Preparation method of inorganic waste residue highly-filled lightweight thermal insulation substrate

Abstract

The invention belongs to the technical field of building heat preservation, and particularly relates to a preparation method of a light heat preservation base plate highly filled with inorganic waste residues. The preparation method comprises the following steps: dissolving sodium hydroxide and triethylene tetramine in water, adding modified waste residue powder under a stirring condition, stirring, adding styrene prepolymer and micron-sized urea-formaldehyde resin coated epoxy resin microcapsules, and fully stirring to obtain uniform slurry; injecting the slurry into a mold, heating, curing, standing and maintaining to obtain a light heat-insulating substrate; the prepared light heat preservation base plate has the performance advantages of being excellent in heat preservation performance, small in density, good in size stability, flame-retardant and the like, the production investment is small, and work operation is easy.

Description

Technical Field

[0001] The invention belongs to the technical field of building thermal insulation, and in particular relates to a method for preparing a lightweight thermal insulation substrate highly filled with inorganic waste residue. Background Art

[0002] In today's era of rapid industrialization and urbanization, mining, metallurgy, construction and other industries, as important pillars of the national economy, inevitably produce a large amount of solid waste - waste residue in their production activities. These waste residues not only occupy a large amount of land resources, but also may cause pollution to the surrounding environment, such as soil erosion, water pollution and air quality degradation, becoming a major challenge restricting sustainable development. Therefore, exploring efficient and environmentally friendly ways to treat and utilize waste residues is of great significance to alleviate resource pressure and protect the ecological environment.

[0003] At present, the treatment methods for waste residue are mostly limited to simple roadbed and foundation paving. Although this method can reduce the accumulation of waste residue to a certain extent, its utilization value is extremely limited and it is impossible to give full play to the potential value of waste residue. In particular, for waste residue that cannot meet the strength requirements of roadbed and foundation, landfill is often the only option, which not only increases the treatment cost, but also may cause secondary pollution problems.

[0004] With the continuous progress of materials science and environmental protection technology, people have begun to try to improve the utilization value of waste slag through chemical activation. Among them, the use of alkaline activators to stimulate SiO2 and Al2O3 tetrahedrons in waste slag, induce geological polymerization reactions, and form inorganic silicon-aluminum long-chain structures is a new type of waste slag utilization technology that has attracted much attention in recent years. This process can not only effectively improve the mechanical properties of waste slag, but also give it excellent durability and weather resistance, which provides possibilities for the development of new building materials such as building insulation boards.

[0005] However, the chemical composition of waste residues from different sources varies significantly, especially the content differences of key components such as Al2O3 and CaSiO3, which directly affect the effect of geopolymerization and the performance of the final product. Specifically, Al2O3 is a key element in the formation of inorganic silicon-aluminum long-chain structures, while CaSiO3 is essential for the formation of gel structures. When the content of these two components in the waste residue is low, the geopolymerization reaction is difficult to fully proceed, resulting in insufficient strength of the generated building insulation board, which is difficult to meet the actual application requirements. Summary of the invention

[0006] In order to overcome the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue.

[0007] In order to achieve the above object, the present invention adopts the following technical solutions:

[0008] The present invention provides a method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue, comprising the following steps:

[0009] Sodium hydroxide and triethylenetetramine are dissolved in water, and modified waste residue powder is added under stirring. After stirring, styrene prepolymer and micron-grade urea-formaldehyde resin-coated epoxy resin microcapsules are added, and the mixture is stirred thoroughly to obtain a uniform slurry. The slurry is injected into a mold, and after heating and curing, it is allowed to stand for maintenance to obtain a lightweight thermal insulation substrate.

[0010] Preferably, the modified waste residue powder is prepared by crushing, grinding and sieving construction waste residue and slag to obtain powder; and fully mixing the powder, mica, calcium oxide, sodium silicate and glass fiber to obtain the modified waste residue powder.

[0011] Preferably, the mass ratio of the powder, mica, calcium oxide, sodium silicate and glass fiber is 100:(15-20):(15-20):(15-20):(1.5-2).

[0012] Preferably, the preparation method of the styrene prepolymer is: adding dibenzoyl peroxide to styrene monomer, heating and stirring to react to obtain the styrene prepolymer.

[0013] Preferably, the preparation method of the micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules is:

[0014] After the wall material emulsion and the core material solution are mixed, n-octanol is added for defoaming treatment, and a stable water-in-oil emulsion is formed after stirring. The pH is adjusted to be acidic, and the reaction is continued after heating. After filtering, the emulsion is washed with water, ethanol and butanone respectively, and after drying, micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules are obtained.

