Small-size tubular plate type water vapor condenser

Abstract

The invention belongs to the technical field of gas-liquid separation, and particularly relates to a small-size tubular plate type water vapor condenser which comprises a cylindrical heat exchange cylinder, a plurality of heat exchange pieces of the same structure are further arranged in the heat exchange cylinder, and the heat exchange pieces are detachably installed in the heat exchange cylinder; each heat exchange sheet is provided with an inclined surface facing materials, a heat exchange surface in close contact with the heat exchange cylinder, an arc-shaped structure for forming a vortex and a through hole structure for increasing gas flux, the number and angle of the heat exchange sheets and distribution of through holes in the heat exchange sheets can be adjusted according to specific water vapor condensation working conditions, so that water vapor is condensed efficiently, and the heat exchange efficiency is improved. And the volume is reduced, the application range of the condenser is widened, and the water vapor collection efficiency of the condenser per unit volume is improved.

Description

Technical Field

[0001] This patent relates to the field of environmental detection and analysis, and in particular to a small-volume tubular plate water vapor condenser for purifying water samples. Background Art

[0002] In the field of environmental monitoring and analysis, especially in the field of radiation environmental monitoring, in order to purify water samples, heating distillation is often used to remove impurities and metal ions, and the water vapor is condensed to obtain the purified sample.

[0003] Traditional methods mostly use water cooling. The condensation speed of water vapor is determined by the heat exchange efficiency between condensed water and condenser tubes and the heat exchange area between water vapor and condenser tubes. At present, glass serpentine condenser tubes are commonly used. The external dimensions are generally about 4cm in diameter and 20-30cm in length. The diameter of the serpentine tube for heat exchange with water vapor is about 0.7cm, 70-110cm in length, and the heat exchange area is about 156-242cm 2 Under the best working conditions, the water vapor condensation rate is only 60-100 ml per hour (calculated based on the volume of liquid after condensation per unit time), and the water sample recovery rate is generally 90-95%.

[0004] In some experimental treatment processes, it is hoped that the water vapor recovery rate is as high as possible. For example, in the evaporation and concentration of nuclear power liquid effluent, the tritium content in the liquid effluent is very high (usually 10 5 Bq / L or above), if the water vapor generated in the evaporation concentration process is not recovered, or the recovery rate is not high enough, then these water vapors with high tritium levels will use the rapid diffusion and permeation properties of tritium to contaminate other low-tritium level samples in the laboratory or nearby laboratories, so in this scenario, technicians hope that the recovery rate will be as high as possible. In some scenarios where water vapor samples need to be completely recovered, the higher the recovery rate, the better, such as collecting air vapor as an experimental analysis sample. To obtain a high recovery rate, the usual method is to increase the residence time of water vapor in the condenser and improve the heat exchange efficiency at the same time to condense the water vapor as much as possible. The heat exchange efficiency can be improved by increasing the heat exchange temperature difference or increasing the heat exchange area.

[0005] In addition to the water vapor recovery rate, the condensation speed is also a factor that needs to be considered in many experimental processes. If the speed is too slow, it will directly affect the work efficiency.

[0006] In publicly available devices or technologies: (1) In the field of environmental monitoring and analysis, the most widely used are the typical structures of glass serpentine condensers, such as the structure disclosed in CN203501832U, and fin condensers (similar to air conditioning evaporators), and fin condensers are mostly made of metal. For glass serpentine condensers, if a higher condensation speed and water vapor recovery rate are to be achieved, the volume of the condenser needs to be continuously increased, which causes great obstacles and inconveniences to technicians under general monitoring and analysis laboratory conditions. For general fin condensers, if the fins are too dense, they are prone to ice and block the water vapor channel; if they are too sparse, the water vapor passes through quickly and the residence time is too short, affecting the recovery rate.

[0007] (2) In industry, there are many tubular or plate-shaped condensers, which are mainly used to handle ultra-large volumes of liquids. Space limitations are rarely considered, and the recovery rate requirements are not as high as those in the field of environmental monitoring and analysis. With the same volume as a glass serpentine condenser, the condensation speed in laboratory applications is not faster than that of a glass serpentine condenser.

[0008] (3) There are also semiconductor refrigerators, which are generally flat or have a small number of upright fins as heat exchangers. It is difficult to meet the requirements for the residence time of water vapor, thus affecting the recovery rate.

[0009] Typically, a steam condenser such as the one disclosed in Chinese patent CN204165416U realizes condensation of steam by passing cooling water into the tube side and gas flowing through the shell side. Such a condenser is usually large in scale. If used in the field of environmental monitoring, the condensation efficiency will be reduced because the cooling medium occupies most of the volume.

