Imaging device

Abstract

The invention relates to an imaging apparatus. An imaging device includes: a photoelectric conversion unit; a substrate having a first surface on the photoelectric conversion section side and a second surface facing the first surface; a rewiring layer provided in a selected region of the second surface of the substrate; and a protective resin layer provided on the second surface of the substrate, the second surface of the substrate having a first external terminal connection region exposed from the protective resin layer and a stress relaxation region exposed from the first external terminal connection region. The stress relaxation region is exposed from the protective resin layer and is arranged at a different position from the first external terminal connection region.

Description

[0001] This application is a divisional application of a patent application with application number 201980033446.5, whose application date is May 14, 2019 and invention name is “Camera Device”. Technical Field

[0002] The present disclosure relates to an imaging device suitable for, for example, a WCSP (Wafer level Chip Size Package) or the like. Background Art

[0003] In recent years, an imaging device such as WCSP has been developed (for example, see Patent Document 1). The imaging device includes, for example: a protective member covering a photoelectric conversion unit such as a photo diode; and a substrate facing the protective member with the photoelectric conversion unit interposed therebetween.

[0004] A rewiring layer and external connection terminals are provided on one surface of the substrate (the surface opposite to the surface on the photoelectric conversion unit side). The rewiring layer is covered with a protective resin layer.

[0005] Citation list

[0006] Patent Literature

[0007] [Patent Document 1] Japanese Unexamined Patent Application Publication No. 2012-191055 Summary of the invention

[0008] In such an imaging device, it is desirable to suppress deformation of the substrate.

[0009] Therefore, it is desirable to provide an imaging device capable of suppressing deformation of a substrate.

[0010] According to an embodiment of the present disclosure, an imaging device includes: a photoelectric conversion unit; a protective member, which is arranged on the light incident side of the photoelectric conversion unit; a substrate, which is opposite to the protective member across the photoelectric conversion unit, and the substrate has a first surface on the photoelectric conversion unit side and a second surface opposite to the first surface; a redistribution layer, which is arranged in a selected area of ​​the second surface of the substrate; and a protective resin layer, which is arranged on the second surface of the substrate, the second surface of the substrate having an external terminal connection area and a stress relief area, the external terminal connection area is exposed from the protective resin layer, and the stress relief area is exposed from the protective resin layer and is arranged at a position different from the external terminal connection area.

[0011] In the image pickup device according to the embodiment of the present disclosure, the second surface of the substrate has the stress relaxation region exposed from the protective resin layer, which reduces the stress applied to the substrate due to the protective resin layer.

[0012] In the imaging device according to the embodiment of the present disclosure, since the second surface of the substrate has the stress relaxation region exposed from the protective resin layer, the stress applied to the substrate can be reduced, thereby suppressing deformation of the substrate.

[0013] It should be noted that the above contents are merely examples of the present disclosure. The effects of the present disclosure are not limited to the above description, and the effects of the present disclosure may be other effects, or may further include other effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a block diagram illustrating an example of a functional configuration of an image pickup apparatus according to an embodiment of the present disclosure.

[0015] Figure 2 yes Figure 1 The schematic diagram of the cross-sectional structure of the main parts of the imaging device shown.

[0016] Figure 3 yes Figure 2 Schematic plan view of an example of the configuration of the redistribution layer and solder balls shown.

[0017] Figure 4 yes Figure 2 A schematic plan view of the configuration of the protective resin layer together with the redistribution layer and solder balls is shown.

[0018] Figure 5 It is along Figure 4 A schematic diagram of a cross section taken along line VV' is shown.

[0019] Fig. 6A is a schematic plan view of the configuration of a main portion of an image pickup device according to a comparative example.

[0020] Figure 6B It is along Fig. 6A A schematic diagram of a cross-sectional structure taken along line BB' is shown.

[0021] Figure 7 It is used to illustrate Fig. 6A A schematic cross-sectional view of the camera device is shown.

[0022] Fig. 8A 1 is a schematic plan view showing the configuration of a main portion of an image pickup device according to Modification 1.

[0023] Figure 8B It is along Fig. 8AA schematic diagram of a cross-sectional structure taken along line BB' is shown.

[0024] Fig.9A It is a schematic plan view showing the configuration of a main part of an image pickup device according to Modification 2.

[0025] Fig. 9B It is along Fig.9A A schematic diagram of a cross-sectional structure taken along line BB' is shown.

[0026] Fig.10 yes Fig.9A Another example of the configuration of the protective resin layer (1) is shown in a schematic plan view together with the redistribution layer and the solder balls.

[0027] Fig.11 yes Fig.9A Still another example (2) of the configuration of the protective resin layer is shown in a schematic plan view together with the redistribution layer and the solder balls.

[0028] Fig.12 It is a schematic plan view showing the configuration of a main part of an image pickup device according to Modification 3.

[0029] Fig.13A It is along Fig.12 A schematic diagram of a cross-sectional structure taken along line AA' is shown.

[0030] Fig. 13B It is along Fig.12 A schematic diagram of a cross-sectional structure taken along line BB' is shown.

[0031] Fig.14 4 is a schematic cross-sectional view showing a configuration of a main portion of an image pickup device according to Modification 4.

[0032] Fig.15 2 is a schematic cross-sectional view showing a configuration of a main portion of an image pickup device according to Modification 5.

[0033] Fig.16 It is shown that Figure 1 1 and 1 are functional block diagrams of examples of electronic devices of the imaging device shown in FIG. 1 .

[0034] Fig.17 is a block diagram showing an example of a schematic configuration of an in-vivo information acquisition system.

[0035] Fig.18 is a diagram showing an example of a schematic configuration of an endoscopic surgery system.

[0036] Fig.19 : is a block diagram showing an example of the functional configuration of a camera head and a camera control unit (CCU: camera control unit).

[0037] Fig. 20 is a block diagram showing an example of a schematic configuration of a vehicle control system.

[0038] Fig.21 It is a diagram for explaining an example of the installation positions of the vehicle exterior information detection unit and the imaging unit. DETAILED DESCRIPTION

[0039] Hereinafter, some embodiments of the present disclosure are described in detail with reference to the accompanying drawings. It should be noted that the description is given in the following order.

[0040] 1. Example (Imaging device having a stress relaxation region on the second surface of a substrate)

[0041] 2. Modification 1 (Example in which the narrow pitch region also has a stress relaxation region)

[0042] 3. Modification 2 (Example in which a protective resin layer is provided to surround the solder balls)

[0043] 4. Modification 3 (Example in which a stress relaxation region is provided at a position not overlapping with a redistribution layer)

[0044] 5. Modification 4 (example including one chip)

[0045] 6. Modification 5 (Example including three chips)

[0046] 7. Application examples (electronic equipment)

[0047] 8. Practical application examples

[0048] <1. Example>

[0049] (Functional Structure of Image Capture Device 1)

[0050] Figure 1 An example of the functional configuration of an image pickup device (image pickup device 1) according to an embodiment of the present disclosure is schematically shown. The image pickup device 1 includes a pixel section 200P and a circuit section 200C for driving the pixel section 200P. The pixel section 200P includes a plurality of light receiving unit areas (pixels P) arranged two-dimensionally. For example, the circuit section 200C includes a row scanning section 201, a horizontal selection section 203, a column scanning section 204, and a system control section 202.

[0051] In the pixel section 200P, for example, a pixel drive line Lread (for example, a row selection line and a reset control line) is wired for each pixel row, and a vertical signal line Lsig is wired for each pixel column. The pixel drive line Lread transmits a drive signal for reading a signal from the pixel section 200P. One end of the pixel drive line Lread is connected to an output end of the row scanning section 201 corresponding to each row. The pixel section 200P includes, for example, a pixel circuit provided for each pixel P.

[0052] The row scanning section 201 is a pixel driver that includes a shift register, an address decoder, and the like, and drives each pixel P of the pixel section 200P in a row unit, for example. Signals output from each pixel P of a pixel row selected and scanned by the row scanning section 201 are supplied to the horizontal selection section 203 through corresponding vertical signal lines Lsig. The horizontal selection section 203 includes an amplifier and a horizontal selection switch, and the like, provided for each vertical signal line Lsig.

[0053] The column scanning section 204 includes a shift register, an address decoder, and the like, and sequentially drives each horizontal selection switch while scanning each horizontal selection switch of the horizontal selection section 203. Through such selective scanning by the column scanning section 204, the signals of each pixel P transmitted via each vertical signal line Lsig are sequentially output to the horizontal signal line 205, and are input to a signal processing section, etc., not shown, through the horizontal signal line 205.

