Metal microstructure collection method

Abstract

According to the metal microstructure collection method disclosed by the invention, the photo-curing material is used as a microstructure collection carrier, and collection of the metal microstructure is realized by curing the photo-curing material. According to the metal microscopic structure collection method, due to the fact that the photocuring technology can ensure that the photocuring material keeps the original form and characteristics in the curing process, the microscopic structure of the metal material can be reflected more truly, the collection quality is good, the collection efficiency is high, the requirement for the operation level of field operators is low, and the good practical value is achieved.

Description

Technical Field

[0001] The invention belongs to the technical field of microstructure collection, and in particular relates to a metal microstructure collection method. Background Art

[0002] Metal microstructure collection technology is a method of copying metal microstructures by bonding prefabricated collection materials to pretreated metal surfaces. At present, the collection materials used in mature metal microstructure collection technology are mainly AC paper (cellulose acetate film). The above method is to first drop a solvent on the surface to be collected that has been etched with a relief surface, and then stick the AC paper on the surface to be collected. After the solvent softens the AC paper on the side in contact with the surface to be collected, the air between the surface to be collected and the AC paper is completely expelled by the fluidity of the softened AC paper under the action of appropriate external force, and the relief surface morphology is copied. As the AC paper is completely solidified, the microstructure collection is completed. At present, the most widely used collection material is mainly AC paper (cellulose acetate film). AC paper has at least the following problems during use:

[0003] 1) The preparation cycle of AC paper is relatively long, generally taking more than a week, and the preparation process is complicated, and improper operation can easily lead to production failure;

[0004] 2) During the collection process, the AC paper needs to be quickly attached to the workpiece surface with tweezers, with a short time interval. Since the solvent is acetone, which is very volatile, a slow action or too little application will result in collection failure. At the same time, if the AC paper is not tightly attached to the surface to be collected, a microstructure illusion will appear. In addition, too much acetone can easily damage very thin AC paper.

[0005] 3) Pressing the AC paper lightly with your fingers requires a lot of finger strength. Excessive force will damage the AC paper, resulting in missing or missing microstructure information, which will lead to acquisition failure. Excessive force will cause the AC paper to not fit tightly to the surface to be collected, resulting in acquisition failure. Therefore, the acquisition technology using AC paper has high technical requirements for operators;

[0006] 4) If the AC paper is carried in a humid, dusty environment, or is squeezed or folded, the use of the AC paper will be affected. Summary of the invention

[0007] The purpose of the present invention is to provide a metal microstructure collection method, which solves the problems of long collection material preparation cycle and excessive reliance on operator experience in the existing microstructure collection method.

[0008] The technical solution adopted by the present invention is a metal microstructure collection method, which adopts a light-curing material as a microstructure collection carrier.

[0009] The method specifically comprises the following steps:

[0010] Pre-treat the area to be collected on the metal part to make the microstructure of the area to be collected visible;

[0011] Applying a photocurable material on the surface of the pre-treated metal part in the area to be collected, irradiating the photocurable material with a photocurable light source device to cure the photocurable material to form a cured layer with a target thickness;

[0012] The solidified layer with the target thickness is separated from the metal part and the microstructure is collected.

[0013] Applying a photocurable material to the area to be collected of the pre-treated metal part, irradiating the photocurable material with a photocurable light source device, and curing the photocurable material to form a cured layer with a target thickness, including:

[0014] S1: Applying a first layer of light-curing material on the surface of the pre-treated metal part in the area to be collected;

[0015] S2: using a light curing light source device to irradiate the first layer of light curing material to cure the first layer of light curing material to form a first sub-cured layer;

[0016] S3: coating a second layer of photocurable material on the first sub-curable layer, and irradiating the second layer of photocurable material with a photocurable light source device to cure the second layer of photocurable material to form a second sub-curable layer;

[0017] S4: repeating the above steps S2 to S3 until the total thickness of all sub-cured layers reaches the target thickness; wherein the thickness of the sub-cured layers is less than the target thickness.

