Die bonding leveling device and die bonding device
By designing an adjustable solid crystal leveling device in solid crystal equipment and combining laser ranging technology, the problem that traditional equipment cannot adjust the inclination of chips and PCBs is solved, and the stability of welding quality is improved.
Patent Information
- Application Number
- CN202411216508.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-02
- Publication Date
- 2024-12-13
AI Technical Summary
Traditional crystal-fixing equipment cannot adjust the inclination between the chip and the PCB according to different materials, resulting in unstable soldering quality.
A solid crystal leveling device is designed, including a first leveling device and a second leveling device. The inclination is adjusted in the X-axis and Y-axis directions by the driving chip, and the flatness is measured in combination with the laser ranging device to ensure that the chip is adjusted. Flatness between PCB.
A comprehensive inclination adjustment of different chips is achieved, and the flatness between the chip and PCB and the stability of soldering quality is improved.
Smart Images
Figure CN119136531A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of crystal bonding, and in particular to a crystal bonding leveling device and a crystal bonding device. Background Art
[0002] The die bonding device, also known as a die bonding machine, a wafer bonding machine, or a chip bonding machine, is a device used for ultrasonic welding, mainly used in various gold wire ultrasonic welding equipment and chip mounting equipment. It is widely used in lead cabinet press plates, nozzles, ejectors, dispensing heads, porcelain nozzles, through pins, motors, carbon brushes, encoders, transmission belts and other automation equipment parts, as well as instruments and meters.
[0003] When assembling chips, traditional die bonding equipment usually places the PCB (printed circuit board) on the welding platform. After the welding head absorbs the chip, it is accurately positioned by the visual system and covers it on the PCB to complete the die bonding process. However, due to the flatness problem of the flexible circuit board, this traditional equipment cannot adjust the inclination between the chip and the PCB according to the different materials, resulting in unstable welding quality and affecting the connection effect between the chip and the PCB. Summary of the invention
[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a die bonding and leveling device and a die bonding device to solve the problem of unevenness between the chip and the PCB.
[0005] In order to solve the above technical problems, a technical solution adopted by the present invention is: providing a die bonding leveling device and a die bonding device including a first leveling device and a second leveling device installed on the first leveling device, the first leveling device is used to drive the second leveling device to adjust the inclination along the X-axis direction, the second leveling device has a positioning part for placing and positioning the chip, and the second leveling device is used to drive the chip on the positioning part to adjust the inclination along the Y-axis direction so that it can be used for leveling to ensure the flatness between the chip and the PCB.
[0006] Furthermore, the first leveling device includes a first bottom plate, a first top plate arranged opposite to the first bottom plate, and a first driving unit arranged between the first bottom plate and the first top plate, the first driving unit is used to drive the first top plate to adjust the inclination along the X-axis direction relative to the first bottom plate, and the second leveling device is connected to the first top plate, and the inclination of the second leveling device on the X-axis is adjusted for leveling by driving the relative movement between the first bottom plate and the first top plate.
[0007] Furthermore, the first bottom plate and the first top plate are connected to each other in an arc-shaped sliding manner along the X-axis via a first sliding structure, so that the first top plate can slide in an arc-shaped manner relative to the first bottom plate in the X-axis direction, thereby adjusting the inclination.
[0008] Furthermore, the first sliding structure includes a first lower sliding portion formed on the first bottom plate and a first upper sliding portion formed on the first top plate; the first lower sliding portion includes two first supporting convex strips parallel to and spaced apart from each other on the first bottom plate along the Y-axis direction and two first guide rails respectively fixedly mounted on one side of the first supporting convex strips facing the first top plate, the two first guide rails are both in an arc-shaped structure along the X-axis, and a first sliding groove adjacent to the first guide rail is recessed on one side of the two first supporting convex strips facing the first top plate and on the outward side of the two first guide rails, the first sliding groove is parallel to the first guide rail and matches the bending direction and curvature of the first guide rail; the first upper sliding portion includes two first supporting convex strips parallel to and spaced apart from each other on the first bottom plate ... The movable part includes two second slide grooves corresponding to and adapted to the two first guide rails so as to allow the two first guide rails to slide in an arc shape along the X-axis and two second guide rails respectively slide in the two first slide grooves along the X-axis. First through holes for allowing the ends of the first guide rails to movably pass through are provided on the first top plate at both ends of the second slide groove along the Z-axis direction. The first top plate and the first bottom plate can slide in an arc shape on the X-axis through the sliding cooperation between the first guide rail and the second slide groove and the sliding cooperation between the second guide rail and the first slide groove, so that the first top plate can slide relative to the first bottom plate under the drive of the first driving part to complete the adjustment of the inclination.
