Device for etching electronic circuit board and use method
By designing a device for electronic circuit board etching, the etching time is judged by detecting the corrosion changes of copper foil, the problem of uneven etching rate in wet etching is solved, and the precise etching of the circuit board is achieved, and over-etching and transverse direction are avoided. Drilling and erosion.
Patent Information
- Application Number
- CN202411468095.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-21
- Publication Date
- 2024-12-10
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
In the existing wet etching technology, the decrease in the concentration of the etching liquid leads to uneven etching rates, which are difficult to accurately control, and it is prone to over-etching of circuit boards and lateral drilling, and there is a lack of effective etching degree detection devices.
A device for etching of electronic circuit boards is designed, including an external frame, a base plate, a vertical plate, a guide plate, a track support frame, a rotating component, a supporting circular plate, an upper track plate, an upper connecting plate, a pressing plate, and a lower track plate. , lower connecting plate and power device, determine the etching time by detecting the corrosion changes of copper foil, and ensure the precise etching of the circuit board.
It realizes that the etching time is accurately measured under the changing concentration of the etching liquid, avoiding over-etching and transverse drilling, improving the accuracy and efficiency of the etching process and simplifying the operation steps.
Smart Images
Figure CN119110498A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of circuit board etching processing, in particular to a device for etching electronic circuit boards. Background Art
[0002] Wet etching is a technology that involves immersing the etching material in a corrosive solution for etching. The main factor affecting the etching material of the circuit board during wet etching is the etching rate. In layman's terms, the etching rate is the thickness of the material removed / the time used for etching. The etching rate is often affected by temperature, bubble agitation, and the number of etching batches of the corrosive solution. In addition, the etching rates of circuit boards in different batches and at different locations will also be different.
[0003] The concentration of the etching solution decreases continuously as the processing progresses. There will be a large difference in the etching rate of circuit boards in different locations and different processing batches. In the existing etching process, the etching results cannot be known in time, making it impossible to accurately determine the etching rate, resulting in over-etching and lateral drilling of circuit boards.
[0004] Therefore, there is an urgent need for an etching degree detection device for etching electronic circuit boards. Summary of the invention
[0005] In order to overcome the disadvantage that it is difficult to obtain the etching condition of the circuit board in the existing etching process, the present invention provides a device for etching an electronic circuit board.
[0006] The technical implementation scheme of the present invention is: a device for etching electronic circuit boards, including an external frame assembly, a bottom plate, a vertical plate and a guide plate; the external frame assembly for support is connected to the bottom plate; two vertical plates are fixedly connected to the rear of the bottom plate; a guide plate is fixedly connected between the two vertical plates; it also includes a track support frame, a rotating assembly, a supporting circular plate, an upper track plate, an upper connecting plate, a clamping plate, a lower track plate, a lower connecting plate and a power device; the bottom plate is connected to two track support frames through a connecting column; each track support frame is connected to a plurality of power devices, and the power devices are provided with angle sensors; each power device is connected to a rotating assembly; each Each rotating component is connected to a supporting circular plate; each supporting circular plate is provided with a rotating shaft on one side close to the track support frame, and each track support frame is rotatably connected to the supporting circular plates through the rotating shaft and a plurality of supporting circular plates; an upper track plate is fixedly connected to the upper side of each supporting circular plate; an upper connecting plate is fixedly connected to each two upper track plates facing each other, and a pressure sensor is provided in the upper connecting plate; a clamping plate is elastically connected to the lower surfaces of each two upper track plates facing each other; a lower track plate is connected to the lower side of each supporting circular plate; a lower connecting plate is fixedly connected to each two lower track plates facing each other, and the lower connecting plate is located below the clamping plate, and an electromagnet is provided on the clamping plate.
[0007] Furthermore, the rotating assembly includes an inner circular plate, a telescopic inclined surface member and an outer circular plate; a torsion spring is connected between the supporting circular plate and the track supporting frame; the rotating shaft of each supporting circular plate is fixedly connected to an inner circular plate; each inner circular plate is installed with a plurality of telescopic inclined surface members evenly distributed circumferentially, and each telescopic inclined surface member can be elastically telescopic; each power device is connected to an outer circular plate; a plurality of transmission protrusions evenly distributed circumferentially are provided on the side of the outer circular plate away from the power device, and the transmission protrusions are in contact with the side of the inner circular plate close to the power device.
[0008] Furthermore, it also includes an upper conveying roller, an outer gear 1 and an outer gear 2; the front parts of all the upper track plates facing each other are connected to an upper conveying roller through a rotating shaft for common rotation; the left and right ends of the rotating shaft of each upper conveying roller are respectively fixed with an outer gear 1; an outer part of each outer circular plate is sleeved with an outer gear 2; each outer gear 2 is meshed with the outer gear 1 closest to itself.
[0009] Furthermore, it also includes a lower conveying roller, an external gear three and an external gear four; the rear parts of all two lower track plates facing each other are connected to a lower conveying roller through a rotating shaft for common rotation; the left and right ends of the rotating shaft of each lower conveying roller are respectively fixed with an external gear three; the left and right parts of the rotating shaft of each upper conveying roller are respectively connected with an external gear four.
