schematic diagram of the separation of the U-shaped board and the rigid-flex circuit board;

[0057] Fig.21 This is a schematic diagram of the suction head moving to the top of the rigid-flexible circuit board;

[0058] Fig. 22 A schematic diagram showing the top surface of the rigid-flex circuit board in contact with the bottom surface of the suction head;

[0059] Fig.23 It is a schematic diagram of the separation of the ejector rod and the rigid-flex circuit board;

[0060] Fig.24 This is a schematic diagram of the hard-bonded circuit board moving to the top of the roller conveyor;

[0061] Fig.25 This is a schematic diagram of a roller conveyor conveying a rigid-flexible circuit board to the next process;

[0062] In the figure:

[0063] 1-flexible and rigid circuit board, 2-printed board, 3-cured sheet, 4-FPC board;

[0064] 5- pad, 6- workbench, 7- gantry, 8- hot pressing mechanism, 9- limit mechanism, 10- pad, 11- surrounding frame, 12- feed cylinder, 13- vertical plate, 14- U-shaped plate;

[0065] 15-lifting mechanism, 16-lifting cylinder, 17-lifting block, 18-lifting rod, 19-bracket, 20-hydraulic press, 21-hot pressing head, 22-electric heating plate;

[0066] 23- roller conveyor, 24- stepping motor, 25- connecting plate, 26- suction head, 27- vacuum pump. DETAILED DESCRIPTION

[0067] The present invention is further described below in conjunction with the accompanying drawings, and the protection scope of the present invention is not limited to the following:

[0068] like Figure 3~Figure 10 As shown, a high-quality molding device for soft-rigid combined circuit boards with anti-layer deviation includes a workbench 6 fixedly mounted on a pad 5, a gantry 7 fixedly mounted on the workbench 6, a hot pressing mechanism 8 is arranged on the gantry 7, and a limiting mechanism 9 is arranged on the workbench 6 for preventing the FPC board 4 from slipping on the curing sheet 3.

[0069] The limiting mechanism 9 is located directly below the hot pressing mechanism 8. The limiting mechanism 9 includes a pad 10 fixed on the top surface of the workbench 6, a surrounding frame 11 fixed on the top surface of the pad 10, and feed cylinders 12 respectively located on the left and right sides of the pad 10. The surrounding frame 11 is detachably fixed to the pad 10 by screws. The surrounding frame 11 is located directly below the hot pressing head 21 of the hot pressing mechanism 8. The inner cavity of the surrounding frame 11 matches the outer edge contour of the printed circuit board 2. The thickness of the surrounding frame 11 is less than The thickness of the printed circuit board 2; the working ends of the piston rods of the two feed cylinders 12 are fixedly connected with vertical plates 13, and the inner end surfaces of the two vertical plates 13 are fixedly provided with U-shaped plates 14, the two U-shaped plates 14 are symmetrically arranged about the cushion block 10, the U-shaped grooves of the two U-shaped plates 14 are arranged opposite to each other on the left and right, and the bottom surface of the U-shaped plate 14 is flush with the top surface of the surrounding frame 11; two frames are fixedly provided on the workbench 6, and the cylinder bodies of the two feed cylinders 12 are respectively fixedly provided on the two frames.

[0070] A lifting mechanism 15 for lifting the rigid-flexible circuit board 1 is arranged between the limiting mechanism 9 and the pad 5. The lifting mechanism 15 includes a lifting cylinder 16 fixedly arranged on the pad 5. A lifting block 17 is fixedly arranged on the active end of the piston rod of the lifting cylinder 16. A plurality of lifting rods 18 are fixedly arranged on the top surface of the lifting block 17, which pass through the workbench 6, the pad 10 and the surrounding frame 11 in sequence upward. The top surface of the lifting rod 18 is flush with the top surface of the pad 10.

[0071] The gantry 7 is also provided with a turnover mechanism for turnover of the soft-hard combination circuit board 1, and the turnover mechanism includes a roller conveyor 23 fixed on the workbench 6 and located on the right side of the cushion block 10, and a stepper motor 24 fixed on the top surface of the gantry 7. The output shaft of the stepper motor 24 passes through the top wall of the gantry 7 downward, and a connecting plate 25 is fixed on the extended end. The connecting plate 25 extends rightward to the top above the roller conveyor 23, and a suction head 26 is fixed on the extended end, and the top port of the suction head 26 is connected to the working port of the vacuum pump 27. The vacuum pump 27 is fixed on the top surface of the connecting plate 25.

