Packaging structure of Hall current sensor chip

Abstract

The invention discloses a packaging structure of a Hall current sensor chip, which comprises a plastic packaging body, a built-in base island and a plurality of conduction bonding pads, the plastic packaging body wraps the built-in base island and the plurality of conduction bonding pads, the built-in base island comprises a mounting part used for placing a Hall disc, the front end of the mounting part obliquely extends upwards to form a transition part, the transition part extends forwards, and the front end of the mounting part extends upwards to form the Hall disc. The mounting part is folded backwards to form a main heat dissipation part, the main heat dissipation part is provided with a penetrating groove used for containing a tube core of the Hall disc, auxiliary heat dissipation parts are arranged on the left side, the right side and the rear side of the mounting part, the mounting part is lower than the main heat dissipation part and the auxiliary heat dissipation parts, and a basin structure with the low middle and the high periphery is formed. Through the arrangement of the main heat dissipation part and the auxiliary heat dissipation part, on one hand, the conduction internal resistance of the connected built-in base island can be reduced, so that the built-in base island has the effects of low impedance and high magnetic gain, and on the other hand, one side of the main heat dissipation part and one side of the auxiliary heat dissipation part are exposed, heat dissipation can be effectively carried out, and the heat dissipation effect of the whole packaging structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of Hall current sensor chips, and in particular to a packaging structure of a Hall current sensor chip. Background Art

[0002] The Hall current sensor chip is made by integrating the Hall sensing element, amplifier, compensation circuit and other electronic circuits on a tube die using the Hall effect principle and integrated circuit technology. It has the advantages of small size, long life, simple structure and high frequency, and is widely used in traditional power electronics, household appliances, electric vehicles, photovoltaics and other fields. Miniaturization, high integration and intelligence will be the main trends in the technical level of Hall current sensor chips, and the new packaging design and packaging structure play an important role in the technical field.

[0003] According to the chip packaging method, it is mainly classified into three categories: chip-level packaging, wafer-level packaging and system-level packaging. The packaging method of Hall current sensor chips is mainly chip-level packaging. The reason is that the lead frame structure in the packaging structure plays an important role in the Hall effect. In the design concept, it can be understood as a wire for primary current. When current passes through the lead frame, a magnetic field is generated at the position of the Hall disk of the tube core. The output voltage signal is processed by the internal circuit to realize primary current detection.

[0004] However, existing Hall current sensor chips using traditional packaging technology generally have problems such as poor heat dissipation performance and high on-resistance, and therefore need to be improved. Summary of the invention

[0005] The object of the present invention is to provide a packaging structure of a Hall current sensor chip with significant heat dissipation effect, low impedance and high magnetic gain effect in view of the defects and shortcomings of the prior art.

[0006] To achieve the above-mentioned purpose, the technical solution adopted by the present invention is: a packaging structure of a Hall current sensor chip, including a plastic package, a built-in base island and a plurality of conductive pads, the plastic package wraps the built-in base island and the plurality of conductive pads, and its innovation lies in: the built-in base island includes a mounting portion for placing a Hall disk, the front end of the mounting portion extends upward at an angle to form a transition portion, the transition portion extends forward and folds backward to form a main heat dissipation portion, the main heat dissipation portion is provided with a through groove for accommodating the tube core of the Hall disk, auxiliary heat dissipation portions are arranged on the left and right sides and the rear side of the mounting portion, the mounting portion is lower than the main heat dissipation portion and the auxiliary heat dissipation portion, forming a basin structure with a low middle and high surroundings.

[0007] Furthermore, the upper surfaces of the main heat dissipation part and the auxiliary heat dissipation part are flush with the upper surface of the plastic package body.

[0008] Furthermore, an external connection port is formed at the connection between the transition portion and the main heat dissipation portion, and a first packaging slot hole is provided on the external connection port.

[0009] Furthermore, second packaging slots are provided on the outer sides of the auxiliary heat dissipation parts.

[0010] Furthermore, a plurality of heat dissipation fins are disposed on the upper surface of the auxiliary heat dissipation portion, and the two are integrally formed.

[0011] Furthermore, the built-in base island is integrally formed.

[0012] Furthermore, the conductive pads are evenly arranged on the left and right sides and the rear side of the plastic package body, and the surfaces are flush with the outer surface of the plastic package body.

[0013] After adopting the above structure, the beneficial effects of the present invention are:

[0014] 1. The present invention provides a main heat dissipation part and an auxiliary heat dissipation part. On the one hand, the internal resistance of the connected built-in base island can be reduced, so that it has the effect of low impedance and high magnetic gain. On the other hand, one side of the main heat dissipation part and the auxiliary heat dissipation part is exposed, which can effectively dissipate heat to improve the heat dissipation effect of the overall packaging structure.

