Image acquisition equipment and detection system

Abstract

The invention relates to the technical field of machine vision, and provides an image acquisition device and a detection system, and the image acquisition device comprises an image acquisition unit. Wherein the image acquisition unit comprises a shell, a circuit board and an image acquirer, the shell is provided with an accommodating cavity, and the shell wall of the shell is provided with an acquisition area; the image collector and the circuit board are both located in the containing cavity, the collecting end of the image collector faces the collecting area, and the collecting end of the image collector extends in the length direction of the image collecting single body. The circuit board is provided with an optical module, and the optical module is electrically connected with the image collector and transmits signals. Through the arrangement, the width of the image acquisition equipment can be improved, and meanwhile, the signal transmission rate of the image acquisition equipment can also be improved.

Description

Technical Field

[0001] The present application relates to the field of machine vision technology, and in particular to an image acquisition device and a detection system. Background Art

[0002] Wide-format industrial cameras (Contact Image Sensor, CIS) have a large imaging field of view and resolution, and are gradually being used in real-time detection systems in various industrial fields.

[0003] As the width of the detection field of view increases, the width of the CIS unit can meet the requirements of the detection field of view. At the same time, higher requirements are also placed on the signal transmission collected by the CIS unit. Therefore, it is urgent to design a CIS that can improve the transmission rate. Summary of the invention

[0004] The present application provides an image acquisition device and a detection system, which can improve the signal transmission rate.

[0005] In order to achieve the above objectives, this application adopts the following technical solutions:

[0006] The present application provides an image acquisition device, comprising:

[0007] An image acquisition unit, the image acquisition unit comprising a shell, a circuit board and an image acquisition device, the shell having a receiving cavity, and a shell wall of the shell having a collection area; the image acquisition device and the circuit board are both located in the receiving cavity, the collection end of the image acquisition device faces the collection area, and the collection end of the image acquisition device extends along the length direction of the image acquisition unit;

[0008] An optical module is arranged on the circuit board, and the optical module is electrically connected with the image collector and transmits signals.

[0009] As a possible implementation manner, there are at least two optical modules on the circuit board, and at least two optical modules are arranged in sequence along the length direction of the image acquisition unit.

[0010] As a possible implementation manner, a controller and a signal receiver are provided on the circuit board;

[0011] The image collector, the signal receiver, the controller and the optical module are electrically connected in sequence.

[0012] As a possible implementation manner, there are multiple signal receivers on the circuit board, and the multiple signal receivers are arranged in an array on the circuit board;

[0013] Each of the signal receivers is electrically connected to the controller, and at least some of the signal receivers are electrically connected to the image collector.

[0014] As a possible implementation manner, there are at least two circuit boards, and at least two circuit boards are arranged in sequence along the length direction of the image acquisition unit, and adjacent circuit boards are electrically connected;

[0015] Wherein, the image collector is electrically connected to at least a portion of the circuit boards.

[0016] As a possible implementation manner, there are at least two image collectors, and the at least two image collectors are arranged in sequence along the length direction of the image collection unit;

[0017] The image collector and the circuit board are arranged in one-to-one correspondence and are electrically connected.

[0018] As a possible implementation manner, there are multiple image acquisition units, and the multiple image acquisition units are arranged in an array;

[0019] The circuit boards of adjacent image acquisition units are electrically connected;

[0020] The collecting ends of the image collectors of the image collecting units face the same direction.

[0021] As a possible implementation manner, the image acquisition unit further includes a lighting component, the lighting component is located in the accommodating cavity, and the lighting component is electrically connected to the circuit board;

[0022] The lighting assembly is configured to illuminate the collection area.

[0023] As a possible implementation, the housing includes an upper cover, a body and a baffle, the upper cover covers one side of the body, and the baffle is detachably connected to an end of the body along the length direction of the image acquisition unit;

[0024] The upper cover, the body and the baffle together form the accommodating cavity;

[0025] The collection area is located at a side of the body away from the upper cover.

[0026] As a possible implementation manner, a heat conducting member is disposed on the upper cover, the heat conducting member is located on a side of the upper cover away from the main body, and the heat conducting member is thermally connected to the accommodating cavity.

[0027] As a possible implementation manner, the image acquisition unit further includes a fan assembly, and the fan assembly is disposed on a side of the upper cover away from the main body, and the fan assembly is configured to dissipate heat from the upper cover.