[0009] Furthermore, a sliding ball structure is provided between the adjacent first guide rail and the second guide rail to improve the sliding smoothness between the first top plate and the second top plate.
[0010] Furthermore, both sides of the first top plate distributed along the Y-axis direction are convexly extended toward one side of the first bottom plate to form a first retaining edge located outside the first supporting convex strip to prevent the first top plate from separating from the first bottom plate in the Y-axis direction.
[0011] Furthermore, the first driving part includes a first permanent magnet fixedly arranged on the first bottom plate and located between the two first supporting ridges, and a first electromagnetic motor fixedly arranged on the first top plate and located between the two second slide grooves. The side surfaces facing the first permanent magnet and the first electromagnetic motor both have an arc surface adapted to the curvature of the first guide rail. The first electromagnetic motor is slidably arranged on the first permanent magnet, and pushes the first top plate to slide in an arc shape along the X-axis direction relative to the first bottom plate by electromagnetic drive to adjust the inclination.
[0012] Furthermore, a limiting portion is provided between the first bottom plate and the first top plate for limiting the sliding angle of the first top plate on both sides when the first top plate slides in an arc shape relative to the first bottom plate along the X-axis, thereby preventing the first top plate from detaching from the first bottom plate due to excessive sliding during the sliding process, thereby avoiding affecting the use of the device.
[0013] Furthermore, the second leveling device includes a second top plate arranged relative to the first top plate and a second driving portion arranged between the first top plate and the second top plate, the positioning portion is recessed on a side surface of the second top plate facing away from the first top plate, and the second driving portion is used to drive the second top plate to adjust the inclination along the Y-axis direction relative to the first top plate, so as to cooperate with the first driving portion to realize the inclination adjustment in the X-axis and Y-axis directions.
[0014] The present invention also provides a die-bonding device including a welding platform for supporting a PCB board, the die-bonding leveling device, and a laser distance-measuring device installed above the welding platform. The fixed leveling device is electrically connected to the laser distance-measuring device to adjust the chip inclination after measuring the flatness by the laser distance-measuring device. Through the cooperation between the laser distance-measuring device and the die-bonding leveling device, an uneven chip can be leveled to ensure the welding quality between the chip and the PCB board.
[0015] A die-bonding leveling device and a die-bonding device of the present invention have at least the following beneficial effects: through the cooperation between the first leveling device and the second leveling device, after the chip is mounted on the positioning part on the second leveling device, according to the flatness of the chip, the first leveling device is used to drive the second leveling device to adjust the inclination along the X-axis, and the second leveling device is used to drive the chip on the positioning part to adjust the inclination along the Y-axis, thereby achieving a more comprehensive inclination adjustment and completing the flatness adjustment, ensuring that different chips are flat with the PCB when installed on the PCB, and ensuring the stability of the connection effect and quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:
[0017] Figure 1 is a structural block diagram of a die bonding device of the present invention;
[0018] Figure 2 It is a structural schematic diagram of the die-bonding and leveling device of the present invention;
[0019] Figure 3 It is a structural schematic diagram of a hidden adsorption platform of a solid crystal leveling device of the present invention;
[0020] Figure 4 It is a structural schematic diagram of the adsorption platform of the present invention;
[0021] Figure 5 It is an exploded view of the first leveling device of the present invention.
[0022] The meanings of the symbols in the accompanying drawings are:
[0023] The first leveling device-1; the first bottom plate-11; the first top plate-12; the first sliding structure-13; the first supporting ridge-131; the first guide rail-132; the first slide groove-133; the second slide groove-134; the second guide rail-135; the first through hole-136; the third slide groove-1371; the ball-1372; the fixed limit block-1381; the movable limit block-1382; the first driving part-14; the first permanent magnet-141; the first electromagnetic motor-142; the arc surface-143; the base-144; the second leveling device-2; the second top plate-21; the positioning part-22; the air groove-221; the adsorption platform-222; the slot-223; the buckle-224. DETAILED DESCRIPTION
[0024] The present invention will be further described below in conjunction with the accompanying drawings.
