Display module and preparation method of display module

Abstract

Embodiments of the present disclosure provide a display module and a preparation method thereof. The display module comprises a first heat dissipation component, a circuit board, a display driving chip, a micro light emitting chip, a conductive area, and a second heat dissipation component. The circuit board and the display driving chip are arranged on the same side of the first heat dissipation component. The display driving chip is bonded to the micro light emitting chip on the side away from the first heat dissipation component. The conductive area electrically connects the display driving chip and the circuit board. The second heat dissipation component is arranged on the side of the display driving chip away from the first heat dissipation component.

Description

TECHNICAL FIELD

[0001] Embodiments of the present disclosure relate to the field of display technology, and in particular, to a display module and a manufacturing method thereof. BACKGROUND

[0002] Micro LED, as the latest display technology in the market, has attracted more and more attention from the industry due to its small pixel size and high luminous brightness.

[0003] Since the pixel chip size of Micro LED is very small, the light emitting efficiency of the chip is more susceptible to temperature. When the temperature rises, the light emitting efficiency will decrease significantly. How to enhance the heat dissipation capacity of the Micro LED display module is a difficult problem to be solved. SUMMARY

[0004] Embodiments described herein provide a display module, a display device, and a manufacturing method of the display module.

[0005] According to a first aspect of the present disclosure, a display module is provided, which includes a first heat dissipation component, a circuit board, a display driving chip, a micro light emitting chip, a conductive area, and a second heat dissipation component. The circuit board and the display driving chip are disposed on the same side of the first heat dissipation component, the display driving chip is bonded to the micro light emitting chip on the side away from the first heat dissipation component, the conductive area electrically connects the display driving chip and the circuit board, and the second heat dissipation component is disposed on the side of the display driving chip away from the first heat dissipation component.

[0006] In some embodiments of the present disclosure, the second heat dissipation component includes an intermediate hollow area that is the same size as the micro light emitting chip, and the intermediate hollow area is disposed in alignment with the micro light emitting chip.

[0007] In some embodiments of the present disclosure, the display driving chip and the first heat dissipation component, and the display driving chip and the second heat dissipation component are attached by a bonding thermally conductive adhesive layer.

[0008] In some embodiments of the present disclosure, the bonding thermally conductive adhesive layer between the display driving chip and the second heat dissipation component is disposed in a peripheral area surrounding the micro light emitting chip.

[0009] In some embodiments of the present disclosure, the surface of the second heat dissipation component is black.

[0010] In some embodiments of the present disclosure, the first heat dissipation component is a heat dissipation substrate integrally formed with the circuit board, and the circuit board includes a portion extending out of the heat dissipation substrate.

[0011] According to a second aspect of the present disclosure, a preparation method of a display module is provided, which comprises: providing a first heat dissipation component, a circuit board, a display driving chip, and a micro light emitting chip; the circuit board is arranged on one side of the first heat dissipation component; the display driving chip is bonded to the micro light emitting chip on a side of the display driving chip facing away from the first heat dissipation component; the side of the display driving chip facing away from the micro light emitting chip is attached to a side of the first heat dissipation component facing the circuit board; a conductive area electrically connecting the display driving chip and the circuit board is made; and a second heat dissipation component is attached to the side of the display driving chip facing away from the first heat dissipation component.

[0012] In some embodiments of the present disclosure, the second heat dissipation component comprises an intermediate hollow area equal in size to the micro light emitting chip, and the attaching of the second heat dissipation component to the side of the display driving chip facing away from the first heat dissipation component comprises: positioning the intermediate hollow area and the micro light emitting chip in alignment when the second heat dissipation component is attached.

[0013] In some embodiments of the present disclosure, the attaching of the side of the display driving chip facing away from the micro light emitting chip to the side of the first heat dissipation component facing the circuit board comprises: making an adhesive heat conductive glue layer on the side of the first heat dissipation component facing the circuit board; and attaching the side of the display driving chip facing away from the micro light emitting chip to the side of the first heat dissipation component facing the circuit board using the adhesive heat conductive glue layer; and the attaching of the second heat dissipation component to the side of the display driving chip facing away from the first heat dissipation component further comprises: making an adhesive heat conductive glue layer on a peripheral area surrounding the micro light emitting chip on the side of the display driving chip facing away from the first heat dissipation component; and attaching the second heat dissipation component to the side of the display driving chip facing away from the first heat dissipation component using the adhesive heat conductive glue layer.