[0054] The system control section 202 receives a clock and data indicating an operation mode from the outside, and outputs data such as internal information of the image pickup device 1. The system control section 202 also includes a timing generator that generates various timing signals, and performs drive control of the row scanning section 201, the horizontal selection section 203, the column scanning section 204, and the like based on the various timing signals generated by the timing generator.

[0055] (Main Structure of Image Capture Device 1)

[0056] Figure 2 2 is a schematic cross-sectional view of the configuration of the main part of the imaging device 1. Figure 2 The specific structure of the imaging device 1 will be described.

[0057] The imaging device 1 is a WCSP, and includes, for example, a logic chip 10 (second chip), a sensor chip 20 (first chip), and a protective member 40 in this order. A flattening film 31, a color filter 32, an on-chip lens 33, and a sealing resin 34 are provided in this order from the sensor chip 20 side between the sensor chip 20 and the protective member 40. The imaging device 1 is configured such that the logic chip 10 side is mounted on a printed board such as a motherboard, and includes an insulating film 51, a redistribution layer 52, solder balls 53, and a protective resin layer 54 on the logic chip 10 side.

[0058] For example, the logic chip 10 includes a semiconductor substrate 11 and a multilayer wiring layer 12, and the logic chip 10 has a stacked structure of these components. For example, the logic chip 10 includes a logic circuit and a control circuit. The entire circuit unit 200C ( Figure 1 ) may be provided in the logic chip 10. Alternatively, a portion of the circuit portion 200C may be provided in the sensor chip 20, and the remaining portion of the circuit portion 200C may be provided in the logic chip 10.

[0059] The semiconductor substrate 11 is opposite to the protective member 40 via the multilayer wiring layer 12 and the sensor chip 20. The semiconductor substrate 11 has a first surface S11A on the sensor chip 20 side and a second surface S11B opposite to the first surface S11A. The multilayer wiring layer 12 is provided on the first surface S11A of the semiconductor substrate 11, and the insulating film 51 is provided on the second surface S11B of the semiconductor substrate 11. For example, the semiconductor substrate 11 includes a silicon (Si) substrate. Here, the semiconductor substrate 11 corresponds to a specific example of a "substrate" in the present disclosure.

[0060] The multilayer wiring layer 12 is provided between the semiconductor substrate 11 and the sensor chip 20. The multilayer wiring layer 12 includes a plurality of wirings 121 and an interlayer insulating film 122 for separating the plurality of wirings 121. For example, the wirings 121 include copper (Cu), aluminum (Al), or tungsten (W). For example, the interlayer insulating film 122 includes a silicon oxide film (SiO) or a silicon nitride film (SiN).

[0061] A through hole 11V is provided at a predetermined position of the semiconductor substrate 11 . The through hole 11V penetrates from the second surface S11B to the first surface S11A of the semiconductor substrate 11 and reaches the wiring 121 or the pad electrode of the multilayer wiring layer 12 .

[0062] The insulating film 51 covers the sidewalls of the through-hole 11V from the second surface S11B of the semiconductor substrate 11. For example, the insulating film 51 includes a silicon oxide film (SiO) or a silicon nitride film (SiN).

[0063] The rewiring layer 52 covers the sidewalls of the through hole 11V through the insulating film 51 and covers the bottom surface of the through hole 11V. On the bottom surface of the through hole 11V, the rewiring layer 52 is in contact with the wiring 121 or the pad electrode of the multilayer wiring layer 12. The rewiring layer 52 extends from the through hole 11V to the second surface S11B of the semiconductor substrate 11, and is led out to the formation area of ​​the solder ball 53. On the second surface S11B of the semiconductor substrate 11, the rewiring layer 52 is arranged in a selected area of ​​the second surface S11B through the insulating film 51. For example, the rewiring layer 52 includes copper (Cu), tungsten (W), titanium (Ti), tantalum (Ta), titanium tungsten alloy (TiW) or polysilicon, etc.

[0064] Figure 3 An example of a planar configuration of the redistribution layer 52 together with the solder balls 53 is shown. On the second surface S11B of the semiconductor substrate 11, there are provided solder balls 53 extending in substantially parallel directions ( Figure 3 The second surface S11B of the semiconductor substrate 11 has a plurality of redistribution layers 52 extending in the Y direction (in the Y direction). For example, the second surface S11B of the semiconductor substrate 11 has a narrow pitch region 52N and a wide pitch region 52W. In the narrow pitch region 52N, the redistribution layers 52 adjacent to each other are spaced apart at a predetermined interval (pitch P). n In the wide pitch region 52W, the adjacent redistribution layers 52 are arranged at a pitch P smaller than that in the narrow pitch region 52N. n Wide spacing (pitch P w ) are arranged. For example, the width of the redistribution layer 52 ( Figure 3 The size in the X direction is 20 μm to 40 μm, and the pitch P n 20μm~40μm, pitch P w It is 100μm~200μm.

[0065] The solder balls 53 are connected to the redistribution wiring layer 52 ( Figure 2 ). The solder balls 53 function as external connection terminals mounted on a printed board, and the solder balls 53 include, for example, high-melting-point lead-free solder such as Sn-Ag-Cu. For example, a plurality of solder balls 53 are provided on the second surface S11B of the semiconductor substrate 11 and are regularly arranged at a predetermined pitch. The arrangement of the solder balls 53 is appropriately set according to the positions of the bonding pads on the side of the mounted printed board (not shown). The solder balls 53 are electrically connected to the wiring 121 or pad electrodes of the multilayer wiring layer 12 via the redistribution layer 52. Here, the solder balls 53 correspond to a specific example of an “external terminal” in the present disclosure.

[0066] The protective resin layer 54 provided on the second surface S11B of the semiconductor substrate 11 protects the rewiring layer 52. In the region of the second surface S11B of the semiconductor substrate 11 where the solder balls 53 are provided, the protective resin layer 54 is not provided. That is, the solder balls 53 are connected to the portion of the rewiring layer 52 exposed from the protective resin layer 54. In other words, the second surface S11B of the semiconductor substrate 11 has an external terminal connection region 54A in which the rewiring layer 52 is exposed from the protective resin layer 54, and the solder balls 53 are connected to the rewiring layer 52 in the external terminal connection region 54A. The protective resin layer 54 has, for example, a solder resist and includes an epoxy resin, a polyimide resin, a silicone resin, an acrylic resin, or the like.

[0067] In this embodiment, the second surface S11B of the semiconductor substrate 11 has a stress relaxation region 54B in addition to the external terminal connection region 54A. The stress relaxation region 54B is a region of the second surface S11B of the semiconductor substrate 11 exposed from the protective resin layer 54 and Figure 2 When viewed in the XY plane (in FIG. 1 ), the stress relaxation region 54B is arranged at a position that does not overlap with the external terminal connection region 54A. In this stress relaxation region 54B, for example, the protective resin layer 54 is not provided, and the redistribution layer 52 or the insulating film 51 is exposed. As described in detail later, by providing such a stress relaxation region 54B in the second surface S11B of the semiconductor substrate 11, the stress applied to the semiconductor substrate 11 can be reduced.

[0068] Figure 4 and Figure 5 An example of the position of the stress relaxation region 54B is shown. Figure 4 An example of a planar configuration of the redistribution layer 52, the solder balls 53, and the protective resin layer 54 is shown. Figure 5 Shown along Figure 4 5. The cross-sectional structure of the cross-sectional structure taken along the line V-V' shown in FIG. As shown in the figure, in the plan view, the protective resin layer 54 may be provided at a position overlapping with the narrow pitch region 52N, and the stress relaxation region 54B may be provided at a position overlapping with the wide pitch region 52W. In the narrow pitch region 52N, migration (corrosion) easily occurs due to the redistribution layer 52. By selectively providing the protective resin layer 54 in the narrow pitch region 52N, the occurrence of migration can be suppressed.

[0069] For example, the sensor chip 20 provided between the logic chip 10 and the protection member 40 includes a plurality of wiring layers 22 and a semiconductor substrate 21 in this order from the logic chip 10 side.