[0018] The target thickness is 0.2mm-1.5mm.

[0019] The light curing light source device is a single light source device with a single wavelength range.

[0020] The light curing light source device is a composite light source device, which can emit light beams with different wavelength ranges.

[0021] Light beams with different wavelength ranges emitted by a composite light source device are used to irradiate different positions of the area to be collected on the metal part.

[0022] The light curing material is sequentially or alternately irradiated with light beams having different wavelength ranges emitted by the composite light source device.

[0023] Photocurable materials include contrast-enhancing color materials.

[0024] The light-curable material is a liquid light-curable material.

[0025] The light curing light source device comprises a light source and a light limiting device. The light limiting device is arranged in the path of the light beam emitted by the light source and is used for focusing and limiting the light beam.

[0026] The light curing light source device comprises a light source and a light homogenizing device, wherein the light homogenizing device is arranged between the light source and the metal component and is used for making the light beam emitted by the light source uniform.

[0027] Pretreatment includes etching treatment.

[0028] The beneficial effects of the present invention are:

[0029] The metal microstructure collection method provided by the present invention uses a light-curing material to replace the existing AC paper (cellulose acetate film) as a metal microstructure collection carrier, and collects the metal microstructure by curing the light-curing material. Since the light-curing technology can ensure that the light-curing material maintains its original form and characteristics during the curing process, it can more realistically reflect the microstructure of the metal material, has good collection quality and high collection efficiency, and has low requirements on the operation level of on-site operators, and has good practical value. DETAILED DESCRIPTION

[0030] The present invention is described in detail below in conjunction with specific implementation modes.

[0031] The metal microstructure collection method provided by the present invention, in particular the on-site metal microstructure collection method, uses a light-curing material as a metal microstructure collection carrier. Since the light-curing material is easy to obtain and inexpensive, the use of the light-curing material for metal microstructure collection has low requirements on the operation level of the on-site operator, high on-site microstructure collection efficiency, and good collection effect. Therefore, the method has good practical value and can be widely promoted and used in the industry.

[0032] When light-curing material is used as a metal microstructure collection carrier for metal microstructure collection, a light-curing material coating tool and a light-curing light source device are required.

[0033] The coating tool is used to coat the photocurable material on the surface to be collected of the metal part with the embossed surface etched. The coating tool can be any tool such as a brush, roller, scraper, spray gun, etc. that can evenly coat the photocurable material on the surface to be collected of the metal part, and this application does not limit this.

[0034] The light-curing light source device is used to light-cure the light-curing material coated on the surface to be collected of the metal component. The light-curing light source device can be a light-curing light source device capable of emitting ultraviolet light, or a light-curing light source device capable of emitting infrared light, or other light-curing light source devices capable of curing light-curing materials, which is not limited in this application.

[0035] The metal microstructure collection method provided by the present invention comprises the following steps:

[0036] 1) Pre-treat the area to be collected on the metal part to make the microstructure of the area to be collected visible.

[0037] The pretreatment may include grinding, polishing, etching and other pretreatment steps on the area of ​​the metal part to be collected.

[0038] For example, a grinding machine may be used to clean the oxide scale, rust and decarburized layer of the metal part to be collected, and then sandpaper of different coarseness may be used to grind the cleaned metal part to be collected until the scratches and deformation layer of the metal part to be collected are completely removed; polishing pastes of different particle sizes or chemical polishing may be used to polish the polished metal part to be collected; finally, an etchant may be used to erode the polished metal part to be collected so that the microstructure of the metal part to be collected is revealed, that is, a microstructure having a relief surface is etched in the metal part to be collected.

[0039] 2) Applying a photocurable material to the surface of the pre-treated metal component in the area to be collected, and irradiating the photocurable material with a photocurable light source device to cure the photocurable material to form a cured layer with a target thickness.

[0040] After completing the pretreatment of the area to be collected on the metal part, use a coating tool to coat the photocurable material on the surface of the area to be collected on the metal part. After coating, use a photocuring light source device to irradiate the photocurable material coated on the surface of the area to be collected on the metal part to cure it and form a cured layer with a target thickness.