[0025] like Figure 1 As shown, a crystal bonding device of the present invention comprises a welding platform for supporting a PCB board, a crystal bonding leveling device arranged on the welding platform, and a laser distance measuring device installed above the welding platform. A placement area for placing the PCB board flat is provided on the welding platform, and the PCB board is positioned on the placement area manually or by using mechanical equipment such as a mechanical arm. The crystal bonding leveling device is used to place the chip so that the chip is located at the welding position corresponding to the PCB board. The position corresponding to the chip on the PCB board usually has a hole for the chip to pass through. The crystal bonding leveling device can be located in the placement area and directly below the PCB board. The chip just corresponds to the hole on the PCB board, and the crystal bonding leveling device and the PCB board are independent of each other and do not affect each other. Before welding, the flatness of the chip is detected by the laser distance measuring device. After the flatness of the PCB board is calculated by the software of the four corner distance difference of the PCB board measured by laser, the flatness of the chip is measured by the laser distance measuring device. In the case of unevenness, the flatness of the chip is adjusted by the crystal bonding leveling device until the chip and the PCB board are leveled, and then the chip is welded on the PCB board by a welding head. In this embodiment, both the solid crystal leveling device and the laser distance measuring device are electrically connected to a controller to implement program execution, so as to ensure the electrical connection and coordination between the fixed leveling device and the laser distance measuring device, and complete the monitoring and adjustment of the chip flatness. The welding head and the controller are both existing structures and are not described in detail here. The laser distance measuring device includes a bracket mounted directly above the welding platform and a laser distance measuring sensor mounted on the bracket and facing the welding platform. The welding head is also mounted on the bracket. In another embodiment, the solid crystal leveling device may not be set in the placement area. After the chip is leveled, the chip can be moved by the welding head and welding can also complete the installation of the chip and the PCB.
[0026] like Figures 2 to 5As shown, a die bonding leveling device of the present invention comprises a first leveling device 1 and a second leveling device 2 installed on the first leveling device 1, the first leveling device 1 is used to drive the second leveling device 2 to adjust the inclination along the X-axis direction, the chip is installed on the second leveling device 2, and the second leveling device 2 is used to drive the chip to adjust the inclination along the Y-axis direction, so as to respectively realize more comprehensive inclination adjustment, and ensure the flatness between the chip and the PCB board when different chips need to be installed, thereby improving the connection effect and quality stability after the chip is soldered.
[0027] In this embodiment, the first leveling device 1 includes a first bottom plate 11, a first top plate 12 arranged opposite to the first bottom plate 11, a first sliding structure 13 arranged on the first bottom plate 11 and the first top plate 12, and a first driving unit 14 arranged between the first bottom plate 11 and the first top plate 12. The first bottom plate 11 is used to be connected to the welding platform to ensure the connection with the welding platform. The first sliding structure 13 enables the first top plate 12 to be connected to the first bottom plate 11 in an arc-shaped sliding connection along the X-axis. The first driving unit 14 is used to drive the first top plate 12 to slide back and forth relative to the first bottom plate 11 along the X-axis direction to adjust the inclination of the chip on the first top plate 12.
[0028] In the content defined in this embodiment, the first bottom plate 11 is made of alloy and has a square sheet structure, and can be fixedly connected to the welding platform by opening screw holes on the first bottom plate 11. The first top plate 12 is also made of alloy and has a square sheet structure, and the side of the first top plate 12 facing away from the first bottom plate 11 is a flat surface, and the second leveling device 2 is installed on the side of the first top plate 12 facing away from the first bottom plate 11.
