Relay circuit and electrical connection device

Abstract

The invention relates to a relay circuit and an electric connection device, which can reduce loss and noise of a loopback circuit. The electrical connection device includes an inspection terminal, a wiring board, and a relay circuit. The wiring substrate includes first electrodes electrically connected to the inspection terminals, connection wires connected to the first electrodes, and second electrodes electrically connected to the first electrodes via the connection wires. The relay circuit is connected to a first wiring and a second wiring electrically connected to each of the first electrodes that are different from each other. The relay circuit includes a common terminal, a first wiring terminal connected to the first wiring, a second wiring terminal connected to the second wiring, and first and second inspection terminals electrically connected to the inspection device, respectively. The relay circuit selectively connects the first wiring terminal to either the common terminal or the first inspection terminal, and selectively connects the second wiring terminal to either the common terminal or the second inspection terminal.

Description

Technical Field

[0001] The present invention relates to a relay circuit and an electrical connection device used in inspecting electrical characteristics of an inspection object. Background Art

[0002] In order to measure the electrical characteristics of an inspection object such as an integrated circuit, an electrical connection device having inspection terminals that contact the inspection object is used. In the measurement using the electrical connection device, the inspection object and an inspection device such as a tester are electrically connected via the inspection terminals.

[0003] In order to inspect the characteristics of the inspection object, a signal output from the output terminal of the inspection object is sometimes input to the input terminal of the inspection object to inspect whether the output part and the input part of the inspection object are functioning. For this purpose, an electrical connection device is used that can form a circuit (hereinafter also referred to as a "loop circuit") that electrically connects the output terminal and the input terminal of the inspection object.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Korean Patent Publication No. 10-2020-0063009 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] In order to measure the characteristics of an inspection object with high accuracy, it is important to reduce the loss and noise of a loop circuit for transmitting a signal. An object of the present invention is to provide a relay circuit and an electrical connection device capable of reducing the loss and noise of a loop circuit.

[0009] Solutions for solving problems

[0010] The main purpose of an electrical connection device involved in one aspect of the present invention is to have a wiring substrate, a relay circuit and a plurality of inspection terminals. The wiring substrate includes: a plurality of first electrodes electrically connected to a certain inspection terminal among the inspection terminals, a plurality of connection wirings connected to a certain first electrode among the first electrodes, and a plurality of second electrodes electrically connected to a certain first electrode among the first electrodes via the connection wirings. The relay circuit is connected to the first wiring and the second wiring electrically connected to a certain first electrode among the different first electrodes. The relay circuit includes: a common terminal, a first wiring terminal connected to the first wiring, a second wiring terminal connected to the second wiring, and a first inspection terminal and a second inspection terminal electrically connected to the inspection device respectively. The relay circuit selectively connects the first wiring terminal to one of the common terminal and the first inspection terminal, and selectively connects the second wiring terminal to one of the common terminal and the second inspection terminal.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to provide a relay circuit and an electrical connection device capable of reducing loss and noise in a loop circuit. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram showing the structure of the electrical connecting device according to the first embodiment.

[0014] Figure 2 It is a schematic diagram showing the structure of the relay circuit of the electrical connection device according to the first embodiment.

[0015] Figure 3 1 is a schematic diagram showing a first connection state of the electrical connection device according to the first embodiment.

[0016] Figure 4 1 is a schematic diagram showing a second connection state of the electrical connection device according to the first embodiment.

[0017] Figure 5 It is a schematic diagram showing the structure of a capacitor included in the relay circuit of the electrical connection device according to the first embodiment.

[0018] Fig. 6A It is a schematic side view showing the structure of the relay circuit of the electrical connecting device according to the first embodiment.

[0019] Figure 6B It is a schematic cross-sectional view showing the structure of the relay circuit of the electrical connecting device according to the first embodiment.

[0020] Figure 6CIt is a schematic front view showing the structure of the relay circuit of the electrical connecting device according to the first embodiment.

[0021] Fig. 7A It is shown Fig. 6A A schematic side view of a first connected state of a relay circuit is shown.

[0022] Figure 7B It is shown Figure 6B A schematic cross-sectional view of a first connection state of a relay circuit is shown.

[0023] Figure 7C It is shown Figure 6C A schematic front view of a first connection state of a relay circuit is shown.

[0024] Fig. 8A It is shown Fig. 6A A schematic side view of a second connected state of a relay circuit is shown.

[0025] Figure 8B It is shown Figure 6B FIG. 1 is a schematic cross-sectional view of a second connection state of a relay circuit shown.

