Vehicle-mounted power supply enhanced heat transfer method and device, electronic equipment and storage medium

Abstract

The embodiment of the invention discloses a vehicle-mounted power supply enhanced heat transfer method and device, electronic equipment and a storage medium, the method is applied to a vehicle-mounted power supply enhanced heat transfer system, and the vehicle-mounted power supply enhanced heat transfer system comprises a temperature sensing bulb and a semiconductor chilling plate; the method comprises the following steps: acquiring the current temperature of a vehicle-mounted power supply component through a temperature sensing bulb; when the current temperature is higher than a first temperature threshold value, the semiconductor chilling plate is controlled to be powered on to work so as to reduce the temperature of the vehicle-mounted power supply component; when the current temperature is between a first temperature threshold value and a second temperature threshold value, the semiconductor chilling plate is controlled to work at the first power, and the second temperature threshold value is lower than the first temperature threshold value; and when the current temperature is lower than a second temperature threshold value, reducing the first power to obtain second power, and controlling the semiconductor chilling plate to work at the second power, so that the temperature of the vehicle-mounted power supply component is between the first temperature threshold value and the second temperature threshold value.

Description

Technical Field

[0001] The present invention relates to the field of vehicle-mounted power supplies, and in particular to a method, device, electronic equipment and storage medium for enhancing heat transfer of a vehicle-mounted power supply. Background Art

[0002] With the development of science and technology, vehicles account for an increasingly large proportion of people's travel modes. During the driving process, the on-board power supply will generate heat. Good heat dissipation is crucial to the performance stability and service life of the on-board power supply. Common on-board power supply heat dissipation methods include natural heat dissipation, air cooling and liquid cooling. Natural heat dissipation relies on the heat exchange between the power supply casing and the surrounding air to achieve heat dissipation. This method has a simple structure, but the heat dissipation effect is relatively weak, and it is suitable for on-board power supplies with lower power. Air cooling uses fans to force convection to speed up air flow and thus take away heat. The speed and air volume of the fan will affect the heat dissipation effect, and it is usually used more in on-board power supplies with higher power. Liquid cooling has a higher heat dissipation efficiency, absorbing and dissipating heat by circulating liquid in the radiator, but the cost is relatively high and the system is more complex.

[0003] At present, the main method of enhancing the heat dissipation of vehicle-mounted power supplies is to increase the heat dissipation area or use heat pipes for heat dissipation. The method of heat dissipation by increasing the heat dissipation area leads to a more complicated heat dissipation-related structural design, resulting in a higher implementation cost.

[0004] Therefore, there is an urgent need for a method that can improve the heat dissipation capacity of vehicle-mounted power components at a low cost. Summary of the invention

[0005] In order to solve the above problems, the embodiments of the present invention provide a method, device, electronic device and storage medium for enhancing heat transfer of a vehicle power supply. By regulating the semiconductor cooling sheet, the heat generated by the vehicle power supply components is dissipated, and the temperature of the vehicle power supply components can be controlled, and the temperature of the vehicle power supply components is between the first temperature threshold and the second temperature threshold. The embodiments of the present invention have relatively low requirements on the shape of the water channel, which reduces the production cost.

[0006] In a first aspect, an embodiment of the present invention provides a method for enhancing heat transfer of a vehicle power supply, the method being applied to an enhanced heat transfer system of a vehicle power supply, the enhanced heat transfer system of the vehicle power supply comprising a temperature sensing package and a semiconductor cooling sheet; the method comprising:

[0007] Obtaining the current temperature of the vehicle power supply components through the temperature sensing package;

[0008] When the current temperature is higher than a first temperature threshold, controlling the semiconductor refrigeration chip to be powered on to lower the temperature of the vehicle-mounted power supply components;

[0009] When the current temperature is between the first temperature threshold and a second temperature threshold, controlling the semiconductor refrigeration plate to operate at a first power, and the second temperature threshold is lower than the first temperature threshold;

[0010] When the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration plate is controlled to operate at the second power so that the temperature of the vehicle power supply component is between the first temperature threshold and the second temperature threshold.

[0011] In a second aspect, an embodiment of the present invention provides a vehicle-mounted power supply enhanced heat transfer device, the vehicle-mounted power supply enhanced heat transfer device comprising an acquisition unit and a processing unit;

[0012] The acquisition unit is used to acquire the current temperature of the vehicle power supply component through the temperature sensing package;

[0013] The processing unit is used to control the semiconductor cooling plate to be powered on to work when the current temperature is higher than a first temperature threshold, so as to reduce the temperature of the vehicle-mounted power supply components;

[0014] When the current temperature is between the first temperature threshold and a second temperature threshold, controlling the semiconductor refrigeration plate to operate at a first power, and the second temperature threshold is lower than the first temperature threshold;

[0015] When the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration plate is controlled to operate at the second power so that the temperature of the vehicle power supply component is between the first temperature threshold and the second temperature threshold.

[0016] In a third aspect, an embodiment of the present invention provides an electronic device, including:

[0017] A processor and a memory, wherein the processor is connected to the memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the electronic device executes the method as described in the first aspect.

[0018] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method as described in the first aspect.

[0019] In a fifth aspect, an embodiment of the present application provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer is operable to cause the computer to execute the method described in the first aspect.

