A solder ball separation device for soldering

Abstract

The present invention relates to the field of welding technology, and specifically to a tin ball separation device for soft soldering. It comprises a separation mechanism mounting plate, a lower cover plate is fixedly and sealedly mounted on the bottom surface of the separation mechanism mounting plate, a turntable is rotatably connected between the lower cover plate and the separation mechanism mounting plate, a tin ball conveying hole is provided on the turntable, a ball storage tank is provided on the separation mechanism mounting plate corresponding to the tin ball conveying hole, tin balls are stored inside the ball storage tank, a tin ball drop hole is provided on the lower cover plate corresponding to the tin ball conveying hole, a drive assembly is connected to the turntable transmission, and an adsorption mechanism is provided on the turntable corresponding to the tin ball drop hole. In the present application, when the turntable transfers the tin balls from the ball storage tank to the tin ball drop hole one by one through the tin ball conveying hole, the adsorption mechanism will adsorb the tin balls, so as to prevent the tin balls from rubbing and wearing against the side walls of the lower cover plate and the tin ball conveying hole, thereby facilitating the efficiency and effect of soft soldering.

Description

Technical Field

[0001] The invention relates to the technical field of welding, and in particular to a tin ball separation device used for soft soldering. Background Art

[0002] Microelectronic welding technology mainly refers to the connection technology in the miniaturization design and manufacturing process of electronic components and circuits. Microelectronic welding technology has two purposes when connecting two materials. One is to obtain good conductivity, and the other is to obtain lasting and reliable mechanical connection strength. Soft soldering technology is mainly used in microelectronic welding technology. In the fields of electronic manufacturing and precision machining, soft soldering is a commonly used connection technology.

[0003] As electronic products are increasingly developing towards miniaturization, high density and high performance, in order to achieve stable and reliable welding with miniaturized pads, we have proposed a laser heating soft soldering equipment. The welding material used in this equipment is spherical solder, that is, solder balls. When the solder balls are separated and transported to the laser focus, it is inevitable that friction will occur between the solder balls and the transport mechanism, resulting in wear.

[0004] The wear of the solder ball may cause its shape to be irregular. The irregular solder ball surface may make the laser energy distribution uneven, thus affecting the focusing and absorption of the laser energy and reducing the precision and quality of welding. It may also cause the oxide layer on the solder ball surface to thicken, which will hinder the good combination between the solder ball and the material to be welded and reduce the welding strength. It may also change the design size of the solder ball, causing the solder ball to be ejected before it is melted, thus affecting the efficiency and effect of soft soldering.

[0005] Therefore, in order to ensure the efficiency and effect of soft soldering, how to avoid friction and wear between the solder ball and the conveying mechanism is a problem that technical personnel in this field need to solve urgently. Summary of the invention

[0006] In order to accurately separate the solder balls and transport them to the focal point under the focusing lens, the present application provides a solder ball separation device for soft soldering.

[0007] The present application provides a tin ball separation device for soft soldering, which adopts the following technical solution: it includes a separation mechanism mounting plate, a lower cover plate is fixedly and sealingly installed on the bottom surface of the separation mechanism mounting plate, a turntable is rotatably connected between the lower cover plate and the separation mechanism mounting plate, a tin ball conveying hole is opened on the turntable, a ball storage groove is opened on the separation mechanism mounting plate corresponding to the tin ball conveying hole, tin balls are stored in the ball storage groove, a tin ball dropping hole is opened on the lower cover plate corresponding to the tin ball conveying hole, a nozzle assembly is fixedly installed on the bottom surface of the lower cover plate, the nozzle assembly is connected to the tin ball dropping hole, the turntable is transmission-connected with a drive assembly, and an adsorption mechanism is provided on the turntable corresponding to the tin ball dropping hole.