[0028] The image acquisition device provided by the present application, the image acquisition device and the circuit board are located in the accommodating cavity of the shell, so that the shell wall of the shell forms a protective effect on the image acquisition device and the circuit board, thereby improving the safety of the image acquisition device and extending the service life of the image acquisition device. The acquisition end of the image acquisition device extends along the length direction of the image acquisition unit so that the image acquisition device has a larger field of view. The image acquisition device and the circuit board are electrically connected to form an information transmission path for capturing images between the image acquisition device and the circuit board, wherein an optical module is provided on the circuit board, and signal transmission is performed through the optical module to improve the signal transmission rate of the image acquisition device. In this way, such an image acquisition device can not only meet various width requirements, but also complete signal transmission faster and better.

[0029] In a second aspect, the present application provides a detection system, comprising a terminal and the image acquisition device described in the first aspect, wherein the terminal and the image acquisition device are electrically connected.

[0030] The detection system provided in the present application can improve the signal transmission rate because it includes the image acquisition device in the aforementioned embodiment. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0032] Figure 1 Schematic diagram of the image acquisition device provided in the embodiment of the present application Figure 1 ;

[0033] Figure 2 A top view of a circuit board in an image acquisition device provided in an embodiment of the present application;

[0034] Figure 3 Schematic diagram of the image acquisition device provided in the embodiment of the present application Figure 2 ;

[0035] Figure 4 A circuit schematic diagram of an image acquisition device provided in an embodiment of the present application.

[0036] Description of reference numerals:

[0037] 100-image acquisition device;

[0038] 200-image acquisition unit;

[0039] 210-housing; 211-upper cover; 212-body; 213-baffle; 214-heat conducting member; 215-fan assembly;

[0040] 220-circuit board;

[0041] 221-connector; 222-controller; 223-signal receiver; 224-optical module; 225-output terminal;

[0042] 230-Image collector. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical scheme and advantages of the embodiments of the present application clearer, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0044] Wide-format industrial cameras (Contact Image Sensor, CIS) have a large imaging field of view and resolution, and are gradually being used in real-time detection systems in various industrial fields.

[0045] As the width of the detection field of view increases, the width of the CIS unit can meet the requirements of the detection field of view. At the same time, higher requirements are also placed on the signal transmission collected by the CIS unit. Therefore, it is urgent to design a CIS that can improve the transmission rate.

[0046] In order to overcome the defects in the prior art, the present application provides an image acquisition device and a detection system. Among them, the image acquisition device includes an image acquisition unit, and the image acquisition unit includes a shell, a circuit board and an image collector. The shell has a containing cavity, and the circuit board and the image collector are both located in the containing cavity. The shell wall has a collection area, and the collection end of the image collector faces the collection area. The collection end of the image collector extends along the length direction of the image acquisition unit to increase the field width of the image acquisition unit. An optical module is provided on the circuit board, and the optical module and the image collector are electrically conductive and transmit signals. Through such a structural setting, the width of the image acquisition device can be increased, and the signal transmission rate can be increased at the same time.

[0047] The contents of the present application will be described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand the contents of the present application more clearly and in detail.

[0048] Figure 1 Schematic diagram of the image acquisition device provided in the embodiment of the present application Figure 1 . Figure 2 A top view of a circuit board in an image acquisition device provided in an embodiment of the present application. Figure 3 Schematic diagram of the image acquisition device provided in the embodiment of the present application Figure 2 . Figure 4 A circuit schematic diagram of an image acquisition device provided in an embodiment of the present application.

[0049] like Figure 1-Figure 4 As shown, the present application provides an image acquisition device 100, including: an image acquisition unit 200. It should be noted that the image acquisition unit 200 in the present application may be a CIS unit, and the acquisition end of the image acquisition unit 200 can acquire the image of the object to be acquired.

[0050] Among them, the image acquisition unit 200 includes a shell 210, a circuit board 220 and an image collector 230. The shell 210 has a accommodating cavity, and the shell wall of the shell 210 has a collection area; the image collector 230 and the circuit board 220 are both located in the accommodating cavity, the collection end of the image collector 230 faces the collection area, and the collection end of the image collector 230 extends along the length direction of the image acquisition unit 200.

[0051] An optical module 224 is disposed on the circuit board 220 , and the optical module 224 and the image collector 230 are electrically connected and transmit signals.

