Organic electroluminescent device sealing monitoring method, system, equipment and medium

Abstract

The present invention provides a method, system, equipment and medium for monitoring the sealing of an organic electroluminescent device, including: using an organic material with strong moisture resistance and adhesion as the first layer of encapsulation; using an inorganic material to form a dense encapsulation layer in the second layer, embedding a humidity sensor and an oxygen sensor between the inorganic material layer and the next layer, and after the inorganic material layer is deposited, using an optical interference detection technology to detect the encapsulation layer, and then monitoring the electrical characteristics to detect whether there is a change in the electrical performance of the device caused by the deposition of the material; uniformly covering the surface of the second layer of inorganic material with a composite material as the third layer, annealing and curing the encapsulation layer at a low temperature, leaving enough space in the sensor area for signal transmission; after the fourth layer of encapsulation is completed, using a non-contact optical detection method, through sensor data, verifying whether the sealing effect of each layer meets expectations. The present invention monitors the encapsulation state in real time, effectively blocks the penetration of moisture and oxygen, and improves the sealing and stability of the device.

Description

Technical Field

[0001] The invention belongs to the technical field of sealing monitoring of organic electroluminescent devices, and in particular relates to a sealing monitoring method, system, equipment and medium for organic electroluminescent devices. Background Art

[0002] OLED materials are highly sensitive to moisture and oxygen. Even a small amount of moisture or oxygen infiltration can cause the device performance to rapidly deteriorate or even fail. Therefore, sealing becomes a key issue affecting the life of OLED devices. Current packaging technology mainly uses a combination of multiple layers of organic and inorganic materials to block moisture and oxygen through different barrier layers. However, due to the microstructure of the material or the unevenness in the packaging process, there may be tiny defects or penetration channels, and these tiny defects may not be discovered in time by traditional packaging monitoring methods.

[0003] The encapsulation layer is usually composed of a combination of organic and inorganic materials. However, the thermal expansion coefficients, mechanical strength and adhesion of these two types of materials are quite different. In practical applications, the multilayer structure of the encapsulation layer may cause interface problems during thermal cycles or stress changes, resulting in cracking, peeling, and even sealing failure of the encapsulation layer. Traditional monitoring methods are difficult to capture this interface failure risk at an early stage, affecting the long-term reliability of the device. Current sealing monitoring methods usually rely on optical detection technology or electrical detection technology, such as optical interferometry, reflection spectroscopy, sensor detection, etc. However, these methods have some limitations. Summary of the invention

[0004] The purpose of this section is to summarize some aspects of embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0005] In view of the above or existing problems of the sealing monitoring method of the organic electroluminescent device, the present invention is proposed.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions:

[0007] The embodiment of the present invention provides a method for monitoring the sealing of an organic electroluminescent device, comprising: using an organic material with strong moisture resistance and adhesion as a first layer of encapsulation, and forming a substrate in contact with the OLED device;

[0008] Based on the first layer of substrate, an inorganic material is used in the second layer to form a dense packaging layer. A humidity sensor and an oxygen sensor are embedded between the inorganic material layer and the next layer to monitor the sealing status in real time. After the inorganic material layer is deposited, the optical interference detection technology is continued to be used to detect the thickness and uniformity of the packaging layer, and then the electrical characteristics are monitored to detect whether there are changes in the electrical performance of the device caused by material deposition; the composite material is evenly covered on the surface of the second layer of inorganic material as the third layer, and the packaging layer is further solidified through a low-temperature annealing process. At the same time, the sensor monitors the humidity and gas content between the layers in real time; the polymer is evenly coated on the fourth layer as an external protective layer, and sufficient space is left in the sensor area for signal transmission; after the fourth layer of packaging is completed, a non-contact optical detection method is used to confirm the integrity and uniformity of the packaging layer surface, and the sensor data is used to verify whether the sealing effect of each layer meets expectations.

[0009] As a preferred solution of the method for monitoring the sealing of an organic electroluminescent device of the present invention, the organic material with strong moisture resistance and adhesion is used as the first layer of the package to form a substrate in contact with the OLED device, including: the organic material includes epoxy resin, polyimide and acrylic polymer, and the substrate of the first layer is formed by coating the liquid organic material on the surface of the device, rotating at a speed of 1000-4000 rpm, and the coating forms a uniform thin film under the action of centrifugal force, and curing the packaging material by ultraviolet curing to make it firmly bonded to the surface of the device.