[0015] Preferably, the mass ratio of the wall material emulsion to the core material solution is 10:(3-4).

[0016] Preferably, the preparation method of the wall material emulsion is: mixing formaldehyde solution and urea, adjusting the pH to alkaline, adding melamine after stirring the reaction, continuing to stir the reaction and quickly cooling to room temperature to obtain a modified urea-formaldehyde resin glue; mixing the modified urea-formaldehyde resin solution with an aqueous solution of sodium dodecylbenzene sulfonate, stirring evenly to obtain a wall material emulsion.

[0017] Preferably, the mass ratio of the formaldehyde solution, urea and melamine is 100:(40-45):(15-20); the mass ratio of the modified urea-formaldehyde resin solution and the sodium dodecylbenzenesulfonate aqueous solution is 1:3.

[0018] Preferably, the preparation method of the core material solution is: mixing epoxy resin and benzyl alcohol to obtain the core material solution; the mass ratio of the epoxy resin to benzyl alcohol is 5:1.

[0019] Preferably, the mass ratio of the modified waste residue powder, sodium hydroxide, triethylenetetramine, water, styrene prepolymer and micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules is 100:(5-7):(2-3):(60-80):(18-20):(8-10).

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] The present invention mixes a certain proportion of CaO, water glass and mica powder into the waste residue to make up for the insufficient content of Al2O3 or CaSiO3 in the waste residue; and adds a small amount of glass fiber to reinforce the composite material system. At the same time, the adhesion of the composite material system is improved by adding an organic phase, and it is given better water resistance. The present invention adopts two synthetic organic components: one is a polystyrene prepolymer prepared by bulk polymerization of styrene monomer; the other is a synthesized micron-sized urea-formaldehyde resin-coated epoxy resin microcapsule. Among them, the micron-sized urea-formaldehyde resin-coated epoxy resin microcapsule can also cross-link with triethylenetetramine added in the matrix to play a repairing function on micro cracks of the composite material, thereby extending the service life of the composite material. DETAILED DESCRIPTION

[0022] In order to enable those skilled in the art to better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only embodiments of a part of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0023] It should be understood that when used in this specification and the appended claims, the terms "include" and "comprises" indicate the presence of described features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0024] It should also be understood that the terms used in the present specification are only for the purpose of describing specific embodiments and are not intended to limit the present invention. As used in the present specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0025] It should be further understood that the term "and / or" used in the present description and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.

[0026] The present invention provides a method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue, which specifically comprises the following steps:

[0027] Pretreatment of inorganic waste residue:

[0028] Use a crusher to crush construction waste and slag, use a grinder to grind large-particle powder, and pass through an 80-mesh screen to obtain waste powder; 100 parts of 80-mesh waste powder, 15 to 20 parts of mica, 15 to 20 parts of calcium oxide, 15 to 20 parts of sodium silicate and 1.5 to 2 parts of glass fiber are fully mixed in mass proportion to obtain modified waste powder; a 20-mesh screen can also be used; mica can also be replaced by other silicate mineral materials. The present invention provides a solution for the resource utilization of "useless waste" generated by mining, metallurgy, construction and other industries by adding CaO, water glass and mica powder, and also provides more sources of raw materials for the production of green building materials.

[0029] Synthesis of polystyrene:

[0030] Add an appropriate amount of styrene monomer into a round-bottom flask, then add 1.5% dibenzoyl peroxide, and stir the reaction at 80-100°C for 1-3 hours to obtain a styrene prepolymer.

[0031] Preparation of urea-formaldehyde resin coated epoxy resin microcapsules:

[0032] 1) Add 100 parts of formaldehyde solution and 40-45 parts of urea into a three-necked flask, then add triethanolamine to adjust the pH to 8.0-9.0, and stir the reaction at 80-100°C for 20-50 minutes. Adjust the temperature to 60-70°C, add 15-20 parts of melamine, continue stirring the reaction for 10-40 minutes, and quickly cool to room temperature to obtain a modified urea-formaldehyde resin glue.

[0033] 2) Mixing the modified urea-formaldehyde resin solution and the sodium dodecylbenzene sulfonate aqueous solution in a mass ratio of 1:3, and stirring evenly to obtain a wall material emulsion; the concentration of the sodium dodecylbenzene sulfonate aqueous solution is 1% to 2%.