[0052] According to the image acquisition device 100 provided by the embodiment of the present application, the image acquisition device 230 and the circuit board 220 are located in the accommodating cavity of the housing 210, so that the image acquisition device 230 and the circuit board 220 are protected by the shell wall of the housing 210, thereby improving the safety of the image acquisition device 100 and extending the service life of the image acquisition device 100. The acquisition end of the image acquisition device 230 extends along the length direction of the image acquisition unit 200, so that the image acquisition device 100 has a larger field of view. The image acquisition device 230 and the circuit board 220 are electrically connected to form an information transmission path for collecting images between the image acquisition device 230 and the circuit board 220. Among them, an optical module 224 is provided on the circuit board 220, and signal transmission is performed through the optical module 224, thereby improving the signal transmission rate of the image acquisition device 100. In this way, the signal transmission rate is improved while satisfying the increase in the width of the image acquisition device 100.

[0053] The specific structure of the image acquisition device 100 and various possible implementations are described in detail below.

[0054] Exemplarily, the shell 210 in the embodiment of the present application can be a cylindrical shell 210, and the cross-section of the cylindrical shell 210 can be circular, square, or polygonal, etc., and this section does not make specific requirements for this. The shell wall of the shell 210 can have a light-transmitting or transparent part, which forms a sampling area, and the acquisition end of the image collector 230 samples through the sampling area to obtain image signals. Of course, the shell wall of the shell 210 can have an opening, and the opening forms a sampling area. The acquisition end of the image collector 230 samples through the sampling area to obtain image sampling information.

[0055] The acquisition end of the image acquisition device 230 extends along the length direction of the image acquisition unit 200. The extension length is different, and the width of the image acquisition device 230 is different. In this way, the image acquisition device 100 has different widths to adapt to different detection requirements and improve the application range of the image acquisition device 100.

[0056] Furthermore, after the image collector 230 acquires the collected image signal, it needs to be transmitted to the terminal, and the staff can analyze it according to the image signal received by the terminal.

[0057] Specifically, the image acquisition unit 200 also includes a circuit board 220, which is located in the accommodating cavity of the shell 210, so as to protect the circuit board 220 through the accommodating cavity of the shell 210, prevent dust and other impurities from affecting the operation of the circuit board 220, and improve the working stability and safety of the image acquisition device 100.

[0058] The circuit board 220 is provided with an optical module 224 , and the optical module 224 and the image collector 230 are electrically connected and transmit signals.

[0059] In the specific implementation process, the circuit board 220 is also provided with an output terminal 225, and the output terminal 225 is electrically connected to the optical module 224. Through the setting of the optical module 224, the image signal obtained from the image collector 230 is converted into an optical signal, and then output through the output terminal 225, thereby improving the transmission rate of the signal.

[0060] For example, the optical module 224 may be a SPF+ optical port (Small Form-factor Pluggables, SPF+). The output bandwidth of a single optical module 224 may reach 10 Gbps.

[0061] When the width of the image collector 230 is relatively large, in order to further improve the signal transmission rate, there are at least two optical modules 224 on the circuit board 220, and at least two optical modules 224 are arranged in sequence along the length direction of the image collector unit 200.

[0062] In some embodiments, there are two optical modules 224, and the two optical modules 224 are electrically connected to the image collector 230 respectively, and each optical module 224 may correspond to an output terminal 225, and the two optical modules 224 may transmit signals to the terminal through the output terminal 225 at the same time, or may transmit signals to the terminal through only one of the optical modules 224. In this way, the output bandwidth of the image collector 230 with different widths can be met.

[0063] It can be understood that when the number of optical modules 224 is three or more, three or more optical modules 224 are electrically connected to the image collector 230 respectively, and each optical module 224 corresponds to an output terminal 225. Three or more optical modules 224 can transmit signals to the terminal through the output terminal 225 at the same time, or can transmit signals to the terminal only through one or part of the optical modules 224, so as to meet the output bandwidth of image collectors 230 of different widths.

[0064] Exemplarily, the circuit board 220 is provided with a controller 222 and a signal receiver 223; the image collector 230, the signal receiver 223, the controller 222 and the optical module 224 are electrically connected in sequence. In this way, the image collector 230 transmits the collected image signal to the controller 222 through the signal receiver 223, and then transmits the signal to the terminal through the optical module 224.