[0010] As a preferred solution of the sealing monitoring method of the organic electroluminescent device described in the present invention, wherein: based on the first layer of substrate, an inorganic material is used in the second layer to form a dense packaging layer, a humidity sensor and an oxygen sensor are embedded between the inorganic material layer and the next layer, and the sealing state is monitored in real time, including: the inorganic material includes aluminum oxide, silicon nitride and silicon oxide, the inorganic material is deposited layer by layer on the substrate by atomic layer deposition technology, the humidity and oxygen sensors are directly printed on the surface of the inorganic layer by precision printing technology, after the inorganic material deposition is completed, the embedding space of the sensor is reserved on the packaging layer by laser etching technology, and the embedded humidity and oxygen sensors can monitor the sealing state in real time and issue an alarm through a data acquisition system.

[0011] As a preferred solution of the organic electroluminescent device sealing monitoring method described in the present invention, wherein: a humidity sensor and an oxygen sensor are embedded between the inorganic material layer and the next layer to monitor the sealing state in real time, and also includes: the monitoring method is as follows: wireless transmission system: the sensor is connected to the external monitoring system by wireless means, and the data is transmitted to a computer or mobile device in real time; data analysis system: combined with data acquisition software, humidity and oxygen thresholds are set. When the monitoring data exceeds the set range, the system will automatically issue an alarm to remind that there is a problem with the packaging layer; real-time data system: real-time humidity and oxygen concentration change curves are generated through the data analysis platform to help analyze the performance of the packaging layer; if the first layer of packaging material is slightly damaged, the sensor will detect the humidity or oxygen changes and issue an early warning, so as to repair it in time.

[0012] As a preferred solution of the organic electroluminescent device sealing monitoring method described in the present invention, wherein: after the inorganic material layer is deposited, the optical interference detection technology is continued to be used to detect the thickness and uniformity of the encapsulation layer, and then the electrical characteristics are monitored to detect whether there is a change in the electrical performance of the device caused by the material deposition, including: using a monochromatic laser source to emit a light beam of a fixed wavelength, the light beam is vertically incident on the surface of the inorganic material encapsulation layer, part of the light is reflected on the surface of the encapsulation layer, and the other part of the light passes through the encapsulation layer, reaches the next interface and is reflected again, the two beams of reflected light form interference fringes, and the thickness of the encapsulation layer is calculated by detecting the relative movement of the interference fringes and the change in the fringe spacing. The system scans multiple areas of the inorganic material encapsulation layer, generates a thickness distribution map to detect the uniformity of the encapsulation layer, obtains the thickness data of the encapsulation layer in real time, and compares it with the preset thickness standard to evaluate whether the thickness of the film layer meets the design requirements.

[0013] As a preferred solution of the method for monitoring the sealing of an organic electroluminescent device of the present invention, the composite material is uniformly covered on the surface of the second layer of inorganic material as the third layer, and the encapsulation layer is further solidified by a low-temperature annealing process, and the sensor monitors the humidity and gas content between the layers in real time, including:

[0014] The low-temperature annealing temperature is controlled between 80-150℃, and the annealing time is controlled between 30-60min. After the annealing is completed, it is slowly cooled to room temperature. During the low-temperature annealing process, the sensor collects the humidity and oxygen content in the packaging layer in real time, and transmits the data to the control system wirelessly or wired. The data system will determine whether there are defects in the packaging layer based on the set threshold. If the humidity or oxygen content exceeds the standard range, the system will issue an alarm to indicate the need to adjust the process or repair the packaging. If the sensor detects abnormal changes during or after annealing, the packaging layer needs to be inspected or repackaged.

