Dual-density micro-channel manifold heat exchanger

Abstract

The invention provides a dual-density micro-channel manifold heat exchanger which comprises a manifold layer located on the upper portion and a heat exchange micro-channel layer located on the lower portion, the manifold layer comprises a fluid inlet manifold located on the upper face and a fluid inlet manifold located on the lower face, and the fluid inlet manifold communicates with the fluid inlet manifold; the heat exchange micro-channel layer comprises high-density micro-channels and low-density micro-channels which are located on the upper portion face, the low-density micro-channels are located on the two sides of the high-density micro-channels, and the lower portion face of the heat exchange micro-channel layer is in thermal connection with a heat source; the manifold layer covers the upper part of the high-density micro-channel layer, and the manifold layer wraps the high-density micro-channel area, so that fluid distribution can be optimized; the manifold layer is provided with a fluid outlet, and the fluid outlet is connected with the low-density microchannels. The micro-channel heat sink wall surface temperature difference is effectively reduced, the non-uniform heat dissipation requirement of heat dissipation equipment is met, and the internal temperature distribution of the equipment is improved.

Description

Technical Field

[0001] The invention relates to the field of heat exchange, and in particular to a double-density microchannel manifold heat exchanger. Background Art

[0002] A heat exchanger is a device that exchanges heat between hot and cold fluids, also known as a heat exchanger. Heat exchangers are widely used in many fields. In fields such as electronics, petrochemicals, communications, aerospace, etc., due to their special working scenes, there are special requirements for the size and weight of the heat exchanger, and their heat exchange capacity is required to be stronger. In 1981, some scholars proposed the use of microchannels for heat dissipation, which can not only reduce the volume of the heat exchanger but also greatly improve its heat exchange capacity by utilizing the higher specific surface area of ​​the microchannel. However, although its heat exchange capacity is strong, its overall pressure loss is also high due to the small hydraulic diameter of the microchannel.

[0003] A large number of studies have found that microchannel heat exchangers still have the problem of uneven temperature distribution. In 1991, another scholar proposed a manifold microchannel heat exchanger based on his microchannel heat exchanger, which greatly reduced its overall pressure loss. However, a large number of studies have shown that the fluid distribution in the manifold microchannel is not uniform, resulting in uneven temperature distribution.

[0004] With the continuous development and popularization of heat dissipation equipment, its power density continues to increase, resulting in a gradual increase in the heat generated inside the equipment. Effective heat dissipation has become one of the key factors to ensure the long-term stable operation of heat dissipation equipment. However, traditional heat dissipation technology faces challenges in meeting the needs of efficient heat dissipation and miniaturization of equipment.

[0005] At present, two heat dissipation methods are widely used in high-power heat dissipation equipment. The first is forced air cooling that relies on fans to push air. It has a simple design and is easy to maintain, but requires a large area of ​​radiator, and there are problems with extra fan power consumption and noise. The second is to use a microchannel liquid-cooled radiator driven by a pump. The tiny channel structure increases the contact area between heat and fluid, achieves efficient heat dissipation in a smaller space, and improves heat dissipation efficiency. However, there are two main problems with traditional microchannel heat dissipation technology: one is the excessive inlet and outlet pressure drop due to the small hydraulic diameter, and the other is the uneven temperature distribution inside the microchannel.

[0006] Patent CN201811088661.9 discloses a manifold-type jet microchannel heat exchanger, which improves heat exchange by jet-enhanced disturbance and improves the temperature distribution characteristics at its bottom. Patent CN202010760271.2 discloses a manifold-type microchannel heat exchanger with a high aspect ratio, which increases the heat exchange area and effectively reduces the pressure drop. Patent 2021104191686 discloses a manifold-type diamond microchannel heat exchanger that meets the requirements of high heat density heat dissipation. Patent CN202110587976.3 discloses a disc-shaped radial microchannel radiator, which solves the temperature unevenness caused by uneven flow through radial microchannels. Patent CN202211385954.X discloses a manifold-type micro-jet microchannel radiator, which reduces the inlet and outlet pressure drop by shortening the flow path of the fluid.