[0010] Furthermore, it also includes fixing bars; the outer frame component is fixedly connected to two symmetrical fixing bars.
[0011] Furthermore, it also includes a guide cylinder and a guide rail; the supporting circular plate and the lower rail plate are slidably connected; the opposite surfaces of the two rail support frames are each fixedly connected to a plurality of guide rails; each lower rail plate is fixedly connected to a guide cylinder on one side close to the rail support frame; the guide cylinder is located in the guide rail.
[0012] Furthermore, it also includes a winding roller; a winding roller is installed between the two vertical plates, the winding roller is located above the guide plate, and the winding roller is used to wind the detection copper foil.
[0013] Furthermore, it also includes an initial conveying roller; two initial conveying rollers symmetrical to the guide plate are installed between the two vertical plates; the initial conveying roller is used to convey the detection copper foil drawn from the winding roller.
[0014] Furthermore, it also includes a cutter; a guide plate is equipped with a cutter; the cutter is used to cut off the detection copper foil drawn out from the winding roller.
[0015] A method for using a device for etching electronic circuit boards, comprising the following steps: Step 1: Place the test copper foil on the winding roller; Step 2: clamp the end of the detection copper foil wound on the winding roller between two initial conveying rollers; Step 3: Start the winding roller, the initial conveying roller, the upper conveying roller and the lower conveying roller to convey the inspection copper foil along the guide plate to the track space; Step 4: Start the power device to bend the separated detection copper foil between the track units into a wavy shape. After starting all the pressing plates, the wavy detection copper foil is tensioned by the power device, and the cutter is started to cut off the wavy detection copper foil strip below. Step 5: Place the entire device in the etching tank before the circuit board to be etched, ensure that the guide plate and the parts above are above the water level, and after standing for a period of time, place the circuit board to be etched in the etching tank; Step 6: Detect the change of the copper foil through the sensor on the upper connecting board to determine the time taken for the copper foil to corrode to a predetermined degree; Step 7: Remove the device and determine the time for the circuit board to continue to be immersed in the etching tank based on the etching time obtained in step 6.
[0016] The present invention has the following advantages: the present invention arranges the structure reasonably and designs the etching detection device, so that even if the concentration of the etching solution changes after multiple uses, the precise etching time required for etching the circuit board can still be measured, so that the circuit board is etched for a suitable time and over-etching and lateral drilling are avoided.
[0017] The present invention guides the detection copper foil strip to move downward smoothly through the track space between the upper track plate connected end to end and the lower track plate connected end to end, thereby avoiding the detection failure caused by the detection copper foil strip slipping during the downward movement.
[0018] The present invention uses a telescopic inclined plane piece so that when the outer circular plate rotates clockwise, the inner circular plate can be rotated by driving the telescopic inclined plane piece, while when the outer circular plate rotates counterclockwise, the inner circular plate will not be driven. Therefore, the outer circular plate can rotate counterclockwise to drive the upper conveying roller and the lower conveying roller to rotate and transport the inspection copper foil, and the clockwise rotation can stretch the upper track plate and the lower track plate to tighten the inspection copper foil, making the device more compact and improving the efficiency of parts utilization.
[0019] The present invention allows the device to accommodate a large amount of test copper foil at one time by designing a winding roller, thereby avoiding the problem of cumbersome operation steps caused by the need to take the test copper foil from outside the device for each test. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic diagram of the positions of the etching tank and the water level line disclosed in the device for etching electronic circuit boards of the present invention; Figure 2 A schematic diagram of an etching tank disclosed by the present invention for an apparatus for etching electronic circuit boards; Figure 3It is a schematic diagram of the overall structure disclosed by the device for etching electronic circuit boards of the present invention; Figure 4 A schematic diagram of the combined structure of a winding roller, an initial conveying roller and a cutting knife disclosed in the device for etching electronic circuit boards of the present invention; Figure 5 It is a schematic structural diagram of a lower receiving plate disclosed in the device for etching electronic circuit boards of the present invention; Figure 6 A schematic structural diagram of a track unit and a power device disclosed in the device for etching electronic circuit boards of the present invention; Figure 7 A schematic diagram of the combined structure of the inner circular plate, the telescopic inclined surface member and the outer circular plate disclosed in the device for etching electronic circuit boards of the present invention; Figure 8 A schematic structural diagram of a track unit disclosed in the device for etching electronic circuit boards of the present invention; Fig. 9 A schematic diagram of the combined structure of the external gear 1, the external gear 2, the external gear 3 and the external gear 4 disclosed in the device for etching electronic circuit boards of the present invention; Fig.10 A schematic diagram of the combined structure of the track unit, the upper conveying roller and the lower conveying roller disclosed in the device for etching electronic circuit boards of the present invention; Fig.11 It is a schematic diagram of the structure of the cooperation of two track units disclosed in the device for etching electronic circuit boards of the present invention; Fig.12 A state diagram of the upper track plate of the device for etching electronic circuit boards disclosed in the present invention being rotated and parallel to the horizontal plane; Fig.13 A state diagram of detecting copper foil bending into a wavy shape disclosed by the device for etching electronic circuit boards of the present invention; Fig.14 A schematic diagram of the structure of a fixing bar disclosed in the device for etching electronic circuit boards of the present invention; Fig.15 A state diagram of the upper track plate embedded in the fixing strip disclosed in the device for etching electronic circuit boards of the present invention; Fig.16 The present invention is a schematic diagram of the guide cylinder and guide track structure disclosed in the device for etching electronic circuit boards.
