Wafer grabbing method

Abstract

The invention relates to the technical field of semiconductor processing equipment, in particular to a wafer grabbing method which comprises the following steps: S01, driving a sealing bin to move so as to enable a clamping mechanism to move up and down and / or horizontally; s02, the sealing bin is driven to rotate horizontally, so that the clamping mechanism rotates horizontally; s03, in the step S01, when the clamping mechanism moves to the required position, the clamping claw is driven to adsorb the wafer, then the clamping mechanism is adopted to drive the clamping claw to be close to the sealing bin, and the clamping claw is moved to the position above or below the clamping bin. According to the invention, automatic wafer grabbing is realized, manpower is saved, the processing precision is guaranteed, the three-dimensional space grabbing requirement of the clamping mechanism can be met, the wafer can be smoothly clamped in a narrow space, and the wafer loading efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a wafer grabbing method. Background Art

[0002] Wafer refers to the silicon chip used to make semiconductor circuits. It is a regular cylindrical shape and its original material is silicon. Wafer is one of the most critical raw materials in the production of semiconductor integrated circuits. In the semiconductor processing technology, in order to make the edge of the wafer complete and smooth, the wafer needs to be trimmed to facilitate subsequent processing, thereby ensuring the excellent performance of the finished chip.

[0003] After wafer trimming is completed, the wafer needs to be clamped from the wafer stage and transferred to the next processing station. The existing wafer clamping is done manually, and the wafer clamping stability is poor, making it difficult to ensure clamping accuracy, which affects wafer loading efficiency. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides a wafer grasping method, which can realize automatic grasping of wafers, save labor, ensure processing accuracy, meet the three-dimensional space grasping requirements of the clamping mechanism, can smoothly clamp wafers in narrow spaces, and improve wafer loading efficiency.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] The present invention provides a wafer grabbing method, comprising the following steps:

[0007] S01, driving the sealing bin to move so that the clamping mechanism can move up and down and / or horizontally;

[0008] S02, driving the sealing chamber to rotate horizontally, so that the clamping mechanism rotates horizontally;

[0009] S03. In step S01, when the clamping mechanism moves to the required position, the clamping claw is driven to absorb the wafer, and then the clamping mechanism is used to drive the clamping claw to approach the sealing chamber, and the clamping claw is moved to the top or bottom of the clamping chamber.

[0010] Wherein, in step S01, a gripping device is used to drive the sealed bin to move, the gripping device includes a sealed bin, a first dustproof component connected to the sealed bin, and a first driving mechanism drivingly connected to the first dustproof component, the first driving mechanism drivingly connects to a clamping mechanism, the sealed bin is equipped with a drag chain body, and the first dustproof component is provided with a mounting port connecting the drag chain body and the first driving mechanism;

[0011] The first driving mechanism drives the first dustproof component and the clamping mechanism to move up and down synchronously, so that the first dustproof component covers the drag chain body;

[0012] The clamping mechanism is driven and connected with a clamping claw. When the clamping mechanism moves to a desired position, the clamping claw is driven to absorb the wafer, and then the clamping mechanism drives the clamping claw to approach the sealing chamber.

[0013] Wherein, in step S01, the gripping device further includes a mounting chamber and a second driving mechanism, the sealing chamber is slidably connected to the mounting chamber, the second driving mechanism is drivingly connected to the sealing chamber, the mounting chamber is installed with a second dustproof component, and the second dustproof component is drivingly connected to the second driving mechanism;

[0014] The second driving mechanism drives the sealing chamber and the clamping mechanism to move horizontally, so that the second dustproof component covers the connection between the sealing chamber and the installation chamber;

[0015] The top of the installation bin is provided with an accommodating cavity, the second dustproof component moves in the accommodating cavity and covers the top opening of the accommodating cavity, and the outer end of the dust guide pipe extends into the inner side of the second dustproof component;

[0016] A plurality of supporting shafts are installed in the accommodating chamber, the second dustproof assembly is sleeved on the supporting shafts, a dust outlet hole is arranged at the bottom of the accommodating chamber, and a gap is left between the second dustproof assembly and the inner wall of the accommodating chamber.

[0017] Wherein, in step S02, the sealing chamber is connected to a support plate, the support plate is rotatably connected to a mounting frame slidably connected to the mounting chamber, the sealing chamber is drivably connected to the second driving mechanism through the mounting frame, the support plate is provided with a pipe penetration hole, the outer end of the dust guide pipe passes through the pipe penetration hole and the second dustproof component and then extends into the mounting chamber, and the second dustproof component is rotatably connected to the dust guide pipe;

[0018] The mounting frame is connected to a driving motor, which is drivingly connected to the supporting disk. The driving motor drives the supporting disk to rotate, and drives the sealing bin to rotate horizontally, so that the clamping mechanism rotates horizontally.

