Cleaning, drying and storing integrated micro-nano sensor substrate cleaning machine

Abstract

The invention discloses a cleaning, drying and storing integrated micro-nano sensor substrate cleaning machine, and relates to the technical field of micro-nano. Comprising a cleaning box, vertical displacement mechanisms are arranged on the left side and the right side of the cleaning box, horizontal displacement mechanisms are arranged on the vertical displacement mechanisms and comprise horizontal displacement rods and horizontal displacement sliding blocks, rotary telescopic air cylinders are arranged on the horizontal displacement sliding blocks, and mechanical clamping jaws are arranged at the tail ends of the rotary telescopic air cylinders of a left metal sheet base. A vacuum gear pump is arranged in the middle of the right metal sheet substrate rotary telescopic cylinder, and a negative-pressure sucker system is arranged at the tail end; a metal sheet substrate storage drawer, a nitrogen purging device and a drying heating plate are arranged in the middle of the cleaning box from top to bottom; a three-groove ultrasonic cleaning machine is arranged at the bottom of the cleaning box. The design concept is advanced, operation is easy, and practicability is high. Multiple cleaning and efficient water removal functions are integrated, the substrate can be quickly and thoroughly cleaned, and the problem of secondary pollution can be effectively prevented. And a storage system is arranged, so that the cleaned substrate can be orderly arranged, and subsequent use and management are facilitated.

Description

Technical Field

[0001] The invention relates to the technical field of micro-nano sensor technology, and in particular to an integrated micro-nano sensor substrate cleaning machine for cleaning, drying and storing micro-nano sensor substrates. Background Art

[0002] In recent years, the rapid development of micro-nanotechnology has made sensors based on micro-nano structures the focus of scientific research and industry. This type of sensor has won wide attention and in-depth research due to its unique size effect and wide and diverse application scenarios. In the process of preparing micro-nano sensors, metal or silicon wafer substrates are key supporting materials, and their surface cleanliness has a decisive influence on the performance of the sensor. In view of the extremely small size characteristics of micro-nanostructure sensors, it is particularly important and indispensable to perform multi-level, high-precision cleaning treatment on the substrate to obtain a smooth substrate surface. This process ensures that the sensor can exhibit optimal performance in the subsequent preparation stage.

[0003] The traditional substrate cleaning process involves placing a pre-polished metal sheet or silicon wafer in an ultrasonic cleaning device containing an organic solvent such as ethanol. During this process, the tiny bubble vibrations stimulated by ultrasound effectively peel off the contaminants on the surface of the substrate, which are then removed by water rinsing and then dried. However, this single cleaning method is powerless when faced with a variety of contaminants, and different solvents have different effects on the removal of specific contaminants. In addition, especially when dealing with a large number of substrates, relying entirely on manual operation increases labor intensity and errors, and the traditional ultrasonic cleaning tank lacks fixings, which easily causes collisions between substrates and forms scratches. After cleaning, the water stains adsorbed on the surface of the substrate are prone to adhere to impurities such as dust during the drying process, causing secondary pollution. Therefore, it is particularly important to develop a device that can efficiently and automatically complete the cleaning, drying and storage of sensor substrates. Summary of the invention

[0004] The purpose of the present invention is to solve the problems of low cleaning efficiency and inconsistent cleanliness of sensor substrates in the prior art, and to provide a cleaning machine for micro-nano sensor substrates that has good cleaning effect, high efficiency and strong practicality. By integrating the cleaning, drying and storage functions, efficient and automated processing of sensor substrates can be achieved.

[0005] To achieve the above object, the present invention adopts the following scheme:

[0006] A cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine, including a cleaning box, a vertical displacement mechanism, a horizontal displacement mechanism, a mechanical clamping claw, a negative pressure suction cup system, a metal sheet substrate storage drawer, a nitrogen purge device, a drying and heating device, and a three-slot ultrasonic cleaning machine;

[0007] The cleaning box is the main part of the equipment, and multiple functional areas are arranged in the cleaning box for cleaning, drying and storing the substrate;

[0008] The vertical displacement mechanism is arranged on the left and right sides of the cleaning box, and the vertical displacement mechanism includes a screw rod, a vertical displacement motor, a supporting slide rail, and a vertical displacement slide plate; the vertical displacement motor drives the screw rod to rotate, thereby driving the vertical displacement slide plate to move up and down on the supporting slide rail;

[0009] The horizontal displacement mechanism is installed on the vertical displacement mechanism; the horizontal displacement mechanism includes a horizontal displacement rod, a horizontal displacement slider and a horizontal displacement motor; the horizontal displacement slider is rollingly connected to the two side walls of the horizontal displacement rod; the horizontal displacement motor drives the horizontal displacement slider to slide on the horizontal displacement rod through a belt to realize horizontal movement of the base;