[0034] 3) Mixing epoxy resin and benzyl alcohol in a mass ratio of 5:1 to obtain a core material solution.

[0035] 4) The wall material emulsion and the core material solution are mixed in a mass ratio of 10:(3-4), and 3-4 drops of n-octanol are added for defoaming treatment. The mixture is stirred at room temperature and 200-300 r / min for 20-30 min to form a stable water-in-oil emulsion. The pH is adjusted to 2.0-3.0 with dilute sulfuric acid, the temperature is slowly raised to 60-80°C, and the reaction is continued for 1-3 h to obtain the reactant.

[0036] 5) The reactants in 4) are filtered through filter paper, washed with water, ethanol and butanone for several times, and dried to obtain micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules.

[0037] Preparation of lightweight thermal insulation substrate:

[0038] 1) Weigh 100 parts of the modified waste residue powder, 5 to 7 parts of sodium hydroxide, 2 to 3 parts of triethylenetetramine, 60 to 80 parts of water, 18 to 20 parts of styrene prepolymer, and 8 to 10 parts of micron-grade urea-formaldehyde resin-coated epoxy resin microcapsules; triethylenetetramine can also be replaced by diethylenetriamine, hexamethylenetetramine or other self-healing agents; sodium hydroxide can also be replaced by other strong alkaline hydroxides (such as potassium hydroxide); styrene prepolymer can also be replaced by other organic resins such as plexiglass (PMMA).

[0039] 2) Dissolve sodium hydroxide and triethylenetetramine in distilled water, gradually add the modified waste residue powder under stirring conditions, and continue stirring for not less than 30 minutes; then, add styrene prepolymer and micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules, and stir well to obtain a uniform slurry; the micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules can also be replaced by other self-healing agents.

[0040] 3) injecting the slurry described in 2) into a mold, heating and curing at 130-150° C. for 1-3 hours; taking out the board from the mold, and leaving it to stand for 15-30 days to obtain a lightweight thermal insulation substrate.

[0041] The thermal insulation substrate of the present invention utilizes "useless waste slag" by means of component compensation, so that the main raw materials have a wider adaptability; the thermal insulation substrate of the present invention adopts a high filling ratio of inorganic waste slag, and has excellent flame retardancy and low cost; the thermal insulation substrate of the present invention is easy to be finished, so that it has both thermal insulation and decorative properties; the thermal insulation substrate of the present invention can realize automatic repair of microcracks and can increase its service life; the thermal insulation substrate of the present invention does not require high-temperature sintering, has low energy consumption, and has outstanding energy-saving and environmental protection advantages.

[0042] Inside the thermal insulation substrate of the present invention, micron-sized and millimeter-sized pores are densely distributed, the density is less than 1.2g / cm3, and the thermal conductivity is less than 0.08W / (mK). The lightweight thermal insulation substrate has the outstanding advantages of light weight and good thermal insulation. Inorganic matter accounts for nearly 80% of the solid content of the thermal insulation substrate, and its flame retardancy reaches Class A. The surface of the thermal insulation substrate is flat and easy to be coated or modified by lamination.

[0043] The light-weight thermal insulation substrate prepared by the present invention has the advantages of excellent thermal insulation performance, low density, good dimensional stability, flame retardancy, etc., and has low production investment and simple operation. In addition, various building thermal insulation decorative panels can be formed by cement plastering, coating a decorative layer or coating a PVC decorative film on the light-weight thermal insulation substrate.

[0044] Example 1

[0045] The construction waste residue and slag are crushed by a crusher, and the large-particle powder is ground by a grinder, and the waste residue powder is obtained after passing through an 80-mesh sieve; 100 parts of 80-mesh waste residue powder, 18 parts of mica, 18 parts of calcium oxide, 18 parts of sodium silicate and 1.8 parts of glass fiber are fully mixed according to the mass ratio to obtain the modified waste residue powder;

[0046] Add an appropriate amount of styrene monomer into a round-bottom flask, then add 1.5% dibenzoyl peroxide, and stir the mixture at 80°C for 3 hours to obtain a styrene prepolymer.

[0047] Add 100 parts of formaldehyde solution and 42 parts of urea to a three-necked flask, then add triethanolamine to adjust the pH to 8.5, and stir the reaction at 80°C for 50 minutes. Adjust the temperature to 65°C, add 18 parts of melamine, continue stirring the reaction for 20 minutes and quickly cool to room temperature to obtain a modified urea-formaldehyde resin glue; mix the modified urea-formaldehyde resin solution with a 2% sodium dodecylbenzene sulfonate aqueous solution at a mass ratio of 1:3, stir evenly to obtain a wall material emulsion; mix epoxy resin and benzyl alcohol at a mass ratio of 5:1 to obtain a core material solution.