[0019] Wherein, an installation cavity is provided inside the sealing chamber, the drag chain body is installed in the installation cavity, an air inlet net is installed at one end of the installation cavity, the other end of the installation cavity is connected to a dust exhaust pipe, and the air inlet net is connected to the installation cavity;

[0020] The outer end of the dust exhaust pipe is connected to a dust extraction fan after passing through the installation cavity, and the output end of the dust extraction fan is connected to a dust guide pipe.

[0021] The clamping mechanism comprises a clamping bin and a clamping drive mechanism connected to the clamping claw, the first drive mechanism is connected to the clamping bin, the clamping claw is provided with an adsorption area, and the clamping drive mechanism drives the clamping claw to move so that the clamping claw approaches or moves away from the clamping bin;

[0022] When clamping the wafer, the clamping drive mechanism drives the clamping claws to approach the wafer, and the wafer is adsorbed in the adsorption area by negative pressure;

[0023] After the wafer is clamped, the clamping drive mechanism drives the clamping claws to approach the clamping bin, so that the clamping claws move to the top or bottom of the clamping bin.

[0024] The clamping bin is provided with an activity space, a collection camera for photographing wafers is installed in the activity space, the clamping claw is connected with a moving part, the clamping claw is slidably connected to the activity space through the moving part, the moving part is connected with a dust shield, and the clamping drive mechanism is drivingly connected with the moving part;

[0025] The clamping drive mechanism drives the moving part to move back and forth at the opening of the activity space, so that the dust blocking part blocks the activity space.

[0026] Wherein, the clamping claw comprises a clamping claw body and a clamping seat connected to the clamping claw body, the clamping seat is connected to the moving part, the clamping claw body is provided with an adsorption channel, the adsorption area is provided on the clamping claw body, and the adsorption channel is communicated with the adsorption area;

[0027] The middle part of the adsorption channel passes through the side of the clamp body away from the adsorption area, the clamping seat covers the middle part of the adsorption channel, the movable member is provided with a threading channel passing through from top to bottom, the inner end of the threading channel is located in the clamping bin, and the side of the movable member is provided with a threading port, which is communicated with the threading channel;

[0028] The gripping device further comprises a locking mechanism, the clamping seat is slidably connected to the moving member, and after the clamping seat moves to a desired position relative to the moving member, the locking mechanism locks the clamping claw and the moving member.

[0029] The sealing chamber is provided with a movable opening connected to the installation cavity, the first dustproof component comprises a driving member slidably connected to the movable opening and a dustproof member connected to the driving member, the installation opening is provided on the driving member, the driving member is drivingly connected to the first driving mechanism, and the first driving mechanism drives the driving member to move so that the dustproof member covers the movable opening;

[0030] An air inlet fan is installed in the installation cavity, and the air inlet fan draws air from the air inlet net under negative pressure to push the air in the sealed chamber to be discharged through the dust exhaust pipe;

[0031] A plurality of rotating shafts are installed in the installation cavity, the dustproof part is sleeved on the rotating shafts, two opposite sides of the dustproof part are both in contact with the inner side of the movable opening, a gap is left between the dustproof part and the inner wall of the installation cavity, and the inner side of the dustproof part is surrounded by a space for accommodating the drag chain body.

[0032] The clamping bin is provided with at least two mounting shafts, the dust shield is sleeved on the mounting shafts, both ends of the dust shield are connected to the moving member, the clamping drive mechanism is drivingly connected to the clamping drive frame, and the clamping drive frame is connected to the moving member;

[0033] The clamping drive frame is arranged on the inner side of the dust shield, the clamping drive frame is provided with a clamping accommodating groove, and the dust shield is arranged on the clamping accommodating groove.

[0034] Beneficial effects of the present invention:

[0035] The first driving mechanism drives the clamping mechanism to move up and down, the second driving mechanism drives the sealing chamber to move horizontally, the driving motor drives the supporting plate to rotate, and drives the sealing chamber to rotate horizontally, so that the clamping mechanism can rotate horizontally, realize automatic wafer grabbing, save labor, ensure processing accuracy, meet the three-dimensional space grabbing requirements of the clamping mechanism, can smoothly clamp the wafer in a narrow space, and improve wafer loading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Schematic diagram of the three-dimensional structure of the wafer grabbing method.

[0037] Figure 2 It is a schematic diagram of an explosion structure with a sealed chamber, a first dustproof component, and a mounting port.

[0038] Figure 3 It is a schematic diagram of a three-dimensional structure having a sealing chamber, an installation chamber, a second driving mechanism and a second dustproof component.

[0039] Figure 4 This is a schematic diagram of the exploded structure of the installation warehouse.

[0040] Figure 5 It is a schematic diagram of the explosion structure at the connection between the sealing chamber and the mounting frame.

[0041] Figure 6 Schematic diagram of the fracture structure inside the sealed chamber.

[0042] Figure 7 It is a schematic diagram of a three-dimensional structure with a sealed bin, a dust exhaust pipe, a dust extraction fan and a dust guide pipe.

