High-efficiency localized electrochemical deposition method and device for grain refinement

Abstract

The invention belongs to the technical field of localized electrodeposition, and relates to a localized electrochemical deposition method and device for high-efficiency grain refinement, the method comprises the following steps: S1, according to a to-be-processed requirement, carrying out inscribing modification on a cathode surface of a substrate by using ultrafast laser to obtain a modified substrate; s2, the modified substrate is fixed in an electroplating pool, an anode plate is fixed below the modified substrate in the electroplating pool, an electrolyte is added, and the liquid level of the electrolyte is higher than the upper surface of the modified substrate; laser is placed above the electroplating pool, it is guaranteed that the laser is focused on the cathode surface of the modified substrate, and establishment of an electro-deposition system is completed; and S3, electro-deposition parameters and laser parameters are set, a laser focus performs reciprocating scanning in the modified area of the modified substrate, and localized electro-deposition is completed. According to the method, ultrafast laser is introduced into the substrate modification and electrochemical deposition process, the machining efficiency and the deposition effect can be improved, and grain refinement can be achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of localized electrodeposition, and relates to a localized electrochemical deposition method and device for high-efficiency grain refinement. Background Art

[0002] Localized electrochemical deposition refers to a technology that induces ion migration in a solution under a local electric field and forms localized deposition by obtaining electrons on the cathode plate. Defects such as pores and structures during the localized electrochemical deposition process will affect the performance of the localized electrochemical deposition device. Ultrafast lasers have the advantages of short pulse time and high peak power, and also carry a high-frequency strong electric field. The introduction of ultrafast lasers in the deposition process is expected to improve deposition defects. Photons can regulate the reduction process of ions in the deposition area, and high-frequency strong electric fields can regulate the behavior of ions.

[0003] With reference to the Chinese patent document with application number CN202111492737.6, a method and device for localized electrodeposition using laser for local activation of anode is disclosed, laser irradiation and electrochemical reaction are used to remove the oxide film in a specific area on the workpiece, and the current direction of the electrochemical circuit is adjusted to localize electrochemical deposition in the area where the oxide film is removed on the workpiece. In the prior art, local activation is achieved by inducing electrolysis by laser irradiation, which avoids the substrate damage caused by direct laser etching of the oxide layer or the passivation layer, and the activation and deposition are both carried out in situ under the liquid, thereby improving the efficiency, precision and surface properties of the local coating. However, when localized deposition is performed in the prior art, it is necessary to move the processed workpiece, but the workpiece is placed in the solution and the moving speed is slow, which makes it difficult to introduce the laser into the local area of ​​the localized electrochemical deposition, resulting in low processing efficiency and poor deposition effect, and it is difficult to achieve the regulation of crystallization characteristics; the poor deposition effect makes the subsequent processing requirements higher and the process complicated; in addition, when the workpiece in the solution is moved, the liquid level of the solution will fluctuate, thereby changing the transmission path, and the laser is prone to defocusing, resulting in poor deposition effect. Summary of the invention

[0004] In view of the technical problem that the existing localized electrodeposition has a slow moving speed, which makes it difficult to introduce the laser into the local area of ​​the localized electrochemical deposition, resulting in low processing efficiency and poor deposition effect, the present invention provides a localized electrochemical deposition method and device with high-efficiency grain refinement.

[0005] The present invention focuses an ultrafast laser on the surface of a substrate for modification, and then places the modified substrate into an electroplating solution as a cathode plate, and realizes localized electrodeposition by controlling the laser focus to quickly scan the modified area. The invention has the characteristics of fast moving speed, and it is easy to introduce the laser into the local area of ​​localized electrochemical deposition, which can not only improve the processing efficiency and deposition effect, but also facilitate the realization of grain refinement.