[0015] As a preferred solution of the organic electroluminescent device sealing monitoring method of the present invention, after the fourth layer of encapsulation is completed, a non-contact optical detection method is used to confirm the integrity and uniformity of the surface of the encapsulation layer, and the sensor data is used to verify whether the sealing effect of each layer meets the expectations, including:

[0016] After the polymer layer is cured, a non-contact optical detection method is used to confirm the integrity and uniformity of the encapsulation layer. The humidity and oxygen concentration data of the sensor during and after curing are recorded to monitor the sealing effect between layers. The data fed back by the sensor is compared with the set threshold value to analyze the barrier performance of the encapsulation layer. If the data fed back by the sensor remains within a safe range and does not fluctuate significantly, it indicates that the sealing effect of the encapsulation layer is good and meets expectations. If the data exceeds the preset range, further analysis is required to determine whether there are encapsulation defects and re-encapsulate or repair.

[0017] In a second aspect, an embodiment of the present invention provides a sealing monitoring system for an organic electroluminescent device, which includes a substrate building module for using an organic material with strong moisture resistance and adhesion as a first layer of encapsulation and forming a substrate in contact with the OLED device; a sensor building module system for forming a dense encapsulation layer based on the first layer of the substrate using an inorganic material in the second layer, embedding a humidity sensor and an oxygen sensor between the inorganic material layer and the next layer, monitoring the sealing state in real time, and after the inorganic material layer is deposited, continuing to use optical interference detection technology to detect the thickness and uniformity of the encapsulation layer, and then through electrical property monitoring, detecting whether there is a change in the electrical performance of the device caused by material deposition; an encapsulation monitoring module for uniformly covering the surface of the second layer of inorganic material with a composite material as a third layer, further curing the encapsulation layer through a low-temperature annealing process, while the sensor monitors the humidity and gas content between the layers in real time, uniformly coating the polymer on the fourth layer as an external protective layer, and leaving enough space in the sensor area for signal transmission; a detection and verification module for confirming the integrity and uniformity of the surface of the encapsulation layer using a non-contact optical detection method after the fourth layer of encapsulation is completed, and verifying whether the sealing effect of each layer meets expectations through sensor data.

[0018] In a third aspect, an embodiment of the present invention provides a computer device, including a memory and a processor, wherein the memory stores a computer program, wherein: when the processor executes the computer program, any step of the above-mentioned organic electroluminescent device sealing monitoring method is implemented.

[0019] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium having a computer program stored thereon, wherein: when the computer program is executed by a processor, any step of the above-mentioned organic electroluminescent device sealing monitoring method is implemented.

[0020] The beneficial effects of the present invention are as follows: the present invention combines multiple layers of organic and inorganic materials, especially embeds humidity and oxygen sensors between the inorganic material layer and the next layer, monitors the packaging state in real time, effectively blocks the penetration of moisture and oxygen, and significantly improves the sealing and long-term stability of the device. The use of optical interference detection and electrical characteristic monitoring technology can not only detect the thickness and uniformity of the packaging layer, but also quickly check the changes in the electrical performance of the device caused by the deposited material, ensuring that there is no negative impact on the device performance during the packaging process.

[0021] The multi-layer structure of organic and inorganic materials, combined with low-temperature annealing process and polymer outer layer protection, further improves the density and anti-aging performance of the packaging layer, and enhances the device's ability to resist external environmental corrosion. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0023] Figure 1 The present invention provides a flowchart of a method for monitoring the sealing of an organic electroluminescent device.

[0024] Figure 2 A schematic structural diagram of a sealing monitoring system for an organic electroluminescent device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the accompanying drawings.

[0026] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0027] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The term "in one embodiment" that appears in different places in this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0028] Example 1

[0029] Reference Figure 1, is an embodiment of the present invention, which provides a method for monitoring the sealing of an organic electroluminescent device, comprising:

[0030] S1: Use an organic material with strong moisture resistance and adhesion as the first layer of encapsulation and form a substrate in contact with the OLED device.

[0031] Preferably, the organic material includes epoxy resin, polyimide and acrylic polymer. The base formation method of the first layer is to coat the liquid organic material on the surface of the device, rotate it at a speed of 1000-4000 rpm, and the coating forms a uniform film under the action of centrifugal force. The packaging material is cured by ultraviolet curing to make it firmly bonded to the surface of the device.

[0032] Further, first, liquid epoxy resin, polyimide or acrylic polymer is prepared into a uniform coating solution. According to needs, a solvent is used to appropriately dilute the organic material to improve the fluidity of the material and the coating effect.