[0020] In a sixth aspect, an embodiment of the present invention provides a vehicle-mounted power supply, which includes the vehicle-mounted power supply enhanced heat transfer system described in the first aspect, the machine cover, the casing, the controller, the refrigeration plate groove, the water channel cover and the heat dissipation device, the heat dissipation device is a heat conductive plate or a heat dissipation fin, the heat dissipation device is used to dissipate heat, the vehicle-mounted power supply components are arranged in the space enclosed by the machine cover, the casing and the water channel cover, the semiconductor refrigeration plate is arranged in the refrigeration plate groove, and the controller is used to control the semiconductor refrigeration plate and / or the circulating pump.

[0021] In a seventh aspect, an embodiment of the present invention provides a vehicle, comprising the on-board power supply described in the sixth aspect.

[0022] Implementing the embodiments of the present application has the following beneficial effects:

[0023] In the embodiment of the present application, the current temperature of the vehicle power supply components is first obtained through the temperature sensing package, and then, when the current temperature is higher than the first temperature threshold, the semiconductor refrigeration piece is controlled to be powered on to reduce the temperature of the vehicle power supply components. When the current temperature is between the first temperature threshold and the second temperature threshold, the semiconductor refrigeration piece is controlled to work at the first power. When the second temperature threshold is lower than the first temperature threshold, when the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration piece is controlled to work at the second power, so that the temperature of the vehicle power supply components is between the first temperature threshold and the second temperature threshold. Thus, by regulating the semiconductor refrigeration piece, the temperature of the vehicle power supply components is controlled, so that the temperature of the vehicle power supply components is between the first temperature threshold and the second temperature threshold. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the drawings required for use in the embodiments of the present invention or the background technology will be described below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 is a schematic diagram of the overall structure of an on-vehicle power supply provided in an embodiment of the present application;

[0026] Figure 2 is an exploded view of a vehicle-mounted power supply structure provided in an embodiment of the present application;

[0027] Figure 3 It is a flow chart of a method for enhancing heat transfer of a vehicle-mounted power supply based on a semiconductor refrigeration sheet provided in an embodiment of the present application;

[0028] Figure 4It is a flow chart of a method for enhancing heat transfer of an on-board power supply based on a semiconductor refrigeration sheet and a circulation pump provided in an embodiment of the present application;

[0029] Figure 5 It is a structural schematic diagram of a vehicle-mounted power supply enhanced heat transfer device provided in an embodiment of the present application;

[0030] Figure 6 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0032] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present application and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or modules is not limited to the listed steps or modules, but optionally includes steps or modules that are not listed, or optionally includes other steps or modules inherent to these processes, methods, products or devices.

[0033] Reference to "embodiments" herein means that a particular feature, result, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0034] The present application embodiment provides a vehicle-mounted power supply, referring to Figure 1 and Figure 2 , Figure 1 is a schematic diagram of an overall structure of a vehicle-mounted power supply provided in an embodiment of the present application, Figure 2 is an exploded view of a vehicle-mounted power supply structure provided in an embodiment of the present application, Figure 2Used to demonstrate the combination of vehicle power supply structure. As shown in the figure, the vehicle power supply enhanced heat transfer system includes a temperature sensing package, a semiconductor cooling sheet 70, a heat dissipation circulating water channel 10, a circulating pump 50 and a cooling water channel 11, and the vehicle power supply includes the vehicle power supply enhanced heat transfer system, a cover 20, a housing 30, a controller 40, a cooling sheet slot 80, a water channel cover 90 and a heat dissipation device, the heat dissipation device is a heat conducting sheet 60 or a heat dissipation fin, and the heat dissipation device is used for heat dissipation. During the heat dissipation process, the heat of the hot end of the semiconductor cooling sheet can be transferred to the heat dissipation circulating water channel, the vehicle power supply components are arranged in the space surrounded by the cover 20, the housing 30 and the water channel cover 90, the semiconductor cooling sheet 70 is arranged in the cooling sheet slot 80, and the controller 40 is used to control the semiconductor cooling sheet 70 and / or the circulating pump 50.

[0035] The method in the embodiment of the present application is applied to the vehicle-mounted power supply enhanced heat transfer system.

[0036] In the embodiment of the present application, on-board power supply components are placed in the on-board power supply, and the on-board power supply components include components with relatively large heat generation, such as transformers and diodes. After the on-board power supply is powered on, the on-board power supply components will generate heat.

[0037] In a possible embodiment, the vehicle power supply enhanced heat transfer system includes a temperature sensing package and a semiconductor cooling plate 70. The temperature sensing package is used to obtain the current temperature of the vehicle power supply components. The semiconductor cooling plate includes a cold end and a hot end. The cold end is used to cool the vehicle power supply components so that the temperature of the vehicle power supply components is at a suitable working temperature. The hot end is used to provide heat to the engine cover to reduce the risk of condensation generation in the engine cover area.

