MOSEFT and preparation method thereof

Abstract

The invention relates to the technical field of field effect transistors, in particular to an MOSEFT (Metal-Oxide-Semiconductor Field Effect Transistor), which comprises a supporting bottom plate; the clamping mechanism is arranged on the supporting bottom plate and used for clamping and fixing a transistor; the supporting plate is fixedly arranged at the bottom end of the supporting bottom plate; the first threaded rod is rotationally arranged between the two supporting plates; the first lantern rings are connected to the first threaded rod in a threaded mode, and the two first lantern rings are evenly distributed at the two ends of the first threaded rod; the first connecting rod is fixedly arranged on the first lantern ring; the baffle plate I is fixedly arranged on the connecting rod I; the limiting unit is arranged on the connecting rod I and is used for transversely positioning and fixing the transistor body; and the heat dissipation mechanism is fixedly arranged on the supporting bottom plate, so that the device can clamp devices of different specifications, a heat dissipation plate arranged at the bottom end of the supporting bottom plate can keep the device to dissipate heat of the devices, and the devices are kept to have good heat dissipation performance.

Description

Technical Field

[0001] The present invention relates to the technical field of field effect transistors, in particular to a MOSFET. Background Art

[0002] MOSFET is also known as field effect transistor. In recent years, quantum dot light emitting diodes (QLED) and organic light emitting diodes (OLED) have gained wide attention in the field of lighting and display due to their advantages such as high brightness, low power consumption, wide color gamut, and easy processing. In the context of the rapid development of microelectronics technology, field effect transistors (FET) are one of the most widely used devices in microelectronics. The existing technology has integrated FET with organic light emitting devices, and controlled the light emission of the device by controlling the source and drain current of the transistor gate voltage, so that FET can be used as a driving unit for flat panel displays.

[0003] High-performance light-emitting field-effect transistors require that the gate insulation layer has good insulation and capacitance properties, as well as better device structure and performance. The representative device is the organic light-emitting field-effect transistor (OFET). However, due to the lack of a heat dissipation unit during operation, the field-effect transistor generates a large amount of high temperature that cannot be evacuated in time, affecting the operation of surrounding components and easily causing damage to itself.

[0004] Therefore, it is necessary to provide a MOS EFT to solve the above problems.

[0005] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0006] Based on the above-mentioned problems existing in the prior art, the problem to be solved by the present application is: high-performance light-emitting field-effect transistors require that the gate insulation layer has good insulation performance, capacitance performance, and better device structure and performance. The representative device is the organic light-emitting field-effect transistor (OFET). However, due to the lack of a heat dissipation unit during operation, the field-effect transistor generates a large amount of high temperature that cannot be evacuated in time, which affects the operation of surrounding components and is very likely to cause damage to itself.

[0007] The technical solution adopted by the present application to solve the technical problem is: a MOSEFT, comprising:

[0008] Support base plate;

[0009] A clamping mechanism, arranged on the supporting base plate, for clamping and fixing the transistor;

[0010] A support plate, fixedly arranged at the bottom end of the support base plate;

[0011] A threaded rod 1, rotatably disposed between the two support plates;

[0012] A collar 1 is threadedly connected to the threaded rod 1, and two collars 1 are evenly distributed on both ends of the threaded rod 1;

[0013] A connecting rod 1, fixedly arranged on the sleeve ring 1;

[0014] Baffle plate 1, fixedly arranged on the connecting rod 1;

[0015] A limiting unit, arranged on the first connecting rod, for laterally positioning and fixing the transistor body;

[0016] A heat dissipation mechanism, fixedly arranged on the supporting base plate, for dissipating heat from the device;

[0017] The buckle mechanism is fixedly arranged on the first connecting rod and is used for fixing the protective device.

[0018] Preferably, a guide rod 1 is fixedly arranged between the two support plates, and the guide rod 1 and the threaded rod 1 are arranged parallel to each other, and the guide rod 1 and the sleeve ring 1 are slidably connected.