[0008] By adopting the above technical solution, the driving component can be used to rotate the turntable, and the turntable will drive the solder ball delivery hole to circulate between the ball storage tank and the solder ball dropping hole during the rotation process. When the solder ball delivery hole passes through the ball storage tank, the numerous solder balls stored inside the ball storage tank will fall into the solder ball delivery hole one by one. When the solder ball delivery hole passes through the solder ball dropping hole, the solder balls in the solder ball delivery hole will fall into the solder ball dropping hole. In the process of the turntable transferring the solder balls from the ball storage tank to the solder ball dropping hole one by one through the solder ball delivery hole, the adsorption mechanism will adsorb the solder balls, which can prevent the solder balls from rubbing and wearing against the lower cover plate and the side walls of the solder ball delivery hole, thereby ensuring the efficiency and effect of soft soldering.

[0009] Furthermore, the nozzle assembly includes a nozzle base, which is fixedly connected to the bottom surface of the lower cover plate, and a nozzle is detachably connected to the nozzle base. A laser channel is provided on the nozzle base, and a solder ball sliding channel is provided on the nozzle base corresponding to the solder ball falling hole. The solder ball sliding channel is connected to the laser channel, and the laser channel is coaxially connected to the nozzle.

[0010] Furthermore, the driving assembly includes a rotating motor, a rotating shaft mounting hole is opened on the separation mechanism mounting plate, a rotating shaft is sealed and rotatably connected inside the rotating shaft mounting hole, and the rotating shaft is transmission-connected to the rotating motor via a first coupling.

[0011] Furthermore, an air inlet hole is opened on the separation mechanism mounting plate, and a gas connector is fixedly and sealedly installed on the separation mechanism mounting plate corresponding to the air inlet hole. The end of the gas connector away from the separation mechanism mounting plate is connected to a pressure gauge, a proportional valve, a solenoid valve, an oil mist separator, and a gas source in sequence.

[0012] Furthermore, a ball storage bin is fixedly installed on the separation mechanism mounting plate corresponding to the ball storage groove, the interior of the ball storage bin is filled with tin balls, the ball storage bin is sealed and connected to the ball storage groove, and a bin cover is sealed and connected to one end of the ball storage bin away from the separation mechanism mounting plate.

[0013] Furthermore, the adsorption mechanism includes a tin ball adsorption hole, which is opened inside the turntable and connected to the tin ball delivery hole. The end of the tin ball adsorption hole away from the tin ball delivery hole passes through the lower surface of the turntable, and an arc-shaped air guide groove is opened on the upper surface of the lower cover plate corresponding to the tin ball adsorption hole. An air guide hole passing through the lower cover plate is opened inside the arc-shaped air guide groove, and an air suction component is fixedly connected to the lower surface of the lower cover plate, and the air suction component is sealed and connected to the air guide hole.

[0014] Furthermore, the upper surface of the lower cover plate is sealingly and slidably connected to the lower surface of the turntable, and the upper surface of the turntable is sealingly and slidably connected to the lower surface of the separation mechanism mounting plate.

[0015] Furthermore, one end of the arc-shaped air guiding groove starts at a position corresponding to the ball storage groove, and the other end of the arc-shaped air guiding groove ends at a position corresponding to the solder ball falling hole.

[0016] Furthermore, the air intake assembly includes a mounting shell fixedly connected to the lower surface of the lower cover plate, an exhaust rack is fixedly installed inside the mounting shell, an exhaust motor is fixedly connected to the exhaust rack, exhaust fan blades are installed on the exhaust motor, an air guide hood is fixedly and sealedly connected to the upper part of the exhaust fan blades inside the mounting shell, and the top of the air guide hood is sealed and connected to the air guide hole.

[0017] Furthermore, the diameter of the solder ball adsorption hole is smaller than the diameter of the solder ball.

[0018] Beneficial effects achieved:

[0019] The present application utilizes a driving component to rotate the turntable, and the turntable will drive the solder ball delivery hole to circulate between the ball storage tank and the solder ball dropping hole during the rotation process. When the solder ball delivery hole passes through the ball storage tank, the numerous solder balls stored inside the ball storage tank will fall into the solder ball delivery hole one by one. When the solder ball delivery hole passes through the solder ball dropping hole, the solder balls in the solder ball delivery hole will fall into the solder ball dropping hole. In the process of the turntable transferring the solder balls from the ball storage tank to the solder ball dropping hole one by one through the solder ball delivery hole, the adsorption mechanism will adsorb the solder balls, which can prevent the solder balls from rubbing and wearing against the lower cover plate and the side walls of the solder ball delivery hole, thereby ensuring the efficiency and effect of soft soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0021] Figure 2 It is a schematic diagram of the structural decomposition of an embodiment of the present application.