[0038] See also Figure 3 , Figure 3 1 is a flow chart of a method for enhancing heat transfer of a vehicle power supply based on a semiconductor cooling plate provided in an embodiment of the present application. Figure 3 As shown, the method includes but is not limited to the following steps:

[0039] Step S101: obtaining the current temperature of the vehicle power supply components through the temperature sensing package;

[0040] Step S102: When the current temperature is higher than the first temperature threshold, the semiconductor refrigeration chip is controlled to be powered on to reduce the temperature of the vehicle power supply components;

[0041] Step S103: when the current temperature is between the first temperature threshold and the second temperature threshold, controlling the semiconductor refrigeration chip to operate at the first power;

[0042] Step S104: when the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration plate is controlled to operate at the second power so that the temperature of the vehicle power supply component is between the first temperature threshold and the second temperature threshold.

[0043] In an embodiment of the present application, a temperature sensing package is disposed at a vehicle-mounted power supply component, and the temperature sensing package can be used to obtain the current temperature of the vehicle-mounted power supply component at a preset time interval, and the preset time interval may be 10s.

[0044] In an embodiment of the present application, the first temperature threshold is the derating temperature of the vehicle power supply components, the second temperature threshold is lower than the first temperature threshold, and the difference between the first temperature threshold and the second temperature threshold can be preset to 5°C. Among them, the derating temperature is the temperature threshold at which the working performance or rated power of the component needs to be reduced when the temperature exceeds a certain value in order to ensure the reliability and stability of the component during use. For example, the rated temperature for normal operation of a component is 80°C. If the temperature reaches 60°C, the component needs to be derated, then 60°C is the derating temperature of the component. Setting the first temperature threshold can prevent the vehicle power supply components from performing poorly or being damaged by overheating due to excessive temperature.

[0045] In a possible embodiment, after the vehicle-mounted power supply component is powered on, the current temperature of the vehicle-mounted power supply component is obtained through a temperature sensing package. After the current temperature is obtained, the current temperature is compared with a first temperature threshold. When the current temperature is lower than or equal to the first temperature threshold, it indicates that the vehicle-mounted power supply component has not reached its derating temperature. At this time, there is no need to turn on the semiconductor refrigeration film. When the current temperature is higher than the first temperature threshold, the semiconductor refrigeration film is controlled to be powered on to reduce the temperature of the vehicle-mounted power supply component. After that, since the semiconductor refrigeration film cools the heated vehicle-mounted power supply component, the temperature of the vehicle-mounted power supply component may be reduced to between the first temperature threshold and the second temperature threshold. At this time, the semiconductor refrigeration film is controlled to work at a first power so that the temperature of the vehicle-mounted power supply component is between the first temperature threshold and the second temperature threshold. The first power can be the power of the semiconductor refrigeration film when the current temperature is reduced to between the first temperature threshold and the second temperature threshold. The first power can also be the power of the semiconductor refrigeration film when the current temperature reaches a dynamic temperature equilibrium.

[0046] In a possible embodiment, when the semiconductor refrigeration plate is working at the first power, the current temperature may be reduced to below the second temperature threshold due to the reduction of heat generated by the vehicle power supply components during the power-on operation process. That is, when the current temperature is lower than the second temperature threshold, the first power needs to be regulated at this time, the first power needs to be reduced to obtain the second power, and the semiconductor refrigeration plate needs to be controlled to work at the second power. By reducing the first power, the cooling capacity of the semiconductor refrigeration plate is appropriately reduced. As the vehicle power supply components are powered on and generate heat, the current temperature will gradually rise to the second temperature threshold. After that, when the current temperature is between the first temperature threshold and the second temperature threshold, the semiconductor refrigeration plate is controlled to continue to work at the second power so that the temperature of the vehicle power supply components is between the first temperature threshold and the second temperature threshold.

[0047] In the embodiment of the present application, the side of the semiconductor refrigeration plate close to the cooling water channel is the cold end of the semiconductor refrigeration plate. After the semiconductor refrigeration plate is powered on, the temperature of the cold end drops, and part of the cold energy of the cold end is transferred to the metal wall of the cooling water channel by conduction, thereby directly cooling the heat-generating vehicle power components attached to the wall of the cooling water channel. The other part of the cold energy is transferred to the coolant in the cooling water channel by convection heat transfer, thereby lowering the temperature of the coolant, increasing the temperature difference between the coolant and the vehicle power components, and improving the thermal driving force, so that the coolant takes away more heat during the flow process.

[0048] Furthermore, in a possible embodiment, when the semiconductor refrigeration plate operates at the second power, the current temperature may again be higher than the first temperature threshold due to the increase in heat generated by the vehicle power supply components during the power-on process. At this time, a circulation pump is added to assist heat transfer.

[0049] Optionally, in a possible embodiment, the vehicle-mounted power supply enhanced heat transfer system further includes a heat dissipation circulating water channel 10 and a circulating pump 50, the heat dissipation circulating water channel is loaded with a flowing medium, and the circulating pump is used to circulate the flowing medium in the circulating water channel. The method may also include the following steps:

[0050] Step S201: When the current temperature is higher than the first temperature threshold again, the circulation pump is controlled to be powered on to reduce the temperature of the vehicle power supply components;

[0051] Step S202: when the current temperature is between the first temperature threshold and the second temperature threshold, controlling the circulation pump to operate at a third power;

[0052] Step S203: when the current temperature is higher than the first temperature threshold or lower than the second temperature threshold, the third power is regulated according to the current temperature to increase or decrease the flow rate of the flowing medium in the heat dissipation circulation water channel.

