High-precision universal die bonder

Abstract

The invention discloses a high-precision universal die bonder which comprises a base, a replaceable substrate jig, a hollow wafer jig, a die bonding table and a chip transfer table are arranged on the base, the substrate jig and the hollow wafer jig are distributed on the base left and right, and the die bonding table and the chip transfer table are also distributed on the base left and right. The die bonding table is located on the rear side of the substrate jig, the chip transfer table is located on the rear side of the hollow wafer jig, the substrate jig can translate along the X axis and the Y axis to be used for placing a substrate, the hollow wafer jig can translate along the X axis and the Y axis to be used for placing a wafer with a chip, and the die bonding table can translate along the X axis and the Y axis and rotate around the Z axis to be used for bearing the substrate and the chip for die bonding. The chip transfer table can translate along the X axis and the Y axis and rotate around the Z axis to be used for placing a chip waiting for die bonding processing, and the base is provided with a first multi-dimensional self-adaptive deviation correction transfer device used for transferring a substrate between the substrate jig and the die bonding table. The base is provided with a second multi-dimensional self-adaptive deviation correction transfer device used for transferring the chips between the hollow wafer jig and the chip transfer table, and the base is provided with a third multi-dimensional self-adaptive deviation correction transfer device used for transferring the chips between the chip transfer table and the wafer fixing table.

Description

Technical Field

[0001] The invention relates to a crystal bonding machine, in particular to a high-precision universal crystal bonding machine. Background Art

[0002] A die bonder is a device used to remove chips from a wafer and place them at a specified location on a substrate for heating and curing.

[0003] Currently, die bonding machines are divided into two categories: dedicated and general-purpose. Dedicated die bonding machines are suitable for specific types of chip and substrate combinations, and are optimized for specific types of chips and substrates, with higher positioning accuracy. General-purpose die bonding machines can be used for a variety of chip and substrate combinations, but because they are not optimized for specific chips and substrates, their positioning accuracy is poorer than that of dedicated die bonding machines.

[0004] Faced with a volatile market environment, if manufacturers deploy dedicated die-bonding machines for each type of chip and substrate combination, it will result in huge initial costs and difficulty in making a profit; if only general-purpose die-bonding machines are used, it will be difficult to ensure alignment accuracy, product quality cannot be improved, and the company's competitiveness will decline.

[0005] Therefore, how to overcome the above-mentioned defects has become an important issue to be solved urgently by those skilled in the art. Summary of the invention

[0006] The present invention overcomes the deficiencies of the above-mentioned technologies and provides a high-precision universal crystal bonding machine.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] A high-precision universal crystal bonding machine comprises a base 1, on which a replaceable substrate fixture 2, a hollow wafer fixture 3, a crystal bonding table 4 and a chip transfer table 5 are arranged, the substrate fixture 2 and the hollow wafer fixture 3 are distributed on the left and right of the base 1, the crystal bonding table 4 and the chip transfer table 5 are also distributed on the left and right of the base 1, the crystal bonding table 4 is located at the rear side of the substrate fixture 2, and the chip transfer table 5 is located at the rear side of the hollow wafer fixture 3, the substrate fixture 2 can be translated along the X-axis and the Y-axis for placing the substrate, the hollow wafer fixture 3 can be translated along the X-axis and the Y-axis for placing the wafer with the chip, the crystal bonding table 4 is located at the rear side of the substrate fixture 2, and the chip transfer table 5 is located at the rear side of the hollow wafer fixture 3. The table 4 can translate along the X-axis and Y-axis and rotate around the Z-axis to carry the substrate and the chip for crystal bonding. The chip transfer table 5 can translate along the X-axis and Y-axis and rotate around the Z-axis to place the chip waiting for crystal bonding. The base 1 is provided with a first multi-dimensional adaptive correction and transportation device 6 for transferring the substrate between the substrate fixture 2 and the crystal bonding table 4. The base 1 is provided with a second multi-dimensional adaptive correction and transportation device 7 for transferring the chip between the hollow wafer fixture 3 and the chip transfer table 5. The base 1 is provided with a third multi-dimensional adaptive correction and transportation device 8 for transferring the chip between the chip transfer table 5 and the crystal bonding table 4.

[0009] Preferably, the base 1 is provided with a first Y-axis slide 21 , the first Y-axis slide 21 is drivingly connected to a first X-axis slide 22 , and the substrate fixture 2 is detachably connected to the first X-axis slide 22 and driven to translate by the first X-axis slide 22 .

[0010] Preferably, the base 1 is provided with a second Y-axis slide 31 , and the second Y-axis slide 31 is drivingly connected to a second X-axis slide 32 . The hollow wafer fixture 3 is detachably connected to the second X-axis slide 32 and driven to translate by the second X-axis slide 32 .

[0011] Preferably, a third X-axis slide 41 is provided on the base 1, the third X-axis slide 41 is drivingly connected to a third Y-axis slide 42, the third Y-axis slide 42 is drivingly connected to a first Z-axis turntable 43, and the crystal fixing table 4 is detachably connected to the first Z-axis turntable 43 and driven to rotate by the first Z-axis turntable 43.

[0012] Preferably, the base 1 is also provided with a fourth X-axis slide 51, the fourth X-axis slide 51 is drivingly connected to a fourth Y-axis slide 52, the fourth Y-axis slide 52 is drivingly connected to a second Z-axis turntable 53, and the chip transfer table 5 is detachably connected to the second Z-axis turntable 53 and driven to rotate by the second Z-axis turntable 53.