[0070] The multilayer wiring layer 22 of the sensor chip 20 is in contact with the multilayer wiring layer 12 of the logic chip 10, and the bonding surface S between the sensor chip 20 and the logic chip 10 is provided between the multilayer wiring layer 22 and the multilayer wiring layer 12. The multilayer wiring layer 22 includes a plurality of wirings 221 and an interlayer insulating film 222 for separating the plurality of wirings 221. The plurality of wirings 221 are used to constitute the pixel portion 200P ( Figure 1 ) pixel circuit. For example, the wiring 221 includes copper (Cu), aluminum (Al) or tungsten (W). For example, the interlayer insulating film 222 includes a silicon oxide film (SiO) or a silicon nitride film (SiN).

[0071] For example, the semiconductor substrate 21 provided between the multilayer wiring layer 22 and the planarization film 31 includes a silicon (Si) substrate. In the semiconductor substrate 21 of the sensor chip 20, a photodiode (PD) 211 is provided for each pixel P. The PD 211 is provided near the light receiving surface (the surface opposite to the surface of the semiconductor substrate 21 on the multilayer wiring layer 22 side) of the semiconductor substrate 21. Here, the PD 211 corresponds to a specific example of a “photoelectric conversion unit” in the present disclosure.

[0072] Through electrodes 223a and 223b are provided in the sensor chip 20. The through electrodes 223a and 223b are connected to each other via a connection wiring 224 provided between the semiconductor substrate 21 and the planarization film 31. In a plan view, the connection wiring 224 is arranged at a position that does not overlap with the PD 211. The through electrode 223a penetrates the semiconductor substrate 21 and the multilayer wiring layer 22, and is connected to the wiring 121 of the logic chip 10. The through electrode 223b penetrates the semiconductor substrate 21, and is connected to the wiring 221 of the sensor chip 20. That is, the multilayer wiring layer 22 of the sensor chip 20 is electrically connected to the multilayer wiring layer 12 of the logic chip 10 via the through electrodes 223a and 223b and the connection wiring 224. An insulating film 225 is provided between the through electrodes 223a and 223b and the semiconductor substrate 21.

[0073] The planarization film 31 provided between the semiconductor substrate 21 and the color filter 32 planarizes the light receiving surface of the semiconductor substrate 21. For example, the planarization film 31 includes silicon oxide (SiO) or the like.

[0074] The color filter 32 provided on the light receiving surface of the sensor chip 20 is, for example, one of a red (R) filter, a green (G) filter, a blue (B) filter, and a white (W) filter, and is provided, for example, for each pixel P. These color filters 32 are provided in a regular color array (for example, a Bayer array). By providing such a color filter 32, the imaging device 1 can acquire color light reception data corresponding to the color array.

[0075] The on-chip lens 33 located on the color filter 32 is provided at a position opposite to the PD 211 of the sensor chip 20 for each pixel P. Light incident on the on-chip lens 33 is collected on the PD 211 in each pixel P. The lens system of the on-chip lens 33 is set to a value corresponding to the size of the pixel P. Examples of the lens material of the on-chip lens 33 include an organic material or a silicon oxide film (SiO) or the like.

[0076] The protective member 40 covering the sensor chip 20 via the on-chip lens 33 is sufficiently thicker than the thickness of the logic chip 10 and the sensor chip 20. The protective member 40 includes, for example, a glass substrate. For example, an IR (infrared) cut filter or the like may be provided on the surface of the protective member 40 provided on the light incident side of the sensor chip 20 (the surface opposite to the surface of the protective member 40 on the sensor chip 20 side). The protective member 40 is opposite to the logic chip 10 via the sensor chip 20.

[0077] For example, the refractive index of the sealing resin 34 provided between the protective member 40 and the on-chip lens 33 is substantially equal to the refractive index of the protective member 40. The sealing resin 34 is provided to fill the space between the protective member 40 and the sensor chip 20. The protective member 40 and the sensor chip 20 are adhered to each other at their peripheries. The imaging device 1 may have a cavity structure having an airtight space between the protective member 40 and the sensor chip 20.

[0078] (Function and Effect of Image Capture Device 1)

[0079] In the imaging device 1, the wiring 121 or pad electrode provided in the multilayer wiring layer 12 of the logic chip 10 is led out to the second surface S11B of the semiconductor substrate 11 through the redistribution wiring layer 52 provided in the through hole 11V. This causes signals to be input and output between the outside and the sensor chip 20 from the second surface S11B side of the semiconductor substrate 11. In such an imaging device 1, since an opening portion for pad electrode connection on the light receiving surface side of the sensor chip 20 is not required, the chip size can be reduced.

[0080] In addition, in the imaging device 1 , by stacking the sensor chip 20 and the logic chip 10 , the size of the imaging device 1 can be reduced compared to the case where the pixel portion 200P and the circuit portion 200C are provided in one semiconductor substrate.

[0081] In particular, in the image pickup device 1 according to the present embodiment, since the second surface S11B of the semiconductor substrate 11 has the stress relaxation region 54B exposed from the protective resin layer 54, the stress applied to the semiconductor substrate 11 due to the protective resin layer 54 is reduced. This makes it possible to suppress deformation of the semiconductor substrate 11. This action and effect will be described below using a comparative example.

[0082] Fig. 6A and Figure 6B The configuration of a main portion of an image pickup device (image pickup device 100 ) according to a comparative example is schematically shown. Fig. 6A 1 shows a planar configuration on the second surface S11B side of the semiconductor substrate 11, Figure 6B Shown along Fig. 6A The cross-sectional structure taken along the line BB′ is shown. Similar to the image pickup device 1 , the image pickup device 100 includes a redistribution layer 52 , solder balls 53 , and a protective resin layer 54 on the second surface S11B of the semiconductor substrate 11 .

[0083] In the imaging device 100, in the second surface S11B of the semiconductor substrate 11, only the region where the solder balls 53 are provided is exposed from the protective resin layer 54, and the regions other than this region are covered by the protective resin layer 54. In other words, in the imaging device 100, the second surface S11B of the semiconductor substrate 11 has only the external terminal connection region 54A, and does not have the stress relaxation region ( Figure 2 The stress relaxation area 54B in the embodiment of the present invention.

[0084] In such an imaging device 100, for example, during the manufacturing process, Figure 7 As shown, the semiconductor substrate 11 may be severely warped. This is caused by the stress applied to the semiconductor substrate 11 due to the difference between the thermal expansion coefficient of the protective resin layer 54 and the thermal expansion coefficient of the semiconductor substrate 11. The larger the area of ​​the protective resin layer 54 provided on the second surface S11B of the semiconductor substrate 11, the greater the stress applied to the semiconductor substrate 11. Therefore, in the imaging device 100 in which the protective resin layer 54 is provided on substantially the entire surface of the second surface S11B of the semiconductor substrate 11, a large stress is applied to the semiconductor substrate 11 due to the protective resin layer 54. In the case where the semiconductor substrate 11 is deformed, handling in the manufacturing process becomes difficult. In addition, reliability is likely to be reduced.

[0085] In contrast, in the image pickup device 1 according to the present embodiment, the second surface S11B of the semiconductor substrate 11 has a stress relaxation region 54B in addition to the external terminal connection region 54A. In the stress relaxation region 54B, the second surface S11B of the semiconductor substrate 11 is exposed from the protective resin layer 54. Therefore, in the image pickup device 1, the area of ​​the protective resin layer 54 provided on the second surface S11B of the semiconductor substrate 11 becomes smaller than that of the image pickup device 100, and the stress applied to the semiconductor substrate 11 due to the protective resin layer 54 is reduced. Therefore, deformation of the semiconductor substrate 11 can be suppressed. Therefore, handling during the manufacturing process becomes easy, and a decrease in reliability can also be suppressed.

[0086] As described above, in the imaging device 1 according to the present embodiment, the second surface S11B of the semiconductor substrate 11 has the stress relaxation region 54B exposed from the protective resin layer 54, which reduces the stress applied to the semiconductor substrate 11. Therefore, deformation of the semiconductor substrate 11 can be suppressed.

[0087] In addition, for example, the stress relaxation region 54B is arranged at a position overlapping with the wide pitch region 52W, and the protective resin layer 54 is provided in the narrow pitch region 52N. This makes it possible to protect the redistribution layer 52 in the narrow pitch region by the protective resin layer 54 while reducing the stress applied to the semiconductor substrate 11. Thus, the deformation of the semiconductor substrate 11 can be reduced, and the occurrence of migration of the redistribution layer 52 can be suppressed.

[0088] Modifications of the above-described embodiment are described below, and the same components as those of the above-described embodiment are denoted by the same reference numerals, and description thereof is appropriately omitted.