[0053] In a possible embodiment, when the current temperature is higher than the first temperature threshold again, the circulation pump is controlled to be powered on. After the circulation pump is powered on, the flowing medium in the circulating water channel circulates, and the heat of the hot end of the semiconductor is taken away by the flowing medium. The heat is transferred to the external environment and the machine cover during the circulation process. After the temperature of the hot end of the semiconductor refrigeration plate drops, the temperature of the cold end drops accordingly, and the refrigeration performance is improved, so that the temperature of the vehicle power supply components is reduced. After that, since the semiconductor refrigeration plate cools the heated vehicle power supply components, the temperature of the vehicle power supply components may drop to between the first temperature threshold and the second temperature threshold. At this time, the semiconductor refrigeration plate is controlled to work at a third power so that the temperature of the vehicle power supply components is between the first temperature threshold and the second temperature threshold. The third power can be the power of the circulation pump when the current temperature drops to between the first temperature threshold and the second temperature threshold, and the first power can also be the power of the circulation pump when the current temperature reaches a dynamic temperature equilibrium.

[0054] In a possible embodiment, the current temperature may be higher than the first temperature threshold or lower than the second temperature threshold due to the increase or decrease in heat generated by the on-board power supply components during the power-on process. At this time, the third power needs to be regulated according to the current temperature. The increase or decrease in the third power will increase or decrease the speed of the impeller in the circulating pump, so as to increase or decrease the flow rate of the flowing medium in the heat dissipation circulating water channel, further improving or suppressing the cooling effect of the semiconductor refrigeration plate.

[0055] In a possible embodiment, after the circulation pump is powered on, the heat of the hot end of the semiconductor cooling plate is transferred to the machine cover through the flowing medium, so that the temperature of the machine cover is increased and the generation of condensation in the machine cover area is reduced.

[0056] Optionally, in step S203, regulating the third power according to the current temperature may include the following steps:

[0057] Step S301: when the current temperature is higher than a first temperature threshold, determining a first adjustment factor according to a difference between the current temperature and the first temperature threshold;

[0058] Step S302: increasing the third power according to the first adjustment factor to increase the flow rate of the flowing medium in the heat dissipation circulation water channel;

[0059] Step S303: when the current temperature is lower than the second temperature threshold, determining a second adjustment factor according to the difference between the current temperature and the second temperature threshold;

[0060] Step S304: reducing the third power according to the second adjustment factor to reduce the flow rate of the flowing medium.

[0061] In a possible embodiment, if the power increase corresponding to each 1°C difference is set to 5W, and the difference between the current temperature and the first temperature threshold is 10°C, then the first adjustment factor is 50W. According to the first adjustment factor, the third power is increased by 50W, and the speed of the impeller in the circulating pump is further increased, so as to increase the flow rate of the flowing medium in the heat dissipation circulating water channel.

[0062] In a possible embodiment, if the power reduction corresponding to each 1°C difference is set to 3W, and the difference between the current temperature and the second temperature threshold is -5°C, then the second adjustment factor is 15W. According to the second adjustment factor, the third power is reduced by 15W, and the speed of the impeller in the circulating pump is further reduced, so as to reduce the flow rate of the flowing medium in the heat dissipation circulating water channel.

[0063] In a possible embodiment, the control amount of the third power can be set to a fixed value each time, for example 5W, and the temperature of the vehicle power supply components is obtained according to a preset time interval. When the temperature is higher than the first temperature threshold, the third power is increased by 5W, and when the temperature is lower than the second temperature threshold, the third power is reduced by 5W.

[0064] Optionally, in step S104, reducing the first power to obtain the second power may include the following steps:

[0065] Step S401: Obtain thermal resistance, thermal capacitance and working environment temperature of vehicle-mounted power components;

[0066] Step S402: determining a target proportionality coefficient according to thermal resistance, thermal capacity and working environment temperature, the target proportionality coefficient being used to determine a power reduction amount per degree Celsius;

[0067] Step S403: determining a current temperature difference according to a difference between the current temperature and a second temperature threshold;

[0068] Step S404: taking the product of the current temperature difference and the target proportionality coefficient as the target power reduction amount;

[0069] Step S405: reducing the first current power according to the target power reduction amount to obtain a second power.

[0070] In a possible embodiment, the first power is reduced by considering the thermal performance parameters of the vehicle power supply components and the working environment temperature of the vehicle power supply. The thermal performance parameters of the vehicle power supply components include thermal resistance and thermal capacitance. Thermal resistance reflects the difficulty of heat dissipation of the components, and thermal capacitance indicates its ability to store heat. The vehicle power supply operates under different climatic conditions (extreme cold, high temperature, high humidity, etc.), and the range of change of the working environment temperature will affect the heat dissipation effect of the vehicle power supply components. When determining the target proportional coefficient based on the thermal resistance, thermal capacitance and working environment temperature, it can be determined through experimental testing and data analysis. Some simulation experiments can be carried out to monitor the temperature changes of the vehicle power supply components under different loads and environmental conditions, and gradually adjust the proportional coefficient to observe the effect of temperature control. If the thermal resistance of the vehicle power supply components is large, the thermal capacitance is small, or the working environment temperature is high, the target proportional coefficient can be set to be large to respond to temperature changes more quickly to reduce power. On the contrary, if the thermal performance of the vehicle power supply components is good and the working environment temperature is relatively stable, the target proportional coefficient can be set to be relatively small to avoid excessive and frequent power adjustment.