[0010] The horizontal displacement mechanism is hinged to the vertical displacement slide plate, and a flip motor is installed at the hinge part to drive the horizontal displacement rod to flip;

[0011] The horizontal displacement slider is provided with a rotating telescopic cylinder, the rotating telescopic cylinder for the metal sheet base on the left side of the box is connected to a small telescopic cylinder, a mechanical clamping claw is provided at the end of the small telescopic cylinder, and the mechanical clamping claw is used to clamp the metal sheet base; a vacuum gear pump is installed in the middle of the rotating telescopic cylinder for the silicon wafer base on the right side of the box, and a negative pressure suction cup system is provided at the end, and the negative pressure suction cup system is used to adsorb the silicon wafer base; the negative pressure suction cup system is provided with a plurality of silicon wafer base placement slots arranged in a line, and a negative pressure suction cup is provided in each placement slot, and both the mechanical clamping claw and the negative pressure suction cup system can realize precise movement and positioning of the base under the drive of the vertical displacement mechanism and the horizontal displacement mechanism;

[0012] The upper part of the rear wall of the cleaning box is provided with a metal sheet base storage drawer cooperating with a mechanical clamping claw, and the metal sheet base storage drawer is used to store the metal sheet base after cleaning and drying for subsequent use or storage; the metal sheet base storage drawer can be pulled forward;

[0013] The nitrogen purge device is arranged in the middle of the rear wall of the cleaning box; the nitrogen purge device is used to purge and air-dry the cleaned substrate with nitrogen to remove residual moisture and tiny particles on the surface of the substrate;

[0014] The drying and heating device is arranged below the rear wall of the cleaning box, and is used to heat and dry the substrate after purging and air drying to ensure that the surface of the substrate is completely dry; the drying and heating device comprises a fixed plate and a heating plate, and the fixed plate is connected to the rear wall of the cleaning box by bolts, and a resistance wire is arranged inside the heating plate for heating, and four spring buffer devices are arranged between the heating plate and the fixed plate; the heating plate is connected to the fixed plate by the spring buffer device to ensure stability during the heating process;

[0015] The three-tank ultrasonic cleaning machine is arranged at the bottom of the cleaning box, and includes three independent cleaning tanks, which are an acetone cleaning tank, an ethanol cleaning tank and a deionized water cleaning tank in sequence; the three-tank ultrasonic cleaning machine is used to perform ultrasonic oscillation cleaning of the substrate with acetone, ethanol and deionized water to remove stains and impurities on the surface of the substrate; a liquid inlet and a liquid discharge port are arranged on both sides of each tank; the liquid inlet is directly connected to the corresponding solution storage tank, and a precision gear pump is used to accurately control the solution input amount, and the liquid is discharged through the liquid port arranged on the tank wall, and a liquid level sensor is arranged on the lower surface of the liquid outlet to prevent the liquid in the tank from overflowing, and the liquid discharge port is connected to the waste liquid collection box.

[0016] Furthermore, the negative pressure suction cup system is provided with 8 silicon wafer substrate placement grooves with a size of 10 mm×10 mm arranged in a line.

[0017] Furthermore, a negative pressure sensor is arranged in the negative pressure suction cup.

[0018] Furthermore, the mechanical clamping claw is composed of a rubber fixed half claw and a bearing base half claw. The bearing base half claw is provided with 6 20mm×30mm metal sheet base placement grooves arranged in a line, and is provided with a docking hollow groove. The opening and closing of the half claw is controlled by a small telescopic cylinder.

[0019] Furthermore, a temperature sensor is provided inside the heating plate.

[0020] Furthermore, the nitrogen purge device is connected to the high-pressure nitrogen bottle through a back plate, and has a built-in solenoid valve to control the switch of nitrogen.

[0021] Furthermore, an ultrasonic generator is provided in the cleaning tank of the three-tank ultrasonic cleaning machine, and high-frequency vibration is generated by the ultrasonic generator to perform ultrasonic oscillation cleaning on the substrate to remove stains and impurities on the surface of the substrate.

[0022] Furthermore, the present invention is also provided with a related electrical control system, which is mainly composed of a control integrated board, a motor drive board, a sensor acquisition module, etc. The various parts of the system are connected by wires, arranged and arranged by a wiring hub, and installed in the interlayer on the back of the box for controlling motors, solenoid valves, heating plates, etc.

[0023] Furthermore, a control panel is provided outside the cleaning box, and the control panel is used to set parameters such as cleaning, purging, drying, etc., and monitor the operating status of the equipment.

[0024] The working principle and operation process of the present invention are as follows:

[0025] 1. Place the metal substrate and silicon substrate into the mechanical clamping claw and negative pressure suction cup system respectively. Close the upper cover and set the parameters of cleaning, purging, drying, etc. through the control panel.