[0021] The meaning of the reference numerals in the figure: 1-device frame, 2-electric push rod, 3-bottom plate, 4-vertical plate, 5-guide plate, 6-lower receiving plate, 101-track support frame, 102-support circular plate, 103-upper track plate, 104-upper connecting plate, 105-pressing plate, 106-lower track plate, 107-guide cylinder, 108-guide track, 109-lower connecting plate, 111-power device, 121-inner circular plate, 122-telescopic inclined plane member , 123-outer circular plate, 131-upper conveying roller, 132-outer gear one, 133-outer gear two, 141-lower conveying roller, 142-outer gear three, 143-outer gear four, 201-fixing bar, 301-winding roller, 302-initial conveying roller, 303-cutter, 3a-connecting column, 123a-transmission protrusion, 201a-fixing groove, 400-etching groove, 500-water level line, 600-detection copper foil, 6a-limiting protrusion. DETAILED DESCRIPTION
[0022] Reference to an embodiment herein means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present invention. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments. Example 1
[0023] A device for etching electronic circuit boards, such as Figure 1-16 As shown, it includes an external frame assembly, a bottom plate 3, a vertical plate 4 and a guide plate 5; the external frame assembly for support is connected with the bottom plate 3; two symmetrical vertical plates 4 are welded to the rear of the bottom plate 3; and a guide plate 5 is welded between the two vertical plates 4; It also includes a track support frame 101, a rotating assembly, a supporting circular plate 102, an upper track plate 103, an upper connecting plate 104, a clamping plate 105, a lower track plate 106, a lower connecting plate 109 and a power device 111; the bottom plate 3 is respectively connected to the inclined track support frame 101 through two rows of connecting columns 3a distributed on the left and right; each track support frame 101 is connected to six power devices 111 along its length direction, and the power device 111 is provided with an angle sensor. The power device 111 includes a motor and a reduction gearbox, so that the power device 111 can output a torque of any value and output the motion state of the power device 111; each power device 111 is connected to a rotating assembly; each rotating assembly is connected to a supporting circular plate 102; each supporting circular plate 102 is provided with a rotating shaft on one side close to the track support frame 101, and each track support frame 101 is rotated through the above-mentioned rotating shaft and the six supporting circular plates 102 Dynamic connection; an upper track plate 103 parallel to the track support frame 101 is welded on the oblique upper side of each supporting circular plate 102; an iron upper connecting plate 104 is welded between every two opposing upper track plates 103, and a pressure sensor is arranged inside the upper connecting plate 104 for detecting the squeezing force of the upper connecting plate 104 and the copper foil 600; a clamping plate 105 is elastically connected to the lower surface of every two opposing upper track plates 103; a lower track plate 106 parallel to the track support frame 101 is connected to the oblique lower side of each supporting circular plate 102; an iron lower connecting plate 109 is welded between the two opposing lower track plates 106, and the lower connecting plate 109 is located below the clamping plate 105, and an electromagnet is arranged on the clamping plate 105. After power is turned on, the clamping plate 105, which is originally at the upper side due to elasticity, is pressed against the lower track plate 106 and the lower connecting plate 109 below by the electromagnet attracted by the magnetic force.
[0024] The rotating assembly includes an inner circular plate 121, a telescopic inclined surface member 122 and an outer circular plate 123; a torsion spring is connected between the supporting circular plate 102 and the track support frame 101. When the torsion spring is not subjected to force in the initial state, the upper track plate 103 and the lower track plate 106 are parallel to the track support frame 101. At this time, the upper track plates 103 located on the same track support frame 101 are connected end to end, and the lower track plates 106 located on the same track support frame 101 are also connected end to end. A track space parallel to the track support frame 101 is formed between the upper track plates 103 connected end to end and the lower track plates 106 connected end to end; an inner circular plate 121 is welded to one end of the rotating shaft of each supporting circular plate 102 away from the upper connecting plate 104; each inner circular plate 121 is equipped with two telescopic inclined surface members 122 evenly distributed in the circumferential direction, and each telescopic inclined surface member 122 can be elastically retracted; each power device 111 is connected to An outer circular plate 123 is connected; the side of the outer circular plate 123 away from the power device 111 is provided with two transmission protrusions 123a evenly distributed in the circumferential direction, and the transmission protrusion 123a is in contact with the side of the inner circular plate 121 close to the power device 111; from the perspective of looking from right to left, when the outer circular plate 123 is driven by the power device 111 to rotate counterclockwise, the transmission protrusion 123a squeezes the side of the telescopic inclined plane member 122 provided with the inclined plane, at this time the telescopic inclined plane member 122 contracts, and the transmission protrusion 123a will not drive the inner circular plate 121 to rotate; when the outer circular plate 123 is driven by the power device 111 to rotate clockwise, the transmission protrusion 123a squeezes the side of the telescopic inclined plane member 122 away from the inclined plane, and the telescopic inclined plane member 122 is not compressed at this time, and the transmission protrusion 123a pushes the telescopic inclined plane member 122, and then the telescopic inclined plane member 122 pushes the inner circular plate 121 to rotate the inner circular plate 121.