[0089] <Modification 1>

[0090] Fig. 8A and Figure 8B The configuration of the main part of the image pickup device 1 according to Modification 1 of the above-described embodiment is shown. Fig. 8A 1 shows a planar configuration of the semiconductor substrate 11 (second surface S11B), the redistribution layer 52, the solder balls 53, and the protective resin layer 54. Figure 8B Shown along Fig. 8A Here, the protective resin layer 54 is provided between the adjacent redistribution layers 52 in the narrow pitch region 52N. That is, in a plan view, the stress relaxation region 54B is also provided at a position overlapping with the narrow pitch region 52N. Except for this, the camera device 1 according to the modification 1 has the same configuration as the camera device 1 according to the above-described embodiment, and its functions and effects are also the same.

[0091] The protective resin layer 54 has a rectangular planar shape, and in a plan view, the protective resin layer 54 is provided at a position that does not overlap with the redistribution layer 52. For example, a plurality of rectangular protective resin layers 54 are arranged in a strip shape on the second surface S11B of the semiconductor substrate 11. The width ( Fig. 8A and 8B The dimension in the X direction in the narrow pitch region 52N is smaller than the pitch P n , and is, for example, 20 μm to 40 μm.

[0092] In the narrow pitch region 52N, in plan view, the stress relaxation region 54B is provided at a position overlapping with the rewiring layer 52. Therefore, the stress relaxation region 54B may be provided at a position overlapping with a portion of the narrow pitch region 52N in addition to being arranged at a position overlapping with the wide pitch region 52W.

[0093] <Modification 2>

[0094] Fig.9A and 9B The configuration of the main part of the image pickup device 1 according to Modification 2 of the above-described embodiment is shown. Fig.9A 1 shows a planar configuration of the semiconductor substrate 11 (second surface S11B), the redistribution layer 52, the solder balls 53, and the protective resin layer 54. Fig. 9B Shown along Fig.9A Here, the protective resin layer 54 is provided so as to surround the solder ball 53. Except for this, the imaging device 1 according to the second modification has the same structure as the imaging device 1 according to the above-described embodiment, and its operation and effects are also the same.

[0095] The protective resin layer 54 has a ring-shaped planar shape. A plurality of ring-shaped protective resin layers 54 are provided on the second surface S11B of the semiconductor substrate 11. On the second surface S11B of the semiconductor substrate 11, the area other than the area where the protective resin layer 54 is provided is an external terminal connection area 54A or a stress relaxation area 54B. For example, the external terminal connection area 54A is provided on the inner side of each of the plurality of ring-shaped protective resin layers 54, and the stress relaxation area 54B is provided on the outer side of each of the plurality of ring-shaped protective resin layers 54.

[0096] By providing the protective resin layer 54 so as to surround the solder ball 53 , it is easy to form the solder ball 53 at an accurate position.

[0097] Fig.10 and Fig.11 Shows Fig.9A Another example of the construction of the protective resin layer 54 is shown.

[0098] like Fig.10 As shown, the configuration of the protective resin layer 54 described in this modification can be combined with the configuration of the protective resin layer 54 described in the above embodiment. Specifically, a protective resin layer 54 surrounding the solder balls 53 and a protective resin layer 54 at a position overlapping with the narrow pitch region 52N can be provided on the second surface S11B of the semiconductor substrate 11. The stress relaxation region 54B is provided in a region located outside the annular protective resin layer 54 and at a position overlapping with the wide pitch region 52W.

[0099] like Fig.11 As shown, the configuration of the protective resin layer 54 described in this modification can be combined with the configuration of the protective resin layer 54 described in the above-mentioned modification 1. Specifically, the protective resin layer 54 surrounding the solder balls 53 and the protective resin layer 54 arranged between the mutually adjacent redistribution layers 52 in the narrow pitch region 52N can be provided on the second surface S11B of the semiconductor substrate 11. The stress relaxation region 54B is provided in the region located outside the annular protective resin layer 54 and at a position overlapping with the wide pitch region 52W and in the region located outside the annular protective resin layer 54 and at a position overlapping with the redistribution layer 52 in the narrow pitch region 52N.

[0100] <Variation 3>

[0101] Fig.12 The planar configuration of the main part of the image pickup device 1 according to the modification 3 of the above-described embodiment is schematically shown. Here, the stress relaxation region 54B is provided at a position that does not overlap with the redistribution layer 52. Except for this, the image pickup device 1 according to the modification 3 has the same configuration as the image pickup device 1 according to the above-described embodiment, and its functions and effects are also the same.

[0102] Fig.13A Shown along Fig.12 The cross-sectional structure taken along the line AA' shown is Fig. 13B Shown along Fig.12 The cross-sectional structure taken along the line BB' shown in FIG. For example, the protective resin layer 54 covers the entire redistribution layer 52. For example, the stress relief region 54B is provided at a position in the wide pitch region 52W that does not overlap with the redistribution layer 52. For example, the stress relief region 54B is formed by a slit in the protective resin layer 54.

[0103] The stress relaxation region 54B is provided at a position not overlapping with the redistribution layer 52, so that the redistribution layer 52 is protected by the protective resin layer 54. This can suppress the occurrence of migration of the redistribution layer 52.

[0104] <Variation 4>

[0105] Fig.14 The cross-sectional structure of the main part of the imaging device 1 according to the modification 4 of the above-mentioned embodiment is schematically shown. The imaging device 1 includes one chip (sensor chip 20). That is, the imaging device 1 does not include a logic chip ( Figure 2 Except for this, the image pickup device 1 according to the modification 4 has the same configuration as the image pickup device 1 according to the above-described embodiment, and its functions and effects are also the same.

[0106] For example, the sensor chip 20 includes a support substrate 23, a multilayer wiring layer 22, and a semiconductor substrate 21 in sequence. The support substrate 23 is opposite to the protective member 40 via the multilayer wiring layer 22 and the semiconductor substrate 21. The support substrate 23 has a first surface S23A on the semiconductor substrate 21 side and a second surface S23B opposite to the first surface S23A. For example, the support substrate 23 includes a silicon (Si) substrate. Solder balls 53 and the like are provided on the second surface S23B of the support substrate 23. In the imaging device 1, the second surface S23B of the support substrate 23 has an external terminal connection area 54A and a stress relaxation area 54B.

[0107] <Variation 5>

[0108] Fig.15 The cross-sectional configuration of the main part of the image pickup device 1 according to the modification example 5 of the above-mentioned embodiment is schematically shown. The image pickup device 1 includes three chips (logic chip 10, sensor chip 20 and memory chip 60). For example, the image pickup device 1 includes the memory chip 60 (second chip), the logic chip 10 (third chip), the sensor chip 20 (first chip) and the protective member 40 in sequence. Except for this, the image pickup device 1 according to the modification example 5 has the same configuration as the image pickup device 1 according to the above-mentioned embodiment, and its functions and effects are also the same.

[0109] For example, the memory chip 60 includes a memory circuit. The memory chip 60 is opposite to the protective member 40 via the logic chip 10 and the sensor chip 20. For example, the memory chip 60 includes a multilayer wiring layer 62 and a semiconductor substrate 61 in sequence from the logic chip 10 side. The semiconductor substrate 61 has a first surface S61A on the sensor chip 20 side and a second surface S61B opposite to the first surface S61A. For example, the semiconductor substrate 61 includes a silicon (Si) substrate. Solder balls 53 and the like are arranged on the second surface S61B of the semiconductor substrate 61. In the imaging device 1, the second surface S61B of the semiconductor substrate 61 has an external terminal connection area 54A and a stress relief area 54B.

[0110] A logic chip including a logic circuit may be provided instead of the memory chip 60. That is, the image pickup device 1 may include the sensor chip 20 and two logic chips.

[0111] <Application example>

[0112] For example, the above-described image pickup device 1 is applicable to various types of electronic devices (eg, cameras) capable of capturing images of light having a wavelength in the visible region. Fig.16 The schematic configuration of an electronic device 3 (camera) as an example is shown. For example, the electronic device 3 is a camera capable of taking still images or moving images. The electronic device 3 includes an image pickup device 1, an optical system (optical lens) 310, a shutter device 311, a driving unit 313 for driving the image pickup device 1 and the shutter device 311, and a signal processing unit 312.

[0113] The optical system 310 guides image light (incident light) from a subject to the image pickup device 1. The optical system 310 may include a plurality of optical lenses. The shutter device 311 controls the illumination time period and the light shielding time period for the image pickup device 1. The driving section 313 controls the transmission operation of the image pickup device 1 and the shutter operation of the shutter device 311. The signal processing section 312 performs various signal processing on the signal output from the image pickup device 1. The image signal Dout that has been subjected to the signal processing is stored in a storage medium such as a memory, or is output to a monitor, etc.

