Wafer conveying device and wafer conveying method

Abstract

This invention discloses a wafer transfer device and method, relating to the field of wafer manufacturing technology. The wafer transfer device includes a guide rail, a moving module, a vehicle body, a lifting module, a clamping module, and a wafer transfer box mounted on a crane body. The wafer transfer box contains multiple arrayed adsorption mechanisms for adsorbing wafers placed within it. This wafer transfer device and method facilitate automatic centering, clamping, and positioning of wafers of different sizes; it can adsorb wafers by using rubber suction cups to draw air; and it can automatically adjust the number of adsorption holes opened according to the wafer size to ensure effective adsorption. Furthermore, it can detect the sealing performance of the rubber suction cups, making wafer transfer more stable and reliable, preventing shaking and collisions during transfer, and ensuring transfer quality.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer production, and in particular to a wafer conveying device and a wafer conveying method. Background Art

[0002] During the production process, wafers need to be transported using a conveyor. Wafer conveyor crane is a type of conveyor. As a key equipment in semiconductor manufacturing, it undertakes the important task of accurately and efficiently transferring wafers between different processes. The crane runs on the rails on the indoor ceiling, which effectively saves space and can maintain a high degree of cleanliness in the clean room to prevent wafers from being contaminated. Its internal precise computer control system ensures the continuity and accuracy of wafer handling, greatly improving production efficiency. In addition, the crane system also has a high level of automation, which can reduce the impact of human factors on wafers and reduce the defective rate. Wafer conveyor crane, the full name of which is "air-suspended unmanned transport vehicle", is a semiconductor The key equipment in manufacturing mainly consists of the following parts: Guide rails: rails installed on the ceiling of the factory, used for the movement of the overhead crane to save floor space; Crane: a lifting equipment that moves along the guide rails, responsible for grabbing, lifting, transferring and placing wafer carriers; Carrier: a special container used to carry and protect wafers, such as wafer transfer boxes; Control system: an automated system responsible for controlling the movement of the crane, real-time monitoring and precise control of the wafer position; Drive system: provides power to enable the overhead crane to move freely in the workshop; Lifting system and grabbing system: work together to ensure the stability and safety of the wafers during transportation.

[0003] However, when the existing wafer conveying device and wafer conveying method are in use, the wafer conveying box is not convenient for centering and clamping wafers of different specifications and sizes. During the conveying process, the wafer is easily shaken or even collided, which can easily cause damage and affect the conveying quality of the wafer. Summary of the invention

[0004] The object of the present invention is to provide a wafer conveying device and a wafer conveying method to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a wafer conveying device, comprising a guide rail, a moving module, a vehicle body, a lifting module, a clamping module and a wafer conveying box arranged on a crane body, wherein a plurality of adsorption mechanisms arranged in an array are arranged in the wafer conveying box, and the adsorption mechanisms are used to adsorb wafers placed in the wafer conveying box;

[0006] The adsorption mechanism includes two hollow covers fixedly connected to the inner side walls of the wafer conveying box, the two hollow covers are arranged opposite to each other, and a plurality of groups of adsorption heads arranged in an array are fixedly inserted on the top of each hollow cover, each of the adsorption heads includes a fixed tube and a conically arranged rubber suction cup, the fixed tube is fixedly inserted on the top of the hollow cover, and the rubber suction cup is threadedly connected to the top of the fixed tube, a adsorption hole is opened on the top of the rubber suction cup, a first reset mechanism is arranged on the top of the fixed tube, a sealing plate is connected to the first reset mechanism, and a conical block is inserted in the adsorption hole, the conical block is fixed to the top of the sealing plate, and a plurality of exhaust pipes arranged in an array are fixedly inserted on the side wall of the wafer conveying box, one end of the exhaust pipe located in the wafer conveying box is fixedly inserted in the hollow cover, and one end of the exhaust pipe away from the wafer conveying box is fixedly connected to a connecting pipe, and a fan is fixedly connected to the side wall of the connecting pipe.

[0007] Preferably, the side wall of the fixed tube is provided with a detection mechanism for detecting the sealing of the rubber suction cup, the detection mechanism includes a first T-shaped guide rod inserted in the side wall of each fixed tube, and the side wall of the first T-shaped guide rod is sleeved with a reset spring, the two ends of the reset spring are respectively fixed to the end of the first T-shaped guide rod of the fixed tube, the side wall of the fixed tube is fixedly connected to a U-shaped frame, and the side wall of the U-shaped frame is fixedly connected to a proximity switch.

[0008] Preferably, the first resetting mechanism includes two fixed plates fixedly connected to the inner side wall of the fixed tube, and a moving rod is inserted into the top of each fixed plate, the top of the moving rod is fixedly connected to a connecting block, the connecting block is fixed to the side wall of the sealing plate, and the side wall of the moving rod is sleeved with a first spring, and the two ends of the first spring are respectively fixed to the bottom of the connecting block and the top of the fixed plate.

[0009] Preferably, the side wall of each of the exhaust pipes is provided with an on-off mechanism, and the on-off mechanism includes a fixed cover fixedly inserted in the side wall of the exhaust pipe, and a sliding plate is slidably connected in the fixed cover, the side wall of the sliding plate is provided with a through hole, and the side wall of the sliding plate is fixedly connected with an L-shaped block, the bottom of the L-shaped block is fixedly connected with a moving block, the bottom of the moving block is fixedly connected with a sealing column, and the side wall of the exhaust pipe is provided with an air hole, and the side wall of the first moving plate is provided with a first pushing mechanism for pushing the sliding plate to move.

[0010] Preferably, the first moving mechanism includes two second T-shaped guide rods inserted in the side walls of the L-shaped plate, and the first moving plate is fixed to the ends of the second T-shaped guide rods, the side wall of each of the second T-shaped guide rods is sleeved with a second spring, the two ends of the second spring are respectively fixed to the L-shaped plate and the side wall of the first moving plate, the side wall of the L-shaped plate is fixedly connected to an electromagnet, and the side wall of the first moving plate is fixedly connected to an iron block.