[0043] Figure 8 It is a schematic diagram of the three-dimensional structure of the clamping mechanism.

[0044] Fig. 9 It is a schematic diagram of the installation structure of the clamping bin and the first driving mechanism.

[0045] Fig.10 Schematic diagram of the exploded structure of the gripping claw and the gripping bin.

[0046] Fig.11Schematic diagram of the exploded structure of the gripping claw.

[0047] Fig.12 It is a structural cross-sectional view of the gripping claw.

[0048] Fig.13 It is a structural schematic diagram of a clamping jaw body, a clamping jaw body and an adsorption channel.

[0049] Fig.14 It is a schematic diagram of the three-dimensional structure of the moving parts.

[0050] Fig.15 It is a structural cross-sectional view of the moving parts.

[0051] Fig.16 It is a schematic diagram of the explosion structure with clamping claws, moving parts and locking mechanism.

[0052] Fig.17 Schematic diagram of the explosion structure of the sealed chamber.

[0053] Fig.18 This is an exploded view of the local structure of the sealed chamber.

[0054] Fig.19 It is a three-dimensional diagram of the partial structure of the clamping bin.

[0055] Fig. 20 It is a three-dimensional diagram of a clamping drive mechanism, a clamping drive frame and a dust shield.

[0056] 100. Drag chain body;

[0057] 1. Sealed chamber; 101. Installation cavity; 102. Activity opening;

[0058] 1011. air inlet fan; 1012. rotating shaft;

[0059] 11. Air inlet net; 12. Dust exhaust pipe; 13. Dust exhaust fan; 14. Dust guide pipe;

[0060] 15. Support plate; 151. Pipe hole; 16. Mounting frame; 17. Driving motor;

[0061] 2. First dustproof component; 201. Mounting port; 21. Driving member; 22. Dustproof member;

[0062] 3. A first driving mechanism;

[0063] 4. Clamping mechanism; 410. Clamping claw; 4101. Adsorption area;

[0064] 41001, clamping claw body; 41002, clamping seat; 41003, adsorption channel;

[0065] 420, moving part; 4201, threading channel; 4202, threading port; 430, dust shield;

[0066] 41. Clamping chamber; 411. Activity space; 4111. Collection camera; 412. Installation axis;

[0067] 42. clamping drive mechanism; 421. clamping drive frame; 4211. clamping receiving groove;

[0068] 5. Installation chamber; 501. Accommodation chamber; 5011. Dust outlet hole; 502. Support shaft;

[0069] 6. Second driving mechanism; 7. Second dustproof component; 8. Locking mechanism. DETAILED DESCRIPTION

[0070] To facilitate understanding by those skilled in the art, the present invention is further described below in conjunction with examples and drawings. Specific implementation methods of the present invention will be described below. It should be pointed out that in the specific description of these implementation methods, in order to provide a concise description, this specification cannot provide a detailed description of all features of the actual implementation methods.

[0071] refer to Figures 1 to 20 As shown, the present invention provides a wafer grabbing method, comprising the following steps: S01, driving the sealing chamber 1 to move, so that the clamping mechanism 4 can move up and down and / or horizontally;

[0072] S02, driving the sealing chamber 1 to rotate horizontally, so that the clamping mechanism 4 rotates horizontally;

[0073] S03. In step S01, when the clamping mechanism 4 moves to the desired position, the clamping claw 410 is driven to adsorb the wafer, and then the clamping mechanism 4 is used to drive the clamping claw 410 to approach the sealing chamber 1, and the clamping claw 410 is moved to the top or bottom of the clamping chamber 1.

[0074] refer to Figure 1 , 2 As shown, automatic wafer grabbing is achieved, labor is saved, processing accuracy is guaranteed, the three-dimensional space grabbing requirements of the clamping mechanism 4 can be met, wafers can be smoothly clamped in a narrow space, and wafer loading efficiency is improved.

[0075] refer to Figure 1As shown, in this embodiment, in step S01, a gripping device is used to drive the sealing chamber 1 to move, and the gripping device includes a sealing chamber 1, a first dustproof component 2 connected to the sealing chamber 1, and a first driving mechanism 3 driven and connected to the first dustproof component 2, the first driving mechanism 3 is driven and connected to a clamping mechanism 4, the sealing chamber 1 is equipped with a drag chain body 100, and the first dustproof component 2 is provided with an installation port 201 connecting the drag chain body 100 and the first driving mechanism 3; the first driving mechanism 3 drives the first dustproof component 2 and the clamping mechanism 4 to move up and down synchronously, so that the first dustproof component 2 covers the drag chain body 100; the clamping mechanism 4 is driven and connected with a clamping claw 410, and when the clamping mechanism 4 moves to the desired position, it drives the clamping claw 410 to adsorb the wafer, and then the clamping mechanism 4 drives the clamping claw 410 to approach the sealing chamber 1, so as to quickly grasp the wafer and save labor, and after grasping, the wafer and the clamping claw 410 are retracted toward the sealing chamber 1 to save space.