[0022] Figure 3 It is a schematic diagram of the installation structure of a separation mechanism mounting plate according to an embodiment of the present application.

[0023] Figure 4 It is a schematic diagram of the installation structure of the lower cover plate of an embodiment of the present application.

[0024] Figure 5 It is a schematic diagram of the installation structure of a turntable according to an embodiment of the present application.

[0025] Figure 6 It is a schematic diagram of the installation structure of a nozzle according to an embodiment of the present application.

[0026] Figure 7 It is a schematic diagram of the internal structure of an embodiment of the present application.

[0027] Figure 8 It is a schematic structural diagram of an air intake assembly according to an embodiment of the present application.

[0028] Description of the accompanying drawings: 1101, bin cover; 1102, ball storage bin; 1103, ball storage tank; 1104, upper component laser through hole; 1106, air inlet hole; 1107, gas connector; 1108, first detection hole; 1109, shaft mounting hole; 1112, optical fiber sensor receiving end; 1114, separation mechanism mounting plate; 1201, annular pad; 1204, lower cover plate; 1205, solder ball drop hole; 1206, lower component laser through hole; 1207, second detection hole; 1210, solder ball runway; 1211, optical fiber sensor transmitting end; 1212, exhaust pipe; 1301, rotating motor; 1302, first coupling; 130 3. Rotating shaft; 1304. Turntable; 1308. Turntable detection hole; 1309. Solder ball conveying hole; 1310. Solder ball adsorption hole; 1311. Arc-shaped air guide groove; 1312. Air guide hole; 140. Nozzle assembly; 1401. Nozzle base; 1403. Nozzle nut; 1404. Nozzle; 1405. Laser channel; 1407. Solder ball sliding channel; 1406. Air intake channel; 150. Air suction assembly; 1501. Mounting shell; 1502. Exhaust net; 1503. Exhaust frame; 1504. Exhaust motor; 1505. Exhaust fan blade; 1506. Air guide cover; 200. Optical path system; 210. Protective mirror; 211. Protective mirror frame. DETAILED DESCRIPTION

[0029] The following is combined with Figure 1-8This application is described in further detail.

[0030] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0031] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] The embodiment of the present application discloses a solder ball separation device for soft soldering.

[0033] Please refer to Figure 1 and Figure 2 In one embodiment of the present application, a solder ball separation device for soft soldering includes a separation mechanism mounting plate 1114, the separation mechanism mounting plate 1114 is provided with an upper component laser through hole 1104, a protective mirror frame 211 is sealed and installed at a position corresponding to the upper component laser through hole 1104 on the separation mechanism mounting plate 1114, a protective mirror 210 is sealed and installed inside the protective mirror frame 211, and an optical path system 200 is arranged on the upper end of the protective mirror frame 211, and the optical path system 200 can transmit the light beam emitted by the laser to the upper component laser through hole 1104 through the protective mirror 210.

[0034] Please refer to Figure 2 and Figure 3 In a specific embodiment of the present application, the protective lens frame 211 is arranged in a cylindrical shape, and the protective lens frame 211 is arranged in a cylindrical shape to reduce dust from falling on the lens surface of the protective lens 210. The protective lens 210 is configured as a flat lens, and its upper and lower surfaces are coated with anti-reflection films for the wavelength of the laser used to increase the transmittance of the laser and reduce the laser loss. During operation, the protective lens 210 can allow the laser beam to pass through the protective lens with low loss into the interior of the solder ball separation device, while preventing dust from entering the interior of the solder ball separation device. The protective lens 210 is contaminated and can be easily disassembled and replaced.

