Substrate carrier and preparation method thereof

Abstract

The invention relates to a substrate carrier and a preparation method thereof. The substrate carrier comprises a carrier body; the number of the bearing table bodies is at least one, the bearing table bodies are formed on the carrier body, the bearing table bodies extend in the first direction, the bearing table bodies are used for containing a to-be-prepared substrate, and the first projection area of the to-be-prepared substrate in the first direction is not equal to the second projection area of the carrier body in the first direction; and positioning bodies, the positioning bodies and the bearing table bodies are arranged in a one-to-one correspondence manner, each positioning body comprises a plurality of positioning parts, the plurality of positioning parts are respectively formed on the carrier body and extend along the first direction, and the plurality of positioning parts are uniformly arranged at intervals along the edges of the corresponding bearing table bodies, so that a substrate to be prepared is limited on the bearing table bodies. The compatibility and the universality of the processing equipment are improved, the substrate to be prepared is more convenient to take and place, more operation space is reserved for the processing equipment, and the processing equipment is more convenient to use.

Description

Technical Field

[0001] The present application relates to the field of substrate processing, and in particular to a substrate carrier and a preparation method thereof. Background Art

[0002] The substrate stage of the processing equipment plays a vital role. It not only ensures the stability and accuracy of the substrate during the processing, but also ensures the smooth progress of the processing and the quality of the final product. In order to ensure that the pattern or device on the substrate can be accurately aligned with the corresponding part on the processing equipment, the substrate stage is usually equipped with a precise positioning and alignment system. Since the positioning and alignment system can only position and align substrates of corresponding sizes, it is impossible to position and align substrates of mismatched sizes when placed on the stage. If substrates of various sizes are to be processed, the corresponding equipment needs to be customized, which increases the production cost. Summary of the invention

[0003] In order to solve the above technical problems, an embodiment of the present application provides a substrate carrier and a method for preparing the same.

[0004] In a first aspect, the substrate carrier provided by the embodiment of the present application includes:

[0005] Vehicle body;

[0006] There is at least one carrying platform, and each of the carrying platforms is formed on the carrier body, and each of the carrying platforms extends along a first direction, and the carrying platform is used to accommodate a substrate to be prepared, and a first projection area of ​​the substrate to be prepared in the first direction is not equal to a second projection area of ​​the carrier body in the first direction; and

[0007] A positioning body, wherein the positioning body is arranged in one-to-one correspondence with the carrier body, each of the positioning bodies comprises a plurality of positioning parts, the plurality of positioning parts are respectively formed on the carrier body and extend along the first direction, and the plurality of positioning parts are evenly spaced along the edge of the corresponding carrier body to limit the substrate to be prepared on the carrier body.

[0008] In some embodiments, the length of each of the positioning portions in the first direction is respectively greater than the length of the supporting platform in the first direction.

[0009] In some embodiments, the lengths of the positioning portions in the first direction are equal.

[0010] In some embodiments, the sum of the length of the positioning portion in the first direction and the length of the supporting platform in the first direction is greater than or equal to the length of the substrate to be prepared in the first direction.

[0011] In some embodiments, each of the positioning bodies includes at least three positioning portions.

[0012] In some embodiments, the first projection is located within the second projection.

[0013] In a second aspect, a method for preparing a substrate carrier provided in an embodiment of the present application includes:

[0014] forming a first pattern structure covering the upper surface of the carrier body, so that the upper surface of the carrier body includes a first portion, and the first portion is not covered by the first pattern structure;

[0015] Etching the first portion to form a supporting platform;

[0016] forming a second pattern structure covering the upper surface of the carrier body and the surface of the carrier platform, so that the upper surface of the carrier body includes a second portion, and the second portion is not covered by the second pattern structure;

[0017] A positioning body is formed at the second portion, and the positioning body includes a plurality of positioning portions evenly spaced along the edge of the supporting platform.

[0018] In some embodiments, forming a positioning body at the second site includes:

[0019] forming a first metal layer, the first metal layer comprising a first metal portion covering the second pattern structure and a second metal portion covering the second portion;

[0020] The second pattern structure and the first metal portion are removed to form the positioning portion including the second metal portion.

[0021] In some embodiments, after forming the positioning portion including the second metal portion, the method further includes:

[0022] A third metal portion is formed to cover the second metal portion, so as to obtain the positioning portion further including the third metal portion.

[0023] In some embodiments, the second metal portion includes at least one of chromium, nickel, and titanium, and / or the third metal portion includes at least one of chromium, nickel, and titanium.