[0033] Drop the prepared organic material solution on the device surface, use a spin coating device, rotate at a speed of 1000-4000 rpm, and set the spin coating time to 30-60 seconds. Under the action of centrifugal force, the liquid organic material is evenly distributed on the device surface to form a uniform film. The adjustment of the spin coating speed can control the thickness of the coating, and a higher rotation speed can form a thinner coating.

[0034] After spin coating, ultraviolet light (UV) is used for curing. The curing time is 30-120 seconds, depending on the photosensitive reaction characteristics of the material. UV irradiation causes the polymer in the coating to undergo a cross-linking reaction, quickly forming a solid film.

[0035] During the curing process, the intensity of the UV light source needs to be kept stable to ensure that the coating can be cured evenly and avoid local uncured or over-cured problems. Different wavelengths of UV light can be used and adjusted according to the absorption characteristics of the material. The thickness of the cured film is usually between 100 nm and 500 nm, and the specific thickness is adjusted according to the spin coating speed and the concentration of the coating solution.

[0036] S2: Based on the first layer of substrate, an inorganic material is used in the second layer to form a dense encapsulation layer, and a humidity sensor and an oxygen sensor are embedded between the inorganic material layer and the next layer to monitor the sealing status in real time.

[0037] Preferably, the inorganic material includes aluminum oxide, silicon nitride and silicon oxide. The inorganic material is deposited layer by layer on the substrate by atomic layer deposition technology, and the humidity and oxygen sensors are directly printed on the surface of the inorganic layer by precision printing technology. After the inorganic material deposition is completed, the embedding space of the sensor is reserved on the packaging layer by laser etching technology. The embedded humidity and oxygen sensors can monitor the sealing status in real time and issue an alarm through the data acquisition system.

[0038] Preferably, the monitoring method is as follows:

[0039] Wireless transmission system: The sensor is connected to the external monitoring system wirelessly, and the data is transmitted to the computer or mobile device in real time;

[0040] Data analysis system: Combined with data acquisition software, humidity and oxygen thresholds are set. When the monitoring data exceeds the set range, the system will automatically issue an alarm to remind that there is a problem with the packaging layer;

[0041] Real-time data system: Generate real-time humidity and oxygen concentration curves through the data analysis platform to help analyze the performance of the packaging layer;

[0042] If the first layer of packaging material is slightly damaged, the sensor will detect changes in humidity or oxygen and issue an early warning so that it can be repaired in time.

[0043] Furthermore, the humidity and oxygen sensors are connected to the external monitoring system through the built-in wireless transmission module. The data is transmitted wirelessly to a computer or mobile device to monitor the packaging status in real time. The wireless transmission system can support long-distance data transmission and adapt to the packaging monitoring needs in complex environments. The humidity and oxygen concentration data collected by the sensor are uploaded to the data acquisition software in real time for analysis. The system sets the threshold range of humidity and oxygen. When the monitoring data exceeds the set safety range, the system will automatically issue an alarm to remind that there may be problems with the packaging layer. The system, combined with an intelligent analysis algorithm, can accurately predict the sealing status of the packaging layer and provide monitoring results in real time. The data analysis system can generate real-time curves of changes in humidity and oxygen concentration, showing the changing trends of each layer of packaging in long-term use.

[0044] S3: After the inorganic material layer is deposited, continue to use optical interference detection technology to detect the thickness and uniformity of the packaging layer, and then use electrical characteristics monitoring to detect whether there are any changes in the device's electrical performance caused by material deposition.

[0045] Preferably, a monochromatic laser source is used to emit a light beam of a fixed wavelength, and the light beam is incident vertically on the surface of the inorganic material encapsulation layer. Part of the light is reflected on the surface of the encapsulation layer, and the other part of the light passes through the encapsulation layer, reaches the next interface and is reflected again. The two reflected light beams form interference fringes. The thickness of the encapsulation layer is calculated by detecting the relative movement of the interference fringes and the change in the fringe spacing. The system scans multiple areas of the inorganic material encapsulation layer, generates a thickness distribution map to detect the uniformity of the encapsulation layer, obtains the thickness data of the encapsulation layer in real time, and compares it with the preset thickness standard to evaluate whether the thickness of the film layer meets the design requirements.