[0035] Please refer to Figure 2 and Figure 3 In one embodiment of the present application, a ball storage tank 1103 is provided on the separation mechanism mounting plate 1114, and a ball storage bin 1102 is fixedly installed on the separation mechanism mounting plate 1114 corresponding to the ball storage tank 1103, and the ball storage bin 1102 is sealed and connected to the ball storage tank 1103, and the end of the ball storage bin 1102 away from the separation mechanism mounting plate 1114 is sealed and connected to the bin cover 1101. The ball storage bin 1102 is filled with tin balls, which refer to spherical solders, and its composition can be various, including lead-containing tin balls, lead-free tin balls, etc. Common solder compositions include: Au80Sn20, Sn3Ag, Sn3Ag0.5Cu, Sn9Zn, Sn63Pb37, etc. The diameter of the tin ball is between 50um-2000um, and the diameter tolerance of the ball is controlled within ±1~3% (depending on the different tolerances of balls with different diameters), so that the ball volume tolerance is controlled within ±3~9%. The solder ball does not contain flux (brazing agent), so the method of the present invention does not cause pollution caused by the splashing of the solder flux during the heating process, and does not require the solder flux cleaning process and equipment after welding. The solder ball is a common material in the semiconductor packaging and electronic assembly industries and can be easily obtained.

[0036] Please refer to Figure 2 and Figure 3 In one embodiment of the present application, an air inlet hole 1106 is provided on the separation mechanism mounting plate 1114, and a gas connector 1107 is fixedly and sealedly installed on the separation mechanism mounting plate 1114 corresponding to the air inlet hole 1106. The end of the gas connector 1107 away from the separation mechanism mounting plate 1114 is connected in sequence with a pressure gauge, a proportional valve, a solenoid valve, an oil mist separator, and a gas source. The gas source uses high-purity inert gas, and the types of inert gas can be argon, nitrogen, carbon dioxide gas, etc., and the purity of the gas is more than 99%. The oil mist separator can remove impurities such as oil, water, and foreign matter in the gas. The solenoid valve controls the opening and closing of the valve according to the electrical signal, thereby realizing the on and off of the gas. The electrical proportional valve is a device that adjusts the gas pressure according to the size of the control signal; the electrical proportional valve can control the gas pressure through the electrical signal, can realize continuous and stepless regulation of the gas pressure, can realize remote control and program control, and its characteristics are that the output changes with the input (current value or voltage value), and there is a certain proportional relationship between the output and the input. The function of the pressure gauge is to display the input gas pressure in digital form, so that people can easily see the value of the gas pressure. The differential pressure sensor can detect the input gas pressure in real time and compare it with the atmospheric pressure. The difference is output in the form of current and voltage, thus realizing the real-time detection of the difference between the input gas pressure and the atmospheric pressure.

[0037] Please refer to Figure 2 and Figure 3In one embodiment of the present application, a first detection hole 1108 is opened on the separation mechanism mounting plate 1114 , and a fiber optic sensor receiving end 1112 is fixedly and sealedly installed on the separation mechanism mounting plate 1114 corresponding to the first detection hole 1108 .

[0038] Please refer to Figure 2 and Figure 4 In one embodiment of the present application, a lower cover plate 1204 is fixedly connected to the bottom surface of the separation mechanism mounting plate 1114, and an annular pad 1201 is sealed between the lower cover plate 1204 and the separation mechanism mounting plate 1114. A lower component laser through hole 1206 is provided on the lower cover plate 1204 corresponding to the upper component laser through hole 1104. A second detection hole 1207 is provided on the lower cover plate 1204 corresponding to the first detection hole 1108, and an optical fiber sensor transmitting end 1211 is fixedly and sealedly installed inside the second detection hole 1207. A solder ball runway 1210 is provided on the lower cover plate 1204 corresponding to the ball storage bin 1102, and a solder ball drop hole 1205 is provided on the solder ball runway 1210. An exhaust pipe 1212 connected to the lower component laser through hole 1206 is installed on the side of the lower cover plate 1204. The end of the exhaust pipe 1212 away from the lower cover plate 1204 is connected to a pressure difference sensor. The pressure difference sensor is connected to a control program, and the control program is connected to the laser control.

