Heat dissipation gasket for ceramic PTC (Positive Temperature Coefficient) thermal sensitive ceramic processing

Abstract

The invention is suitable for the technical field of ceramic manufacturing, and provides a heat dissipation gasket for ceramic PTC thermal sensitive ceramic processing, which comprises a thermal sensitive ceramic body, a first heat dissipation gasket, a second heat dissipation gasket and a locking mechanism, the first heat dissipation gasket is connected to the upper surface of the thermal sensitive ceramic body, the second heat dissipation gasket is connected to the lower surface of the thermal sensitive ceramic body, and the locking mechanism is arranged between the first heat dissipation gasket and the second heat dissipation gasket. According to the scheme, rapid connection and locking of the heat dissipation gaskets and the thermal sensitive ceramic body are achieved through the locking mechanism, after one heat dissipation gasket is damaged, the heat dissipation gasket can be rapidly separated from the thermal sensitive ceramic body, rapid disassembly and assembly of the damaged heat dissipation gasket are achieved, and the heat dissipation efficiency is improved. Time and labor are saved, meanwhile, the situation that an integral structure formed by the whole thermal sensitive ceramic body and the heat dissipation gaskets needs to be replaced due to damage of one heat dissipation gasket is effectively avoided, and then unnecessary economic losses are avoided.

Description

Technical Field

[0001] The invention belongs to the technical field of ceramic production, and in particular relates to a heat dissipation pad for processing ceramic PTC thermistors. Background Art

[0002] PTC thermistor ceramic is a new type of semiconductor thermistor ceramic with very unique resistance, temperature thermistor characteristics and automatic temperature control and heating function, which makes it have a wide range of applications. The advantages are simple shape, easy processing, convenient use and fast assembly. It can be used as heating elements such as electric slippers, electric heating plates, electric stoves, electric irons, electric heating plates, electric mosquito repellents, electric thermostats, screen heaters, etc. Its heating method is mainly through the heat conduction heating of the surface of the heating plate manufacturing process. In some heating elements, such as electric thermostats, the heat dissipation area of ​​the thermistor ceramic itself cannot meet the heat demand, and it is necessary to increase the heat dissipation area of ​​the thermistor ceramic by adding structures such as heat dissipation pads.

[0003] Although the current heat sinks are similar, there are still some problems. For example, the current heat sinks are mostly rectangular in shape and are arranged equidistantly on the surface of thermistor ceramics. However, at present, most of these heat sinks and thermistor ceramics use integrated molding technology to fix the thermistor ceramics and the heat sink to form an integral structure. However, since there are often multiple heat sinks, when one of the heat sinks is damaged, the damaged heat sink cannot be replaced separately, and the thermistor ceramics and the heat sink need to be replaced as a whole, resulting in unnecessary economic losses. Summary of the invention

[0004] The invention provides a heat dissipation pad for processing ceramic PTC thermistor ceramics, aiming to solve the problem that the thermistor ceramics and the heat dissipation pads are currently integrated and the damaged heat dissipation pads cannot be disassembled and replaced separately.

[0005] The present invention is implemented as follows: a heat dissipation pad for processing ceramic PTC thermistor ceramics, comprising: a thermistor ceramic body, a first heat dissipation pad, a second heat dissipation pad and a locking mechanism;

[0006] The first heat dissipation pad is connected to the upper surface of the thermistor ceramic body, the second heat dissipation pad is connected to the lower surface of the thermistor ceramic body, and the locking mechanism is arranged between the first heat dissipation pad and the second heat dissipation pad;

[0007] The locking mechanism includes a limit seat, a linkage claw, a slot, a fixed plate and a locking rod. The limit seat is fixed on one side of the second heat dissipation gasket, and a rectangular cavity is concavely arranged on the top of the limit seat. The linkage claw is rotatably connected in the rectangular cavity. The slot is arranged on the linkage claw, and the fixed plate is fixed on one side of the bottom of the first heat dissipation gasket. The locking rod is fixed to the bottom of the fixed plate, and two fixed plates are symmetrically arranged on the locking rod, and a notch is arranged on the top of the limit seat. The locking rod is clamped in the notch, and the linkage claw rotates and is located between two adjacent fixed plates, and at the same time the locking rod is clamped in the slot.