[0029] In the content defined in this embodiment, the first sliding structure 13 includes a first lower sliding part formed on a side surface of the first bottom plate 11 facing the first top plate 12 and a first upper sliding part formed on a side surface of the first top plate 12 facing the first bottom plate 11. Through the cooperation between the first upper sliding part and the first lower sliding part, the first top plate 12 and the first bottom plate 11 can be slidably guided and cooperated, so as to facilitate the first driving part 14 to drive the first top plate 12 to slide and maintain the stability of the sliding. In this embodiment, the first lower sliding part includes two first supporting ridges 131 parallel and spaced apart and convexly arranged on the first bottom plate 11 along the Y-axis direction, and two first guide rails 132 respectively fixedly mounted on the side surface of the first supporting ridges 131 facing the first top plate 12. The first supporting ridges 131 are used to support the first guide rails 132, and the first guide rails 132 are used to slide and cooperate with the first upper sliding part. The two first support convex strips 131 are both in a square strip structure and are arranged along the X-axis in the length direction. The first installation slots and the first slots 133 are adjacently provided in the Y-axis direction on the two first support convex strips 131. The two first slots 133 are located on the outward side relative to the first installation slots in the Y-axis direction, and the two first installation slots are located on the inward side relative to the first slots 133 in the Y-axis direction, so that the two first installation slots are located between the two first slots 133. Each of the first slots 133 and the first installation slot is an arc-shaped structure with a concave middle portion and two ends curved toward one side of the first top plate 12. The arc lengths of the first slots 133 and the first installation slots are consistent and are arranged along the X-axis in the length direction. The first installation slots and the first slots 133 can be separated by a certain distance, such as about 1 mm, or can be connected along the Y-axis direction. Among them, the first slot 133 passes through the first support convex strip 131 outwardly along the Y-axis direction. Both first guide rails 132 are arc-shaped strip structures along the X-axis, and the curvature of the outer arc surface of the first guide rail 132 is consistent with the curvature of the first installation slot, and the arc length of the first guide rail 132 is greater than the arc length of the first installation slot, the middle part of the first guide rail 132 is fixedly installed in the first guide rail 132 and at least a part of the middle part of the first guide rail 132 is located outside the first installation slot, and both ends of the first guide rail 132 are located outside the first installation slot, so that the first slot 133 is parallel to the first guide rail 132 and matches the bending direction and curvature of the first guide rail 132, so that the first guide rail 132 is easy to cooperate with the first upper sliding part. Among them, the first guide rail 132, the first installation slot and the first slot 133 are all streamlined and smooth in surface to reduce friction.In this embodiment, the first upper sliding part includes two second slide grooves 134 corresponding to and adapted to the two first guide rails 132 so as to allow the two first guide rails 132 to slide and fit therein in an arc shape along the X axis, and two second guide rails 135 respectively slide and fit in the two first slide grooves 133 in an arc shape along the X axis. After installation, the first guide rail 132 is slidably arranged in the second slide groove 134, and the second guide rail 135 is slidably arranged in the first slide groove 133, so as to achieve sliding fit between the first top plate 12 and the first bottom plate 11. The second slide groove 134 is formed on a side surface of the first top plate 12 facing the first bottom plate 11 and is arranged opposite to the first guide rail 132 along the Z axis direction. The curvature of the second slide groove 134 is the same as the inner curvature of the first guide rail 132 so as to enable arc shape sliding fit. When the second slide groove 134 and the first guide rail 132 are matched, they slide along the arc surface of the second slide groove 134. Since the two ends of the first guide rail 132 are close to or away from the two ends of the second slide groove 134 during sliding, and the length of the second slide groove 134 is limited, and in order to avoid increasing the thickness of the first top plate 12 to adapt to the sliding of the first guide rail 132, first through holes 136 for the end of the first guide rail 132 to movably pass through are opened on the first top plate 12 at both ends of the second slide groove 134 along the Z-axis direction. When the first driving unit 14 drives the first top plate 12 to move, the first guide rail 132 and the second slide groove 134 guide each other and slide in an arc shape along the X-axis direction. During the sliding process, the end of the first guide rail 132 moves inward and outward relative to the first through hole 136 without hindering the first guide rail 132, thereby not hindering the first top plate 12 from sliding relative to the first bottom plate 11. It should be noted that the depth of the second slide groove 134 should be less than the thickness of the middle portion of the first guide rail 132 outside the first installation slide groove, so that a portion of the first guide rail 132 can penetrate into the second slide groove 134 and can slide with the second slide groove 134. A connecting surface with an arc shape and an arc that is consistent with the arc of the inner side arc surface of the second guide rail 135 is formed on the side surface of the first top plate 12 facing the first bottom plate 11 and at a position directly opposite to the first slide groove 133 along the Z-axis direction. The connecting surface is arranged adjacent to the second slide groove 134 and is stepped with the second slide groove 134 to form the second slide groove 134. The second guide rail 135 is fixedly connected to the connecting surface, and the length of the connecting surface is greater than the arc