[0026] Figure 8C It is shown Figure 6C A schematic front view of a second connection state of the relay circuit is shown.

[0027] Fig.9A 1 is a schematic diagram showing a first connection state of a relay circuit according to a comparative example.

[0028] Fig. 9B 2 is a schematic diagram showing a second connection state of the relay circuit of the comparative example.

[0029] Fig. 10A It is a schematic side view showing the structure of a relay circuit of an electrical connecting device according to a second embodiment.

[0030] Fig. 10B It is a schematic cross-sectional view showing the structure of a relay circuit of an electrical connecting device according to a second embodiment.

[0031] Fig. 10C It is a schematic front view showing the structure of a relay circuit of an electrical connecting device according to a second embodiment.

[0032] Fig.11A It is shown Fig. 10A A schematic side view of a first connected state of a relay circuit is shown.

[0033] Fig. 11B It is shown Fig. 10BA schematic cross-sectional view of a first connection state of a relay circuit is shown.

[0034] Fig. 11C It is shown Fig. 10C A schematic front view of a first connection state of a relay circuit is shown. DETAILED DESCRIPTION

[0035] Next, the embodiments of the present invention are described with reference to the accompanying drawings. In the description of the following drawings, the same or similar parts are marked with the same or similar figure marks. However, it should be noted that the drawings are schematic, and the ratio of the thickness of each part is different from the actual. In addition, of course, the drawings also include parts with different dimensional relationships and ratios. The embodiments shown below illustrate the devices and methods for concretizing the technical ideas of the present invention. The embodiments of the present invention do not specifically specify the materials, shapes, structures, configurations, etc. of the constituent parts as the following materials, shapes, structures, configurations, etc.

[0036] (First Embodiment)

[0037] Figure 1 The electrical connection device 1 according to the first embodiment shown is used in the inspection of the inspection object 2. The electrical connection device 1 includes: a plurality of probes 10 that come into contact with the inspection object 2 during the inspection of the inspection object 2, a wiring substrate 20 connected to the probes 10, and a relay circuit 30 disposed on the wiring substrate 20. The electrical connection device 1 further includes a printed circuit board 40 stacked on the wiring substrate 20 and a reinforcement member 50 stacked on the printed circuit board 40.

[0038] One end of the probe 10 (hereinafter, also referred to as the "base end") is connected to the wiring substrate 20. When inspecting the inspection object 2, the other end of the probe 10 (hereinafter, also referred to as the "front end") contacts a signal terminal (not shown) of the inspection object 2. The plurality of probes 10 function as a plurality of inspection terminals that electrically connect the inspection device to the inspection object 2. Figure 1 The state where the probe 10 is separated from the inspection object 2 is shown. The probe 10 may be supported by a probe head 60 through which the probe 10 passes. The probe head 60 may be a housing having a space provided inside. The probe head 60 is fixed to the wiring substrate 20, for example.

[0039] like Figure 1As shown, the wiring substrate 20 includes a plurality of first electrodes 21 electrically connected to a certain probe 10 of the plurality of probes 10, and a plurality of second electrodes 22 electrically connected to a certain first electrode 21 of the first electrodes 21. The second electrodes 22 are electrically connected to the first electrodes 21 via a plurality of connection wirings 200 connected to a certain first electrode 21 of the first electrodes 21. The first electrode 21 is connected to the base end of the probe 10. The connection wiring 200 may be, for example, an internal wiring arranged inside the wiring substrate 20. The wiring substrate 20 may also use a multilayer wiring substrate such as MLO (Multi-Layer Organic) or MLC (Multi-Layer Ceramic).

[0040] The printed circuit board 40 includes a wiring pattern 400 that electrically connects the second electrode 22 of the wiring substrate 20 to the inspection device. For example, a first end 41 of the wiring pattern 400 disposed inside and on the surface of the printed circuit board 40 is connected to the second electrode 22 of the wiring substrate 20, and a second end 42 of the wiring pattern 400 is electrically connected to the inspection device.

[0041] The wiring substrate 20 is a space transformer that expands the interval between the base ends of the probes 10 to the interval between the wiring patterns 400 of the printed circuit board 40, for example, when viewed from above in the normal direction of the main surface of the wiring substrate 20. By using the space transformer on the wiring substrate 20, the base ends of the probes 10 corresponding to the interval between the signal terminals arranged on the inspection object 2 can be electrically connected to the wiring patterns 400 of the printed circuit board 40 arranged at a wider interval than the interval between the base ends.