[0041] The coating of the photocurable material can be completed at one time, and the photocurable material coated on the surface of the area to be collected of the metal component is irradiated with a photocurable light source device to cure it and form a cured layer with a target thickness.

[0042] A solidified layer with a target thickness can be formed by coating and solidifying layer by layer. For example, this can be achieved by the following steps:

[0043] S1: Applying a first layer of light-curing material on the surface of the pre-treated metal part in the area to be collected;

[0044] S2: using a light curing light source device to irradiate the first layer of light curing material to cure the first layer of light curing material to form a first sub-cured layer;

[0045] S3: coating a second layer of photocurable material on the first sub-curable layer, and irradiating the second layer of photocurable material with a photocurable light source device to cure the second layer of photocurable material to form a second sub-curable layer;

[0046] S4: repeating the above steps S2 to S3 until the total thickness of all sub-cured layers reaches the target thickness; wherein the thickness of the sub-cured layers is less than the target thickness.

[0047] The method of forming a solidified layer with a target thickness by layer-by-layer coating and layer-by-layer curing helps the photocurable material to more fully fill the relief surface of the metal part to be collected in the process of metal microstructure collection, thereby more realistically collecting the microstructure image of the metal material; it helps to eliminate bubbles in the photocurable material and reduce other defects, making the collected microstructure image clearer and more accurate.

[0048] 3) Separate the solidified layer with target thickness from the metal component and complete the microstructure collection.

[0049] After the photocurable material is fully cured to form a cured layer with a target thickness, tweezers, blades and other tools can be used to separate the formed cured layer with the target thickness from the metal part to complete the collection of the microstructure of the metal part by the photocurable material. Afterwards, the cured layer with the target thickness can be placed under a microscope for microstructural observation.

[0050] The metal microstructure collection method provided by the present invention adopts a photocurable material to replace the existing AC paper (cellulose acetate film) as a metal microstructure collection carrier, and collects the metal microstructure by curing the photocurable material. Since the photocuring technology can ensure that the photocurable material maintains its original shape and characteristics during the curing process, it can more realistically reflect the microstructure of the metal material, has good collection quality and high collection efficiency, and has low requirements on the operation level of on-site operators, and has good practical value.

[0051] For metal microstructure collection, the coating thickness of the photocurable material is crucial. If the coating thickness is too thin, the solidified layer formed by the cured photocurable material is easily damaged during separation and easily deformed, resulting in failure of microstructure collection or the collected microstructure is elongated and deformed, resulting in distortion of the collected microstructure. If the coating thickness is too thick, on the one hand, the solidified layer formed by the cured photocurable material has poor flatness. When the solidified layer is placed under a microscope to observe the microstructure, part of the microstructure in the field of view cannot be focused. On the other hand, the photocurable material is wasted and the curing time is long, which increases the cost of microstructure collection and affects the collection efficiency.

[0052] To this end, the inventors of the present application have conducted a large number of experimental studies and surprisingly found that when the thickness of the solidified layer is 0.2 mm-1.0 mm, the appearance of the solidified layer after separation is intact and has no deformation, and the microstructure collected thereon under a microscope is also intact and has no deformation. Therefore, the thickness of the solidified layer is preferably 0.2 mm-1.0 mm.

[0053] In order to improve the contrast of the metal microstructure, contrast coloring materials can be added to the photocurable material of the present invention; at the same time, in order to obtain different microstructure information, pigments of specific colors can be added to the photocurable material, preferably, the pigments are organic pigments.

[0054] The metal microstructure collection method provided by the present invention needs to be implemented with the aid of a light-curing light source device. Generally, the properties of the light beam emitted by the light-curing light source device should be compatible with the applied light-curing material. For example, if the applied light-curing material is an ultraviolet light-curing material, the light beam emitted by the light-curing light source device should be an ultraviolet light beam; if the applied light-curing material is a blue light-curing material, the light beam emitted by the light-curing light source device should be a blue light source.