[0026] 2. The equipment is started, and the mechanical clamping claw and negative pressure suction cup system, driven by the vertical displacement mechanism and the horizontal displacement mechanism, send the substrate into the three-slot ultrasonic cleaning machine for cleaning in turn.

[0027] 3. After cleaning, the substrate is sent to a nitrogen purge device for purge and air drying.

[0028] 4. After the blowing and air drying is completed, the substrate is sent to the drying and heating device for heating and drying.

[0029] 5. After drying, the metal sheet substrate is sent to the metal sheet substrate storage drawer, and the silicon wafer substrate is taken out with tweezers by opening the upper cover.

[0030] Compared with the prior art, the present invention has the following beneficial effects: the micro-nano sensor substrate cleaning machine of the present invention is reasonably designed, easy to use, and highly practical. It can efficiently clean, dewater, and store the micro-nano sensor substrate at multiple levels, has a good cleaning effect, and can ensure that the substrate is completely dry to prevent secondary contamination. In addition, the cleaning machine is also equipped with a storage system, so that the cleaned substrate can be organized in order, which is convenient for subsequent use and management. The present invention realizes automatic cleaning and drying of the substrate, improves cleaning efficiency and cleanliness; the equipment of the present invention has a compact structure, is easy to operate, and reduces manual operation costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 A schematic diagram of a closed state structure of an embodiment of the present invention;

[0032] Figure 2 This is a schematic diagram of the internal structure of an embodiment of the present invention in an open state;

[0033] Figure 3 A schematic diagram of the internal structure of a cleaning box according to an embodiment of the present invention;

[0034] Figure 4 It is a schematic diagram of the overall displacement system structure of an embodiment of the present invention;

[0035] Figure 5 A schematic diagram of a horizontal displacement mechanism according to an embodiment of the present invention;

[0036] Figure 6 A schematic diagram of the structure of a mechanical clamping claw according to an embodiment of the present invention;

[0037] Figure 7 A schematic diagram of the structure of a negative pressure suction cup system according to an embodiment of the present invention;

[0038] Figure 8 A schematic diagram of the details of the load-bearing base half claw and the storage drawer structure according to an embodiment of the present invention;

[0039] Fig. 9A schematic diagram of a cleaning mechanism according to an embodiment of the present invention;

[0040] Fig.10 A schematic diagram of a nitrogen purge working condition according to an embodiment of the present invention;

[0041] Fig.11 This is a schematic diagram of the drying working condition of an embodiment of the present invention;

[0042] Fig.12 It is a schematic diagram of a substrate being fed into a storage drawer under storage conditions according to an embodiment of the present invention.

[0043] The marks in the figure are:

[0044] 1. Upper cover;

[0045] 2. Mechanical clamping claw; 2-1. Rubber fixed half claw; 2-2. Rubber fixed floppy disk; 2-3. Carrying base half claw; 2-4. Rubber sheet; 2-5. Small telescopic cylinder; 2-6. Metal sheet base rotating telescopic cylinder;

[0046] 3. Negative pressure suction cup system; 3-1. Silicon wafer substrate rotating and telescopic cylinder; 3-2. Air pipe; 3-3. Negative pressure suction cup; 3-4. Vacuum gear pump;

[0047] 4. Drying and heating device; 4-1. Spring buffer device; 4-2. Fixed plate; 4-3. Heating plate;

[0048] 5. Nitrogen purge device;

[0049] 6. Three-tank ultrasonic cleaning machine; 6-1. Liquid inlet; 6-2. Liquid outlet; 6-3. Liquid outlet;

[0050] 7. Horizontal displacement mechanism; 7-1. Flip motor; 7-2. Belt; 7-3. Horizontal displacement slider; 7-4. Horizontal displacement rod; 7-5. Horizontal displacement motor;

[0051] 8. Vertical displacement mechanism; 8-1. Aluminum profile; 8-2. Vertical displacement mechanism connector; 8-3. Vertical displacement slide plate; 8-4. Support slide rail; 8-5. Vertical displacement motor; 8-6. Screw rod;

[0052] 9. Sheet metal base storage drawer; 10. Front movable door; 11. Control panel; 12. Sheet metal base; 13. Silicon wafer base. DETAILED DESCRIPTION

[0053] It should be noted that the following detailed descriptions are exemplary and are intended to provide further explanation of the present application. Unless otherwise specified, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art to which the present application belongs.

[0054] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof. Existing conventional technical means may be used for the present invention that is not described in detail.