[0011] Preferably, the telescopic mechanism includes two first sets of rods fixedly connected to the side wall of the first movable plate, and the side wall of each first set of rods is sleeved with a first sleeve, the other end of the first sleeve is fixed to the side wall of the second movable plate, the side wall of the first sleeve is sleeved with a third spring, and the two ends of the third spring are respectively fixed to the side walls of the first movable plate and the second movable plate.

[0012] Preferably, the first pushing mechanism includes two second sleeves fixedly connected to the side walls of the moving block, and a second sleeve rod is inserted in each second sleeve, the second sleeve rod is fixedly connected to a moving frame at one end away from the moving block, and the moving frame includes a first inclined surface, a second reset mechanism is provided on the top of the moving frame, the first moving plate is connected to the second reset mechanism, and the first moving plate is abutted against the top of the moving frame.

[0013] Preferably, the second reset mechanism includes two third T-shaped guide rods fixedly connected to the top of the movable frame, and the side walls of the third T-shaped guide rods are sleeved with connecting plates, and the connecting plates are fixed to the side walls of the first movable plate, and the side walls of each of the third T-shaped guide rods are sleeved with a fourth spring, and the two ends of the fourth spring are respectively fixed to the top of the connecting plate and the top of the third T-shaped guide rod.

[0014] Preferably, the side wall of the wafer conveying box is provided with a limiting mechanism for limiting the conical block, and the limiting mechanism includes a socket opened on the side wall of each conical block, and the side wall of the wafer conveying box is provided with a second moving mechanism, and the second moving mechanism is connected to a third moving plate, and the side wall of the third moving plate is fixedly connected with an insertion rod, and the end of the insertion rod away from the third moving plate passes through the wafer conveying box.

[0015] Preferably, the second moving mechanism includes two third rods fixedly connected to the side wall of the third moving plate, and a third sleeve is inserted in each third rod, the end of the third sleeve away from the third moving plate is fixed to the side wall of the wafer conveying box, and the side wall of the third sleeve is sleeved with a fifth spring, the two ends of the fifth spring are respectively fixed to the third moving plate and the side wall of the wafer conveying box, the side wall of the third moving plate is fixedly connected to a push plate, and the push plate includes a second inclined surface, the side wall of the sealing column is fixedly connected to an L-shaped push rod, and the end of the push rod away from the sealing column slides on the second inclined surface.

[0016] A clamping mechanism for centering the wafer is provided on the top of the hollow cover, and the clamping mechanism includes two symmetrically arranged arc plates slidably connected to the top of each hollow cover, and the side wall of each arc plate is fixedly connected to a rubber pad, the side wall of the wafer conveying box is fixedly connected to a plurality of L-shaped plates arranged in an array, and the side wall of each L-shaped plate is connected to a first movable plate through a first movable mechanism, the side wall of the first movable plate is connected to a second movable plate through a telescopic mechanism, and the side wall of the second movable plate is fixedly connected to two symmetrically arranged connecting rods, and the other end of the connecting rod is fixed to the side wall of the arc plate.

[0017] A wafer conveying method, using the wafer conveying device described above, comprises the following steps:

[0018] S1: When the wafer needs to be transferred, the wafer is placed on the top of the rubber suction cup. When the wafer contacts the top of the conical block, gravity can push the conical block downward. At the same time, the first spring is compressed to ensure that the wafer can fit the top plate of the rubber suction cup.

[0019] S2: Then, the electromagnet is energized to attract the iron block, so that the first movable plate moves in the direction close to the L-shaped plate, and at the same time, the second spring is compressed. When the first movable plate moves, the second movable plate and the connecting rod are driven to move through the telescopic mechanism, thereby driving the arc plate and the rubber pad to move. At the same time, the movable frame is driven to move through the second reset mechanism, and the second set of rods slides along the side wall of the second sleeve. When the rubber pad abuts against the side wall of the wafer, it can be automatically clamped in the center. When the wafer moves and adjusts on the top of the rubber suction cup, when it abuts against the side wall of the conical block, it can push the conical block to move downward, ensuring that the wafer can fit with the top plate of the rubber suction cup, thereby facilitating automatic centering clamping and limiting of wafers of different specifications and sizes, which is more stable and reliable, avoids shaking and collision during the transmission process, ensures the quality of the transmission, and has stronger applicability and is more convenient and quick to use.

[0020] S3: After the wafer is centered and clamped to a limit, the fan is started to perform an exhaust operation. At this time, the second movable plate no longer moves. When the first movable plate continues to move, the third spring is gradually compressed. At this time, the distance between the first movable plate and the second movable plate gradually becomes smaller. At the same time, the movable frame is driven to continue to move through the second reset mechanism, and the first inclined surface is abutted against the bottom of the second movable plate, so that the movable frame can be pushed to move downward. At the same time, the fourth spring is gradually compressed, and the sliding plate is driven to move downward through the second set of rods, the second set of tubes, the moving block and the L-shaped block, so that the through hole and the exhaust pipe gradually overlap. At the same time, when the moving block moves downward, the belt The movable push rod moves downward synchronously and abuts against the second inclined surface, so that the push plate can be pushed to move in the direction close to the wafer conveying box, and the third movable plate drives the insertion rod to move, and the insertion rod is inserted into the insertion hole of the side wall of the extended conical block, so that the extended conical block can be limited, and the sealing column is driven downward by the movable block to block and seal the vent hole. When the sliding plate abuts against the bottom of the fixed cover, the first movable plate cannot continue to move, so that the compression amount of the second spring can be controlled, and then the clamping force of the rubber pad on the wafer can be controlled, so as to ensure the clamping effect while avoiding damage to the wafer and ensuring the quality of the transmission;

[0021] S4: At this time, the hollow cover can be evacuated through the exhaust pipe, and the wafer can be adsorbed through the fixed pipe and the adsorption hole, so that the wafer is more stably and reliably limited, avoiding movement or even collision, and ensuring the quality of transmission. In addition, the conical block that is not under the wafer will be in an extended state and limited by the limiting mechanism. At this time, the adsorption hole is blocked and sealed by the sealing plate, so that the number of adsorption holes opened can be automatically adjusted according to the size of the wafer to ensure the adsorption effect.