[0114] <Application examples of in vivo information acquisition system>

[0115] In addition, the technology according to the present disclosure (the present technology) is applicable to various products. For example, the technology according to the present disclosure can be applied to an in vivo information acquisition system.

[0116] Fig.17 : is a block diagram showing an example of a schematic configuration of a system for acquiring in-vivo information of a patient using a capsule-type endoscope to which a technology according to an embodiment of the present disclosure (the present technology) can be applied.

[0117] The in-vivo information acquisition system 10001 includes a capsule endoscope 10100 and an external control device 10200 .

[0118] During the examination, the patient swallows the capsule endoscope 10100. The capsule endoscope 10100 has an imaging function and a wireless communication function, and continuously captures images of the inside of an organ such as the stomach or intestines (hereinafter referred to as in-vivo images) at predetermined intervals while moving inside the organ by peristaltic motion until the patient naturally expel the capsule endoscope 10100. Then, the capsule endoscope 10100 sequentially transmits the information of the in-vivo images to the external control device 10200 outside the body by wireless transmission.

[0119] The external control device 10200 controls the operation of the in-vivo information acquisition system 10001 as a whole. In addition, the external control device 10200 receives in-vivo image information transmitted from the capsule endoscope 10100, and based on the received in-vivo image information, generates image data for displaying the in-vivo image on a display device (not shown).

[0120] In the in-vivo information acquisition system 10001, at any time in the period from swallowing the capsule endoscope 10100 to excreting the capsule endoscope 10100, in-vivo images obtained by photographing the internal state of the patient's body can be acquired.

[0121] The structure and function of the capsule endoscope 10100 and the external control device 10200 will be described in more detail below.

[0122] The capsule endoscope 10100 includes a capsule-shaped shell 10101, in which a light source unit 10111, a camera unit 10112, an image processing unit 10113, a wireless communication unit 10114, a power supply unit 10115, a power supply unit 10116 and a control unit 10117 are all accommodated.

[0123] For example, the light source unit 10111 includes a light source such as a light emitting diode (LED), and irradiates light within the imaging field of the imaging unit 10112 .

[0124] The imaging unit 10112 includes an imaging element and an optical system including a plurality of lenses disposed at the front section of the imaging element. Reflected light (hereinafter referred to as observation light) of light irradiated on body tissue as an observation object is gathered by the optical system and introduced into the imaging element. In the imaging unit 10112, the incident observation light is photoelectrically converted by the imaging element, thereby generating an image signal corresponding to the observation light. The image signal generated by the imaging unit 10112 is provided to the image processing unit 10113.

[0125] The image processing unit 10113 includes a processor such as a central processing unit (CPU) or a graphics processing unit (GPU), and performs various signal processing on the image signal generated by the imaging unit 10112. The image processing unit 10113 supplies the image signal that has been subjected to the signal processing to the wireless communication unit 10114 as RAW data.

[0126] The wireless communication unit 10114 performs predetermined processing such as modulation processing on the image signal that has been signal-processed by the image processing unit 10113, and transmits the resulting image signal to the external control device 10200 through the antenna 10114A. In addition, the wireless communication unit 10114 receives a control signal related to the drive control of the capsule endoscope 10100 from the external control device 10200 through the antenna 10114A. The wireless communication unit 10114 provides the control signal received from the external control device 10200 to the control unit 10117.

[0127] The power supply unit 10115 includes an antenna coil for receiving power, a power regeneration circuit for regenerating power from a current generated in the antenna coil, a boost circuit, etc. The power supply unit 10115 generates power using the principle of contactless charging.

[0128] The power supply unit 10116 includes a secondary battery and stores the power generated by the power supply unit 10115. Fig.17 In order to avoid complicating the drawing, the arrow mark indicating the power supply destination of the power supply unit 10116 is omitted. However, the power stored in the power supply unit 10116 is supplied to the light source unit 10111, the camera unit 10112, the image processing unit 10113, the wireless communication unit 10114 and the control unit 10117, and can be used to drive these units.

[0129] The control unit 10117 includes a processor such as a CPU, and appropriately controls the driving of the light source unit 10111, the camera unit 10112, the image processing unit 10113, the wireless communication unit 10114 and the power supply unit 10115 according to a control signal sent from the external control device 10200.

[0130] The external control device 10200 includes: a processor such as a CPU or a GPU; or a microcomputer or a control board equipped with a processor and a storage element (such as a memory) in a mixed manner. The external control device 10200 sends a control signal to the control unit 10117 of the capsule endoscope 10100 through the antenna 10200A to control the operation of the capsule endoscope 10100. In the capsule endoscope 10100, for example, the illumination condition of the observation object of the light source unit 10111 can be changed according to the control signal from the external control device 10200. In addition, the imaging condition (for example, the frame rate or exposure value of the imaging unit 10112) can be changed according to the control signal from the external control device 10200. In addition, according to the control signal from the external control device 10200, the processing content of the image processing unit 10113 or the condition of sending the image signal from the wireless communication unit 10114 (for example, the transmission interval, the number of images to be sent, etc.) can be changed.

[0131] In addition, the external control device 10200 performs various image processing on the image signal sent from the capsule endoscope 10100, and generates image data for displaying the captured in-vivo image on the display device. As image processing, for example, various signal processing such as development processing (demosaic processing), image quality improvement processing (bandwidth enhancement processing, super-resolution processing, noise reduction (NR) processing and / or image stabilization processing), and / or magnification processing (electronic zoom processing) can be performed. The external control device 10200 controls the drive of the display device so that the display device displays the captured in-vivo image based on the generated image data. Alternatively, the external control device 10200 can also control a recording device (not shown) to record the generated image data, or control a printing device (not shown) to print out the generated image data.

[0132] An example of an in vivo information acquisition system to which the technology of the present disclosure can be applied has been described above. For example, the technology of the present disclosure can be applied to the imaging unit 10112 in the above components. This improves the detection accuracy.

[0133] <Application examples of endoscopic surgery systems>

[0134] The technology according to the present disclosure (the present technology) is applicable to a variety of products. For example, the technology according to the present disclosure can be applied to an endoscopic surgery system.

[0135] Fig.18 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technology according to an embodiment of the present disclosure (the present technology) can be applied.

[0136] exist Fig.18, a state is shown in which a surgeon (doctor) 11131 is using an endoscopic surgery system 11000 to perform surgery on a patient 11132 on a bed 11133. As shown in the figure, the endoscopic surgery system 11000 includes: an endoscope 11100; other surgical tools 11110 such as a pneumoperitoneum tube 11111 and an energy treatment device 11112; a support arm device 11120 supporting the endoscope 11100; and a cart 11200 equipped with various devices for endoscopic surgery.

[0137] The endoscope 11100 includes: a barrel 11101 having a predetermined length from its distal end to be inserted into a body cavity of a patient 11132; and a camera 11102 connected to the proximal end of the barrel 11101. In the illustrated example, the endoscope 11100 including a rigid endoscope having a rigid barrel 11101 is shown. However, the endoscope 11100 may also include a flexible endoscope having a flexible barrel 11101.

[0138] The lens barrel 11101 has an opening at its distal end in which an objective lens is installed. The light source device 11203 is connected to the endoscope 11100 so that the light generated by the light source device 11203 is guided to the distal end of the lens barrel 11101 through a light guide extending inside the lens barrel 11101, and the light is irradiated to the observation object in the body cavity of the patient 11132 through the objective lens. It should be noted that the endoscope 11100 can be a forward-viewing endoscope, or can be an oblique-viewing endoscope or a side-viewing endoscope.

[0139] An optical system and an imaging element are provided inside the camera head 11102, so that the reflected light (observation light) from the observation object is focused on the imaging element through the optical system. The observation light is photoelectrically converted by the imaging element to generate an electrical signal corresponding to the observation light, that is, an image signal corresponding to the observation image. The image signal is sent to the camera control unit (CCU: Camera Control Unit) 11201 as RAW data.

[0140] The CCU 11201 includes a central processing unit (CPU) or a graphics processing unit (GPU) or the like, and overall controls the operations of the endoscope 11100 and the display device 11202. In addition, the CCU 11201 receives an image signal from the camera 11102, and performs various image processing such as development processing (demosaic processing) on ​​the image signal for displaying an image based on the image signal.