length of the second guide rail 135, so that when the second guide rail 135 is slidably arranged in the first slide groove 133, the first supporting convex strip 131 will not affect its sliding. The outer side of the first slide groove 133 passes through the first supporting ridge 131 to reduce friction when the second guide rail 135 slides in the first slide groove 133. It should be noted that the portion of the first top plate 12 facing the side of the first bottom plate 11 and located inward of the first slide groove 133 should not hinder the cooperation between the first guide rail 132 and the second slide groove 134.Since the first guide rail 132 and the second slide groove 134 and the second guide rail 135 and the first slide groove 133 are only slidably matched without connection when they are matched, the stability is poor. In addition, the driving of the first driving unit 14 can easily cause the first top plate 12 to flip. Therefore, a sliding ball structure is provided between the two first guide rails 132 and the two second guide rails 135, that is, the two first guide rails 132 and the two second guide rails 135 are divided into two groups, one first guide rail 132 and one second guide rail 135, and the two groups are provided on the two first supporting convex strips 131 to correspond to each other. A sliding ball structure is provided between the first guide rail 132 and the second guide rail 135 of each group. The sliding ball structure includes a third slide groove 1371 recessed on the outward side of the first guide rail 132 along the Y-axis direction and a ball 1372 protruding on the inward side of the second guide rail 135 along the Y-axis direction. The third slide groove 1371 is opened along the bending direction of the first guide rail 132 and is through at both ends. The ball 1372 is provided in a plurality of directions that are arranged in sequence along a direction consistent with the bending direction of the third slide groove 1371. Each ball 1372 protrudes in the third slide groove 1371 and slidably cooperates with the third slide groove 1371 to limit the first guide rail 132 and the second guide rail 135 from flipping in the Z-axis direction, thereby improving the stability between the first guide rail 132 and the second guide rail 135 and making the sliding between the first guide rail 132 and the second guide rail 135 smoother, cooperating with each other to prevent deflection in the X-axis and Y-axis directions. Preferably, both side edges of the first top plate 12 distributed along the Y-axis direction protrude toward the first bottom plate 11 to form a first rib located on the outside of the first supporting protrusion 131, and the first rib is also arc-shaped relative to the connecting surface. The side of the second guide rail 135 facing outward along the Y-axis direction is connected to the first rib to enhance the firmness of the first guide rail 132.
[0030] Preferably, a limiting portion is provided between the first bottom plate 11 and the first top plate 12 for limiting the sliding angle of both sides of the first top plate 12 when the first top plate 12 slides in an arc shape along the X-axis relative to the first bottom plate 11. The limiting portion is used to limit the sliding range of the first top plate 12 and the first top plate 12 to prevent the first guide rail 132 from disengaging from the second slide groove 134 and to prevent the second guide rail 135 from disengaging from the first slide groove 133. The limiting portion includes a fixed limiting block 1381 fixedly connected to the first bottom plate 11 and arranged along the Y-axis direction on the outside of the first supporting protrusion 131, and two movable limiting blocks 1382 arranged on the first top plate 12 along the Y-axis direction and located on the same side of the first top plate 12 as the fixed limiting block 1381. The movable limiting blocks 1382 are spaced apart and arranged symmetrically, and the positions of the two movable limiting blocks 1382 are adapted to the sliding limits at both ends of the second guide rail 135. The sliding limits are set according to the actual required inclination between the second guide rail 135 and the first slide groove 133, so that the second guide rail 135 does not separate from the first slide groove 133. The fixed limit block 1381 and the movable limit block 1382 are both made of rubber or silicone. When one end of the second guide rail 135 slides upward and the other end slides downward, the movable limit block 1382 closer to the end sliding downward abuts against the fixed limit block 1381. At this time, the first top plate 12 can no longer continue to slide upward. Otherwise, the other movable limit block 1382 abuts against the fixed limit block 1381 to complete the sliding limit.
[0031] In this embodiment, the first driving part 14 includes a first permanent magnet 141 fixedly arranged on the first bottom plate 11 and located between the two first supporting ridges 131, and a first electromagnetic motor 142 fixedly arranged on the first top plate 12 and located between the two second slide grooves 134. The first permanent magnet 141 and the first electromagnetic motor 142 have a curved surface 143 adapted to the curvature of the first guide rail 132 on the side facing each other. The first electromagnetic motor 142 is slidably arranged on the first permanent magnet 141 so as to move along the curved surface 143 relative to the first permanent magnet 141 by electromagnetic pushing after power is turned on. A base 144 is fixedly connected between the two first supporting ridges 131. The base 144 is arranged at intervals between the two first supporting ridges 131. A curved surface adapted to the curvature of the first permanent magnet 141 is provided on the side surface of the base 144 facing the first top plate 12. The first permanent magnet 141 is fixedly connected to the curved surface in an arc shape. The arc surface 143 of the first permanent magnet 141 is consistent with the curvature of the inner surface of the first guide rail 132 to adapt to each other, so that after the first electromagnetic motor 142 is powered on, it is electromagnetically driven and slides in the corresponding direction along the X-axis direction as needed with the cooperation of the first guide rail 132 and the second guide rail 135, thereby changing the flatness of the first top plate 12.
