Semiconductor wafer slicing auxiliary device capable of avoiding uneven thickness of wafer slices

Abstract

The invention provides a semiconductor wafer slicing auxiliary device capable of avoiding uneven thickness of wafer slices, and belongs to the technical field of wafer slicing devices.The semiconductor wafer slicing auxiliary device comprises a machining table, a clamping assembly, an elastic assembly, a positioning assembly and a cutting assembly, a feeding hole is vertically formed in the upper surface of the middle of the machining table, and the clamping assembly is located in the feeding hole; the elastic assembly is located between the clamping assembly and the bottom wall of the feeding hole, the positioning assembly and the cutting assembly are both located above the machining table, the positioning assembly and the cutting assembly are both located above the clamping assembly, the cutting assembly is located on the side where the positioning assembly is located, and in the process that the cutting assembly conducts wafer slicing on the wafer body, the cutting assembly is located on the side where the positioning assembly is located; the clamping assembly clamps the wafer body to be located in the feeding hole, and when the cutting assembly is subjected to cutting resistance brought by the wafer body, the cutting assembly is connected with the clamping assembly in a clamped mode, and the cutting assembly and the clamping assembly are integrally linked, so that the cutting face of the wafer body does not deviate, and the phenomenon that the thickness of a wafer slice is not uniform is avoided.

Description

Technical Field

[0001] The invention relates to the technical field of wafer slicing devices, and in particular to a semiconductor wafer slicing auxiliary device for avoiding uneven wafer slice thickness. Background Art

[0002] Wafer slicing refers to the silicon wafers used to make silicon semiconductor circuits. The raw material is silicon. The manufacturing process of the wafer body is complex and delicate, including multiple steps, such as purifying silicon materials, crystal growth, slicing, polishing, etc. In the slicing process of the wafer body, a blade is usually used to impact and slice the wafer body.

[0003] In the prior art, for example, a Chinese invention patent with authorization announcement number CN112976381A discloses a semiconductor wafer slicing auxiliary device for avoiding uneven thickness during slicing, comprising a bracket, a mounting column fixedly mounted on the inner wall of the bracket, a slideway fixedly mounted on one end of the mounting column away from the bracket, a sliding rack slidably connected inside the slideway, a blade fixedly mounted on the bottom end of the sliding rack, and during slicing, the semi-gear drives the driving gear and the sliding rack to reciprocate and move, thereby realizing automatic cutting and lifting of the blade, so that the wafer body is cut longitudinally. Cutting; however, in the above technical solution, since the wafer body is mainly made of silicon, the Mohs hardness of silicon is about 7, which is relatively large. The upper end of the blade is connected to the bottom end of the sliding rack. When the blade cuts the silicon wafer from top to bottom, the end of the blade that contacts the wafer body is subject to resistance given by the wafer body, and the blade shakes, but the wafer body is fixed, resulting in the blade's entry position and exit position not being located in the same vertical plane, and the wafer body and the cutting surface of the blade are offset. The cutting offset will cause uneven thickness of the wafer slices, resulting in a decrease in the yield of wafer slices. Summary of the invention

[0004] In view of this, it is necessary to provide a semiconductor wafer slicing auxiliary device that avoids uneven wafer slice thickness, so as to solve the technical problem that when the blade is slicing the wafer body, the cutting resistance brought by the wafer body causes the blade to shake, causing the cutting surface of the wafer body to shift, resulting in uneven wafer slice thickness.

[0005] A semiconductor wafer slicing auxiliary device for avoiding uneven wafer slice thickness, characterized in that it includes a processing table, a clamping component, an elastic component, a positioning component, and a cutting component. A loading hole is vertically opened on the middle upper surface of the processing table, the clamping component is located in the loading hole, the elastic component is located between the clamping component and the bottom wall of the loading hole, the positioning component and the cutting component are both located above the processing table, the positioning component and the cutting component are both located above the clamping component, the cutting component is located on one side where the positioning component is located, the clamping component is connected to the elastic component, the elastic component is connected to the bottom of the loading hole, the positioning component is slidably connected to the processing table, the cutting component is connected to the processing table, and the cutting component is connected to the processing table. The component is clamped with the clamping component, the clamping component clamps the wafer body, the elastic component supports the clamping component to rise and fall in the loading hole and makes the wafer body extend out of the loading hole, the positioning component limits the upper surface of the wafer body to control the height of the wafer body extending out of the loading hole, the cutting component moves to the loading hole, the cutting component is clamped with the clamping component to keep the cutting surface of the cutting component and the wafer body from offset and cut the upper end of the wafer body, the cutting component, the positioning component and the loading hole jointly limit the movement of the clamping component in the loading hole, and during the process of the cutting component cutting the wafer body, the cutting component pushes the positioning component to slide in the direction away from the wafer body to separate the positioning component from the upper surface of the wafer body.