[0022] S5: Moreover, when adsorption is performed, negative pressure is generated in the fixed tube. At this time, under the action of the negative pressure, the first T-shaped guide rod can slide into the hollow cover. At the same time, the reset spring is compressed, so that the proximity switch is separated from the end of the first T-shaped guide rod. When air leakage occurs at the rubber suction cup, the pressure in the fixed tube will increase. At this time, under the action of the reset spring, the first T-shaped guide rod moves toward the direction of the proximity switch and is detected by the proximity switch. At the same time, the indicator light on the proximity switch lights up, reminding the staff which rubber suction cup is leaking. Then, the on-off mechanism is closed, and the rubber suction cup is replaced after the wafer is removed to ensure the adsorption effect, avoid shaking and collision during the transmission process, and ensure the quality of transmission;

[0023] S6: Then, the wafer transfer box is clamped and fixed by the clamping module, and the wafer transfer box is moved into the vehicle body by the lifting module. Finally, the vehicle body is transferred on the guide rail by the moving module;

[0024] S7: When it is necessary to remove the conveyed wafer, the wafer conveyor box is lowered from the vehicle body through the lifting module, and then the electromagnet is powered off. The first movable plate can be moved and reset in the direction away from the L-shaped plate under the action of the second spring. At this time, under the action of the third spring, the first movable plate is gradually moved and reset in the direction away from the second movable plate. At the same time, under the action of the fourth spring, the movable frame can be driven to move upward and reset, and the sliding plate can be driven to move upward and reset, so that the through hole and the exhaust pipe are staggered. At this time, the exhaust pipe is blocked by the sliding plate. At the same time, the sealing column is driven to move upward and the vent is opened, so that the rubber suction cup is no longer in a negative pressure state. After the third spring is reset, when the first movable plate continues to move, the arc plate can be driven to move and reset through the connecting rod, thereby releasing the wafer.

[0025] Compared with the prior art, the present invention has the following beneficial effects:

[0026] The wafer conveying device and the wafer conveying method are provided with a clamping mechanism, etc., and when the wafer needs to be conveyed, the wafer is placed on the top of the rubber suction cup, and when the wafer contacts the top of the conical block, the conical block can be pushed downward by gravity, and at the same time, the first spring is compressed, thereby ensuring that the wafer can fit with the top plate of the rubber suction cup, and then, the electromagnet is energized to attract the iron block, so that the first moving plate moves in the direction close to the L-shaped plate, and at the same time, the second spring is compressed, and when the first moving plate moves, the second moving plate and the connecting rod are driven to move by the telescopic mechanism, thereby driving the arc plate and the rubber pad to move, At the same time, the moving frame is driven to move by the second resetting mechanism, and the second set of rods slides along the side wall of the second sleeve. When the rubber pad abuts against the side wall of the wafer, the third spring is gradually compressed, so that it can be automatically clamped in the center. When the wafer is moved and adjusted on the top of the rubber suction cup, when it abuts against the side wall of the conical block, it can push the conical block to move downward, ensuring that the wafer can fit with the top plate of the rubber suction cup, thereby facilitating automatic centering clamping and limiting of wafers of different specifications and sizes, which is more stable and reliable, avoids shaking and collision during transmission, ensures the quality of transmission, and has stronger applicability and is more convenient and quick to use.

[0027] The wafer conveying device and the wafer conveying method are provided with an adsorption mechanism, etc., and after the wafer is centered and clamped and limited, the fan is started to perform an exhaust operation. At this time, the second movable plate no longer moves. When the first movable plate continues to move, the third spring is gradually compressed. At this time, the distance between the first movable plate and the second movable plate gradually becomes smaller. At the same time, the movable frame is driven to continue to move through the second reset mechanism, and the first inclined surface is abutted against the bottom of the second movable plate, so that the movable frame can be pushed to move downward. At the same time, the fourth spring is gradually compressed, and the sliding plate is driven to move downward through the second set of rods, the second set of tubes, the moving block and the L-shaped block, so that the through hole and the exhaust pipe gradually overlap. At the same time, when the moving block moves downward, the pushing rod is driven to move downward synchronously and abut against the second inclined surface, so that the pushing plate can be pushed to move in the direction close to the wafer conveying box, and the insertion rod is driven to move through the third movable plate, and the insertion rod is inserted into the extended conical block When the sliding plate abuts against the bottom of the fixed cover, the first movable plate cannot move further, so that the compression amount of the second spring can be controlled, and then the clamping force of the rubber pad on the wafer can be controlled, so as to ensure the clamping effect while avoiding damage to the wafer, thereby ensuring the quality of transmission, and at this time, the air can be exhausted in the hollow cover through the exhaust pipe, and the wafer can be adsorbed through the fixed pipe and the adsorption hole, so that the limitation of the wafer is more stable and reliable, avoiding its movement or even collision, ensuring the quality of transmission, and the conical block not under the wafer will be in an extended state and limited by the limiting mechanism. At this time, the sealing plate is used to seal the adsorption hole, so that the number of adsorption holes opened can be automatically adjusted according to the size of the wafer to ensure the adsorption effect.