[0032] In this embodiment, the second leveling device 2 includes a second top plate 21 arranged relative to the first top plate 12, a positioning portion 22 formed on the second top plate 21 for placing and positioning the chip, a second sliding structure formed on the first top plate 12 and the second top plate 21, and a second driving portion arranged between the first top plate 12 and the second top plate 21. The second sliding structure is used to make the second top plate 21 slide and guide in an arc-shaped sliding connection along the Y-axis relative to the first top plate 12, and the second driving portion is used to drive the second top plate 21 to move back and forth along the Y-axis relative to the first top plate 12 to drive the chip on the positioning portion 22 to move, thereby adjusting the inclination of the chip.
[0033] In the content defined in this embodiment, the second top plate 21 is made of alloy and has a square sheet structure, and the side of the second top plate 21 facing away from the first bottom plate 11 is a plane. The positioning portion 22 includes an air groove 221 recessed on the side of the second top plate 21 facing away from the first top plate 12 and an adsorption platform 222 sealed and detachably connected to the side of the second top plate 21 facing away from the first bottom plate 11 and covering the air groove, the air groove 221 is connected to an external air pump, the adsorption platform 222 is hollow inside and is open toward the side of the second top plate 21, sealing strips are arranged on each side of the adsorption platform 222, and a plurality of air holes connected to the air groove 221 are opened on the adsorption platform 222, and the adsorption platform 222 is used to support and adsorb the chip for fixing the chip. In this embodiment, a slot 223 is recessed on the two opposite side walls of the adsorption platform 222, and a buckle 224 is hinged on the second top plate 21 and can rotate relative to the inside or outside of the slot 223. The adsorption platform 222 can be fixed or released by rotating the buckle 224, thereby realizing the detachable connection of the adsorption platform 222.
[0034] In the content defined in this embodiment, the second sliding structure includes a second lower sliding part formed on a side surface of the first top plate 12 facing the second top plate 21 and a second upper sliding part formed on a side surface of the second top plate 21 facing the first top plate 12. Through the cooperation between the second upper sliding part and the second lower sliding part, the first top plate 12 and the second top plate 21 can slide and cooperate with each other, so as to facilitate the second driving part to drive the second top plate 21 to slide and maintain the stability of the sliding. In this embodiment, the second lower sliding part includes two second supporting ridges parallel to and spaced apart from each other on the first top plate 12 along the X-axis direction, and two third guide rails respectively fixedly mounted on the side surface of the second supporting ridges facing the second top plate 21. The second supporting ridges are used to support the third guide rails, and the third guide rails are used to slide and cooperate with the second upper sliding part. The two second support convex strips are both square strip-shaped structures and are arranged along the Y-axis in the length direction. The second installation slot and the fourth slot are adjacently recessed along the X-axis on the two second support convex strips. The two fourth slots are located on the outward side relative to the second installation slots along the X-axis direction, and the two second installation slots are located on the inward side relative to the fourth slots along the X-axis direction, so that the two second installation slots are located between the two fourth slots. Each fourth slot and the second installation slot are both arc-shaped structures with a concave middle and two ends bent toward one side of the second top plate 21. The arc lengths of the fourth slot and the second installation slot are consistent and are arranged along the Y-axis in the length direction. The second installation slot and the fourth slot can be separated by a certain distance, such as about 1 mm, or can be connected along the X-axis direction. Among them, the fourth slot passes through the second support convex strip outward along the X-axis direction. Both second guide rails 135 are arc-shaped strip structures along the Y axis, and the curvature of the outer arc surface of the second guide rail 135 is consistent with the curvature of the second installation slot, and the arc length of the third guide rail is greater than the arc length of the second installation slot, the middle part of the third guide rail is fixedly installed in the third guide rail and at least a part of the middle part of the third guide rail is located outside the second installation slot, and both ends of the third guide rail are located outside the second installation slot, so that the fourth slot is parallel to the third guide rail and matches the arc direction and curvature of the third guide rail, so that the third guide rail is easy to cooperate with the second upper sliding part. Among them, the third guide rail, the second installation slot and the second slot 134 are streamlined and smooth in surface to reduce friction. In this embodiment, the second upper sliding part includes two fifth slide grooves corresponding to and adapted to the two third guide rails so as to allow the two third guide rails to slide and fit therein in an arc shape along the Y axis, and two fourth guide