[0065] It should be noted that a high-speed communication channel can be established between the optical module 224 and the terminal to further improve the rate and stability of signal transmission. The communication channel can be adapted through different standard communication protocols.

[0066] In some embodiments, the signal receiver 223 can be a low-voltage differential signal (LVDS) receiver. The timing positioning of the LVDS receiver is precise, and it can achieve effective and accurate transmission of the signal, so as to improve the transmission accuracy and transmission rate of the collected image signal, and further improve the overall transmission rate of the image acquisition device 100.

[0067] Possibly, there are multiple signal receivers 223 on the circuit board 220 , and the multiple signal receivers 223 are arranged in an array on the circuit board 220 ; each signal receiver 223 is electrically connected to the controller 222 , and at least some of the signal receivers 223 are electrically connected to the image collector 230 .

[0068] It is understandable that the acquisition end of the image acquisition device 230 extends along the length direction of the image acquisition unit 200. As the width of the image acquisition device 230 increases, the image acquisition device 230 acquires more image signals, and more signal receivers 223 are required to complete signal reception.

[0069] At the same time, when there are multiple signal receivers 223 on the circuit board 220, such a circuit board 220 can be compatible with a smaller width image collector 230, which is conducive to the flexible design of the image acquisition device 100. Multiple signal receivers 223 are distributed in an array on the circuit board 220, which facilitates the modular design of the circuit board 220.

[0070] Possibly, there are at least two circuit boards 220, and at least two circuit boards 220 are arranged in sequence along the length direction of the image acquisition unit 200, and adjacent circuit boards 220 are electrically connected; wherein, the image acquisition device 230 is electrically connected to at least a part of the circuit boards 220.

[0071] It is understandable that there may be two circuit boards 220, which are arranged in sequence along the length direction of the image acquisition unit 200, effectively utilizing the accommodating cavity of the shell 210, improving space utilization, and reducing the space occupied by the image acquisition unit 200.

[0072] The two circuit boards 220 are electrically connected to each other, and the image collector 230 is electrically connected to at least one of the two circuit boards 220, forming a transmission path for the collected image signal. It can be understood that when the image collector 230 is electrically connected to one of the circuit boards 220, the collected image signal can be transmitted to the terminal through the optical module 224 on the circuit board 220, or the collected image signal can be transmitted to the terminal through the optical module 224 on the other circuit board 220 that is electrically connected to the circuit board 220.

[0073] It is not difficult to understand that the image collector 230 can be electrically connected to both circuit boards 220 , and finally the collected image signal can be transmitted to the terminal through the optical module 224 on one of the circuit boards 220 .

[0074] Of course, when there are multiple circuit boards 220, the multiple circuit boards 220 are arranged in sequence along the length direction of the image acquisition unit 200, and the adjacent circuit boards 220 are electrically connected. Some of the multiple circuit boards 220 are electrically connected to the image acquisition device 230.

[0075] It should be noted that, in the present embodiment, the image collector 230 may be one or more. When there is only one image collector 230, one image collector 230 may be electrically connected to one of at least two circuit boards 220, or may be electrically connected to a portion of the at least two circuit boards 220, or may be electrically connected to all of the circuit boards 220.

[0076] When there are multiple image collectors 230 , the multiple image collectors 230 may be arranged one-to-one with the circuit board 220 and electrically connected, or some of the multiple image collectors 230 may be electrically connected to the same circuit board 220 .

[0077] Furthermore, each circuit board 220 is provided with a connector 221, and adjacent circuit boards 220 are electrically connected through the connector 221. Thus, signal transmission between adjacent circuit boards 220 is realized through the connection of the connector 221, and at the same time, each circuit board 220 forms a series relationship, and the current signal output is completed through one of the circuit boards 220.

[0078] In some embodiments, there are at least two image collectors 230, and at least two image collectors 230 are arranged in sequence along the length direction of the image collection unit 200; the image collectors 230 and the circuit board 220 are arranged one by one and electrically connected. In this way, by setting up multiple image collectors 230, the width of the image collection unit 200 is increased, and the overall width of the image collection unit 200 is further improved. Multiple image collectors 230 are set on the same housing 210, which reduces the difficulty of position calibration between each image collector 230, so as to improve the overall economy of the image collection device 100. At the same time, each image collector 230 corresponds to a circuit board 220, and the signal transmission is completed through the optical module on the circuit board to ensure the rate and stability of information transmission between each image collection unit 200 and the terminal.