[0007] However, the above patents all focus on improving the performance of microchannel radiators, without considering the uneven power distribution of the heat dissipation device itself. Usually, the heat generated inside is more concentrated than other areas. Insufficient heat dissipation in the middle area may cause the device to overheat or even be damaged. Excessive heat dissipation around the periphery will lead to energy waste. Therefore, effective heat dissipation measures are needed to balance this uneven power situation. Summary of the invention

[0008] The purpose of the present invention is to provide a dual-density microchannel manifold heat exchanger that can achieve heat distribution to different areas, aiming to effectively reduce the temperature difference of the microchannel heat sink wall by adopting immersion liquid cooling technology, to meet the uneven heat dissipation requirements of heat dissipation equipment, and to improve the temperature distribution inside the equipment. At the same time, the radiator can also have the advantages of the manifold structure, strengthen convection disturbance, optimize the flow path of the fluid, and reduce the pressure drop of the fluid at the inlet and outlet.

[0009] In order to achieve the above object, the technical solution of the present invention is as follows:

[0010] A dual-density microchannel manifold heat exchanger includes a manifold layer located at the upper part and a heat exchange microchannel layer located at the lower part, the manifold layer includes a fluid inlet manifold located at the upper surface and a fluid inlet manifold located at the lower surface, the fluid inlet manifold is connected to the fluid inlet manifold; the heat exchange microchannel layer includes a high-density microchannel and a low-density microchannel located at the upper surface, and the lower surface of the heat exchange microchannel layer is thermally connected to a heat source; the manifold layer covers the upper part of the high-density microchannel layer, and the manifold layer wraps the high-density microchannel area, which is conducive to optimizing fluid distribution; the manifold layer is provided with a fluid outlet, and the fluid outlet is connected to the low-density microchannel. The heat exchanger needs to be completely immersed in the box when in use, and uses immersion liquid cooling to dissipate heat; the heat exchanger uses coolant as the heat exchange fluid.

[0011] Preferably, the inlet of the inlet manifold is located in the middle of the manifold layer, with a height of H m =6mm, a double-conical structure extending from the middle to both ends.

[0012] Preferably, the manifold layer comprises closed walls at two opposite ends, and a fluid outlet is formed between the two opposite closed walls.

[0013] Preferably, the inlet manifold extends from the inlet to closed walls at both ends.

[0014] Preferably, the heat exchange microchannel layer adopts a segmented microchannel design, and the high-density microchannel and the low-density microchannels on both sides adopt traditional straight rectangular fin flow channels, wherein the low-density microchannel structures on both sides are completely equal.

[0015] As a preference, the high-density microchannel heat dissipation area has a length L1 = 40-60 mm and a width W1 = 50-70 mm, wherein the fin width W f1 =0.13-0.18mm, channel width W1 = 0.20-0.30mm, channel height H1 = 3-5mm, the number of channels is 130-180; the left low-density microchannel heat dissipation area L2 = 15-21mm, W2 = 50-70mm, where W f2 = 0.8-1.2 mm, W2 = 0.8-1.2 mm, H2 = 6-10 mm, and the number of channels is 25-35. The low-density microchannel on the right is exactly the same as the low-density microchannel on the left, so L2 = L3, W2 = W3.

[0016] As a preferred method, the heat transfer efficiency of the fins inside the radiator is taken into consideration to solve the convective heat transfer area of ​​the corrected actual fluid when it flows through the radiator microchannel. The fitting formula is as follows:

[0017] A=LW(n-1)+2η f LH(n-1)(1.1)

[0018]

[0019] Where A is the contact area between the actual fluid and the wall of the radiator microchannel, including the bottom area of ​​the microchannel and the side areas of the fins, m 2 ; η f is the fin efficiency, that is, the ratio of the actual heat transfer of the fin to the ideal heat transfer; L is the channel length, m; W is the channel width, m; H is the channel height, m; W f is the fin width, m; n is the number of fins, pieces; h is the convection heat transfer coefficient between the fluid and the radiator surface, W / (m 2 ·K);λ c is the thermal conductivity of the fin, W / (m·K).

[0020] According to the formula, the convective heat transfer area of ​​the high-density microchannel is 0.0266m 2 The convection heat transfer area of ​​the low-density microchannel is 0.0065m 2 The convective heat transfer area of ​​the high-density microchannel is 4 times that of the low-density microchannel.

[0021] Preferably, the heat exchanger needs to be completely immersed in the heat exchange fluid when in use, and dissipates heat by immersion liquid cooling.