[0010] Another example is the air heat exchanger disclosed in US20190283191A1, which improves the gas permeability by arranging the fins in a radioactive manner. However, the gas residence time of this heat exchanger is too short, requiring a larger heat exchange, and it is difficult for the laboratory to meet the above heat exchange conditions.

[0011] Based on the problems existing in the above-mentioned prior art, the applicant has proposed a small-volume tubular plate water vapor condenser. The condenser has high condensation efficiency and good gas flux. The condensation efficiency can be easily adjusted according to actual needs. Summary of the invention

[0012] In view of the problem of mismatch between condensation efficiency and gas passage rate in the prior art, the technical bias that it is inconvenient to adjust the condensation power or efficiency of the condenser or the existing condenser needs to increase the volume if high condensation efficiency is required, and the technical problem that it is inconvenient to change the condensation efficiency under the existing laboratory conditions, the present invention adopts the following technical solutions: In the first aspect, a small-volume tubular plate-type steam condenser comprises a heat exchange tube, which is in a cylindrical shape and has a first end opening and a second end opening, wherein the first end opening is a material inlet and the second end opening is a material outlet, and a plurality of heat exchange fins with the same structure are also arranged in the heat exchange tube, and the heat exchange fins can be detachably installed in the heat exchange tube.

[0013] Furthermore, the heat exchange plate has a first surface that is detachably mounted on the heat exchange tube, a plurality of screw holes are provided on the first surface, and the first surface is sealingly mounted on an inner wall of the heat exchange tube.

[0014] Furthermore, the heat exchange plate has a second surface and a third surface in contact with the heat exchange tube, and the second surface and the third surface have the same structure and are in sealing contact with the inner wall of the heat exchange tube.

[0015] Furthermore, the heat exchange plate has a fifth surface for guiding materials, and the fifth surface has an arc structure.

[0016] Furthermore, the fourth surface and the fifth surface of the heat exchange plate form an edge with a gap from the inner wall of the heat exchange tube.

[0017] Furthermore, the cross section of the heat exchange tube is square or rectangular.

[0018] Furthermore, the inner wall and the outer wall of the heat exchange tube are polished, and the Ra value of the inner and outer walls of the heat exchange tube is 0.1-0.5 μm.

[0019] Furthermore, the first surface of the heat exchange plate is polished, and the threaded holes on the first surface are blind holes.

[0020] Furthermore, the cross section of the heat exchange tube is a square, the side length of the square is 3-6 cm, the length of the heat exchange tube is 30-50 cm, and the tube wall thickness of the heat exchange tube is 2-4 mm.

[0021] Furthermore, the material of the heat exchange tube is a corrosion-resistant alloy, which can be an aluminum alloy; the material of the heat exchange plate is any one of copper, aluminum alloy, silver alloy, aluminum nitride and / or silicon carbide.

[0022] Furthermore, the angle between the fourth surface of the heat exchange material and the cross section of the heat exchange tube is 10-40°, preferably 20°.

[0023] Furthermore, the surfaces of the fourth surface and the fifth surface are provided with a plurality of through holes penetrating the heat exchange fins, and the total area of ​​the through holes occupies 5-60% of the area of ​​the heat exchange fins.

[0024] Furthermore, the arc diameter of the arc surface of the fifth surface is 15-20 cm.

[0025] Furthermore, a plurality of semiconductor refrigerators are arranged on the outer wall of the heat exchange cylinder corresponding to the first surface of the heat exchange plate.

[0026] The second aspect of the present invention also discloses another scheme, a small-volume tubular plate water vapor condenser, comprising a heat exchange tube, which is cylindrical and has a first end opening and a second end opening, wherein the first end opening is a material inlet, and the second end opening is a material outlet, and a plurality of heat exchange fins with the same structure are also arranged in the heat exchange tube, and the heat exchange fins can be detachably installed in the heat exchange tube.

[0027] Furthermore, the heat exchange plate has a first surface that can be detachably mounted on the heat exchange tube, a plurality of screw holes are provided on the first surface, and the first surface is sealingly mounted on an inner wall of the heat exchange tube; the heat exchange plate has the same shape as the inner wall of the heat exchange tube, and the heat exchange plate has an arc-shaped notch for materials to pass through.

[0028] Furthermore, the heat exchange plate gradually thickens from the arc-shaped notch toward the other end of the cross section of the inner wall of the heat exchange cylinder.

[0029] Furthermore, the first surface of the heat exchange plate is perpendicular to the inner wall of the heat exchange tube and is provided with a plurality of threaded holes, and the threaded holes correspond to the threaded holes on the heat exchange tube.