[0046] Furthermore, a photodetector or CCD camera is used to capture the interference fringes formed by the reflected light. Through high-precision image processing technology, the movement of the interference fringes and the change in the fringe spacing are collected in real time.

[0047] The system converts the interference image into a digital signal and transmits it to the computer for analysis. Based on the periodicity and relative position changes of the interference fringes, the thickness of the encapsulation layer can be accurately calculated. The thickness calculation formula is:

[0048] d=m⋅λ / 2

[0049] Wherein, d is the thickness of the encapsulation layer, m is the order of the interference fringes, and λ is the wavelength of the laser.

[0050] The light beam will measure the thickness of different positions of the inorganic material encapsulation layer by multi-area scanning. The system controls the movement of the laser beam, vertically incident on multiple areas of the encapsulation layer according to the preset path, and collects the interference fringe data of each area point by point. The computer system summarizes the thickness data of each area and generates a thickness distribution map of the encapsulation layer. The thickness distribution map can reflect the thickness uniformity of the encapsulation layer in different areas. The real-time obtained encapsulation layer thickness data will be compared with the preset standard thickness. The preset thickness standard is determined by the design requirements. For example, the target thickness of some inorganic material encapsulation layers may be 100 nm to 300 nm. The system evaluates whether the thickness of the encapsulation layer is within the allowable error range (such as ±5 nm) by comparing the real-time thickness data with the preset standard. If the thickness of certain areas deviates from the preset standard, the system will issue an alarm to indicate that the encapsulation process needs to be adjusted.

[0051] S4: The composite material is evenly covered on the surface of the second layer of inorganic material as the third layer, and the encapsulation layer is further solidified through a low-temperature annealing process. At the same time, the sensor monitors the humidity and gas content between each layer in real time.

[0052] Preferably, the low-temperature annealing temperature is controlled between 80-150°C, the annealing time is controlled between 30-60min, and after the annealing is completed, it is slowly cooled to room temperature;

[0053] During the low-temperature annealing process, the sensor collects the humidity and oxygen content in the packaging layer in real time and transmits the data to the control system wirelessly or wiredly;

[0054] The data system will determine whether there are defects in the packaging layer based on the set threshold. If the humidity or oxygen content exceeds the standard range, the system will issue an alarm, indicating that the process needs to be adjusted or the packaging needs to be repaired;

[0055] If the sensor detects abnormal changes during or after annealing, the packaging layer needs to be repaired or repackaged.

[0056] Furthermore, the control system combines data acquisition software and analysis platform to process sensor data in real time. The software sets standard thresholds for humidity and oxygen content in the packaging layer. For example, humidity is kept below 100 ppm and oxygen content is less than 1%.

[0057] During the entire annealing process, the system generates a real-time change curve of humidity and oxygen content. By comparing the change curve and setting thresholds, the system can determine in real time whether the encapsulation layer is well sealed.

[0058] If the humidity or oxygen content exceeds the preset standard range during the annealing process or cooling stage, the system will automatically issue an alarm. The alarm information will be sent to the operator's monitoring equipment via wireless or wired network to remind the operator of the need for process adjustment or package repair.

[0059] During the annealing process, if the sensor detects abnormal changes in humidity or oxygen content (such as humidity rise or oxygen leakage), the process needs to be suspended and the packaging layer needs to be repaired. The abnormality may be caused by cracks, bubbles or other process defects in the packaging layer.

[0060] If degradation of sealing performance is detected after annealing is completed and cooled to room temperature, resealing or local repair is required to ensure the long-term reliability of the device.

[0061] S5: Evenly coat the fourth layer with polymer as an outer protective layer, and leave enough space in the sensor area for signal transmission; after the fourth layer of packaging is completed, use a non-contact optical detection method to confirm the integrity and uniformity of the packaging layer surface, and verify whether the sealing effect of each layer meets expectations through sensor data.

[0062] Preferably, after the polymer layer is cured, a non-contact optical detection method is used to confirm the integrity and uniformity of the encapsulation layer; the humidity and oxygen concentration data of the sensor during and after curing are recorded, the interlayer sealing effect is monitored, the data fed back by the sensor is compared with the set threshold, and the barrier performance of the encapsulation layer is analyzed; if the data fed back by the sensor remains within a safe range and does not fluctuate significantly, it indicates that the sealing effect of the encapsulation layer is good and meets expectations; if the data exceeds the preset range, further analysis is required to determine whether there is a packaging defect, and re-encapsulation or repair is required.

