Glass-based circuit board and preparation process thereof

Abstract

The invention relates to a glass-based circuit board and a preparation process thereof, the glass-based circuit board comprises a glass substrate, the glass substrate comprises a bottom substrate and a covering sheet, the bottom substrate is provided with a recessed area, the surface of the bottom substrate is connected with a metal line, and a part of line segment of the metal line is located in the recessed area. The covering piece is located in the sunken area and covers part of line segments of the metal line, the covering piece is connected with the bottom substrate, a plurality of windows are formed in the covering piece, and a gland area is formed between every two adjacent windows; compared with the prior art, the invention has the beneficial effects that when the metal circuit is connected to the bottom substrate, through the structural design of the bottom substrate and the covering sheet, the clamping force to the metal circuit can be realized after the bottom substrate and the covering sheet are butted, and meanwhile, the existence of the covering sheet also prevents the metal circuit from moving in the direction far away from the bottom substrate; the processing difficulty can be reduced, and the stability of the metal circuit is maintained.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit boards, and particularly relates to a glass-based circuit board and a preparation process thereof. Background Art

[0002] Glass-based circuit boards are electronic components with circuit patterns printed on glass substrates. They are widely used in electronic products, automotive displays, AR / VR devices, smart homes and other fields. Compared with traditional organic substrate (such as epoxy boards) circuit boards, they have greatly improved thermal stability, mechanical strength, thermal expansion and wear resistance.

[0003] Although the overall performance of glass-based circuit boards is good, their processing difficulty is also high. Due to the smooth surface of the glass substrate, it is difficult to firmly connect the conductive film to the glass substrate using general processes. For example, after the copper foil is connected to the glass substrate by gluing, the connection stability between the two is poor, and the copper foil is easily peeled off from the glass substrate.

[0004] In order to increase the connection strength between the two in the prior art, special processes and equipment are often required for processing and manufacturing, which leads to a significant increase in manufacturing costs. Therefore, a glass-based circuit board that is easy to process and manufacture is urgently needed. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a glass-based circuit board and a preparation process thereof. Through the structural design of the glass-based circuit board, the connection stability between the conductive film and the glass substrate can be increased.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is a glass-based circuit board, including a glass substrate, the glass substrate including a bottom substrate and a cover sheet, the bottom substrate is provided with a recessed area, the surface of the bottom substrate is connected with a metal circuit, some segments of the metal circuit are located in the recessed area, the cover sheet is located in the recessed area and covers some segments of the metal circuit, the cover sheet is connected to the bottom substrate, a plurality of openings are provided on the cover sheet, a pressure covering area is provided between two adjacent openings, a perforation is provided at the pressure covering area, a docking component can be connected at the perforation, and the lower end of the docking component is against the metal circuit.

[0007] Furthermore, the docking assembly includes a docking column located in the through hole, a seat plate is fixed to the upper end of the docking column, and when the lower end of the docking column contacts the metal circuit, the seat plate is connected to the cover sheet.

[0008] In addition, a process for preparing a glass-based circuit board is also provided, comprising the following steps:

[0009] S1. Substrate processing: Select high-purity materials to make the bottom substrate and cover sheet, and clean the surfaces of both;

[0010] S2 Surface pretreatment: Activate the surface of the cleaned substrate to remove the gas adsorbed on the surface of the substrate;

[0011] S3. Lamination molding: coating a film on the surface of the bottom substrate and forming a circuit outline on the coated film;

[0012] S4. Etching: etching the area outside the circuit outline on the film, and finally retaining the film within the circuit outline area;

[0013] S5. Deposition and electroplating: depositing a conductive layer on the etched glass substrate, and electroplating the conductive layer with an electroplating solution;

[0014] S6. Docking: After the cover sheet is sunk into the recessed area, the cover sheet and the bottom substrate are bonded together;

[0015] S7. Assembling: Connect the docking assembly to the cover sheet, and then install the components on the docking assembly.