[0042] like Figure 1 As shown, a reinforcing member 50 may be laminated on the printed circuit board 40. The rigidity of the reinforcing member 50 is higher than that of the printed circuit board 40, thereby ensuring the mechanical strength of the electrical connection device 1 to prevent the printed circuit board 40 from bending, etc. In addition, the reinforcing member 50 can be used as a support body to fix the components of the electrical connection device 1. The reinforcing member 50 can also be fixed to the printed circuit board 40 by screws, for example.

[0043] The relay circuit 30 is connected to a first wiring 201A and a second wiring 202A which are electrically connected to one of the first electrodes 21 different from each other. Figure 1 The relay circuit 30 shown is connected to the first wiring 201A and the second wiring 202A included in the connection wiring 200 arranged on the wiring substrate 20. The first wiring 201A is electrically connected to the first probe 101 of the plurality of probes 10. The second wiring 202A is electrically connected to the second probe 102 of the plurality of probes 10.

[0044] like Figure 2 As shown, the relay circuit 30 includes: a common terminal 300, a first wiring terminal 301A connected to the first wiring 201A, a second wiring terminal 302A connected to the second wiring 202A, a first inspection terminal 301B, and a second inspection terminal 302B. The first inspection terminal 301B can be electrically connected to the inspection device via the first inspection wiring 201B included in the connection wiring 200 of the wiring substrate 20 and a part of the wiring pattern 400 of the printed circuit board 40. The second inspection terminal 302B can be electrically connected to the inspection device via the second inspection wiring 202B included in the connection wiring 200 of the wiring substrate 20 and a part of the wiring pattern 400 of the printed circuit board 40.

[0045] The relay circuit 30 selectively connects the first wiring terminal 301A to one of the common terminal 300 and the first inspection terminal 301B. Furthermore, the relay circuit 30 selectively connects the second wiring terminal 302A to one of the common terminal 300 and the second inspection terminal 302B. Hereinafter, the operation of switching the connection destination of the first wiring terminal 301A and the second wiring terminal 302A by the relay circuit 30 is also referred to as a "switching operation". For example, the switching operation of the relay circuit 30 may be controlled according to the control signal CS received by the relay circuit 30 from the inspection device.

[0046] The relay circuit 30 connects the second wiring terminal 302A to the common terminal 300 when the first wiring terminal 301A is connected to the common terminal 300. Hereinafter, the state in which the first wiring terminal 301A and the second wiring terminal 302A are connected to the common terminal 300 is referred to as a "first connection state". On the other hand, the relay circuit 30 connects the second wiring terminal 302A to the second check terminal 302B when the first wiring terminal 301A is connected to the first check terminal 301B. Hereinafter, the state in which the first wiring terminal 301A is connected to the first check terminal 301B and the second wiring terminal 302A is connected to the second check terminal 302B is referred to as a "second connection state".

[0047] exist Figure 3 FIG. 2 shows the wiring path in the first connection state. Figure 3 As shown, the wiring path between the inspection object 2 and the inspection device 3 is composed of the first section P1 to the fourth section P4 (the same below). The first section P1 is the wiring path of the probe 10 in a state where the tip portion thereof contacts the signal terminal of the inspection object 2. The second section P2 is the wiring path composed of the connection wiring 200 of the wiring substrate 20. The third section P3 is the wiring path composed of the wiring pattern 400 of the printed circuit board 40. The fourth section P4 is the wiring path between the printed circuit board 40 and the inspection device 3.

[0048] like Figure 3 As shown, in the first connection state, the first probe 101 electrically connected to the first wiring 201A is electrically connected to the second probe 102 electrically connected to the second wiring 202A via the common terminal 300. That is, in the electrical connection device 1, the first probe 101 and the second probe 102 electrically connected to the common terminal 300 can form a loop circuit.

[0049] The two signal terminals of the inspection object 2 are electrically connected via the loop circuit formed in the first connection state. Figure 3 The case where the first signal terminal 2A of the inspection object 2 contacted by the first probe 101 and the second signal terminal 2B of the inspection object 2 contacted by the second probe 102 are electrically connected via the common terminal 300 is shown as an example. For example, when the inspection object 2 is a receiving circuit, the first signal terminal 2A is the output terminal of the inspection object 2, and the second signal terminal 2B is the input terminal of the inspection object 2, a transmission test can be performed by returning the output from the inspection object 2 to the input. In other words, even if there is no device as the object of transmission, it is possible to test whether the output part and the input part of the inspection object 2 are functioning normally. For example, as an inspection based on the jitter tolerance test performed on the receiving circuit, the output signal output from the first signal terminal 2A (output terminal) can also be input as an input signal to the second signal terminal 2B (input terminal) to check whether the specified error rate is ensured.