[0028] This wafer conveying device and wafer conveying method, by setting up a detection mechanism, etc., generates negative pressure in the fixed tube during adsorption. At this time, under the action of the negative pressure, the first T-shaped guide rod can slide into the hollow cover. At the same time, the reset spring is compressed, so that the proximity switch and the end of the first T-shaped guide rod are separated. When air leakage occurs at the rubber suction cup, the pressure in the fixed tube will increase. At this time, under the action of the reset spring, the first T-shaped guide rod moves in the direction close to the proximity switch and is detected by the proximity switch. At the same time, the indicator light on the proximity switch lights up, and the staff is reminded which rubber suction cup is leaking. Then, the on-off mechanism is closed, and the rubber suction cup is replaced after the wafer is removed, so as to ensure the adsorption effect, avoid shaking and collision during the transmission process, and ensure the quality of the transmission. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 It is a schematic diagram of the overall structure of the wafer transfer box in the present invention;

[0031] Figure 3 It is a schematic diagram of the positions of the first moving mechanism and the telescopic mechanism in the present invention;

[0032] Figure 4 It is a partial cross-sectional structural schematic diagram of the hollow cover in the present invention;

[0033] Figure 5 for Figure 1 A schematic diagram of the enlarged structure at A in the middle;

[0034] Figure 6 for Figure 2 A schematic diagram of the enlarged structure at B in the middle;

[0035] Figure 7 for Figure 3 Schematic diagram of the enlarged structure at C in the middle;

[0036] Figure 8 for Figure 3 Schematic diagram of the enlarged structure at D in the middle;

[0037] Fig. 9 for Figure 4 Schematic diagram of the enlarged structure at E in the middle;

[0038] Fig.10 for Figure 6 The enlarged structural diagram at F in the middle;

[0039] Fig.11 for Figure 7 Schematic diagram of the enlarged structure at G in the middle;

[0040] Fig.12 for Fig. 9 Schematic diagram of the enlarged structure at H in the middle.

[0041] In the figure: 1, crane body; 101, guide rail; 102, moving module; 103, vehicle body; 104, lifting module; 105, clamping module; 106, wafer transfer box; 201, U-shaped frame; 202, first T-shaped guide rod; 203, reset spring; 204, proximity switch; 301, fixed cover; 302, sliding plate; 303, through hole; 304, L-shaped block; 305, moving block; 306, vent hole; 307, sealing column; 401, second T-shaped guide rod; 402, electromagnet; 403, iron block; 404, second spring; 501, second sleeve; 502, second set of rods; 503, moving frame; 504, first inclined plane; 601, third T-shaped guide rod; 602, connecting plate; 603, fourth spring; 701, first set of rods; 702, first a sleeve; 703, a third spring; 801, a moving rod; 802, a connecting block; 803, a fixed plate; 804, a first spring; 901, a socket; 902, a third moving plate; 903, a plug rod; 1001, a third sleeve; 1002, a third sleeve rod; 1003, a fifth spring; 1004, a push plate; 1005, a second inclined plane; 1006, a push rod; 1101, a hollow cover; 1102, a fixing tube; 1103, a rubber suction cup; 1104, an adsorption hole; 1105, a conical block; 1106, a sealing plate; 1107, an exhaust pipe; 1108, a connecting pipe; 1109, a fan; 1201, an arc plate; 1202, a rubber pad; 1203, an L-shaped plate; 1204, a first moving plate; 1205, a second moving plate; 1206, a connecting rod. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] See also Figure 1-Figure 12 The present invention provides a technical solution: a wafer conveying device, including a guide rail 101, a moving module 102, a vehicle body 103, a lifting module 104, a clamping module 105 and a wafer conveying box 106 arranged on a crane body 1, wherein a plurality of adsorption mechanisms arranged in an array are arranged in the wafer conveying box 106, and the adsorption mechanisms are used to adsorb wafers placed in the wafer conveying box 106.

[0044] The adsorption mechanism includes two hollow covers 1101 fixedly connected to the inner wall of the wafer transfer box 106, the two hollow covers 1101 are arranged opposite to each other, and a plurality of adsorption heads arranged in an array are fixedly inserted on the top of each hollow cover 1101, and each adsorption head includes a fixed tube 1102 and a conical rubber suction cup 1103, the fixed tube 1102 is fixedly inserted on the top of the hollow cover 1101, and the rubber suction cup 1103 is threadedly connected to the top of the fixed tube 1102, and an adsorption hole 1104 is opened on the top of the rubber suction cup 1103, a first reset mechanism is arranged on the top of the fixed tube 1102, a sealing plate 1106 is connected to the first reset mechanism, and a conical block 1105 is inserted in the adsorption hole 1104, and the conical block 1105 and the top of the sealing plate 1106 are connected. The part is fixed, and a plurality of exhaust pipes 1107 arranged in an array are fixedly inserted on the side wall of the wafer conveying box 106, one end of the exhaust pipe 1107 in the wafer conveying box 106 is fixedly inserted in the hollow cover 1101, and the end of the exhaust pipe 1107 away from the wafer conveying box 106 is fixedly connected with a connecting pipe 1108, and the side wall of the connecting pipe 1108 is fixedly connected with a fan 1109; the wafer can be adsorbed by exhausting air through the rubber suction cup 1103, and at the same time, the number of the adsorption holes 1104 opened can be automatically adjusted according to the size of the wafer to ensure the adsorption effect, and the sealing of the rubber suction cup 1103 can be tested, so that the wafer transfer is more stable and reliable, avoiding shaking and collision during the transfer process, and ensuring the quality of the transfer.

[0045] The side wall of the fixed tube 1102 is provided with a detection mechanism for detecting the sealing of the rubber suction cup 1103, the detection mechanism includes a first T-shaped guide rod 202 inserted in the side wall of each fixed tube 1102, and the side wall of the first T-shaped guide rod 202 is sleeved with a reset spring 203, the two ends of the reset spring 203 are respectively fixed to the end of the first T-shaped guide rod 202 of the fixed tube 1102, the side wall of the fixed tube 1102 is fixedly connected with a U-shaped frame 201, and the side wall of the U-shaped frame 201 is fixedly connected with a proximity switch 204. When adsorption is performed, negative pressure is generated in the fixed tube 1102. At this time, under the action of the negative pressure, the first T-shaped guide rod 202 can slide into the hollow cover 1101, and at the same time , the reset spring 203 is compressed, so that the proximity switch 204 is separated from the end of the first T-shaped guide rod 202. When air leakage occurs at the rubber suction cup 1103, the pressure in the fixed tube 1102 will increase. At this time, under the action of the reset spring 203, the first T-shaped guide rod 202 moves toward the direction close to the proximity switch 204 and is detected by the proximity switch 204. At the same time, the indicator light on the proximity switch 204 lights up, reminding the staff which rubber suction cup 1103 is leaking. Then, the on-off mechanism 3 is closed, and the rubber suction cup 1103 is replaced after the wafer is removed to ensure the adsorption effect, avoid shaking and collision during the transmission process, and ensure the quality of transmission.