[0013] Preferably, the first multi-dimensional adaptive deviation correction and transfer device 6 includes a first camera 61 and a first light source 62 fixed on the base 1 facing the area where the substrate fixture 2 is located, and the base 1 is provided with a fifth Y-axis slide 63, and the fifth Y-axis slide 63 is drivingly connected to the first Z-axis slide 65, and the first Z-axis slide 65 is drivingly connected to the third Z-axis turntable 66, and the third Z-axis turntable 66 is drivingly connected to the first cross bar 67, and the first cross bar 67 is connected to a first vertical bar 68 extending downward, and the first vertical bar 68 is hinged with a second cross bar 69 extending in the direction of the rotation axis of the third Z-axis turntable 66, and the second cross bar 69 is fixed with a first suction nozzle 610 extending downward for adsorbing the substrate for easy transfer, and a first buffer spring 611 is connected between the first cross bar 67 and the second cross bar 69.

[0014] Preferably, the second multi-dimensional adaptive deviation correction and transfer device 7 includes a second camera 71 and a second light source 72 fixed on the base 1 facing the area where the hollow wafer fixture 3 is located, and the base 1 is provided with a sixth Y-axis slide 73, and the sixth Y-axis slide 73 is driven and connected to the second Z-axis slide 75, and the second Z-axis slide 75 is driven and connected to the fourth Z-axis turntable 76, and the fourth Z-axis turntable 76 is driven and connected to the third cross bar 77, and the third cross bar 77 is connected to a second vertical rod 78 extending downward, and the second vertical rod 78 is hinged with a fourth cross bar 79 extending in the direction of the rotation axis of the fourth Z-axis turntable 76, and a second suction nozzle 710 extending downward for adsorbing chips for easy transportation is fixed on the fourth cross bar 79, and a second buffer spring 711 is connected between the third cross bar 77 and the fourth cross bar 79, and the base 1 is also provided with a chip ejector pin 712 located below the hollow wafer fixture 3 and used to eject the chip in the wafer upward to facilitate the second suction nozzle 710 to suck it.

[0015] Preferably, the third multi-dimensional adaptive deviation correction and transfer device 8 includes a third camera 81 and a fourth camera 82 fixed on the base 1, the third camera 81 faces the chip transfer table 5 area, and the fourth camera 82 faces the solid crystal table 4 area, and a fifth X-axis slide 83 is arranged on the base 1, and the fifth X-axis slide 83 is driven and connected to the third Z-axis slide 84, and the third Z-axis slide 84 is driven and connected to the fifth Z-axis turntable 85, and the fifth Z-axis turntable 85 is driven and connected to the fifth cross bar 86, and the fifth cross bar 86 is connected to the third vertical bar 87 extending downward, and the third vertical bar 87 is hinged with a sixth cross bar 88 extending in the direction of the rotation axis of the fifth Z-axis turntable 85, and the sixth cross bar 88 is fixed with a third suction nozzle 89 extending downward for adsorbing chips for easy transportation, and a third buffer spring 810 is connected between the fifth cross bar 86 and the sixth cross bar 88.

[0016] Preferably, the base 1 is further provided with an ion blower 9 for supplying air to the substrate fixture 2 and the hollow wafer fixture 3 regions.

[0017] Preferably, the substrate fixture 2 is also provided with a plurality of finished product storage positions 23 for placing finished substrates that have completed die bonding.

[0018] Preferably, the first Z-axis slide 65, the third Z-axis turntable 66, the first cross bar 67, the first vertical bar 68, the second cross bar 69, the first buffer spring 611 and the first suction nozzle 610 together form a first flexible multi-dimensional correction component 612, and the fifth Y-axis slide 63 is provided with two groups of first flexible multi-dimensional correction components 612 side by side.

[0019] Preferably, the second Z-axis slide 75, the fourth Z-axis turntable 76, the third cross bar 77, the second vertical bar 78, the fourth cross bar 79, the second buffer spring 711 and the second suction nozzle 710 together form a second flexible multi-dimensional correction component 713, and two groups of second flexible multi-dimensional correction components 713 are arranged side by side on the sixth Y-axis slide 73.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The substrate fixture, hollow wafer fixture solid crystal table and chip transfer table of the solid crystal machine in this case can be replaced according to different types of chips and substrates, which can ensure the versatility of the solid crystal machine in this case. At the same time, the substrate fixture, hollow wafer fixture solid crystal table and chip transfer table can also adjust their own positions through translation in the X-axis and Y-axis directions or rotation in the Z-axis direction to improve the alignment accuracy of the chip and the substrate. In addition, the first multi-dimensional adaptive deviation correction and transportation device, the second multi-dimensional adaptive deviation correction and transportation device and the third multi-dimensional adaptive deviation correction and transportation device used to transport substrates and chips can correct the transported objects after the transported objects are taken out and before the transported objects are taken out to ensure the accurate alignment of the chips and substrates. Moreover, compared with the prior art, which only corrects the substrate and chip once in the entire process of solid crystal, the solid crystal machine in this case corrects the substrate and chip each time they are transported, which can ensure that each movement of the substrate and chip is accurately aligned, thereby achieving high-precision alignment of the chip and substrate while maintaining universality.

[0022] 2. The die bonding machine in this case distributes the substrate fixture, hollow wafer fixture, die bonding table and chip transfer table at the four vertices of a square. This allows the three multi-dimensional adaptive deviation correction and transfer devices to simultaneously transfer the substrate and chip without interfering with each other. In addition, the transfer path can be shortened while ensuring that the transfer actions do not interfere with each other, thereby improving the transfer efficiency and reducing the footprint of the die bonding machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the high-precision universal die bonding machine in this case.