[0030] Furthermore, the inner wall and the outer wall of the heat exchange tube are polished, and the Ra value of the inner and outer walls of the heat exchange tube is 0.1-0.5 μm.

[0031] Furthermore, the first surface of the heat exchange plate is polished, and the threaded holes on the first surface are blind holes.

[0032] Furthermore, the material of the heat exchange tube is a corrosion-resistant alloy, which can be an aluminum alloy; the material of the heat exchange plate is any one of copper, aluminum alloy, silver alloy, aluminum nitride and / or silicon carbide.

[0033] Furthermore, the angle between the second surface of the heat exchange plate facing the material and the cross section of the heat exchange tube is 10-40°, preferably 20°.

[0034] Furthermore, the heat exchange plate has a third surface facing away from the incoming material, the third surface has an arc-shaped cross section, and the arc diameter of the arc cross section is 15-20 cm.

[0035] Furthermore, the surfaces of the second surface and the third surface are provided with a plurality of through holes penetrating the heat exchange fins, and the total area of ​​the through holes occupies 5-60% of the area of ​​the heat exchange fins.

[0036] Furthermore, the arc diameter of the arc surface of the third surface is 15-20 cm.

[0037] Furthermore, a plurality of semiconductor refrigerators are arranged on the outer wall of the heat exchange cylinder corresponding to the first surface of the heat exchange plate.

[0038] The beneficial effects of this patent are: 1. Under the same volume, the heat exchange area in the present invention is greatly increased, thereby greatly improving the heat exchange rate. Taking an embodiment as an example, the heat exchange area of ​​a condenser with a volume of 4cm*4cm*30cm can reach 460cm 2 , which is nearly twice that of a serpentine glass condenser of the same volume.

[0039] 2. On the one hand, the heat exchange area is enlarged, and on the other hand, water vapor passes through the circulation pipe structure and forms small vortices at the arc surface, which increases the residence time of water vapor in the heat exchanger and increases the water vapor recovery rate. Taking an embodiment as an example, a condenser with a volume of 4cm*4cm*30cm has a water vapor condensation rate of 230ml per hour (calculated based on the volume of liquid after condensation per unit time), and the water sample recovery rate exceeds 99%.

[0040] 3. The angle φ between the condensing plate facing the material surface and the cross-section of the heat exchange tube is adjustable and can be adjusted according to the size of the water vapor flux to obtain a working state with a higher condensation rate and a higher recovery rate.

[0041] 4. There are circular holes on the surface facing the material that penetrate the arc surface to reduce the resistance of water vapor passing through and provide a collection channel for condensed water. The number and diameter of holes can also be increased or decreased according to the working conditions.

[0042] 5. The small-volume tubular plate type steam condenser of the present invention can replace the type of heat exchange fins according to actual working conditions, thereby achieving the purpose of adjusting the condensation efficiency and changing the condensation speed.

[0043] 6. The semiconductor refrigeration sheet is used for refrigeration, which avoids the complicated device structure caused by the circulating condensing medium and increases the use environment of the water vapor condenser. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 A cross-sectional view of a small-volume tubular plate type water vapor condenser according to a certain embodiment; Figure 2 A cross-sectional view of a heat exchange fin of a small-volume tubular plate type steam condenser according to a certain embodiment; Figure 3 A schematic diagram of the layout of heat exchange fins of a small-volume tubular plate-type steam condenser according to a certain embodiment; Figure 4 An exploded view of a small-volume tubular plate type water vapor condenser according to a certain embodiment; Figure 5A cross-sectional view of a small-volume tubular plate-type steam condenser after assembly according to a certain embodiment; Figure 6 A schematic diagram of a heat exchanger fin of a small-volume tubular plate type steam condenser according to a certain embodiment; Figure 7 The present invention is a physical schematic diagram of a small-volume tubular plate type water vapor condenser according to a certain embodiment.

[0045] In the figure: 1, heat exchange tube, 2, first end opening, 3, second end opening, 4, heat exchange plate, 40, through hole, 41, first surface, 42, second surface, 43, third surface, 44, fourth surface, 45, fifth surface, 46, gap, 401, sixth surface, 402, seventh surface, 403, eighth surface, 400, first through hole, 5, semiconductor refrigerator. DETAILED DESCRIPTION

[0046] The following will clearly and completely describe the technical solutions in the embodiments of this patent in conjunction with the drawings in the embodiments of this patent. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Example 1