[0039] Please refer to Figure 2 and Figure 4 In one embodiment of the present application, the first detection hole 1108 is coaxially arranged with the second detection hole 1207 so that the optical fiber sensor receiving end 1112 can receive the light beam energy of the optical fiber sensor transmitting end 1211. Therefore, in other embodiments of the present application, the optical fiber sensor receiving end 1112 can also be installed in the second detection hole 1207, and the optical fiber sensor transmitting end 1211 can be correspondingly installed inside the first detection hole 1108.

[0040] Please refer to Figure 2 and Figure 5In one embodiment of the present application, a shaft mounting hole 1109 is opened on the separation mechanism mounting plate 1114, and a shaft 1303 is sealed and rotatably connected inside the shaft mounting hole 1109. A first coupling 1302 is fixedly installed at one end of the shaft 1303 located outside the separation mechanism mounting plate 1114, and a rotating motor 1301 is transmission-connected to one end of the first coupling 1302 away from the rotating shaft 1303. The rotating motor 1301 is connected to a rotation control program, and the rotation control program is connected to the optical fiber sensor transmitting end 1211 and the optical fiber sensor receiving end 1112. One end of the rotating shaft 1303 located inside the separation mechanism mounting plate 1114 is fixedly connected to a turntable 1304. The turntable 1304 is rotatably installed between the lower cover plate 1204 and the separation mechanism mounting plate 1114 and located inside the annular pad 1201. A tin ball conveying hole 1309 is opened on the turntable 1304 corresponding to the tin ball runway 1210. A turntable detection hole 1308 is opened on the turntable 1304 corresponding to the tin ball conveying hole 1309. The turntable detection hole 1308 and the tin ball conveying hole 1309 are both evenly distributed in a ring shape, and the turntable detection hole 1308 is correspondingly located between the first detection hole 1108 and the second detection hole 1207.

[0041] Please refer to Figure 2 and Figure 6 In one embodiment of the present application, a nozzle base 1401 is fixedly installed on the bottom surface of the lower cover plate 1204, and the nozzle 1404 is detachably connected to the nozzle base 1401. The nozzle 1404 is detachably installed on the nozzle base 1401 through a nozzle nut 1403. A laser channel 1405 sealed and connected to the laser through hole 1206 of the lower component is opened on the nozzle base 1401. The laser channel 1405 is coaxially connected to the nozzle 1404. A tin ball sliding channel 1407 is opened on the nozzle base 1401 corresponding to the tin ball falling hole 1205, and the tin ball sliding channel 1407 is connected to the laser channel 1405. An air inlet channel 1406 is opened on the nozzle base 1401 corresponding to the air inlet hole 1106, and the air inlet channel 1406 is connected to the laser channel 1405.

[0042] Please refer to Figure 2 and Figure 7In one embodiment of the present application, a tin ball adsorption hole 1310 connected to the tin ball delivery hole 1309 is opened inside the turntable 1304, the aperture of the tin ball adsorption hole 1310 is smaller than the diameter of the tin ball, and the end of the tin ball adsorption hole 1310 away from the tin ball delivery hole 1309 passes through the lower surface of the turntable 1304, the upper surface of the lower cover plate 1204 is sealed and slidably connected to the lower surface of the turntable 1304, and the upper surface of the turntable 1304 is sealed and slidably connected to the lower surface of the separation mechanism mounting plate 1114, and the lower cover plate 1114 is sealed and slidably connected to the lower surface of the separation mechanism mounting plate 1114. An arc-shaped air guide groove 1311 is provided on the upper surface of 204 corresponding to the solder ball adsorption hole 1310, one end of the arc-shaped air guide groove 1311 starts at a position corresponding to the ball storage groove 1103, and the other end of the arc-shaped air guide groove 1311 ends at a position corresponding to the solder ball falling hole 1205, and an air guide hole 1312 penetrating the lower cover plate 1204 is provided inside the arc-shaped air guide groove 1311, and an air suction component 150 is fixedly connected to the lower surface of the lower cover plate 1204, and the air suction component 150 is sealed and connected to the air guide hole 1312.