[0006] It can be known from the above technical scheme that the semiconductor wafer slicing auxiliary device for avoiding uneven wafer slice thickness provided by the present invention includes a processing table, a clamping component, an elastic component, a positioning component, and a cutting component. A loading hole is vertically opened on the middle upper surface of the processing table, the clamping component is located in the loading hole, the elastic component is located between the clamping component and the bottom wall of the loading hole, the positioning component and the cutting component are both located above the processing table, the positioning component and the cutting component are both located above the clamping component, the cutting component is located on one side where the positioning component is located, the clamping component is connected to the elastic component, the elastic component is connected to the bottom of the loading hole, the positioning component is slidably connected to the processing table, and the cutting component The cutting assembly is connected to the processing table, the cutting assembly is clamped with the clamping assembly, the clamping assembly clamps the wafer body, the elastic assembly supports the clamping assembly to rise and fall in the loading hole and makes the wafer body extend out of the loading hole, the positioning assembly limits the upper surface of the wafer body to control the height of the wafer body extending out of the loading hole, the cutting assembly moves to the loading hole, the cutting assembly is clamped with the clamping assembly to keep the cutting surface of the cutting assembly and the wafer body from offset and cut the upper end of the wafer body, the cutting assembly, the positioning assembly and the loading hole jointly limit the movement of the clamping assembly in the loading hole, and when the cutting assembly cuts the wafer body, the cutting assembly pushes the positioning assembly to slide in a direction away from the wafer body to separate the positioning assembly from the upper surface of the wafer body; When the clamping assembly clamps the wafer body in the loading hole, the elastic assembly pushes the clamping assembly to make the wafer body extend out of the loading hole, and the positioning assembly presses against the upper surface of the wafer body. Relevant staff can control the height of the wafer body extending out of the loading hole through the positioning assembly to control the thickness of the wafer slices. In the process of the cutting assembly slicing the wafer body, the cutting assembly is subjected to the cutting resistance brought by the wafer body, causing the cutting assembly to shake. In the process of wafer slicing, the cutting assembly is clamped with the clamping assembly, and the cutting assembly and the clamping assembly are linked as a whole. Driven by the elastic assembly, the wafer body and the cutting assembly achieve synchronous movement, and the cutting assembly and the wafer body remain relatively still, so that the entry position and the exit position of the cutting assembly are located in the same plane, thereby avoiding uneven thickness of wafer slices and improving the yield of wafer slicing. In addition, while slicing the wafer, the cutting assembly pushes the positioning assembly to slide away from the wafer body to separate the positioning assembly from the upper surface of the wafer body, making it convenient for staff to take the wafer slices. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 A schematic diagram of the structure of a semiconductor wafer slicing auxiliary device for avoiding uneven wafer slice thickness.

[0009] Figure 2 A schematic diagram of the structure of the clamping assembly.

[0010] Figure 3 A schematic diagram of the structure of the cutting assembly.

[0011] Figure 4 It is a structural schematic diagram of the mobile part.

[0012] Figure 5 This is a cross-sectional view of the processing table.

[0013] Figure 6 It is a structural diagram of the positioning component.

[0014] In the figure: processing table 1, loading hole 11, limiting ring 111, recovery trough 112, water trough 12, enclosure 13, clamping assembly 2, chassis 21, manipulator 22, limiting rod 23, elastic assembly 3, positioning assembly 4, positioning part 41, positioning seat 411, third L-shaped rod 412, fourth L-shaped rod 413, threaded rod 414, turntable 415, pressing block 416, sliding part 42, guide rod 421, spring 422, cutting assembly 5, supporting part 51, fixing box 511, first L-shaped rod 512, second L-shaped rod 513, moving part 52, screw 521, sliding rod 522, driving motor 523, cutting part 53, cutting motor 531, connecting plate 532, tool 533, positioning rod 534, wafer body 6, cooling assembly 7, water pump 71, water spray pipe 72. DETAILED DESCRIPTION