[0141] Under the control of CCU 11201 , the display device 11202 displays an image based on the image signal that has been image-processed by the CCU 11201 .

[0142] For example, the light source device 11203 includes a light source such as a light emitting diode (LED), and supplies irradiation light to the endoscope 11100 when imaging a surgical site.

[0143] The input device 11204 is an input interface of the endoscopic surgery system 11000. The user can input various information or instructions to the endoscopic surgery system 11000 through the input device 11204. For example, the user can input instructions to change the imaging conditions of the endoscope 11100 (type of irradiation light, magnification or focal length, etc.).

[0144] The treatment tool control device 11205 controls the drive of the energy treatment device 11112 to perform cauterization or cutting of tissues, or sealing of blood vessels, etc. The pneumoperitoneum device 11206 injects gas into the body cavity of the patient 11132 through the pneumoperitoneum tube 11111 to expand the body cavity in order to ensure the field of view of the endoscope 11100 and the working space of the surgeon. The recorder 11207 is a device capable of recording various information related to the operation. The printer 11208 is a device capable of printing various information related to the operation in various forms such as text, images, or charts.

[0145] It should be noted that the light source device 11203 that provides the endoscope 11100 with irradiation light when the surgical site is to be imaged may include a white light source, such as an LED, a laser light source, or a combination of an LED and a laser light source. In the case where the white light source includes a combination of red, green, and blue (RGB) laser light sources, since the output intensity and output timing of each color (each wavelength) can be controlled with high precision, the white balance of the captured image can be adjusted by the light source device 11203. In addition, in this case, if the observation object is irradiated with laser beams from each of the RGB laser light sources in a time-divisionally manner, and the driving of the imaging element of the camera 11102 is controlled in synchronization with the irradiation timing, images corresponding to the R color, the G color, and the B color can also be captured in a time-divisionally manner. According to this method, even if a color filter is not provided in the imaging element, a color image can be obtained.

[0146] In addition, the light source device 11203 can be controlled so that the intensity of the light to be output changes at predetermined intervals. By controlling the driving of the imaging element of the camera 11102 in synchronization with the change in the intensity of the light so as to acquire images in a time-division manner and synthesize these images, it is possible to generate a high dynamic range image without underexposed blocked up shadows and overexposed highlights.

[0147] In addition, the light source device 11203 can be configured to provide light of a predetermined wavelength band for special light observation. In special light observation, for example, by utilizing the wavelength dependence of light absorption in human tissue and irradiating light having a narrower band domain than the irradiation light (i.e., white light) during ordinary observation, the following narrow-band observation (narrow-band imaging) is performed: wherein predetermined tissues such as blood vessels in the mucosal surface layer are imaged with high contrast. Alternatively, in special light observation, fluorescence observation in which an image is obtained by irradiating fluorescence generated by excitation light can be performed. In fluorescence observation, fluorescence from human tissue can be observed by irradiating excitation light to human tissue (autofluorescence observation), or a fluorescent image can be obtained by locally injecting a reagent such as indocyanine green (ICG) into human tissue and irradiating the human tissue with excitation light corresponding to the fluorescence wavelength of the reagent. As described above, the light source device 11203 can be configured to provide such narrow-band light and / or excitation light suitable for special light observation.

[0148] Fig.19 It is shown Fig.18 A block diagram of an example of the functional configuration of the camera 11102 and the CCU 11201 shown.

[0149] The camera 11102 includes a lens unit 11401, an imaging unit 11402, a driving unit 11403, a communication unit 11404, and a camera control unit 11405. The CCU 11201 includes a communication unit 11411, an image processing unit 11412, and a control unit 11413. The camera 11102 and the CCU 11201 are communicably connected to each other via a transmission cable 11400.

[0150] The lens unit 11401 is an optical system provided at a connection position with the lens barrel 11101. Observation light introduced from the distal end of the lens barrel 11101 is guided to the camera head 11102 and introduced to the lens unit 11401. The lens unit 11401 includes a combination of a plurality of lenses including a zoom lens and a focus lens.

[0151] The number of imaging elements included in the imaging unit 11402 can be one (single-board type) or multiple (multi-board type). For example, in the case where the imaging unit 11402 is configured as a multi-board type, each imaging element generates image signals corresponding to R, G, and B, respectively, and these image signals can be synthesized to obtain a color image. The imaging unit 11402 can also be configured to have a pair of imaging elements for respectively acquiring a right-eye image signal and a left-eye image signal corresponding to a three-dimensional (3D) display. If a 3D display is performed, the surgeon 11131 can more accurately grasp the depth of living tissue in the surgical site. It should be noted that in the case where the imaging unit 11402 is configured as a multi-board type, multiple systems of lens units 11401 are provided corresponding to each imaging element.

[0152] In addition, the camera unit 11402 does not necessarily have to be disposed on the camera head 11102. For example, the camera unit 11402 may be disposed in the lens barrel 11101 and immediately behind the objective lens.

[0153] The driving unit 11403 includes an actuator and moves the zoom lens and the focus lens of the lens unit 11401 by a predetermined distance along the optical axis under the control of the camera control unit 11405. Therefore, the magnification and focus of the image captured by the camera unit 11402 can be appropriately adjusted.

[0154] The communication unit 11404 includes a communication device for transmitting and receiving various information to and from the CCU 11201. The communication unit 11404 transmits the image signal acquired from the imaging unit 11402 to the CCU 11201 through the transmission cable 11400 as RAW data.

[0155] In addition, the communication unit 11404 receives a control signal for controlling the driving of the camera 11102 from the CCU 11201, and provides the control signal to the camera control unit 11405. For example, the control signal includes information related to imaging conditions, such as information specifying a frame rate of an image to be captured, information specifying an exposure value during imaging, and / or information specifying a magnification and a focus of an image to be captured.

[0156] It should be noted that imaging conditions such as frame rate, exposure value, magnification or focus may be appropriately specified by the user, or may be automatically set based on the acquired image signal by the control unit 11413 of the CCU 11201. In the latter case, the endoscope 11100 is equipped with an automatic exposure (AE: auto exposure) function, an automatic focus (AF: autofocus) function, and an automatic white balance (AWB: auto white balance) function.

[0157] The camera control unit 11405 controls the driving of the camera 11102 based on the control signal from the CCU 11201 received through the communication unit 11404 .

[0158] The communication unit 11411 includes a communication device for sending and receiving various information to and from the camera 11102. The communication unit 11411 receives an image signal sent from the camera 11102 through the transmission cable 11400.

[0159] In addition, the communication unit 11411 transmits a control signal for controlling the driving of the camera 11102 to the camera 11102. The above-mentioned image signal and the above-mentioned control signal can be transmitted through electrical communication, optical communication, or the like.

[0160] The image processing unit 11412 performs various image processing on the image signal in the form of RAW data sent from the camera 11102 .

[0161] The control unit 11413 performs various controls related to imaging of a surgical site, etc., through the endoscope 11100 and display of a captured image obtained by imaging the surgical site, etc. For example, the control unit 11413 generates a control signal for controlling the driving of the camera head 11102 .

[0162] In addition, the control unit 11413 controls the display device 11202 to display a captured image reflecting the surgical site, etc., based on the image signal that has been image-processed by the image processing unit 11412. At this time, the control unit 11413 can use various image recognition technologies to recognize various objects in the captured image. For example, the control unit 11413 can recognize surgical tools such as forceps, specific living parts, bleeding, and mist when the energy treatment device 11112 is used by detecting the shape and color of the edges of the objects included in the captured image. When the control unit 11413 controls the display device 11202 to display the captured image, the control unit 11413 can use the recognition result to display various surgical auxiliary information in an overlapping manner on the image of the surgical site. In the case where the surgical auxiliary information is displayed in an overlapping manner and presented to the surgeon 11131, the burden of the surgeon 11131 can be reduced, and the surgeon 11131 can perform the operation with certainty.

[0163] The transmission cable 11400 connecting the camera head 11102 and the CCU 11201 to each other is an electrical signal cable supporting electrical signal communication, an optical fiber supporting optical communication, or a composite cable supporting both electrical communication and optical communication.

[0164] Here, although in the illustrated example, communication is performed by wired communication using the transmission cable 11400, communication between the camera 11102 and the CCU 11201 may be performed by wireless communication.

[0165] An example of an endoscopic surgery system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the imaging unit 11402 in the above-mentioned configuration. By applying the technology according to the present disclosure to the imaging unit 11402, the detection accuracy is improved.