[0072] The hot pressing mechanism 8 includes a through slot opened in the gantry 7, a bracket 19 fixed on the gantry 7 and located directly above the through slot, a hydraulic press 20 is fixed on the top surface of the bracket 19, a piston rod of the hydraulic press 20 passes through the bracket, and a hot pressing head 21 is fixed on the extended end, an electric heating plate 22 is fixed on the top surface of the hot pressing head 21, and the electric heating plate 22 is connected to a power source.

[0073] A high-quality molding method for a rigid-flexible circuit board with anti-layer deviation, comprising the following steps:

[0074] S1. A worker takes out a printed circuit board 2 and puts the printed circuit board 2 into the inner cavity of the surrounding frame 11 of the limiting mechanism 9. Since the inner cavity of the surrounding frame 11 matches the outer edge contour of the printed circuit board 2, the printed circuit board 2 is positioned. Figure 11~Figure 12 As shown, at this time, the top surface of the printed circuit board 2 is located outside the surrounding frame 11;

[0075] S2. The worker controls the piston rods of the two feed cylinders 12 of the limit mechanism 9 to extend, and the piston rods drive the vertical plate 13 to extend, and the vertical plate 13 drives the U-shaped plate 14 to move toward the printed board 2. When the piston rods of the two feed cylinders 12 are fully extended, the two U-shaped plates 14 are butted together. Figure 13~Figure 14 As shown, at this time, the area enclosed by the U-shaped grooves of the two U-shaped plates 14 just matches the outer contour of the cured sheet 3;

[0076] S3, the worker places the curing sheet 3 flat in the area surrounded by the U-shaped grooves of the two U-shaped plates 14, and ensures that the curing sheet 3 is supported on the top surface of the printed circuit board 2; then the worker places the FPC board 4 flat in the area surrounded by the U-shaped grooves of the two U-shaped plates 14, as shown in FIG. Figure 15~Figure 17 As shown, and ensure that the FPC board 4 is placed flat on the top surface of the curing sheet 3, at this time, the FPC board 4 is just below the hot pressing head 21 of the hot pressing mechanism 8;

[0077] S4, the piston rod of the hydraulic press 20 controlling the hot pressing mechanism 8 extends downward, and the piston rod drives the hot pressing head 21 to move downward, and the hot pressing head 21 enters the enclosure 11 and just presses on the top surface of the FPC board 4, as shown in FIG. Figure 18-19 As shown; the power supply connected to the electric heating plate 22 is turned on, the electric heating plate 22 generates heat, the heat is transferred to the hot pressing head 21, the hot pressing head 21 transfers the heat to the FPC board 4, and the FPC board 4 transfers the heat to the curing sheet 3. When the curing sheet 3 is heated, the curing sheet 3 fixes the FPC board 4 and the printed circuit board 2 together, thereby hot pressing and forming the required soft and hard combined circuit board 1;

[0078] Among them, it can be seen from steps S2~S4 that since the curing sheet 3 and the FPC board 4 are both confined between the U-shaped grooves of the two U-shaped plates 14, and the printed circuit board 2 is always confined in the frame 11, therefore, when the hot pressing head 21 is pressed on the top surface of the FPC board 4, the FPC board 4 will not slip on the curing sheet 3, thereby effectively avoiding the layer deviation phenomenon between the printed circuit board 2 and the FPC board 4, thereby greatly improving the production quality of the soft-hard combination circuit board 1.