[0055] like Figures 1 to 12 As shown, a cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine includes a cleaning box, and vertical displacement mechanisms 8 are provided on the left and right sides of the cleaning box, and a horizontal displacement mechanism 7 is installed on the vertical displacement mechanism 8. The cleaning box also includes an upper cover plate 1, a front movable door 10, and a control panel 11; the upper cover plate 1 and the front movable door 10 are installed on the cleaning box through hinges; the control panel 11 is arranged outside the cleaning box for controlling and monitoring the operation of the cleaning machine.

[0056] In this embodiment, the vertical displacement mechanism 8 includes a screw rod 8-6, a vertical displacement motor 8-5, a support rail 8-4, and a vertical displacement slide 8-3; the screw rod 8-6, the vertical displacement motor 8-5, the support rail 8-4, and the vertical displacement slide 8-3 are connected to the aluminum profile 8-1 through the vertical displacement mechanism connector 8-2 and fixed in the cleaning box; the horizontal displacement mechanism 7 is hinged to the vertical displacement slide 8-3, and the hinge is equipped with a flip motor 7-1 for driving the horizontal displacement rod 7-4 to flip; the support rail 8-4 provides a sliding track for the vertical displacement slide 8-3, and the vertical displacement slide 8-3 slides on the support rail 8-4 to achieve vertical displacement. The vertical displacement motor 8-5 drives the screw rod 8-6 to rotate, thereby driving the vertical displacement slide 8-3 to move up and down; the screw rod 8-6 is connected to the vertical displacement slide 8-3 through a thread, converting the rotational motion of the motor into the linear motion of the slide.

[0057] In this embodiment, the horizontal displacement mechanism 7 includes a horizontal displacement slider 7-3 slidingly connected to the horizontal displacement rod 7-4 and a horizontal displacement motor 7-5 installed at the end of the horizontal displacement rod. The horizontal displacement motor 7-5 drives the horizontal displacement slider through a belt 7-2, and the horizontal displacement slider is rollingly connected to the two side walls of the horizontal displacement rod.

[0058] The horizontal displacement mechanism 7 comprises a flipping motor 7-1, a belt 7-2, a horizontal displacement slider 7-3, a horizontal displacement rod 7-4, and a horizontal displacement motor 7-5; the horizontal displacement rod 7-4 is placed horizontally for carrying and moving the cleaning object; the horizontal displacement slider 7-3 is rollingly connected to the two side walls of the horizontal displacement rod 7-4, and the horizontal displacement motor 7-5 drives the horizontal displacement slider 7-3 to slide on the horizontal displacement rod 7-4 through the belt 7-2; the horizontal displacement motor 7-5 is installed at the end of the horizontal displacement rod 7-4, and the belt 7-2 transmits the power of the horizontal displacement motor 7-5 to the horizontal displacement slider 7-3; the horizontal displacement motor 7-5 drives the belt 7-2 to rotate, thereby driving the horizontal displacement slider 7-3 to move on the horizontal displacement rod 7-4; the flipping motor 7-1 is installed at the hinged part of the horizontal displacement mechanism and the vertical displacement slide 8-3, and is used to drive the horizontal displacement rod 7-4 and the cleaning object thereon to flip.

[0059] In this embodiment, a metal sheet substrate rotating telescopic cylinder 2-6 is installed on the horizontal displacement mechanism 7, and the metal sheet substrate rotating telescopic cylinder 2-6 is connected to a small telescopic cylinder 2-5. A mechanical clamping claw 2 is provided at the end of the small telescopic cylinder 2-5, and the mechanical clamping claw 2 is used to grab and place the metal sheet substrate 12; the metal sheet substrate rotating telescopic cylinder 2-6 and the small telescopic cylinder 2-5 control the rotation and opening and closing of the mechanical clamping claw 2; a vacuum gear pump 3-4 is installed in the middle of the silicon wafer substrate rotating telescopic cylinder 3-1, and the vacuum gear pump 3-4 is connected to the negative pressure suction cup 3-3 through an air pipe 3-2, and the silicon wafer substrate rotating telescopic cylinder 3-1 is connected to the vacuum gear pump 3-4 to control the lifting and rotation of the negative pressure suction cup system 3; the negative pressure suction cup system 3 is provided with 8 10mm×10mm silicon wafer substrate 13 placement grooves arranged in a line, and a negative pressure suction cup 3-3 is arranged in each placement groove. The negative pressure suction cup 3 - 3 is used to absorb the silicon wafer substrate 13 ; the vacuum gear pump 3 - 4 provides negative pressure to the negative pressure suction cup system 3 through the air pipe 3 - 2 .