[0019] Preferably, the limiting unit includes two mutually parallel brackets fixedly arranged on the connecting rod one, a threaded rod two is rotatably arranged between the two mutually parallel brackets, a guide rod two is fixedly arranged on another group of the brackets, and a ring two is threadedly connected to the threaded rod two, and the threaded rod one and the threaded rod two are arranged perpendicular to each other, a telescopic rod is fixedly arranged between the two rings two, and the telescopic rod and the baffle one are arranged perpendicular to each other.

[0020] Preferably, the threaded rod one and the threaded rod two are each provided with two sections of threads, and the two sections of threads are evenly distributed at both ends of the threaded rod one and the threaded rod two, the two collars one are evenly distributed at both ends of the threaded rod one, the two collars two are evenly distributed at both ends of the threaded rod two, and the two threaded rods two are both arranged above the threaded rod one.

[0021] Preferably, the heat dissipation mechanism includes a heat dissipation plate fixedly arranged on the supporting base plate, the heat dissipation plate is provided with two symmetrically arranged sliding grooves, and expansion plates are slidably arranged in the two sliding grooves, and each of the expansion plates is fixedly connected to the ring one.

[0022] Preferably, a plurality of circular shells are fixedly arranged on the supporting base plate, and support columns are slidably arranged on the circular shells, a spring is fixedly arranged between the support columns and the bottom ends of the circular shells, and the plurality of circular shells are evenly distributed on the supporting base plate.

[0023] Preferably, the snap mechanism includes a sleeve fixedly arranged on the connecting rod 1, a disc is slidably arranged on the bottom of the sleeve, a spring 2 is fixedly arranged between the bottom of the disc and the bottom of the sleeve, two side tubes are fixedly arranged on the outer circumferential surface of the sleeve, a clamping plate is slidably arranged in the side tubes, a shaft body is slidably arranged in the sleeve, a clamping disk is fixedly arranged on the bottom end of the shaft body, a tray is fixedly arranged on the other end of the shaft body, a snap plate is slidably arranged on the shaft body, a spring 3 is fixedly arranged on the tray, and the other end of the spring 3 is fixedly connected to the snap plate.

[0024] Preferably, the end of the clamping plate away from the supporting bottom plate is inclined, and the buckle plate is thin at both ends and thick in the middle.

[0025] Preferably, a guide groove is provided on the supporting bottom plate, and the guide groove and the threaded rod 1 are arranged parallel to each other.

[0026] A method for preparing MOSEFT comprises the following steps:

[0027] S1, preparing a first insulating layer on a first electrode; preparing a second insulating layer with a concave-convex structure on the first insulating layer by a solution method; preparing a light-emitting device on the second insulating layer to obtain a field effect transistor; the steps of preparing the second insulating layer with a concave-convex structure on the first insulating layer by a solution method include: providing a nanosphere suspension and an organic insulating material solution; mixing the nanosphere suspension and the organic insulating material solution to obtain a mixed solution; depositing the mixed solution on the first insulating layer, performing a drying process to volatilize the solvent, and obtaining a mixed film; annealing the mixed film to decompose the nanospheres to form a second insulating layer with a concave-convex structure;

[0028] S2, placing the prepared device on the supporting bottom plate of the device, and when the placement is completed, the staff rotates the threaded rod 1, and the rotating threaded rod 1 can drive the ring 1 threadedly connected to the two ends of the threaded rod 1 to move, and as the ring 1 moves, it can drive the connecting rod 1 fixedly connected to it to move, thereby driving the baffle 1 to move, and the baffle 1 that moves longitudinally clamps the fixed device, and then by rotating the threaded rod 2, the ring 2 threadedly connected to the threaded rod 2 moves, and the movable telescopic rod can clamp the fixed device horizontally;

[0029] S3. After fixing the device in the horizontal direction, the staff presses down the cover plate. At this time, when the shaft body is pressed down, the chuck on the shaft body is combined with the clamping plate to protect the device.