[0079] S5, transfer the soft and hard combined circuit board 1 to the next production process, and the specific operation steps are as follows:

[0080] S51, control the piston rod of the hydraulic press 20 to retract upward, the piston rod drives the hot pressing head 21 to move upward, and the hot pressing head 21 is separated from the soft and hard combination circuit board 1; then control the piston rods of the two feed cylinders 12 to retract, the piston rod drives the vertical plate 13 to move away from the soft and hard combination circuit board 1, the vertical plate 13 drives the U-shaped plate 14 to move synchronously, and the U-shaped plate 14 is separated from the soft and hard combination circuit board 1, as shown in FIG. Fig. 20 As shown;

[0081] S52, the stepper motor 24 of the control turnover mechanism is started, the stepper motor 24 drives the connecting plate 25 to rotate, the connecting plate 25 drives the suction head 26 and the vacuum pump 27 to rotate synchronously, when the suction head 26 moves to the top of the soft-hard combination circuit board 1, as shown in FIG. Fig.21 As shown, the controller controls the stepper motor 24 to turn off;

[0082] S53, lifting: The piston rod of the lifting cylinder 16 of the lifting mechanism 15 extends upward, the piston rod drives the lifting block 17 to move upward, the lifting block 17 drives the plurality of lifting rods 18 to move upward, the lifting rods 18 lift the rigid-flexible circuit board 1 upward until the top surface of the rigid-flexible circuit board 1 contacts the bottom surface of the suction head 26, as shown in FIG. Fig. 22 As shown, at this time, the controller controls the lifting cylinder 16 to close, and at the same time, the controller controls the vacuum pump 27 to start, and the vacuum pump 27 evacuates the suction head 26, and under negative pressure, the soft-hard combination circuit board 1 is adsorbed and fixed;

[0083] S54, the vacuum pump 27 of the control turnover mechanism is started, and the vacuum pump 27 evacuates the suction head 26. Under the negative pressure, the rigid-flexible circuit board 1 is adsorbed and fixed on the suction head 26; the piston rod of the lifting cylinder 16 is controlled to retract downward, and the piston rod drives the lifting block 17 to move downward, and the lifting block 17 drives the ejecting rod 18 to move downward, and the ejecting rod 18 is separated from the rigid-flexible circuit board 1. Fig.23 As shown;

[0084] S55, control the stepper motor 24 to start, the stepper motor 24 drives the connecting plate 25 to rotate in the opposite direction, the connecting plate 25 drives the suction head 26 and the vacuum pump 27 to rotate synchronously, the suction head 26 drives the soft and hard combined circuit board 1 to rotate synchronously, when the soft and hard combined circuit board 1 moves to the top of the roller conveyor 23, as shown in FIG. Fig.24 As shown, the controller controls the stepper motor 24 to turn off; finally, the vacuum pump 27 is controlled to turn off. At this time, the hard-soft circuit board 1 falls onto the roller conveyor 23, and the roller conveyor 23 conveys the hard-soft circuit board 1 to the next process. The conveying direction is as shown in FIG. Fig.25 As indicated by the arrow;

[0085] S6. The worker repeats the operations of steps S1 to S5 to continuously produce a plurality of rigid-flexible circuit boards 1, and directly delivers the produced rigid-flexible circuit boards 1 to the next process.

[0086] Among them, it can be seen from step S5 that the worker only needs to transfer the soft and hard combination circuit board 1 formed by pressing production to the roller conveyor 23 through the linkage cooperation of the jacking mechanism 15 and the turnover mechanism, and then transport it to the next process through the roller conveyor 23. It can be seen that in the entire production process, there is no need for workers to manually transfer the soft and hard combination circuit board 1 from the hot press table to the next production process, but the soft and hard combination circuit board 1 is automatically turned over, which not only reduces the work intensity of the workers, but also greatly improves the subsequent production efficiency of the soft and hard combination circuit board 1.