[0060] In this embodiment, the mechanical clamping claw 2 is composed of a rubber fixed half claw 2-1, a bearing base half claw 2-3, and a pressure sensor control. The bearing base half claw 2-3 is provided with 6 20mm×30mm metal sheet base 12 placement grooves arranged in a line, and is provided with a docking hollow groove. The rubber fixed half claw is provided with a rubber fixed floppy disk 2-2. The rubber fixed half claw 2-1 and the bearing base half claw 2-3 are controlled by a small telescopic cylinder 2-2 to open and close the half claws. The pressure sensor inside the mechanical clamping claw 2 senses the number of bases and feedbacks to regulate the fixing force.

[0061] In this embodiment, a sheet metal base storage drawer 9 cooperating with the mechanical clamping claws 2 is provided on the upper portion of the rear wall of the cleaning box, and the sheet metal base storage drawer 9 can be pulled forward.

[0062] In this embodiment, a drying and heating device 4 is provided in the upper middle part of the rear wall of the cleaning box. The drying and heating device 4 includes a fixed plate 4-2, a heating plate 4-3 and a temperature sensor. The fixed plate 4-2 is connected to the rear wall of the cleaning box by bolts. The heating plate 4-3 is provided with a resistance wire heating inside. Four spring buffer devices 4-1 are provided between the heating plate 4-3 and the fixed plate 4-2.

[0063] In this embodiment, a nitrogen purge device 5 is provided in the middle of the rear wall of the cleaning box; the nitrogen purge device 5 is connected to the high-pressure nitrogen bottle through a back plate, and the nitrogen purge device 5 is built with a solenoid valve to control the switch of nitrogen.

[0064] In this embodiment, a three-slot ultrasonic cleaning machine 6 is provided at the bottom of the cleaning box, and an ultrasonic generator is provided in the internal space below the cleaning slot of the three-slot ultrasonic cleaning machine 6. The three-slot ultrasonic cleaning machine 6 includes three independent cleaning slots, which are an acetone cleaning slot, an ethanol cleaning slot, and a deionized water cleaning slot, respectively. A liquid inlet 6-1 and a liquid discharge port 6-2 are arranged on both sides of each slot. The liquid inlet 6-1 is directly connected to the corresponding solution storage tank, and a precision gear pump is used to accurately control the solution input amount, and the liquid discharge port 6-2 is connected to the waste liquid collection box.

[0065] In this embodiment, it also includes a related electrical control system, which adopts conventional technical means in the field and is mainly composed of a control integrated board, a motor drive board, a sensor acquisition module, etc. The various parts of the system are connected by wires, arranged and arranged by a wiring board, and installed in the interlayer on the back of the cleaning box for controlling the motor, solenoid valve, heating plate, etc.

[0066] In this embodiment, commonly used temperature sensors, pressure sensors and other sensors may also be provided, but whether or not the sensors are provided does not affect the entire process of the cleaning machine of the present invention and the realization of the overall functions. Adding sensors to achieve a closed-loop control effect can improve accuracy and efficiency.

[0067] The micro-nano sensor substrate cleaning machine is carried out according to the following steps:

[0068] Step 1: Close the front movable door 10 of the cleaning machine and lock it to prevent it from opening during the operation of the machine. At this time, the vertical displacement mechanism 8 rises to the top, the horizontal displacement rod is in an upward posture, the horizontal displacement slider 7-3 is in the initial position in the middle of the horizontal displacement rod 7-4, the two rotating telescopic cylinders (metal sheet base rotating telescopic cylinder 2-6 and silicon wafer base rotating telescopic cylinder 3-1) are retracted to the shortest state, the mechanical clamping claw 2 remains horizontal and in a slightly open state, the negative pressure suction cup system 3 remains horizontal, and the negative pressure suction cup 3-3 in the groove is in an upward posture;

[0069] Step 2: Open the upper cover 1, place the metal sheet substrate 12 of 20mm×30mm size into the groove of the rubber fixed half claw 2-1 of the mechanical clamping claw, and place the silicon wafer substrate 13 of 10mm×10mm size into the negative pressure suction cup groove of the negative pressure suction cup system 3;

[0070] Step 3: close the upper cover 1, set the cleaning time, nitrogen purge intensity, and temperature parameters of the heating and drying system for each slot of the substrate in the three-slot ultrasonic cleaning machine 6 on the control panel 11, and select the position of the metal sheet substrate storage drawer 9 for the metal sheet substrate to be stored;

[0071] Step 4: Open the solenoid valve of the liquid inlet of the three-tank ultrasonic cleaning machine 6, and add appropriate volumes of acetone, ethanol, and deionized water into the acetone cleaning tank, ethanol cleaning tank, and deionized water cleaning tank of the three-tank ultrasonic cleaning machine 6 respectively.