rails respectively slide and fit in the two fourth slide grooves in an arc shape along the Y axis. After installation, the third guide rail is slideably arranged in the fifth slide groove, and the fourth guide rail is slideably arranged in the fourth slide groove, so as to realize the sliding fit between the first top plate 12 and the second top plate 21. The fourth slide groove is formed on a side surface of the second top plate 21 facing the first top plate 12 and is arranged opposite to the third guide rail along the Z axis direction. The curvature of the fourth slide groove is the same as the inner curvature of the third guide rail so as to enable arc shape sliding fit, and slides along the arc surface of the fifth slide groove when the fifth slide groove and the third guide rail cooperate.Since the two ends of the third guide rail are close to or away from the two ends of the fifth slide slot during sliding, and the length of the fifth slide slot is limited, and in order to avoid increasing the thickness of the second top plate 21 to adapt to the sliding of the third guide rail, a second through hole for the end of the third guide rail to move through is provided at both ends of the fifth slide slot on the second top plate 21 along the Z-axis direction. When the second driving unit drives the second top plate 21 to move, the third guide rail and the fifth slide slot guide each other and slide in an arc shape along the Y-axis direction. During the sliding process, the end of the third guide rail moves in and out of the second through hole without hindering the third guide rail, thereby not hindering the sliding of the second top plate 21 relative to the first top plate 12. It should be noted that the depth of the fifth slide slot should be less than the thickness of the middle part of the third guide rail located outside the second mounting slide slot, so that a part of the third guide rail can penetrate into the fifth slide slot and slide relative to the fifth slide slot. A connecting surface is also formed on the side surface of the second top plate 21 facing the first top plate 12 and at the position opposite to the fourth slide groove along the Z-axis direction, and the connecting surface is adjacent to the fifth slide groove and is stepped with the fifth slide groove. The fourth guide rail is fixedly connected to the connecting surface, and the length of the connecting surface is greater than the arc length of the fourth guide rail, so that when the fourth guide rail is slidably set in the fourth slide groove, the second supporting convex strip will not affect its sliding. It should be noted that a sliding ball structure is also set between the two third guide rails and the two fourth guide rails, and the setting method is similar to the matching arrangement method of the first guide rail 132 and the second guide rail 135, except that the ball and the third slide groove are arranged along the X-axis direction, and the rest of the settings are the same and will not be repeated here.
[0035] Preferably, a stopper is also provided between the second top plate 21 and the first top plate 12 for limiting the sliding angles of the two sides of the second top plate 21 when the second top plate 21 slides in an arc shape relative to the first top plate 12 along the Y axis. The fixed stopper 1381 of the stopper of the second leveling device 2 is fixedly connected to the first top plate 12 and arranged outside the second supporting convex strip along the X axis direction. The two movable stoppers 1382 of the stopper of the second leveling device 2 are arranged on the second top plate 21 along the X axis direction on the same side of the second top plate 21 and the fixed stopper 1381. When one end of the fourth guide rail slides upward and the other end slides downward, the movable stopper 1382 of the two movable stoppers 1382 that is closer to the end that slides downward abuts against the fixed stopper 1381, and the second top plate 21 can no longer slide upward. Otherwise, the other movable stopper 1382 abuts against the fixed stopper 1381 to complete the sliding limit.
[0036] In this embodiment, the second driving part includes a second permanent magnet fixedly arranged on the first top plate 12 and located between the two second supporting convex strips, and a second electromagnetic motor fixedly arranged on the second top plate 21 and located between the two second slide grooves 134. The side of the second permanent magnet facing the second electromagnetic motor both has an arc surface 143 adapted to the arc curvature of the third guide rail. The second electromagnetic motor is slidably arranged on the second permanent magnet so as to move along the arc surface 143 relative to the second permanent magnet by electromagnetic force after power is turned on. A base 144 is fixedly connected between the two second supporting convex strips. The base 144 is arranged at intervals between the two second supporting convex strips. A curved surface adapted to the arc curvature of the second permanent magnet is provided on the side surface of the base 144 facing the second top plate 21. The second permanent magnet is fixedly connected to the curved surface in an arc shape. The arc surface 143 of the second permanent magnet is consistent with the curvature of the inner surface of the third guide rail to adapt to each other, so that after the second electromagnetic motor is energized, it is driven by electromagnetic force and slides in the corresponding direction along the Y-axis direction as needed with the cooperation of the third guide rail and the fourth guide rail, thereby changing the flatness of the second top plate 21.