[0022] Preferably, the heat exchanger uses coolant as the heat exchange fluid. After the fluid enters from the manifold inlet, it flows evenly into the high-density microchannel area for primary heat exchange; the heated coolant enters the low-density microchannel area through the fluid outlets on both sides for secondary heat exchange, and finally flows into the heat exchange fluid filled with coolant, thereby realizing the heat exchange cycle of the liquid.

[0023] Compared with the prior art, the present invention has the following advantages:

[0024] (1) The present invention fully considers the special needs of heat dissipation of heat dissipation equipment and adopts a dual-density microchannel design. The heat exchange surface area is increased in the high-density microchannel area, the heat exchange with the fluid is enhanced, and the heat transfer efficiency is improved. However, the fluid flow rate is large and the temperature is high at the outlet of the high-density microchannel. By setting low-density fins, it is not only possible to effectively disperse the fluid, reduce the strong impact of the fluid at the outlet, and delay the impact on other electronic components on the circuit board, but also to further reduce the fluid temperature without increasing the pressure drop of the entire radiator. This design optimizes the heat dissipation effect while improving the stability and reliability of the system.

[0025] (2) The design of the tapered manifold can not only reduce the velocity difference of the fluid flow and reduce the turbulent loss of the fluid, but also achieve smooth regulation of the fluid flow before the fluid enters the 21 high-density microchannel area, avoiding the problem of local overheating or uneven cooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of the dual-density microchannel manifold heat exchanger of the present invention.

[0027] Figure 2 It is a schematic diagram of the split structure of the double-density microchannel manifold heat exchanger of the present invention.

[0028] Figure 3 It is a schematic diagram of the size identification of the dual-density microchannel manifold heat exchanger of the present invention.

[0029] Figure 4 It is a schematic diagram of the heat exchange microchannel layer structure of the present invention.

[0030] Figure 5It is a schematic diagram of the flow of the fluid manifold layer of the present invention. DETAILED DESCRIPTION

[0031] The specific implementation modes of the present invention are described in detail below with reference to the accompanying drawings.

[0032] In this article, unless otherwise specified, “ / ” represents division, and “×” and “*” represent multiplication.

[0033] A dual-density microchannel manifold heat exchanger, such as Figure 1 As shown, the heat exchanger includes a manifold layer 1 located at the upper part and a heat exchange microchannel layer 2 located at the lower part, the manifold layer 1 includes a fluid inlet manifold 11 located at the upper surface and a fluid inlet manifold 12 located at the lower surface, the fluid inlet manifold 12 is connected to the fluid inlet manifold 11; the heat exchange microchannel layer 2 includes a high-density microchannel 21 and a low-density microchannel 22 located at the upper surface, the low-density microchannel 22 is located on both sides of the high-density microchannel 21, the manifold layer 1 covers the upper part of the high-density microchannel layer 21, and the manifold layer 1 wraps the high-density microchannel layer 21, which is beneficial to optimize the flow path; the manifold layer 1 is provided with a fluid outlet, and the fluid outlet is connected to the low-density microchannel 22. When in use, the heat exchanger needs to be completely immersed in the cooling fluid, and the heat is dissipated by immersion liquid cooling; the heat exchanger uses cooling liquid as the heat exchange fluid; the lower surface of the heat exchange microchannel layer 2 is thermally connected to the heat source.

[0034] The present invention fully considers the special needs of heat dissipation of heat dissipation equipment and adopts a dual-density microchannel design. The heat exchange surface area is increased in the high-density microchannel area, the heat exchange with the fluid is enhanced, and the heat transfer efficiency is improved. However, the fluid flow rate is large and the temperature is high at the outlet of the high-density microchannel. By setting low-density fins, it is not only possible to effectively disperse the fluid, reduce the strong impact of the fluid at the outlet, and delay the impact on other devices, but also to further reduce the fluid temperature without increasing the pressure drop of the entire radiator. This design optimizes the heat dissipation effect while improving the stability and reliability of the system.

[0035] In the present application, the manifold layer 1 only covers the high-density microchannels, and does not cover the low-density microchannels. This is because the heat exchange of the high-density microchannel layer 21 is more intensive, requiring a more efficient heat dissipation method. Therefore, by designing the manifold layer to only cover the high-density microchannels 21, the high-density microchannel area can be completely immersed in the coolant at a lower temperature, thereby maximizing the heat transfer efficiency and effectively reducing the temperature difference of the microchannel heat sink wall. At the same time, the low-density microchannel layer 22 does not require such intensive heat exchange, so directly using the coolant flowing out of the high-density microchannel layer 21 for cooling can reduce the use of liquid cooling medium, reduce the operating cost of the system, and improve economy and sustainability.