[0072] Step 5: Cleaning starts, the small telescopic cylinder 2-5 telescopically drives the rubber fixed half claw 2-1 and the bearing substrate half claw 2-3 to clamp the metal sheet substrate 12; the vacuum gear pump 3-4 starts to operate, sucks the silicon wafer substrate 13, the horizontal displacement slider 7-3 moves to the front position of the box, the horizontal displacement rod flips to a horizontal state, and the vertical displacement mechanism 8 descends to a suitable position at the bottom, so that the mechanical clamping claw 2 and the substrate in the negative pressure suction cup 3-3 are completely immersed in acetone;

[0073] Step 6: The ultrasonic generator in the three-tank ultrasonic cleaning machine 6 works to perform ultrasonic oscillation cleaning on the substrate immersed in acetone for a period of time; after the acetone cleaning time is over, the vertical displacement mechanism 8 is lifted, the mechanical clamping claw 2 and the negative pressure suction cup system 3 are lifted upward out of the acetone cleaning tank, and the horizontal displacement slider 7-3 is driven by the horizontal displacement motor 7-5 to move to the rear side of the box to the top of the ethanol cleaning tank, and the vertical displacement mechanism 8 is lowered to immerse the substrate in ethanol, and the substrate immersed in ethanol is ultrasonically cleaned for a period of time. Wash; after the ethanol cleaning time is over, the vertical displacement mechanism 8 is lifted, the mechanical clamping claw 2 and the negative pressure suction cup system 3 are lifted upward out of the ethanol cleaning tank, and the horizontal displacement slider 7-3, driven by the horizontal displacement motor 7-5, continues to move to the rear side of the box to the top of the deionized water cleaning tank, and the vertical displacement mechanism 8 descends to immerse the substrate in the deionized water, and the substrate immersed in the deionized water is ultrasonically cleaned for a period of time; after the deionized water cleaning time is over, the drain port 6-2 of the three-trough ultrasonic cleaning machine 6 is opened to discharge the dirty liquid;

[0074] Step 7: After cleaning is completed, the flip motor 7-1 of the horizontal displacement mechanism 7 is started, so that the horizontal displacement rod is flipped upward to a vertical state, and the vertical displacement mechanism 8 is lifted so that the height position of the substrate is close to the air outlet of the nitrogen purge device 5;

[0075] Step 8: Start nitrogen purge and air drying. The horizontal displacement slider 7-3, the small telescopic cylinder 2-5 on the mechanical clamping claw 2, and the silicon wafer substrate rotating telescopic cylinder 3-1 of the negative pressure suction cup system 3 are continuously extended and retracted to adjust the position so that each substrate can be evenly purged with nitrogen to remove adhered particles and dry the substrate.

[0076] Step 9: After nitrogen purge and air drying are completed, the telescopic rods of the small telescopic cylinder 2-5 and the silicon wafer substrate rotating telescopic cylinder 3-1 are retracted to the shortest, and the horizontal displacement slider 7-3 moves to the front side of the box under the drive of the horizontal displacement motor 7-5, bypassing the nitrogen purge device 5;

[0077] Step 10: After the drying program is started, the heating plate 4-3 of the drying and heating device 4 is immediately started and heated to the preset temperature value. The vertical displacement mechanism 8 is started and slowly rises until its height exceeds the nitrogen purge device 5. The horizontal displacement slider 7-3 slides to the back side of the box, and the telescopic rods of the metal sheet base rotating telescopic cylinder 2-6 on the mechanical clamping claw 2 and the silicon wafer base rotating telescopic cylinder 3-1 of the negative pressure suction cup system 3 are extended to ensure that all substrates are fully covered in the effective heating area of ​​the heating plate 4-3. The vertical displacement mechanism 8 is lifted again, and the distance is controlled by the motor parameters until the surface of the substrate is kept very close to the lower surface of the drying and heating device 4 to ensure an efficient drying effect;

[0078] Step 11: After the drying function is completed, the telescopic rods of the metal sheet substrate rotating telescopic cylinder 2-6 and the silicon wafer substrate rotating telescopic cylinder 3-1 are retracted to the shortest, and the horizontal displacement slider 7-3 moves to the front side of the box under the drive of the horizontal displacement motor 7-5, bypassing the heating plate 4-3;

[0079] Step 12: Start the metal sheet substrate storage, the vertical displacement mechanism 8 is lifted until the bearing substrate half claw 2-3 is slightly higher than the docking surface of the metal sheet substrate storage drawer 9, then the horizontal displacement slider 7-3 moves toward the rear side of the box, and the telescopic rod of the small telescopic cylinder 2-5 is extended to a suitable position, that is, the bearing substrate half claw 2-3 and the metal sheet substrate storage drawer 9 dock with the hollow groove to match, then the mechanical clamping claw 2 is slightly opened, the vertical displacement mechanism 8 is lowered, and the metal sheet substrate 12 is stored in the metal sheet substrate storage drawer 9;