[0016] Preferably, the bottom substrate and the cover sheet are both made of silicate glass, quartz glass or borosilicate glass.

[0017] Preferably, the thin film comprises copper foil or silicon oxide.

[0018] Preferably, a photoresist layer is coated on the film, and after a circuit outline is formed on the photoresist layer, the photoresist layer is exposed to light to solidify the photoresist in the circuit outline region.

[0019] Preferably, the area outside the circuit outline on the photoresist layer is removed by a developer to expose the thin film area that needs to be etched.

[0020] It should be noted that during the etching process, the etching time and the etchant concentration of the recessed area and the bottom substrate surface area are strictly controlled.

[0021] Compared with the prior art, the beneficial effect of the present invention is that when the metal circuit is connected to the bottom substrate, through the structural design of the bottom substrate and the cover sheet, the clamping force on the metal circuit can be achieved after the two are connected. At the same time, the existence of the cover sheet also hinders the metal circuit from moving away from the bottom substrate. Based on such a structure, not only the processing difficulty can be reduced, but also the stability of the metal circuit can be maintained. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the bottom substrate structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the cover sheet structure of the present invention;

[0024] Among them, 1-bottom substrate, 2-covering sheet, 3-recessed area, 4-opening window, 5-pressing area, 6-perforation. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. The components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various configurations. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention. In the embodiments, the components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the application claimed for protection, but merely represents the selected embodiments of the present application.

[0026] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "front", "back" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be an electrical connection; it can be a hydraulic oil circuit connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] See also Figure 1 to Figure 2 A glass-based circuit board shown in the figure is composed of a glass substrate and a metal circuit, but the metal circuit is not pasted on the surface of the glass substrate. There is a tight structure between the metal circuit and the glass substrate, and the tight structure is used to increase the firmness of the metal circuit.

[0029] The tight structure is as follows: the above-mentioned glass substrate is composed of two parts, namely a bottom substrate 1 and a cover sheet 2. The bottom substrate 1 and the cover sheet 2 need to be connected by an adhesive. Since the two are made of the same material, it is only necessary to select a suitable adhesive to firmly connect the bottom substrate 1 and the cover sheet 2. The adhesive can be selected from epoxy resin, acrylic acid, chloroprene rubber, silicone, etc. These adhesives have the characteristics of transparency, strength and heat resistance, and the metal circuit is located between the two. At this time, the metal circuit is not only connected to the surface of the bottom substrate 1, but also clamped by the bottom substrate 1 and the cover sheet 2. When the bottom substrate 1 and the cover sheet 2 are firmly connected, the stability of the metal circuit is also increased, and the difficulty of peeling the metal circuit from the bottom substrate 1 is increased, thereby increasing the connection stability.

[0030] When connecting the bottom substrate 1 and the cover sheet 2, other methods can also be used, such as: using hardware for connection. Suitable hardware can be selected according to the size and shape of the bottom substrate 1, such as: straight bar buckles, bolt assemblies, etc. Here, the bolt assembly is taken as an example, and the bottom substrate 1 and the cover sheet 2 are assembled. The bottom substrate 1 and the cover sheet 2 should be provided with holes corresponding to the positions, and buried grooves are provided around the holes. Then, after the bolt assembly is passed through the holes of the two, the bottom substrate 1 and the cover sheet 2 are locked by screwing the bolt assembly. However, it should be noted that in the selection of the bolt assembly, the assembly of the screw and the nut cannot be selected, because after the bottom substrate 1 and the cover sheet 2 are connected, it should be ensured that the whole is a flat plate without large protrusions on its surface. After the bottom substrate 1 and the cover sheet 2 are connected by the bolt assembly, the two ends of the bolt assembly are respectively located in the buried grooves on the bottom substrate 1 and the cover sheet 2, and no protrusions are formed at this time, thereby ensuring the flatness of the glass substrate.