[0024] Figure 2 It is a schematic diagram of the substrate fixture, the crystal bonding table and the first multi-dimensional adaptive deviation correction and transfer device in this case.

[0025] Figure 3 It is a schematic diagram of the hollow wafer fixture, chip transfer table and the second multi-dimensional adaptive correction and transfer device in this case.

[0026] Figure 4 It is a schematic diagram of the chip transfer station, crystal bonding station and the third multi-dimensional adaptive deviation correction and transportation device in this case.

[0027] Figure 5 It is a schematic diagram of the first multi-dimensional adaptive deviation correction and transfer device in this case.

[0028] Figure 6 It is a schematic diagram of the second multi-dimensional adaptive deviation correction and transfer device in this case.

[0029] Figure 7 It is a schematic diagram of the third multi-dimensional adaptive deviation-correcting and transporting device in this case.

[0030] Figure 8 It is a schematic diagram of the crystal bonding station in this case.

[0031] Fig. 9 This is a schematic diagram of the chip transfer station in this case.

[0032] Fig.10 This case Figure 5 A partial enlarged schematic diagram of .

[0033] Fig.11 This case Figure 6 A partial enlarged schematic diagram of .

[0034] Fig.12 This case Figure 7 A partial enlarged schematic diagram of . DETAILED DESCRIPTION

[0035] The features of the present invention and other related features are further described in detail below through embodiments to facilitate understanding by those skilled in the art:

[0036] like Figures 1 to 12As shown, a high-precision universal crystal bonding machine comprises a base 1, on which a replaceable substrate fixture 2, a hollow wafer fixture 3, a crystal bonding table 4 and a chip transfer table 5 are arranged, the substrate fixture 2 and the hollow wafer fixture 3 are distributed on the left and right of the base 1, the crystal bonding table 4 and the chip transfer table 5 are also distributed on the left and right of the base 1, the crystal bonding table 4 is located at the rear side of the substrate fixture 2, and the chip transfer table 5 is located at the rear side of the hollow wafer fixture 3, the substrate fixture 2 can be translated along the X-axis and the Y-axis for placing the substrate, the hollow wafer fixture 3 can be translated along the X-axis and the Y-axis for placing the wafer with the chip, the crystal bonding table 4 and the chip transfer table 5 are also distributed on the left and right of the base 1, the crystal bonding table 4 is located at the rear side of the substrate fixture 2, and the chip transfer table 5 is located at the rear side of the hollow wafer fixture 3. The crystal table 4 can translate along the X-axis and Y-axis and rotate around the Z-axis to carry the substrate and the chip for crystal bonding. The chip transfer table 5 can translate along the X-axis and Y-axis and rotate around the Z-axis to place the chip waiting for crystal bonding. The base 1 is provided with a first multi-dimensional adaptive deflection correction and transportation device 6 for transferring the substrate between the substrate fixture 2 and the crystal bonding table 4. The base 1 is provided with a second multi-dimensional adaptive deflection correction and transportation device 7 for transferring the chip between the hollow wafer fixture 3 and the chip transfer table 5. The base 1 is provided with a third multi-dimensional adaptive deflection correction and transportation device 8 for transferring the chip between the chip transfer table 5 and the crystal bonding table 4.

[0037] The base 1 of the crystal bonding machine in this case is distributed with a substrate fixture 2, a hollow wafer fixture 3, a crystal bonding table 4 and a chip transfer table 5. These carriers can be replaced according to the models of the chips and substrates to be bonded, so as to be compatible with different combinations of chips and substrates. When the crystal bonding machine in this case is working, the substrate fixture 2 adjusts the position of the substrate to be transferred by translation of the X-axis and the Y-axis, so that the first multi-dimensional adaptive correction and transfer device 6 can accurately take out the substrate to be transferred from the substrate fixture 2. And the first multi-dimensional adaptive correction and transfer device 6 can correct the substrate after taking out the substrate according to the posture of the substrate on the substrate fixture 2 while transferring the substrate, so as to ensure that the substrate is accurately aligned when it is placed on the crystal bonding table 4. Similarly, the hollow wafer fixture 3 can also adjust the position of the chip to be transferred by translation of the X-axis and the Y-axis, so that the second multi-dimensional adaptive correction and transfer device 7 can accurately take out the chip. Correspondingly, the second multi-dimensional adaptive deflection correction and transportation device 7 can also correct the chip after taking out the chip according to the posture of the chip before it is taken out, so as to ensure that the chip is accurately aligned when it is placed on the chip transfer table 5. When the substrate is placed on the crystal bonding table 4, the crystal bonding table 4 will begin to heat up, and then the third multi-dimensional adaptive deflection correction and transportation device 8 will operate to transfer the chip on the chip transfer table 5 to the substrate of the crystal bonding table 4 for crystal bonding. When transporting the chip, the third multi-dimensional adaptive deflection correction and transportation device 8 will also correct the chip again after taking out the chip according to the posture of the chip on the chip transfer table 5, so as to eliminate the slight offset of the chip when it is placed on the chip transfer table 5. At the same time, the crystal bonding table 4 and the chip transfer table 5 can also adjust the position of the chip and the substrate by translation in the X-axis and Y-axis directions and rotation in the Z-axis direction, so as to cooperate with the third multi-dimensional adaptive deflection correction and transportation device 8 to complete the precise alignment of the chip and the substrate.