[0047] In this embodiment, refer to Figure 1-7 A small-volume tubular plate-type steam condenser includes a heat exchange tube 1, which is in a cylindrical shape and has a first end opening 2 and a second end opening 3. The first end opening 2 is a material inlet, and the second end opening 3 is a material outlet. The heat exchange tube 1 is also provided with a plurality of heat exchange fins 4 of the same structure, and the heat exchange fins 4 can be detachably installed in the heat exchange tube 1. The heat exchange fin 4 has a first surface 41 that can be detachably installed with the heat exchange tube 1, and a plurality of screw holes 410 are provided on the first surface 41. The first surface 41 is sealed and installed on an inner wall of the heat exchange tube 1. The heat exchange fin 4 has a second surface 42 and a third surface 43 that are in contact with the inner wall of the heat exchange tube 1. The second surface 42 and the third surface 43 have the same structure and are in sealing contact with the inner wall of the heat exchange tube 1. The heat exchange fin 4 has a fifth surface 45 for draining materials, and the fifth surface 45 has an arc structure. The fourth surface 44 and the fifth surface 45 of the heat exchanger fin 4 form an edge with a gap 46 from the inner wall of the heat exchanger tube. In this embodiment, the width of the gap 46 is 6 mm. The cross section of the heat exchanger tube 1 is square. The inner and outer walls of the heat exchanger tube 1 are polished, and the Ra value of the inner and outer walls of the heat exchanger tube is 0.2 μm.

[0048] The first surface 41 of the heat exchange plate 4 is polished, and the threaded holes on the first surface 41 are blind holes.

[0049] The cross section of the heat exchange tube 1 is a square, the side length of the square is 4 cm, the length of the heat exchange tube is 30 cm, and the tube wall thickness of the heat exchange tube is 2 mm.

[0050] The heat exchange tube is made of red copper.

[0051] The angle between the fourth surface 44 of the material receiving material and the cross section of the heat exchange tube 1 is 20°.

[0052] The surfaces of the fourth surface 44 and the fifth surface 45 are provided with a plurality of through holes 40 penetrating the heat exchange fins, and the total area of ​​the through holes occupies 25% of the area of ​​the heat exchange fins.

[0053] The arc diameter of the arc surface of the fifth surface 45 is 15 cm.

[0054] A plurality of semiconductor refrigerators 5 are arranged on the outer wall of the heat exchange tube 1 corresponding to the first surface 41 of the heat exchange plate 4 .

[0055] The through hole 40 is opened at a distance of 10 mm from the inner wall of the heat exchange tube 1 , with a hole diameter of 5 mm and a hole spacing of 20 mm. The through hole 40 is far away from the gap 46 .

[0056] The outer wall of the heat exchange tube 1 is attached with several semiconductor refrigerators, and the inner wall of the heat exchange tube 1 is provided with a temperature sensor, which is connected to the control terminal. The power of the semiconductor refrigerator is adjusted according to the feedback temperature of the temperature sensor to adjust and control the condensation temperature of the entire heat exchange tube.

[0057] The heat exchange area of ​​this embodiment can reach 460cm 2 , which is nearly twice that of the serpentine glass condenser of the same volume. The water vapor condensation rate reaches 230ml per hour (calculated based on the volume of liquid after condensation per unit time), and the water sample recovery rate exceeds 99%. Example 2

[0058] A small-volume tubular plate-type steam condenser comprises a heat exchange tube 1, which is cylindrical and has a first end opening 2 and a second end opening 3. The first end opening 2 is a material inlet, and the second end opening 3 is a material outlet. A plurality of heat exchange fins 4 having the same structure are also arranged in the heat exchange tube 1, and the heat exchange fins 4 can be detachably installed in the heat exchange tube 1.

[0059] The heat exchange plate 4 has a sixth surface 401 which can be detachably mounted on the heat exchange tube 1, and a plurality of screw holes are provided on the sixth surface 401. The sixth surface 401 is sealingly mounted on an inner wall of the heat exchange tube 1; the heat exchange plate 4 has the same shape as the inner wall of the heat exchange tube 1, and has an arc-shaped notch 406 for materials to pass through.

[0060] The heat exchange fin 4 gradually becomes thicker from the arc-shaped notch toward the other end of the cross section of the inner wall of the heat exchange tube 1 .

[0061] The sixth surface 401 of the heat exchange plate 4 is perpendicular to the inner wall of the heat exchange tube 1 and is provided with a plurality of threaded holes, and the threaded holes correspond to the threaded holes on the heat exchange tube 1 .

[0062] The inner wall and the outer wall of the heat exchange tube 1 are polished, and the Ra value of the inner and outer walls of the heat exchange tube 1 is 0.15 μm.

[0063] The sixth surface 401 of the heat exchange plate 4 is polished, and the threaded holes on the sixth surface 401 are blind holes.