[0048] The wall material emulsion and the core material solution were mixed in a mass ratio of 10:3.5, and 3 drops of n-octanol were added for defoaming treatment. The mixture was stirred at room temperature and 250 r / min for 25 min to form a stable water-in-oil emulsion. The pH was adjusted to 2.5 with dilute sulfuric acid, the temperature was slowly raised to 70°C, and the reaction was continued for 2 h to obtain the reactant.

[0049] The reactants were filtered through filter paper, washed with water, ethanol and butanone for three times respectively, and dried to obtain micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules.

[0050] Weigh 100 parts of the above-mentioned modified waste residue powder, 6 parts of sodium hydroxide, 2 parts of triethylenetetramine, 70 parts of distilled water, 19 parts of styrene prepolymer, and 9 parts of micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules respectively; dissolve sodium hydroxide and triethylenetetramine in distilled water, gradually add the modified waste residue powder under stirring conditions, and continue stirring for not less than 30 minutes; then, add styrene prepolymer and micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules, and stir well to obtain a uniform slurry; inject the slurry into a mold, heat and cure at 140°C for 2 hours; take out the board from the mold, and let it stand for 20 days to obtain a lightweight thermal insulation substrate.

[0051] Example 2

[0052] The construction waste residue and slag are crushed by a crusher, and the large-particle powder is ground by a grinder, and the waste residue powder is obtained after passing through an 80-mesh sieve; 100 parts of 80-mesh waste residue powder, 15 parts of mica, 15 parts of calcium oxide, 15 parts of sodium silicate and 1.5 parts of glass fiber are fully mixed according to the mass ratio to obtain modified waste residue powder;

[0053] Add an appropriate amount of styrene monomer into a round-bottom flask, then add 1.5% dibenzoyl peroxide, and stir the mixture at 80°C for 2 hours to obtain a styrene prepolymer.

[0054] Add 100 parts of formaldehyde solution and 40 parts of urea to a three-necked flask, then add triethanolamine to adjust the pH to 8.0, and stir the reaction at 80°C for 30 minutes. Adjust the temperature to 60°C, add 15 parts of melamine, continue stirring the reaction for 10 minutes and quickly cool to room temperature to obtain a modified urea-formaldehyde resin glue; mix the modified urea-formaldehyde resin solution with a 2% sodium dodecylbenzene sulfonate aqueous solution at a mass ratio of 1:3, stir evenly to obtain a wall material emulsion; mix epoxy resin and benzyl alcohol at a mass ratio of 5:1 to obtain a core material solution.

[0055] The wall material emulsion and the core material solution were mixed in a mass ratio of 10:3, and 3 drops of n-octanol were added for defoaming treatment. The mixture was stirred at room temperature and 200 r / min for 30 min to form a stable water-in-oil emulsion. The pH was adjusted to 2.0 with dilute sulfuric acid, the temperature was slowly raised to 60°C, and the reaction was continued for 2 h to obtain the reactant.

[0056] The reactants were filtered through filter paper, washed twice with water, ethanol and butanone respectively, and dried to obtain micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules.

[0057] Weigh 100 parts of the above-mentioned modified waste residue powder, 5 parts of sodium hydroxide, 2 parts of triethylenetetramine, 60 parts of distilled water, 18 parts of styrene prepolymer, and 8 parts of micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules respectively; dissolve sodium hydroxide and triethylenetetramine in distilled water, gradually add the modified waste residue powder under stirring conditions, and continue stirring for not less than 30 minutes; then, add styrene prepolymer and micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules, and stir well to obtain a uniform slurry; inject the slurry into a mold, heat and cure at 130°C for 2 hours; take out the board from the mold, and let it stand for 15 days to obtain a lightweight thermal insulation substrate.

[0058] Example 3

[0059] The construction waste residue and slag are crushed by a crusher, and the large-particle powder is ground by a grinder, and the waste residue powder is obtained after passing through an 80-mesh sieve; 100 parts of 80-mesh waste residue powder, 20 parts of mica, 20 parts of calcium oxide, 20 parts of sodium silicate and 2 parts of glass fiber are fully mixed according to the mass ratio to obtain modified waste residue powder;

[0060] Add an appropriate amount of styrene monomer into a round-bottom flask, then add 1.5% dibenzoyl peroxide, and stir the mixture at 90°C for 2 hours to obtain a styrene prepolymer.