[0036] As a preference, Figure 2 , 5 As shown, the inlet of the inlet manifold 12 is located in the middle of the manifold layer, and the double-conical structure extends from the middle to both ends. The design of the conical manifold can not only reduce the velocity difference of the fluid flow and reduce the turbulent loss of the fluid, but also can achieve smooth regulation of the fluid flow before the fluid enters the high-density microchannel 21 area, avoiding the problem of local overheating or uneven cooling.

[0037] Preferably, the manifold layer 1 includes closed walls at two opposite ends, and a fluid outlet is formed between the two opposite closed walls. Through the closing ratio at both ends, the high-density microchannel is closed at both ends, so that the fluid flows out of the high-density microchannel through the fluid outlet after heat exchange.

[0038] Preferably, the inlet manifold extends from the inlet to the closed walls at both ends. Through the above arrangement, the fluid can flow from the center to both ends, and because the tapered end of the tapered structure is located at the closed wall position, the fluid flow can be smoothly regulated, avoiding the problem of local overheating or uneven cooling.

[0039] Preferably, the upper surface of the manifold layer 1 includes a first plane and a rectangular boss protruding upward from the first plane, the boss extending along the two ends of the closed wall, a fluid inlet manifold 11 is arranged in the middle of the boss, and the fluid inlet manifold 12 extends along the boss. After the fluid enters the heat exchanger from the inlet manifold 11, it extends to both sides along the boss, so that the fluid enters the heat exchanger more smoothly and flows smoothly through the microchannel layer. This design can reduce the turbulence and eddy current generated by the fluid, maintain the stable flow state of the fluid, and further improve the heat exchange efficiency.

[0040] Preferably, the heat exchange microchannel layer 2 adopts a segmented microchannel design, and the high-density microchannel 21 and the low-density microchannels 22 on both sides adopt traditional straight rectangular flow channels, wherein the structures of the low-density microchannels 22 on both sides are completely equal.

[0041] As a preference, Figure 3 As shown, the high-density microchannel heat dissipation area has a length L1 = 40-60 mm and a width W1 = 50-70 mm, wherein the fin width W f1 =0.13-0.18mm, channel width W1 = 0.20-0.30mm, channel height H1 = 3-5mm, the number of channels is 130-180; the left low-density microchannel heat dissipation area L2 = 15-21mm, W2 = 50-70mm, where the fin width W f2= 0.8-1.2 mm, channel width W2 = 0.8-1.2 mm, channel height H2 = 6-10 mm, and the number of channels is 25-35. The low-density microchannel on the right is exactly the same as the low-density microchannel on the left, so L2 = L3, W2 = W3.

[0042] The microchannel layer adopts a segmented microchannel design with reasonable parameters such as the ratio of fin to channel width, the aspect ratio of channel height and width according to the heat dissipation requirements of each part. Through the density and size design of the two microchannels, heat can be evenly distributed and the system pressure drop can be reduced. The microchannel uses water as the heat exchange fluid and adopts the traditional straight rectangular fin flow channel design to increase flow stability and improve the temperature uniformity of the radiator, thereby improving the reliability of equipment operation.

[0043] When the fin height and spacing are not exactly the same, the above parameters are averaged.

[0044] As a preferred method, the heat transfer efficiency of the fins inside the radiator is taken into consideration to solve the convective heat transfer area of ​​the corrected actual fluid when it flows through the radiator microchannel. The fitting formula is as follows:

[0045] A=LW(n-1)+2η f LH(n-1)(1.1)

[0046]

[0047] Where A is the contact area between the actual fluid and the wall of the radiator microchannel, including the bottom area of ​​the microchannel and the side areas of the fins, m 2 ; η f is the fin efficiency, that is, the ratio of the actual heat transfer of the fin to the ideal heat transfer; L is the channel length, m; W is the channel width, m; H is the channel height, m; W f is the fin width, m; n is the number of fins, pieces; h is the convection heat transfer coefficient between the fluid and the radiator surface, W / (m 2 ·K);λ c is the thermal conductivity of the fin, W / (m·K).