[0038] As mentioned above, the substrate fixture 2, hollow wafer fixture 3, solid crystal table 4 and chip transfer table 5 of the solid crystal machine in this case can be replaced according to different types of chips and substrates, so that the versatility of the solid crystal machine in this case can be guaranteed. At the same time, the plate fixture 2, hollow wafer fixture 3, solid crystal table 4 and chip transfer table 5 can also adjust their own positions through translation in the X-axis and Y-axis directions or rotation in the Z-axis direction to improve the alignment accuracy of the chip and the substrate. In addition, the first multi-dimensional adaptive deviation correction and transportation device 6, the second multi-dimensional adaptive deviation correction and transportation device 7 and the third multi-dimensional adaptive deviation correction and transportation device 8 used to transport substrates and chips can all correct the transported objects after the transported objects are taken out and before the transported objects are taken out to ensure the accurate alignment of the chips and substrates. Moreover, compared with the prior art, which only corrects the substrate and chip once in the entire process of solid crystal, the solid crystal machine in this case corrects the substrate and chip each time they are transported, so that each movement of the substrate and the chip is accurately aligned, thereby maintaining universality while achieving high-precision alignment of the chip and the substrate.

[0039] In addition, the substrate fixture 2, hollow wafer fixture 3, crystal fixing table 4 and chip transfer table 5 of the crystal fixing machine in this case are distributed on the base 1 in a left-right and front-back manner, so that the substrate fixture 2, hollow wafer fixture 3, crystal fixing table 4 and chip transfer table 5 form a square on the base 1, and the substrate fixture 2, hollow wafer fixture 3, crystal fixing table 4 and chip transfer table 5 are respectively located at the four vertices of the square. A first multi-dimensional adaptive deflection correction and transportation device 6 is provided between the substrate fixture 2 and the crystal fixing table 4 for transferring the substrate back and forth, a second multi-dimensional adaptive deflection correction and transportation device 7 is provided between the hollow wafer fixture 3 and the chip transfer table 5 for transferring the chip, and a third multi-dimensional adaptive deflection correction and transportation device 8 is provided between the chip transfer table 5 and the crystal fixing table 4 for transferring the chip. In this way, the crystal bonding machine in this case distributes the substrate fixture 2, hollow wafer fixture 3, crystal bonding table 4 and chip transfer table 5 at the four vertices of the square. This allows the three multi-dimensional adaptive correction and transfer devices to simultaneously transfer the substrate and the chip without interfering with each other. In addition, the transfer path can be shortened while ensuring that the transfer actions do not interfere with each other, thereby improving the transfer efficiency and reducing the footprint of the crystal bonding machine.

[0040] like Figure 1 , Figure 2 As shown, preferably, a first Y-axis slide 21 is provided on the base 1, and the first Y-axis slide 21 is driven and connected to a first X-axis slide 22, and the substrate fixture 2 is detachably connected to the first X-axis slide 22 and driven to translate by the first X-axis slide 22. In this way, the substrate fixture 2 can be driven to translate along the X-axis direction by the first X-axis slide 22, and the first Y-axis slide 21 can indirectly drive the substrate fixture 2 to translate along the Y-axis direction by driving the first X-axis slide 22 to translate along the Y-axis direction. In this way, the translation action of the substrate fixture 2 in the X-axis and Y-axis directions can be realized through the cooperation of the first Y-axis slide 21 and the first X-axis slide 22, so that the substrate fixture 2 can adjust the position of the substrate and cooperate with the first multi-dimensional adaptive deviation correction and transfer device 6 to transport the substrate.

[0041] like Figure 1 , Figure 3 As shown, preferably, a second Y-axis slide 31 is provided on the base 1, and the second Y-axis slide 31 is driven and connected to the second X-axis slide 32. The hollow wafer fixture 3 is detachably connected to the second X-axis slide 32 and driven to translate by the second X-axis slide 32. In this way, the second X-axis slide 32 can drive the hollow wafer fixture 3 to translate along the X-axis direction, and the second Y-axis slide 31 can indirectly drive the hollow wafer fixture 3 to translate along the Y-axis direction by driving the second X-axis slide 32 to translate along the Y-axis direction. In this way, the second Y-axis slide 31 and the second X-axis slide 32 can cooperate to realize the translation action of the hollow wafer fixture 3 in the X-axis and Y-axis directions, so that the hollow wafer fixture 3 can adjust the position of the chip and cooperate with the second multi-dimensional adaptive deviation correction and transportation device 7 to transport the chip.

[0042] like Figure 1 , Figure 2 , Figure 4 , Figure 8 As shown, preferably, a third X-axis slide 41 is provided on the base 1, and the third X-axis slide 41 is driven and connected to a third Y-axis slide 42, and the third Y-axis slide 42 is driven and connected to a first Z-axis turntable 43, and the crystal fixing table 4 is detachably connected to the first Z-axis turntable 43 and driven to rotate by the first Z-axis turntable 43, so that the third Y-axis slide 42 can be driven to translate along the X-axis direction through the third X-axis slide 41, and the first Z-axis turntable 43 can be driven to translate along the Y-axis direction through the third Y-axis slide 42, and at the same time, the third X-axis slide 41 can also indirectly drive the first Z-axis turntable 43 to translate along the X-axis direction, thereby realizing the translation of the first Z-axis turntable 43 along the X-axis and Y-axis directions. The crystal fixing table 4 is installed on the first Z-axis turntable 43 and can be driven by the first Z-axis turntable 43 to rotate around the Z-axis. In this way, the crystal fixing table 4 can adjust its own position through translation in the X-axis and Y-axis directions and rotation around the Z-axis direction so as to more accurately receive the substrate sent out by the first multi-dimensional adaptive deflection correction and transportation device 6. At the same time, the position of the substrate can also be adjusted so that the substrate can more accurately receive the chip sent out by the third multi-dimensional adaptive deflection correction and transportation device 8.