[0055] The light curing light source device can be a single light source device with a single wavelength range, that is, the light curing light source device can only emit a light beam in a specific wavelength range, and the light beam in the specific wavelength range is used to cure the light curing material; the light curing light source device can also be a composite light source device, that is, the light curing light source device can emit light beams in at least two different wavelength ranges, for example, it can emit a light beam in a first wavelength range and a light beam in a second wavelength range, and the first wavelength range is different from the second wavelength range. The use of a composite light source device here can expand the selection range of light curing materials and improve the flexibility of on-site metal microstructure collection.

[0056] In the case where the light curing light source device is a composite light source device, light beams with different wavelength ranges emitted by the composite light source device can be used to irradiate different positions of the area to be collected on the metal part. For example, a light beam with a short wavelength range can be used to irradiate the center position of the area to be collected on the metal part, and a light beam with a long wavelength range can be used to irradiate the edge position of the area to be collected on the metal part, so as to control the curing effect of different positions of the area to be collected on the metal part.

[0057] In the case where the light-curing light source device is a composite light source device, the light beams with different wavelength ranges emitted by the composite light source device can be used to sequentially irradiate the light-curing material coated on the area to be collected of the metal part (for example, the light beam with a short wavelength range can be used to irradiate the light-curing material first, and then the light beam with a long wavelength range can be used to complete the final irradiation of the light-curing material) or alternately irradiate (for example, the light beam with a short wavelength range and the light beam with a long wavelength range are used to alternately irradiate the light-curing material). By adopting different irradiation methods, the curing effect and curing efficiency of the light-curing material can be improved.

[0058] The light-curing light source device comprises a light source and a light-limiting device. The light-limiting device is arranged in the path of the light beam emitted by the light source and is used to focus and limit the light beam to improve the curing efficiency of the light-curing material.

[0059] The light curing light source device comprises a light source and a light homogenizing device. The light homogenizing device is arranged between the light source and the metal component to make the light beam emitted by the light source uniform and improve the curing effect of the light curing material.

[0060] The light-curing material may be a material that can be cured by chemical reaction under light, such as photosensitive resin, UV glue, UV silicone, etc.

[0061] The present invention does not limit the state of the photocurable material. Considering that the liquid photocurable material can form a very fine structure during the curing process, this helps to capture the tiny details and features of the metal material when collecting the metal microstructure. Therefore, the present application preferably uses liquid photocurable material for metal microstructure collection.

[0062] In summary, the metal microstructure collection method provided by the present invention uses a photocurable material to replace the existing AC paper (cellulose acetate film) as a metal microstructure collection carrier, and collects the metal microstructure by curing the photocurable material. Since the photocuring technology can ensure that the photocurable material maintains its original form and characteristics during the curing process, it can more realistically reflect the microstructure of the metal material, with good collection quality and high collection efficiency, and has low requirements on the operation level of on-site operators, and has good practical value.

[0063] Example 1

[0064] The metal microstructure collection method proposed in this embodiment uses a light-curing material as a microstructure collection carrier.

[0065] Methods include:

[0066] Pre-treat the area to be collected on the metal part to make the microstructure of the area to be collected visible;

[0067] Applying a photocurable material on the surface of the pre-treated metal part in the area to be collected, irradiating the photocurable material with a photocurable light source device to cure the photocurable material to form a cured layer with a target thickness;

[0068] The solidified layer with the target thickness is separated from the metal part and the microstructure is collected.

[0069] Example 2

[0070] The metal microstructure collection method proposed in this embodiment uses a light-curing material as a microstructure collection carrier.

[0071] Methods include:

[0072] Pre-treat the area to be collected on the metal part to make the microstructure of the area to be collected visible;

[0073] Applying a photocurable material on the surface of the pre-treated metal part in the area to be collected, irradiating the photocurable material with a photocurable light source device to cure the photocurable material to form a cured layer with a target thickness;

[0074] The solidified layer with the target thickness is separated from the metal part and the microstructure is collected.