[0050] On the other hand, Figure 4 As shown, in the second connection state, the first probe 101 electrically connected to the first wiring 201A is electrically connected to the inspection device 3 via the wiring substrate 20 and the printed circuit board 40. In other words, the first signal terminal 2A of the inspection object 2 is electrically connected to the first terminal 3A of the inspection device 3 via the electrical connection device 1. Moreover, the second probe 102 electrically connected to the second wiring 202A is electrically connected to the inspection device 3 via the wiring substrate 20 and the printed circuit board 40. In other words, the second signal terminal 2B of the inspection object 2 is electrically connected to the second terminal 3B of the inspection device 3 via the electrical connection device 1.

[0051] As described above, in the second connection state, the signal terminal of the inspection object 2 is electrically connected to the terminal of the inspection device 3 via the relay circuit 30. In the second connection state, an electrical signal is transmitted between the inspection device 3 such as an IC tester and the inspection object 2 to measure the characteristics of the inspection object 2.

[0052] The common terminal 300 of the relay circuit 30 may include a capacitor that can be electrically connected to the first wiring 201A and the second wiring 202A. Figure 52 shows an example of the capacitor 33 included in the common terminal 300. As the capacitor 33, a capacitor formed on a semiconductor substrate by a semiconductor manufacturing process (hereinafter also referred to as a "process capacitor") or the like can be used. Figure 5 The capacitor 33 shown has a laminated body formed by disposing a dielectric layer 33C between a first electrode layer 33A and a second electrode layer 33B in a semiconductor substrate 330. On one main surface of the semiconductor substrate 330, a first electrode terminal 331 connected to the first electrode layer 33A and a second electrode terminal 332 connected to the second electrode layer 33B are disposed.

[0053] exist Figure 6A to Figure 6C 2 shows an example of the structure of the relay circuit 30 including the capacitor 33. Fig. 6A The position of the first electrode terminal 331 facing the first wiring 201A is shown. Figure 6B 2 shows the position of the second electrode terminal 332 facing the second wiring 202A. Fig. 6A and Figure 6B The direction from the top to the bottom of the paper is set as the Z direction, the direction from the right side to the left side of the paper perpendicular to the Z direction is set as the X direction, and the direction from the front side to the back side of the paper perpendicular to the Z direction is set as the Y direction. Figure 6C The relative positional relationship between the first electrode terminal 331 and the second electrode terminal 332 as viewed from the X direction is shown. Figure 6B is along Figure 6C Hereinafter, the figure viewed from the X direction is set as the front view, and the figure viewed from the Y direction is set as the side view.

[0054] Figure 6A to Figure 6C The relay circuit 30 shown in the figure has: a support portion 311, whose main surface is parallel to the XY plane; a first short-circuit wiring 3121 and a second short-circuit wiring 3122 arranged on the main surface of the support portion 311 facing the Z direction; and a column portion 313, one end of which is connected to the support portion 311, and the column portion 313 extends in the Z direction. The support portion 311 has insulating properties, and the first short-circuit wiring 3121 and the second short-circuit wiring 3122 have conductivity. The first short-circuit wiring 3121 and the second short-circuit wiring 3122 are arranged in parallel in the Y direction and extend in the X direction respectively. In the following, when the first short-circuit wiring 3121 and the second short-circuit wiring 3122 are not limited respectively, they are also recorded as short-circuit wiring 312.

[0055] The capacitor 33 is connected to the other end of the column portion 313. On the main surface of the capacitor 33 facing the support portion 311, a first electrode terminal 331 and a second electrode terminal 332 are arranged along the Y direction.

[0056] like Figure 6A to Figure 6CAs shown, the first wiring 201A and the second wiring 202A are located between the support portion 311 and the capacitor 33. The first wiring 201A, the second wiring 202A, the first short-circuit wiring 3121, and the second short-circuit wiring 3122 are arranged on the same XY plane level.

[0057] When viewed from the Z direction, the first electrode terminal 331 faces the first wiring 201A, and the second electrode terminal 332 faces the second wiring 202A. When viewed from the Z direction, the first short-circuit wiring 3121 faces the first wiring 201A and the first inspection wiring 201B. When viewed from the Z direction, the second short-circuit wiring 3122 faces the second wiring 202A and the second inspection wiring 202B.