[0048] The above optimization formula is a way to calculate the optimal contact area. Through the above optimization, even heat distribution can be further achieved, system pressure drop can be reduced, and the temperature uniformity of the radiator can be improved, thereby improving the reliability of equipment operation.

[0049] As a further preferred embodiment, the high-density microchannel heat dissipation area has a length L1 = 50 mm and a width W1 = 60 mm, wherein the fin width W f1 =0.15mm, channel width W1 =0.25mm, channel height H1 =4mm, the number of channels is 150; the left low-density microchannel heat dissipation area L2 = 18mm, W2 = 60mm, where Wf2 =1mm, W2=1mm, H2=8mm, and the number of channels is 29. The low-density microchannel on the right is exactly the same as the low-density microchannel on the left, so L2=L3, W2=W3.

[0050] The best parameter calculated by the formula is that the convection heat transfer area of ​​the high-density microchannel is 0.0266m 2 The convection heat transfer area of ​​the low-density microchannel is 0.0065m 2 The convection heat transfer area of ​​high-density microchannels is four times that of low-density microchannels. Through the above optimization, even heat distribution can be further achieved, system pressure drop can be reduced, and the temperature uniformity of the radiator can be improved, thereby improving the reliability of equipment operation.

[0051] Preferably, the heat exchanger needs to be completely immersed in the cooling fluid when in use, and dissipates heat by immersion liquid cooling.

[0052] Preferably, the heat exchanger uses coolant as the heat exchange fluid. After the fluid enters from the manifold inlet, it flows evenly into the high-density microchannel area for primary heat exchange; the heated coolant enters the low-density microchannel area through the fluid outlets on both sides for secondary heat exchange, and finally flows into the cooling fluid filled with coolant, thereby realizing the heat exchange cycle of the liquid.

[0053] As an improvement, the average height of the fins in the low-density microchannel heat dissipation area is higher than the average height of the fins in the high-density microchannel heat dissipation area.

[0054] As an improvement, the fins of the high-density microchannel heat dissipation zone are set at an angle, and the height of the fins of the high-density microchannel heat dissipation zone gradually increases from the center of the heat dissipation zone to the fin direction of the low-density microchannel heat dissipation zone. In the area connected to the low-density microchannel heat dissipation zone, the height of the fins of the high-density microchannel heat dissipation zone is the same as the height of the fins of the low-density microchannel heat dissipation zone.

[0055] Because the high-density area is forced convection, and the low-density area is basically natural convection heat exchange, by setting the fins in the low-density area to tilt upward, the fluid in the fins in the low-density area can flow out quickly, while flushing the upper part of the fins in the high-density area, so that the upper part of the fins in the high-density area can also enhance heat transfer, improving the heat exchange effect of the upper part of the fins in the high-density area. Through the above settings, the number of fins can be reduced, saving costs, and improving the heat exchange effect.

[0056] As an improvement, the height of the fins in the high-density microchannel heat dissipation area gradually decreases from the center of the heat dissipation area to the fin direction of the low-density microchannel heat dissipation area. By setting it in this way, the height of the fins near the low-density area can be made consistent, ensuring that the fluid can flush the upper part of the fin horizontally instead of flushing upward, which can further enhance heat transfer and improve the heat exchange effect.

[0057] The specific working process is as follows: the fluid enters the heat exchanger from the fluid inlet manifold 11 and then flows into the double-conical manifold channel 12. After being buffered at the manifold, the fluid impacts downward to the high-density microchannel area 21 and flows to both sides along the direction of the microchannel. In the high-density microchannel area 21, due to the dense layout of the microchannels and the immersion cooling method, the contact area between the fluid and the microchannel wall increases, achieving efficient heat transfer. After the enhanced heat exchange in the middle area, the fluid continues to flow through the low-density microchannel 22 area along the flow direction of the fluid microchannel. When the fluid flows from the high-density microchannel 21 into the low-density microchannel 22, the high-speed fluid is broken up, which slows down the strong impact of the fluid at the outlet. Subsequently, the fluid exchanges heat along the low-density microchannel area 22, further cooling the heat exchanger outlet. Finally, the fluid flows out of the heat exchanger through the microchannel fluid outlets on both sides, completing the entire heat exchange process.