[0025] The external frame assembly includes a device frame 1 and an electric push rod 2; four electric push rods 2 are installed on the top surface of the device frame 1; and the telescopic parts of all the electric push rods 2 are welded to the bottom plate 3.
[0026] It also includes a lower receiving plate 6; an inclined lower receiving plate 6 is welded to the front of the bottom plate 3, and a limiting protrusion 6a is provided on the lower receiving plate 6 to prevent excessive deflection of the upper track plate 103 at the lower end.
[0027] It also includes an upper conveying roller 131, an outer gear 132 and an outer gear 2 133; the front parts of all the upper track plates 103 facing each other are connected to an upper conveying roller 131 through a rotating shaft for common rotation; the left and right ends of the rotating shaft of each upper conveying roller 131 are respectively fixed with an outer gear 1 132; the outside of each outer circular plate 123 is sleeved with an outer gear 2 133; each outer gear 2 133 is meshed with the outer gear 1 132 closest to itself.
[0028] It also includes a lower conveying roller 141, an outer gear three 142 and an outer gear four 143; the rear parts of all two lower track plates 106 facing each other are connected to a lower conveying roller 141 through a rotating shaft for common rotation; the left and right ends of the rotating shaft of each lower conveying roller 141 are respectively fixed with an outer gear three 142; the left and right parts of the rotating shaft of each upper conveying roller 131 are respectively connected with an outer gear four 143.
[0029] Reference Figure 1 , with the center of the etching groove 400 as a reference, the marked position of the water level line 500 is at the rear, and the observation angle of rotation is from right to left.
[0030] Before the present invention is put into operation, the parts are checked to ensure that the device can work normally, and all parts that need to be electrically connected are electrically connected. At this time, the upper track plates 103 located on the same track support frame 101 are connected end to end, and the lower track plates 106 located on the same track support frame 101 are also connected end to end. A track space parallel to the track support frame 101 is formed between the upper track plates 103 connected end to end and the lower track plates 106 connected end to end. Figure 4-5 As shown, for the convenience of description, each supporting circular plate 102, the upper track plate 103 connected to the supporting circular plate 102 and the lower track plate 106 are combined as a track unit. Figure 8 As shown, at this time, the upper conveying roller 131 located on the rear track unit and the lower conveying roller 141 located on the front track unit are symmetrical about the track space, and the corresponding external gear 3 142 and external gear 4 143 are also meshed with each other. The parts state is referenced Fig.11 .
[0031] First, cut a section of the detection copper foil 600 that is longer than the track support frame 101, and trim the width of the above-mentioned detection copper foil 600 to be larger than the length of the upper connecting plate 104, but smaller than the distance between the two opposite supporting circular plates 102, and then place the lower end of the above-mentioned detection copper foil 600 on the upper surface of the guide plate 5, so that the detection copper foil 600 slides along the inclined guide plate 5 into the track space formed between the upper track plate 103 connected end to end and the lower track plate 106 connected end to end.
[0032] At the same time, Figure 8-11As shown, the power device 111 is started to make the outer circular plate 123 rotate counterclockwise, and the outer circular plate 123 drives the outer gear 2 133 to rotate counterclockwise, and then the outer gear 1 132 meshing therewith rotates clockwise, so the upper conveying roller 131 rotates clockwise, and then the outer gear 4 143 rotates clockwise, therefore, the outer gear 3 142 meshing with the outer gear 4 143 rotates counterclockwise, so the outer gear 3 142 drives the corresponding lower conveying roller 141 to rotate counterclockwise, so the upper conveying roller 131 and the adjacent lower conveying roller 141 rotate in opposite directions, when the detection copper foil 600 sliding down along the track space contacts the upper conveying roller 131 and the lower conveying roller 141, it is clamped and conveyed by the upper conveying roller 131 and the lower conveying roller 141, and the auxiliary detection copper foil 600 moves obliquely downward.
[0033] It is worth noting that reference Figure 7 When the outer circular plate 123 rotates counterclockwise, the transmission protrusion 123a slides on the inner circular plate 121, and when the transmission protrusion 123a slides counterclockwise, it contacts the inclined surface of the telescopic inclined plane member 122, so that the telescopic inclined plane member 122 contracts. Therefore, the transmission protrusion 123a will not transmit torque to the telescopic inclined plane member 122, and then the inner circular plate 121 will not rotate. Therefore, the upper track plate 103 and the lower track plate 106 will not rotate to cause the above-mentioned track space deformation. In addition, if Figure 6 As shown, the upper track plate 103 at the lower end is also held back by the limiting protrusion 6a on the upper surface of the lower supporting plate 6 at a position parallel to the track support frame 101, so that the upper track plate 103 at the lower end cannot be further driven by the corresponding inner circular plate 121 to rotate counterclockwise, and further, since all the upper track plates 103 and lower track plates 106 are respectively connected end to end at this time, the remaining upper track plates 103 and lower track plates 106 are also respectively limited by the adjacent upper track plates 103 and lower track plates 106, which further ensures that the above-mentioned track space will not be deformed, so that the 600 detection copper foils can slide down smoothly along the above-mentioned track space without being stuck.