[0076] In actual application, the first driving mechanism 3 adopts a screw motor module, and the first driving mechanism 3 drives the clamping mechanism 4 to move up and down, which saves labor, realizes automatic clamping, meets the different height grasping requirements of the clamping mechanism 4, and facilitates the smooth grasping of the wafer; the line pipeline in the drag chain body 100 passes through the installation port 201 and is connected to the first driving mechanism 3, and the first driving mechanism 3 drives the drag chain body 100 to move synchronously; the movement of the clamping mechanism 4 drives the first dustproof component 2 to move synchronously at the same time, and the first dustproof component 2 continuously blocks the drag chain body 100 during the movement to prevent dust from entering the drag chain body 100 and the sealing chamber 1, thereby improving the dustproof effect and ensuring the processing accuracy.

[0077] refer to Figure 3 As shown, in this embodiment, in step S01, the gripping device also includes an installation bin 5 and a second driving mechanism 6, the sealing bin 1 is slidably connected to the installation bin 5, the second driving mechanism 6 is drivingly connected to the sealing bin 1, the installation bin 5 is installed with a second dustproof component 7, and the second dustproof component 7 is drivingly connected to the second driving mechanism 6; the second driving mechanism 6 drives the sealing bin 1 and the clamping mechanism 4 to move horizontally, so that the second dustproof component 7 covers the connection between the sealing bin 1 and the installation bin 5.

[0078] refer to Figure 3 As shown, in actual application, the second driving mechanism 6 adopts a linear slide module, a cylinder or an electric cylinder, and drives the sealing chamber 1 to move horizontally through the second driving mechanism 6 to meet the grasping requirements of different horizontal positions of the clamping mechanism 4, so as to facilitate the smooth grasping of the wafer; the second dustproof component 7 blocks the connection between the sealing chamber 1 and the installation chamber 4 to prevent dust from entering the installation chamber 5, thereby improving the dustproof effect of the installation chamber 5.

[0079] refer to Figure 4As shown, a accommodating cavity 501 is provided at the top of the installation bin 5, the second dustproof component 7 moves in the accommodating cavity 501 and blocks the top opening of the accommodating cavity 501, and the outer end of the dust guide tube 14 extends into the inner side of the second dustproof component 7; in actual application, the second dustproof component 7 is driven to move by the second driving mechanism 6, and the second dustproof component 7 continuously blocks the opening of the accommodating cavity 501 during the movement to prevent dust from entering along the accommodating cavity 501, thereby ensuring that the interior of the installation bin 5 is clean and tidy.

[0080] A plurality of support shafts 502 are installed in the accommodating chamber 501, the second dustproof assembly 7 is sleeved on the support shafts 502, a dust outlet hole 5011 is provided at the bottom of the accommodating chamber 501, and a gap is left between the second dustproof assembly 7 and the inner wall of the accommodating chamber 501. In actual application, the second dustproof assembly 7 is stably supported by the support shafts 502 to ensure that the opening of the accommodating chamber 501 can be continuously covered during the movement of the second dustproof assembly 7, and the dust exhaust fan 13 generates airflow in the dust guide pipe 14 and pushes the dust to flow into the accommodating chamber 501, and then the dust is discharged from the dust outlet hole 5011 along the gap between the second dustproof assembly 7 and the accommodating chamber 501, which is conducive to centralized dust treatment.

[0081] refer to Figure 5 As shown, in this embodiment, in step S02, the sealing chamber 1 is connected to a support plate 15, and the support plate 15 is rotatably connected to a mounting frame 16 slidably connected to the mounting chamber 5. The sealing chamber 1 is driven and connected to the second driving mechanism 6 through the mounting frame 16. The support plate 15 is provided with a pipe through hole 151. The outer end of the dust guide pipe 14 passes through the pipe through hole 151 and the second dustproof component 7 and then extends into the mounting chamber 5. The second dustproof component 7 is rotatably connected to the dust guide pipe 14; the mounting frame 16 is connected to a driving motor 17, and the driving motor 17 is rotatably connected to the support plate 15. The driving motor 17 drives the support plate 15 to rotate, and drives the sealing chamber 1 to rotate horizontally, so that the clamping mechanism 4 rotates horizontally, which is convenient for horizontally adjusting the clamping angle of the clamping mechanism 4, and is convenient for smoothly grabbing the wafer.

[0082] refer to Figure 5 As shown, in actual application, the second driving mechanism 6 drives the mounting frame 16 to move the sealing bin 1 horizontally; specifically, the output end of the driving motor 17 is connected to a gear, and the supporting plate 15 is provided with a gear ring meshing with the gear. The driving motor 17 drives the gear to rotate, and the supporting plate 15 is driven to rotate under the meshing action of the gear and the gear ring, so as to realize the horizontal rotation of the sealing bin 1 and the clamping mechanism 4, and meet the horizontal movement and horizontal rotation of the clamping mechanism 4; when the sealing bin 1 rotates, the dust guide pipe 14 rotates smoothly in the second dustproof component 7, and the second dustproof component 7 can maintain the dustproof effect on the mounting bin 5 during the rotation of the sealing bin 1, and the dust in the dust guide pipe 14 is sucked away by the dust exhaust fan 13 and introduced into the mounting bin 5, so as to concentrate the dust in the dust guide pipe 14 in the mounting bin 5, which is conducive to the centralized treatment of dust.