[0166] It should be noted that an endoscopic surgery system is used as an example for description herein, but the technology according to the present disclosure can also be applied to, for example, a microsurgery system.

[0167] <Application example of mobile object>

[0168] The technology according to the present disclosure is applicable to various products. For example, the technology according to the present disclosure can be implemented as a device installed on any type of mobile body, such as a car, an electric car, a hybrid car, a motorcycle, a bicycle, a personal mobile device, an airplane, a drone, a ship, a robot, a construction machine, or an agricultural machine (tractor).

[0169] Fig. 20 : is a block diagram showing an example of a schematic configuration of a vehicle control system as an example of a moving body control system to which the technology according to the embodiment of the present disclosure can be applied.

[0170] The vehicle control system 12000 includes a plurality of electronic control units connected to each other via a communication network 12001. Fig. 20 In the example shown, the vehicle control system 12000 includes a drive system control unit 12010, a body system control unit 12020, an outside information detection unit 12030, an inside information detection unit 12040, and an integrated control unit 12050. In addition, a microcomputer 12051, a sound / image output section 12052, and an in-vehicle network interface (I / F) 12053 are shown as the functional configuration of the integrated control unit 12050.

[0171] The drive system control unit 12010 controls the operation of the devices related to the drive system of the vehicle according to various programs. For example, the drive system control unit 12010 serves as a control device for the following devices: a drive force generating device such as an internal combustion engine or a drive motor for generating the drive force of the vehicle; a drive force transmitting mechanism for transmitting the drive force to the wheels; a steering mechanism for adjusting the steering angle of the vehicle; and a braking device for generating the braking force of the vehicle.

[0172] The body system control unit 12020 controls the operation of various devices provided on the vehicle body according to various programs. For example, the body system control unit 12020 functions as a control device for each of the following devices: a keyless entry system; a smart key system; a power window device; or various lights such as a headlight, a taillight, a brake light, a turn signal, or a fog light. In this case, a radio wave or a signal of various switches transmitted from a mobile device that replaces a key can be input to the body system control unit 12020. The body system control unit 12020 receives these input radio waves or signals, and controls the door lock device, the power window device, or the lights of the vehicle.

[0173] The vehicle exterior information detection unit 12030 detects information of the exterior of the vehicle including the vehicle control system 12000. For example, the vehicle exterior information detection unit 12030 is connected to the camera unit 12031. The vehicle exterior information detection unit 12030 causes the camera unit 12031 to capture an image of the exterior of the vehicle and receives the captured image. Based on the received image, the vehicle exterior information detection unit 12030 can perform detection processing or distance detection processing on objects such as pedestrians, vehicles, obstacles, signs, or letters on the road surface.

[0174] The imaging unit 12031 is an optical sensor for receiving light and outputting an electrical signal corresponding to the amount of light received. The imaging unit 12031 can output the electrical signal as an image, or can output the electrical signal as information related to the measured distance. In addition, the light received by the imaging unit 12031 may be visible light, or may be non-visible light such as infrared rays.

[0175] The in-vehicle information detection unit 12040 detects information about the interior of the vehicle. For example, the in-vehicle information detection unit 12040 is connected to a driver state detection unit 12041 that detects the driver's state. For example, the driver state detection unit 12041 includes a camera for photographing the driver. The in-vehicle information detection unit 12040 can calculate the driver's fatigue level or concentration level based on the detection information input from the driver state detection unit 12041, or can determine whether the driver is dozing off.

[0176] Based on the information outside or inside the vehicle acquired by the outside information detection unit 12030 or the inside information detection unit 12040, the microcomputer 12051 can calculate the control target value of the driving force generating device, the steering mechanism, or the braking device, and can output a control command to the driving system control unit 12010. For example, the microcomputer 12051 can perform cooperative control for realizing the functions of the advanced driver assistance system (ADAS), which includes: collision avoidance or collision mitigation of the vehicle, following driving based on the following distance, speed maintenance driving, collision warning of the vehicle, or lane departure warning of the vehicle.

[0177] In addition, the microcomputer 12051 is capable of controlling the driving force generating device, steering mechanism, or braking device, etc. based on the information outside the vehicle or inside the vehicle obtained by the outside vehicle information detection unit 12030 or the inside vehicle information detection unit 12040, thereby performing collaborative control for realizing automatic driving that enables the vehicle to drive autonomously without relying on the driver's operation.

[0178] Furthermore, based on the information outside the vehicle acquired by the vehicle exterior information detection unit 12030, the microcomputer 12051 can output a control command to the body system control unit 12020. For example, the microcomputer 12051 can control the headlights and switch the high beam to the low beam, for example, according to the position of the preceding vehicle or the oncoming vehicle detected by the vehicle exterior information detection unit 12030, thereby performing cooperative control for anti-glare.

[0179] The sound / image output unit 12052 sends an output signal of at least one of sound and image to an output device, which can visually or auditorily notify passengers on the vehicle or the outside of the vehicle of information. Fig. 20 In the example of FIG. 1 , as output devices, an audio speaker 12061, a display portion 12062, and an instrument panel 12063 are shown. For example, the display portion 12062 may include at least one of an on-board display and a head-up display.

[0180] Fig.21 This is a diagram showing an example of the installation position of the camera unit 12031.

[0181] exist Fig.21 In the figure, the camera unit 12031 includes camera units 12101, 12102, 12103, 12104 and 12105.

[0182] For example, the camera units 12101, 12102, 12103, 12104 and 12105 are arranged at the front nose, side mirrors, rear bumper and rear door of the vehicle 12100 and at the upper part of the windshield in the vehicle. The camera unit 12101 arranged at the front nose and the camera unit 12105 arranged at the upper part of the windshield in the vehicle mainly acquire images in front of the vehicle 12100. The camera units 12102 and 12103 arranged at the side mirrors mainly acquire images on the sides of the vehicle 12100. The camera unit 12104 arranged at the rear bumper or rear door mainly acquires images behind the vehicle 12100. The camera unit 12105 arranged at the upper part of the windshield in the vehicle is mainly used to detect the vehicle in front, pedestrians, obstacles, traffic lights, traffic signs, or lanes, etc.

[0183] By the way, Fig.21 An example of the imaging range of the imaging units 12101 to 12104 is shown. The imaging range 12111 indicates the imaging range of the imaging unit 12101 provided at the front nose. The imaging ranges 12112 and 12113 respectively indicate the imaging ranges of the imaging units 12102 and 12103 provided at the side mirrors. The imaging range 12114 indicates the imaging range of the imaging unit 12104 provided at the rear bumper or the rear door. For example, by superimposing the image data acquired by the imaging units 12101 to 12104, a bird's-eye view image of the vehicle 12100 seen from above is obtained.

[0184] At least one of the imaging units 12101 to 12104 may have a function of acquiring distance information. For example, at least one of the imaging units 12101 to 12104 may be a stereo camera composed of a plurality of imaging elements, or may be an imaging element having pixels for phase difference detection.

[0185] For example, the microcomputer 12051 can determine the distance to each three-dimensional object within the imaging range 12111 to 12114 and the change of the distance over time (relative speed relative to the vehicle 12100) based on the distance information obtained from the imaging units 12101 to 12104, thereby extracting the following three-dimensional object as the leading vehicle: in particular, the three-dimensional object is closest to the vehicle 12100 on the driving road and is traveling at a predetermined speed (e.g., equal to or greater than 0 km / h) in the same direction as the vehicle 12100. In addition, the microcomputer 12051 can pre-set the following distance to be maintained in front of the leading vehicle, and can perform automatic braking control (including follow-up stop control) and automatic acceleration control (including follow-up start control), etc. Therefore, cooperative control for realizing automatic driving, etc. that enables the vehicle to travel autonomously without relying on the driver's operation, can be performed.

[0186] For example, based on the distance information obtained from the camera units 12101 to 12104, the microcomputer 12051 can classify the three-dimensional object data related to the three-dimensional object into three-dimensional object data of two-wheeled vehicles, standard vehicles, large vehicles, pedestrians, telephone poles and other three-dimensional objects, extract the classified three-dimensional object data, and use the extracted three-dimensional object data to automatically avoid obstacles. For example, the microcomputer 12051 distinguishes obstacles around the vehicle 12100 into obstacles that can be visually recognized by the driver of the vehicle 12100 and obstacles that are difficult to recognize visually. Then, the microcomputer 12051 determines the collision risk used to represent the risk of collision with each obstacle. In the case where the collision risk is equal to or higher than the set value and therefore there is a possibility of collision, the microcomputer 12051 outputs a warning to the driver through the audio speaker 12061 or the display unit 12062, and performs forced deceleration or avoidance steering through the drive system control unit 12010. Thus, the microcomputer 12051 can assist driving to avoid collision.