[0014] In some embodiments of the present disclosure, the preparation method further comprises: performing blackening treatment on the surface of the second heat dissipation component.

[0015] In various embodiments of the present disclosure, the first heat dissipation component and the second heat dissipation component are arranged on two sides of the display driving chip respectively, forming a double-channel heat dissipation structure, and enhancing the heat dissipation effect of the display module. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly described below. It should be noted that the drawings described below only relate to some embodiments of the present disclosure, but not limit the present disclosure, wherein:

[0017] Figures 1A-1D is a side view and a top view schematic diagram of the structure of the display module according to various embodiments of the present disclosure;

[0018] Figures 2A-2C is a schematic flow chart related to the preparation method of the micro display device according to various embodiments of the present disclosure;

[0019] It is to be noted that the elements in the figures are schematic and not drawn on scale. DETAILED DESCRIPTION

[0020] In order to make the purposes, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are a part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative effort belong to the protection scope of the present disclosure.

[0021] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this present subject matter belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the specification and relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein. As used herein, the statement that two or more parts or components are "connected" or "coupled" together shall mean that the parts are joined or linked together either directly or through one or more intermediate parts or components. In addition, as used herein, the term "number" shall mean one or an integer greater than one (i.e., more than one).

[0022] For ease of description, spatially relative terms, such as "upper", "lower", "left", "right", "front", "back", and the like, can be used herein for the purpose of illustrating one device or element's spatial relationship to another device or element within the figures. For example, terms such as "above", "over", "top", "up", "down", "bottom", "under" and the like, can be used herein to describe one element's spatial position relative to another element, as illustrated in the figures. The terms "contacting" or "in contact" mean connecting or placing two elements such as first and second structures together with or without an intervening element at the interface between the two elements. It will be understood that the spatially relative terms are intended to encompass different orientations of the devices in use or operation in addition to the orientations depicted in the figures. For example, if a device in the figures is inverted, then a figure described as being on top of other devices or structures would now be oriented up below the other devices or structures. Accordingly, the exemplary term "above" can encompass both an orientation of above and below. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. The devices can be positioned in other ways relative to one another, such as by rotating 90 degrees or in other ways.

[0023] In the existing micro display technology, the display module is usually not provided with a heat dissipation structure or is only provided with a single-channel heat dissipation, so that the heat dissipation area of the Micro LED is small when working, and the heat dissipation effect is poor, thereby easily affecting the display performance of the entire Micro LED display module.

[0024] Embodiments of the present disclosure provide a display module, which is provided with a heat dissipation component on each side of the display driving chip to realize a double-channel heat dissipation design, and the formed double-channel heat dissipation design significantly improves the heat dissipation area and the heat dissipation effect compared with the single-channel heat dissipation design.

[0025] Figure 1A A side view schematic diagram showing the structure of a display module 100 according to an embodiment of the present disclosure is shown. The display module 100 can include a first heat dissipation component 101, a circuit board 102, a display driving chip 103, a micro light emitting chip 104, a conductive area 105, and a second heat dissipation component 106.

[0026] In the embodiment, the circuit board 102 and the display driving chip 103 are arranged on the same side of the first heat dissipation component 101. Alternatively, the circuit board 102 and the display driving chip 103 are arranged on the same side of the first heat dissipation component 101 with a spacing, i.e., the two are not in direct contact. Alternatively, the circuit board 102 can be a flexible printed circuit (FPC). The FPC is a highly reliable, flexible printed circuit board made of polyimide or polyester film as a substrate, which has the characteristics of high wiring density, light weight, thin thickness, and good bending property.