[0083] refer to Figure 6 As shown, in this embodiment, the sealing chamber 1 is provided with an installation cavity 101, the drag chain body 100 is installed in the installation cavity 101, an air inlet net 11 is installed at one end of the installation cavity 101, and the other end of the installation cavity 101 is connected to a dust exhaust pipe 12, and the air inlet net 11 is connected to the installation cavity 101; Figure 7 As shown, the outer end of the dust exhaust pipe 12 is connected to a dust extraction fan 13 after passing through the installation cavity 101 , and the output end of the dust extraction fan 13 is connected to a dust guide pipe 14 .

[0084] In actual application, a negative pressure device is connected to the air inlet net 11, and the dust in the installation cavity 101 is driven to be discharged along the dust exhaust pipe 12 under the action of airflow. Figure 4 As shown, the dust in the dust exhaust pipe 12 is discharged through the dust guide pipe 14 through the dust extraction fan 13, the flow speed of the airflow in the installation cavity 101 is accelerated, and the dust discharge speed is improved; specifically, two sealing chambers 1 are provided, and the first driving mechanism 3 is driven and connected with the corresponding first dustproof component 2, so that the first dustproof component 2 moves up and down synchronously, driving the clamping mechanism 4 to move smoothly, and a three-way joint is connected between the outer ends of the two dust exhaust pipes 12 and the dust extraction fan 13, and the dust in the dust exhaust pipe 12 flows to the dust guide pipe 14 through the dust extraction fan 13.

[0085] refer to Figure 8 As shown, in this embodiment, the clamping mechanism 4 includes a clamping bin 41 and a clamping drive mechanism 42 driven and connected to a clamping claw 410. The first drive mechanism 3 is driven and connected to the clamping bin 41. The clamping claw 410 is provided with an adsorption area 4101. The clamping drive mechanism 42 drives the clamping claw 410 to move so that the clamping claw 410 approaches or moves away from the clamping bin 41.

[0086] In actual application, the first driving mechanism 3 is a linear motor, and the clamping driving mechanism 42 is a linear slide module or an electric cylinder. When clamping the wafer, the adsorption area 4101 is filled with negative pressure through an external negative pressure device, for example, a negative pressure pump, and the clamping driving mechanism 42 drives the clamping claw 410 to approach the wafer, and the wafer is adsorbed in the adsorption area 4101 by the negative pressure to stably adsorb the wafer; after the wafer is clamped, the clamping driving mechanism 42 drives the clamping claw 410 to approach the clamping bin 41, so that the clamping claw 410 moves to the top or bottom of the clamping bin 41, and the wafer is moved out of the wafer loading space, thereby realizing wafer clamping in a narrow space. The clamping bin 1 can move smoothly in the wafer loading space, thereby improving the wafer loading efficiency.

[0087] refer to Fig. 9As shown, in this embodiment, the clamping bin 41 is provided with an activity space 411, and the activity space 411 is installed with a collection camera 4111 for photographing wafers, the clamping claw 410 is connected to a movable part 420, and the clamping claw 410 is slidably connected to the activity space 411 through the movable part 420, and the movable part 420 is connected to a dust shield 430, and the clamping drive mechanism 42 is drivingly connected to the movable part 420; the clamping drive mechanism 42 drives the movable part 420 to reciprocate at the opening of the activity space 411, so that the dust shield 430 blocks the activity space 411.

[0088] refer to Fig.10 As shown, in actual application, the clamping drive mechanism 42 drives the moving part 420 to move, so that the clamping claw 410 switches between clamping and resetting, and the acquisition camera 4111 follows the clamping bin 41 to shoot the wafer. When the wafer is not grasped, the clamping claw 410 moves to the top or bottom of the clamping bin 1, saving space occupancy; when the moving part 420 moves, it drives the dust shield 430 to block the activity space 411, effectively blocking the gap between the activity space 411 and the moving part 3, preventing dust from entering the clamping bin 1, and reducing the impact of dust on the clamping bin 1.