[0058] Figure 6A to Figure 6C The relay circuit 30 shown in FIG. 1 is configured to be relatively movable in the M direction relative to the first wiring 201A, the second wiring 202A, the first inspection wiring 201B, and the second inspection wiring 202B along the Z direction. The support portion 311, the column portion 313, and the capacitor 33 configured with the short-circuit wiring 312 move integrally. For example, the relay circuit 30 moves in the Z direction between the first connection state and the second connection state in response to the control signal CS.

[0059] exist Figure 7A to Figure 7C Shown in Figure 6A to Figure 6C An example of a first connection state of the relay circuit 30 is shown. Figure 7B is along Figure 7C In the first connection state, the relay circuit 30 is connected from Figure 6A to Figure 6C Thus, in the first connection state, the first electrode terminal 331 of the capacitor 33 is electrically connected to the first wiring 201A, and the second electrode terminal 332 is electrically connected to the second wiring 202A. In the first connection state, the first electrode terminal 331 corresponds to the first wiring terminal 301A, and the second electrode terminal 332 corresponds to the second wiring terminal 302A. Furthermore, the capacitor 33 corresponds to the common terminal 300.

[0060] In the first connection state, the first signal terminal 2A and the second signal terminal 2B of the inspection object 2 are electrically connected via the capacitor 33. In other words, in the first connection state, a loop circuit including the capacitor 33 is formed between the first signal terminal 2A and the second signal terminal 2B.

[0061] exist Figure 8A to Figure 8C Shown in Figure 6A to Figure 6C An example of a second connection state of the relay circuit 30 is shown. Figure 8B is along Figure 8C In the second connection state, the relay circuit 30 is connected from Figure 6A to Figure 6C Thus, in the second connection state, the first wiring 201A and the first inspection wiring 201B are connected to the first short-circuit wiring 3121. Furthermore, the second wiring 202A and the second inspection wiring 202B are connected to the second short-circuit wiring 3122. That is, the first wiring 201A and the first inspection wiring 201B are electrically connected via the first short-circuit wiring 3121, and the second wiring 202A and the second inspection wiring 202B are electrically connected via the second short-circuit wiring 3122.

[0062] In the second connection state, the portion of the first short-circuit wiring 3121 connected to the first wiring 201A corresponds to the first wiring terminal 301A, and the portion of the first short-circuit wiring 3121 connected to the first inspection wiring 201B corresponds to the first inspection terminal 301B. Furthermore, the portion of the second short-circuit wiring 3122 connected to the second wiring 202A corresponds to the second wiring terminal 302A, and the portion of the second short-circuit wiring 3122 connected to the second inspection wiring 202B corresponds to the second inspection terminal 302B.

[0063] In the second connection state, the first signal terminal 2A and the second signal terminal 2B of the inspection object 2 are respectively electrically connected to the first terminal 3A and the second terminal 3B of the inspection device 3. Thus, in the second connection state, an electrical signal is transmitted between the inspection device 3 and the inspection object 2 to measure the characteristics of the inspection object 2.

[0064] As described above, as the relay circuit 30, the common terminal 300, the first wiring terminal 301A, the second wiring terminal 302A, the first check terminal 301B, and the second check terminal 302B are integrally formed. Therefore, the circuit structure of the relay circuit 30 is simple, and the internal signal path is short. In addition, the relay circuit 30 obtained by integrating the circuit structure can reduce the external size. For example, by forming the relay circuit 30 integrally using a MEMS (Micro Electro Mechanical Systems) process, the relay circuit 30 can be miniaturized.

[0065] On the other hand, even if you use Fig.9A and Fig. 9BA relay circuit of a comparative example including two relays and an external capacitor 33M as shown (hereinafter, also referred to as a "comparison relay circuit 30M") can also realize the same structure as the first connection state and the second connection state. The comparison relay circuit 30M controlled by the control signal CS electrically connects the first signal terminal 2A of the inspection object 2 to the first terminal 3A of the inspection device 3 and the external capacitor 33M through the first relay 310. Moreover, the comparison relay circuit 30M electrically connects the second signal terminal 2B of the inspection object 2 to the second terminal 3B of the inspection device 3 and the external capacitor 33M through the second relay 320. That is, the comparison relay circuit 30M is as Fig.9A As shown in FIG. 1 , the first signal terminal 2A of the inspection object 2 is electrically connected to one terminal of the external capacitor 33M, and the second signal terminal 2B of the inspection object 2 is electrically connected to the other terminal of the external capacitor 33M. Alternatively, the comparison relay circuit 30M is as shown in FIG. Fig. 9B As shown, the first signal terminal 2A of the inspection object 2 is electrically connected to the first terminal 3A of the inspection device 3 , and the second signal terminal 2B of the inspection object 2 is electrically connected to the second terminal 3B of the inspection device 3 .