[0075] Applying a photocurable material to the area to be collected of the pre-treated metal part, irradiating the photocurable material with a photocurable light source device, and curing the photocurable material to form a cured layer with a target thickness, including:

[0076] S1: Applying a first layer of light-curing material on the surface of the pre-treated metal part in the area to be collected;

[0077] S2: using a light curing light source device to irradiate the first layer of light curing material to cure the first layer of light curing material to form a first sub-cured layer;

[0078] S3: coating a second layer of photocurable material on the first sub-curable layer, and irradiating the second layer of photocurable material with a photocurable light source device to cure the second layer of photocurable material to form a second sub-curable layer;

[0079] S4: repeating the above steps S2 to S3 until the total thickness of all sub-cured layers reaches the target thickness; wherein the thickness of the sub-cured layers is less than the target thickness.

[0080] Example 3

[0081] The metal microstructure collection method proposed in this embodiment uses a light-curing material as a microstructure collection carrier.

[0082] Methods include:

[0083] Pre-treat the area to be collected on the metal part to make the microstructure of the area to be collected visible;

[0084] Applying a photocurable material on the surface of the pre-treated metal part in the area to be collected, irradiating the photocurable material with a photocurable light source device to cure the photocurable material to form a cured layer with a target thickness;

[0085] The solidified layer with the target thickness is separated from the metal part and the microstructure is collected.

[0086] Applying a photocurable material to the area to be collected of the pre-treated metal part, irradiating the photocurable material with a photocurable light source device, and curing the photocurable material to form a cured layer with a target thickness, including:

[0087] S1: Applying a first layer of light-curing material on the surface of the pre-treated metal part in the area to be collected;

[0088] S2: using a light curing light source device to irradiate the first layer of light curing material to cure the first layer of light curing material to form a first sub-cured layer;

[0089] S3: coating a second layer of photocurable material on the first sub-curable layer, and irradiating the second layer of photocurable material with a photocurable light source device to cure the second layer of photocurable material to form a second sub-curable layer;

[0090] S4: repeating the above steps S2 to S3 until the total thickness of all sub-cured layers reaches the target thickness; wherein the thickness of the sub-cured layers is less than the target thickness.

[0091] The target thickness is 0.2mm-1.0mm.

[0092] The light curing light source device is a single light source device with a single wavelength range.

[0093] Photocurable materials include contrast-enhancing color materials.

[0094] The light-curable material is a liquid light-curable material.

[0095] The light curing light source device comprises a light source and a light limiting device. The light limiting device is arranged in the path of the light beam emitted by the light source and is used for focusing and limiting the light beam.

[0096] The light curing light source device comprises a light source and a light homogenizing device, wherein the light homogenizing device is arranged between the light source and the metal component and is used for making the light beam emitted by the light source uniform.

[0097] Pretreatment includes etching treatment.

[0098] Example 4

[0099] The metal microstructure collection method proposed in this embodiment uses a light-curing material as a microstructure collection carrier.

[0100] Methods include:

[0101] Pre-treat the area to be collected on the metal part to make the microstructure of the area to be collected visible;

[0102] Applying a photocurable material on the surface of the pre-treated metal part in the area to be collected, irradiating the photocurable material with a photocurable light source device to cure the photocurable material to form a cured layer with a target thickness;

[0103] The solidified layer with the target thickness is separated from the metal part and the microstructure is collected.

[0104] Applying a photocurable material to the area to be collected of the pre-treated metal part, irradiating the photocurable material with a photocurable light source device, and curing the photocurable material to form a cured layer with a target thickness, including:

[0105] S1: Applying a first layer of light-curing material on the surface of the pre-treated metal part in the area to be collected;

[0106] S2: using a light curing light source device to irradiate the first layer of light curing material to cure the first layer of light curing material to form a first sub-cured layer;

[0107] S3: coating a second layer of photocurable material on the first sub-curable layer, and irradiating the second layer of photocurable material with a photocurable light source device to cure the second layer of photocurable material to form a second sub-curable layer;

[0108] S4: repeating the above steps S2 to S3 until the total thickness of all sub-cured layers reaches the target thickness; wherein the thickness of the sub-cured layers is less than the target thickness.