[0089] refer to Fig.10 , 11 As shown, in this embodiment, the clamping claw 410 includes a clamping claw body 41001 and a clamping seat 41002 connected to the clamping claw body 41001, the clamping seat 41002 is connected to the moving part 420, the clamping claw body 41001 is provided with an adsorption channel 41003, the adsorption area 4101 is provided on the clamping claw body 41001, and the adsorption channel 41003 is communicated with the adsorption area 4101; in actual application, the outer end of the adsorption channel 41003 is connected to the negative pressure, so that the negative pressure fills the adsorption channel 41003 and the adsorption area 4101, and the wafer is adsorbed by the negative pressure of the adsorption area 4101, and the negative pressure access point is set at the outer end of the adsorption channel 41003. The negative pressure is connected to the outer end of the adsorption channel 41003 to achieve adsorption of the wafer, thereby meeting the wafer adsorption requirements in narrow spaces.

[0090] refer to Fig.12 , 13 As shown, the middle part of the adsorption channel 41003 passes through the side of the clamp body 41001 away from the adsorption area 4101, and the clamping seat 41002 covers the middle part of the adsorption channel 41003. After the clamp body 41001 is separated from the clamping seat 41002, the adsorption channel 41003 can be cleaned directly, which is conducive to cleaning and maintenance of the adsorption channel 41003 and improving the use quality of the adsorption channel 41003.

[0091] refer to Fig.14 , 15As shown, the movable part 420 is provided with a threading channel 4201 which passes through from top to bottom, the inner end of the threading channel 4201 is located in the clamping bin 41, and a threading port 4202 is provided on the side of the movable part 420, and the threading port 4202 is communicated with the threading channel 4201; in actual application, the open end of the adsorption channel 41003 is connected to the negative pressure joint, and the relevant pipelines used for the connection of the negative pressure joint extend into the clamping bin 41 along the threading channel 4201 and the threading port 4202, and when the movable part 420 moves relative to the clamping bin 41, the pipeline is passed between the threading channel 4201 and the threading port 4202, and the pipeline is clearly arranged to prevent the pipeline from being entangled when the movable part 420 moves, and it is convenient to repair and detect the pipeline.

[0092] refer to Fig.16 As shown, the gripping device also includes a locking mechanism 8, and the clamping seat 41002 is slidably connected to the movable part 420. After the clamping seat 41002 moves to the desired position relative to the movable part 420, the locking mechanism 8 locks the clamping claw 410 and the movable part 420; in actual application, the locking mechanism 8 adopts a screw and a nut. After the installation position of the clamping seat 41002 on the movable part 420 is determined, the screw is passed through the clamping claw body 41001, the clamping seat 41002 and the movable part 420, and the nut is rotated to lock the clamping claw body 41001, the clamping seat 41002 and the movable part 420, which is convenient for disassembly and assembly, and convenient for adjusting the relative installation position between the clamping claw 41001 and the movable part 420.

[0093] refer to Fig.17 As shown, in the present embodiment, the sealing chamber 1 is provided with a movable opening 102 connected with the installation cavity 101, the first dustproof component 2 includes a driving member 21 slidably connected to the movable opening 102 and a dustproof member 22 connected to the driving member 21, the installation opening 201 is provided on the driving member 21, the driving member 21 is connected to the first driving mechanism 3, the first driving mechanism 3 drives the driving member 21 to move so that the dustproof member 22 blocks the movable opening 102; in actual application, the first driving mechanism 3 drives the drag chain body 100 to move, and the drag chain body 100 is hidden in the installation opening 201 and the sealing chamber 1, with a clever structure, which is convenient for installing the drag chain body 100; the first driving mechanism 3 drives the driving member 21 to move, so that the dustproof member 22 blocks the movable opening 102, effectively blocks the movable opening 102, and prevents dust from entering the movable opening 102.

[0094] refer to Fig.18 As shown, an air inlet fan 1011 is installed in the installation cavity 101. The air inlet fan 1011 draws air at the air inlet net 11 under negative pressure to push the air in the sealed chamber 1 to be discharged from the dust exhaust pipe 12. The air inlet fan 1011 pushes the dust in the sealed chamber 1 to flow toward the dust exhaust pipe 12, thereby accelerating the dust flow rate.

[0095] refer to Fig.18 As shown, a plurality of rotating shafts 1012 are installed in the installation cavity 101, and the dust-proof member 22 is sleeved on the rotating shaft 1012. The two opposite sides of the dust-proof member 22 are both fitted on the inner side of the movable opening 102. A gap is left between the dust-proof member 22 and the inner wall of the installation cavity 101, and the inner side of the dust-proof member 22 is surrounded by a space for accommodating the drag chain body 100; in actual application, the dust-proof member 22 is a belt-shaped structure, and the first driving mechanism 3 drives the driving member 21 to move, and drives the dust-proof member 22 to move around the rotating shaft 1012. The rotating shaft 1012 stably supports the dust-proof member 22, so that the dust-proof member 22 can stably and continuously cover the movable opening 102 to ensure the dust-proof effect; the air flowing into the sealed chamber 1, along with the airflow along the gap between the dust-proof member 22 and the inner wall of the installation cavity 101, is mixed with dust and is discharged from the dust guide pipe 14 after passing through the dust exhaust pipe 12 and the dust exhaust fan 13, which is conducive to the smooth discharge of dust and ensures that the sealed chamber 1 is clean and tidy.