[0061] Add 100 parts of formaldehyde solution and 45 parts of urea to a three-necked flask, then add triethanolamine to adjust the pH to 9.0, and stir the reaction at 90°C for 30 minutes. Adjust the temperature to 70°C, add 20 parts of melamine, continue stirring the reaction for 30 minutes and quickly cool to room temperature to obtain a modified urea-formaldehyde resin glue; mix the modified urea-formaldehyde resin solution with a 2% sodium dodecylbenzene sulfonate aqueous solution at a mass ratio of 1:3, stir evenly to obtain a wall material emulsion; mix epoxy resin and benzyl alcohol at a mass ratio of 5:1 to obtain a core material solution.

[0062] The wall material emulsion and the core material solution were mixed in a mass ratio of 10:4, and 3 drops of n-octanol were added for defoaming treatment. The mixture was stirred at room temperature and 300 r / min for 20 min to form a stable water-in-oil emulsion. The pH was adjusted to 3.0 with dilute sulfuric acid, the temperature was slowly raised to 80°C, and the reaction was continued for 1 h to obtain the reactant.

[0063] The reactants were filtered through filter paper, washed twice with water, ethanol and butanone respectively, and dried to obtain micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules.

[0064] Weigh 100 parts of the above-mentioned modified waste residue powder, 7 parts of sodium hydroxide, 3 parts of triethylenetetramine, 80 parts of distilled water, 20 parts of styrene prepolymer, and 10 parts of micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules respectively; dissolve sodium hydroxide and triethylenetetramine in distilled water, gradually add the modified waste residue powder under stirring conditions, and continue stirring for not less than 30 minutes; then, add styrene prepolymer and micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules, and stir well to obtain a uniform slurry; inject the slurry into a mold, heat and cure at 150°C for 1 hour; take out the board from the mold, and let it stand for 15 days to obtain a lightweight thermal insulation substrate.

[0065] Example 4

[0066] The construction waste residue and slag are crushed by a crusher, and the large-particle powder is ground by a grinder, and the waste residue powder is obtained after passing through an 80-mesh sieve; 100 parts of 80-mesh waste residue powder, 20 parts of mica, 20 parts of calcium oxide, 20 parts of sodium silicate and 2 parts of glass fiber are fully mixed according to the mass ratio to obtain modified waste residue powder;

[0067] Add an appropriate amount of styrene monomer into a round-bottom flask, then add 1.5% dibenzoyl peroxide, and stir the reaction at 100°C for 1 hour to obtain a styrene prepolymer.

[0068] Add 100 parts of formaldehyde solution and 45 parts of urea to a three-necked flask, then add triethanolamine to adjust the pH to 9.0, and stir and react at 100°C for 20 minutes. Adjust the temperature to 60°C, add 20 parts of melamine, continue stirring and reacting for 40 minutes and quickly cool to room temperature to obtain a modified urea-formaldehyde resin glue; mix the modified urea-formaldehyde resin solution with a 1% sodium dodecylbenzene sulfonate aqueous solution at a mass ratio of 1:3, stir evenly to obtain a wall material emulsion; mix epoxy resin and benzyl alcohol at a mass ratio of 5:1 to obtain a core material solution.

[0069] The wall material emulsion and the core material solution were mixed in a mass ratio of 10:4, and 3 drops of n-octanol were added for defoaming treatment. The mixture was stirred at room temperature and 300 r / min for 20 min to form a stable water-in-oil emulsion. The pH was adjusted to 3.0 with dilute sulfuric acid, the temperature was slowly raised to 60°C, and the reaction was continued for 6 h to obtain the reactant.

[0070] The reactants were filtered through filter paper, washed twice with water, ethanol and butanone respectively, and dried to obtain micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules.

[0071] Weigh 100 parts of the above-mentioned modified waste residue powder, 7 parts of sodium hydroxide, 3 parts of triethylenetetramine, 80 parts of distilled water, 20 parts of styrene prepolymer, and 10 parts of micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules respectively; dissolve sodium hydroxide and triethylenetetramine in distilled water, gradually add the modified waste residue powder under stirring conditions, and continue stirring for not less than 30 minutes; then, add styrene prepolymer and micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules, and stir well to obtain a uniform slurry; inject the slurry into a mold, heat and cure at 130°C for 3 hours; take out the board from the mold, and let it stand for 15 days to obtain a lightweight thermal insulation substrate.