[0024] Compared with the prior art, the beneficial features of the embodiments of the present application are: the substrate carrier and the preparation method thereof, the substrate carrier includes a carrier body and at least one carrier body formed on the carrier body, each carrier body extends along the first direction, the carrier body is used to accommodate the substrate to be prepared, and the first projection area of ​​the substrate to be prepared in the first direction is not equal to the second projection area of ​​the carrier body in the first direction; and a positioning body, the positioning body and the carrier body are arranged in a one-to-one correspondence, each positioning body includes a plurality of positioning parts, the plurality of positioning parts are respectively formed on the carrier body and extend along the first direction, and the plurality of positioning parts are evenly spaced along the edge of the corresponding carrier body to limit the substrate to be prepared on the carrier body, and the size of the carrier body matches the size of the substrate in the processing equipment. The same, and the size of the substrate to be prepared is different from the size of the carrier body. The substrate to be prepared is installed on the bearing platform of the carrier body, and the carrier body can be placed on the substrate bearing platform of the processing equipment for positioning and alignment. There is no need to customize special processing equipment for the substrate to be prepared, and the substrate to be prepared can be processed on the processing equipment, which saves production costs. In addition to processing substrates that match the existing sizes, the processing equipment can also process substrates to be prepared in other sizes, thereby improving the compatibility and versatility of the processing equipment. Moreover, each positioning body includes a plurality of positioning parts, and all the positioning parts are evenly spaced along the edge of the corresponding bearing platform, which makes it easier to take and place the substrate to be prepared, and also leaves more operating space for the processing equipment, which is more convenient to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the use status of the substrate carrier of the embodiment of the present application;

[0026] Figure 2 for Figure 1 AA section diagram;

[0027] Figure 3 This is a schematic diagram of the use status of the substrate carrier of the embodiment of the present application;

[0028] Figure 4 This is a schematic diagram of the structure of an unprocessed substrate carrier body in the method for preparing the substrate carrier according to an embodiment of the present application;

[0029] Figure 5 for Figure 4 BB section diagram;

[0030] Figure 6 This is a schematic structural diagram of the intermediate obtained in step S11 in the method for preparing a substrate carrier according to an embodiment of the present application;

[0031] Figure 7 for Figure 6 CC cross-section diagram;

[0032] Figure 8This is a schematic structural diagram of the intermediate obtained in step S12 in the method for preparing a substrate carrier according to an embodiment of the present application;

[0033] Fig. 9 for Figure 8 DD cross-section diagram;

[0034] Fig.10 This is a schematic structural diagram of the intermediate obtained in step S13 in the method for preparing a substrate carrier according to an embodiment of the present application;

[0035] Fig.11 for Fig.10 EE cross-section diagram;

[0036] Fig.12 This is a schematic diagram of the structure of a substrate carrier according to an embodiment of the present application;

[0037] Fig.13 for Fig.12 FF cross-section diagram;

[0038] Among them: 1-carrier body (101-second projection, 102-upper surface (1021-first part, 1022-second part)), 2-carrying platform (201-carrying surface, 202-third projection), 3-positioning body (301-positioning part (301a-positioning part, 3011-second metal part, 3012-third metal part), 302-fourth projection), 4-substrate to be prepared (401-first projection), 5-first pattern structure, 6-second pattern structure. DETAILED DESCRIPTION

[0039] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0040] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0042] Please refer to Figures 1 to 3The substrate carrier of the embodiment of the present application includes a carrier body 1, a carrier platform 2 and a positioning body 3. Among them, there is at least one carrier platform 2, each of which is formed on the carrier body 1, and each of which extends along the first direction. The carrier platforms 2 are arranged in a one-to-one correspondence with the substrates 4 to be prepared, and the carrier platforms 2 are used to accommodate the corresponding substrates 4 to be prepared, and the area of ​​the first projection 401 of each substrate 4 to be prepared in the first direction is not equal to the area of ​​the second projection 101 of the carrier body 1 in the first direction. The positioning body 3 is arranged in a one-to-one correspondence with the carrier platform 2, and each positioning body 3 includes a plurality of positioning parts 301, all of which are formed on the carrier body 1 and extend along the first direction, and all of which are evenly spaced along the edge of the corresponding carrier platform 2, so as to limit the substrate 4 to be prepared on the carrier platform 2.