[0046] The first reset mechanism includes two fixed plates 803 fixedly connected to the inner wall of the fixed tube 1102, and a moving rod 801 is inserted at the top of each fixed plate 803, and a connecting block 802 is fixedly connected to the top of the moving rod 801, and the connecting block 802 is fixed to the side wall of the sealing plate 1106, and the side wall of the moving rod 801 is sleeved with a first spring 804, and the two ends of the first spring 804 are respectively fixed to the bottom of the connecting block 802 and the top of the fixed plate 803, so as to guide and reset the movement of the sealing plate 1106.

[0047] The side wall of each exhaust pipe 1107 is provided with an on-off mechanism, which includes a fixed cover 301 fixedly inserted in the side wall of the exhaust pipe 1107, and a sliding plate 302 is slidably connected in the fixed cover 301, and a through hole 303 is provided in the side wall of the sliding plate 302, and an L-shaped block 304 is fixedly connected to the side wall of the sliding plate 302, and a moving block 305 is fixedly connected to the bottom of the L-shaped block 304, and a sealing column 307 is fixedly connected to the bottom of the moving block 305, and a vent hole 306 is provided on the side wall of the exhaust pipe 1107, and a first pushing mechanism for pushing the sliding plate 302 to move is provided on the side wall of the first moving plate 1204. When the wafer needs to be transferred, the wafer is placed on the top of the rubber suction cup 1103. When the wafer is against the top of the conical block 1105, under the action of gravity, the conical block 1105 can be pushed downward. At the same time, the first spring 804 is compressed to ensure that the wafer can fit with the top plate of the rubber suction cup 1103. Then, the first moving plate 1204 is moved toward the direction close to the L-shaped plate 1203 through the first moving mechanism 4. When the first moving plate 1204 moves, the second moving plate 1205 and the connecting rod 1206 are driven to move through the telescopic mechanism 7, thereby driving the arc plate 1201 and the rubber pad 1202 to move. At the same time, the sliding plate 302 is pushed downward by the first pushing mechanism 5, so that the through hole 303 gradually overlaps with the exhaust pipe 1107.

[0048] The first moving mechanism includes two second T-shaped guide rods 401 inserted into the side walls of the L-shaped plate 1203, and the first moving plate 1204 is fixed to the ends of the second T-shaped guide rods 401, and the side walls of each second T-shaped guide rod 401 are sleeved with a second spring 404, and the two ends of the second spring 404 are respectively fixed to the side walls of the L-shaped plate 1203 and the first moving plate 1204, and the side walls of the L-shaped plate 1203 are fixedly connected with an electromagnet 402, and the side walls of the first moving plate 1204 are fixedly connected with an iron block 403, and the electromagnet 402 is energized to attract the iron block 403, so that the first moving plate 1204 moves toward the direction close to the L-shaped plate 1203, and at the same time, the second spring 404 is compressed.

[0049] The telescopic mechanism includes two first rods 701 fixedly connected to the side wall of the first movable plate 1204, and the side wall of each first rod 701 is sleeved with a first sleeve 702, the other end of the first sleeve 702 is fixed to the side wall of the second movable plate 1205, the side wall of the first sleeve 702 is sleeved with a third spring 703, and the two ends of the third spring 703 are respectively fixed to the side walls of the first movable plate 1204 and the second movable plate 1205. When the rubber pad 1202 is against the side wall of the wafer, when the first movable plate 1204 continues to move, the third spring 703 is gradually compressed.

[0050] The first pushing mechanism includes two second sleeves 501 fixedly connected to the side wall of the moving block 305, and each second sleeve 501 is inserted with a second sleeve rod 502, and the second sleeve rod 502 is fixedly connected to the end of the moving block 305 away from the moving block 305. The moving frame 503 includes a first inclined surface 504, and a second reset mechanism is arranged on the top of the moving frame 503. The first moving plate 1204 is connected to the second reset mechanism, and the first moving plate 1204 is against the top of the moving frame 503. After the wafer is centered and clamped, the second moving plate 1205 no longer moves. When a movable plate 1204 continues to move, the third spring 703 is gradually compressed. At this time, the distance between the first movable plate 1204 and the second movable plate 1205 gradually decreases. At the same time, the movable frame 503 is driven to continue to move through the second reset mechanism, and the first inclined surface 504 is abutted against the bottom of the second movable plate 1205, thereby pushing the movable frame 503 to move downward, and the sliding plate 302 is driven to move downward through the second sleeve rod 502, the second sleeve 501, the movable block 305 and the L-shaped block 304, so that the through hole 303 gradually overlaps with the exhaust pipe 1107.

[0051] The second reset mechanism includes two third T-shaped guide rods 601 fixedly connected to the top of the moving frame 503, and the side walls of the third T-shaped guide rods 601 are sleeved with connecting plates 602, and the connecting plates 602 are fixed to the side walls of the first moving plate 1204. The side walls of each third T-shaped guide rod 601 are sleeved with a fourth spring 603, and the two ends of the fourth spring 603 are respectively fixed to the top of the connecting plate 602 and the top of the third T-shaped guide rod 601, which guides and resets the movement of the moving frame 503.

[0052] The side wall of the wafer conveying box 106 is provided with a limiting mechanism for limiting the conical block 1105, and the limiting mechanism includes a socket 901 opened on the side wall of each conical block 1105, and the side wall of the wafer conveying box 106 is provided with a second moving mechanism, and the second moving mechanism is connected to a third moving plate 902, and the side wall of the third moving plate 902 is fixedly connected with an insertion rod 903, and the end of the insertion rod 903 away from the third moving plate 902 passes through the wafer conveying box 106. When the moving block 305 moves downward, the third moving plate 902 is pushed by the second moving mechanism to drive the insertion rod 903 to move, and the insertion rod 903 is inserted into the socket 901 on the side wall of the extended conical block 1105, so that the extended conical block 1105 can be limited, and the height of the insertion rod 903 is greater than the height after the wafer is placed.