[0015] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0016] In the description of the present invention, it should be understood that the terms "upper", "middle", "outer", "inner", "lower" and the like indicating directions or positional relationships are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the components or elements referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0017] Please see Figure 1-6A semiconductor wafer slicing auxiliary device for avoiding uneven wafer slice thickness comprises a processing table 1, a clamping component 2, an elastic component 3, a positioning component 4, and a cutting component 5. A loading hole 11 is vertically opened on the middle upper surface of the processing table 1, the clamping component 2 is located in the loading hole 11, the elastic component 3 is located between the clamping component 2 and the bottom wall of the loading hole 11, the positioning component 4 and the cutting component 5 are both located above the processing table 1, the positioning component 4 and the cutting component 5 are both located above the clamping component 2, the cutting component 5 is located on one side of the positioning component 4, the clamping component 2 is connected to the elastic component 3, the elastic component 3 is connected to the bottom of the loading hole 11, the positioning component 4 The cutting assembly 5 is connected to the processing table 1 in a sliding manner, and the cutting assembly 5 is connected to the processing table 1. The cutting assembly 5 is clamped with the clamping assembly 2. The clamping assembly 2 clamps and fixes the wafer bodies 6 of different sizes. The elastic assembly 3 supports the clamping assembly 2 to rise and fall in the loading hole 11 and makes the wafer body 6 extend out of the loading hole 11. The positioning assembly 4 limits the upper surface of the wafer body 6 to control the height of the wafer body 6 extending out of the loading hole 11. The cutting assembly 5 moves to the loading hole 11. The cutting assembly 5 is clamped with the clamping assembly 2 to keep the cutting surface of the cutting assembly 5 and the wafer body 6 from offset and cut the upper end of the wafer body 6. The cutting assembly 5, the positioning assembly 4, and the loading hole 11 jointly limit the clamping assembly 2 The cutting assembly 5 moves in the loading hole 11. During the process of cutting the wafer body 6, the cutting assembly 5 pushes the positioning assembly 4 to slide away from the wafer body 6 so that the positioning assembly 4 is separated from the upper surface of the wafer body 6. When the clamping assembly 2 clamps the wafer body 6 in the loading hole 11, the elastic assembly 3 pushes the clamping assembly 2 to make the wafer body 6 extend out of the loading hole 11, and the positioning assembly 4 abuts against the upper surface of the wafer body 6. The relevant staff can control the height of the wafer body 6 extending out of the loading hole 11 through the positioning assembly 4, thereby controlling the thickness of the wafer slice. During the process of the cutting assembly 5 slicing the wafer body 6, the cutting assembly 5 is affected by the wafer body 6. The cutting resistance caused by the cutting assembly 5 causes the cutting assembly 5 to shake. During the wafer slicing process, the cutting assembly 5 is clamped with the clamping assembly 2, and the cutting assembly 5 and the clamping assembly 2 are linked as a whole. Driven by the elastic assembly 3, the wafer body 6 and the cutting assembly 5 achieve synchronous movement, and the cutting assembly 5 and the wafer body 6 remain relatively still, so that the entry position and the exit position of the cutting assembly 5 are located in the same plane, avoiding uneven thickness of wafer slices and improving the yield of wafer slicing. At the same time as the wafer is slicing, the cutting assembly 5 pushes the positioning assembly 4 to slide away from the wafer body 6, so that the positioning assembly is separated from the upper surface of the wafer body 6, which is convenient for the staff to take the wafer slices.

[0018] In one embodiment, the clamping assembly 2 includes a chassis 21, a manipulator 22, and two limit rods 23. The diameter of the chassis 21 is smaller than the diameter of the feeding hole 11. The chassis 21, the manipulator 22, and the two limit rods 23 are all located in the feeding hole 11. The chassis 21 is located above the elastic component 3, and the manipulator 22 is located at the center of the upper surface of the chassis 21. The two limit rods 23 are vertically located on the upper surface of the chassis 21. The two limit rods 23 are symmetrically located on both sides of the manipulator 22. Several card grooves are evenly opened on the opposite surfaces of the two limit rods 23. The bottom surface of the chassis 21 is connected to the elastic component 3, and the manipulator 22 is connected to the chassis 21. One end of the two limit rods 23 is connected to the chassis 21, and the other ends of the two limit rods 23 extend out of the feeding hole 11 and are clamped with the cutting assembly 5. The elastic component 3 drives the chassis 21 to rise and fall in the feeding hole 11, and the manipulator 2 2 clamps the wafer body 6, and when the cutting assembly 5 moves to the loading hole 11 to cut the wafer body 6, the cutting assembly 5 shakes due to the cutting resistance brought by the wafer body 6, resulting in relative displacement between the cutting assembly 5 and the wafer body 6, causing the cutting surface of the wafer body 6 to be uneven or even broken. In this regard, during cutting, the cutting assembly 5 is clamped in the clamping grooves of the two limit rods 23, so that the cutting assembly 5 limits the lifting and lowering of the wafer body 6 in the loading hole 11. At the same time, the cutting assembly 5, the positioning assembly 4, and the loading hole 11 jointly fix the chassis 21, so as to realize the synchronous movement of the cutting assembly 5 and the clamping assembly 2, so that the cutting assembly 5 and the wafer body 6 remain relatively still, prevent the cutting assembly 5 from shaking, and prevent the cutting surface of the wafer body 6 from shifting, so as to avoid the phenomenon of uneven cutting or even cutting fracture of the wafer body 6 during the cutting process.