[0079] Possibly, there are multiple image acquisition units 200, and the multiple image acquisition units 200 are arranged in an array; the circuit boards 220 of adjacent image acquisition units 200 are electrically connected; and the acquisition ends of the image acquisition devices 230 of each image acquisition unit 200 face the same direction. In this way, by arranging multiple image acquisition units 200 in an array, the width of the image acquisition device 100 is increased, and the circuit boards 220 are electrically connected, so as to realize the connection of the signal transmission path of each image acquisition unit 200, so as to improve the stability and transmission rate of the overall signal transmission of the image acquisition device 100.

[0080] In addition, when a plurality of image acquisition units 200 are arranged in an array, since the circuit boards 220 of the image acquisition units 200 are electrically connected, one or a portion of the image acquisition units 200 can be selected to output optical signals.

[0081] It should be noted that when multiple image acquisition units 200 are arranged in an array, they can be arranged in sequence along the length direction of the image acquisition units 200 to form a linear curve or a linear straight line. For example, multiple image acquisition units 200 are arranged in a "one" shape, or each image acquisition unit 200 is arranged in a "pin" shape.

[0082] Possibly, the image acquisition unit 200 further includes a lighting assembly, which is located in the accommodating cavity and is electrically connected to the circuit board 220; the lighting assembly is configured to illuminate the acquisition area. In this way, the complexity of setting up the lighting environment of the image acquisition device 100 is reduced, and the flexibility of the image acquisition device 100 is improved, so that the image acquisition device 100 is easy to migrate.

[0083] Possibly, the housing 210 includes an upper cover 211, a body 212 and a baffle 213, wherein the upper cover 211 covers one side of the body 212, and the baffle 213 is detachably connected to the end of the body 212 along the length direction of the image acquisition unit 200; the upper cover 211, the body 212 and the baffle 213 together form a receiving cavity; and the acquisition area is located on the side of the body 212 away from the upper cover 211. In this way, the assembly and production of the image acquisition unit 200 are facilitated. At the same time, when multiple image acquisition units 200 are spliced, it is only necessary to remove the baffle 213 at one end of the body 212, electrically connect the circuit boards 220 of two adjacent image acquisition units 200, and then connect the baffle 213 and the body 212, so that the interior of each image acquisition unit 200 is isolated from the outside, so as to protect the components in the image acquisition unit 200.

[0084] Possibly, a heat conducting member 214 is disposed on the upper cover 211, and the heat conducting member 214 is located on the side of the upper cover 211 away from the body 212, and the heat conducting member 214 and the accommodating cavity are thermally connected. In this way, the heat conducting member 214 dissipates heat from the housing 210, preventing the heat generated by the circuit board 220 during operation from causing a decrease in the signal transmission rate, thereby improving the stability of signal transmission.

[0085] Exemplarily, the heat conducting member 214 may be a fin structure, etc., and this section does not make specific requirements for this.

[0086] Furthermore, the image acquisition unit 200 further includes a fan assembly 215, which is disposed on a side of the upper cover 211 away from the body 212, and is configured to dissipate heat from the upper cover 211. In this way, the fan assembly 215 accelerates the heat dissipation of the upper cover 211, improves the heat dissipation efficiency and effect, and enables each image acquisition device 100 to work stably.

[0087] In a second aspect, the present application may also provide a detection system, including a terminal and the image acquisition device 100 in the aforementioned embodiment, wherein the terminal and the image acquisition device 100 are electrically connected.

[0088] It should be noted that the terminal in this embodiment may be a processor, a display or a computer, etc.

[0089] The detection system provided in this embodiment can improve the signal transmission rate because it includes the image acquisition device 100 in the aforementioned embodiment.

[0090] It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when describing certain features, structures or characteristics in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such features, structures or characteristics in conjunction with other embodiments, whether explicitly or not explicitly described.

[0091] In general, terms should be understood, at least in part, by the context in which they are used. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, depending, at least in part, on the context. Similarly, terms such as "a," "an," or "the" may also be understood to convey singular usage or to convey plural usage, depending, at least in part, on the context.