[0087] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A high-quality molding device for rigid-flexible circuit boards with anti-layer deviation, characterized in that: It comprises a workbench (6) fixedly mounted on a backing plate (5), and a gantry (7) fixedly mounted on the workbench (6); a hot pressing mechanism (8) is arranged on the gantry (7); and a limiting mechanism (9) for preventing an FPC board (4) from sliding on a curing sheet (3) is arranged on the workbench (6); The limiting mechanism (9) is located directly below the hot pressing mechanism (8). The limiting mechanism (9) comprises a cushion block (10) fixedly mounted on the top surface of the workbench (6), a surrounding frame (11) fixedly mounted on the top surface of the cushion block (10), and feed cylinders (12) respectively located on the left and right sides of the cushion block (10). The surrounding frame (11) is located directly below the hot pressing head (21) of the hot pressing mechanism (8). The inner cavity of the surrounding frame (11) matches the outer edge profile of the printed circuit board (2). The thickness of the surrounding frame (11) is less than the thickness of the printed circuit board (2). The action ends of the piston rods of the two feed cylinders (12) are both fixedly connected to vertical plates (13). The inner end surfaces of the two vertical plates (13) are both fixedly mounted with U-shaped plates (14). The U-shaped grooves of the two U-shaped plates (14) are arranged opposite to each other on the left and right sides, and the bottom surface of the U-shaped plate (14) is flush with the top surface of the surrounding frame (11). A lifting mechanism (15) for lifting the rigid-flexible circuit board (1) is arranged between the limiting mechanism (9) and the pad (5), the lifting mechanism (15) comprising a lifting cylinder (16) fixedly arranged on the pad (5), a lifting block (17) fixedly arranged on the action end of the piston rod of the lifting cylinder (16), a plurality of lifting rods (18) that sequentially penetrate the workbench (6), the pad (10) and the surrounding frame (11) upwardly are fixedly arranged on the top surface of the lifting block (17), and the top surface of the lifting rods (18) is flush with the top surface of the pad (10); The gantry (7) is also provided with a turnover mechanism for rotating the hard-and-flexible circuit board (1).

2. According to claim 1, a high-quality molding device for rigid-flexible circuit boards with layer deviation prevention, characterized in that: The hot pressing mechanism (8) comprises a through slot formed in the gantry (7), a bracket (19) fixedly mounted on the gantry (7) and located directly above the through slot, a hydraulic press (20) fixedly mounted on the top surface of the bracket (19), a piston rod of the hydraulic press (20) passing through the bracket, and a hot pressing head (21) fixedly mounted on the extended end, an electric heating plate (22) fixedly mounted on the top surface of the hot pressing head (21), and the electric heating plate (22) connected to a power source.

3. The high-quality molding device for rigid-flexible circuit boards with layer deviation prevention according to claim 2 is characterized in that: The surrounding frame (11) is detachably fixed to the cushion block (10) via screws.

4. The high-quality molding device for rigid-flexible circuit boards with layer deviation prevention according to claim 3 is characterized in that: The two U-shaped plates (14) are arranged symmetrically with respect to the cushion block (10).

5. The high-quality molding device for rigid-flexible circuit boards with layer deviation prevention according to claim 4 is characterized in that: Two frames are fixedly arranged on the workbench (6), and cylinder bodies of two feed oil cylinders (12) are respectively fixedly arranged on the two frames.

6. The high-quality molding device for rigid-flexible circuit boards with layer deviation prevention according to claim 5, characterized in that: The turnover mechanism comprises a roller conveyor (23) fixedly mounted on the workbench (6) and located on the right side of the cushion block (10), and a stepper motor (24) fixedly mounted on the top surface of the gantry (7), wherein the output shaft of the stepper motor (24) passes downward through the top wall of the gantry (7), and a connecting plate (25) is fixedly mounted on the extended end, the connecting plate (25) extends rightward to the position directly above the roller conveyor (23), and a suction head (26) is fixedly mounted on the extended end, wherein the top port of the suction head (26) is connected to the working port of the vacuum pump (27).

7. The high-quality molding device for rigid-flexible circuit boards with layer deviation prevention according to claim 6, characterized in that: The vacuum pump (27) is fixedly mounted on the top surface of the connecting plate (25).