[0080] Step 13: The horizontal displacement mechanism 7, the vertical displacement mechanism 8, the mechanical clamping claw 2 and the telescopic arm of the negative pressure suction cup system 3 return to the initial position, and the metal sheet substrate is stored. After the negative pressure suction cup system 3 is returned to its original position, the vacuum gear pump 3-4 is turned off, and the cleaned metal sheet substrate 12 can be taken out from the metal sheet substrate storage drawer 9 on the front side of the cleaning box for normal use or temporarily stored in the metal sheet substrate storage drawer 9. The cleaned silicon wafer substrate 13 can be opened on the upper cover plate 1 and clamped in the groove of the negative pressure suction cup system 3 with tweezers, and all cleaning processes are completed.

[0081] The electrical components of the present invention belong to the existing mature and complicated technology, and do not involve the innovative part of the present invention. Therefore, some lower-level control mainboards (integrated logic control chips, micro-electrical components, etc.) and motor drive boards (installed in the back plate interlayer of the cleaning box) are added to the control panel part, but only for the integrity of the machine. The present invention is placed in a clean room when used, does not involve seals, and does not involve electrical components in the liquid contact part, and corresponding anti-rust materials can be selected.

[0082] The micro-nano sensor substrate cleaning system of the present invention realizes an automated and efficient operation process, covering three ultrasonic cleanings with different solutions, two efficient water removals and an integrated process of final storage. The entire cleaning process of the present invention is rigid and controllable. The system adopts a three-layer ultrasonic cleaning technology to deeply remove pollutants such as debris and photoresist residues on the substrate, ensuring that the substrate surface reaches a highly smooth state. Subsequently, through the nitrogen purge technology, not only the residual moisture is effectively removed, but also the tiny particle attachments are blown away and removed, further ensuring the cleanliness of the substrate. The subsequent drying step ensures that the substrate is thoroughly dried, laying a solid foundation for the subsequent spin coating of photoresist or coating process, and significantly improving the quality of the finished product. In addition, the cleaning system also integrates an automatic storage function after cleaning is completed, optimizes the operating process, and improves work efficiency and convenience. Compared with traditional cleaning methods, the present invention has achieved significant improvements in cleaning efficiency, cleaning effect and ease of operation.

[0083] Unless otherwise stated, any technical solution disclosed in the present invention disclosed above, if it discloses a numerical range, then the disclosed numerical range is a preferred numerical range, and any technician in the field should understand that the preferred numerical range is only a numerical value with a more obvious technical effect or representative value among many implementable numerical values. Since there are too many numerical values ​​to be exhaustive, the present invention discloses some numerical values ​​to illustrate the technical solution of the present invention, and the numerical values ​​listed above should not constitute a limitation on the scope of protection of the present invention.

[0084] If the present invention discloses or involves components or structures that are fixedly connected to each other, then, unless otherwise stated, the fixed connection can be understood as: a detachable fixed connection (for example, connection using bolts or screws), and can also be understood as: a non-detachable fixed connection (for example, riveting, welding). Of course, the mutual fixed connection can also be replaced by an integrated structure (for example, manufactured by integrated molding using a casting process) (except when it is obviously impossible to use an integrated molding process).

[0085] In addition, unless otherwise stated, the terms used to indicate positional relationships or shapes in any of the technical solutions disclosed in the present invention include states or shapes that are approximate, similar, or close to them.

[0086] Any component provided by the present invention may be assembled from a plurality of separate components, or may be a separate component manufactured by an integral forming process.

[0087] The above is only a preferred embodiment of the present invention, and does not limit the present invention in other forms. Any technician familiar with the profession may use the above disclosed technical content to change or modify it into an equivalent embodiment with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiment according to the technical essence of the present invention without departing from the technical solution of the present invention still belongs to the protection scope of the technical solution of the present invention.