[0034] When the lower end of the detection copper foil 600 contacts the lower receiving plate 6 at the bottom, the upper part of the detection copper foil 600 stays on the guide plate 5 and does not enter the track space, the power device 111 is stopped, and the electromagnet on the lower clamping plate 105 is started. The electromagnet attracts the lower connecting plate 109 due to magnetism, and then the electromagnet drives the clamping plate 105 to press the lower connecting plate 109, so that the clamping plate 105 and the corresponding lower connecting plate 109 cooperate with each other to clamp the detection copper foil 600 between them, and then the motor on the power device 111 is reversed to make the outer circular plate 123 rotate clockwise, and then the transmission protrusion 123a on the outer circular plate 123 contacts the telescopic inclined surface member 122, refer to Figure 7At this time, the telescopic inclined plane member 122 does not shrink, so the transmission protrusion 123a drives the telescopic inclined plane member 122 to rotate clockwise, and then the telescopic inclined plane member 122 drives the inner circular plate 121 to rotate clockwise, so that the supporting circular plate 102 is also driven by the inner circular plate 121 to overcome the elastic force of the torsion spring and rotate clockwise, thereby causing the upper track plate 103 and the lower track plate 106 to rotate, as shown in FIG. Fig.12 As shown, at this time, the rear end of the upper track plate 103 and the corresponding upper connecting plate 104 press down the upper surface of the detection copper foil 600, and the lower track plate 106 and the corresponding lower connecting plate 109 push up the lower surface of the detection copper foil 600. At this time, several fulcrums of the detection copper foil 600 are upward, and several fulcrums are downward, and the separation of these fulcrums also makes the detection copper foil 600 bend into a wave shape, as shown in FIG. Fig.13 As shown, when the upper rail plate 103 and the lower rail plate 106 are parallel to the horizontal plane, the power device 111 is suspended.
[0035] It is worth noting that in the process of bending the detection copper foil 600 into a wave shape, the upper track plate 103, the upper connecting plate 104, the lower track plate 106 and the lower connecting plate 109 do not restrict the sliding of the detection copper foil 600, so the upper part of the detection copper foil 600 originally located on the guide plate 5 will be pulled downward due to the movement of the fulcrum. Therefore, the detection copper foil 600 is still in a relaxed state at this time.
[0036] Then, the electromagnets on all the pressing plates 105 are started, so that the pressing plates 105 press the corresponding parts on the detection copper foil 600, and then the power device 111 is started. At this time, since the detection copper foil 600 is pressed by the pressing plates 105, the detection copper foil 600 cannot be extended, which limits the movement of the upper track plate 103, the upper connecting plate 104, the lower track plate 106 and the lower connecting plate 109. Therefore, the supporting circular plate 102 no longer rotates, but the continuously working power device 111 continues to supply the inner circular plate 12 1 transmits torque. As the torque on the inner circular plate 121 becomes larger and larger, the pressure on the detection copper foil 600 by the upper track plate 103 and the lower track plate 106 and the corresponding upper connecting plate 104 and the lower connecting plate 109 becomes larger and larger. Therefore, the stress inside the detection copper foil 600 also increases. When the sensor built into the power device 111 detects that the output torque reaches a fixed value, the increase of the output torque is stopped, so that the detection copper foil 600 is in a taut state. At this point, the placement of the detection copper foil 600 is completed.
[0037] Then, the device frame 1 is placed in the etching tank 400 filled with etching liquid. At this time, the electric push rod 2 is in a retracted state, and the bottom plate 3 is located above the water level line 500. Before placing the circuit board to be etched into the etching tank 400, the electric push rod 2 is started, and the bottom plate 3 is lowered to immerse the detection copper foil 600 in the etching liquid. Considering that the flow direction of the circuit board to be etched and the etching liquid are parallel, the width direction of the detection copper foil 600 is placed in the left and right direction, so that the detection copper foil 600 is parallel to the flow direction of the etching liquid. The time required for the detection copper foil 600 to be corroded to a predetermined degree is the etching time required for the circuit board to be etched. Since the detection copper foil 600 is corroded before the circuit board to be etched, after the corrosion of the detection copper foil 600 is completed, the circuit board to be etched has not been successfully etched. At this time, the time for the circuit board to be etched to continue to be immersed can be determined according to the corrosion time of the detection copper foil 600.
[0038] The detection copper foil 600 is corroded by the etching solution and its strength is reduced, and then the tight detection copper foil 600 is broken. At this time, the pressure on the upper connecting plate 104 closest to the break is reduced, and the sensor thereon detects the pressure change, thereby knowing that the detection copper foil 600 near the upper connecting plate 104 is corroded and broken.