[0053] The second moving mechanism includes two third sleeve rods 1002 fixedly connected to the side wall of the third moving plate 902, and each third sleeve rod 1002 is inserted with a third sleeve tube 1001, and one end of the third sleeve tube 1001 away from the third moving plate 902 is fixed to the side wall of the wafer transfer box 106, and the side wall of the third sleeve tube 1001 is sleeved with a fifth spring 1003, and the two ends of the fifth spring 1003 are respectively fixed to the third moving plate 902 and the side wall of the wafer transfer box 106, and the third moving plate 902 The side wall is fixedly connected with a push plate 1004, and the push plate 1004 includes a second inclined surface 1005. The side wall of the sealing column 307 is fixedly connected with an L-shaped push rod 1006, and the end of the push rod 1006 away from the sealing column 307 slides on the second inclined surface 1005. When the moving block 305 moves downward, the push rod 1006 is driven to move downward synchronously and resist against the second inclined surface 1005, thereby pushing the push plate 1004 to move in the direction close to the wafer transfer box 106.

[0054] A clamping mechanism for centering the wafer is provided on the top of the hollow cover 1101, and the clamping mechanism includes two symmetrically arranged arc plates 1201 slidably connected to the top of each hollow cover 1101, and the side wall of each arc plate 1201 is fixedly connected to a rubber pad 1202, and the side wall of the wafer conveying box 106 is fixedly connected to a plurality of L-shaped plates 1203 arranged in an array, and the side wall of each L-shaped plate 1203 is connected to a first movable plate 1204 through a first moving mechanism, and the side wall of the first movable plate 1204 is connected to a second movable plate 1205 through a telescopic mechanism, and the side wall of the second movable plate 1205 is fixedly connected to two symmetrically arranged connecting rods 1206, and the other end of the connecting rod 1206 is fixed to the side wall of the arc plate 1201, and the electromagnet 402 is energized to attract the iron block 403, so that the first movable plate 1204 moves toward the direction close to the L-shaped plate 1203, and at the same time, the second spring 40 4 is compressed. When the first movable plate 1204 moves, the telescopic mechanism 7 drives the second movable plate 1205 and the connecting rod 1206 to move, thereby driving the arc plate 1201 and the rubber pad 1202 to move. At the same time, the second reset mechanism drives the movable frame 503 to move, and the second sleeve rod 502 slides along the side wall of the second sleeve 501. When the rubber pad 1202 abuts against the side wall of the wafer, it can be automatically clamped in the center. When the wafer moves and adjusts on the top of the rubber suction cup 1103, when it abuts against the side wall of the tapered block 1105, it can push the tapered block 1105 to move downward, ensuring that the wafer can fit with the top plate of the rubber suction cup 1103, thereby facilitating the automatic centering clamping and limiting of wafers of different specifications and sizes, which is more stable and reliable, avoids shaking and collision during the transmission process, ensures the quality of the transmission, and has stronger applicability and is more convenient and quick to use.

[0055] A wafer conveying method, using the above-mentioned wafer conveying device, comprises the following steps:

[0056] S1: When the wafer needs to be transferred, the wafer is placed on the top of the rubber suction cup 1103. When the wafer is against the top of the conical block 1105, the conical block 1105 can be pushed downward under the action of gravity. At the same time, the first spring 804 is compressed to ensure that the wafer can fit with the top plate of the rubber suction cup 1103.

[0057] S2: Then, the electromagnet 402 is energized to attract the iron block 403, so that the first movable plate 1204 moves toward the direction close to the L-shaped plate 1203. At the same time, the second spring 404 is compressed. When the first movable plate 1204 moves, the second movable plate 1205 and the connecting rod 1206 are driven to move through the telescopic mechanism 7, thereby driving the arc plate 1201 and the rubber pad 1202 to move. At the same time, the second reset mechanism drives the movable frame 503 to move, and the second sleeve rod 502 moves along the second sleeve 501. The side wall slides, and when the rubber pad 1202 abuts against the side wall of the wafer, it can be automatically clamped in the center. When the wafer is moved and adjusted on the top of the rubber suction cup 1103, when it abuts against the side wall of the conical block 1105, it can push the conical block 1105 to move downward, ensuring that the wafer can fit with the top plate of the rubber suction cup 1103, thereby facilitating automatic centering clamping and limiting of wafers of different specifications and sizes, which is more stable and reliable, avoids shaking and collision during transportation, ensures the quality of transportation, and has stronger applicability and is more convenient and quick to use.

[0058] S3: After the wafer is centered and clamped, the fan 1109 is started to perform the exhaust operation. At this time, the second movable plate 1205 no longer moves. When the first movable plate 1204 continues to move, the third spring 703 is gradually compressed. At this time, the distance between the first movable plate 1204 and the second movable plate 1205 gradually decreases. At the same time, the second reset mechanism drives the movable frame 503 to continue to move, and makes the first inclined surface 504 abut against the bottom of the second movable plate 1205, so as to push the movable frame 503 to move downward. At the same time, the fourth spring 603 is gradually compressed, and the sliding plate 302 is driven to move downward through the second sleeve rod 502, the second sleeve tube 501, the moving block 305 and the L-shaped block 304, so that the through hole 303 gradually overlaps with the exhaust pipe 1107. At the same time, when the moving block 305 moves downward, The push rod 1006 is driven to move downward synchronously and abut against the second inclined surface 1005, so that the push plate 1004 can be pushed to move in the direction close to the wafer transfer box 106, and the insertion rod 903 is driven to move by the third movable plate 902, and the insertion rod 903 is inserted into the socket 901 on the side wall of the extended conical block 1105, so that the extended conical block 1105 can be limited, and the sealing column 307 is driven to move downward by the movable block 305 to block and seal the vent 306. When the sliding plate 302 abuts against the bottom of the fixed cover 301, the first movable plate 1204 cannot continue to move, so that the compression amount of the second spring 404 can be controlled, and then the clamping force of the rubber pad 1202 on the wafer can be controlled, thereby ensuring the clamping effect while avoiding damage to the wafer and ensuring the quality of the transmission.