[0006] In order to achieve the above object, the technical solution adopted by the present invention is:

[0007] A localized electrochemical deposition method for high-efficiency grain refinement comprises the following steps:

[0008] S1. Substrate modification

[0009] After the substrate is cleaned, a corresponding pattern is written and modified on the cathode surface of the substrate using a shaped ultrafast laser according to the pattern requirements to be processed, thereby obtaining a modified substrate;

[0010] S2. Constructing an Electrodeposition System

[0011] The modified substrate is fixed in an electroplating tank, and an anode plate is fixed below the modified substrate in the electroplating tank, and an electrolyte is added to the electroplating tank, and the liquid level of the electrolyte is higher than the upper surface of the modified substrate; a laser is placed above the electroplating tank, and at the same time, the laser is focused on the cathode surface of the modified substrate, and the electrodeposition system is established;

[0012] S3. Localized electrodeposition

[0013] The electrodeposition parameters and laser parameters are set, and the laser focus position is moved so that the laser focus performs reciprocating scanning in the surface modification area of ​​the modified substrate until the scanning is completed, thereby completing the localized electrodeposition.

[0014] It is further defined that in step S1, the material of the substrate is a conductor material or a semiconductor material.

[0015] It is further defined that in step S1, the material of the substrate is stainless steel, copper, aluminum or silicon.

[0016] It is further defined that in step S2, the electrolyte includes a metal solution and an inhibitor; in the electrolyte, the concentration of the metal solution is 0.05 mol / L-0.4 mol / L.

[0017] It is further defined that the metal solution is a copper sulfate solution, a silver nitrate solution and a potassium gold cyanide solution; and the inhibitor is sodium chloride, sodium nitrate or sodium cyanide.

[0018] It is further defined that in step S3, the laser parameters are: pulse energy 0.1 μJ-40 uJ, pulse width 0.25 ps-10 ps, ​​repetition frequency 1 MHz, scanning speed 200 mm-1000 mm / s, and filling interval 20 μm-100 μm.

[0019] It is further defined that in step S3, the electrodeposition parameters are: voltage 0.2V-1V, time 0min-40min.

[0020] A device for realizing the localized electrochemical deposition method for high-efficiency grain refinement, the device comprising:

[0021] Laser modification unit: used to perform writing modification on the substrate to form a modified substrate;

[0022] And a localized electrodeposition unit: used for performing localized electrodeposition on the modified substrate after being modified by the laser modification unit.

[0023] It is further defined that the laser modification unit includes an ultrafast laser source, a laser control device, a laser reflector and a laser focusing lens which are arranged in sequence from front to back along the laser optical path. The laser emitted by the ultrafast laser source is formed into a shaped ultrafast laser by the laser control device, and then is focused on the cathode surface of the substrate by the laser reflector and the laser focusing lens to perform writing modification on the substrate to form a modified substrate.

[0024] It is further defined that the localized electrodeposition unit includes a power supply, an electroplating cell, a cathode plate, an anode plate, an ultrafast laser source, a laser control device and a scanning galvanometer, the electroplating cell is filled with an electrolyte, the cathode plate and the anode plate are placed in the electroplating cell from top to bottom and are both immersed in the electrolyte, the cathode plate is a modified substrate that has been modified by engraving by a laser modification unit, the power supply is placed outside the electroplating cell and is respectively connected to the cathode plate and the anode plate, the ultrafast laser source, the laser control device and the scanning galvanometer are all located above the electroplating cell, and the laser emitted by the ultrafast laser source is focused on the surface modification area of ​​the modified substrate after passing through the laser control device and the scanning galvanometer for localized electrodeposition.

[0025] The beneficial effects of the present invention are:

[0026] 1. The present invention focuses an ultrafast laser on the cathode surface of a substrate for modification, and then places the modified substrate into an electroplating solution as a cathode plate, and realizes localized electrodeposition by controlling the laser focus to quickly scan the modified area; it has the characteristics of fast moving speed, and it is easy to introduce the laser into the local area of ​​localized electrochemical deposition, which can not only improve the processing efficiency and deposition effect, but also facilitate the realization of grain refinement.