[0030] The beneficial effects of the present application are as follows: a MOS EFT provided by the present application is realized by means of threaded rod one and threaded rod two arranged on a supporting base plate, so that when a staff member places a device on the supporting base plate, the staff member rotates threaded rod one, and the rotating threaded rod one can drive a ring one threadedly connected to both ends of threaded rod one to move, and as the ring one moves, it can drive a connecting rod one fixedly connected to it to move, thereby driving a baffle one to move, so that the baffle one that moves longitudinally clamps and fixes the device, and then by rotating threaded rod two, the ring two threadedly connected to threaded rod two moves, and the movable telescopic rod can clamp and fix the device laterally, so that the device can clamp devices of different specifications, and the heat sink arranged on the bottom end of the supporting base plate can keep the device from dissipating heat to the device, and keep the device having good heat dissipation.

[0031] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail below with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0033] Figure 2 For the present invention Figure 1 The enlarged structural diagram at A in the middle;

[0034] Figure 3 It is a schematic diagram of the bottom structure of the present invention;

[0035] Figure 4 It is a schematic diagram of the local structure of the present invention;

[0036] Figure 5 For the present invention Figure 4 The enlarged structural diagram at B in the middle;

[0037] Figure 6 It is a schematic diagram of the support column structure of the present invention;

[0038] Figure 7 The buckle mechanism structure of the present invention is shown in FIG. Figure 1 ;

[0039] Figure 8 The buckle mechanism structure of the present invention is shown in FIG. Figure 2 .

[0040] In the figure: 1. support base plate; 11. round shell; 12. support column; 13. spring one; 14. guide groove; 2. clamping mechanism; 21. support plate; 211. guide rod one; 22. threaded rod one; 23. collar one; 24. connecting rod one; 25. baffle one; 26. limit unit; 261. bracket; 262. threaded rod two; 263. guide rod two; 264. collar two; 265. telescopic rod; 3. heat dissipation mechanism; 31. heat dissipation plate; 32. slide groove; 33. extension plate; 4. snap mechanism; 41. sleeve; 42. disc; 43. spring two; 44. side tube; 45. clamping plate; 46. shaft; 47. clamping disc; 48. tray; 481. spring three; 49. snap plate. DETAILED DESCRIPTION

[0041] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0042] In order to enable those skilled in the art to better understand the solution of the present application, the following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0043] Reference Figure 1-3 A MOSFET comprises: a supporting base plate 1; a clamping mechanism 2, arranged on the supporting base plate 1, for clamping and fixing a transistor; a supporting plate 21, fixedly arranged at the bottom end of the supporting base plate 1; a threaded rod 22, rotatably arranged between two supporting plates 21; a collar 23, threadedly connected to the threaded rod 22, and two collars 23 are evenly distributed on both ends of the threaded rod 22; a connecting rod 24, fixedly arranged on the collar 23; a baffle 25, fixedly arranged on the connecting rod 24; a limiting unit 26, arranged on the connecting rod 24, for laterally positioning and fixing a transistor body; a heat dissipation mechanism 3, fixedly arranged on the supporting base plate 1, for heat dissipation of the device; a buckle mechanism 4, fixedly arranged on the connecting rod 24, for fixing a protective device.

[0044] Reference Figure 1-3A guide rod 211 is fixedly arranged between the two support plates 21, and the guide rod 211 and the threaded rod 22 are arranged parallel to each other, and the guide rod 211 and the collar 23 are slidably connected. By setting the guide rod 211 between the two support plates 21, the threaded rod 22 can drive the collar 23 to move during the rotation of the threaded rod 22, and the baffle 25 fixedly arranged between the two collars 23 can move horizontally, and it is ensured that it will not rotate during the movement, thereby improving the overall stability of the device.

[0045] Reference Figure 2-4 The limiting unit 26 includes two mutually parallel brackets 261 fixedly arranged on the connecting rod 1 24, a threaded rod 262 is rotatably arranged between the two mutually parallel brackets 261, a guide rod 263 is fixedly arranged on the other group of brackets 261, and a collar 264 is threadedly connected to the threaded rod 262, and the threaded rod 1 22 and the threaded rod 262 are arranged perpendicular to each other, a telescopic rod 265 is fixedly arranged between the two collars 264, and the telescopic rod 265 and the baffle 1 25 are arranged perpendicular to each other, and the threaded rod 262 262 arranged between the two brackets 261 is used to achieve that when the threaded rod 262 rotates, the collar 264 threadedly connected to the threaded rod 262 can move toward each other along the threaded rod 262, and the two moving collars 264 can drive the telescopic rod 265 to move toward each other, and the telescopic rod 265 can clamp the material longitudinally.