[0109] The target thickness is 0.2mm-1.0mm.

[0110] The light curing light source device is a composite light source device, which can emit light beams with different wavelength ranges.

[0111] Light beams with different wavelength ranges emitted by a composite light source device are used to irradiate different positions of the area to be collected on the metal part.

[0112] The light curing material is sequentially or alternately irradiated with light beams having different wavelength ranges emitted by the composite light source device.

[0113] Photocurable materials include contrast-enhancing color materials.

[0114] The light-curable material is a liquid light-curable material.

[0115] The light curing light source device comprises a light source and a light limiting device. The light limiting device is arranged in the path of the light beam emitted by the light source and is used for focusing and limiting the light beam.

[0116] The light curing light source device comprises a light source and a light homogenizing device, wherein the light homogenizing device is arranged between the light source and the metal component and is used for making the light beam emitted by the light source uniform.

[0117] Pretreatment includes etching treatment.

Claims

1. A method for collecting metal microstructures, characterized in that: Light-curing materials are used as carriers for microstructure collection.

2. The metal microstructure collection method according to claim 1, characterized in that: The method comprises: Pre-treating the area to be collected of the metal part to make the microstructure of the area to be collected visible; Applying the photocurable material on the surface of the pre-treated area of ​​the metal component to be collected, irradiating the photocurable material with a photocurable light source device to cure the photocurable material to form a cured layer with a target thickness; The solidified layer having the target thickness is separated from the metal component to complete the microstructure collection.

3. The metal microstructure collection method according to claim 2, characterized in that: The method of applying the photocurable material to the pre-treated area of ​​the metal component to be collected, irradiating the photocurable material with a photocurable light source device, and curing the photocurable material to form a cured layer with a target thickness includes: S1: applying a first layer of light-curing material on the surface of the pre-treated metal part in the area to be collected; S2: irradiating the first layer of light-curable material with a light-curing light source device to cure the first layer of light-curable material to form a first sub-cured layer; S3: coating a second layer of photocurable material on the first sub-curable layer, and irradiating the second layer of photocurable material with a photocurable light source device to cure the second layer of photocurable material to form a second sub-curable layer; S4: repeating the above steps S2 to S3 until the total thickness of all sub-cured layers reaches the target thickness; wherein the thickness of the sub-cured layers is less than the target thickness.

4. The metal microstructure collection method according to claim 2, characterized in that: The target thickness is 0.2 mm-1.0 mm.

5. The metal microstructure collection method according to claim 2, characterized in that: The photocuring light source device is a single light source device with a single wavelength range.

6. The metal microstructure collection method according to claim 2, characterized in that: The photocuring light source device is a composite light source device, which can emit light beams with different wavelength ranges.

7. The metal microstructure collection method according to claim 6, characterized in that: The light beams with different wavelength ranges emitted by the composite light source device are used to irradiate different positions of the area to be collected of the metal component.

8. The metal microstructure collection method according to claim 6, characterized in that: The light curing material is sequentially or alternately irradiated with light beams having different wavelength ranges emitted by the composite light source device.

9. The metal microstructure collection method according to claim 1, characterized in that: The photocurable material includes a contrast color-adding material.

10. The metal microstructure collection method according to claim 1, characterized in that: The light-curable material is a liquid light-curable material.

11. The metal microstructure collection method according to claim 1, characterized in that: The light curing light source device comprises a light source and a light limiting device. The light limiting device is arranged in the path of the light beam emitted by the light source and is used to focus and limit the light beam.

12. The metal microstructure collection method according to claim 1, characterized in that: The light curing light source device comprises a light source and a light homogenizing device, wherein the light homogenizing device is arranged between the light source and the metal component and is used for homogenizing the light beam emitted by the light source.

13. The metal microstructure collection method according to claim 2, characterized in that: The pretreatment includes an etching treatment.