[0043] like Figure 1 , Figure 3 , Figure 4 , Fig. 9 As shown, preferably, a fourth X-axis slide 51 is further provided on the base 1, and the fourth X-axis slide 51 is driven and connected to a fourth Y-axis slide 52, and the fourth Y-axis slide 52 is driven and connected to a second Z-axis turntable 53, and the chip turntable 5 is detachably connected to the second Z-axis turntable 53 and driven to rotate by the second Z-axis turntable 53, so that the fourth X-axis slide 51 can drive the fourth Y-axis slide 52 to translate in the X-axis direction, and the fourth Y-axis slide 52 can drive the second Z-axis turntable 53 to translate in the Y-axis direction, and at the same time, the fourth X-axis slide 51 can also indirectly drive the second Z-axis turntable 53 to translate in the X-axis direction, thereby realizing the translation of the second Z-axis turntable 53 along the X-axis and Y-axis directions. The chip transfer table 5 is installed on the second Z-axis turntable 53 and can be driven by the second Z-axis turntable 53 to rotate around the Z-axis. In this way, the chip transfer table 5 can adjust its own position through translation in the X-axis and Y-axis directions and rotation around the Z-axis direction so as to more accurately receive the chip sent by the second multi-dimensional adaptive deflection correction and transportation device 7. At the same time, the position of the chip can also be adjusted so that the third multi-dimensional adaptive deflection correction and transportation device 8 can take away the chip more accurately.

[0044] like Figure 1 , Figure 2 , Figure 5 , Fig.10As shown, preferably, the first multi-dimensional adaptive deviation correction and transfer device 6 includes a first camera 61 and a first light source 62 fixed on the base 1 facing the area where the substrate fixture 2 is located, and the base 1 is provided with a fifth Y-axis slide 63, and the fifth Y-axis slide 63 is driven and connected to the first Z-axis slide 65, and the first Z-axis slide 65 is driven and connected to the third Z-axis turntable 66, and the third Z-axis turntable 66 is driven and connected to the first cross bar 67, and the first cross bar 67 is connected to a first vertical bar 68 extending downward, and the first vertical bar 68 is hinged with a second cross bar 69 extending in the direction of the rotation axis of the third Z-axis turntable 66, and the second cross bar 69 is fixed with a first suction nozzle 610 extending downward for adsorbing the substrate for easy transfer, and a first buffer spring 611 is connected between the first cross bar 67 and the second cross bar 69.

[0045] As described above, the first multi-dimensional adaptive deviation correction and transfer device 6 in this case includes a first camera 61 and a first light source 62 facing the substrate fixture 2, so that the substrate image information on the substrate fixture 2 can be obtained through the first camera 61, and the specific position and offset of the substrate can be determined through image recognition. At the same time, a fifth Y-axis slide 63 is also provided on the base 1, and the first Z-axis slide 65 can be driven to translate along the Y-axis direction through the fifth Y-axis slide 63, and the third Z-axis turntable 66 can be driven to translate up and down along the Z-axis through the first Z-axis slide 65. The third Z-axis turntable 66 is connected to the first suction nozzle 610 through the first cross bar 67, the first vertical bar 68 and the second cross bar 69, so that the first suction nozzle 610 can be rotated through the third Z-axis turntable 66, and when the first suction nozzle 610 is adsorbed with a substrate, the angle of the substrate can be changed and adjusted to correct it. The first Z-axis slide 65 can also indirectly drive the first suction nozzle 610 to move up and down along the Z-axis direction to facilitate lifting and lowering the substrate, and the fifth Y-axis slide 63 can indirectly drive the first suction nozzle 610 to translate along the Y-axis direction to realize the transfer of the substrate. In addition, since the first crossbar 67 and the second crossbar 69 are connected by the first buffer spring 611, when the first suction nozzle 610 contacts the substrate, the first buffer spring 611 can change the distance between the first crossbar 67 and the second crossbar 69 for buffering, thereby preventing the first suction nozzle 610 from hard contact with the substrate to damage the substrate and change the posture of the substrate. In this way, according to the image recognition result of the first camera 61, the first multi-dimensional adaptive deviation correction and transfer device 6 can move the first suction nozzle 610 to the substrate of the substrate fixture 2 through the fifth Y-axis slide 63 and the first Z-axis slide 65, and lift the substrate through the first suction nozzle 610, and then use the first suction nozzle 610 to rotate around the Z-axis to adjust the angle of the substrate to the correct position, and finally move the first suction nozzle 610 to the crystal bonding table 4 again through the fifth Y-axis slide 63 and the first Z-axis slide 65 and place the substrate into the crystal bonding table 4 to complete the transfer of the substrate.

[0046] like Figure 1 , Figure 2 As shown, specifically, the substrate fixture 2 and the crystal bonding table 4 are distributed at two ends of the fifth Y-axis slide table 63 .

[0047] like Figure 1 , Figure 3 , Figure 6 , Fig.11 As shown, preferably, the second multi-dimensional adaptive deviation correction and transfer device 7 includes a second camera 71 and a second light source 72 fixed on the base 1 facing the area where the hollow wafer fixture 3 is located, and the base 1 is provided with a sixth Y-axis slide 73, and the sixth Y-axis slide 73 is driven and connected to the second Z-axis slide 75, and the second Z-axis slide 75 is driven and connected to the fourth Z-axis turntable 76, and the fourth Z-axis turntable 76 is driven and connected to the third cross bar 77, and the third cross bar 77 is connected to a second vertical rod 78 extending downward, and the second vertical rod 78 is hinged with a fourth cross bar 79 extending in the direction of the rotation axis of the fourth Z-axis turntable 76, and the fourth cross bar 79 is fixed with a second suction nozzle 710 extending downward for adsorbing chips for easy transportation, and a second buffer spring 711 is connected between the third cross bar 77 and the fourth cross bar 79, and the base 1 is also provided with a chip ejector pin 712 located below the hollow wafer fixture 3 for ejecting the chip in the wafer upward to facilitate the second suction nozzle 710 to suck it.