[0019] In one embodiment, the cutting assembly 5 includes a supporting portion 51, a moving portion 52, and a cutting portion 53. The supporting portion 51 is located on the moving portion 52, and the cutting portion 53 is located on the moving portion 52. The moving portion 52 is arranged on the left and right sides of the feeding hole 11. The cutting portion 53 includes a cutting motor 531, a connecting disk 532, a cutter 533, and two positioning rods 534. The cutting motor 531 is located in the supporting portion 51, the connecting disk 532 is located below the supporting portion 51, the connecting disk 532 is located below the cutting motor 531, the cutter 533 is located below the connecting disk 532, and the two positioning rods 534 are both arranged on the supporting portion 51, the two positioning rods 534 are relatively parallel, the two positioning rods 534 are both facing the direction of the feeding hole 11, and the two positioning rods 534 are both with the loading The workbench 1 is relatively parallel, the support part 51 is connected to the moving part 52, the moving part 52 is connected to the processing table 1, the output shaft of the cutting motor 531 passes through the bottom end of the support part 51 and is fixedly connected to the axis of the connecting disk 532. Since the tool 533 is a wearing part and needs to be replaced regularly, the connecting disk 532 is evenly provided with an annular array of penetrating through holes away from its axis. The tool 533 is provided with an annular array of bolts that are compatible with the annular array of penetrating through holes of the connecting disk 532 away from its axis. The annular array bolts of the tool 533 pass through the annular array of penetrating through holes of the connecting disk 532 and are fixed by nuts. The tool 533 can be removed from the connecting disk 532 by rotating the nuts for regular replacement. The two positioning rods 534 are both connected to the support part 51. The two positioning rods 534 is respectively engaged with the two limit rods 23. During the cutting process, the cutting motor 531 drives the connecting plate 532 to rotate, and the connecting plate 532 drives the tool 533 to rotate and cut the wafer body 6. Compared with the longitudinal impact of the blade on the wafer body 6, the tool 533 axially cuts the wafer body 6 during the rotation, which reduces the cutting resistance and makes the cutting surface of the wafer body 6 more stable. The moving part 52 drives the supporting part 51 to move toward the direction close to the loading hole 11 or away from the loading hole 11. The supporting part 51 supports the cutting part 53 to be located above the processing table 1. The supporting part 51 moves to the loading hole 12. The two positioning rods 534 are respectively engaged in the slots of the two limit rods 23 to limit the lifting and lowering of the chassis 211 in the loading hole 12, so as to realize the tool 533 and the clamping assembly 2. The integrated linkage keeps the tool 533 and the wafer body 6 relatively still, preventing the tool 533 from shaking and preventing the cutting surface of the wafer body 6 from shifting. The tool 533 passes through the slots of the two limit rods 23 to cut the wafer body 6. In order to ensure the integrity of the wafer slices and prevent the connection plate 532 from causing collision damage to the wafer slices of the wafer body 6, ensure that the tool 533 passes through the slots of the two limit rods 213. The radius of the tool 533 is greater than the radius of the wafer body 6 and the connection plate 532, and is smaller than the distance between the two limit rods 213. The difference in radius between the connection plate 532 and the tool 533 is greater than the radius of the wafer body 6. In order to allow the tool 533 to cut the wafer body 6, the two positioning rods 534 are located in the slots of the two limit rods 23 to complete the early limit.The lengths of the two positioning rods 534 are both greater than the radius of the cutter 533. When cutting, the two positioning rods 534 are inserted into the slots of the two limiting rods 23. When the two positioning rods 534 slide in the slots of the two limiting rods 23 toward the loading hole 11, the support portion 51 pushes the positioning assembly 4 to slide in the direction away from the loading hole 11 until the positioning assembly 4 releases the limit on the wafer body 6. At this time, the two positioning rods 534 limit the lifting and lowering of the wafer body 6 in the loading hole 11. In the process of the two positioning rods 534 being inserted into the slots of the two limiting rods 23 to replace the positioning assembly 4, the positioning assembly 4 does not immediately release the limit on the wafer body 6, which greatly reduces the friction between the two positioning rods 534 and the slots of the two limiting rods 23, ensuring that the two positioning rods 534 can slide smoothly in the slots of the two limiting rods 23.

[0020] In one embodiment, the support portion 51 includes a fixed box 511, a first L-shaped rod 512, and a second L-shaped rod 513. The fixed box 511 is hollow inside and has an open upper end. The cutting motor 531 is located in the fixed box 511. The positioning rod 534 is located on the first L-shaped rod 512 or the second L-shaped rod 513. The first L-shaped rod 512 and the second L-shaped rod 513 are located on the moving portion 52. The first L-shaped rod 512 and the second L-shaped rod 513 are symmetrically arranged on the left and right sides of the fixed box 511. The output shaft of the cutting motor 531 passes through the bottom end of the fixed box 511 and the connecting plate 532. The two positioning rods 534 are respectively fixedly connected to the first L-shaped rod 512 and the second L-shaped rod 513. The first L-shaped rod 512 is threadedly transmitted with the moving part 52, and the second L-shaped rod 513 is slidably connected with the moving part 52. The first L-shaped rod 512 and the second L-shaped rod 513 are integrally formed with the fixed box 511. The first L-shaped rod 512 and the second L-shaped rod 513 support the fixed box 511 above the processing table 1. The first L-shaped rod 512 and the second L-shaped rod 513 drive the fixed box 511 to move toward or away from the loading hole 11.