[0043] In the embodiment of the present application, the area of ​​the first projection 401 of the substrate to be prepared in the first direction is not equal to the area of ​​the second projection 101 of the carrier body 1 in the first direction, that is, the size of the substrate to be prepared 4 is different from the size of the carrier body 1, and the positioning body 3 and the supporting platform body 2 are arranged in a one-to-one correspondence to restrict the substrate to be prepared 4 on the supporting platform body 2, each positioning body 3 includes a plurality of positioning parts 301, and all the positioning parts 301 are evenly spaced along the edge of the corresponding supporting platform body 2, which makes it easier to take and place the substrate to be prepared 4, and also leaves more operating space for the processing equipment, making it more convenient to use.

[0044] In the embodiment of the present application, the size of the carrier body 1 is the same as the size of the matching substrate of the existing processing device, and the size of the substrate 4 to be prepared is different from the size of the matching substrate of the existing processing device. In other words, after the substrate carrier loaded with the substrate 4 to be prepared is placed on the substrate stage of the existing processing device, the positioning and alignment system of the existing processing device can accurately align the pattern or device on the substrate 4 to be prepared with the corresponding part on the processing equipment, so that the processing equipment can process substrates 4 to be prepared of other sizes in addition to processing substrates matching the existing size, without the need to customize special processing equipment for the substrate 4 to be prepared, thereby saving production costs.

[0045] For some preferred implementations, please refer to Figure 1 and Figure 3 , the first projection 401 is located within the second projection 101, that is, the size of the substrate 4 to be prepared is smaller than the size of the carrier body 1. Therefore, the substrate carrier can be used to solve the problem that small-sized substrates cannot be prepared on large-sized substrate equipment with high precision and high process capability.

[0046] In some preferred embodiments, the carrier body 1 is made of a matching substrate of an existing processing device, which is not only convenient to obtain materials but also simple in structure. The substrate carrier can be directly prepared on a substrate production line, and semiconductor process processing is used without mechanical reprocessing. It not only has high processing accuracy and can match the wafer transfer requirements of high-precision devices, but also improves production efficiency.

[0047] As an example, the existing processing equipment can be suitable for processing substrates with a diameter of eight inches, that is, the carrier body 1 is a substrate with a diameter of eight inches. The substrate 4 to be prepared is a substrate with a diameter of two inches. A carrier body 2 is provided on the carrier body 1, and the carrier body 2 is arranged in a one-to-one correspondence with the substrate 4 to be prepared. By placing the substrate 4 to be prepared on the substrate carrier, and then placing the substrate carrier on the carrier of the existing processing equipment, the pattern or device on the substrate 4 to be prepared can be accurately aligned with the corresponding part on the processing equipment through the positioning and alignment system of the existing processing equipment, thereby realizing the processing of two-inch substrates on the processing equipment for processing eight-inch substrates, that is, two-inch substrates can be processed on the production line for processing eight-inch substrates, without the need to customize special processing equipment for two-inch substrates, saving production costs, solving the problem that two-inch substrates cannot be prepared on high-precision, high-process capability eight-inch substrate processing equipment, and can also match the wafer reprinting requirements of high-precision devices. In addition, the substrate carrier is directly made of eight-inch substrate, which is not only easy to obtain materials but also simple in structure. The substrate carrier can be directly prepared on the eight-inch substrate production line, using semiconductor process processing without mechanical reprocessing. It not only has high processing accuracy but also improves production efficiency.

[0048] As an example, the existing processing equipment may be a 100nm process 8-inch substrate lithography machine. In other words, the substrate carrier can be used to process a 2-inch substrate on a 100nm process 8-inch substrate lithography machine, which can solve the problem of the lack of a 100nm process 2-inch substrate lithography machine.

[0049] It is understandable that the processing equipment in this application is prior art and will not be described in detail here. In other words, the substrate carrier and the positioning and alignment system of the processing equipment in this application are prior art and will not be described in detail here.

[0050] It should be noted that, in this embodiment, the size of the carrier body 1 is larger than the size of the substrate 4 to be prepared. The above examples are for illustration only, and the present application does not limit the specific sizes of the carrier body 1 and the substrate 4 to be prepared. As an example, the carrier body 1 can also be a substrate with a diameter of six inches or a substrate with a diameter of more than eight inches, and the substrate 4 to be prepared can also be a substrate with a diameter of four inches, etc. The processing equipment can also be other equipment, for example, the processing equipment can also be semiconductor and microelectronics field equipment such as an etcher and a coating machine, which is not limited here.

[0051] In some preferred embodiments, the carrier body 1 is made of silicon. Specifically, the carrier body 1 can be a silicon wafer substrate. In other embodiments, the carrier body 1 can also be made of other materials, such as a glass substrate, which will not be described in detail here.