[0048] As described above, the second multi-dimensional adaptive deviation correction and transportation device 7 of this case includes a chip ejector pin 712 located below the hollow wafer fixture 3. The hollow wafer fixture 3 can move the chip to be transported above the chip ejector pin 712 by translation in the X-axis and Y-axis directions, and the chip in the wafer on the hollow wafer fixture 3 can be ejected with the help of the chip ejector pin 712. In addition, the base 1 is also provided with a second camera 71 and a second light source 72 facing the hollow wafer fixture 3, so that the chip image information on the hollow wafer fixture 3 can be obtained through the second camera 71, and the specific position and offset of the chip can be determined through image recognition. At the same time, the base 1 is also provided with a sixth Y-axis slide 73, through which the second Z-axis slide 75 can be driven to translate along the Y-axis direction, and through the second Z-axis slide 75, the fourth Z-axis turntable 76 can be driven to translate up and down along the Z-axis, and the fourth Z-axis turntable 76 is connected to the second suction nozzle 710 through the third crossbar 77, the second vertical rod 78 and the fourth crossbar 79, so that the second suction nozzle 710 can be rotated by the fourth Z-axis turntable 76, and when a chip is adsorbed on the second suction nozzle 710, the angle of the chip can be changed and adjusted. The second Z-axis slide 75 can also indirectly drive the second suction nozzle 710 to move up and down along the Z-axis direction to facilitate the lifting and lowering of the chip, and the sixth Y-axis slide 73 can indirectly drive the second suction nozzle 710 to translate along the Y-axis direction to realize the transportation of the chip. In addition, since the third cross bar 77 and the fourth cross bar 79 are connected by the second buffer spring 711, when the second suction nozzle 710 contacts the chip, the distance between the third cross bar 77 and the fourth cross bar 79 can be changed by the second buffer spring 711 for buffering, so as to avoid the second suction nozzle 710 from hard contact with the chip to damage the chip and change the chip's posture. In this way, according to the image recognition result of the second camera 71, the second multi-dimensional adaptive deviation correction and transportation device 7 can move the second suction nozzle 710 to the chip of the hollow wafer fixture 3 through the sixth Y-axis slide 73 and the second Z-axis slide 75, and lift the chip through the second suction nozzle 710, and then use the second suction nozzle 710 to rotate around the Z axis to adjust the chip angle to the accurate position, and finally move the second suction nozzle 710 to the chip transfer table 5 again through the sixth Y-axis slide 73 and the second Z-axis slide 75 and put the chip into the chip transfer table 5 to complete the transfer of the chip.

[0049] like Figure 1 , Figure 3 As shown, specifically, the chip transfer table 5 is distributed at both ends of the sixth Y-axis slide table 73 .

[0050] like Figure 1 , Figure 4 , Figure 7 , Fig.12As shown, preferably, the third multi-dimensional adaptive deviation correction and transfer device 8 includes a third camera 81 and a fourth camera 82 fixed on the base 1, the third camera 81 faces the chip transfer table 5 area, and the fourth camera 82 faces the solid crystal table 4 area, and a fifth X-axis slide 83 is arranged on the base 1, and the fifth X-axis slide 83 is driven and connected to the third Z-axis slide 84, and the third Z-axis slide 84 is driven and connected to the fifth Z-axis turntable 85, and the fifth Z-axis turntable 85 is driven and connected to the fifth cross bar 86, and the fifth cross bar 86 is connected to the third vertical bar 87 extending downward, and the third vertical bar 87 is hinged with a sixth cross bar 88 extending in the direction of the rotation axis of the fifth Z-axis turntable 85, and the sixth cross bar 88 is fixed with a third suction nozzle 89 extending downward for adsorbing chips for easy transportation, and a third buffer spring 810 is connected between the fifth cross bar 86 and the sixth cross bar 88.

[0051] As described above, the third multi-dimensional adaptive deviation correction and transfer device 8 of this case includes a third camera 81 facing the chip transfer table 5 and a fourth camera 82 facing the solid crystal table 4, so that the image information of the chip on the chip transfer table 5 can be obtained through the third camera 81, and the image information of the substrate on the solid crystal table 4 can be obtained through the fourth camera 82. Through image recognition, the specific position and offset of the chip and substrate to be solidified can be determined. At the same time, the base 1 is also provided with a fifth X-axis slide 83, through which the third Z-axis slide 84 can be driven to translate along the X-axis direction, and the third Z-axis slide 84 can drive the fifth Z-axis turntable 85 to translate up and down along the Z-axis. The fifth Z-axis turntable 85 is connected to the third suction nozzle 89 through the fifth crossbar 86, the third vertical rod 87, and the sixth crossbar 88, so that the third suction nozzle 89 can be rotated by the fifth Z-axis turntable 85, and when a chip is adsorbed on the third suction nozzle 89, the angle of the chip can be adjusted and corrected. In this way, the third suction nozzle 89 can be indirectly driven to move up and down along the Z axis through the third Z-axis slide 84 to lift and put down the chip, and the third suction nozzle 89 can be indirectly driven to translate along the X-axis direction through the fifth X-axis slide 83 to realize the transportation of the chip. In addition, since the fifth crossbar 86 and the sixth crossbar 88 are connected by the third buffer spring 810, the third suction nozzle 89 can also change the distance between the fifth crossbar 86 and the sixth crossbar 88 through the third buffer spring 810 when contacting the chip to buffer, so as to avoid the third suction nozzle 89 from hard contact with the chip to damage the chip and change the chip's posture. In this way, according to the image recognition results of the third camera 81 and the fourth camera 82, the third multi-dimensional adaptive deviation correction and transportation device 8 can be used to transfer the chip from the chip transfer table 5 to the substrate of the crystal fixing table 4 through the five X-axis slides 83 and the third Z-axis slide 84 in cooperation with the third suction nozzle 89 to fix the crystal, and at the same time, the angle of the chip is adjusted and corrected through the fifth Z-axis turntable 85 to ensure accurate alignment between the substrate and the chip for crystal fixing.