[0027] The display driving chip 103 is bonded to the micro light emitting chip 104 on the side away from the first heat dissipation component 101. The micro light emitting chip 104 can include a plurality of micro light emitting units capable of independently emitting light, and the plurality of micro light emitting units are arranged in an array. The display driving chip 103 can drive the micro light emitting chip 104. Alternatively, the micro light emitting chip 104 covers part of the area on the side of the display driving chip 103 away from the first heat dissipation component 101, i.e., there is still part of the area on the side that is not covered by the micro light emitting chip 104. Generally, the display driving chip 103 and the micro light emitting chip 104 have the same area and generate more heat during the operation of the display module, and the heat dissipation demand of the related area is stronger.

[0028] The conductive area 105 electrically connects the display driving chip 103 and the circuit board 102. That is, the display driving chip 103 and the circuit board 102 can be connected in conduction through the conductive area 105. Alternatively, the conductive area can be various media that can transmit electrical signals. Figure 1A The conductive area 105 described in the above is only an example, and the conductive area 105 can be various forms, including but not limited to conductive wires and conductive layers. The number of the conductive area 105 can be one or multiple.

[0029] The second heat dissipation component 106 is arranged on the side of the display driving chip 103 away from the first heat dissipation component 101. The second heat dissipation component 106 can be made of high-thermal-conductivity metal or non-metal material. Figure 1A The specific position, shape, and number of the second heat dissipation component 106 shown in the above are only examples, and the second heat dissipation component 106 can be various shapes that meet the description, and the number of the second heat dissipation component 106 can be one or multiple. Alternatively, since the second heat dissipation component 106 is arranged on the side of the display driving chip 103 away from the first heat dissipation component 101, i.e., on the same side of the display driving chip 103 as the micro light emitting chip 104. Alternatively, the micro light emitting chip 104 and the second heat dissipation component 106 on the same side of the display driving chip 103 can be in contact or not in contact.

[0030] Optionally, the micro light emitting chip 104 can also be provided with a transparent cover plate 107 on the side facing away from the display driving chip 103. The transparent cover plate 107 can effectively block dust, moisture and other harmful substances to ensure that the micro light emitting chip 104 works stably in various environments. In addition, the transparent cover plate 107 allows the light emitted by the micro light emitting chip 104 to pass through, which can enhance the transmittance and uniformity of the light and improve the light emitting effect.

[0031] In the embodiment, the display driving chip side uses the first heat dissipation component shared with the circuit board for heat dissipation, and the other side is provided with the second heat dissipation component for heat dissipation, forming an upward and downward double-channel heat dissipation structure for the display module, especially the display driving chip. Compared with the single-channel structure, the heat dissipation area is increased, and the heat dissipation effect is obviously improved. Moreover, the first heat dissipation component can be shared by the display driving chip and the circuit board while realizing heat dissipation for the display driving chip and the circuit board, which increases the heat dissipation performance and reduces the use of additional heat dissipation components, simplifying the product structure.

[0032] In some embodiments of the present disclosure, the second heat dissipation component 106 includes an intermediate hollow area which is the same size as the micro light emitting chip 104, and the intermediate hollow area is arranged in position with the micro light emitting chip 104. The side view and top view of the related structure can be referred to in Figure 1A and Figure 1B . As shown in Figure 1A and 1B , the second heat dissipation component 106 is provided as an intermediate hollow structure, wherein the intermediate hollow area of the second heat dissipation component 106 is the same size as the micro light emitting chip 104, and the intermediate hollow area is arranged in position with the micro light emitting chip 104. The arrangement in position can make the projection of the intermediate hollow area coincide with the micro light emitting chip 104, that is, the light emitted by the micro light emitting chip 104 can pass through the intermediate hollow area of the second heat dissipation component 106 and irradiate to the outside. By adopting this intermediate hollow structure, on the one hand, the intermediate hollow area can allow the light to smoothly exit the micro light emitting chip 104 without blocking the light path, and on the other hand, the second heat dissipation component 106 with this intermediate hollow structure can directly dissipate heat on the peripheral area surrounding the light emitting chip on the side of the display driving chip, which can increase the heat dissipation area as much as possible, thereby further improving the heat dissipation effect of the double-channel heat dissipation structure. For example, the second heat dissipation component can be designed as a rectangular ring structure with an intermediate hollow area, and the intermediate hollow area and the micro light emitting chip are the same size rectangular.