[0031] In addition, a recessed area 3 is provided on the bottom substrate 1. At this time, two surfaces with different levels are formed on the bottom substrate 1, one of which is a low-level surface, which is the bottom surface of the recessed area 3, and the other is a high-level surface, which is the initial surface of the bottom substrate 1. Since the metal circuit is connected to the bottom substrate 1, the metal circuit at this time has two segments, one of which is connected to the low-level surface and the other is connected to the high-level surface. When the cover sheet 2 is connected to the bottom substrate 1, the cover sheet 2 only connects the metal circuit located on the low-level surface. The metal circuit is covered, that is, only a part of the metal circuit is covered by the cover sheet 2, and the other part of the line segments is still exposed, so the cover sheet 2 is required to have the following structure, a plurality of windows 4 are provided on the cover sheet 2, and a pressure-covering area 5 is provided between two adjacent windows 4. After the cover sheet 2 is docked with the bottom substrate 1, the pressure-covering area 5 of the cover sheet 2 is located in the recessed area 3. At this time, the line segment part of the metal circuit located in the recessed area 3 is pressure-covered. In the process of docking and assembling the cover sheet 2 and the bottom substrate 1, the other part of the line segments of the metal circuit passes through the windows on the cover sheet.

[0032] After completing the docking of the bottom substrate 1 and the cover sheet 2, the components can be connected to the metal circuit. The position not covered by the pressure cover area of ​​the cover sheet 2 can be directly connected to the components and the metal circuit by soldering. At the same time, a through hole 6 is provided in the pressure cover area, and a docking component can be connected to the through hole 6. The lower end of the docking component is against the metal circuit. The docking component has conductive properties and includes a docking column and a seat plate. The docking column is located in the through hole, and the seat plate is located at the upper end of the docking column. When the lower end is docked and contacts the metal circuit, the seat plate contacts the surface of the cover sheet. At this time, the cover sheet 2 can be connected to the seat plate by screws or other adhesives, and then the components can be installed on the seat plate. For example, the components and the seat plate are welded with an electric soldering iron. In this way, the stability of the metal circuit can be increased while not affecting the installation of the components.

[0033] When manufacturing the glass-based circuit board in this application, the following steps can be adopted:

[0034] First, a base substrate 1 and a cover sheet 2 made of high-purity materials are selected, for example, the base substrate 1 and the cover sheet 2 are made of silicate glass, quartz glass or borosilicate glass. During the manufacturing process, different molds are selected for the base substrate 1 and the cover sheet 2 according to their structural differences. After the two are formed, the surfaces of the two are thoroughly cleaned to remove impurities such as dirt and grease on the surface to ensure that the substrate surface is clean and free of dirt;

[0035] Then, the bottom substrate that has been cleaned is subjected to surface activation treatment to remove the gas adsorbed on the surface of the bottom substrate 1, thereby enhancing the surface adhesion;

[0036] After the base substrate 1 is pre-treated, a circuit outline needs to be formed on its surface. One or more thin films can be coated on the surface of the base substrate 1. The thin films can be copper foil or silicon oxide, etc. This thin film is used for subsequent circuit wiring. It should be noted that the concave area 3 of the base substrate 1 is also coated with a thin film. After the coating is completed, the thin film in the concave area 3 needs to be processed to ensure that the thickness of the thin film in the concave area 3 is consistent with the thickness of the thin film outside the concave area 3 on the base substrate 1, and then a circuit outline is formed on the thin film using a photolithography machine;

[0037] After the circuit outline is formed, a layer of photoresist is coated on the surface of the film as a mask of the circuit outline, and the photoresist is exposed to solidify the photoresist in the circuit outline area, and then a developer is used to remove the uncured photoresist outside the circuit outline. At this time, the circuit outline is formed and the area to be etched is exposed;

[0038] Then use chemical etchant to etch the film part not protected by photoresist, and finally retain the film in the circuit outline area to form the circuit outline. The etching time and etchant concentration must be strictly controlled during the etching process to ensure the accuracy and integrity of the circuit outline.