[0037] The working method of a die bonding and leveling device and one embodiment of the die bonding device of the present invention is as follows: first, a PCB board is mounted on a welding platform, and a corresponding chip is picked up and placed on a positioning portion 22 by a welding head. After a laser distance measuring device detects the flatness of the PCB board and the chip, the die bonding and leveling device adjusts the chip inclination for unevenness, and the chip is moved and leveled by the first driving portion 14 and / or the second driving portion as needed, and finally the chip is welded to the PCB by the welding head.
Claims
1. A die-bonding and leveling device, characterized in that: The invention comprises a first leveling device and a second leveling device installed on the first leveling device, wherein the first leveling device is used to drive the second leveling device to adjust the inclination along the X-axis direction, the second leveling device has a positioning part for placing and positioning the chip, and the second leveling device is used to drive the chip on the positioning part to adjust the inclination along the Y-axis direction.
2. The die bonding and leveling device according to claim 1, characterized in that: The first leveling device includes a first bottom plate, a first top plate arranged opposite to the first bottom plate, and a first driving unit arranged between the first bottom plate and the first top plate, the first driving unit is used to drive the first top plate to adjust the inclination along the X-axis direction relative to the first bottom plate, and the second leveling device is connected to the first top plate.
3. The die bonding and leveling device according to claim 2, characterized in that: The first bottom plate and the first top plate are connected to each other in an arc-shaped sliding manner along the X-axis via a first sliding structure.
4. The die bonding and leveling device according to claim 3, characterized in that: The first sliding structure includes a first lower sliding portion formed on the first bottom plate and a first upper sliding portion formed on the first top plate; The first lower sliding part includes two first supporting convex strips parallel to and spaced apart from each other on the first bottom plate along the Y-axis direction, and two first guide rails respectively fixedly mounted on the side of the first supporting convex strips facing the first top plate, the two first guide rails are both in an arc-shaped structure along the X-axis, and a first slide groove adjacent to the first guide rail is concavely disposed on the side of the two first supporting convex strips facing the first top plate and on the outward side of the two first guide rails, the first slide groove is parallel to the first guide rail and is adapted to the bending direction and curvature of the first guide rail; The first upper sliding portion includes two second slide grooves corresponding to and adapted to the two first guide rails so as to allow the two first guide rails to slide in an arc shape along the X-axis and two second guide rails respectively sliding in the two first slide grooves along the X-axis. First through holes are provided on the first top plate at both ends of the second slide groove along the Z-axis direction for the ends of the first guide rails to movably pass through.
5. The die bonding and leveling device according to claim 4, characterized in that: A sliding ball structure is arranged between the first guide rail and the second guide rail adjacent to each other.
6. The die bonding and leveling device according to claim 4, characterized in that: Both side edges of the first top plate distributed along the Y-axis direction are convexly provided toward one side of the first bottom plate to form a first rib located outside the first supporting convex strip.
7. The die bonding and leveling device according to claim 4, characterized in that: The first driving part includes a first permanent magnet fixedly arranged on the first bottom plate and located between two first supporting ridges, and a first electromagnetic motor fixedly arranged on the first top plate and located between two second slide grooves. The side surfaces facing the first permanent magnet and the first electromagnetic motor both have an arc surface adapted to the curvature of the first guide rail, and the first electromagnetic motor is slidably arranged on the first permanent magnet.
8. The die bonding and leveling device according to any one of claims 2 to 7, characterized in that: A limiting portion is provided between the first bottom plate and the first top plate for limiting the sliding angles of both sides of the first top plate when the first top plate slides in an arc shape relative to the first bottom plate along the X-axis.
9. The die bonding and leveling device according to claim 2, characterized in that: The second leveling device includes a second top plate arranged relative to the first top plate and a second driving portion arranged between the first top plate and the second top plate, the positioning portion is arranged on a side surface of the second top plate facing away from the first top plate, and the second driving portion is used to drive the second top plate to adjust the inclination along the Y-axis direction relative to the first top plate.
10. A die bonding device, characterized in that: The invention comprises a welding platform for supporting a PCB board, a die-bonding and leveling device as claimed in any one of claims 1 to 9, and a laser distance-measuring device installed above the welding platform, wherein the fixed leveling device is electrically connected to the laser distance-measuring device to adjust the chip inclination after measuring the flatness through the laser distance-measuring device.