[0033] Optionally, the display module can further include a transparent cover plate 107, which can be arranged in the hollowed-out area of the second heat dissipation component 106. In this way, the display driving chip in the non-light-emitting area can use the double-channel heat dissipation structure of the first heat dissipation component and the second heat dissipation component for heat dissipation, and the transparent cover plate 107 can also be used for heat dissipation at the micro light-emitting chip in the light-emitting area, so that the overall heat dissipation effect can be further improved.

[0034] In some embodiments of the present disclosure, the display driving chip 103 and the first heat dissipation component 101 are attached through the adhesive heat-conducting glue layer 108, and the display driving chip 103 and the second heat dissipation component 106 are attached through the adhesive heat-conducting glue layer 108. The schematic diagram of the structure of these embodiments can be referred to as Figure 1C . As shown in Figure 1C , the display driving chip 103 and the first heat dissipation component 101 are attached through the adhesive heat-conducting glue layer 108, and the display driving chip 103 and the second heat dissipation component 106 are attached through the adhesive heat-conducting glue layer 108. The adhesive heat-conducting glue layer 108 can use various glue materials with adhesive and high heat-conducting effects. It should be noted that the adhesive heat-conducting glue layer 108 used between the display driving chip 103 and the first heat dissipation component 101 and the adhesive heat-conducting glue layer 108 used between the display driving chip 103 and the second heat dissipation component 106 can use the same glue material or different glue materials. In the display module of these embodiments, on the one hand, the adhesive heat-conducting glue layer 108 has an adhesive effect, which can realize the fixed connection between different structures, and on the other hand, the adhesive heat-conducting glue layer 108 also has a heat-conducting effect, which can better transmit the heat of the display driving chip to the first heat dissipation component 101 and the second heat dissipation component 106, so as to better dissipate heat through the first heat dissipation component 101 and the second heat dissipation component 106, and realize better overall heat dissipation effect.

[0035] In some embodiments of the present disclosure, the adhesive heat-conducting glue layer 108 between the display driving chip 103 and the second heat dissipation component 106 is arranged in the peripheral area surrounding the micro light-emitting chip 104. Figure 1C and Figure 1D respectively show the side view schematic diagram and the top view schematic diagram of the structure of the display module 100 in this embodiment. In order to observe the position and structure of the adhesive heat-conducting glue layer 108, Figure 1D , the second heat dissipation component 106 is omitted, and the adhesive heat-conducting glue layer 108 between the display driving chip 103 and the second heat dissipation component 106 is highlighted. As Figure 1DAs shown, the side of the display driving chip 103 away from the first heat dissipation component 101 has peripheral regions which are not covered by the micro light emitting chip 104. In these peripheral regions, the adhesive heat conductive glue layer 108 can be arranged to realize the adhesion between the display driving chip 103 and the second heat dissipation component 106. In the technical solution of the present embodiment, the adhesive heat conductive glue layer surrounds the micro light emitting chip, which can increase the contact area with the display driving chip as much as possible, and enhance the heat dissipation effect that can be conducted to the second heat dissipation component through the adhesive heat conductive glue layer. Optionally, the adhesive heat conductive glue layer 108 has a spacing region with the micro light emitting chip 104, i.e. the adhesive heat conductive glue layer 108 is not in contact with the micro light emitting chip 104, so that the potential influence of the adhesive heat conductive glue layer 108 on the photoelectric performance of the micro light emitting chip 104 can be avoided.

[0036] In some embodiments of the present disclosure, the surface of the second heat dissipation component 106 is black. Compared with other colors, black can better dissipate heat to air when in contact with air. In the present embodiment, the second heat dissipation component is located above the driving chip and the micro light emitting chip array, and can be in contact with air. Designing the surface of the second heat dissipation component as black is conducive to further improving the heat dissipation effect to air. Optionally, the second heat dissipation component 106 can be made by pre-surface blackening.