[0066] However, it is difficult to miniaturize the comparison relay circuit 30M. That is, since the comparison relay circuit 30M is configured with two relays and an external capacitor, it has a complex structure and a larger outer size than the relay circuit 30. Therefore, compared with the relay circuit 30, the comparison relay circuit 30M has a long signal path and has greater signal loss and noise.

[0067] Furthermore, by miniaturizing the relay circuit 30, the degree of freedom of the arrangement position of the relay circuit 30 is increased. For example, the relay circuit 30 can be arranged in the wiring substrate 20 whose distance to the probe 10 is closer than the distance to the printed circuit board 40. By shortening the distance between the probe 10 and the relay circuit 30, the length of the wiring for connecting the probe 10 and the relay circuit 30 can be shortened. As a result, when, for example, a loop circuit is used to measure the high-frequency characteristics of the inspection object 2, the loss of the signal transmitted in the wiring and the generation of noise can be suppressed.

[0068] As described above, according to the electrical connection device 1 including the relay circuit 30 according to the first embodiment, it is possible to reduce the loss and noise of the loop circuit.

[0069] In addition, the switching operation of the relay circuit 30 may be performed according to, for example, a control signal CS from an inspection device. By configuring the relay circuit 30 to be able to receive the control signal CS from the inspection device, a loop circuit can be formed at any timing in the middle of a series of inspections of the inspection object 2. For example, wiring for transmitting the control signal CS between the relay circuit 30 and the inspection device may be formed on the wiring substrate 20 and the printed circuit board 40. Alternatively, the switching operation of the relay circuit 30 may be performed manually.

[0070] (Second Embodiment)

[0071] Regarding the electrical connection device 1 according to the second embodiment, Figures 10A to 10C As shown, the other end of the column 313 connected to the support portion 311 at one end is not connected to the capacitor 33, but is connected to a support substrate 35 having a connecting wiring 34 arranged on the main surface. The connecting wiring 34 is made of a conductive material and is arranged on the main surface of the support substrate 35 facing the support portion 311. The connecting wiring 34 faces the first wiring 201A and the second wiring 202A. The electrical connection device 1 involved in the second embodiment is different from the first embodiment in that the relay circuit 30 includes the connecting wiring 34 instead of the capacitor 33. Regarding other structures, the electrical connection device 1 involved in the second embodiment is different from the first embodiment. Figure 1 The electrical connecting device 1 according to the first embodiment shown is the same.

[0072] In the first connection state, if Figures 11A to 11C As shown, the relay circuit 30 is Figures 10A to 10C . Thus, the first wiring 201A and the second wiring 202A are connected to the connecting wiring 34. As a result, the first wiring 201A and the second wiring 202A are electrically connected via the connecting wiring 34.

[0073] Therefore, in the first connection state, the first signal terminal 2A and the second signal terminal 2B of the inspection object 2 are electrically connected via the connection wiring 34. In other words, in the first connection state, a loop circuit is formed in which the first signal terminal 2A and the second signal terminal 2B are connected in series.

[0074] In the electrical connection device 1 according to the second embodiment, the second connection state is also similar to the reference Figure 8A to Figure 8C That is, the first signal terminal 2A and the second signal terminal 2B of the inspection object 2 are electrically connected to the first terminal 3A and the second terminal 3B of the inspection device 3 via the short-circuit wiring 312, respectively. Therefore, the description of the second connection state is omitted.

[0075] For example, if a protective element with a capacitor is connected to the input / output terminal of the inspection object 2, the measured waveform is blunted. Therefore, the inspection object 2 is sometimes measured by the inspection device without connecting the protective element. In this case, the capacitor 33 included in the relay circuit 30 of the electrical connection device 1 according to the first embodiment functions in place of the protective element.