[0046] Reference Figure 3-5 , the threaded rod 1 22 and the threaded rod 262 are both provided with two sections of threads, and the two sections of threads are evenly distributed at the two ends of the threaded rod 1 22 and the threaded rod 262, the two collars 1 23 are evenly distributed at the two ends of the threaded rod 1 22, the two collars 264 are evenly distributed at the two ends of the threaded rod 262, and the two threaded rods 262 are both arranged above the threaded rod 1 22. By setting the two sections of threads with opposite rotation directions on the threaded rod 1 22 and the threaded rod 262, it is achieved that when the threaded rod 1 22 and the threaded rod 262 rotate, the two collars 1 23 and the collar 2 264 can move towards each other at the same time along the threaded rod 1 22 and the threaded rod 262, thereby achieving position adjustment of the baffle 1 25 and the telescopic rod 265, ensuring that the device can effectively clamp and fix devices of different specifications and sizes, and ensuring that the device has good safety and stability when in use.

[0047] Reference Figure 3-5The heat dissipation mechanism 3 includes a heat dissipation plate 31 fixedly arranged on the supporting base plate 1, and two mutually symmetrically arranged slide grooves 32 are provided on the heat dissipation plate 31, and expansion plates 33 are slidably arranged in the two slide grooves 32, and each expansion plate 33 is fixedly connected to the ring 23. Through the heat dissipation plate 31 arranged on the supporting base plate 1, the device is heat-dissipated and cooled, ensuring that the heat dissipation plate 31 can perform real-time heat dissipation treatment on the device fixed on the device when the device is in use, ensuring that the device has good working efficiency when in use.

[0048] Reference Figure 1 , 2 and 6, a plurality of circular shells 11 are fixedly arranged on the supporting base plate 1, and support columns 12 are slidably arranged on the circular shells 11, a spring 13 is fixedly arranged between the support column 12 and the bottom end of the circular shell 11, and the plurality of circular shells 11 are evenly distributed on the supporting base plate 1. By means of the circular shells 11 arranged on the supporting base plate 1 and the support columns 12 slidably arranged on the circular shells 11, when the staff places the device, the elastic force of the spring 13 can push the support column 12 to fit with the bottom of the device, thereby ensuring the stability of the device.

[0049] Reference Figure 1 , 7 and 8, the buckle mechanism 4 includes a sleeve 41 fixedly arranged on the connecting rod 1 24, a disc 42 is slidably arranged on the bottom of the sleeve 41, a spring 23 is fixedly arranged between the bottom of the disc 42 and the bottom of the sleeve 41, two side sleeves 44 are fixedly arranged on the outer circumference of the sleeve 41, a clamping plate 45 is slidably arranged in the side sleeve 44, a shaft 46 is slidably arranged in the sleeve 41, a clamping plate 47 is fixedly arranged on the bottom end of the shaft 46, a tray 48 is fixedly arranged on the other end of the shaft 46, a buckle plate 49 is slidably arranged on the shaft 46, a spring 3 481 is fixedly arranged on the tray 48, and a spring 3 481 is fixedly arranged between the other end of the spring 3 481 and the buckle plate 49. The fixed connection is achieved by the sleeve 41 set in the connecting rod 24, so that when the staff presses the shaft body 46, the chuck 47 on the end of the shaft body 46 can press down the card plate 45 in the sleeve 41 and move it to both sides. When the chuck 47 completely enters the sleeve 41, the spring can push the card plate 45 to buckle on the disc 42, thereby completing the positioning and fixation of the shaft body 46. When the buckle needs to be released, the staff continues to press the shaft body 46 and makes the buckle plate 49 slidingly set on the shaft body 46 move through the card plate 45. At this time, the elastic force generated by the spring 43 pushes the chuck 47 to move through the disc 42 until the shaft body 46 is pushed to move until it is separated from the sleeve 41.