[0021] In one embodiment, a threaded through hole is provided at the bottom of the first L-shaped rod 512, a through hole is provided at the bottom of the second L-shaped rod 513, the moving part 52 includes a screw 521, a slide rod 522, and a drive motor 523, both ends of the screw 521 are provided with a rotating block, both ends of the slide rod 522 are provided with a limiting block, the screw 521 and the slide rod 522 are respectively located on the left and right sides of the feeding hole 11, the drive motor 523 is located at the rear end of the screw 521, the screw 521 and the slide rod 522 are relatively parallel, the screw 521 rotates on the rotating block of the screw 521, the rotating block of the screw 521 is fixedly connected to the processing table 1, the limiting block of the slide rod 522 is fixedly connected to the processing table 1, the drive motor 523 is fixedly connected to the processing table 1, and the drive motor 523 The output gear of and the input gear of the screw rod 521 mesh with each other, the first L-shaped rod 512 and the screw rod 521 are threadedly transmitted, the second L-shaped rod 513 is slidably connected with the sliding rod 522, and the driving motor 523 drives the screw rod 521 to rotate, and the screw rod 521 drives the first L-shaped rod 512 to move toward the loading hole 11 or away from the loading hole 11, the first L-shaped rod 512 and the second L-shaped rod 513 drive the fixed box 511 to move toward the loading hole 11 or away from the loading hole 11, and the fixed box 511 drives the cutting part 53 to move toward the loading hole 11 or away from the loading hole 11, and the rotating block of the screw rod 521 and the limiting block of the sliding rod 522 jointly restrict the first L-shaped rod 512 and the second L-shaped rod 513 from detaching from the moving part 52.

[0022] In one embodiment, a limiting ring 111 is further provided at the feeding hole 11. The inner diameter of the limiting ring 111 is smaller than the diameter of the chassis 21. The limiting ring 111 is located at the upper end of the feeding hole 11. The limiting ring 111 is connected to the feeding hole 11. The manipulator 22 and the limiting rod 23 can both extend out of the inner ring of the limiting ring 111 to the feeding hole 11. When the elastic component 3 fails or the relevant staff misoperates and causes the clamping component 2 to rise excessively in the feeding hole 11, the limiting ring 111 can prevent the chassis 21 from extending out of the feeding hole 11 to protect the safety of relevant equipment and staff.

[0023] In one embodiment, the positioning assembly 4 includes a positioning portion 41 and a sliding portion 42. The positioning portion 41 is located on the sliding portion 42, and the sliding portion 42 is located on the processing table 1. The positioning portion 41 includes a positioning seat 411, a third L-shaped rod 412, a fourth L-shaped rod 413, a threaded rod 414, a turntable 415, and a pressing block 416. A through threaded through hole that is compatible with the threaded rod 414 is vertically opened at the axis of the positioning seat 411. The sliding portion 42 is arranged on the left and right sides of the feeding hole 11. The positioning seat 411, the threaded rod 414, the turntable 415, and the pressing block 416 are all located on the upper side of the sliding portion 42. The third L-shaped rod 412 and the fourth L-shaped rod 413 are both located on the sliding portion 42, the third L-shaped rod 412 and the fourth L-shaped rod 413 are symmetrically arranged on the left and right sides of the positioning seat 411, the threaded rod 414 is located in the positioning seat 411, the turntable 415 is located above the positioning seat 411, the pressing block 416 is located below the positioning seat 411, the sliding portion 42 is connected to the processing table 1, the positioning seat 411 and the third L-shaped rod 412 and the fourth L-shaped rod 413 are integrally formed, the third L-shaped rod 412 and the fourth L-shaped rod 413 are slidably connected to the sliding portion 42, the positioning seat 411 and the threaded rod 4 14 threaded connection, one end of the threaded rod 414 is connected to the turntable 415, and the other end of the threaded rod 414 passes through the through threaded through hole of the positioning seat 411 and is connected to the pressing block 416. The third L-shaped rod 412 and the fourth L-shaped rod 413 support the positioning seat 411, the threaded rod 414, the turntable 415, and the pressing block 416 are located above the loading hole 11. When the clamping assembly 2 clamps the wafer body 6 and is located in the loading hole 11, the pressing block 416 abuts against the upper surface of the wafer body 6. The relevant staff can drive the threaded rod 414 to rotate by rotating the turntable 415, and the threaded rod 414 drives the pressing block 4 16 is lifted and lowered, the pressing block 416 presses the upper surface of the wafer body 6 to rise and fall in the loading hole 11, thereby adjusting the height of the wafer body 6 extending out of the loading hole 11, and realizing the effect of manually adjusting the slice thickness of the wafer body 6. The third L-shaped rod 412 and the fourth L-shaped rod 413 drive the positioning seat 411 to slide on the sliding part 42 toward the loading hole 11 or away from the loading hole 11. When the cutting assembly 5 moves to the loading hole 11 to cut the wafer body 6, the cutting assembly 5 pushes the positioning seat 411 to make the positioning seat 411 slide on the sliding part 42 in the direction away from the loading hole 11.