[0008] Preferably, a docking protrusion is fixed on the side wall of the linkage claw, the linkage claw is rotatably connected to the limit seat through a rotating rod, and a first torsion spring is sleeved on the rotating rod, one end of the first torsion spring is fixed on the second heat dissipation gasket, and the other end is fixed on the docking protrusion.

[0009] Preferably, the locking mechanism also includes a check plate, a transmission rod and a check groove, the transmission rod is fixed on the check plate, and the transmission rod is rotatably connected in the rectangular cavity of the limit seat, the check groove is arranged at the edge of the side wall of the linkage claw, and one end of the check plate is slidably abutted in the check groove.

[0010] Preferably, a second torsion spring is sleeved on the transmission rod, one end of the second torsion spring is fixed on the non-return plate, and the other end of the second torsion spring is fixed on the second heat dissipation gasket.

[0011] Preferably, a lever is fixed on the non-return plate, and a slide groove is provided on the side wall of the limit seat. The slide groove is an arc-shaped structure and passes through the rectangular cavity of the limit seat, and the lever is slidably engaged in the slide groove.

[0012] Preferably, two groups of locking mechanisms are provided, and the two groups of locking mechanisms are symmetrically arranged on both sides of the first heat dissipation gasket and the second heat dissipation gasket.

[0013] Preferably, the abutting surfaces of the first heat dissipation gasket and the second heat dissipation gasket with the thermistor ceramic body are both provided with positioning rods, and the upper and lower sides of the thermistor ceramic body are provided with positioning holes, and the positioning rods are docked in the positioning holes.

[0014] Compared with the prior art, the embodiments of the present application have the following beneficial effects:

[0015] In the present scheme, the locking rod in the locking mechanism abuts against the linkage claw, thereby pushing the linkage claw to rotate, and while the linkage claw rotates, the non-return plate abuts against the stop groove, thereby realizing the limit locking of the linkage claw, and the locking rod is firmly locked on the limit seat through the linkage claw, thereby realizing the quick connection and locking of the heat dissipation gasket and the thermistor ceramic body, and after one of the heat dissipation gaskets is damaged, the non-return plate is separated from the non-return groove by rotating the non-return plate, so that the linkage claw can be rotated in the opposite direction to unlock the locking rod, thereby allowing the heat dissipation gasket to be quickly separated from the thermistor ceramic body, thereby realizing the quick disassembly and assembly of the damaged heat dissipation gasket, saving time and effort, and effectively avoiding the situation where the entire thermistor ceramic body and the overall structure composed of the heat dissipation gasket need to be replaced due to the damage of a certain heat dissipation gasket, thereby avoiding unnecessary economic losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the external overall structure of the present invention;

[0017] Figure 2 It is a schematic diagram of the separation structure of the thermosensitive ceramic body and the heat dissipation pad of the present invention;

[0018] Figure 3 It is a schematic diagram of the external structure of the limit seat of the present invention;

[0019] Figure 4 It is a schematic diagram of the internal connection structure of the limit seat of the present invention;

[0020] Figure 5 It is a partial enlarged structural schematic diagram of the first heat dissipation gasket of the present invention;

[0021] In the figure: 1. thermistor ceramic body; 2. first heat dissipation gasket; 3. second heat dissipation gasket; 4. locking mechanism; 41. limit seat; 42. linkage claw; 43. slot; 44. fixing plate; 45. locking rod; 46. first torsion spring; 47. docking protrusion; 48. check plate; 49. transmission rod; 410. check groove; 411. second torsion spring; 412. lever; 413. slide groove; 5. positioning rod; 6. positioning hole. DETAILED DESCRIPTION

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned drawings are intended to cover non-exclusive inclusions. The terms "first", "second", etc. in the specification and claims of this application or the above-mentioned drawings are used to distinguish different objects, not to describe a specific order.