[0092] It should be easily understood that “on,” “above,” and “over” in this application should be interpreted in the broadest manner, so that “on” not only means “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” not only includes the meaning of “above something” or “over,” but also may include the meaning of “above something” or “over” with no intervening features or layers therebetween (i.e., directly on something).

[0093] In addition, spatially relative terms, such as "below," "below," "below," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90° or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An image acquisition device (100), It is characterized in that include: An image acquisition unit (200), the image acquisition unit (200) comprising a housing (210), a circuit board (220) and an image acquisition device (230), the housing (210) having a receiving cavity, and a housing wall of the housing (210) having a collection area; the image acquisition device (230) and the circuit board (220) are both located in the receiving cavity, the collection end of the image acquisition device (230) faces the collection area, and the collection end of the image acquisition device (230) extends along the length direction of the image acquisition unit (200); The circuit board (220) is provided with an optical module (224), and the optical module (224) and the image collector (230) are electrically connected and transmit signals.

2. The image acquisition device (100) according to claim 1, It is characterized in that There are at least two optical modules (224) on the circuit board (220), and at least two optical modules (224) are arranged in sequence along the length direction of the image acquisition unit (200).

3. The image acquisition device (100) according to claim 1, It is characterized in that The circuit board (220) is provided with a controller (222) and a signal receiver (223); The image collector (230), the signal receiver (223), the controller (222) and the optical module (224) are electrically connected in sequence.

4. The image acquisition device (100) according to claim 3, It is characterized in that There are a plurality of signal receivers (223) on the circuit board (220), and the plurality of signal receivers (223) are arranged in an array on the circuit board (220); Each of the signal receivers (223) is electrically connected to the controller (222), and at least some of the signal receivers (223) are electrically connected to the image collector (230).

5. The image acquisition device (100) according to any one of claims 1 to 4, It is characterized in that There are at least two circuit boards (220), and at least two circuit boards (220) are arranged in sequence along the length direction of the image acquisition unit (200), and adjacent circuit boards (220) are electrically conductive; The image collector (230) and at least a portion of the circuit boards (220) are electrically connected.

6. The image acquisition device (100) according to claim 5, It is characterized in that A connector (221) is provided on each of the circuit boards (220), and adjacent circuit boards (220) are electrically connected via the connectors (221).

7. The image acquisition device (100) according to claim 5, It is characterized in that There are at least two image collectors (230), and the at least two image collectors (230) are arranged in sequence along the length direction of the image collection unit (200); The image collector (230) and the circuit board (220) are arranged in a one-to-one correspondence and are electrically connected.

8. The image acquisition device (100) according to any one of claims 1 to 4, It is characterized in that There are a plurality of image acquisition units (200), and the plurality of image acquisition units (200) are arranged in an array; The circuit boards (220) of adjacent image acquisition units (200) are electrically connected; The collecting ends of the image collectors (230) of the image collecting units (200) face the same direction.

9. The image acquisition device (100) according to any one of claims 1 to 4, It is characterized in that The image acquisition unit (200) further comprises a lighting component, the lighting component is located in the accommodating cavity, and the lighting component is electrically connected to the circuit board (220); The lighting assembly is configured to illuminate the collection area.

10. The image acquisition device (100) according to any one of claims 1 to 4, It is characterized in that The housing (210) comprises an upper cover (211), a body (212) and a baffle (213); the upper cover (211) covers one side of the body (212); and the baffle (213) is detachably connected to an end of the body (212) along the length direction of the image acquisition unit (200); The upper cover (211), the body (212) and the baffle (213) together enclose the accommodating cavity; The collection area is located on a side of the body (212) away from the upper cover (211).

11. The image acquisition device (100) according to claim 10, It is characterized in that A heat conducting member (214) is provided on the upper cover (211); the heat conducting member (214) is located on a side of the upper cover (211) away from the main body (212); and the heat conducting member (214) is thermally connected to the accommodating cavity.

12. The image acquisition device (100) according to claim 11, It is characterized in that The image acquisition unit (200) further comprises a fan assembly (215), wherein the fan assembly (215) is arranged on a side of the upper cover (211) away from the main body (212), and the fan assembly (215) is configured to dissipate heat from the upper cover (211).

13. A detection system, It is characterized in that It comprises a terminal and the image acquisition device (100) according to any one of claims 1 to 12, wherein the terminal and the image acquisition device (100) are electrically connected.

Images