[0039] If the etching rate in the etching groove 400 is uniform, the detection copper foil 600 will be corroded uniformly, and there will be several fractures in the detection copper foil 600 in a short time. Therefore, several sensors on the upper connecting plate 104 will detect the pressure change in a short time. If the etching rate in the etching groove 400 is uneven, the detection copper foil 600 will be fractured at the point with the maximum corrosion rate. The sensors on the upper connecting plate 104 near this point can detect the pressure change. However, the corrosion rate of the detection copper foil 600 in other positions is slower. In addition, the detection copper foil 600 is pressed by several pressing plates 105, so that the fracture in one place will not affect the stress in other areas. Therefore, the upper connecting plate 104 in other areas will be The sensor needs a long time to detect the pressure change. Therefore, by comparing the time when each sensor measures the pressure change, the uniformity of the etching solution can be indirectly judged, and then the accurate etching time of the circuit board can be obtained. Compared with the detection device in the prior art, which can only detect the corrosion of the etching solution in a small area around it, in order to correct the influence of the position on the etching rate, several detection devices distributed in various places are required. The device uses 600 detection copper foils that penetrate the etching solution from the upper layer to the lower layer of the etching solution during detection. Therefore, one device can be used to judge the etching rate of each layer of the etching solution, and then only one device can be used to correct the influence of the position on the etching rate. Compared with the prior art, it is simpler.
[0040] When a certain number of sensors on the upper connecting plate 104 detect pressure changes, it means that the detection copper foil 600 has been completely corroded. At this time, the power device 111 is started, and the upper track plate 103 and the lower track plate 106 are rotated clockwise to a position perpendicular to the horizontal plane. At this time, the broken parts of the detection copper foil 600 will fall on the bottom plate 3, and the electric push rod 2 is started to lift the bottom plate 3 above the water level line 500. At the same time, the operator can also obtain accurate etching time. After the circuit board has been immersed for the same period of time, the circuit board can be taken out in time to avoid excessive etching and lateral drilling. Example 2
[0041] On the basis of Example 1, Figure 14-16 As shown, a fixing bar 201 is also included; two symmetrical fixing bars 201 are welded on the top surface of the inner side of the device frame 1 .
[0042] It also includes a guide cylinder 107 and a guide rail 108; the support circular plate 102 and the lower rail plate 106 are slidably connected; six guide rails 108 are welded to the opposite surfaces of the two rail support frames 101; each lower rail plate 106 is welded with a guide cylinder 107 on the side close to the rail support frame 101; the guide cylinder 107 is located in the guide rail 108, and the guide cylinder 107 slides in the guide rail 108 as the lower rail plate 106 rotates, and then the guide cylinder 107 drives the lower rail plate 106 to slide along the slide groove of the support circular plate 102.
[0043] Some of the remaining detection copper foil 600 will be placed on the lower track plate 106 and the corresponding lower connecting plate 109. As the lower track plate 106 rotates, the guide cylinder 107 slides in the guide track 108, and then the guide cylinder 107 drives the lower track plate 106 to slide on the supporting circular plate 102, so that the lower track plate 106 and the corresponding lower connecting plate 109 away from the lower conveying roller 141 are in contact with the upper conveying roller 131. Fig.15 and 16 As shown, when the telescopic part of the electric push rod 2 is fully retracted, the upper track plate 103 is inserted into the fixing groove 201a on the fixing strip 201, and the fixing strip 201 fixes the upper track plate 103, thereby supporting the circular plate 102 and the parts thereon and preventing them from rotating at will. At this time, the power device 111 is started to drive the outer circular plate 123 to rotate counterclockwise, and then through the meshing outer gear 1 132 and the outer gear 2 133, the upper conveying roller 131 rotates clockwise, and then through the upper conveying roller 131, the remaining detection copper foil 600 strips on the lower track plate 106 and the corresponding lower connecting plate 109 are moved, so that the remaining detection copper foil 600 strips fall and fall onto the bottom plate 3.
[0044] After cleaning is completed, the base plate 3 is lowered by the electric push rod 2. At this time, the upper track plate 103 is disengaged from the fixed groove 201a, and the supporting circular plate 102 rotates counterclockwise under the action of the torsion spring. At the same time, the power device 111 is started to make the outer circular plate 123 rotate counterclockwise as well to avoid interfering with the rotation of the supporting circular plate 102 under the action of the torsion spring. Finally, the supporting circular plate 102 returns to the initial position. At this time, the upper track plate 103 and the lower track plate 106 are parallel to the track support frame 101.
[0045] It is worth noting that the guide rail 108 is composed of two circular arcs. The center of the first circular arc coincides with the axis of the supporting circular plate 102. When the supporting circular plate 102 rotates to make the upper rail plate 103 and the lower rail plate 106 parallel to the horizontal plane, the guide cylinder 107 slides on this part of the arc. Therefore, the lower rail plate 106 does not slide relative to the supporting circular plate 102 at this time, thereby preventing the sliding of the lower rail plate 106 from affecting the force on the detection copper foil 600. The center of the other part of the arc is lower than the axis of the supporting circular plate 102. When the upper rail plate 103 and the lower rail plate 106 continue to rotate to be perpendicular to the horizontal plane, the guide cylinder 107 slides on this part of the arc, so the lower rail plate 106 will slide relative to the supporting circular plate 102. Example 3
[0046] On the basis of Example 2, Figure 1-16 As shown, a winding roller 301 is also included; a winding roller 301 is installed between the two vertical plates 4, and the winding roller 301 is located above the guide plate 5. The winding roller 301 is used to wind the detection copper foil 600.