[0023] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0024] The embodiment of the present invention provides a heat dissipation pad for processing ceramic PTC thermistor ceramics, such as Figure 1-5 As shown, it includes: a thermal ceramic body 1, a first heat dissipation pad 2, a second heat dissipation pad 3 and a locking mechanism 4;

[0025] The first heat dissipation pad 2 is connected to the upper surface of the thermistor ceramic body 1, the second heat dissipation pad 3 is connected to the lower surface of the thermistor ceramic body 1, and the locking mechanism 4 is arranged between the first heat dissipation pad 2 and the second heat dissipation pad 3;

[0026] The locking mechanism 4 includes a limit seat 41, a linkage claw 42, a card slot 43, a fixed plate 44 and a locking rod 45. The limit seat 41 is fixed to one side of the second heat dissipation pad 3, and a rectangular cavity is concavely provided at the top of the limit seat 41. The linkage claw 42 is rotatably connected in the rectangular cavity. The card slot 43 is provided on the linkage claw 42. The fixed plate 44 is fixed to one side of the bottom of the first heat dissipation pad 2. The locking rod 45 is fixed to the bottom of the fixed plate 44. The fixed plate 44 is symmetrically provided with two locking rods 45, and a notch is provided at the top of the limit seat 41. The locking rod 45 is clamped in the notch, and the linkage claw 42 rotates and is located between two adjacent fixed plates 44, and at the same time, the locking rod 45 is clamped in the card slot 43.

[0027] The locking mechanism 4 also includes a check plate 48, a transmission rod 49 and a check groove 410. The transmission rod 49 is fixed on the check plate 48, and the transmission rod 49 is rotatably connected in the rectangular cavity of the limit seat 41. The check groove 410 is arranged at the edge of the side wall of the linkage claw 42, and one end of the check plate 48 is slidably abutted in the check groove 410.

[0028] It should be noted that, since the existing heat dissipation gaskets are mostly rectangular in shape and are equidistantly arranged on the surface of the thermistor ceramic, at present, most of these heat dissipation gaskets and thermistor ceramics use integrated molding technology to fix the thermistor ceramics and the heat dissipation gaskets to form an integral structure. However, since there are often multiple heat dissipation gaskets, when one of the heat dissipation gaskets is damaged, the damaged heat dissipation gasket cannot be replaced alone, and the thermistor ceramics and the heat dissipation gasket need to be replaced as a whole, thereby causing unnecessary economic losses. In order to solve this problem, a locking mechanism 4 is provided in the present solution, and the locking rod 45 in the locking mechanism 4 is in contact with the linkage claw 42, thereby pushing the linkage claw 42 to rotate, and while the linkage claw 42 rotates, the check plate 48 is in contact with the stop plate 48. The abutment of the return groove 410 realizes the limit locking of the linkage claw 42, and the locking rod 45 is firmly locked on the limit seat 41 through the linkage claw 42, thereby realizing the quick connection and locking of the heat dissipation gasket and the thermistor ceramic body 1. After one of the heat dissipation gaskets is damaged, the check plate 48 is rotated to separate the check plate 48 from the check groove 410, so that the linkage claw 42 can be rotated in the opposite direction to unlock the locking rod 45, so that the heat dissipation gasket can be quickly separated from the thermistor ceramic body 1, thereby realizing the quick disassembly and assembly of the damaged heat dissipation gasket, saving time and effort, and effectively avoiding the situation where the entire thermistor ceramic body 1 and the overall structure composed of the heat dissipation gasket need to be replaced due to the damage of a certain heat dissipation gasket, thereby avoiding unnecessary economic losses.