[0064] The heat exchange tube 1 is made of copper. The heat exchange plate 4 has a seventh surface 402 facing the material, and the angle between the seventh surface 402 and the cross section of the heat exchange tube is 20°.

[0065] The heat exchange plate 4 has an eighth surface 403 facing away from the incoming material, and the eighth surface 403 has an arc-shaped cross section, and the arc diameter of the arc cross section is 15 cm.

[0066] The surfaces of the seventh surface 402 and the eighth surface 403 are provided with a plurality of first through holes 400 penetrating the heat exchange plate, the total area of ​​the first through holes 400 accounts for 25% of the area of ​​the heat exchange plate, the first through holes have a diameter of 5 mm, the hole spacing is 20 mm, and the minimum distance between the circular holes and the inner wall of the heat exchange tube is 15 mm.

[0067] A plurality of semiconductor refrigerators are arranged on the outer wall of the heat exchange tube 1 corresponding to the sixth surface 401 of the heat exchange plate 4, and a temperature sensor is arranged on the inner wall of the heat exchange tube 1. The temperature sensor is connected to the control terminal, and the power of the semiconductor refrigerator is adjusted according to the feedback temperature of the temperature sensor to adjust and control the condensation temperature of the entire heat exchange tube.

[0068] The above is only a preferred specific implementation method of this patent, but the protection scope of this patent is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by this patent can make equivalent substitutions or changes based on the technical solution and inventive concept of this patent, which should be covered by the protection scope of this patent.

Claims

1. A small volume tubular plate type water vapor condenser, comprising a heat exchange tube, Features: The heat exchange tube is in a cylindrical shape, and has a first end opening and a second end opening, the first end opening is defined as a material inlet, and the second end opening is defined as a material outlet. A plurality of heat exchange fins with the same structure are also arranged in the heat exchange tube, and the heat exchange fins are configured to be detachably installed in the heat exchange tube; The heat exchange plate has a first surface that can be detachably mounted on the heat exchange tube, a plurality of screw holes are provided on the first surface, and the first surface is sealingly mounted on the inner wall of the heat exchange tube; The heat exchange plate has a second surface and a third surface in contact with the heat exchange tube, the second surface and the third surface have the same structure and are in sealing contact with the inner wall of the heat exchange tube; The heat exchange plate has a fourth surface facing the material, and the fourth surface of the heat exchange plate is inclined at an acute angle relative to the material flow direction; The heat exchange plate has a fifth surface for guiding the material, and the fifth surface has an arc structure; The fourth surface and the fifth surface of the heat exchange plate form an edge with a gap from the inner wall of the heat exchange tube.

2. A small volume tubular plate type water vapor condenser according to claim 1, It is characterized in that The cross section of the heat exchange tube is square or rectangular.

3. A small volume tubular plate type water vapor condenser according to claim 1, It is characterized in that The inner wall and the outer wall of the heat exchange tube are polished, and the Ra value of the inner and outer walls of the heat exchange tube is 0.1-0.5 μm.

4. A small volume tubular plate type water vapor condenser according to claim 1, It is characterized in that The first surface of the heat exchange plate is polished, and the threaded holes on the first surface are blind holes.

5. A small volume tubular plate type water vapor condenser according to claim 2, It is characterized in that The cross section of the heat exchange tube is a square, the side length of the square is 3-6 cm, the length of the heat exchange tube is 30-50 cm, and the tube wall thickness of the heat exchange tube is 2-4 mm.

6. A small-volume tubular plate steam condenser according to claim 5, characterized in that the heat exchange tube is made of a corrosion-resistant alloy, which can be an aluminum alloy; the heat exchange plate is made of any one of red copper, aluminum alloy, silver alloy, aluminum nitride and / or silicon carbide.

7. A small volume tubular plate type water vapor condenser according to claim 1, It is characterized in that The vertical angle between the fourth surface of the material receiving material and the interior of the heat exchange tube is 10-40°.

8. A small volume tubular plate type water vapor condenser according to claim 1, It is characterized in that The surfaces of the fourth surface and the fifth surface are provided with a plurality of through holes penetrating the heat exchange plate, and the total area of ​​the through holes occupies 5-60% of the area of ​​the heat exchange plate.

9. A small volume tubular plate type water vapor condenser according to claim 1, It is characterized in that The arc diameter of the arc surface of the fifth surface is 15-20 cm.

10. A small volume tubular plate type water vapor condenser according to claim 1, It is characterized in that A plurality of semiconductor refrigerators are arranged on the outer wall of the heat exchange cylinder corresponding to the first surface of the heat exchange plate.

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