[0052] In some preferred embodiments, the length of each positioning portion 301 in the first direction is respectively greater than the length of the supporting platform 2 in the first direction. In other words, the height of the positioning portion 301 is greater than the height of the supporting platform 2. Figure 2 , so that the positioning portion 301 can more stably and effectively limit the substrate 4 to be prepared. Fig.12 and Fig.13 As shown, the carrier body 2 has a carrier surface 201 for supporting the bottom surface of the substrate 4 to be prepared, so the flatness of the carrier surface 201 determines whether the carrier body 2 can stably and effectively support the substrate 4 to be prepared. If the carrier surface 201 is not flat, it may cause the pattern or device on the substrate 4 to be prepared to be unable to accurately align with the corresponding part on the processing equipment, thereby affecting the processing accuracy of the substrate 4 to be prepared. Figure 2 and Fig.13 In the groove structure shown, if the groove depth of the carrier body 2 is too deep, it is difficult to ensure the flatness of the carrier surface 201 formed by processing. In the embodiment of the present application, the carrier body 2 cooperates with the positioning body 3, which can not only effectively carry and limit the substrate 4 to be prepared, but also improve the processing accuracy of the carrier body 2, and further improve the processing accuracy of the substrate 4 to be prepared. In addition, all positioning parts 301 are evenly spaced along the edge of the corresponding carrier body 2, which is more convenient for taking and placing the substrate 4 to be prepared, and also leaves more operating space for the processing equipment, which is more convenient to use.

[0053] As an example, the height of the carrier body 2 can be 10 μm-100 μm, and the height of the positioning portion 301 can be 100 μm-1000 μm, thereby improving the processing accuracy of the carrier body 2 and further improving the processing accuracy of the substrate 4 to be prepared. Preferably, the height of the carrier body 2 is less than the height of the substrate 4 to be prepared, thereby further improving the processing accuracy of the carrier body 2 and the processing accuracy of the substrate 4 to be prepared.

[0054] In some more preferred embodiments, please refer to Figure 2 and Fig.13 , the lengths of the positioning portions 301 in the first direction are equal, that is, the heights of the positioning portions 301 are equal, which can not only effectively avoid interference with other structures on the processing equipment, but also facilitate processing, while ensuring the overall strength of the positioning body 3, and can also better position the substrate 4 to be prepared.

[0055] As an example, please refer to Figure 1 and Figure 3 As shown, the third projection 202 of the carrier body 2 in the first direction coincides with the first projection 401 of the substrate 4 to be prepared in the first direction, that is, the size of the carrier body 2 matches that of the substrate 4 to be prepared, which can not only effectively control the processing cost of the carrier body 2, but also enable the carrier body 2 to stably and effectively carry the substrate 4 to be prepared.

[0056] In some preferred embodiments, the fourth projection 302 of the positioning body 3 in the first direction is located outside the third projection 202. Figure 1 and Figure 3 , which is not only more convenient for machining the positioning body 3, but also will not damage the support platform 2 or affect the machining of the support platform 2, thereby improving the overall machining accuracy and product quality of the carrier. It can be understood that the fourth projection 302 of the positioning body 3 refers to the projection of all the positioning parts 301 of the positioning body 3 in the first direction.

[0057] As an example, there may be a gap between the fourth projection 302 and the third projection 202 , which not only makes processing easier but also fully avoids damaging the support platform 2 or affecting the processing of the support platform 2 during the processing of the positioning body 3 .

[0058] It should be noted that, in other embodiments, there may be no gap or at least partial overlap between the fourth projection 302 and the third projection 202. Alternatively, in other embodiments, the first projection 401 is located within the third projection 202 and the projection area of ​​the first projection 401 is smaller than the projection area of ​​the third projection 202, and the fourth projection 302 is also located within the third projection 202. As long as the positioning body 3 and the carrier body 2 cooperate with each other to restrict the substrate 4 to be prepared on the carrier body 1, it is ensured that the substrate 4 to be prepared will not move accidentally during the processing.

[0059] As an optional embodiment, the sum of the length of the positioning portion 301 in the first direction and the length of the supporting platform 2 in the first direction is equal to the length of the substrate 4 to be prepared in the first direction. Figure 2From the perspective shown, the upper end surface of the positioning portion 301 and the upper end surface of the substrate 4 to be prepared are located on the same plane, which can not only stably and effectively restrict the substrate 4 to be prepared on the supporting platform 2, but also effectively control the processing cost of the positioning body 3, and also leave more operating space for the processing equipment.