[0096] refer to Fig.19 As shown, in this embodiment, the clamping bin 41 is installed with at least two installation shafts 412, the dust shield 430 is sleeved on the installation shaft 412, both ends of the dust shield 430 are connected to the movable part 420, the clamping drive mechanism 42 is drivingly connected to the clamping drive frame 421, and the clamping drive frame 421 is connected to the movable part 420; in actual application, the clamping drive mechanism 42 drives the clamping drive frame 421 to move, and drives the movable part 420 and the dust shield 430 to move. Specifically, the dust shield 430 is made of PE100-3 material, and the cleanliness can reach Class 1. The dust shield 430 is supported by the installation shaft 412 to ensure that the dust shield 430 stably blocks the activity space 411.

[0097] As shown in reference 20, the clamping drive frame 421 is penetrated through the inner side of the dust shield 430, the clamping drive frame 421 is provided with a clamping accommodating groove 4211, and the dust shield 430 is penetrated through the clamping accommodating groove 4211, which saves space and has a compact structure.

[0098] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention is disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technician familiar with the profession can make some changes or modifications to equivalent embodiments of equivalent changes by using the technical contents disclosed above without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent changes and modifications made to the above embodiments according to the technology of the present invention are within the scope of the technical solution of the present invention without departing from the content of the technical solution of the present invention.

Claims

1. A wafer grabbing method, It is characterized in that The following steps are involved: S01, driving the sealing chamber (1) to move, so that the clamping mechanism (4) can move up and down and / or horizontally; S02, driving the sealing chamber (1) to rotate horizontally, so that the clamping mechanism (4) rotates horizontally; S03. In step S01, when the clamping mechanism (4) moves to the desired position, the clamping claw (410) is driven to absorb the wafer, and then the clamping mechanism (4) drives the clamping claw (410) to approach the sealing chamber (1), and moves the clamping claw (410) to the top or bottom of the clamping chamber (1).

2. The wafer grabbing method according to claim 1, It is characterized in that In step S01, a gripping device is used to drive the sealed bin (1) to move, the gripping device comprising a sealed bin (1), a first dustproof component (2) connected to the sealed bin (1), and a first driving mechanism (3) drivingly connected to the first dustproof component (2), the first driving mechanism (3) drivingly connected to a clamping mechanism (4), the sealed bin (1) being equipped with a drag chain body (100), the first dustproof component (2) being provided with an installation opening (201) connecting the drag chain body (100) and the first driving mechanism (3); The first driving mechanism (3) drives the first dustproof component (2) and the clamping mechanism (4) to move up and down synchronously, so that the first dustproof component (2) covers the drag chain body (100); The clamping mechanism (4) is driven and connected to a clamping claw (410). When the clamping mechanism (4) moves to a desired position, the clamping claw (410) is driven to absorb the wafer. Then, the clamping mechanism (4) drives the clamping claw (410) to approach the sealing chamber (1).

3. The wafer grabbing method according to claim 2, It is characterized in that In step S01, the gripping device further comprises a mounting bin (5) and a second driving mechanism (6), the sealing bin (1) is slidably connected to the mounting bin (5), the second driving mechanism (6) is drivingly connected to the sealing bin (1), the mounting bin (5) is equipped with a second dustproof component (7), and the second dustproof component (7) is drivingly connected to the second driving mechanism (6); The second driving mechanism (6) drives the sealing bin (1) and the clamping mechanism (4) to move horizontally, so that the second dustproof component (7) covers the connection between the sealing bin (1) and the installation bin (5); The top of the installation bin (5) is provided with a receiving cavity (501), the second dustproof component (7) moves in the receiving cavity (501) and blocks the top opening of the receiving cavity (501), and the outer end of the dust guide tube (14) extends into the inner side of the second dustproof component (7); A plurality of support shafts (502) are installed in the accommodating chamber (501), the second dustproof component (7) is sleeved on the support shafts (502), a dust outlet hole (5011) is provided at the bottom of the accommodating chamber (501), and a gap is left between the second dustproof component (7) and the inner wall of the accommodating chamber (501).

4. The wafer grabbing method according to claim 3, It is characterized in that In step S02, the sealing chamber (1) is connected to a support plate (15), the support plate (15) is rotatably connected to a mounting frame (16) slidably connected to the mounting chamber (5), the sealing chamber (1) is drivingly connected to the second driving mechanism (6) via the mounting frame (16), the support plate (15) is provided with a pipe penetration hole (151), the outer end of the dust guide pipe (14) passes through the pipe penetration hole (151) and the second dustproof component (7) and then extends into the mounting chamber (5), and the second dustproof component (7) is rotatably connected to the dust guide pipe (14); The mounting frame (16) is connected to a driving motor (17), and the driving motor (17) is drivingly connected to the supporting plate (15). The driving motor (17) drives the supporting plate (15) to rotate, and drives the sealing chamber (1) to rotate horizontally, so that the clamping mechanism (4) rotates horizontally.