[0043] Please refer to Figure 7 and Figure 8 In one embodiment of the present application, the air intake component 150 includes a mounting shell 1501, which is fixedly mounted on the lower surface of the lower cover plate 1204 by means of a flange structure and screw-locked. The bottom of the mounting shell 1501 is fixedly connected with an exhaust net 1502, and the interior of the mounting shell 1501 is fixedly installed with an exhaust frame 1503, and the exhaust frame 1503 is fixedly connected with an exhaust motor 1504, and the exhaust motor 1504 is installed with an exhaust fan blade 1505. The interior of the mounting shell 1501 is located on the upper part of the exhaust fan blade 1505 and is fixedly and sealedly connected with an air guide cover 1506, and the top of the air guide cover 1506 is sealed and connected with the air guide hole 1312. The exhaust motor 1504 can drive the exhaust fan blades 1505 to rotate. When the exhaust fan blades 1505 rotate, the gas inside the air guide cover 1506 and the air guide hole 1312 will be discharged from the exhaust net 1502, and a negative pressure will be formed inside the air guide hole 1312, the arc-shaped air guide groove 1311 and the solder ball adsorption hole 1310, and then the solder balls falling into the solder ball delivery hole 1309 will be adsorbed at the intersection of the solder ball adsorption hole 1310 and the solder ball delivery hole 1309, thereby preventing the solder balls from rubbing against the upper surface of the lower cover plate 1204 and causing wear.

[0044] The implementation principle of a solder ball separation device for soldering in the embodiment of the present application is as follows:

[0045] During operation, solder balls are first poured into the ball storage bin 1102 and accumulated in the ball storage tank 1103. Before the solder balls enter the ball storage tank 1103, the solder ball delivery holes 1309 below the ball storage tank 1103 are all empty. When the solder balls enter the ball storage tank 1103 and accumulate in the ball storage tank 1103, the solder balls just fall into the several solder ball delivery holes 1309 below the ball storage tank 1103.

[0046] After the solder ball falls into the solder ball delivery hole 1309, the suction component 150 is started to adsorb the solder ball at the intersection of the solder ball adsorption hole 1310 and the solder ball delivery hole 1309, and then the rotating motor 1301 is controlled by the program to slowly drive the turntable 1304 to rotate. During the rotation of the turntable 1304, the solder ball can be prevented from moving inside the solder ball delivery hole 1309, thereby avoiding friction between the solder ball and the upper surface of the lower cover plate 1204 or the side wall of the solder ball delivery hole 1309 to cause wear.

[0047] When the detection hole 1308 of the detection turntable on the turntable 1304 is aligned with the first detection hole 1108 and the second detection hole 1207, the optical fiber sensor receiving end 1112 is aligned with the receiving optical fiber sensor transmitting end 1211. At this time, the optical fiber sensor receiving end 1112 receives the maximum beam energy, which means that the solder ball delivery hole 1309 is aligned with the solder ball drop hole 1205 of the lower component. The optical fiber sensor will transmit the alignment signal to the rotation control program, and the rotation control program will control the rotation motor 1301 to stop rotating. At the same time, the corresponding solder ball adsorption hole 1310 will leave the arc-shaped air guide groove 1311, and the air suction component 150 will be disconnected from the solder ball adsorption hole 1310, and the solder ball will fall from the solder ball delivery hole 1309 into the solder ball drop hole 1205 of the lower component, and the solder ball delivery hole 1309 will become empty. The rotating motor 1301 is continuously controlled by the program to rotate at a fixed angle a. At this time, the next solder ball delivery hole 1309 is aligned with the solder ball drop hole 1205 of the lower component, and the second solder ball falls.