[0060] As an optional implementation, please refer to Figure 2 The sum of the length of the positioning portion 301 in the first direction and the length of the supporting platform 2 in the first direction is greater than the length of the substrate 4 to be prepared in the first direction, that is, the plane where the upper end surface of the positioning portion 301 is located is higher than the plane where the upper end surface of the substrate 4 to be prepared is located, thereby further ensuring that the entire substrate 4 to be prepared can be stably and effectively confined on the supporting platform 2.

[0061] In some preferred embodiments, please refer to Figure 1 and Figure 3 Each positioning body 3 includes at least three positioning portions 301 , and all positioning portions 301 are evenly spaced along the edge of the corresponding carrier body 2 , thereby stably and effectively limiting the substrate 4 to be prepared on the carrier body 2 .

[0062] As an example, please refer to Figure 1 and Figure 3 Each positioning body 3 includes four positioning portions 301 , and the positioning portions 301 of each positioning body 3 are evenly spaced along the edge of the corresponding carrier body 2 , thereby stably and effectively limiting the substrate 4 to be prepared on the carrier body 2 .

[0063] As an optional implementation, please refer to Figure 1 and Figure 3 , two adjacent bearing platforms 2 can share part of the positioning body 3, thereby effectively reducing the difficulty of processing and also reducing the occupied space. For example, please refer to Figure 1 and Figure 3 As shown, the positioning portion 301 a is simultaneously arranged corresponding to the two supporting platforms 2 , that is, each positioning portion 301 a simultaneously belongs to two different positioning bodies 3 .

[0064] It can be understood that, in other embodiments, each positioning body 3 may be independent of each other, and each positioning portion 301 belongs to only one positioning body 3 , that is, each positioning portion 301 is only used to limit one substrate 4 to be prepared.

[0065] In some preferred embodiments, a plurality of support platforms 2 are formed on the carrier body 1, all of the support platforms 2 are arranged at intervals, and the support platforms 2 are arranged one-to-one corresponding to the substrates 4 to be prepared, and each support platform 2 is used to position the corresponding substrate 4 to be prepared on the carrier body 1, so that batch processing of multiple substrates 4 to be prepared can be achieved, further improving production efficiency.

[0066] As an optional implementation, please refer to Figure 1 The shape of each carrier body 2 is the same, and the size of each carrier body 2 is equal, so as to achieve batch production of multiple identical substrates 4 to be prepared, and further improve the production efficiency.

[0067] As an optional implementation, please refer to Figure 3 The shapes of some of the supporting platforms 2 may be different, and the sizes of some of the supporting platforms 2 may also be different, so that substrates 4 of various sizes can be produced at the same time, further improving the compatibility and versatility of the equipment.

[0068] As an optional embodiment, the shape of each carrier body 2 may be different. Alternatively, the shape of each carrier body 2 may be the same, but the size of each carrier body 2 is different, so as to achieve the simultaneous production of multiple different substrates 4 to be prepared, further improving the compatibility and versatility of the processing equipment.

[0069] In some preferred embodiments, please refer to Figure 1 and Figure 3 At least part of the support platform 2 is evenly spaced around the axis of the carrier body 1, so as to more fully and effectively utilize the space, so that the substrate carrier can place more substrates 4 to be prepared, further improving production efficiency.

[0070] In other embodiments, the supporting platforms 2 may also be distributed in other ways.

[0071] It should be noted that the number, shape, size and specific distribution of the supporting platform 2 can be set according to actual conditions and will not be elaborated here.

[0072] In some preferred embodiments, the shape of the substrate 4 to be prepared may be the same as the shape of the carrier body 1. As an example, the carrier body 1 may be a circular silicon wafer substrate with a diameter of six inches, and the carrier body 1 may load at least one substrate 4 to be prepared, wherein at least one substrate 4 to be prepared is a circular silicon wafer substrate with a diameter of two inches, so that a circular silicon wafer substrate with a diameter of two inches can be processed on a processing device for a circular silicon wafer substrate with a diameter of six inches.

[0073] In other preferred embodiments, the shape of the substrate 4 to be prepared may be different from the shape of the carrier body 1. As an example, the carrier body 1 may be a circular silicon wafer substrate with a diameter of six inches, and the carrier body 1 may carry at least one substrate 4 to be prepared, wherein at least one substrate 4 to be prepared may be a square glass substrate with a side length of four inches, so that a square glass substrate with a side length of four inches can be processed on a processing device for a circular silicon wafer substrate with a diameter of six inches.