Claims

1. Cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine, Features It is equipped with a cleaning box, a vertical displacement mechanism, a horizontal displacement mechanism, a mechanical clamping claw, a negative pressure suction cup system, a metal sheet base storage drawer, a nitrogen purge device, a drying and heating device, and a three-tank ultrasonic cleaning machine; The cleaning box is the main part of the equipment, and multiple functional areas are arranged in the cleaning box for cleaning, drying and storing the substrate; The vertical displacement mechanism is arranged on the left and right sides of the cleaning box, and the vertical displacement mechanism includes a screw rod, a vertical displacement motor, a supporting slide rail, and a vertical displacement slide plate; the vertical displacement motor drives the screw rod to rotate, thereby driving the vertical displacement slide plate to move up and down on the supporting slide rail; The horizontal displacement mechanism is installed on the vertical displacement mechanism; the horizontal displacement mechanism includes a horizontal displacement rod, a horizontal displacement slider and a horizontal displacement motor; the horizontal displacement slider is rollingly connected to the two side walls of the horizontal displacement rod; the horizontal displacement motor drives the horizontal displacement slider to slide on the horizontal displacement rod through a belt to realize horizontal movement of the base; The horizontal displacement mechanism is hinged to the vertical displacement slide plate, and a flip motor is installed at the hinge part to drive the horizontal displacement rod to flip; The horizontal displacement slider is provided with a rotating telescopic cylinder, the rotating telescopic cylinder for the metal sheet base on the left side of the box is connected to a small telescopic cylinder, a mechanical clamping claw is provided at the end of the small telescopic cylinder, and the mechanical clamping claw is used to clamp the metal sheet base; a vacuum gear pump is installed in the middle of the rotating telescopic cylinder for the silicon wafer base on the right side of the box, and a negative pressure suction cup system is provided at the end, and the negative pressure suction cup system is used to adsorb the silicon wafer base; the negative pressure suction cup system is provided with a plurality of silicon wafer base placement slots arranged in a line, and a negative pressure suction cup is provided in each placement slot, and the mechanical clamping claw and the negative pressure suction cup system can realize the precise movement and positioning of the base under the drive of the vertical displacement mechanism and the horizontal displacement mechanism; The upper part of the rear wall of the cleaning box is provided with a metal sheet base storage drawer cooperating with a mechanical clamping claw, and the metal sheet base storage drawer is used to store the metal sheet base after cleaning and drying for subsequent use or storage; the metal sheet base storage drawer can be pulled forward; The nitrogen purge device is arranged in the middle of the rear wall of the cleaning box; the nitrogen purge device is used to purge and air-dry the cleaned substrate with nitrogen to remove residual moisture and tiny particles on the surface of the substrate; The drying and heating device is arranged below the rear wall of the cleaning box, and is used to heat and dry the substrate after purging and air drying to ensure that the surface of the substrate is completely dry; the drying and heating device comprises a fixed plate and a heating plate, and the fixed plate is connected to the rear wall of the cleaning box by bolts, and a resistance wire is arranged inside the heating plate for heating, and four spring buffer devices are arranged between the heating plate and the fixed plate; the heating plate is connected to the fixed plate by the spring buffer device to ensure stability during the heating process; The three-tank ultrasonic cleaning machine is arranged at the bottom of the cleaning box, and includes three independent cleaning tanks, which are an acetone cleaning tank, an ethanol cleaning tank and a deionized water cleaning tank in sequence; the three-tank ultrasonic cleaning machine is used to perform ultrasonic oscillation cleaning of the substrate with acetone, ethanol and deionized water to remove stains and impurities on the surface of the substrate; a liquid inlet and a liquid discharge port are arranged on both sides of each tank; the liquid inlet is directly connected to the corresponding solution storage tank, and a precision gear pump is used to accurately control the solution input amount, and the liquid is discharged through the liquid port arranged on the tank wall, and a liquid level sensor is arranged on the lower surface of the liquid outlet to prevent the liquid in the tank from overflowing, and the liquid discharge port is connected to the waste liquid collection box.

2. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features The negative pressure suction cup system is provided with 8 silicon wafer substrate placement grooves with a size of 10mm×10mm arranged in a line.

3. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features A negative pressure sensor is arranged in the negative pressure suction cup.

4. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features The mechanical clamping claw consists of a rubber fixed half claw and a bearing base half claw. The bearing base half claw is provided with 6 20mm×30mm metal sheet base placement grooves arranged in a line, and is provided with a docking hollow groove. The opening and closing of the half claw is controlled by a small telescopic cylinder.

5. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features A temperature sensor is arranged inside the heating plate.

6. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features The nitrogen purge device is connected to the high-pressure nitrogen bottle through a back plate, and is equipped with a built-in solenoid valve to control the switch of nitrogen.

7. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features An ultrasonic generator is arranged in the cleaning tank of the three-tank ultrasonic cleaning machine, and high-frequency vibration is generated by the ultrasonic generator to perform ultrasonic oscillation cleaning on the substrate to remove stains and impurities on the surface of the substrate.

8. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features It is also equipped with an electrical control system, which consists of a control integrated board, a motor drive board, and a sensor acquisition module. The various parts of the electrical control system are connected by wires, arranged and arranged by a wiring board, and installed in the interlayer on the back of the cleaning box for controlling the motor, solenoid valve, and heating plate.

9. The cleaning, drying and storage integrated micro-nano sensor substrate cleaning machine as claimed in claim 1, Features A control panel is provided outside the cleaning box, and the control panel is used to set cleaning, purging and drying parameters and monitor the operating status of the equipment.

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