8. A high-quality molding method for a rigid-flexible circuit board with an anti-layer deviation, using the high-quality molding device for a rigid-flexible circuit board with an anti-layer deviation as claimed in claim 7, characterized in that: It includes the following steps: S1. A worker takes out a printed circuit board (2) and places the printed circuit board (2) into the inner cavity of the surrounding frame (11) of the limiting mechanism (9). Since the inner cavity of the surrounding frame (11) matches the outer edge contour of the printed circuit board (2), the printed circuit board (2) is positioned. At this time, the top surface of the printed circuit board (2) is located outside the surrounding frame (11); S2, the worker controls the piston rods of the two feed cylinders (12) of the limit mechanism (9) to extend, the piston rods drive the vertical plate (13) to extend, and the vertical plate (13) drives the U-shaped plate (14) to move toward the printed board (2). When the piston rods of the two feed cylinders (12) are fully extended, the two U-shaped plates (14) are butted together. At this time, the area enclosed by the U-shaped grooves of the two U-shaped plates (14) just matches the outer contour of the cured sheet (3); S3. The worker places the curing sheet (3) flatly in the area enclosed by the U-shaped grooves of the two U-shaped plates (14), and ensures that the curing sheet (3) is supported on the top surface of the printed circuit board (2); then the worker places the FPC board (4) flatly in the area enclosed by the U-shaped grooves of the two U-shaped plates (14), and ensures that the FPC board (4) is flatly placed on the top surface of the curing sheet (3). At this time, the FPC board (4) is just below the hot pressing head (21) of the hot pressing mechanism (8); S4, the piston rod of the hydraulic press (20) controlling the hot pressing mechanism (8) extends downward, the piston rod drives the hot pressing head (21) to move downward, the hot pressing head (21) enters the enclosure (11), and just presses on the top surface of the FPC board (4); the power supply connected to the electric heating plate (22) is turned on, the electric heating plate (22) generates heat, the heat is transferred to the hot pressing head (21), the hot pressing head (21) transfers the heat to the FPC board (4), the FPC board (4) then transfers the heat to the curing sheet (3), when the curing sheet (3) is heated, the curing sheet (3) fixes the FPC board (4) and the printed circuit board (2) together, thereby hot pressing and forming the desired hard-soft circuit board (1); S5, transferring the rigid-flexible circuit board (1) to the next production process, the specific operation steps are as follows: S51, controlling the piston rod of the hydraulic press (20) to retract upward, the piston rod drives the hot pressing head (21) to move upward, and the hot pressing head (21) is separated from the hard-flexible circuit board (1); then controlling the piston rods of the two feed cylinders (12) to retract, the piston rod drives the vertical plate (13) to move in a direction away from the hard-flexible circuit board (1), the vertical plate (13) drives the U-shaped plate (14) to move synchronously, and the U-shaped plate (14) is separated from the hard-flexible circuit board (1); S52, the stepper motor (24) of the control turnover mechanism is started, the stepper motor (24) drives the connecting plate (25) to rotate, the connecting plate (25) drives the suction head (26) and the vacuum pump (27) to rotate synchronously, and when the suction head (26) moves to the top of the soft-hard combination circuit board (1), the controller controls the stepper motor (24) to turn off; S53, the piston rod of the lifting cylinder (16) of the lifting mechanism (15) extends upward, the piston rod drives the lifting block (17) to move upward, the lifting block (17) drives the plurality of lifting rods (18) to move upward, the lifting rods (18) lift the hard-flexible circuit board (1) upward until the top surface of the hard-flexible circuit board (1) contacts the bottom surface of the suction head (26), at which time the controller controls the lifting cylinder (16) to close, and at the same time, the controller controls the vacuum pump (27) to start, the vacuum pump (27) evacuates the suction head (26), and the hard-flexible circuit board (1) is adsorbed and fixed under negative pressure; S54, the vacuum pump (27) of the control turnover mechanism is started, the vacuum pump (27) evacuates the suction head (26), and under negative pressure, the rigid-flexible circuit board (1) is adsorbed and fixed on the suction head (26); the piston rod of the control lifting cylinder (16) is retracted downward, the piston rod drives the lifting block (17) to move downward, the lifting block (17) drives the ejecting rod (18) to move downward, and the ejecting rod (18) is separated from the rigid-flexible circuit board (1); S55, control the stepper motor (24) to start, the stepper motor (24) drives the connecting plate (25) to rotate in the opposite direction, the connecting plate (25) drives the suction head (26) and the vacuum pump (27) to rotate synchronously, the suction head (26) drives the soft and hard combination circuit board (1) to rotate synchronously, when the soft and hard combination circuit board (1) moves to the top of the roller conveyor (23), the controller controls the stepper motor (24) to turn off; finally, control the vacuum pump (27) to turn off, at this time, the soft and hard combination circuit board (1) falls onto the roller conveyor (23), and the roller conveyor (23) conveys the soft and hard combination circuit board (1) to the next process; S6. The worker repeats the operations of steps S1 to S5 to continuously produce a plurality of rigid-flexible circuit boards (1), and directly delivers the produced rigid-flexible circuit boards (1) to the next process.

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