[0074] It is understandable that the material of the substrate 4 to be prepared may be the same as the material of the carrier body 1 , or the material of the substrate 4 to be prepared may be different from the material of the carrier body 1 , which will not be elaborated herein.

[0075] In some preferred embodiments, the thickness of the carrier body 1 may be 100 μm-1000 μm. The carrier body 1 is a standard substrate, which is convenient for obtaining materials and manufacturing substrate carriers, thereby reducing production costs.

[0076] As an optional embodiment, the carrier body 1 has a diameter of four inches and a thickness of 525 μm±25 μm.

[0077] As an optional embodiment, the carrier body 1 has a diameter of six inches and a thickness of 675 μm±25 μm.

[0078] As an optional embodiment, the carrier body 1 has a diameter of eight inches and a thickness of 725 μm±25 μm.

[0079] As an optional embodiment, the carrier body 1 has a diameter of twelve inches and a thickness of 775 μm±25 μm.

[0080] The method for preparing a substrate carrier according to an embodiment of the present application can be applied to preparing any of the above-mentioned substrate carriers.

[0081] The method for preparing a substrate carrier according to an embodiment of the present application comprises steps S11 to S14:

[0082] Step S11, providing Figure 4 and Figure 5 The carrier body 1 shown in FIG. 1 has a first pattern structure 5 formed on the carrier body 1. The first pattern structure 5 covers a portion of the upper surface of the carrier body 1, so that the upper surface 102 of the carrier body 1 includes a first portion 1021. The first portion 1021 is not covered by the first pattern structure 5. Please refer to FIG. Figure 6 and Figure 7 .

[0083] Step S12, etching the first portion 1021 of the upper surface 102 of the carrier body 1 to form the carrier platform 2, please refer to Figure 8 and Fig. 9The supporting platform 2 is used to support the corresponding substrate 4 to be prepared.

[0084] Step S13, forming a second pattern structure 6, the second pattern structure 6 covers a portion of the upper surface of the carrier body 1 and the surface of the carrier platform 2, so that the upper surface 102 of the carrier body 1 includes a second portion 1022, the second portion 1022 is not covered by the second pattern structure 6, please refer to Fig.10 and Fig.11 .

[0085] Step S14, forming a positioning body 3 at the second portion 1022 of the upper surface 102 of the carrier body 1, the positioning body 3 is arranged one by one with the supporting platform 2, and each positioning body 3 includes a plurality of positioning portions 301 evenly spaced along the edge of the supporting platform 2, please refer to Fig.12 and Fig.13 The plurality of positioning portions 301 are used to cooperate with each other to restrict the substrate 4 to be prepared on the carrier platform 2 .

[0086] In the present application, please refer to Figures 1 to 3 The positioning body 3 and the carrier body 2 are arranged one by one to limit the substrate 4 to be prepared on the carrier body 2. Each positioning body 3 includes a plurality of positioning parts 301. All positioning parts 301 are evenly spaced along the edge of the corresponding carrier body 2, which makes it easier to take and place the substrate 4 to be prepared, and also leaves more operating space for the processing equipment, making it more convenient to use.

[0087] In the embodiment of the present application, the size of the carrier body 1 is the same as the size of the matching substrate of the existing processing device, and the size of the substrate 4 to be prepared is different from the size of the matching substrate of the existing processing device. In other words, after the substrate carrier loaded with the substrate 4 to be prepared is placed on the substrate stage of the existing processing device, the positioning and alignment system of the existing processing device can accurately align the pattern or device on the substrate 4 to be prepared with the corresponding part on the processing equipment, so that the processing equipment can process substrates 4 to be prepared of other sizes in addition to processing substrates matching the existing size, without the need to customize special processing equipment for the substrate 4 to be prepared, thereby saving production costs.

[0088] In some preferred embodiments, the carrier body 1 is made of a matching substrate of an existing processing device, which not only facilitates material acquisition but also has a simple structure. The substrate carrier can be directly prepared on a substrate production line, and the semiconductor process is used to process the substrate carrier without the need for mechanical reprocessing. Not only is the processing accuracy high and can it match the wafer transfer requirements of high-precision devices, but production efficiency is also improved.

[0089] As an example, the cross-sectional shape of the carrier body 2 may be circular or square. The height of the carrier body 2 may be 10 μm-100 μm. The height of the positioning portion 301 may be 100 μm-1000 μm. Preferably, the height of the carrier body 2 is less than the height of the substrate 4 to be prepared.