[0048] As the turntable 1304 rotates, empty solder ball delivery holes 1309 continuously enter the area below the ball storage tank 1103, so the solder balls accumulated in the ball storage tank 1103 fall into the solder ball delivery holes 1309 one by one, and follow the solder ball delivery holes 1309 to rotate in the solder ball runway 1210 area of ​​the lower cover plate. When the solder ball delivery hole 1309 coincides with the solder ball drop hole 1205 of the lower component, the solder ball falls into the solder ball drop hole 1205 of the lower component, and then falls into the solder ball sliding channel 1407 on the nozzle component 140, slides downward along the solder ball sliding channel 1407, and then falls into the nozzle 1404, and just stops at the lower end outlet of the nozzle 1404.

[0049] When the solder ball stops at the lower outlet of the nozzle 1404, the focus formed by the laser beam emitted by the optical system 200 coincides with the center of the solder ball staying at the lower outlet of the nozzle 1404. Therefore, the high-energy density laser at the focus heats the solder ball, and the solder ball melts due to the heat. After melting, the liquid solder ball changes its shape and can be ejected from the lower outlet of the nozzle 1404. At this time, the laser heating is stopped, and the lower outlet of the nozzle 1404 is facing the solder pad of the processed product. Therefore, the liquid solder ball falls on the solder pad of the processed product and immediately begins to cool and re-solidify, forming a re-solid spherical solder joint on the solder pad of the processed product, thereby completing the welding process.

[0050] After the solder ball melts, it is ejected from the outlet at the lower end of the nozzle 1404 with the power from the inert gas. The inert gas continuously enters from the air inlet 1106 and reaches the top of the turntable 1304. When there is a solder ball in the solder ball delivery hole 1309, the inert gas can exert a downward force on the solder ball, making it easier for the solder ball to fall into the solder ball drop hole 1205 of the lower component and continue to fall downward.

[0051] When the solder ball slides into the nozzle 1404 on the nozzle assembly 140, the outlet diameter of the lower end of the nozzle 1404 is equal to or slightly smaller than the diameter of the solder ball, and the solder ball stops here. At this time, a closed cavity is formed inside the entire solder ball separation device. Since the inert gas continuously flows into the solder ball separation device, the air pressure inside the solder ball separation device rises. The rising air pressure inside the solder ball separation device will transmit the air pressure to the differential pressure sensor through the exhaust pipe 1212. The differential pressure sensor senses that its internal pressure is greater than the external atmospheric pressure and sends a signal to the control program. The control program immediately controls the laser to emit a laser beam to heat the solder ball. The solder ball is liquefied and deformed after being heated. The process of the solder ball being heated and liquefied is protected by the inert gas to prevent the solder ball from reacting with oxygen in the air and oxidizing during laser heating.

[0052] After the solder ball is liquefied and deformed by heat, it falls from the lower end outlet of the nozzle 1404. The inert gas inside the solder ball separation device escapes from the nozzle 1404. Because the distance from the nozzle 1404 to the solder pad of the processed product is very small, generally less than 1 mm, the inert gas escaping from the nozzle will be sprayed onto the solder pad of the processed product. When the liquid solder ball is cooled at the solder pad position of the processed product, it is still protected by the inert gas to prevent it from reacting with oxygen in the air and oxidizing.