[0050] Reference Figure 1 , 7And 8, the end of the card plate 45 away from the supporting base plate 1 is inclined, and the buckle plate 49 is thin at both ends and thick in the middle. By setting the card plate 45 at an incline, it is ensured that the card plate 45 can move along the side of the chuck 47 during the movement process, and the shaft body 46 can be separated from the sleeve 41.

[0051] Reference Figure 1-3 A guide groove 14 is provided on the support base plate 1 , and the guide groove 14 and the threaded rod 22 are arranged parallel to each other. The guide groove 14 provided on the support base plate 1 ensures that the connecting rod 24 can slide stably along the guide groove 14 .

[0052] The scheme is specifically as follows: S1, preparing a first insulating layer on a first electrode; preparing a second insulating layer with a concave-convex structure on the first insulating layer by a solution method; preparing a light-emitting device on the second insulating layer to obtain a field effect transistor; the steps of preparing the second insulating layer with a concave-convex structure on the first insulating layer by a solution method include: providing a nanosphere suspension and an organic insulating material solution; mixing the nanosphere suspension and the organic insulating material solution to obtain a mixed solution; depositing the mixed solution on the first insulating layer, performing a drying process to volatilize the solvent, and obtaining a mixed film; annealing the mixed film to decompose the nanospheres to form a second insulating layer with a concave-convex structure;

[0053] S2, the prepared device is placed on the supporting base plate 1 of the device. When the placement is completed, the staff rotates the threaded rod 22, and the rotating threaded rod 22 can drive the ring 23 threadedly connected to the two ends of the threaded rod 22 to move, and as the ring 23 moves, it can drive the connecting rod 24 fixedly connected to it to move, thereby driving the baffle 25 to move, and the baffle 25 that moves longitudinally clamps the fixed device, and then by rotating the threaded rod 262, the ring 264 threadedly connected to the threaded rod 262 moves, and the movable telescopic rod 265 can clamp the fixed device horizontally;

[0054] S3. After fixing the device in the horizontal direction, the staff presses down the cover plate. At this time, when the shaft body 46 is pressed down, the chuck 47 on the shaft body 46 is combined with the clamping plate 45 to protect the device.

[0055] A person skilled in the art should understand that the discussion of any of the above embodiments is only exemplary, and within the spirit of the present invention, the technical features in the above embodiments or in different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0056] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A MOSEF, characterized in that: include: Supporting base plate (1); A clamping mechanism (2), arranged on the supporting base plate (1), and used for clamping and fixing the transistor; A support plate (21) fixedly arranged at the bottom end of the support base plate (1); A threaded rod (22) rotatably disposed between the two support plates (21); A collar (23) is threadedly connected to the threaded rod (22), and two collars (23) are evenly distributed on both ends of the threaded rod (22); A connecting rod (24) is fixedly mounted on the collar (23); Baffle plate 1 (25), fixedly disposed on connecting rod 1 (24); A limiting unit (26), arranged on the first connecting rod (24), and used for laterally positioning and fixing the transistor body; A heat dissipation mechanism (3) is fixedly arranged on the supporting base plate (1) and is used to dissipate heat from the device; The buckle mechanism (4) is fixedly arranged on the connecting rod 1 (24) and is used to fix the protective device.

2. A MOS EFT according to claim 1, characterized in that: A guide rod 1 (211) is fixedly arranged between the two support plates (21), and the guide rod 1 (211) and the threaded rod 1 (22) are arranged parallel to each other, and the guide rod 1 (211) and the sleeve ring 1 (23) are slidably connected.

3. A MOS EFT according to claim 1, characterized in that: The limiting unit (26) comprises two mutually parallel brackets (261) fixedly arranged on the connecting rod 1 (24), a threaded rod 2 (262) is rotatably arranged between the two mutually parallel brackets (261), a guide rod 2 (263) is fixedly arranged on another group of the brackets (261), and a collar 2 (264) is threadedly connected to the threaded rod 2 (262), and the threaded rod 1 (22) and the threaded rod 2 (262) are arranged perpendicular to each other, a telescopic rod (265) is fixedly arranged between the two collars 2 (264), and the telescopic rod (265) and the baffle 1 (25) are arranged perpendicular to each other.