[0029] Specifically, in this embodiment, this scheme mainly includes a thermistor ceramic body 1, a first heat dissipation gasket 2, a second heat dissipation gasket 3 and a locking mechanism 4. When in use, the second heat dissipation gasket 3 is firstly abutted against the bottom of the thermistor ceramic body 1. At this time, the limiting seats 41 on both sides of the second heat dissipation gasket 3 are located on both sides of the thermistor ceramic body 1. Then, the thermistor ceramic body 1 is abutted against the top of the thermistor ceramic body 1. At the same time of abutment, the locking rod 45 is docked with the notch on the limiting seat 41, and at the same time, the linkage claw 42 is pushed to rotate, and the linkage claw 42 While rotating, the check plate 48 abuts against the check groove 410, thereby locking the linkage claw 42, and locking the locking rod 45 through the linkage claw 42, thereby locking the first heat dissipation gasket 2 and the second heat dissipation gasket 3 on the upper and lower sides of the thermistor ceramic body 1 respectively. When the heat dissipation gasket is damaged and needs to be replaced, the check plate 48 is rotated by the lever 412 to separate the check plate 48 from the check groove 410, so that the linkage claw 42 can be reversed and the locking rod 45 can be unlocked, so that the heat dissipation gasket can be separated from the thermistor ceramic body 1.

[0030] In a further preferred embodiment of the present invention, Figure 1-5As shown, a docking protrusion 47 is fixed on the side wall of the linkage claw 42, the linkage claw 42 is rotatably connected to the limit seat 41 through a rotating rod, and a first torsion spring 46 is sleeved on the rotating rod, one end of the first torsion spring 46 is fixed on the second heat dissipation gasket 3, and the other end is fixed on the docking protrusion 47.

[0031] In this embodiment, the first torsion spring 46 enables the linkage claw 42 to quickly reverse and reset.

[0032] In a further preferred embodiment of the present invention, Figure 1-5 As shown, a second torsion spring 411 is sleeved on the transmission rod 49 , one end of the second torsion spring 411 is fixed on the check plate 48 , and the other end is fixed on the second heat dissipation pad 3 .

[0033] In this embodiment, the check plate 48 is pushed by the elastic force of the second torsion spring 411 , so that the check plate 48 can always abut against the check groove 410 .

[0034] In a further preferred embodiment of the present invention, Figure 1-5 As shown, a lever 412 is fixed on the check plate 48 , and a slide groove 413 is provided on the side wall of the limit seat 41 . The slide groove 413 is an arc-shaped structure and passes through the rectangular cavity of the limit seat 41 , and the lever 412 is slidably engaged in the slide groove 413 .

[0035] In this embodiment, the staff can drive the non-return plate 48 to rotate through the lever 412, so that the non-return plate 48 can be quickly separated from the non-return groove 410.

[0036] In a further preferred embodiment of the present invention, Figure 1-5 As shown, two groups of locking mechanisms 4 are provided, and the two groups of locking mechanisms 4 are symmetrically arranged on both sides of the first heat dissipation pad 2 and the second heat dissipation pad 3 .

[0037] In this embodiment, the firmness of the connection between the heat dissipation gasket and the thermistor ceramic body 1 is ensured by the symmetrically arranged locking mechanism 4 .

[0038] In a further preferred embodiment of the present invention, Figure 1-5 As shown, the first heat dissipation pad 2 and the second heat dissipation pad 3 are both provided with positioning rods 5 on the abutting surfaces with the thermistor ceramic body 1 , and the upper and lower sides of the thermistor ceramic body 1 are provided with positioning holes 6 , and the positioning rods 5 are docked in the positioning holes 6 .

[0039] In this embodiment, the positioning rod 5 is connected with the positioning hole 6, so that the heat dissipation gasket and the thermistor ceramic body 1 can be quickly positioned when they are connected.

[0040] It should be noted that, for the above-mentioned embodiments, for the sake of simplicity, they are all described as a series of action combinations, but those skilled in the art should know that the present invention is not limited by the described order of actions, because according to the present invention, some steps may be performed in other orders or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present invention.

[0041] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely schematic, such as the division of the above-mentioned units. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or communication connection shown or discussed can be through some interfaces, and the indirect coupling or communication connection between devices or units can be in the form of telecommunication or other forms.