[0053] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A solder ball separation device for soldering, characterized in that: The invention comprises a separation mechanism mounting plate (1114), a lower cover plate (1204) is fixedly and sealedly mounted on the bottom surface of the separation mechanism mounting plate (1114), a turntable (1304) is rotatably connected between the lower cover plate (1204) and the separation mechanism mounting plate (1114), a tin ball conveying hole (1309) is provided on the turntable (1304), a ball storage groove (1103) is provided on the separation mechanism mounting plate (1114) corresponding to the tin ball conveying hole (1309), tin balls are stored in the ball storage groove (1103), and a tin ball dropping hole (1209) is provided on the lower cover plate (1204) corresponding to the tin ball conveying hole (1309). 5), a nozzle assembly (140) is fixedly mounted on the bottom surface of the lower cover plate (1204), the nozzle assembly (140) is connected to the solder ball drop hole (1205), the turntable (1304) is transmission-connected with a drive assembly, and an adsorption mechanism is provided on the turntable (1304) corresponding to the solder ball drop hole (1205); the adsorption mechanism includes a solder ball adsorption hole (1310), the solder ball adsorption hole (1310) is opened inside the turntable (1304), and the solder ball adsorption hole (1310) is connected to the solder ball delivery hole (1309), and one end of the solder ball adsorption hole (1310) away from the solder ball delivery hole (1309) is penetrated The lower surface of the turntable (1304) is penetrated, and the upper surface of the lower cover plate (1204) is provided with an arc-shaped air guide groove (1311) corresponding to the solder ball adsorption hole (1310), and the arc-shaped air guide groove (1311) is provided with an air guide hole (1312) penetrating the lower cover plate (1204). An air suction component (150) is fixedly connected to the lower surface of the lower cover plate (1204), and the air suction component (150) is sealed and connected to the air guide hole (1312); one end of the arc-shaped air guide groove (1311) starts at a position corresponding to the ball storage groove (1103), and the other end of the arc-shaped air guide groove (1311) ends at a position corresponding to the ball storage groove (1103). The position corresponding to the tin ball falling hole (1205); the suction component (150) includes a mounting shell (1501) fixedly connected to the lower surface of the lower cover plate (1204), an exhaust frame (1503) is fixedly installed inside the mounting shell (1501), an exhaust motor (1504) is fixedly connected to the exhaust frame (1503), an exhaust fan blade (1505) is installed on the exhaust motor (1504), an air guide cover (1506) is fixedly and sealedly connected to the upper part of the exhaust fan blade (1505) inside the mounting shell (1501), and the top of the air guide cover (1506) is sealed and connected to the air guide hole (1312).

2. The solder ball separation device for soldering according to claim 1, characterized in that: The nozzle assembly (140) comprises a nozzle base (1401), the nozzle base (1401) is fixedly connected to the bottom surface of the lower cover plate (1204), the nozzle base (1401) is detachably connected to the nozzle (1404), a laser channel (1405) is provided on the nozzle base (1401), a solder ball sliding channel (1407) is provided on the nozzle base (1401) corresponding to the solder ball falling hole (1205), the solder ball sliding channel (1407) is connected to the laser channel (1405), and the laser channel (1405) is coaxially connected to the nozzle (1404).

3. The solder ball separation device for soldering according to claim 1, characterized in that: The driving assembly comprises a rotating motor (1301), a rotating shaft mounting hole (1109) is provided on the separation mechanism mounting plate (1114), a rotating shaft (1303) is sealed and rotatably connected inside the rotating shaft mounting hole (1109), and the rotating shaft (1303) is transmission-connected to the rotating motor (1301) via a first coupling (1302).

4. The solder ball separation device for soldering according to claim 1, characterized in that: An air inlet hole (1106) is provided on the separation mechanism mounting plate (1114), and a gas connector (1107) is fixedly and sealedly installed on the separation mechanism mounting plate (1114) corresponding to the air inlet hole (1106), and an end of the gas connector (1107) away from the separation mechanism mounting plate (1114) is connected in sequence to a pressure gauge, a proportional valve, a solenoid valve, an oil mist separator, and a gas source.

5. The solder ball separation device for soldering according to claim 1, characterized in that: A ball storage bin (1102) is fixedly mounted on the separation mechanism mounting plate (1114) corresponding to the ball storage groove (1103), the interior of the ball storage bin (1102) is filled with tin balls, the ball storage bin (1102) is sealed and connected to the ball storage groove (1103), and one end of the ball storage bin (1102) away from the separation mechanism mounting plate (1114) is sealed and connected to a bin cover (1101).

6. The solder ball separation device for soldering according to claim 1, characterized in that: The upper surface of the lower cover plate (1204) is sealed and slidably connected to the lower surface of the turntable (1304), and the upper surface of the turntable (1304) is sealed and slidably connected to the lower surface of the separation mechanism mounting plate (1114).

7. A solder ball separation device for soldering according to any one of claims 1 to 6, characterized in that: The diameter of the solder ball adsorption hole (1310) is smaller than the diameter of the solder ball.

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