[0072] The performance of the lightweight thermal insulation substrate prepared in Examples 1-4 was tested, and the test results are shown in Table 1:

[0073] Table 1 Performance test data of lightweight thermal insulation substrates prepared in Examples 1-4

[0074]

[0075]

[0076] As can be seen from Table 1, the lightweight thermal insulation substrate prepared by the present invention not only performs well in structural strength and load-bearing capacity, but also has excellent thermal insulation performance. The strengths of Examples 1 to 4 are all between 13.5 and 14.1 MPa, indicating that the lightweight thermal insulation substrate prepared by the present invention has high mechanical strength. The thermal conductivity λ is between 0.09 and 0.14 W / m·K, which is much lower than the thermal conductivity of traditional thermal insulation materials. These lightweight thermal insulation substrates have excellent thermal insulation performance. The low thermal conductivity means that the substrate can effectively reduce the transfer of heat, thereby playing an important role in thermal insulation and energy saving. The superiority of this comprehensive performance makes the substrate have broad application prospects in construction, industry and other fields that require thermal insulation and load-bearing. In addition, the preparation process of the present invention is simple and the cost is controllable, which also provides strong support for the large-scale production and commercial application of the substrate.

[0077] The above contents are only for explaining the technical idea of ​​the present invention and cannot be used to limit the protection scope of the present invention. Any changes made on the basis of the technical solution in accordance with the technical idea proposed by the present invention shall fall within the protection scope of the claims of the present invention.

Claims

1. A method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue, characterized in that: The following steps are involved: Sodium hydroxide and triethylenetetramine are dissolved in water, and modified waste residue powder is added under stirring. After stirring, styrene prepolymer and micron-grade urea-formaldehyde resin-coated epoxy resin microcapsules are added, and the mixture is stirred thoroughly to obtain a uniform slurry. The slurry is injected into a mold, and after heating and curing, it is allowed to stand for maintenance to obtain a lightweight thermal insulation substrate.

2. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste slag according to claim 1, characterized in that: The preparation method of the modified waste residue powder is as follows: crushing, grinding and sieving construction waste residue and slag to obtain powder; and fully mixing the powder, mica, calcium oxide, sodium silicate and glass fiber to obtain the modified waste residue powder.

3. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 2, characterized in that: The mass ratio of the powder, mica, calcium oxide, sodium silicate and glass fiber is 100:(15-20):(15-20):(15-20):(1.5-2).

4. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 1, characterized in that: The preparation method of the styrene prepolymer comprises: adding dibenzoyl peroxide into styrene monomer, heating and stirring to react to obtain the styrene prepolymer.

5. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 1, characterized in that: The preparation method of the micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules is as follows: After mixing the wall material emulsion and the core material solution, n-octanol is added for defoaming treatment, and a stable water-in-oil emulsion is formed after stirring, and the pH is adjusted to acidic, and the reaction is continued after heating; After filtering, the product is washed with water, ethanol and butanone respectively, and dried to obtain micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules.

6. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 5, characterized in that: The mass ratio of the wall material emulsion to the core material solution is 10:(3-4).

7. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 5, characterized in that: The preparation method of the wall material emulsion is as follows: formaldehyde solution and urea are mixed, pH is adjusted to be alkaline, melamine is added after stirring for reaction, stirring for reaction is continued and the mixture is rapidly cooled to room temperature to obtain a modified urea-formaldehyde resin glue solution; the modified urea-formaldehyde resin solution is mixed with a sodium dodecylbenzene sulfonate aqueous solution, and the wall material emulsion is obtained after stirring evenly.

8. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 7, characterized in that: The mass ratio of the formaldehyde solution, urea and melamine is 100:(40-45):(15-20); the mass ratio of the modified urea-formaldehyde resin solution and the sodium dodecylbenzene sulfonate aqueous solution is 1:

3.

9. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 5, characterized in that: The preparation method of the core material solution is: epoxy resin and benzyl alcohol are mixed to obtain the core material solution; the mass ratio of the epoxy resin to the benzyl alcohol is 5:

1.

10. The method for preparing a lightweight thermal insulation substrate with high filling of inorganic waste residue according to claim 1, characterized in that: The mass ratio of the modified waste residue powder, sodium hydroxide, triethylenetetramine, water, styrene prepolymer and micron-sized urea-formaldehyde resin-coated epoxy resin microcapsules is 100:(5-7):(2-3):(60-80):(18-20):(8-10).

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