[0047] It also includes an initial conveying roller 302 ; two initial conveying rollers 302 symmetrically about the guide plate 5 are installed between the two vertical plates 4 ; the initial conveying roller 302 is used to convey the detection copper foil 600 drawn from the winding roller 301 .
[0048] A cutter 303 is also included; the guide plate 5 is equipped with a cutter 303; the cutter 303 is used to cut the detection copper foil 600 drawn out from the winding roller 301.
[0049] A method for using a device for etching electronic circuit boards, comprising the following steps: Step 1: placing the inspection copper foil 600 on the winding roller 301; Step 2: clamp the end of the detection copper foil 600 wound on the winding roller 301 between two initial conveying rollers 302; Step 3: Start the winding roller 301, the initial conveying roller 302, the upper conveying roller 131 and the lower conveying roller 141 to convey the inspection copper foil 600 along the guide plate 5 to the track space; Step 4: Start the power device 111 to bend the separated detection copper foil 600 between the track units into a wave shape. After starting all the pressing plates 105, the wave-shaped detection copper foil 600 is tensioned by the power device 111, and the cutter 303 is started to cut off the wave-shaped detection copper foil 600 at the bottom. Step 5: Place the entire device in the etching tank 400 before the circuit board to be etched, ensure that the guide plate 5 and the parts above are above the water level line 500, and after standing for a period of time, place the circuit board to be etched in the etching tank 400; Step 6: Detect the change of the copper foil 600 through the sensor on the upper connecting plate 104, and determine the time taken for the copper foil 600 to corrode to a predetermined degree; Step 7: Remove the device and determine the time for the circuit board to continue to be immersed in the etching tank 400 according to the etching time obtained in step 6.
[0050] Different types of circuit boards have different surface copper foil thicknesses, so the etching time is also different. When the present invention handles this type of situation, it can simulate etching conditions of different circuit boards by placing different thicknesses of detection copper foil 600, or it can use a thicker detection copper foil 600 and only adjust the torque transmitted by the power device 111 to change the stress of the detection copper foil 600 by tensioning the upper track plate 103, the upper connecting plate 104, the lower track plate 106 and the lower connecting plate 109, so that the detection copper foil 600 of the same thickness breaks and ruptures at different times under the same corrosion conditions. That is, for a circuit board with a thinner surface copper foil, the etching depth of the circuit board is shallow and the etching time is short, and the power device 111 can be adjusted to increase the stress of the detection copper foil 600, so that the detection copper foil 600 breaks when the corrosion degree is relatively shallow, while the circuit board with a thicker surface copper foil is the opposite. The advantage of this is that when etching different types of circuit boards in the same etching tank 400, the detection copper foil 600 of the same thickness can be used for detection, avoiding the need to replace the detection copper foil 600. Therefore, the winding roller 301 can be designed in the present invention to wind the detection copper foil 600, so that the detection copper foil 600 strips for detection can be obtained at any time.
[0051] On this basis, the end of the detection copper foil 600 wound on the winding roller 301 is clamped between the two initial conveying rollers 302. Before etching is required, the winding roller 301 and the two initial conveying rollers 302 are started to convey the detection copper foil 600 along the guide plate 5 to the track space. When the end of the detection copper foil 600 contacts the lower receiving plate 6 at the bottom, the electromagnet on the lower clamping plate 105 is started so that the clamping plate 105 presses the lower end of the detection copper foil 600. Then the power device 111 is started to bend the detection copper foil 600 located between the track units into a wavy shape. After all the clamping plates 105 are started, the cutter 303 is started to cut off the detection copper foil 600 below. At this point, the automatic installation of the detection copper foil 600 is completed. The detection copper foil 600 is placed manually by the operator instead of mechanical parts, thereby improving the degree of automation of the present invention.
[0052] Although the present invention is described in detail with reference to the above embodiments, it is obvious to those skilled in the art through this disclosure that various changes or modifications may be made to the present invention without departing from the principle and spirit of the present invention defined by the claims. Therefore, the detailed description of the embodiments of the present disclosure is only used to explain, not to limit the present invention, but the scope of protection is limited by the content of the claims.
Claims
1. A device for etching electronic circuit boards, comprising an external frame assembly, a bottom plate (3), a vertical plate (4) and a guide plate (5); the external frame assembly for supporting is connected to the bottom plate (3); two vertical plates (4) are fixedly connected to the rear of the bottom plate (3); the guide plate (5) is fixedly connected between the two vertical plates (4); the device is characterized in that: The invention also comprises a track support frame (101), a rotating assembly, a supporting circular plate (102), an upper track plate (103), an upper connecting plate (104), a pressing plate (105), a lower track plate (106), a lower connecting plate (109) and a power device (111); the bottom plate (3) is connected to two track support frames (101) via a connecting column (3a); each track support frame (101) is connected to a plurality of power devices (111), and the power devices (111) are provided with an angle sensor; each power device (111) is connected to a rotating assembly; each rotating assembly is connected to a supporting circular plate (102); each supporting circular plate (102) is provided with a rotating shaft on one side close to the track support frame (101); each track support The frames (101) are rotatably connected via the rotating shaft and a plurality of supporting circular plates (102); an upper track plate (103) is fixedly connected to the oblique upper side of each supporting circular plate (102); an upper connecting plate (104) is fixedly connected between every two upper track plates (103) facing each other, and a pressure sensor is arranged inside the upper connecting plate (104); a clamping plate (105) is elastically connected to the lower surface of every two upper track plates (103) facing each other; a lower track plate (106) is connected to the oblique lower side of each supporting circular plate (102); a lower connecting plate (109) is fixedly connected between the two lower track plates (106) facing each other, and the lower connecting plate (109) is located below the clamping plate (105), and an electromagnet is arranged on the clamping plate (105).