[0027] 2. The present invention performs writing modification on the substrate before electrodeposition, which can induce a micro-nanoscale surface structure on the cathode substrate. This structure has local field enhancement characteristics, can achieve localized electrochemical deposition effects under ordinary electrochemical reaction conditions, and can improve the bonding strength between the deposition structure and the substrate, which can promote the refinement of electrodeposition grains.

[0028] 3. In the process of electrodeposition, the present invention focuses the laser on the cathode surface of the base material, and controls the focus to scan rapidly in the modified area through a scanning galvanometer, thereby realizing the application of the light field during the localized deposition process, which is easy to operate, has high processing efficiency, and has a better grain refinement effect.

[0029] 4. The present invention adopts ultrafast laser to regulate localized electrodeposition. During electrodeposition, the laser focus is moved to avoid shaking caused by rapid movement of the electrolyte, thereby ensuring that the transmission path does not change, avoiding defocusing, and improving the stability of electrochemical deposition. At the same time, the laser moves at a fast speed, which can improve the efficiency of laser regulation of electrochemical reactions.

[0030] 5. The localized electrochemical deposition method provided by the present invention realizes the regulation of electrochemical deposition by setting electrochemical deposition parameters and laser parameters so that the laser focus is reciprocatedly scanned in the writing and modification area of ​​the modified substrate. The laser regulation of electrochemical deposition is realized by adjusting the scanning galvanometer parameters or the ultrafast laser parameters, thereby realizing the refinement of the deposited grains.

[0031] 6. The electroplating method provided by the present invention is simple, economical and operable, and is widely applicable to the electroplating of various conductors or semiconductor materials by laser.

[0032] 7. The present invention also provides a localized electrochemical deposition device, including a laser modification unit and a localized electrochemical deposition unit, for performing writing modification on a substrate; and for performing localized electrochemical deposition on the substrate modified by the laser modification unit. The entire device has a simple structure and is easy to operate. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the method for ultrafast laser controlled localized electrochemical deposition of the present invention;

[0034] Figure 2 Schematic diagram of the ultrafast laser controlled localized electrochemical deposition device of the present invention; A is a laser modification unit, and B is a localized electrochemical deposition unit;

[0035] Figure 3 This is the result of regulating the deposition by the laser energy density in Example 1 of the present invention;

[0036] Figure 4 This is the result of the control of the deposition by the scanning speed in Example 2 of the present invention;

[0037] Figure 5 This is a comparison diagram of electrochemical deposition results between the control group and the test group of the present invention;

[0038] in:

[0039] 1-laser control device; 2-laser reflector; 3-laser focusing lens; 4-substrate; 5-scanning galvanometer; 6-electroplating cell; 7-cathode plate; 8-anode plate. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1 The present invention provides a method for localized electrochemical deposition regulated by ultrafast laser: during the electrochemical deposition process, the laser is focused on the cathode surface of the substrate, and the focus is controlled by a scanning galvanometer to quickly scan the modified area, thereby realizing the application of the light field during the localized deposition process; a suitable laser scanning interval is set in combination with the size of the focused spot to achieve uniform laser irradiation, and the irradiation time interval of the modified area is controlled by changing the laser scanning speed. By changing the pulse energy, pulse width and repetition frequency, from the perspective of the influence of light and electric field on ions and double electric layers, combined with the deposition results under different parameters, the influence of laser on the electrochemical deposition process is analyzed.

[0042] The present invention provides a localized electrochemical deposition method for high-efficiency grain refinement, comprising the following steps:

[0043] S1. Substrate modification

[0044] After the substrate 4 is cleaned, a corresponding pattern is written and modified on the cathode surface of the substrate 4 using a shaped ultrafast laser according to the pattern requirements to be processed, thereby obtaining a modified substrate.

[0045] In this step S1 , the material of the substrate 4 is a conductor material or a semiconductor material.

[0046] Preferably, the material of the substrate 4 is stainless steel, copper, aluminum or silicon.

[0047] In this step, a laser control device 1 is used to spatially shape the Gaussian beam to generate a suitable laser focal field, such as a flat-top distributed ultrafast laser, so as to perform writing modification on the cathode surface of the substrate 4 (the upper surface or lower bottom surface of the substrate 4 is defined as the cathode surface) to form a modified substrate.