4. A MOS EFT according to claim 3, characterized in that: The threaded rod one (22) and the threaded rod two (262) are both provided with two sections of threads, and the two sections of threads are evenly distributed at the two ends of the threaded rod one (22) and the threaded rod two (262), the two collars one (23) are evenly distributed at the two ends of the threaded rod one (22), the two collars two (264) are evenly distributed at the two ends of the threaded rod two (262), and the two threaded rods two (262) are both arranged above the threaded rod one (22).

5. A MOS EFT according to claim 1, characterized in that: The heat dissipation mechanism (3) comprises a heat dissipation plate (31) fixedly arranged on the supporting base plate (1), the heat dissipation plate (31) is provided with two mutually symmetrically arranged sliding grooves (32), and an expansion plate (33) is slidably arranged in each of the two sliding grooves (32), and each of the expansion plates (33) is fixedly connected to the first sleeve ring (23).

6. A MOS EFT according to claim 1, characterized in that: A plurality of circular shells (11) are fixedly arranged on the supporting base plate (1), and a support column (12) is slidably arranged on each of the circular shells (11), a spring (13) is fixedly arranged between the support column (12) and the bottom end of the circular shell (11), and the plurality of circular shells (11) are evenly distributed on the supporting base plate (1).

7. A MOS EFT according to claim 1, characterized in that: The buckle mechanism (4) comprises a sleeve (41) fixedly arranged on the connecting rod (24), a disc (42) slidably arranged on the bottom of the sleeve (41), a spring (43) fixedly arranged between the bottom of the disc (42) and the bottom of the sleeve (41), two side tubes (44) fixedly arranged on the outer peripheral surface of the sleeve (41), a clamping plate (45) slidably arranged in the side tubes (44), a shaft (46) slidably arranged in the sleeve (41), a clamping plate (47) fixedly arranged on the bottom end of the shaft (46), a tray (48) fixedly arranged on the other end of the shaft (46), a clamping plate (49) slidably arranged on the shaft (46), a spring (481) fixedly arranged on the tray (48), and the other end of the spring (481) is fixedly connected to the clamping plate (49).

8. A MOS EFT according to claim 7, characterized in that: The end of the clamping plate (45) away from the supporting base plate (1) is arranged in an inclined manner, and the buckle plate (49) is arranged to be thin at both ends and thick in the middle.

9. A MOS EFT according to claim 1, characterized in that: The supporting base plate (1) is provided with a guide groove (14), and the guide groove (14) and the threaded rod (22) are arranged parallel to each other.

10. A MOSEFT, comprising a method for preparing a MOSEFT according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, preparing a first insulating layer on the first electrode; preparing a second insulating layer with a concave-convex structure on the first insulating layer by a solution method; preparing a light-emitting device on the second insulating layer to obtain a field effect transistor; The steps of preparing a second insulating layer with a concavo-convex structure on the first insulating layer by a solution method include: providing a nanosphere suspension and an organic insulating material solution; mixing the nanosphere suspension and the organic insulating material solution to obtain a mixed solution; depositing the mixed solution on the first insulating layer, performing a drying process to volatilize the solvent, and obtaining a mixed film; annealing the mixed film to decompose the nanospheres to form a second insulating layer with a concavo-convex structure; S2, placing the prepared device on the supporting bottom plate of the device, and when the placement is completed, the staff rotates the threaded rod 1, and the rotating threaded rod 1 can drive the ring 1 threadedly connected to the two ends of the threaded rod 1 to move, and as the ring 1 moves, it can drive the connecting rod 1 fixedly connected to it to move, thereby driving the baffle 1 to move, and the baffle 1 that moves longitudinally clamps the fixed device, and then by rotating the threaded rod 2, the ring 2 threadedly connected to the threaded rod 2 moves, and the movable telescopic rod can clamp the fixed device horizontally; S3. After fixing the device in the horizontal direction, the staff presses down the cover plate. At this time, when the shaft body is pressed down, the chuck on the shaft body is combined with the clamping plate to protect the device.

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