[0187] At least one of the camera units 12101 to 12104 may be an infrared camera for detecting infrared rays. For example, the microcomputer 12051 can identify a pedestrian by determining whether the pedestrian exists in the image captured by the camera units 12101 to 12104. For example, such identification of pedestrians is performed by the following process: extracting feature points in the image captured by the camera units 12101 to 12104 as infrared cameras; and determining whether the object is a pedestrian by pattern matching a series of feature points representing the contour of the object. When the microcomputer 12051 determines that a pedestrian exists in the image captured by the camera units 12101 to 12104 and thus identifies the pedestrian, the sound / image output unit 12052 controls the display unit 12062 so that a rectangular contour line for emphasis is displayed superimposed on the identified pedestrian. The sound / image output unit 12052 can also control the display unit 12062 so that an icon or the like for representing a pedestrian is displayed at a desired position.

[0188] An example of a vehicle control system to which the technology according to the present disclosure can be applied has been described above. The technology according to the present disclosure can be applied to the camera unit 12031 among the above components. By applying the technology according to the present disclosure to the camera unit 12031, it is possible to obtain a captured image that is easier to see. This can reduce the fatigue of the driver.

[0189] The present disclosure has been described above with reference to the embodiments and the modified examples; however, the present disclosure is not limited to the above-described embodiments and the like, and may be modified in various ways. For example, the configuration of the camera device in the above-described embodiments is merely exemplary, and may further include any other layers. In addition, the materials and thicknesses of the layers are also merely exemplary, and are not limited to those described above.

[0190] In addition, in the above-described embodiments etc., the examples of the configuration of the stress relaxation region 54B have been described. However, the configuration of the stress relaxation region 54B is not limited to those examples described above.

[0191] In addition, in the above-mentioned embodiment and the like, the case where the redistribution layer 52 is provided in the through hole 11V of the semiconductor substrate 11 has been described ( Figure 2 ); however, the through hole 11V may be filled with a conductor different from the redistribution layer 52, and the conductor may be connected to the redistribution layer 52.

[0192] In addition, in the above-described embodiments and the like, the case where the logic chip 10 and the sensor chip 20 are electrically connected to each other through the through electrodes 223a and 223b has been described ( Figure 2 ); however, the logic chip 10 and the sensor chip 20 may also be electrically connected to each other using other methods. For example, the logic chip 10 and the sensor chip 20 may be electrically connected by direct metal bonding such as Cu-Cu bonding.

[0193] In addition, in the above-described embodiment and the like, an example has been given in which the image pickup device 1 includes a single chip (sensor chip 20). Fig.14 ) and an example in which the camera device 1 includes two or three stacked chips (logic chip 10, sensor chip 20, and memory chip 60) ( Figure 2 and Fig.15 In addition to the above-mentioned examples, the camera device 1 may also include four or more stacked chips.

[0194] It should be noted that the effects described in the above-mentioned embodiments and the like are merely exemplary, and may be any other effects, or may further include any other effects.

[0195] It should be noted that the present disclosure may have the following configurations.

[0196] (1) A camera device comprising:

[0197] Photoelectric conversion unit;

[0198] a protective member provided on a light incident side of the photoelectric conversion portion;

[0199] a substrate that is opposed to the protective member across the photoelectric conversion portion, and has a first surface on the photoelectric conversion portion side and a second surface opposed to the first surface;

[0200] a redistribution layer disposed in a selected region of the second surface of the substrate; and

[0201] a protective resin layer disposed on the second surface of the substrate,

[0202] The second surface of the substrate has an external terminal connection region exposed from the protective resin layer and a stress relaxation region exposed from the protective resin layer and arranged at a position different from the external terminal connection region.

[0203] (2) The imaging device according to (1), further comprising an external terminal provided on the second surface of the substrate, wherein:

[0204] In the external terminal connection region, the external terminal is exposed from the protective resin layer.

[0205] (3) The imaging device according to (2), wherein the protective resin layer is provided so as to surround the external terminal.

[0206] (4) The imaging device according to (3), wherein, in the second surface of the substrate, a region other than a region where the protective resin layer is provided so as to surround the external terminal includes the external terminal connection region or the stress relaxation region.

[0207] (5) The imaging device according to (1) or (2), wherein the stress relaxation region is provided at a position not overlapping with the redistribution layer.

[0208] (6) An imaging device according to any one of (1) to (3), wherein the second surface of the substrate further has a narrow pitch region and a wide pitch region, wherein the adjacent redistribution layers in the narrow pitch region are arranged at a predetermined interval, and wherein the adjacent redistribution layers in the wide pitch region are arranged at an interval larger than the predetermined interval in the narrow pitch region.

[0209] (7) The imaging device according to (6), wherein:

[0210] The protective resin layer is disposed in the narrow pitch region, and

[0211] The stress relaxation region is arranged at a position overlapping with the wide pitch region.

[0212] (8) The imaging device according to (7), wherein:

[0213] The protective resin layer is provided between the redistribution layers adjacent to each other in the narrow pitch region, and

[0214] The stress relaxation region is also arranged at a position overlapping with the redistribution layer in the narrow pitch region.

[0215] (9) The imaging device according to any one of (1) to (8), further comprising:

[0216] a first chip having the photoelectric conversion unit; and

[0217] The second chip includes the substrate.

[0218] (10) The imaging device according to (9), further including a third chip provided between the first chip and the second chip.

[0219] (11) The image pickup device according to any one of (1) to (10), wherein the redistribution layer includes copper.

[0220] (12) The imaging device according to any one of (1) to (11), wherein the substrate includes a silicon substrate.

[0221] This application claims priority from Japanese Priority Patent Application No. JP2018-114251 filed in the Japan Patent Office on Jun. 15, 2018, the entire contents of which are hereby incorporated by reference.

[0222] It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may occur depending on design requirements and other factors insofar as they are within the scope of the appended claims or the equivalents thereof.

Claims

1. A camera device, comprising: Photoelectric conversion unit; a substrate having a first surface on the photoelectric conversion portion side and a second surface opposite to the first surface; a redistribution layer disposed in a selected region of the second surface of the substrate; and a protective resin layer disposed on the second surface of the substrate, The second surface of the substrate has a first external terminal connection area and a stress relaxation area, the first external terminal connection area is exposed from the protective resin layer, and the stress relaxation area is exposed from the protective resin layer and arranged at a position different from the first external terminal connection area.

2. The imaging device according to claim 1, wherein: The redistribution layer is exposed in the stress relaxation region.

3. The camera device according to claim 1, further comprising: a second external terminal connection region, which is exposed from the protective resin layer, Wherein, the stress relaxation area is arranged between the first external terminal connection area and the second external terminal connection area.

4. The camera device according to claim 3, further comprising: an external terminal disposed on the second surface of the substrate, Wherein, in the first external terminal connection region and the second external terminal connection region, the external terminals are exposed from the protective resin layer.

5. The imaging device according to claim 4, wherein: The protective resin layer is provided so as to surround the external terminal.

6. The camera device according to claim 1, further comprising: a protective member provided on the light incident side of the photoelectric conversion unit, The substrate is opposed to the protective member via the photoelectric conversion unit.

7. The imaging device according to claim 1, wherein: The second surface of the substrate also has a narrow pitch area and a wide pitch area, wherein the adjacent redistribution layers are arranged at a predetermined interval, and wherein the adjacent redistribution layers are arranged at an interval larger than the predetermined interval in the narrow pitch area.

8. The imaging device according to claim 7, wherein: The protective resin layer is disposed in the narrow pitch region, and The stress relaxation region is arranged at a position overlapping with the wide pitch region.

9. The imaging device according to claim 8, wherein: The protective resin layer is provided between the redistribution layers adjacent to each other in the narrow pitch region, and The stress relaxation region is also arranged at a position overlapping with the redistribution layer in the narrow pitch region.

10. The camera device according to any one of claims 1 to 9, further comprising: A first chip, which is provided with the photoelectric conversion unit; and The second chip includes the substrate.

11. The camera device according to claim 10, further comprising: A third chip is disposed between the first chip and the second chip.

12. The imaging device according to any one of claims 1 to 9, wherein: The redistribution layer includes copper.

13. The imaging device according to any one of claims 1 to 9, wherein: The substrate includes a silicon substrate.

Images