[0076] On the other hand, when the protection element is not connected to the inspection object 2, or the capacitance of the protection element does not cause a problem in the measurement, the relay circuit 30 may not include the capacitor 33, as in the electrical connection device 1 according to the second embodiment. Since the relay circuit 30 does not include the capacitor 33, the circuit structure of the relay circuit 30 can be further simplified, and the internal signal path can be shortened. In addition, the electrical connection device 1 according to the second embodiment is substantially the same as the electrical connection device 1 according to the first embodiment, and repeated descriptions are omitted.

[0077] (Other Embodiments)

[0078] As described above, the present invention is described by the embodiments, but it should not be understood that the discussion and drawings constituting part of the present disclosure are used to limit the present invention. Based on the present disclosure, various alternative embodiments, examples, and application techniques can be clearly known to those skilled in the art.

[0079] For example, the case where the relay circuit 30 is arranged on the wiring substrate 20 is described above by way of example. However, the relay circuit 30 may be arranged at any position of the electrical connection device 1. In the electrical connection device 1, the relay circuit 30 is miniaturized, thereby providing a high degree of freedom in arranging the relay circuit 30. Therefore, for example, the relay circuit 30 may be arranged on the printed circuit board 40. However, the shorter the wiring for connecting the probe 10 to the relay circuit 30, the less loss and noise of the signal transmitted to the relay circuit 30, which is preferable in this respect.

[0080] In addition, although the case where there is one relay circuit 30 is described as an example, the electrical connection device 1 may include a plurality of relay circuits 30. According to the electrical connection device 1 including a plurality of relay circuits 30, a loop circuit can be formed for any two signal terminals of the inspection object 2, or a plurality of loop circuits can be formed simultaneously.

[0081] In the above, the relay circuit 30 is described as including the capacitor 33. However, in addition to the capacitor 33, an element such as an inductor or a resistor may be arranged in the relay circuit 30. For example, the passive element included in the relay circuit 30 may be selected so as to obtain impedance matching of the loop circuit. In this way, in the electrical connection device 1, the element to be inserted into the loop circuit can be arbitrarily selected according to the inspection content of the inspection object 2, etc.

[0082] In addition, Figure 1 FIG. 2 shows a case where the electrical connection device 1 equipped with the relay circuit 30 includes a probe 10 that contacts the inspection object 2. Figure 1 The electrical connection device 1 shown in the figure can measure the electrical characteristics of the inspection object 2 in a state where it is not separated from the wafer or in a chip state. On the other hand, the relay circuit 30 can be arranged in the electrical connection device including the test socket in correspondence with the measurement of the electrical characteristics in a state where the inspection object 2 is mounted in a package or the like. For example, a relay circuit 30 can be arranged in place of the test socket. Figure 1 The probe 10 of the electrical connection device 1 shown in the figure is configured so that a test socket having a terminal for inspection connected to the external terminal of the package body on which the inspection object 2 is mounted is configured on the wiring substrate 20. The signal terminal of the inspection object 2 mounted on the package body connects the package body to the test socket, thereby forming a loop circuit via the external terminal of the package body and the inspection terminal of the test socket. In the electrical connection device including the test socket, the first connection state and the second connection state can also be switched in the same manner as the electrical connection device 1 including the probe 10 described above.

[0083] In addition, the switching operation of the relay circuit 30 may be performed by the control of the inspection object 2. For example, the semiconductor device as the inspection object 2 may have a self-diagnosis function of outputting a control signal CS for controlling the switching operation to the relay circuit 30 and performing a measurement using a loopback circuit. In other words, the electrical connection device 1 and the inspection object 2 may be configured so that the relay circuit 30 can receive the control signal CS from the inspection object 2, and the operation of the relay circuit 30 may be controlled by the inspection object 2. The relay circuit 30 selectively connects the first wiring terminal 301A to one of the common terminal 300 and the first inspection terminal 301B, and selectively connects the second wiring terminal 302A to one of the common terminal 300 and the second inspection terminal 302B, based on the control signal CS. For example, the inspection circuit built in the inspection object 2 may send the control signal CS to the relay circuit 30 via the inspection terminal of the electrical connection device 1 to configure a loopback circuit so that the inspection object 2 performs self-diagnosis. As described above, also in a configuration in which the inspection device is built into the inspection object 2, the loss and noise of the loop circuit can be reduced.

[0084] Thus, the present invention naturally includes various embodiments not described above, etc. Therefore, according to the above description, the technical scope of the present invention is determined only by the invention-specific matters involved in the appropriate claims.