[0063] Furthermore, the data fed back by the sensor is compared with the preset humidity and oxygen thresholds. The humidity threshold is set to less than 100 ppm and the oxygen concentration is set to less than 1%, ensuring that the encapsulation layer remains dry and low in oxygen.

[0064] If the data fed back by the sensor remains stable during and after the curing process without significant fluctuations, and the humidity and oxygen concentrations do not exceed the set thresholds, it means that the sealing performance of the encapsulation layer is good and the expected effect has been achieved.

[0065] If the data fed back by the sensor exceeds the set safety range or fluctuates significantly, it indicates that there may be defects in the packaging layer and the packaging quality fails to meet expectations.

[0066] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A method for monitoring the sealing of an organic electroluminescent device, characterized in that: include: Using an organic material with strong moisture resistance and adhesion as the first layer of the encapsulation and forming a substrate in contact with the OLED device; Based on the first layer of substrate, an inorganic material is used in the second layer to form a dense encapsulation layer. A humidity sensor and an oxygen sensor are embedded between the inorganic material layer and the next layer to monitor the sealing status in real time. After the inorganic material layer is deposited, the thickness and uniformity of the encapsulation layer are continuously detected using optical interference detection technology. Then, electrical property monitoring is used to detect whether there is any change in the device electrical performance caused by material deposition. The composite material is evenly covered on the surface of the second layer of inorganic material as the third layer, and the encapsulation layer is further solidified through a low-temperature annealing process. At the same time, sensors monitor the humidity and gas content between each layer in real time; The fourth layer is evenly coated with polymer as an outer protective layer, leaving enough space in the sensor area for signal transmission; After the fourth layer of packaging is completed, a non-contact optical inspection method is used to confirm the integrity and uniformity of the packaging layer surface, and sensor data is used to verify whether the sealing effect of each layer meets expectations.

2. The method for monitoring the sealing of an organic electroluminescent device according to claim 1, wherein: The method uses an organic material with strong moisture resistance and adhesion as the first layer of the encapsulation and forms a substrate in contact with the OLED device, comprising: The organic material includes epoxy resin, polyimide and acrylic polymer. The base formation method of the first layer is to coat the liquid organic material on the surface of the device and rotate it at a speed of 1000-4000 rpm. The coating forms a uniform film under the action of centrifugal force. The packaging material is cured by ultraviolet curing to make it firmly bonded to the surface of the device.

3. The method for monitoring the sealing of an organic electroluminescent device according to claim 1, wherein: Based on the first substrate, an inorganic material is used in the second layer to form a dense encapsulation layer, and a humidity sensor and an oxygen sensor are embedded between the inorganic material layer and the next layer to monitor the sealing state in real time, including: The inorganic materials include aluminum oxide, silicon nitride and silicon oxide. The inorganic materials are deposited layer by layer on the substrate through atomic layer deposition technology. The humidity and oxygen sensors are directly printed on the surface of the inorganic layer through precision printing technology. After the inorganic material deposition is completed, the embedding space of the sensor is reserved on the packaging layer through laser etching technology. The embedded humidity and oxygen sensors can monitor the sealing status in real time and issue an alarm through a data acquisition system.

4. The method for monitoring the sealing of an organic electroluminescent device according to claim 3, wherein: The method further comprises embedding a humidity sensor and an oxygen sensor between the inorganic material layer and the next layer to monitor the sealing state in real time, and further comprising: The monitoring method is as follows: Wireless transmission system: The sensor is connected to the external monitoring system wirelessly, and the data is transmitted to the computer or mobile device in real time; Data analysis system: Combined with data acquisition software, humidity and oxygen thresholds are set. When the monitoring data exceeds the set range, the system will automatically issue an alarm to remind that there is a problem with the packaging layer; Real-time data system: Generate real-time humidity and oxygen concentration curves through the data analysis platform to help analyze the performance of the packaging layer; If the first layer of packaging material is slightly damaged, the sensor will detect changes in humidity or oxygen and issue an early warning so that it can be repaired in time.