[0059] S4: At this time, the hollow cover 1101 can be evacuated through the exhaust pipe 1107, and the wafer can be adsorbed through the fixed tube 1102 and the adsorption hole 1104, so that the limiting of the wafer is more stable and reliable, avoiding its movement or even collision, thereby ensuring the quality of transmission. In addition, the conical block 1105 that is not under the wafer will be in an extended state and limited by the limiting mechanism. At this time, the sealing plate 1106 is used to block and seal the adsorption hole 1104, so that the number of adsorption holes 1104 opened can be automatically adjusted according to the size of the wafer to ensure the adsorption effect.

[0060] S5: Moreover, during adsorption, negative pressure is generated in the fixed tube 1102. At this time, under the action of negative pressure, the first T-shaped guide rod 202 can slide into the hollow cover 1101. At the same time, the reset spring 203 is compressed, so that the proximity switch 204 is separated from the end of the first T-shaped guide rod 202. When air leakage occurs at the rubber suction cup 1103, the pressure in the fixed tube 1102 will increase. At this time, under the action of the reset spring 203, the first T-shaped guide rod 202 moves toward the direction of the proximity switch 204 and is detected by the proximity switch 204. At the same time, the indicator light on the proximity switch 204 lights up, reminding the staff which rubber suction cup 1103 is leaking. Then, the on-off mechanism 3 is closed, and the rubber suction cup 1103 is replaced after the wafer is removed to ensure the adsorption effect, avoid shaking and collision during the transmission process, and ensure the quality of the transmission.

[0061] S6: Then, the wafer transfer box 106 is clamped and fixed by the clamping module 105 , and the wafer transfer box 106 is moved into the vehicle body 103 by the lifting module 104 . Finally, the vehicle body 103 is transferred on the guide rail 101 by the moving module 102 .

[0062] S7: When it is necessary to remove the transferred wafer, the wafer transfer box 106 is lowered from the vehicle body 103 through the lifting module 104, and then the electromagnet 402 is powered off. The first movable plate 1204 can be reset in the direction away from the L-shaped plate 1203 under the action of the second spring 404. At this time, under the action of the third spring 703, the first movable plate 1204 is gradually reset in the direction away from the second movable plate 1205. At the same time, under the action of the fourth spring 603, the movable frame 503 can be driven to The rubber suction cup 1103 is no longer in a negative pressure state. After the third spring 703 is reset, when the first moving plate 1204 continues to move, the arc plate 1201 can be driven by the connecting rod 1206 to move and reset, thereby releasing the wafer.

Claims

1. A wafer transfer device, comprising a guide rail (101) arranged on a crane body (1), a moving module (102), a vehicle body (103), a lifting module (104), a clamping module (105) and a wafer transfer box (106), characterized in that: A plurality of adsorption mechanisms arranged in an array are arranged in the wafer transport box (106), and the adsorption mechanisms are used to adsorb wafers placed in the wafer transport box (106); The adsorption mechanism comprises two hollow covers (1101) fixedly connected to the inner wall of the wafer transfer box (106), the two hollow covers (1101) are arranged opposite to each other, and a plurality of adsorption heads arranged in an array are fixedly inserted on the top of each hollow cover (1101), each adsorption head comprises a fixed tube (1102) and a conical rubber suction cup (1103), the fixed tube (1102) is fixedly inserted on the top of the hollow cover (1101), and the rubber suction cup (1103) is threadedly connected to the top of the fixed tube (1102), and an adsorption hole (1104) is opened on the top of the rubber suction cup (1103), and a top of the fixed tube (1102) is arranged There is a first reset mechanism, which is connected to a sealing plate (1106), and a conical block (1105) is inserted into the adsorption hole (1104), the conical block (1105) is fixed to the top of the sealing plate (1106), and a plurality of exhaust pipes (1107) arranged in an array are fixedly inserted into the side wall of the wafer conveying box (106), one end of the exhaust pipe (1107) in the wafer conveying box (106) is fixedly inserted in the hollow cover (1101), and the end of the exhaust pipe (1107) away from the wafer conveying box (106) is fixedly connected to a connecting pipe (1108), and the side wall of the connecting pipe (1108) is fixedly connected to a fan (1109).

2. A wafer conveying device according to claim 1, characterized in that: The side wall of the fixed tube (1102) is provided with a detection mechanism for detecting the sealing performance of the rubber suction cup (1103), the detection mechanism comprising a first T-shaped guide rod (202) inserted into the side wall of each fixed tube (1102), and the side wall of the first T-shaped guide rod (202) is sleeved with a return spring (203), the two ends of the return spring (203) are respectively fixed to the fixed tube (1102) and the end of the first T-shaped guide rod (202), the side wall of the fixed tube (1102) is fixedly connected to a U-shaped frame (201), and a proximity switch (204) is fixedly connected to the side wall of the U-shaped frame (201) at a position corresponding to the end of the first T-shaped guide rod (202).

3. The wafer conveying device according to claim 1, characterized in that: A clamping mechanism for centering the wafer is arranged on the top of the hollow cover (1101), and the clamping mechanism comprises two symmetrically arranged arc plates (1201) slidably connected to the top of each hollow cover (1101), and the side wall of each arc plate (1201) is fixedly connected to a rubber pad (1202), the side wall of the wafer transfer box (106) is fixedly connected to a plurality of L-shaped plates (1203) arranged in an array, and the side wall of each L-shaped plate (1203) is connected to a first movable plate (1204) via a first movable mechanism, the side wall of the first movable plate (1204) is connected to a second movable plate (1205) via a telescopic mechanism, and the side wall of the second movable plate (1205) is fixedly connected to two symmetrically arranged connecting rods (1206), and the other end of the connecting rod (1206) is fixed to the side wall of the arc plate (1201).