[0071] Furthermore, the impact of the load characteristics of the vehicle power supply on the proportional coefficient can be considered. Frequent large current load changes may cause the heating of components to increase rapidly. Accordingly, if the load changes frequently and drastically, the target proportional coefficient can be set larger, and if the load changes more slowly, the target proportional coefficient can be set relatively small.

[0072] For example, for an on-board power component with high thermal resistance, working in a high temperature environment and large load changes, the target proportionality factor may be set to 8W / ℃, while for a component with good thermal performance, stable working environment temperature and relatively smooth load changes, the target proportionality factor may be set to 3W / ℃.

[0073] In a possible embodiment, according to the principle of proportional control, the target power reduction amount is the product of the current temperature difference and the target proportional coefficient. For example, when the proportional coefficient is 5W / °C and the current temperature difference is 10°C, the target power reduction amount is 50W.

[0074] In a possible embodiment, the target power reduction amount may be set to a fixed value, such as 5W, and the temperature of the vehicle power supply component is obtained according to a preset time interval. When the temperature is lower than a second temperature threshold, the first power is reduced by 5W.

[0075] Optionally, in a possible embodiment, the vehicle-mounted power supply enhanced heat transfer system further includes a cooling water channel 11, in which a coolant is loaded. The coolant may be a 50% ethylene glycol solution. The method may further include the following steps:

[0076] Step S501: obtaining a first opening of a target valve corresponding to a cooling water channel;

[0077] Step S502: determining a mapping relationship between the power reduction amount and the opening of the target valve;

[0078] Step S503: determining a second opening of the target valve according to the mapping relationship and the target power reduction amount;

[0079] Step S504: controlling the target valve to decrease from the first opening to the second opening.

[0080] In a possible embodiment, the mapping relationship can be pre-set or obtained through experimental testing. For example, the mapping relationship stipulates that for every 100W power reduction, the opening of the target valve needs to be reduced by 5%. If the target power reduction is 300W, then it is calculated that the opening of the target valve should be reduced by 15%. Assuming that the initial first opening is 80%, the second opening is 65%, thereby reducing the target valve opening from 80% to 65%. While reducing the first power, the auxiliary regulation of the opening of the target valve is also considered. Through the linkage regulation of the two, the current temperature of the vehicle power supply components can be assisted to be between the second temperature threshold and the first temperature threshold.

[0081] In one possible embodiment, see Figure 4 , Figure 4 This is a flow chart of a method for enhancing heat transfer of a vehicle power supply based on a semiconductor cooling plate and a circulating pump provided in an embodiment of the present application. Figure 1 and Figure 2 In the embodiment of the present application, the vehicle-mounted power supply includes a heat dissipation circulating water channel 10, a machine cover 20, a machine housing 30, a controller 40, a circulation pump 50, a heat conductive sheet 60, a semiconductor cooling sheet 70, a cooling sheet slot 80, a water channel cover plate 90 and a cooling water channel 11. The heat dissipation circulating water channel 10 has two functions: first, in the second stage of heat dissipation (the stage of turning on the circulation pump), it takes away the heat from the hot end of the semiconductor cooling sheet, thereby reducing the temperature of the cold end of the semiconductor cooling sheet and enhancing the cooling effect; second, it transfers the heat from the hot end of the semiconductor cooling sheet to the machine cover 20, increases the temperature of the machine cover 20, and reduces the generation of condensation in this area. The function of the heat conductive sheet 60 is to transfer the heat from the hot end of the semiconductor cooling sheet to the heat dissipation circulating water channel.

[0082] Specifically, in the vehicle-mounted power supply, a temperature sensing package is placed at the vehicle-mounted power supply component close to the cooling water channel, and the temperature of the heating component is monitored by the temperature sensing package and fed back to the controller 40 in real time. 1, 2, and 3 in the flow chart are three operating states, or three temperature rise states. State 1 is that the component monitoring temperature is less than the derating temperature, and the difference exceeds 5°C; State 2 is that the component monitoring temperature is less than the derating temperature, but the difference with the derating temperature is within 5°C; State 3 is that the component monitoring temperature exceeds the derating temperature. Each component is powered on to generate heat, and the temperature rises. The temperature sensing package transmits the monitored temperature information to the controller 40. The controller 40 determines the current temperature rise state. When it is in state 1 and state 2, the current working condition is maintained. When it is in state 3, the controller 40 controls the semiconductor refrigeration plate 70 to be powered on and enter the first stage of heat dissipation.

[0083] Furthermore, from the working principle of the semiconductor refrigeration sheet, it can be known that after power is turned on, the temperature of the cold end close to the water channel side drops, and part of the cold energy is transferred to the metal wall of the water channel by conduction, directly cooling the heat-generating components attached to the water channel wall, and the other part of the cold energy is transferred to the coolant by convection heat transfer, which reduces the temperature of the coolant, increases the temperature difference between the coolant and the components, and improves the thermal driving force, so that it can take away more heat during the flow. At this time, the temperature of the component drops, and when the temperature drops to state 2, the current operating condition is maintained; when the temperature drops to state 1, the controller 40 adjusts and reduces the power of the semiconductor refrigeration sheet until the monitored temperature becomes state 2, then stops adjusting and maintains the current operating condition; when the temperature is state 3, the controller 40 controls the circulation pump to start powering on and enters the second stage of heat dissipation.