[0037] In some embodiments of the present disclosure, the first heat dissipation component 101 is a heat dissipation substrate integrally formed with the circuit board 102, and the circuit board 102 includes a portion 109 extending out of the heat dissipation substrate. In the present embodiment, the structure and positional relationship of the components of the display module 100 can be referred to Figure 1C and 1DThe heat dissipation substrate can be a substrate with heat dissipation capability, and the display driving chip bottom can be disposed on the heat dissipation substrate. On the one hand, the heat dissipation substrate can play a bearing role that the substrate can have, and on the other hand, the heat dissipation substrate has heat dissipation capability. Optionally, the heat dissipation substrate can adopt a single structure of a material with high heat dissipation performance and bearing performance, including but not limited to an aluminum substrate, a copper substrate, and a ceramic substrate. In the embodiment, the first heat dissipation component 101 adopts the heat dissipation substrate, which is equivalent to integrating the heat dissipation function and the bearing function in one component, and is conducive to reducing the overall structural complexity. Moreover, the first heat dissipation component 101 is integrally formed with the circuit board 102, which is also conducive to further reducing the process difficulty of combining with other components in the later manufacturing of the display module. In addition, the circuit board 102 includes a portion 109 extending out of the heat dissipation substrate, and the portion 109 extending out can also be used to connect with other electronic components, so that the overall structural usability is further increased. That is, in the embodiment, the heat dissipation and bearing functions are simultaneously implemented by using the heat dissipation substrate, the heat dissipation substrate is integrally formed with the circuit board, and the portion of the circuit board designed to extend out of the heat dissipation substrate, which can improve the heat dissipation effect while further reducing the structural complexity and manufacturing difficulty of the display module.

[0038] The display device provided in the embodiment of the present disclosure includes the display module 100, and the structure of the display module 100 can refer to the description of any of the embodiments. Figures 1A-1D In addition, the display device can further include other components, which are not limited herein. The display device can be applied to any product with a display function, for example, electronic paper, a mobile phone, a tablet computer, a television, a notebook computer, a digital photo frame, a wearable device, or a navigator, etc.

[0039] Figure 2A A schematic flowchart of a preparation method 20 of a display module according to an embodiment of the present disclosure is shown.

[0040] In step 201, a first heat dissipation component, a circuit board, a display driving chip, and a micro light emitting chip are provided, the circuit board is disposed on one side of the first heat dissipation component, and the display driving chip is bonded to the micro light emitting chip on a side away from the first heat dissipation component.

[0041] In the embodiment, the circuit board and the first heat dissipation component can be integrally manufactured in advance. Optionally, in the structure manufactured in advance, the circuit board can be disposed in a partial region on one side of the first heat dissipation component. Optionally, the two can be combined in various ways.

[0042] The display driving chip is bonded to the micro light emitting chip on a side away from the first heat dissipation component. That is, one side of the display driving chip can be bonded to the backlight side of the micro light emitting chip in advance to form a light emitting module. Optionally, in the formed module, the micro light emitting chip can be disposed in a partial region on one side of the display driving chip.

[0043] In step 202, the side of the display driving chip facing away from the micro light emitting chip is attached to the side of the first heat dissipation component facing the circuit board.

[0044] In this embodiment, when the display driving chip is attached to the first heat dissipation component, the side of the display driving chip to be attached is the side facing away from the micro light emitting chip, and the side of the first heat dissipation component to be attached is the side facing the circuit board. That is, after the two are attached, the display driving chip and the circuit board are arranged on the same side of the first heat dissipation component.

[0045] Optionally, the display driving chip and the circuit board can be arranged apart, that is, without contact between the two, to avoid interference between the two.

[0046] In step 203, a conductive area for electrically connecting the display driving chip and the circuit board is made.

[0047] In this embodiment, for the display driving chip and the circuit board, a conductive area for electrically connecting the two can be made. The specific process and manner of making the conductive area can be determined according to actual functional needs. Optionally, the conductive area made can be a conductive metal wire.

[0048] Optionally, the conductive area made can be electrically connected to the side of the display driving chip facing away from the first heat dissipation component and the side of the circuit board facing away from the first heat dissipation component, respectively. This way of making the conductive area is relatively easy to implement, which is conducive to reducing the overall manufacturing difficulty and cost of the display module. Optionally, when making the conductive area, it is ensured that the conductive area does not contact the second heat dissipation component, to avoid interference of the second heat dissipation component with the electrical signal of the display module.