[0042] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0043] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, ordinary technicians in this field can still combine, add, delete or make other adjustments to the features in the various embodiments of the present invention according to the circumstances without conflict, without making creative work, so as to obtain different other technical solutions that do not deviate from the concept of the present invention in essence, and these technical solutions also belong to the scope of protection of the present invention.

Claims

1. A heat dissipation pad for processing ceramic PTC thermistor ceramics, characterized in that: include: A thermosensitive ceramic body (1), a first heat dissipation pad (2), a second heat dissipation pad (3) and a locking mechanism (4); The first heat dissipation pad (2) is connected to the upper surface of the thermistor ceramic body (1), the second heat dissipation pad (3) is connected to the lower surface of the thermistor ceramic body (1), and the locking mechanism (4) is arranged between the first heat dissipation pad (2) and the second heat dissipation pad (3); The locking mechanism (4) comprises a limiting seat (41), a linkage claw (42), a slot (43), a fixing plate (44) and a locking rod (45); the limiting seat (41) is fixed on one side of the second heat dissipation pad (3); a rectangular cavity is concavely arranged at the top of the limiting seat (41); the linkage claw (42) is rotatably connected in the rectangular cavity; the slot (43) is arranged on the linkage claw (42); the fixing plate (44) is fixed on one side of the bottom of the first heat dissipation pad (2); the locking rod (45) is fixed at the bottom of the fixing plate (44); two locking rods (45) are symmetrically arranged on the fixing plate (44); a notch is arranged at the top of the limiting seat (41); the locking rod (45) is clamped in the notch; the linkage claw (42) is rotated and located between two adjacent fixing plates (44); and at the same time, the locking rod (45) is clamped in the slot (43).

2. A heat dissipation pad for processing ceramic PTC thermistor ceramics as claimed in claim 1, characterized in that: A docking protrusion (47) is fixed on the side wall of the linkage claw (42); the linkage claw (42) is rotatably connected to the limit seat (41) via a rotating rod, and a first torsion spring (46) is sleeved on the rotating rod; one end of the first torsion spring (46) is fixed on the second heat dissipation gasket (3), and the other end is fixed on the docking protrusion (47).

3. A heat dissipation pad for processing ceramic PTC thermistor ceramics as claimed in claim 1, characterized in that: The locking mechanism (4) further comprises a non-return plate (48), a transmission rod (49) and a non-return groove (410); the transmission rod (49) is fixed on the non-return plate (48), and the transmission rod (49) is rotatably connected in a rectangular cavity of a limit seat (41); the non-return groove (410) is arranged at the edge of a side wall of the linkage claw (42), and one end of the non-return plate (48) is slidably abutted in the non-return groove (410).

4. A heat dissipation pad for processing ceramic PTC thermistor ceramics as claimed in claim 3, characterized in that: A second torsion spring (411) is sleeved on the transmission rod (49); one end of the second torsion spring (411) is fixed on the non-return plate (48), and the other end is fixed on the second heat dissipation pad (3).

5. A heat dissipation pad for processing ceramic PTC thermistor ceramics as claimed in claim 3, characterized in that: A lever (412) is fixed on the check plate (48), and a slide groove (413) is provided on the side wall of the limit seat (41). The slide groove (413) is an arc-shaped structure and is connected with the rectangular cavity of the limit seat (41), and the lever (412) is slidably engaged in the slide groove (413).

6. A heat dissipation pad for processing ceramic PTC thermistor ceramics as claimed in claim 1, characterized in that: The locking mechanisms (4) are provided in two groups, and the two groups of locking mechanisms (4) are symmetrically arranged on both sides of the first heat dissipation gasket (2) and the second heat dissipation gasket (3).

7. A heat dissipation pad for processing ceramic PTC thermistor ceramics as claimed in claim 1, characterized in that: Positioning rods (5) are provided on the surfaces of the first heat dissipation pad (2) and the second heat dissipation pad (3) that abut against the thermistor ceramic body (1), and positioning holes (6) are provided on the upper and lower sides of the thermistor ceramic body (1), and the positioning rods (5) are butt-jointed in the positioning holes (6).

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