[0084] Furthermore, after the circulation pump starts to run, the flowing medium takes away the heat from the hot end of the semiconductor refrigeration plate, and transfers the heat to the external environment and the machine cover during the circulation process. After the temperature of the hot end of the semiconductor refrigeration plate drops, the temperature of the cold end also drops, and the refrigeration performance is improved. When the temperature of the component drops to state 2, the current operating condition is maintained; when the temperature of the component drops to state 1, the controller 40 controls to reduce the power of the circulation pump so that its flow rate is reduced, and the refrigeration effect is suppressed until the temperature reaches state 2, and then the control is stopped to maintain the current operating condition; when the temperature of the component is state 3, the controller 40 controls to increase the power of the circulation pump so that its flow rate is increased, and the refrigeration effect is improved until the temperature reaches state 2, and then the control is stopped to maintain the current operating condition. During the second stage of heat dissipation, the heat from the hot end of the semiconductor refrigeration plate is transferred to the machine cover through the circulating water flow, which increases the temperature of the machine cover and reduces the generation of condensation in this area.

[0085] In one possible embodiment, in the initial design, the design of the cooling water channel can meet the heat dissipation requirements, but when there is a new plan later that requires increasing the power consumption of the heating element close to the water channel, the conventional cooling water channel can no longer meet the heat dissipation requirements and a new design of the water channel is required. However, in the present application, only the power of the semiconductor refrigeration plate and / or the circulation pump needs to be regulated, and there is no need to redesign the cooling water channel, saving the cost of re-opening the mold.

[0086] In summary, in the embodiment of the present application, the current temperature of the vehicle power supply components is first obtained through the temperature sensing package, and then, when the current temperature is higher than the first temperature threshold, the semiconductor refrigeration chip is controlled to be powered on to reduce the temperature of the vehicle power supply components. When the current temperature is between the first temperature threshold and the second temperature threshold, the semiconductor refrigeration chip is controlled to work at the first power. The second temperature threshold is lower than the first temperature threshold. When the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration chip is controlled to work at the second power so that the temperature of the vehicle power supply components is between the first temperature threshold and the second temperature threshold. Thus, by regulating the semiconductor refrigeration chip, the temperature of the vehicle power supply components is controlled so that the temperature of the vehicle power supply components is between the first temperature threshold and the second temperature threshold.

[0087] The method of the embodiment of the present invention is described in detail above, and the device of the embodiment of the present invention is provided below.

[0088] See also Figure 5 , Figure 5 Schematic diagram of the structure of a vehicle-mounted power supply enhanced heat transfer device provided in an embodiment of the present application. The vehicle-mounted power supply enhanced heat transfer device 500 includes an acquisition unit 501 and a processing unit 502;

[0089] The acquisition unit 501 is used to acquire the current temperature of the vehicle power supply components through the temperature sensing package;

[0090] The processing unit 502 is used to control the semiconductor cooling chip to be powered on to reduce the temperature of the vehicle power supply components when the current temperature is higher than the first temperature threshold;

[0091] When the current temperature is between a first temperature threshold and a second temperature threshold, the semiconductor refrigeration piece is controlled to work at a first power, and the second temperature threshold is lower than the first temperature threshold;

[0092] When the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration plate is controlled to work at the second power so that the temperature of the vehicle power supply component is between the first temperature threshold and the second temperature threshold.

[0093] In some possible embodiments, the processing unit 502 is further configured to:

[0094] When the current temperature is higher than the first temperature threshold again, the circulating pump is controlled to be powered on to reduce the temperature of the vehicle power supply components;

[0095] When the current temperature is between the first temperature threshold and the second temperature threshold, controlling the circulating pump to operate at a third power;

[0096] When the current temperature is higher than the first temperature threshold or lower than the second temperature threshold, the third power is regulated according to the current temperature to increase or decrease the flow rate of the flowing medium in the heat dissipation circulation water channel.

[0097] In some possible embodiments, in terms of regulating the third power according to the current temperature, the processing unit 502 is specifically configured to:

[0098] When the current temperature is higher than the first temperature threshold, determining the first adjustment factor according to the difference between the current temperature and the first temperature threshold;

[0099] The third power is increased according to the first adjustment factor so as to increase the flow rate of the flowing medium in the heat dissipation circulation water channel;

[0100] When the current temperature is lower than the second temperature threshold, determining the second adjustment factor according to the difference between the current temperature and the second temperature threshold;

[0101] The third power is reduced according to the second adjustment factor so as to reduce the flow rate of the flowing medium.

[0102] In some possible embodiments, in terms of reducing the first power to obtain the second power, the processing unit 502 is specifically configured to:

[0103] Obtain the thermal resistance, thermal capacitance and operating environment temperature of vehicle power components;

[0104] Determine a target proportionality factor based on thermal resistance, thermal capacitance and operating ambient temperature, the target proportionality factor being used to determine a power reduction per degree Celsius;

[0105] Determine a current temperature difference according to a difference between the current temperature and a second temperature threshold;

[0106] The product of the current temperature difference and the target proportionality coefficient is used as the target power reduction amount;

[0107] The first current power is reduced according to the target power reduction amount to obtain a second power.