[0090] In some preferred implementations, step S11 specifically includes steps S111 to S113:

[0091] Step S111, spin-coating photoresist on the upper surface 102 of the carrier body 1. As an example, the thickness of the photoresist may be 1 μm-50 μm.

[0092] Step S112, exposing the photoresist. As an example, the exposure energy may be 10 mJ / cm 2 -200mJ / cm 2 .

[0093] Step S113, developing the photoresist, at this time, the exposed photoresist will be removed, and the unexposed photoresist will be left to form a first pattern structure 5, and the first pattern structure 5 only shields part of the upper surface of the carrier body 1. Therefore, at this time, the upper surface 102 of the carrier body 1 has a first portion 1021 that is not shielded by the first pattern structure 5. Please refer to Figure 6 and Figure 7 .

[0094] In some preferred embodiments, step S12 may be performed by plasma etching to etch the first portion 1021 not covered by the first pattern structure 5. At this time, the upper surface 102 of the carrier body 1 shielded by the first pattern structure 5 will not be etched, so that the carrier body 2 can be formed. Figure 8 and Fig. 9 The shape of the support platform 2 is determined by the first pattern structure 5, and the specific structure of the first pattern structure 5 can be set as required.

[0095] As an example, the etching gas may include SF6 (sulfur hexafluoride), O2 (oxygen) and C4F8 (octafluorocyclobutane). SF6 can be used as the main etching gas, which has a higher etching rate and a better selectivity. O2 can be used as an auxiliary gas together with the main etching gas to increase the etching rate. In addition, O2 can also improve the quality of the etched surface and reduce the residue and pollution after etching. C4F8 can be used as a passivation gas. C4F8 decomposes in a plasma state to produce CF2 groups, thereby forming a layer of high molecular polymer film on the side wall of the groove, preventing further reaction of fluorine free radicals with silicon, protecting the side wall from excessive etching, thereby improving the accuracy and controllability of etching.

[0096] In this embodiment, semiconductor photolithography is used to process the carrier body 2, and the formed carrier body 2 has a micron level or even sub-micron level precision, which is very high. This allows the carrier body 2 to not only more effectively support the substrate 4 to be prepared, but also better protect the substrate 4 to be prepared, thereby further improving the processing precision of the substrate 4 to be prepared.

[0097] As an example, after forming the carrier platform 2 in step S12 and before forming the second pattern structure 6 in step S13, step S12 further includes: removing the first pattern structure 5 to obtain Figure 8 and Fig. 9 The intermediate shown.

[0098] In a preferred embodiment, step S13 specifically includes steps S131 to S133:

[0099] Step S131, spin-coating photoresist on the upper surface 102 of the carrier body 1 and the surface of the carrier platform 2. As an example, the thickness of the photoresist may be 1 μm-50 μm.

[0100] Step S132: Expose the photoresist. As an example, the exposure energy may be 10 mJ / cm 2 -200mJ / cm 2 .

[0101] Step S133, developing the photoresist, at which time the exposed photoresist will be removed, and the unexposed photoresist will be left to form a second pattern structure 6, the second pattern structure 6 only shields part of the upper surface of the carrier body 1 and the surface of the carrier body 2, so the upper surface 102 of the carrier body 1 includes a second portion 1022 not covered by the second pattern structure 6, please refer to Fig.10 and Fig.11 .

[0102] In some preferred implementations, step S14 may specifically include steps S141 to S142:

[0103] In step S141 , a first metal layer is formed. The first metal layer includes a first metal portion and a second metal portion 3011 . The first metal portion covers the second pattern structure 6 , and the second metal portion 3011 covers the second portion 1022 .

[0104] Step S142 , removing the second pattern structure 6 and the first metal portion to form a positioning portion 301 including a second metal portion 3011 .

[0105] This embodiment can effectively reduce the difficulty of preparing the substrate carrier, further reduce the production cost and improve the production efficiency.

[0106] As an example, in step S141, at least one of PVD (Physical Vapor Deposition) and electroplating can be used. Fig.10 and Fig.11 A seed layer of metal is sputtered on the intermediate body to form a first metal layer. The first metal layer may include at least one of Cr (Chromium), Ni (Nickel), and Ti (Titanium). In other words, the second metal part 3011 includes at least one of Cr, Ni, and Ti.

[0107] It is understandable that, in other embodiments, the first metal layer may be formed in other ways, and the first metal layer and the second metal part 3011 may also include other materials, which will not be elaborated herein.