[0039] Then, a conductive layer is deposited on the etched glass substrate. Physical vapor deposition (PVD) or chemical vapor deposition (CVD) methods can be used for processing. The conductive layer can be made of copper or aluminum. The deposition rate and deposition thickness must be controlled during the deposition process to ensure the uniformity and conductivity of the conductive layer.

[0040] Then, electrochemical method is used to realize electroplating, so as to further increase the thickness and wear resistance of the conductive layer. During the electroplating process, appropriate electroplating solution and electroplating conditions are selected according to the different materials of the conductive layer to ensure the quality and performance of the electroplated layer.

[0041] At this point, the connection between the metal circuit and the bottom substrate is completed. Then, after the cover sheet is sunk into the recessed area, the cover sheet is fitted with the bottom substrate and then the two are connected. Adhesives or hardware can be used for connection, and a flat glass-based circuit board is formed. When it is necessary to connect components to the covered line segment of the metal circuit, the docking assembly is connected to the cover sheet, and then the components are installed on the docking assembly. The docking assembly and the cover sheet can also be connected with adhesives and hardware to finally form a complete glass-based circuit board.

[0042] The method is relatively simple to manufacture a glass-based circuit board, and even the above-mentioned deposition step can be omitted, and the metal circuit can also have a certain connection stability.

[0043] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A glass-based circuit board, comprising a glass substrate, characterized in that: The glass substrate comprises a bottom substrate and a cover sheet, the bottom substrate is provided with a recessed area, a metal circuit is connected to the surface of the bottom substrate, a part of the metal circuit is located in the recessed area, the cover sheet is located in the recessed area and covers a part of the metal circuit, and the cover sheet is connected to the bottom substrate; The cover sheet is provided with a plurality of windows, a capping area is provided between two adjacent windows, a perforation is provided at the capping area, a docking assembly can be connected at the perforation, and the lower end of the docking assembly is against the metal circuit.

2. A glass-based circuit board according to claim 1, characterized in that: The docking assembly comprises a docking column located in the through hole, a seat plate is fixed to the upper end of the docking column, and when the lower end of the docking column contacts the metal circuit, the seat plate is connected to the covering sheet.

3. A process for preparing a glass-based circuit board as claimed in any one of claims 1 to 2, characterized in that: The steps include: S1. Substrate processing: Select high-purity materials to make the bottom substrate and cover sheet, and clean the surfaces of both; S2 Surface pretreatment: Activate the surface of the cleaned substrate to remove the gas adsorbed on the surface of the substrate; S3. Lamination molding: coating a film on the surface of the bottom substrate and forming a circuit outline on the coated film; S4. Etching: etching the area outside the circuit outline on the film, and finally retaining the film within the circuit outline area; S5. Deposition and electroplating: depositing a conductive layer on the etched glass substrate, and electroplating the conductive layer with an electroplating solution; S6. Docking: After the cover sheet is sunk into the recessed area, the cover sheet and the bottom substrate are bonded together; S7. Assemble: Connect the docking assembly to the cover sheet and then mount the components on the components.

4. The process for preparing a glass-based circuit board according to claim 3, characterized in that: The bottom substrate and the cover sheet are both made of silicate glass, quartz glass or borosilicate glass.

5. The process for preparing a glass-based circuit board according to claim 3, characterized in that: The film includes copper foil or silicon oxide.

6. The process for preparing a glass-based circuit board according to claim 5, characterized in that: The film is coated with a photoresist layer. After forming a circuit outline on the photoresist layer, the photoresist layer is exposed to solidify the photoresist in the circuit outline area.

7. The process for preparing a glass-based circuit board according to claim 6, characterized in that: The area outside the circuit outline on the photoresist layer is removed by a developer to expose the film area that needs to be etched.

8. The process for preparing a glass-based circuit board according to claim 3, characterized in that: During the etching process, the etching time and etching agent concentration of the recessed area and the bottom substrate surface area are strictly controlled.

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