2. A device for etching electronic circuit boards according to claim 1, characterized in that: The rotating assembly comprises an inner circular plate (121), a telescopic inclined surface member (122) and an outer circular plate (123); a torsion spring is connected between the supporting circular plate (102) and the track supporting frame (101); the rotating shaft of each supporting circular plate (102) is fixedly connected to an inner circular plate (121); each inner circular plate (121) is installed with a plurality of telescopic inclined surface members (122) evenly distributed in the circumferential direction, and each telescopic inclined surface member (122) can be elastically telescopic; each power device (111) is connected to an outer circular plate (123); a plurality of transmission protrusions (123a) evenly distributed in the circumferential direction are provided on a side of the outer circular plate (123) away from the power device (111), and the transmission protrusions (123a) are in contact with a side of the inner circular plate (121) close to the power device (111).
3. A device for etching electronic circuit boards according to claim 2, characterized in that: It also includes an upper conveying roller (131), an outer gear 1 (132) and an outer gear 2 (133); the front parts of all the upper rail plates (103) facing each other are connected to an upper conveying roller (131) through a rotating shaft for common rotation; the left and right ends of the rotating shaft of each upper conveying roller (131) are respectively fixedly connected to an outer gear 1 (132); the outside of each outer circular plate (123) is sleeved with an outer gear 2 (133); and each outer gear 2 (133) is meshed with the outer gear 1 (132) closest to itself.
4. A device for etching electronic circuit boards according to claim 3, characterized in that: It also includes a lower conveying roller (141), an outer gear three (142) and an outer gear four (143); the rear parts of all two mutually opposite lower track plates (106) are connected to a lower conveying roller (141) through a rotating shaft for common rotation; the left end and the right end of the rotating shaft of each lower conveying roller (141) are respectively fixedly connected to an outer gear three (142); the left part and the right part of the rotating shaft of each upper conveying roller (131) are respectively connected to an outer gear four (143).
5. A device for etching electronic circuit boards according to claim 4, characterized in that: It also includes a fixing strip (201); two symmetrical fixing strips (201) are fixedly connected to the inner top surface of the external frame assembly.
6. A device for etching electronic circuit boards according to claim 5, characterized in that: It also includes a guide cylinder (107) and a guide rail (108); the support circular plate (102) and the lower rail plate (106) are slidably connected; the opposite surfaces of the two rail support frames (101) are each fixedly connected to a plurality of guide rails (108); each lower rail plate (106) is fixedly connected to a guide cylinder (107) on one side close to the rail support frame (101); and the guide cylinder (107) is located inside the guide rail (108).
7. A device for etching electronic circuit boards according to claim 6, characterized in that: It also includes a winding roller (301); a winding roller (301) is installed between the two vertical plates (4), the winding roller (301) is located above the guide plate (5), and the winding roller (301) is used to wind the detection copper foil (600).
8. A device for etching electronic circuit boards according to any one of claims 1 to 7, characterized in that: It also includes an initial conveying roller (302); two initial conveying rollers (302) are installed between the two vertical plates (4) and are symmetrical with respect to the guide plate (5); the initial conveying roller (302) is used to convey the detection copper foil (600) drawn from the winding roller (301).
9. A device for etching electronic circuit boards according to claim 8, characterized in that: It also includes a cutter (303); the guide plate (5) is equipped with a cutter (303); the cutter (303) is used to cut the detection copper foil (600) drawn out from the winding roller (301).
10. A device for etching electronic circuit boards according to claim 9, characterized in that: A method for using a device for etching electronic circuit boards, comprising the following steps: Step 1: placing a test copper foil (600) on the winding roller (301); Step 2: clamping the end of the detection copper foil (600) wound on the winding roller (301) between two initial conveying rollers (302); Step 3: starting the winding roller (301), the initial conveying roller (302), the upper conveying roller (131) and the lower conveying roller (141) to convey the inspection copper foil (600) along the guide plate (5) to the track space; Step 4: Start the power device (111) to bend the separated detection copper foil (600) between the track units into a wave shape. After starting all the pressing plates (105), the wave-shaped detection copper foil (600) is tensioned by the power device (111), and the cutter (303) is started to cut off the wave-shaped detection copper foil (600) strip at the bottom. Step 5: Place the entire device before the circuit board to be etched in the etching tank (400), ensure that the guide plate (5) and the parts above are above the water level (500), and after a period of rest, place the circuit board to be etched in the etching tank (400); Step six: using a sensor on the upper connecting plate (104) to detect changes in the detection copper foil (600), and determining the time taken for the detection copper foil (600) to corrode to a predetermined degree; Step 7: Remove the device and determine the time for the circuit board to continue to be immersed in the etching tank (400) according to the etching time obtained in step 6.