[0048] S2. Constructing an Electrodeposition System

[0049] The modified substrate is fixed in the electroplating tank 6, and the anode plate 8 is fixed below the modified substrate in the electroplating tank 6, and the electrolyte is added to the electroplating tank 6 and the liquid level of the electrolyte is higher than the upper surface of the modified substrate; the laser is placed above the electroplating tank 6, and at the same time, the laser is focused on the cathode surface of the modified substrate to complete the establishment of the electrodeposition system.

[0050] In step S2, the electrolyte includes a metal solution and an inhibitor; in the electrolyte, the concentration of the metal solution is 0.2 mol / L.

[0051] Preferably, the metal solution is a copper sulfate solution, a silver nitrate solution and a potassium gold cyanide solution.

[0052] Preferably, the inhibitor is sodium chloride, sodium nitrate or sodium cyanide.

[0053] S3. Localized electrodeposition

[0054] The electro-deposition parameters and laser parameters are set, and the laser position is moved so that the laser focus performs reciprocating scanning in the writing and modification area of ​​the modified substrate until the scanning is completed, thereby completing the localized electro-deposition.

[0055] In step S3 of the present invention, the laser parameters are: pulse energy 0.1 μJ-40 uJ, pulse width 0.25 ps-10 ps, ​​repetition frequency 1 MHz, scanning speed 200 mm-1000 mm / s, and filling interval 20 μm-100 μm.

[0056] In step S3 of the present invention, the electrodeposition parameters are: voltage 0.2V-1V, time 0min-40min.

[0057] The innovation of the present invention lies in: while realizing localized electrodeposition, the laser is conveniently introduced into the localized electrodeposition area by moving the laser focus, and the laser control on the electrodeposition is realized by setting the laser application method and laser parameters; by changing the pulse energy, pulse width, repetition frequency, scanning speed, filling interval and other parameters, the control effect of the laser on the deposited body during the electrodeposition process is studied.

[0058] The present invention also provides a device for realizing a localized electrochemical deposition method for high-efficiency grain refinement. Figure 2 , the device includes a laser modification unit and a localized electrodeposition unit.

[0059] Laser modification unit: used for performing writing modification on the substrate 4 to form a modified substrate.

[0060] Localized electrodeposition unit: used for localized electrodeposition of the modified substrate after being modified by the laser modification unit.

[0061] See also Figure 2 The laser modification unit of the present invention includes an ultrafast laser source, a laser control device 1, a laser reflector 2 and a laser focusing lens 3 which are arranged in sequence from front to back along the laser optical path. The laser emitted by the ultrafast laser source is formed into a shaped ultrafast laser by the laser control device 1, and then is focused on the cathode surface of the substrate 4 by the laser reflector 2 and the laser focusing lens 3, and the substrate 4 is modified by writing to obtain a modified substrate.

[0062] See also Figure 2 The localized electrodeposition unit of the present invention comprises a power supply, an electroplating cell 6, a cathode plate 7, an anode plate 8, an ultrafast laser source, a laser control device 1 and a scanning galvanometer 5. The electroplating cell 6 is filled with an electrolyte. The cathode plate 7 and the anode plate 8 are placed in the electroplating cell 6 from top to bottom and are immersed in the electrolyte. The cathode plate 7 is a modified substrate modified by the laser modification unit. The power supply is placed outside the electroplating cell 6 and is connected to the cathode plate 7 and the anode plate 8 respectively. The ultrafast laser source, the laser control device 1 and the scanning galvanometer 5 are all located above the electroplating cell 6. The laser emitted by the ultrafast laser source is focused on the modified area of ​​the modified substrate after passing through the laser control device 1 and the scanning galvanometer 5 to perform localized electrodeposition.