[0108] In some possible embodiments, the processing unit 502 is further configured to:

[0109] Obtaining a first opening of a target valve corresponding to a cooling water channel;

[0110] Determine a mapping relationship between a power reduction amount and an opening degree of a target valve;

[0111] determining a second opening of the target valve according to the mapping relationship and the target power reduction amount;

[0112] The control target valve is reduced from the first opening to the second opening.

[0113] See also Figure 6 , Figure 6 Schematic diagram of the structure of an electronic device provided in an embodiment of the present application. Figure 6 As shown, the electronic device 600 includes a transceiver 601, a processor 602 and a memory 603. They are connected via a bus 604. The memory 603 is used to store computer programs and data, and can transmit the data stored in the memory 603 to the processor 602. The electronic device can be the above-mentioned vehicle-mounted power supply enhanced heat transfer device, and the processor 602 can be the above-mentioned acquisition unit 501 and processing unit 502.

[0114] The processor 602 is used to read the computer program in the memory 603 and perform the following operations:

[0115] Get the current temperature of the vehicle power components through the temperature sensing package;

[0116] When the current temperature is higher than the first temperature threshold, the semiconductor cooling chip is controlled to be powered on to reduce the temperature of the vehicle power supply components;

[0117] When the current temperature is between a first temperature threshold and a second temperature threshold, the semiconductor refrigeration piece is controlled to work at a first power, and the second temperature threshold is lower than the first temperature threshold;

[0118] When the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration plate is controlled to work at the second power so that the temperature of the vehicle power supply component is between the first temperature threshold and the second temperature threshold.

[0119] In some possible embodiments, the processor 602 is further configured to perform the following operations:

[0120] When the current temperature is higher than the first temperature threshold again, the circulating pump is controlled to be powered on to reduce the temperature of the vehicle power supply components;

[0121] When the current temperature is between the first temperature threshold and the second temperature threshold, controlling the circulating pump to operate at a third power;

[0122] When the current temperature is higher than the first temperature threshold or lower than the second temperature threshold, the third power is regulated according to the current temperature to increase or decrease the flow rate of the flowing medium in the heat dissipation circulation water channel.

[0123] In some possible embodiments, in terms of regulating the third power according to the current temperature, the processor 602 is specifically configured to perform the following operations:

[0124] When the current temperature is higher than the first temperature threshold, determining the first adjustment factor according to the difference between the current temperature and the first temperature threshold;

[0125] The third power is increased according to the first adjustment factor so as to increase the flow rate of the flowing medium in the heat dissipation circulation water channel;

[0126] When the current temperature is lower than the second temperature threshold, determining the second adjustment factor according to the difference between the current temperature and the second temperature threshold;

[0127] The third power is reduced according to the second adjustment factor so as to reduce the flow rate of the flowing medium.

[0128] In some possible embodiments, in terms of reducing the first power to obtain the second power, the processor 602 is specifically configured to perform the following operations:

[0129] Obtain the thermal resistance, thermal capacitance and operating environment temperature of vehicle power components;

[0130] Determine a target proportionality factor based on thermal resistance, thermal capacitance and operating ambient temperature, the target proportionality factor being used to determine a power reduction per degree Celsius;

[0131] Determine a current temperature difference according to a difference between the current temperature and a second temperature threshold;

[0132] The product of the current temperature difference and the target proportionality coefficient is used as the target power reduction amount;

[0133] The first current power is reduced according to the target power reduction amount to obtain a second power.

[0134] In some possible embodiments, the processor 602 is further configured to perform the following operations:

[0135] Obtaining a first opening of a target valve corresponding to a cooling water channel;

[0136] Determine a mapping relationship between a power reduction amount and an opening degree of a target valve;

[0137] determining a second opening of the target valve according to the mapping relationship and the target power reduction amount;

[0138] The control target valve is reduced from the first opening to the second opening.

[0139] In a possible embodiment, the embodiment of the present invention further provides a vehicle-mounted power supply, which may include the vehicle-mounted power supply provided by any of the above embodiments, and the vehicle-mounted power supply enhanced heat transfer system in the vehicle-mounted power supply is the same as the vehicle-mounted power supply enhanced heat transfer system described in any of the above embodiments, which will not be described here. In addition, the embodiment of the present invention further provides a vehicle, which may include the vehicle-mounted power supply provided by any of the above embodiments.

[0140] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. The computer program is executed by a processor to implement part or all of the steps of any one of the vehicle-mounted power supply enhanced heat transfer methods recorded in the above method embodiments.

[0141] An embodiment of the present application also provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program, and the computer program is operable to enable a computer to execute part or all of the steps of any one of the vehicle-mounted power supply enhanced heat transfer methods recorded in the above method embodiments.

[0142] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily required by the present application.

[0143] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0144] In the several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the modules, which is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection of the device or module can be electrical or other forms.

[0145] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0146] In addition, each functional module in each embodiment of the present application can be integrated into a processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The above integrated modules can be implemented in the form of hardware or software program modules.

[0147] If the integrated module is implemented in the form of a software program module and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, which is stored in a memory and includes several instructions for a computer device (which can be a personal computer, a server or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned memory includes: U disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), mobile hard disk, disk or optical disk and other media that can store program codes.