[0052] like Figure 1 , Figure 4 As shown, specifically, the chip transfer table 5 and the crystal bonding table 4 are distributed at both ends of the fifth X-axis slide table 83 .

[0053] like Figures 1 to 3 As shown, preferably, the base 1 is also provided with an ion blower 9 for supplying air to the substrate fixture 2 and the hollow wafer fixture 3. In this way, the static electricity near the substrate and the chip can be effectively removed by the ion blower 9, thereby reducing the probability of components being damaged by static electricity and improving the yield rate of solid crystal.

[0054] like Figure 1 to Figure 2 As shown, preferably, the substrate fixture 2 is also provided with a plurality of finished product storage positions 23 for placing finished substrates that have completed die bonding.

[0055] As described above, the substrate fixture 2 is also provided with a finished product storage position 23 for placing finished substrates that have completed crystal bonding. In addition to transferring the substrates to be crystal bonded on the substrate fixture 2 to the crystal bonding table 4, the first multi-dimensional adaptive deviation correction and transfer device 6 can also transfer the finished substrates that have completed crystal bonding on the crystal bonding table 4 to the finished product storage position 23 to wait for being taken out, thereby improving the circulation efficiency of the substrates in the crystal bonding machine in this case.

[0056] like Figure 1 , Figure 2 , Figure 5 As shown, preferably, the first Z-axis slide 65, the third Z-axis turntable 66, the first cross bar 67, the first vertical bar 68, the second cross bar 69, the first buffer spring 611 and the first suction nozzle 610 together form a first flexible multi-dimensional correction component 612, and the fifth Y-axis slide 63 is provided with two groups of first flexible multi-dimensional correction components 612 side by side. In this way, by setting up two groups of first flexible multi-dimensional correction components 612, two substrates can be transferred synchronously during a back-and-forth process between the substrate fixture 2 and the solid crystal table 4, without completing the transfer of one substrate before transferring the other substrate, thereby improving the circulation efficiency.

[0057] like Figure 1 , Figure 3 , Figure 6 As shown, preferably, the second Z-axis slide 75, the fourth Z-axis turntable 76, the third cross bar 77, the second vertical bar 78, the fourth cross bar 79, the second buffer spring 711 and the second suction nozzle 710 together form a second flexible multi-dimensional correction component 713, and two groups of second flexible multi-dimensional correction components 713 are arranged side by side on the sixth Y-axis slide 73. In this way, by setting up two groups of second flexible multi-dimensional correction components 713, two chips can be transferred synchronously during a back-and-forth process between the hollow wafer fixture 3 and the chip transfer table 5, without having to complete the transfer of one chip before transferring another chip, thereby improving the circulation efficiency.

[0058] As mentioned above, this case protects a high-precision general-purpose crystal bonding machine, and all technical solutions that are the same or similar to this case should be deemed to fall within the scope of protection of this case.

Claims

1. A high-precision universal die bonding machine, characterized in that The invention comprises a base (1), wherein a replaceable substrate fixture (2), a hollow wafer fixture (3), a crystal fixing table (4) and a chip transfer table (5) are arranged on the base (1); the substrate fixture (2) and the hollow wafer fixture (3) are distributed on the left and right of the base (1); the crystal fixing table (4) and the chip transfer table (5) are also distributed on the left and right of the base (1); the crystal fixing table (4) is located at the rear side of the substrate fixture (2); the chip transfer table (5) is located at the rear side of the hollow wafer fixture (3); the substrate fixture (2) can be translated along the X-axis and the Y-axis for placing a substrate; the hollow wafer fixture (3) can be translated along the X-axis and the Y-axis for placing a wafer with a chip; the crystal fixing table (4) is located at the rear side of the hollow wafer fixture (3); 4) capable of translating along the X-axis and the Y-axis and rotating around the Z-axis for carrying the substrate and the chip for crystal bonding, the chip transfer table (5) capable of translating along the X-axis and the Y-axis and rotating around the Z-axis for placing the chip waiting for crystal bonding, the base (1) is provided with a first multi-dimensional adaptive deviation correction and transportation device (6) for transferring the substrate between the substrate fixture (2) and the crystal bonding table (4), the base (1) is provided with a second multi-dimensional adaptive deviation correction and transportation device (7) for transferring the chip between the hollow wafer fixture (3) and the chip transfer table (5), and the base (1) is provided with a third multi-dimensional adaptive deviation correction and transportation device (8) for transferring the chip between the chip transfer table (5) and the crystal bonding table (4).