[0049] In step 204, the second heat dissipation component is attached to the side of the display driving chip facing away from the first heat dissipation component.

[0050] In this embodiment, the second heat dissipation component is attached to the side of the display driving chip facing away from the first heat dissipation component.

[0051] In the display module prepared by the preparation method of this embodiment, the first heat dissipation component shared by the display driving chip and the circuit board is used for heat dissipation on one side of the display driving chip, and the second heat dissipation component is arranged for heat dissipation on the other side of the display driving chip, forming a double-channel heat dissipation structure for the display module, especially for the display driving chip. Compared with a single-channel structure, the heat dissipation area is increased, and the heat dissipation effect is obviously increased. Moreover, the first heat dissipation component can be shared by the display driving chip and the circuit board for heat dissipation, which also reduces the use of additional heat dissipation components and simplifies the product structure.

[0052] Optionally, the preparation method 20 can further include: adhering a transparent cover plate to the side of the micro light emitting chip away from the display driving chip. The transparent cover plate can protect the light emitting chip from dust, moisture and other harmful substances while allowing the light of the light emitting chip to pass through.

[0053] In some embodiments of the present disclosure, the second heat dissipation component includes an intermediate hollow area equal in size to the micro light emitting chip, and step 204 can include: positioning the intermediate hollow area and the micro light emitting chip in alignment when adhering. In these embodiments, the second heat dissipation component includes the intermediate hollow area. That is, the second heat dissipation component can be designed as a hollow structure when it is manufactured in advance. The intermediate hollow area is equal in size to the micro light emitting chip, that is, the intermediate hollow area and the micro light emitting chip are the same in shape and size. Optionally, the micro light emitting chip is in a rectangular structure, and the intermediate hollow area included in the second heat dissipation component can be a rectangular structure consistent with the size of the micro light emitting chip. For example, the second heat dissipation component can be designed as a rectangular ring structure, and the hollow intermediate area is a rectangular structure consistent with the size of the micro light emitting chip. When adhering in step 204, the intermediate hollow area and the micro light emitting chip are positioned in alignment. That is, the light emitting area of the micro light emitting chip can completely pass through the hollow area and be emitted without being blocked. In this embodiment, the contact area of the second heat dissipation component with the display driving chip can be maximized without blocking the micro light emitting chip, thereby maximizing the heat dissipation effect. Optionally, when adhering the transparent cover plate, the transparent cover plate can be adhered to the intermediate hollow area of the second heat dissipation component.

[0054] In some embodiments of the present disclosure, step 202 can include various sub-steps as shown in Figure 2B Figure 2C ​The sub-steps shown. Specifically, step 202 can include: sub-step 2021, making an adhesive thermal glue layer on the side of the first heat dissipation component facing the circuit board; sub-step 2022, using the adhesive thermal glue layer to adhere the side of the display driving chip facing away from the micro light emitting chip to the side of the first heat dissipation component facing the circuit board. Step 204 can further include: sub-step 2041, making an adhesive thermal glue layer on the peripheral area of the micro light emitting chip surrounding the display driving chip away from the first heat dissipation component; sub-step 2042, using the adhesive thermal glue layer to adhere the second heat dissipation component on the side of the display driving chip away from the first heat dissipation component; and step 2043, positioning the middle hollow area with the micro light emitting chip during adhesion. In this embodiment, the adhesion of the display driving chip to the first heat dissipation component and the second heat dissipation component through the adhesive thermal glue layer can not only play a role in adhesion and fixation, but also enhance the heat dissipation performance of the display driving chip to the first heat dissipation component and the second heat dissipation component due to the high thermal conductivity of the adhesive thermal glue layer, thereby achieving better heat dissipation effect. In addition, the adhesive thermal glue layer is made in the peripheral area surrounding the micro light emitting chip, which can further improve the adhesion and thermal conductivity area of the adhesive thermal glue layer, and achieve better adhesion and heat dissipation effect.