[0063] The device of the localized electrochemical deposition method for realizing high-efficiency grain refinement provided by the present invention also includes a Z-axis displacement platform, the electroplating pool 6 is fixed on the Z-axis displacement platform and placed below the scanning galvanometer 5, the modified substrate is fixed in the electroplating pool 6, the modified substrate is equivalent to the cathode plate 7, and an anode plate 8 is fixed directly below the cathode plate 7; and an electrolyte is added to the electroplating pool 6, and the upper water level of the electrolyte is higher than the upper surface of the cathode plate 7; the height of the Z-axis displacement platform in the vertical direction is adjusted so that the laser emitted by the ultrafast laser source is focused on the cathode surface of the cathode plate 7 (that is, the modified side of the substrate 4) after passing through the laser control device 1 and the scanning galvanometer 5.

[0064] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0065] It should be noted that, unless otherwise specified, the reagents, chemicals, etc. used in the following examples are all commercially available products conventional in the art. Unless otherwise specified, the operations used in the following examples are all conventional operations in the art.

[0066] Example 1

[0067] In this embodiment, the regulation and influence of laser pulse energy on localized electrochemical deposition is mainly studied.

[0068] This embodiment provides a localized electrochemical deposition method for high-efficiency grain refinement, comprising the following steps:

[0069] The first step: using stainless steel as the base material, and performing blanking and ultrasonic cleaning to obtain a stainless steel base 4 for standby use.

[0070] Step 2: According to the pattern required by the processing, the cathode surface of the stainless steel substrate 4 is modified by writing with an ultrafast laser, and an array of equally spaced lines is written on the cathode surface to obtain a modified substrate. Through writing modification, localized deposition can be achieved while achieving high efficiency, density, and bonding strength.

[0071] Step 3: prepare a copper sulfate solution with a concentration of 0.2 mol / L, and add an inhibitor (sodium chloride) to the copper sulfate solution to obtain an electrolyte; fix the electroplating cell 6 on the Z-axis displacement platform and place it below the scanning galvanometer 5, fix the modified substrate in the electroplating cell 6, the modified substrate is equivalent to the cathode plate 7, and an anode plate 8 is fixed directly below the cathode plate 7; add the prepared electrolyte into the electroplating cell 6 so that the electrolyte completely immerses the cathode plate 7, adjust the height of the Z-axis displacement platform in the vertical direction, and focus the laser on the cathode surface of the cathode plate 7.

[0072] Step 4: Localized electrodeposition

[0073] The electro-deposition parameters and laser parameters are set, and the laser position is moved so that the laser focus performs reciprocating scanning in the writing and modification area of ​​the modified substrate until the scanning is completed, thereby completing the localized electro-deposition.

[0074] In this embodiment, three sets of pulse energy density parameters (0.004 J / cm 2 , 0.008J / cm 2 , 0.016J / cm 2 ), used to study the effect of laser pulse energy on localized electrochemical deposition.

[0075] The electroplating voltage is set to 0.2V, the electroplating time is set to 20min, the laser scanning speed is set to 1000mm / s (better deposition), the power is turned on, the cathode plate 7 and the anode plate 8 are powered on, and the scanning galvanometer 5 is turned on at the same time. The laser generated by the ultrafast laser source is focused on the cathode surface of the cathode plate 7 (i.e., the side of the substrate 4 to be modified by writing) after passing through the laser control device 1 and the scanning galvanometer 5. The laser scans in the modified area according to the set laser scanning speed. After the set time is reached, the electroplating is completed; the ultrafast laser source and the power supply are turned off, and the cathode plate 7 is taken out to obtain the deposited body.

[0076] In this embodiment, the deposition bodies under different laser pulse energy densities are characterized and analyzed by using scanning electron microscopy and profilometer and other characterization equipment. Figure 3 As shown, it is a surface morphology diagram under different laser energy densities. When the laser energy density is too high, the base 4 of the deposited body will be damaged, and pores will appear on the surface. When the laser energy density is moderate, the base 4 of the deposited body will not be damaged, and the deposited grains can be refined.

[0077] Example 2

[0078] In this embodiment, the deposition effect of laser scanning speed on localized electrochemical deposition is mainly studied.