4. The wafer conveying device according to claim 1, characterized in that: The first reset mechanism comprises two fixed plates (803) fixedly connected to the inner wall of the fixed tube (1102), and a movable rod (801) is inserted at the top of each fixed plate (803), and a connecting block (802) is fixedly connected to the top of the movable rod (801), and the connecting block (802) is fixed to the side wall of the sealing plate (1106), and a first spring (804) is sleeved on the side wall of the movable rod (801), and the two ends of the first spring (804) are respectively fixed to the bottom of the connecting block (802) and the top of the fixed plate (803).

5. The wafer conveying device according to claim 3, characterized in that: The side wall of each of the exhaust pipes (1107) is provided with an on-off mechanism, the on-off mechanism comprising a fixed cover (301) fixedly inserted in the side wall of the exhaust pipe (1107), and a sliding plate (302) slidably connected in the fixed cover (301), a through hole (303) being provided on the side wall of the sliding plate (302), and an L-shaped block (304) being fixedly connected to the side wall of the sliding plate (302), a moving block (305) being fixedly connected to the bottom of the L-shaped block (304), a sealing column (307) being fixedly connected to the bottom of the moving block (305), and a ventilation hole (306) being provided on the side wall of the exhaust pipe (1107), and a first pushing mechanism for pushing the sliding plate (302) to move is provided on the side wall of the first moving plate (1204).

6. The wafer conveying device according to claim 3, characterized in that: The first moving mechanism comprises two second T-shaped guide rods (401) inserted into the side wall of the L-shaped plate (1203), and the first moving plate (1204) is fixed to the end of the second T-shaped guide rod (401), and the side wall of each second T-shaped guide rod (401) is sleeved with a second spring (404), and the two ends of the second spring (404) are respectively fixed to the side wall of the L-shaped plate (1203) and the first moving plate (1204), the side wall of the L-shaped plate (1203) is fixedly connected to an electromagnet (402), and an iron block (403) is fixedly connected to the side wall of the first moving plate (1204) at a position corresponding to the electromagnet (402).

7. The wafer conveying device according to claim 5, characterized in that: The first pushing mechanism comprises two second sleeves (501) fixedly connected to the side wall of the moving block (305), and a second sleeve rod (502) is inserted into each second sleeve (501), one end of the second sleeve rod (502) away from the moving block (305) is fixedly connected to a moving frame (503), and the moving frame (503) comprises a first inclined surface (504), a second reset mechanism is arranged on the top of the moving frame (503), the first moving plate (1204) is connected to the second reset mechanism, and the first moving plate (1204) abuts against the top of the moving frame (503).

8. The wafer conveying device according to claim 7, characterized in that: The second reset mechanism comprises two third T-shaped guide rods (601) fixedly connected to the top of the moving frame (503), and the side walls of the third T-shaped guide rods (601) are sleeved with connecting plates (602), and the connecting plates (602) are fixed to the side walls of the first moving plate (1204), and the side walls of each of the third T-shaped guide rods (601) are sleeved with a fourth spring (603), and the two ends of the fourth spring (603) are respectively fixed to the top of the connecting plate (602) and the top of the third T-shaped guide rod (601).

9. The wafer conveying device according to claim 5, characterized in that: The side wall of the wafer conveying box (106) is provided with a limiting mechanism for limiting the conical block (1105), and the limiting mechanism includes a socket (901) opened on the side wall of each conical block (1105); the side wall of the wafer conveying box (106) is provided with a second moving mechanism, and the second moving mechanism is connected to a third moving plate (902); the side wall of the third moving plate (902) is fixedly connected with an insertion rod (903), and the end of the insertion rod (903) away from the third moving plate (902) passes through the wafer conveying box (106).

10. The wafer conveying device according to claim 9, characterized in that: The second moving mechanism comprises two third rods (1002) fixedly connected to the side wall of the third moving plate (902), and each third rod (1002) is inserted with a third sleeve (1001), one end of the third sleeve (1001) away from the third moving plate (902) is fixed to the side wall of the wafer transfer box (106), and the side wall of the third sleeve (1001) is sleeved with a fifth spring (1003), the two ends of the fifth spring (1003) are respectively fixed to the side wall of the third moving plate (902) and the wafer transfer box (106), the side wall of the third moving plate (902) is fixedly connected with a push plate (1004), and the push plate (1004) includes a second inclined surface (1005), the side wall of the sealing column (307) is fixedly connected with an L-shaped push rod (1006), and the end of the push rod (1006) away from the sealing column (307) slides on the second inclined surface (1005).

11. The wafer conveying device according to claim 3, characterized in that: The telescopic mechanism comprises two first rods (701) fixedly connected to the side wall of the first movable plate (1204), and the side wall of each first rod (701) is sleeved with a first sleeve (702), the first sleeve (702) is fixed to the side wall of the second movable plate (1205), the side wall of the first sleeve (702) is sleeved with a third spring (703), and the two ends of the third spring (703) are respectively fixed to the side walls of the first movable plate (1204) and the second movable plate (1205).

12. A wafer conveying method, using the wafer conveying device according to claim 1, characterized in that: The following steps are involved: S1: When the wafer needs to be transferred, the wafer is placed on the top of the rubber suction cup (1103). When the wafer contacts the top of the conical block (1105), the conical block (1105) is pushed downward by gravity to make the wafer fit the top plate of the rubber suction cup (1103). S2: Next, the fan (1109) is started to perform an exhaust operation. At this time, the hollow cover (1101) can be exhausted through the exhaust pipe (1107), and the wafer can be adsorbed through the fixed pipe (1102) and the adsorption hole (1104); S3: Furthermore, the conical block (1105) that is not under the wafer is in an extended state. At this time, the adsorption hole (1104) is blocked and sealed by using the sealing plate (1106); S4: Then, the wafer transfer box (106) is clamped and fixed by the clamping module (105), and the wafer transfer box (106) is moved into the vehicle body (103) by the lifting module (104). Finally, the vehicle body (103) is transferred on the guide rail (101) by the moving module (102); S5: When the transferred wafer needs to be removed, the wafer transfer box (106) is lowered from the vehicle body (103) through the lifting module (104), so that the rubber suction cup (1103) is no longer in a negative pressure state.

Images