[0055] In some embodiments of the present disclosure, the above preparation method 20 further includes: performing blackening treatment on the surface of the second heat dissipation component. Optionally, the blackening treatment on the surface of the second heat dissipation component in step 205 can be performed before step 201 or after step 201. Compared with other colors, black can better dissipate heat to the air when in contact with the air. In the display module prepared by the preparation method of the present embodiment, the second heat dissipation component is located above the driving chip and the micro light emitting chip array and can be in contact with the air. After the surface of the second heat dissipation component is blackened, the black second heat dissipation component is beneficial to further improving the heat dissipation effect to the air.

[0056] In some embodiments of the present disclosure, the above preparation method 20 of the display module can further include: preparing an integrally formed circuit board and a first heat dissipation component, the first heat dissipation component being a heat dissipation substrate, and the circuit board including a portion extending out of the heat dissipation substrate. In this embodiment, the integrated design of heat dissipation and bearing in the heat dissipation substrate, the integrally formed heat dissipation substrate and circuit board, and the portion of the circuit board extending out of the heat dissipation substrate can improve the heat dissipation effect while further reducing the structural complexity and manufacturing difficulty of the display module and improving the usability.

[0057] The diagrams of the flowcharts and block diagrams in the drawings show the architecture, functionality, and operation of possible implementations of apparatuses and methods according to various embodiments of the present disclosure. In this regard, each block in the flowcharts or block diagrams can represent a module, a segment, or a portion of code which comprises one or more executable instructions for implementing the specified logical functions. In some alternative implementations, the functions noted in the blocks can occur out of the order noted in the figures. For example, two blocks shown in succession can in fact be executed substantially concurrently or the blocks can sometimes be executed in the reverse order, depending upon the functionality involved. It will also be noted that each block of the block diagrams and / or flowchart illustrations, and combinations thereof, can be implemented by dedicated hardware-based systems which perform the specified functions or acts or combinations thereof, or can be implemented by a combination of dedicated hardware and computer instructions.

[0058] The singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a" or "the" element is

[0059] Further aspects and scope of adaptations become apparent from the description provided herein. It should be appreciated that individual aspects of the present application can be implemented alone or in combination with one or more other aspects. It should also be appreciated that the description and specific examples herein are intended to be illustrative only and are not intended to limit the scope of the present application.

[0060] The foregoing detailed description of the application has been presented for purposes of clarity and description. It is apparent to those skilled in the art that many modifications and variations could be made to the embodiments of the present application without deviating from the spirit and scope of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A display module, characterized by The display module comprises a first heat dissipation component, a circuit board, a display driving chip, a micro light emitting chip, a conductive area, and a second heat dissipation component.

2. The display module of claim 1, wherein, The first heat dissipation component is a heat dissipation substrate integrally formed with the circuit board, and the circuit board comprises a portion extending out of the heat dissipation substrate.

3. A method for manufacturing a display module, characterized by, The preparation method comprises: providing a first heat dissipation component, a circuit board, a display driving chip, and a micro light emitting chip, wherein the circuit board is arranged on one side of the first heat dissipation component, and one side of the display driving chip is bonded to the micro light emitting chip; bonding, to one side of the first heat dissipation component facing the circuit board, a side of the display driving chip facing away from the micro light emitting chip, comprising: forming an adhesive thermal conductive adhesive layer on the side of the first heat dissipation component facing the circuit board, and using the adhesive thermal conductive adhesive layer to bond the side of the display driving chip facing away from the micro light emitting chip to the side of the first heat dissipation component facing the circuit board; forming a conductive area for electrically connecting the display driving chip and the circuit board; bonding, to a side of the display driving chip facing away from the first heat dissipation component, a second heat dissipation component, comprising: performing blackening treatment on a surface of the second heat dissipation component, and the second heat dissipation component comprises an intermediate hollow area equal in size to the micro light emitting chip; forming an adhesive thermal conductive adhesive layer on a peripheral area of the micro light emitting chip on the side of the display driving chip facing away from the first heat dissipation component; bonding, to the side of the display driving chip facing away from the first heat dissipation component, the second heat dissipation component using the adhesive thermal conductive adhesive layer, and the intermediate hollow area is arranged in position with the micro light emitting chip during the bonding.

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