2. A high-precision universal die bonding machine according to claim 1, characterized in that The base (1) is provided with a first Y-axis slide (21), the first Y-axis slide (21) is drivingly connected to a first X-axis slide (22), and the substrate fixture (2) is detachably connected to the first X-axis slide (22) and driven to translate by the first X-axis slide (22); The base (1) is provided with a second Y-axis slide (31), the second Y-axis slide (31) is drivingly connected to a second X-axis slide (32), and the hollow wafer fixture (3) is detachably connected to the second X-axis slide (32) and driven to translate by the second X-axis slide (32).

3. A high-precision universal die bonding machine according to claim 1, characterized in that The base (1) is provided with a third X-axis slide (41), the third X-axis slide (41) is drivingly connected to a third Y-axis slide (42), the third Y-axis slide (42) is drivingly connected to a first Z-axis turntable (43), and the crystal fixing table (4) is detachably connected to the first Z-axis turntable (43) and driven to rotate by the first Z-axis turntable (43); The base (1) is also provided with a fourth X-axis slide (51), the fourth X-axis slide (51) is drivingly connected to a fourth Y-axis slide (52), the fourth Y-axis slide (52) is drivingly connected to a second Z-axis turntable (53), and the chip transfer table (5) is detachably connected to the second Z-axis turntable (53) and driven to rotate by the second Z-axis turntable (53).

4. A high-precision universal die bonding machine according to any one of claims 1 or 2, characterized in that The first multi-dimensional adaptive deviation correction and transfer device (6) comprises a first camera (61) and a first light source (62) fixed on the base (1) and facing the area where the substrate fixture (2) is located; the base (1) is provided with a fifth Y-axis slide (63); the fifth Y-axis slide (63) is drivingly connected to a first Z-axis slide (65); the first Z-axis slide (65) is drivingly connected to a third Z-axis turntable (66); the third Z-axis turntable (66) is drivingly connected to a first cross bar (67); the first cross bar (67) is connected to a first vertical bar (68) extending downward; the first vertical bar (68) is hinged with a second cross bar (69) extending in the direction of the rotation axis of the third Z-axis turntable (66); the second cross bar (69) is fixed with a first suction nozzle (610) extending downward for adsorbing the substrate for easy transfer; a first buffer spring (611) is connected between the first cross bar (67) and the second cross bar (69).

5. A high-precision universal die bonding machine according to claim 1 or 2, characterized in that The second multi-dimensional adaptive deviation correction and transfer device (7) comprises a second camera (71) and a second light source (72) fixed on the base (1) and facing the area where the hollow wafer fixture (3) is located; the base (1) is provided with a sixth Y-axis slide (73); the sixth Y-axis slide (73) is drivably connected to a second Z-axis slide (75); the second Z-axis slide (75) is drivably connected to a fourth Z-axis turntable (76); the fourth Z-axis turntable (76) is drivably connected to a third crossbar (77); the third crossbar (77) is connected to a downwardly extending A second vertical rod (78), a fourth horizontal rod (79) extending in the direction of the rotation axis of the fourth Z-axis turntable (76) is hinged on the second vertical rod (78), a second suction nozzle (710) extending downward and used for adsorbing chips for easy transportation is fixed on the fourth horizontal rod (79), a second buffer spring (711) is connected between the third horizontal rod (77) and the fourth horizontal rod (79), and the base (1) is also provided with a chip ejector pin (712) located below the hollow wafer fixture (3) and used for ejecting the chip in the wafer upward to facilitate the second suction nozzle (710) to suck it.

6. A high-precision universal die bonder according to any one of claims 1 or 3, characterized in that The third multi-dimensional self-adaptive deviation-correcting and transporting device (8) comprises a third camera (81) and a fourth camera (82) fixed on the base (1), the third camera (81) faces the chip transfer table (5) area, the fourth camera (82) faces the crystal bonding table (4) area, a fifth X-axis slide (83) is arranged on the base (1), the fifth X-axis slide (83) is drivingly connected to a third Z-axis slide (84), and the third Z-axis slide (84) is drivingly connected to a fifth Z-axis turntable (85 ), the fifth Z-axis turntable (85) is drivenly connected to a fifth crossbar (86), the fifth crossbar (86) is connected to a third vertical bar (87) extending downward, the third vertical bar (87) is hinged with a sixth crossbar (88) extending in the direction of the rotation axis of the fifth Z-axis turntable (85), the sixth crossbar (88) is fixed with a third suction nozzle (89) extending downward for adsorbing chips for easy transportation, and a third buffer spring (810) is connected between the fifth crossbar (86) and the sixth crossbar (88).

7. A high-precision universal die bonding machine according to claim 1, characterized in that The base (1) is also provided with an ion blower (9) for supplying air to the substrate fixture (2) and the hollow wafer fixture (3) regions.

8. The high-precision universal die bonding machine according to claim 1, characterized in that The substrate fixture (2) is also provided with a plurality of finished product storage positions (23) for placing finished substrates that have completed crystal bonding.

9. A high-precision universal die bonding machine according to claim 4, characterized in that The first Z-axis slide (65), the third Z-axis turntable (66), the first cross bar (67), the first vertical bar (68), the second cross bar (69), the first buffer spring (611) and the first suction nozzle (610) together form a first flexible multi-dimensional deviation correction component (612), and the fifth Y-axis slide (63) is provided with two groups of first flexible multi-dimensional deviation correction components (612) arranged side by side.

10. The high-precision universal die bonding machine according to claim 5, characterized in that The second Z-axis slide (75), the fourth Z-axis turntable (76), the third cross bar (77), the second vertical bar (78), the fourth cross bar (79), the second buffer spring (711) and the second suction nozzle (710) together form a second flexible multi-dimensional deviation correction component (713), and two groups of second flexible multi-dimensional deviation correction components (713) are arranged side by side on the sixth Y-axis slide (73).

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