5. The method for monitoring the sealing of an organic electroluminescent device according to claim 1, wherein: After the inorganic material layer is deposited, the thickness and uniformity of the encapsulation layer are continuously detected using optical interference detection technology, and then the electrical characteristics are monitored to detect whether there is any change in the electrical performance of the device caused by the material deposition, including: A monochromatic laser source is used to emit a light beam of fixed wavelength. The light beam is incident vertically on the surface of the inorganic material packaging layer. Part of the light is reflected on the surface of the packaging layer, and the other part of the light passes through the packaging layer, reaches the next interface and is reflected again. The two reflected light beams form interference fringes. The thickness of the packaging layer is calculated by detecting the relative movement of the interference fringes and the change in the fringe spacing. The system scans multiple areas of the inorganic material packaging layer, generates a thickness distribution map to detect the uniformity of the packaging layer, obtains the thickness data of the packaging layer in real time, and compares it with the preset thickness standard to evaluate whether the thickness of the film layer meets the design requirements.

6. The method for monitoring the sealing of an organic electroluminescent device according to claim 1, wherein: The composite material is uniformly covered on the surface of the second layer of inorganic material as the third layer, and the encapsulation layer is further solidified by a low-temperature annealing process, while the sensor monitors the humidity and gas content between the layers in real time, including: The low-temperature annealing temperature is controlled between 80-150°C, the annealing time is controlled between 30-60 minutes, and after the annealing is completed, it is slowly cooled to room temperature; During the low-temperature annealing process, the sensor collects the humidity and oxygen content in the packaging layer in real time and transmits the data to the control system wirelessly or wiredly; The data system will determine whether there are defects in the packaging layer based on the set threshold. If the humidity or oxygen content exceeds the standard range, the system will issue an alarm, indicating that the process needs to be adjusted or the packaging needs to be repaired; If the sensor detects abnormal changes during or after annealing, the packaging layer needs to be repaired or repackaged.

7. The method for monitoring the sealing of an organic electroluminescent device according to claim 1, wherein: After the fourth layer of packaging is completed, a non-contact optical detection method is used to confirm the integrity and uniformity of the packaging layer surface, and the sensor data is used to verify whether the sealing effect of each layer meets the expectations, including: After the polymer layer is cured, a non-contact optical detection method is used to confirm the integrity and uniformity of the encapsulation layer; the humidity and oxygen concentration data of the sensor during and after curing are recorded to monitor the sealing effect between layers, and the data fed back by the sensor is compared with the set threshold to analyze the barrier performance of the encapsulation layer; If the data fed back by the sensor remains within the safe range and does not fluctuate significantly, it indicates that the sealing effect of the encapsulation layer is good and meets expectations; If the data exceeds the preset range, further analysis is required to determine whether there is a packaging defect and repackage or repair it.

8. An organic electroluminescent device sealing monitoring system, characterized in that: include: A substrate building block for using an organic material with strong moisture resistance and adhesion as the first layer of encapsulation and forming a substrate in contact with the OLED device; The sensor building module is used to form a dense encapsulation layer based on the first layer substrate and the second layer with inorganic materials, and embed a humidity sensor and an oxygen sensor between the inorganic material layer and the next layer to monitor the sealing state in real time. After the inorganic material layer is deposited, the thickness and uniformity of the encapsulation layer are continuously detected using optical interference detection technology, and then the electrical characteristics are monitored to detect whether there is any change in the electrical performance of the device caused by the material deposition; The encapsulation monitoring module is used to evenly cover the composite material on the surface of the second layer of inorganic material as the third layer, further solidify the encapsulation layer through a low-temperature annealing process, and the sensor monitors the humidity and gas content between the layers in real time, and evenly coats the polymer on the fourth layer as an external protective layer, and leaves enough space in the sensor area for signal transmission; The detection and verification module is used after the fourth layer of packaging is completed. It uses a non-contact optical detection method to confirm the integrity and uniformity of the packaging layer surface, and verifies through sensor data whether the sealing effect of each layer meets expectations.

9. A computer device comprising a memory and a processor, wherein the memory stores a computer program, wherein: When the processor executes the computer program, the steps of the organic electroluminescent device sealing monitoring method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the organic electroluminescent device sealing monitoring method according to any one of claims 1 to 7 are implemented.

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