5. The wafer grabbing method according to claim 2, It is characterized in that The sealing chamber (1) is provided with an installation cavity (101) inside, the drag chain body (100) is installed in the installation cavity (101), an air inlet net (11) is installed at one end of the installation cavity (101), the other end of the installation cavity (101) is connected to a dust exhaust pipe (12), and the air inlet net (11) is connected to the installation cavity (101); The outer end of the dust exhaust pipe (12) is connected to a dust extraction fan (13) after passing through the installation cavity (101), and the output end of the dust extraction fan (13) is connected to a dust guide pipe (14).

6. The wafer grabbing method according to claim 2, It is characterized in that The clamping mechanism (4) comprises a clamping bin (41) and a clamping drive mechanism (42) drivingly connected to the clamping claw (410); the first drive mechanism (3) is drivingly connected to the clamping bin (41); the clamping claw (410) is provided with an adsorption area (4101); the clamping drive mechanism (42) drives the clamping claw (410) to move so that the clamping claw (410) approaches or moves away from the clamping bin (41); When clamping a wafer, the clamping drive mechanism (42) drives the clamping claw (410) to approach the wafer, and the wafer is adsorbed in the adsorption area (4101) by negative pressure; After the wafer is clamped, the clamping drive mechanism (42) drives the clamping claw (410) to approach the clamping bin (41), so that the clamping claw (410) moves to the top or bottom of the clamping bin (41).

7. The wafer grabbing method according to claim 6, It is characterized in that The clamping bin (41) is provided with an activity space (411), the activity space (411) is equipped with a collection camera (4111) for photographing wafers, the clamping claw (410) is connected to a moving part (420), the clamping claw (410) is slidably connected to the activity space (411) via the moving part (420), the moving part (420) is connected to a dust shield (430), and the clamping drive mechanism (42) is drivingly connected to the moving part (420); The clamping drive mechanism (42) drives the moving member (420) to move back and forth at the opening of the activity space (411), so that the dust blocking member (430) blocks the activity space (411).

8. The wafer grabbing method according to claim 7, It is characterized in that The clamping claw (410) comprises a clamping claw body (41001) and a clamping seat (41002) connected to the clamping claw body (41001), the clamping seat (41002) is connected to the moving part (420), the clamping claw body (41001) is provided with an adsorption channel (41003), the adsorption area (4101) is provided on the clamping claw body (41001), and the adsorption channel (41003) is connected to the adsorption area (4101); The middle part of the adsorption channel (41003) passes through the side of the clamp body (41001) away from the adsorption area (4101), the clamping seat (41002) covers the middle part of the adsorption channel (41003), the movable member (420) is provided with a threading channel (4201) passing through from top to bottom, the inner end of the threading channel (4201) is located in the clamping bin (41), and the side of the movable member (420) is provided with a threading port (4202), and the threading port (4202) is connected to the threading channel (4201); The gripping device further comprises a locking mechanism (8), wherein the clamping seat (41002) is slidably connected to the movable member (420), and after the clamping seat (41002) moves to a desired position relative to the movable member (420), the locking mechanism (8) locks the clamping claw (410) and the movable member (420).

9. The wafer grabbing method according to claim 5, It is characterized in that The sealing chamber (1) is provided with a movable opening (102) communicating with the installation cavity (101); the first dustproof component (2) comprises a driving member (21) slidably connected to the movable opening (102) and a dustproof member (22) connected to the driving member (21); the installation opening (201) is provided on the driving member (21); the driving member (21) is drivingly connected to the first driving mechanism (3); the first driving mechanism (3) drives the driving member (21) to move so that the dustproof member (22) covers the movable opening (102); An air inlet fan (1011) is installed in the installation cavity (101), and the air inlet fan (1011) draws air from the air inlet net (11) under negative pressure to push the air in the sealed bin (1) to be discharged through the dust exhaust pipe (12); A plurality of rotating shafts (1012) are installed in the installation cavity (101), and the dustproof member (22) is sleeved on the rotating shaft (1012). Two opposite sides of the dustproof member (22) are in contact with the inner side of the movable opening (102), and a gap is left between the dustproof member (22) and the inner wall of the installation cavity (101). The inner side of the dustproof member (22) forms a space for accommodating the drag chain body (100).

10. The wafer grabbing method according to claim 7, It is characterized in that The clamping bin (41) is installed with at least two installation shafts (412), the dust shield (430) is sleeved on the installation shaft (412), both ends of the dust shield (430) are connected to the moving member (420), the clamping drive mechanism (42) is drivingly connected to the clamping drive frame (421), and the clamping drive frame (421) is connected to the moving member (420); The clamping drive frame (421) is inserted into the inner side of the dust shield (430), the clamping drive frame (421) is provided with a clamping accommodating groove (4211), and the dust shield (430) is inserted into the clamping accommodating groove (4211).

Images