[0085] Description of Reference Numerals

[0086] 1: electrical connection device; 10: probe; 20: wiring substrate; 21: first electrode; 22: second electrode; 30: relay circuit; 33: capacitor; 40: printed circuit board; 50: reinforcement; 60: probe head; 200: connection wiring; 201A: first wiring; 201B: first inspection wiring; 202A: second wiring; 202B: second inspection wiring; 300: common terminal; 301A: first wiring terminal; 301B: first inspection terminal; 302A: second wiring terminal; 302B: second inspection terminal; 400: wiring pattern.

Claims

1. An electrical connection device used in an inspection of an inspection object by an inspection device, the electrical connection device comprising: a plurality of inspection terminals, the plurality of inspection terminals being in contact with the inspection object; a wiring substrate including a plurality of first electrodes electrically connected to one of the inspection terminals, a plurality of connection wirings electrically connected to one of the first electrodes, and a plurality of second electrodes electrically connected to one of the first electrodes via the connection wirings; as well as a relay circuit connected to a first wiring and a second wiring respectively electrically connected to the first electrodes different from each other, in, The relay circuit comprises: Common terminal; a first wiring terminal connected to the first wiring; a second wiring terminal connected to the second wiring; and a first inspection terminal and a second inspection terminal capable of being electrically connected to the inspection device, respectively; The relay circuit selectively connects the first wiring terminal to one of the common terminal and the first check terminal. The relay circuit selectively connects the second wiring terminal to one of the common terminal and the second check terminal.

2. The electrical connection device according to claim 1, wherein: A loop circuit including the first inspection terminal electrically connected to the common terminal and the second inspection terminal electrically connected to the common terminal can be configured to electrically connect two signal terminals of the inspection object.

3. The electrical connection device according to claim 1, wherein: The common terminal, the first wiring terminal, the second wiring terminal, the first check terminal, and the second check terminal are integrally formed.

4. The electrical connection device according to any one of claims 1 to 3, wherein: The common terminal includes a capacitor, The first electrode terminal of the capacitor can be electrically connected to the first wiring. The second electrode terminal of the capacitor can be electrically connected to the second wiring.

5. The electrical connection device according to claim 1, wherein: The relay circuit is arranged on the wiring substrate. The first wiring and the second wiring are included in the connection wiring.

6. The electrical connection device according to claim 5, wherein: The first inspection terminal and the second inspection terminal are electrically connected to the second electrode.

7. The electrical connection device according to claim 5, wherein: A printed circuit board is further provided. The printed circuit board is stacked on the wiring substrate and includes a wiring pattern that electrically connects the second electrode and the inspection device.

8. The electrical connection device according to claim 7, wherein: The wiring substrate is a space transformer that expands the interval between the inspection terminals to the interval between the wiring patterns when viewed in a plan view from a normal direction of a main surface of the wiring substrate.

9. The electrical connection device according to claim 1, wherein: The relay circuit can receive a control signal from the inspection device for selectively connecting the first wiring terminal to one of the common terminal and the first inspection terminal and for selectively connecting the second wiring terminal to one of the common terminal and the second inspection terminal.

10. The electrical connection device according to claim 1, wherein: The relay circuit can receive a control signal from the inspection target to selectively connect the first wiring terminal to one of the common terminal and the first inspection terminal and to selectively connect the second wiring terminal to one of the common terminal and the second inspection terminal.

11. The electrical connection device according to claim 1, wherein: The inspection terminal is a probe whose one end is connected to the wiring substrate and whose other end is in contact with a signal terminal of the inspection object.

12. The electrical connection device according to claim 1, wherein: The inspection terminal is arranged in a test socket connected to an external terminal of a package on which the inspection target object is mounted.

13. A relay circuit comprising: Common terminal; first wiring terminal and second wiring terminal; and a first inspection terminal and a second inspection terminal, in, The relay circuit selectively connects the first wiring terminal to one of the common terminal and the first inspection terminal. The relay circuit selectively connects the second wiring terminal to one of the common terminal and the second check terminal. The common terminal, the first wiring terminal, the second wiring terminal, the first check terminal, and the second check terminal are integrally formed.

14. The relay circuit according to claim 13, wherein: The common terminal, the first wiring terminal, the second wiring terminal, the first inspection terminal, and the second inspection terminal are integrally formed using a micro-electromechanical system process (MEMS process).

15. The relay circuit according to claim 13 or 14, wherein: The common terminal includes a capacitor, The first electrode terminal of the capacitor can be electrically connected to the first wiring terminal. The second electrode terminal of the capacitor can be electrically connected to the second wiring terminal.

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