[0058] Although the present invention has been disclosed as above with preferred embodiments, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A dual-density microchannel manifold heat exchanger, comprising a manifold layer located at an upper portion and a heat exchange microchannel layer located at a lower portion, the manifold layer comprising a fluid inlet manifold located at an upper surface and a fluid inlet manifold located at a lower surface, the fluid inlet manifold being connected to the fluid inlet manifold; the heat exchange microchannel layer comprising a high-density microchannel and a low-density microchannel located at an upper surface, the low-density microchannel being located at both sides of the high-density microchannel, and the lower surface of the heat exchange microchannel layer being thermally connected to a heat source; the manifold layer covers the upper portion of the high-density microchannel layer, and the manifold layer wraps up the high-density microchannel region, which is beneficial to optimizing fluid distribution; the manifold layer is provided with a fluid outlet, and the fluid outlet is connected to the low-density microchannel.

2. The heat exchanger according to claim 1, It is characterized in that The inlet of the inlet manifold is located in the middle of the manifold layer, with a double-conical structure extending from the middle to both ends.

3. The heat exchanger according to claim 2, It is characterized in that The manifold layer includes closed walls at two opposite ends, and a fluid outlet is formed between the two opposite closed walls.

4. The heat exchanger according to claim 3, It is characterized in that The inlet manifold extends from the inlet to closed walls at both ends.

5. The heat exchanger according to claim 1, It is characterized in that The heat exchange microchannel layer adopts a segmented microchannel design, and the high-density microchannel and the low-density microchannels on both sides adopt straight rectangular fin flow channels, wherein the low-density microchannel structures on both sides are completely equal.

6. The heat exchanger according to claim 5, It is characterized in that High-density microchannel heat dissipation area length L 1 =40-60mm, width W 1 =50-70mm, where the fin width W f1 =0.13-0.18mm, channel width W 1 =0.20-0.30mm, channel height H 1 =3-5mm, the number of channels is 130-180; the left low-density microchannel heat dissipation area L 2 =15-21mm, W 2 =50-70mm, where W f2 =0.8-1.2mm, W 2 =0.8-1.2mm, H 2 =6-10mm, the number of channels is 25-35. The low-density microchannel on the right is exactly the same as the low-density microchannel on the left, so L 2 =L 3 , W 2 =W 3 .

7. The heat exchanger according to claim 6, It is characterized in that Considering the heat transfer efficiency of the fins inside the radiator, the convective heat transfer area of ​​the corrected actual fluid flowing through the radiator microchannel is solved. The fitting formula is as follows: A=LW(n-1)+2η f LH(n-1) (1.1) Where A is the contact area between the actual fluid and the wall of the radiator microchannel, including the bottom area of ​​the microchannel and the side areas of the fins, m 2 ; η f is the fin efficiency, that is, the ratio of the actual heat transfer of the fin to the ideal heat transfer; L is the channel length, m; W is the channel width, m; H is the channel height, m; W f is the fin width, m; n is the number of fins, pieces; h is the convection heat transfer coefficient between the fluid and the radiator surface, W / (m 2 ·K);λ c is the thermal conductivity of the fin, W / (m·K).

8. The heat exchanger according to claim 1, It is characterized in that High-density microchannel heat dissipation area length L 1 =50mm, width W 1 =60mm, where the fin width W f1 =0.15mm, channel width W 1 =0.25mm, channel height H 1 =4mm, the number of channels is 150; the left low-density microchannel heat dissipation area L 2 =18mm, W 2 =60mm, where W f2 =1mm,W 2 =1mm, H 2 =8mm, the number of channels is 29; the low-density microchannel on the right is exactly the same as the low-density microchannel on the left, so L 2 =L 3 , W 2 =W 3 . According to the formula, the convective heat transfer area of ​​the high-density microchannel is 0.0266m 2 The convection heat transfer area of ​​the low-density microchannel is 0.0065m 2 The convective heat transfer area of ​​the high-density microchannel is 4 times that of the low-density microchannel.

9. The heat exchanger according to claim 1, It is characterized in that The heat exchanger needs to be completely immersed in the cooling fluid when in use, and dissipates heat by immersion liquid cooling.

10. The heat exchanger according to claim 9, It is characterized in that The heat exchanger uses coolant as the heat exchange fluid. After the fluid enters from the manifold inlet, it flows evenly into the high-density microchannel area for primary heat exchange; the heated coolant enters the low-density microchannel area through the fluid outlets on both sides for secondary heat exchange, and finally flows into the cooling fluid filled with coolant, thereby realizing the heat exchange cycle of the liquid.

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