[0079] The localized electrochemical deposition method for high-efficiency grain refinement provided in this embodiment includes the following steps:

[0080] The first step: using stainless steel as the substrate 4 material, and performing blanking and ultrasonic cleaning to obtain a stainless steel substrate for standby use.

[0081] Step 2: According to the pattern required by the processing, the cathode surface of the stainless steel substrate is modified by ultrafast laser writing, and an array of equally spaced lines is written on the cathode surface to obtain a modified substrate. Through writing modification, localized deposition can be achieved while achieving high efficiency, density, and bonding strength.

[0082] Step 3: Prepare a copper sulfate solution with a concentration of 0.2 mol / L, add an inhibitor (sodium chloride) to the copper sulfate solution to obtain an electrolyte. Fix the electroplating cell 6 on the Z-axis displacement platform and place it below the scanning galvanometer 5, fix the modified substrate in the electroplating cell 6, the modified substrate is equivalent to the cathode plate 7, and the anode plate 8 is fixed directly below the cathode plate 7; add the prepared electrolyte to the electroplating cell 6 so that the electrolyte completely immerses the cathode plate 7, adjust the vertical height of the Z-axis displacement platform, and focus the laser on the cathode surface of the cathode plate 7.

[0083] Step 4: Localized electrodeposition

[0084] The electro-deposition parameters and laser parameters are set, and the laser position is moved so that the laser focus performs reciprocating scanning in the writing and modification area of ​​the modified substrate until the scanning is completed, thereby completing the localized electro-deposition.

[0085] In this embodiment, three sets of laser scanning speed parameters are set, namely 1000mm / s, 400mm / s, and 200mm / s, the electroplating voltage is set to 0.2V, the electroplating time is set to 20min, the power is turned on, the cathode plate 7 and the anode plate 8 are powered on, and the scanning galvanometer 5 is turned on at the same time. The laser generated by the ultrafast laser source is focused on the cathode surface of the cathode plate 7 (i.e., the side of the substrate 4 to be modified by writing) after passing through the laser control device 1 and the scanning galvanometer 5. The laser scans in the modified area according to the set laser scanning speed. After the set time is reached, the electroplating is completed; the ultrafast laser source and the power supply are turned off, and the cathode plate 7 is taken out to obtain the deposited body.

[0086] In this embodiment, the sediments at different scanning speeds were characterized and analyzed by using scanning electron microscopy and profilometer and other characterization equipment. Figure 4 , which are EBSD morphologies at different scanning speeds. When the scanning speed is too slow, the deposited body is damaged and the grains on the deposited body are missing. When the laser scanning speed is faster, the deposited grains are refined and the deposited body is not damaged.

[0087] Furthermore, the effect of the localized electrochemical deposition method of the present invention is verified and illustrated by the following comparative test.

[0088] Experimental group: localized electrochemical deposition was carried out according to the method of Example 1. After ultrafast laser irradiation (laser energy density was 0.004 J / cm 2 ), the laser scanning speed is 1000 mm / s, the deposition voltage is 0.2 V, and the deposition time is 20 min.

[0089] Control group: The difference from the experimental group is that no laser irradiation was applied.

[0090] After the localized electrochemical deposition was completed in the above test group and control group, the electro-deposited products were characterized and analyzed by scanning electron microscopy and profilometer. The results are as follows: Figure 5 shown.

[0091] See also Figure 5 When no laser irradiation is applied, the deposited grain size is larger and the distribution is more dispersed; after ultrafast laser irradiation, the deposition effect is best, the deposition is denser and has no holes. After EBSD characterization, the grains show a random orientation distribution.

[0092] Obviously, the above embodiments are merely examples for the purpose of clear explanation, and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived from these are still within the scope of protection of the invention.

