Acidic copper plating additive

Abstract

The invention discloses an acidic copper plating additive which is characterized by comprising the following components: 28-32 g / L of copper sulfate, 22-28 g / L of sulfuric acid, 10-14 g / L of red dye, 78-82 g / L of blue dye, 4-6 g / L of acid copper yellow powder and the balance of deionized water. The formula is simple, the processing and manufacturing cost can be reduced, the current density range of the plating solution can be increased during use, the filling and leveling degree of a plating layer is good, the internal stress of the plating layer is high, the electroplating quality can be improved, and the practicability is high.

Description

Technical Field

[0001] The invention belongs to the technical field of copper plating, and in particular relates to an acid copper plating additive. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on certain metal surfaces using the principle of electrolysis. It is a process that uses electrolysis to adhere a layer of metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhancing aesthetics.

[0003] Organic additives are usually used in copper electroplating to achieve uniform conductive patterns and obtain excellent coatings. Currently, the copper electroplating additives used in printed circuit board production mainly contain three most important components: accelerators, inhibitors and levelers. Accelerators can accelerate copper deposition, while inhibitors and levelers mainly function to increase copper deposition overpotential, refine grains and improve the throwing power of the plating solution. Through the synergistic effect of the three additives, a uniform and bright coating can be obtained.

[0004] However, conventional additives are not only expensive, but also have limited coating flatness and low internal stress in the coating, which will affect the quality of copper plating to a certain extent, so their applicability and practicality are limited. Summary of the invention

[0005] The purpose of the invention is to provide an acid copper plating additive which is beneficial to improving the copper plating quality.

[0006] The technical solution for achieving the purpose of the present invention is an acid copper plating additive, which comprises the following components: 28-32 g / L of copper sulfate, 22-28 g / L of sulfuric acid, 10-14 g / L of red dye, 78-82 g / L of blue dye, 4-6 g / L of acid copper yellow powder, and the rest is deionized water.

[0007] More preferably, the copper sulfate is 30 g / L.

[0008] More preferably, the sulfuric acid is 25 g / L.

[0009] More preferably, the red dye is 12 g / L.

[0010] More preferably, the blue dye is 80 g / L.

[0011] More preferably, the acid copper yellow powder is 5 g / L.

[0012] The invention has positive effects: the formula of the invention is simple, which is beneficial to reducing the processing and manufacturing cost, and is beneficial to improving the current density range of the plating solution when used, and the plating layer has good flatness and strong internal stress of the plating layer, which is beneficial to improving the quality of electroplating and has strong practicality. DETAILED DESCRIPTION

[0013] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0014] Example

[0015] An acid copper plating additive comprises the following components: 28-32 g / L of copper sulfate, 22-28 g / L of sulfuric acid, 10-14 g / L of red dye, 78-82 g / L of blue dye, 4-6 g / L of acid copper yellow powder, and the rest is deionized water.

[0016] In this embodiment, the copper sulfate is 30 g / L, the sulfuric acid is 25 g / L, the red dye is 12 g / L, the blue dye is 80 g / L, and the acid copper yellow powder is 5 g / L.

[0017] The invention has positive effects: the formula of the invention is simple, which is beneficial to reducing the processing and manufacturing cost, and is beneficial to improving the current density range of the plating solution when used, and the plating layer has good flatness and strong internal stress of the plating layer, which is beneficial to improving the quality of electroplating and has strong practicality.

[0018] Obviously, the above embodiments of the present invention are merely examples for clearly explaining the present invention, and are not intended to limit the implementation methods of the present invention. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. However, these obvious changes or modifications derived from the essential spirit of the present invention still fall within the protection scope of the present invention.

Claims

1. An acid copper plating additive, characterized in that: The composition includes: copper sulfate 28-32g / L, sulfuric acid 22-28g / L, red dye 10-14g / L, blue dye 78-82g / L, acid copper yellow powder 4-6g / L, and the rest is deionized water.

2. The acid copper plating additive according to claim 1, characterized in that: The copper sulfate is 30g / L.

3. The acid copper plating additive according to claim 2, characterized in that: The sulfuric acid is 25g / L.

4. The acid copper plating additive according to claim 3, characterized in that: The red dye is 12g / L.

5. The acid copper plating additive according to claim 4, characterized in that: The blue dye is 80g / L.

6. The acid copper plating additive according to claim 5, characterized in that: The acid copper yellow powder is 5g / L.