[0148] A person skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable memory, and the memory can include: a flash drive, a read-only memory (English: Read-Only Memory, abbreviated as: ROM), a random access memory (English: Random Access Memory, abbreviated as: RAM), a magnetic disk or an optical disk, etc.

[0149] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for general technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A method for enhancing heat transfer of a vehicle-mounted power supply, characterized in that: The method is applied to a vehicle-mounted power supply enhanced heat transfer system, wherein the vehicle-mounted power supply enhanced heat transfer system comprises a temperature sensing package and a semiconductor cooling sheet; the method comprises: Obtaining the current temperature of the vehicle power supply components through the temperature sensing package; When the current temperature is higher than a first temperature threshold, controlling the semiconductor refrigeration chip to be powered on to lower the temperature of the vehicle-mounted power supply components; When the current temperature is between the first temperature threshold and a second temperature threshold, controlling the semiconductor refrigeration plate to operate at a first power, and the second temperature threshold is lower than the first temperature threshold; When the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration plate is controlled to operate at the second power so that the temperature of the vehicle power supply component is between the first temperature threshold and the second temperature threshold.

2. The method according to claim 1, characterized in that The vehicle-mounted power supply enhanced heat transfer system also includes a heat dissipation circulation water channel and a circulation pump; the method also includes: When the current temperature is higher than the first temperature threshold again, controlling the circulation pump to be powered on to lower the temperature of the vehicle-mounted power supply components; When the current temperature is between the first temperature threshold and the second temperature threshold, controlling the circulation pump to operate at a third power; When the current temperature is higher than the first temperature threshold or lower than the second temperature threshold, the third power is regulated according to the current temperature to increase or decrease the flow rate of the flowing medium in the heat dissipation circulation water channel.

3. The method according to claim 2, characterized in that The regulating the third power according to the current temperature includes: When the current temperature is higher than the first temperature threshold, determining a first adjustment factor according to a difference between the current temperature and the first temperature threshold; Increasing the third power according to the first adjustment factor so as to increase the flow rate of the flowing medium in the heat dissipation circulation water channel; When the current temperature is lower than the second temperature threshold, determining a second adjustment factor according to a difference between the current temperature and the second temperature threshold; The third power is reduced according to the second adjustment factor to reduce the flow rate of the flowing medium.

4. The method according to any one of claims 1 to 3, characterized in that The step of reducing the first power to obtain a second power includes: Obtaining the thermal resistance, thermal capacity and operating environment temperature of the vehicle-mounted power supply components; determining a target proportionality factor according to the thermal resistance, the thermal capacitance and the operating environment temperature, wherein the target proportionality factor is used to determine a power reduction amount per degree Celsius; determining a current temperature difference according to a difference between the current temperature and the second temperature threshold; Taking the product of the current temperature difference and the target proportionality coefficient as the target power reduction amount; The first power is reduced according to the target power reduction amount to obtain the second power.

5. The method according to claim 4, characterized in that The vehicle-mounted power supply enhanced heat transfer system further includes a cooling water channel; the method further includes: Obtaining a first opening of a target valve corresponding to the cooling water channel; Determining a mapping relationship between a power reduction amount and an opening degree of the target valve; determining a second opening of the target valve according to the mapping relationship and the target power reduction amount; The target valve is controlled to decrease from the first opening to the second opening.

6. A vehicle-mounted power supply enhanced heat transfer device, characterized in that: The vehicle-mounted power supply enhanced heat transfer device comprises an acquisition unit and a processing unit; The acquisition unit is used to acquire the current temperature of the vehicle power supply component through the temperature sensing package; The processing unit is used to control the semiconductor cooling plate to be powered on to work when the current temperature is higher than a first temperature threshold, so as to reduce the temperature of the vehicle-mounted power supply components; When the current temperature is between the first temperature threshold and a second temperature threshold, controlling the semiconductor refrigeration plate to operate at a first power, and the second temperature threshold is lower than the first temperature threshold; When the current temperature is lower than the second temperature threshold, the first power is reduced to obtain the second power, and the semiconductor refrigeration plate is controlled to operate at the second power so that the temperature of the vehicle power supply component is between the first temperature threshold and the second temperature threshold.

7. An electronic device, characterized in that: include: A processor and a memory, the processor is connected to the memory, the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the electronic device executes the method as described in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and the computer program is executed by a processor to implement the method according to any one of claims 1 to 5.

9. A vehicle-mounted power supply, characterized in that: The vehicle-mounted power supply enhanced heat transfer system comprises the vehicle-mounted power supply enhanced heat transfer system according to any one of claims 1 to 5, the machine cover, the machine casing, the controller, the cooling plate slot, the water channel cover and the heat dissipation device, the heat dissipation device is a heat conductive plate or a heat dissipation fin, the heat dissipation device is used for heat dissipation, the vehicle-mounted power supply components are arranged in the space enclosed by the machine cover, the machine casing and the water channel cover, the semiconductor cooling plate is arranged in the cooling plate slot, and the controller is used for controlling the semiconductor cooling plate and / or the circulating pump.

10. A vehicle, characterized in that: Including the vehicle-mounted power supply as claimed in claim 9.

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