Claims

1. A localized electrochemical deposition method for high-efficiency grain refinement, characterized in that: The following steps are involved: S1. Substrate modification After the substrate (4) is cleaned, a corresponding pattern is written and modified on the cathode surface of the substrate (4) using a shaped ultrafast laser according to the pattern requirements to be processed, thereby obtaining a modified substrate; S2. Constructing an Electrodeposition System The modified substrate is fixed in an electroplating tank (6), and an anode plate (8) is fixed below the modified substrate in the electroplating tank (6), and an electrolyte is added to the electroplating tank (6) so that the liquid level of the electrolyte is higher than the upper surface of the modified substrate; a laser is placed above the electroplating tank (6) and the laser is focused on the cathode surface of the modified substrate to complete the establishment of an electrodeposition system; S3. Localized electrodeposition The electrodeposition parameters and laser parameters are set, and the laser focus position is moved so that the laser focus performs reciprocating scanning in the surface modification area of ​​the modified substrate until the scanning is completed, thereby completing the localized electrodeposition.

2. The localized electrochemical deposition method for high-efficiency grain refinement according to claim 1, characterized in that: In the step S1, the material of the substrate (4) is a conductor material or a semiconductor material.

3. The localized electrochemical deposition method for high-efficiency grain refinement according to claim 1, characterized in that: In the step S1, the material of the substrate (4) is stainless steel, copper, aluminum or silicon.

4. The localized electrochemical deposition method for high-efficiency grain refinement according to claim 1, characterized in that: In the step S2, the electrolyte includes a metal solution and an inhibitor; in the electrolyte, the concentration of the metal solution is 0.05 mol / L-0.4 mol / L.

5. The localized electrochemical deposition method for high-efficiency grain refinement according to claim 4, characterized in that: The metal solution is a copper sulfate solution, a silver nitrate solution and a potassium gold cyanide solution; the inhibitor is sodium chloride, sodium nitrate or sodium cyanide.

6. The localized electrochemical deposition method for high-efficiency grain refinement according to claim 1, characterized in that: In step S3, the laser parameters are: pulse energy 0.1 μJ-40 uJ, pulse width 0.25 ps-10 ps, ​​repetition frequency 1 MHz, scanning speed 200 mm-1000 mm / s, and filling interval 20 μm-100 μm.

7. The localized electrochemical deposition method for high-efficiency grain refinement according to claim 1, characterized in that: In step S3, the electrodeposition parameters are: voltage 0.2V-1V, time 0min-40min.

8. A device for realizing the localized electrochemical deposition method for high-efficiency grain refinement as claimed in claim 1, characterized in that: The device comprises: Laser modification unit: used for performing writing modification on the substrate (4) to form a modified substrate; And a localized electrodeposition unit: used for performing localized electrodeposition on the modified substrate after being modified by the laser modification unit.

9. The device according to claim 8, characterized in that The laser modification unit comprises an ultrafast laser source, a laser control device (1), a laser reflector (2) and a laser focusing lens (3) which are arranged in sequence from front to back along a laser optical path. The laser emitted by the ultrafast laser source is formed into a shaped ultrafast laser by the laser control device (1), and then is focused on the cathode surface of a substrate (4) by the laser reflector (2) and the laser focusing lens (3), so as to perform writing modification on the substrate (4) and form a modified substrate.

10. The device according to claim 8, characterized in that The localized electrodeposition unit comprises a power source, an electroplating pool (6), a cathode plate (7), an anode plate (8), an ultrafast laser source, a laser control device (1) and a scanning galvanometer (5); the electroplating pool (6) is filled with an electrolyte; the cathode plate (7) and the anode plate (8) are placed in the electroplating pool (6) from top to bottom and are immersed in the electrolyte; the cathode plate (7) is a modified substrate that has been modified by a laser modification unit; the power source is placed outside the electroplating pool (6) and is respectively connected to the cathode plate (7) and the anode plate (8); the ultrafast laser source, the laser control device (1) and the scanning galvanometer (5) are all located above the electroplating pool (6); the laser emitted by the ultrafast laser source is focused on the surface modification area of ​​the modified substrate after passing through the laser control device (1) and the scanning galvanometer (5) to perform localized electrodeposition.

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