[0024] In one embodiment, the lower ends of the third L-shaped rod 412 and the fourth L-shaped rod 413 are provided with through holes, and the sliding part 42 includes two guide rods 421 and two springs 422. Both ends of the two guide rods 421 are provided with limit blocks. The two guide rods 421 are respectively located on the left and right sides of the feeding hole 11, one of the guide rods 421 is arranged between the feeding hole 11 and the screw rod 521, and the other guide rod 421 is arranged between the feeding hole 11 and the sliding rod 522. The two guide rods 421 are relatively parallel, and the two springs 422 are respectively wound between the limit blocks of each guide rod 421. The third L-shaped rod 412 and the fourth L-shaped rod 413 are respectively located on each guide rod 421, the limit blocks of the two guide rods 421 are connected to the processing table 1, the limit blocks of the two guide rods 421 are integrally formed with the guide rods 421, the third L-shaped rod 412 and the fourth L-shaped rod 413 are slidably connected to the two guide rods 421, and the two springs 422 support the third L-shaped rod 412 and the fourth L-shaped rod 413 to be located at the loading hole 11 without being affected by external forces, and the third L-shaped rod 412 and the fourth L-shaped rod 413 support the positioning seat 411 to be located at the upper axis of the loading hole 11, The third L-shaped rod 412 and the fourth L-shaped rod 413 drive the positioning seat 411 to slide on the two guide rods 421 in the direction close to the loading hole 11 or away from the loading hole 11, and the two springs 422 push the third L-shaped rod 412 and the fourth L-shaped rod 413 to slide on the two guide rods 421 in the direction close to the loading hole 11 or away from the loading hole 11, and the limit blocks of the two guide rods 421 prevent the third L-shaped rod 412 and the fourth L-shaped rod 413 from slipping on the two guide rods 421. After the cutting is completed, the fixing box 511 pushes the pressing block 416 to the outside of the wafer body 6 , the limiting effect of the pressing block 416 on the wafer body 6 is released, so that the wafer slices after cutting are conveniently taken away by the staff, and after the wafer slices are taken away, when the fixing box 511 moves in the direction away from the loading hole 11, the two springs 422 push the third L-shaped rod 412 and the fourth L-shaped rod 413 to slide on the two guide rods 421 in the direction close to the loading hole 11, and the third L-shaped rod 412 and the fourth L-shaped rod 413 drive the pressing block 416 to return to the top of the loading hole 12 to press against the upper surface of the wafer body 6, thereby realizing automatic limiting of the wafer body 6 again.

[0025] In one embodiment, a water trough 12 is provided on the upper surface of the end of the processing table 1 opposite to the cutting component 5, a recovery trough 112 connected to the water trough 12 is provided on the upper part of the inner cavity of the loading hole 11, and enclosures 13 are provided on all sides of the upper surface of the processing table 1. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slice thickness also includes a cooling component 7, and the cooling component 7 includes a water pump 71 and a water spray pipe 72. The water pump 71 is located in the water trough 12, the water pump 71 is connected to the processing table 1, one end of the water spray pipe 72 is connected to the water pump 71, and the other end of the water spray pipe 72 extends to the top of the positioning component 4. The water pump 71 pumps the coolant in the water trough 12 to spray to the upper end of the wafer body 6 through the water spray pipe 72 to avoid damage to the wafer body 6 caused by the high temperature generated by the cutting component 5 during the cutting process, and the recovery trough 112 returns the coolant stored in the loading hole 11 to the water trough 12, and the enclosure 13 prevents the coolant from flowing off the processing table 1.

[0026] In one embodiment, the elastic component 3 is a telescopic spring. When the clamping component 2 clamps the wafer body 6 and locates it in the loading hole 11, the elastic component 3 supports the clamping component 2 so that the wafer body 6 extends out of the loading hole 11. The pressing block 416 presses the upper surface of the wafer body 6 to move the upper surface of the wafer body 6 up and down in the loading hole 11, thereby adjusting the height of the wafer body 6 extending out of the loading hole 11.

[0027] What is disclosed above is only a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. A person skilled in the art can understand that all or part of the processes of the above embodiments and equivalent changes made according to the claims of the present invention still fall within the scope of the invention.

Claims

1. A semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness, characterized in that: The invention comprises a processing table, a clamping assembly, an elastic assembly, a positioning assembly and a cutting assembly. A feeding hole is vertically opened on the middle upper surface of the processing table. The clamping assembly is located in the feeding hole. The elastic assembly is located between the clamping assembly and the bottom wall of the feeding hole. The positioning assembly and the cutting assembly are both located above the processing table. The positioning assembly and the cutting assembly are both located above the clamping assembly. The cutting assembly is located on one side where the positioning assembly is located. The clamping assembly is connected to the elastic assembly. The elastic assembly is connected to the bottom of the feeding hole. The positioning assembly is slidably connected to the processing table. The cutting assembly is connected to the processing table. The cutting assembly is clamped with the clamping assembly. The component clamps the wafer body, the elastic component supports the clamping component to rise and fall in the loading hole and makes the wafer body extend out of the loading hole, the positioning component limits the upper surface of the wafer body to control the height of the wafer body extending out of the loading hole, the cutting component moves to the loading hole, the cutting component is engaged with the clamping component to keep the cutting surface of the cutting component and the wafer body from offset and cut the upper end of the wafer body, the cutting component, the positioning component and the loading hole jointly limit the movement of the clamping component in the loading hole, and during the process of the cutting component cutting the wafer body, the cutting component pushes the positioning component to slide away from the wafer body to separate the positioning component from the upper surface of the wafer body.

2. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness as claimed in claim 1, characterized in that: The clamping assembly includes a chassis, a manipulator, and a limiting rod. The diameter of the chassis is smaller than the diameter of the feeding hole. The limiting rod is evenly provided with a plurality of slots. The chassis, the manipulator, and the limiting rod are all located in the feeding hole. The chassis is located above the elastic assembly. The manipulator is located at the center of the upper surface of the chassis. The limiting rod is vertically located on the upper surface of the chassis. The limiting rod is located on one side of the manipulator. The bottom surface of the chassis is connected to the elastic assembly. The manipulator is connected to the chassis. The cutting assembly is connected to the loading hole, one end of the limiting rod is connected to the chassis, the other end of the limiting rod extends out of the loading hole and is engaged with the cutting assembly, the elastic assembly drives the chassis to rise and fall in the loading hole, the robot clamps the wafer body, the cutting assembly moves to the loading hole, the cutting assembly extends into the slot of the limiting rod to limit the lifting and lowering of the chassis in the loading hole, the cutting surface of the cutting assembly and the wafer body are kept from being offset, and the cutting assembly slides in the slot of the limiting rod and cuts the wafer body.

3. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness as claimed in claim 2, characterized in that: The cutting assembly includes a supporting part, a moving part, and a cutting part. The supporting part is located on the moving part, and the cutting part is located on the moving part. The moving part is arranged on the left and right sides of the loading hole. The cutting part includes a cutting motor, a connecting plate, a tool, and a positioning rod. The radius of the tool is greater than the radius of the wafer body and the connecting plate. The difference in radius between the connecting plate and the tool is greater than the radius of the wafer body. The length of the positioning rod exceeds the radius of the tool. The cutting motor is located in the supporting part, the connecting plate is located below the supporting part, the connecting plate is located below the cutting motor, the tool is located below the connecting plate, the positioning rod is arranged on the supporting part, the positioning rod faces the direction of the loading hole, and the positioning rod is aligned with the limiting rod. The positioning rod is relatively vertical, the supporting part is connected to the moving part, the moving part is connected to the processing table, the output shaft of the cutting motor passes through the bottom end of the supporting part and is fixedly connected to the axis center of the connecting disk, the connecting disk is detachably connected to the tool, the positioning rod is connected to the supporting part, the positioning rod is clamped with the limiting rod, the cutting motor drives the connecting disk to rotate, the connecting disk drives the tool to rotate, the moving part drives the supporting part to move toward the loading hole or away from the loading hole, the supporting part supports the cutting part to be located above the processing table, the supporting part moves to the loading hole, the positioning rod extends into the slot of the limiting rod to limit the chassis from rising and falling in the loading hole, and the tool cuts the wafer body.

4. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness as claimed in claim 3, characterized in that: The supporting part includes a fixed box, a first L-shaped rod, and a second L-shaped rod. The interior of the fixed box is hollow and the upper end is open. The cutting motor is located in the fixed box. The positioning rod is located on the first L-shaped rod or the second L-shaped rod. The first L-shaped rod and the second L-shaped rod are located on the moving part. The first L-shaped rod and the second L-shaped rod are symmetrically arranged on the left and right sides of the fixed box. The output shaft of the cutting motor passes through the bottom end of the fixed box and is fixedly connected to the axis of the connecting disk. The positioning rod is connected to the first L-shaped rod or the second L-shaped rod. The first L-shaped rod is threadedly transmitted with the moving part, and the second L-shaped rod is slidably connected with the moving part. The first L-shaped rod and the second L-shaped rod are both integrally formed with the fixed box. The first L-shaped rod and the second L-shaped rod support the fixed box to be located above the processing table, and the first L-shaped rod and the second L-shaped rod drive the fixed box to move in a direction close to or away from the loading hole.

5. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness as claimed in claim 4, characterized in that: A threaded through hole is provided at the bottom of the first L-shaped rod, and a through through hole is provided at the bottom of the second L-shaped rod. The moving part includes a screw, a sliding rod, and a driving motor. The screw and the sliding rod are respectively located on the left and right sides of the feeding hole, and the driving motor is located at the rear end of the screw. The screw and the sliding rod are relatively parallel to each other. The screw is rotatably connected to the processing table, the sliding rod is fixedly connected to the processing table, the driving motor is fixedly connected to the processing table, the driving motor is connected to the screw, the first L-shaped rod is threadedly transmitted with the screw, the second L-shaped rod is slidably connected to the sliding rod, the driving motor drives the screw to rotate, and the screw drives the first L-shaped rod to move in a direction close to or away from the feeding hole.

6. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness according to any one of claims 2 to 5, characterized in that: The feeding hole is also provided with a limiting ring, the inner diameter of which is smaller than the diameter of the chassis, the limiting ring is located at the upper port of the feeding hole, the limiting ring is connected to the feeding hole, the manipulator and the limiting rod can both extend out of the feeding hole from the inner ring of the limiting ring, and the limiting ring prevents the chassis from extending out of the feeding hole.

7. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness as claimed in claim 1, characterized in that: The positioning assembly comprises a positioning part and a sliding part, the positioning part is located on the sliding part, the sliding part is located on the processing table, the positioning part comprises a positioning seat, a third L-shaped rod, a fourth L-shaped rod, a threaded rod, a turntable, and a pressing block, a through threaded through hole adapted to the threaded rod is vertically opened at the axis of the positioning seat, the sliding part is arranged on the left and right sides of the feeding hole, the positioning seat, the threaded rod, the turntable, and the pressing block are all located above the sliding part, the third L-shaped rod and the fourth L-shaped rod are both located on the sliding part, the third L-shaped rod and the fourth L-shaped rod are symmetrically arranged on the left and right sides of the positioning seat, the threaded rod is located in the positioning seat, the turntable is located above the positioning seat, the pressing block is located below the positioning seat, the sliding part is connected to the processing table, the positioning seat is connected to the third L-shaped rod and the fourth L-shaped rod The third L-shaped rod and the fourth L-shaped rod are integrally formed, and are slidably connected to the sliding part. The positioning seat is threadedly connected to the threaded rod, one end of the threaded rod is connected to the turntable, and the other end of the threaded rod passes through the through-threaded through hole of the positioning seat and is connected to the pressing block. The third L-shaped rod and the fourth L-shaped rod support the positioning seat, the threaded rod, the turntable, and the pressing block to be located above the loading hole. The turntable drives the threaded rod to rotate, and the threaded rod drives the pressing block to rise and fall. The pressing block presses the upper surface of the wafer body to make the wafer body rise and fall in the loading hole. The third L-shaped rod and the fourth L-shaped rod drive the positioning seat to slide on the sliding part in a direction close to or away from the loading hole. The cutting assembly moves to the loading hole to push the positioning seat to slide on the sliding part in a direction away from the loading hole.

8. The semiconductor wafer slicing auxiliary device for preventing uneven wafer slicing thickness as claimed in claim 7, characterized in that: The lower ends of the third L-shaped rod and the fourth L-shaped rod are provided with through holes, the sliding part includes two guide rods and two springs, both ends of the two guide rods are provided with limit blocks, the two guide rods are respectively arranged on the left and right sides of the feeding hole, the two guide rods are relatively parallel, the two springs are respectively wound between the limit blocks of each guide rod, the third L-shaped rod and the fourth L-shaped rod are respectively located on each guide rod, the limit blocks of the two guide rods are connected to the processing table, the limit blocks of the two guide rods are integrally formed with the guide rods, the third L-shaped rod and the fourth L-shaped rod are slidably connected to the two guide rods, the two springs The third L-shaped rod and the fourth L-shaped rod are supported at the loading hole without being affected by external forces, and the third L-shaped rod and the fourth L-shaped rod support the positioning seat at the upper axis of the loading hole, the third L-shaped rod and the fourth L-shaped rod drive the positioning seat to slide on the two guide rods toward the loading hole or away from the loading hole, the two springs push the third L-shaped rod and the fourth L-shaped rod to slide on the two guide rods toward the loading hole or away from the loading hole, and the limit blocks of the two guide rods prevent the third L-shaped rod and the fourth L-shaped rod from slipping off the two guide rods.

9. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slicing thickness as claimed in claim 1, characterized in that: A water trough is provided on the upper surface of the end of the processing table opposite to the cutting assembly, a recovery trough connected to the water trough is provided on the upper part of the inner cavity of the feeding hole, and enclosures are provided on all sides of the upper surface of the processing table. The semiconductor wafer slicing auxiliary device for avoiding uneven wafer slice thickness also includes a cooling assembly, and the cooling assembly includes a water pump and a water spray pipe. The water pump is located in the water trough, the water pump is connected to the processing table, one end of the water spray pipe is connected to the water pump, and the other end of the water spray pipe extends to the top of the positioning assembly, the water pump pumps the coolant in the water trough to spray to the upper end of the wafer body through the water spray pipe, the recovery trough returns the coolant stored in the feeding hole to the water trough, and the enclosure prevents the coolant from flowing off the processing table.

10. The semiconductor wafer slicing auxiliary device for preventing uneven wafer slicing thickness as claimed in claim 1, characterized in that: The elastic component is a telescopic spring.

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