[0108] In some preferred embodiments, step S14 further includes step S143 after step S142:

[0109] Step S143, forming a third metal portion 3012 covering the second metal portion 3011, so as to obtain a positioning portion 301 including the third metal portion 3012, please refer to Fig.12 and Fig.13 , that is, the positioning portion 301 at least includes a second metal portion 3011 and a third metal portion 3012 .

[0110] In this embodiment, the positioning portion 301 includes a second metal portion 3011 and a third metal portion 3012 formed on the second metal portion 3011. The third metal portion 3012 can effectively increase the height of the positioning portion 301, so that the positioning portion 301 can have a sufficient height, and the step-by-step preparation of the positioning portion 301 can effectively thin the thickness of the first metal layer, thereby further reducing the difficulty of forming the first metal layer and reducing the time to form the first metal layer, thereby further reducing the preparation difficulty and production cost of the substrate carrier, improving production efficiency, and at the same time, it can also improve the product yield of the substrate carrier, so that the substrate carrier can stably and effectively carry the substrate 4 to be prepared.

[0111] As an optional implementation, the height of the second metal portion 3011 is 0.5 μm-3 μm, and the height of the third metal portion 3012 is 100 μm-1000 μm.

[0112] As an example, the third metal part 3012 may be formed on the second metal part 3011 by electroplating, which is a simple process. The third metal part 3012 may include at least one of Cr, Ni and Ti.

[0113] In a preferred embodiment, the third metal part 3012 includes Cr, which can combine with oxygen to form a corrosion-resistant Cr2O3 passivation film, thereby effectively preventing further oxidation and corrosion of the positioning part 301. In addition, Cr can significantly improve the strength, hardness and wear resistance of the positioning part 301.

[0114] It is understandable that, in other embodiments, the third metal portion 3012 may be formed in other ways, and the third metal portion 3012 may also include other materials, which will not be elaborated herein.

[0115] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The above embodiments only express the preferred implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A substrate carrier, characterized in that: include: Vehicle body; There is at least one carrying platform, and each of the carrying platforms is formed on the carrier body, and each of the carrying platforms extends along a first direction, and the carrying platform is used to accommodate a substrate to be prepared, and a first projection area of ​​the substrate to be prepared in the first direction is not equal to a second projection area of ​​the carrier body in the first direction; and A positioning body, wherein the positioning body is arranged in one-to-one correspondence with the carrier body, each of the positioning bodies comprises a plurality of positioning parts, the plurality of positioning parts are respectively formed on the carrier body and extend along the first direction, and the plurality of positioning parts are evenly spaced along the edge of the corresponding carrier body to limit the substrate to be prepared on the carrier body.

2. The substrate carrier according to claim 1, wherein: The length of each positioning portion in the first direction is respectively greater than the length of the supporting platform in the first direction.

3. The substrate carrier according to claim 1, wherein: The lengths of the positioning portions in the first direction are equal.

4. The substrate carrier according to claim 3, characterized in that The sum of the length of the positioning portion in the first direction and the length of the supporting platform in the first direction is greater than or equal to the length of the substrate to be prepared in the first direction.

5. The substrate carrier according to claim 1, wherein: Each of the positioning bodies includes at least three positioning portions.

6. The substrate carrier according to claim 1, wherein: The first projection is located within the second projection.

7. A method for preparing a substrate carrier, characterized in that: include: forming a first pattern structure covering the upper surface of the carrier body, so that the upper surface of the carrier body includes a first portion, and the first portion is not covered by the first pattern structure; Etching the first portion to form a supporting platform; forming a second pattern structure covering the upper surface of the carrier body and the surface of the carrier platform, so that the upper surface of the carrier body includes a second portion, and the second portion is not covered by the second pattern structure; A positioning body is formed at the second portion, and the positioning body includes a plurality of positioning portions evenly spaced along the edge of the supporting platform.

8. The method for preparing a substrate carrier according to claim 7, wherein: The forming of a positioning body at the second position comprises: forming a first metal layer, the first metal layer comprising a first metal portion covering the second pattern structure and a second metal portion covering the second portion; The second pattern structure and the first metal portion are removed to form the positioning portion including the second metal portion.

9. The method for preparing a substrate carrier according to claim 8, wherein: After forming the positioning portion including the second metal portion, the method further includes: A third metal portion is formed to cover the second metal portion, so as to obtain the positioning portion further including the third metal portion.

10. The method for preparing a substrate carrier according to claim 9, wherein: The second metal portion includes at least one of chromium, nickel, and titanium, and / or the third metal portion includes at least one of chromium, nickel, and titanium.

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