[0015] 2. The present invention provides a plurality of auxiliary heat dissipation parts, a first packaging slot and a second packaging slot, which helps to improve the bonding strength between the built-in base island and the plastic package body and improve the anti-delamination capability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A top view of the present invention;

[0017] Figure 2 It is a cross-sectional view of the built-in base island in the present invention.

[0018] Description of reference numerals:

[0019] 1 plastic package body, 2 built-in base island, 21 mounting portion, 22 transition portion, 23 main heat dissipation portion, 24 through groove, 25 auxiliary heat dissipation portion, 26 external port, 27 first packaging slot hole, 28 second packaging slot hole, 29 heat dissipation fin, 3 conductive pad. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with the accompanying drawings.

[0021] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific implementation methods described herein are only used to explain the present invention and are not used to limit the present invention.

[0022] See also Figure 1-2A packaging structure of a Hall current sensor chip includes a plastic package 1, a built-in base island 2 and a plurality of conductive pads 3. The plastic package 1 wraps the built-in base island 2 and the plurality of conductive pads 3. The built-in base island 2 includes a mounting portion 21 for placing a Hall disk. The front end of the mounting portion 21 extends upwardly and obliquely to form a transition portion 22. The transition portion 22 extends forward and folds backward to form a main heat dissipation portion 23. The main heat dissipation portion 23 is provided with a through groove 24 for accommodating a tube core of the Hall disk. Auxiliary heat dissipation portions 25 are arranged on the left and right sides and the rear side of the mounting portion 21. The mounting portion 21 is lower than the main heat dissipation portion 23 and the auxiliary heat dissipation portion 25, forming a basin structure with a low middle and high surroundings. Specifically, the mounting portion 21 of the built-in base island 2 is used to place the Hall disk; the main heat dissipation portion 23 and the auxiliary heat dissipation portion 25 are connected to the built-in base island 2, which can reduce the on-state internal resistance, so that it has the effect of low impedance and high magnetic gain; the through groove 24 is used to place the tube core of the Hall disk, which can better protect the Hall disk; the plastic package body 1 is preferably a cubic structure, which is convenient for processing and manufacturing, and of course it can also be other shapes, such as a cylinder, a triangle, etc.; the built-in base island 2 has a structure that is low in the middle and high around, which is convenient for installing the Hall disk, and is also beneficial for protecting the Hall disk and preventing damage; the overall packaging structure is a left-right symmetrical structure, which is left-right symmetrical about the center line of the built-in base island 2.

[0023] In this embodiment, the upper surfaces of the main heat dissipation portion 23 and the auxiliary heat dissipation portion 25 are flush with the upper surface of the plastic package. The upper surfaces of the main heat dissipation portion 23 and the auxiliary heat dissipation portion 25 are exposed, which can effectively improve the heat dissipation performance of the packaging structure, reduce the on-resistance of the current sensor chip, ensure the performance of the current sensor chip, and make the overall structure more compact and beautiful, which is also convenient for the actual use of the Hall current sensor.

[0024] In this embodiment, the connection between the transition part 22 and the main heat dissipation part 23 forms an external port 26, and a first packaging slot 27 is provided on the external port 26. The external port 26 is used to connect an external device, etc., for inputting and outputting current, etc., and can be connected to the external device by welding; the first packaging slot 27 is an etched through hole, which helps to improve the bonding strength between the main heat dissipation part 23 and the plastic package body 1, avoid the occurrence of popcorn phenomenon caused by thermal and humid stress, and ensure the performance of the package body.

[0025] In this embodiment, the outer side of the auxiliary heat dissipation part 25 is provided with a second packaging slot 28. The second packaging slot 28 is an etched through hole, which helps to improve the bonding strength between the auxiliary heat dissipation part 25 and the plastic package body 1, avoids the occurrence of popcorn phenomenon caused by thermal and humid stress, and ensures the performance of the package body.

[0026] Therefore, the combination of the first packaging slot 27 and the second packaging slot 28 can effectively enhance the bonding strength and stability between the plastic package 1 and the built-in base island 2, reduce the risk of delamination of the plastic package, and ensure the performance of the package.

[0027] In this embodiment, a plurality of heat dissipation fins 29 are disposed on the upper surface of the auxiliary heat dissipation portion 25, and the two are integrally formed. The heat dissipation fins 29 can further improve the heat dissipation effect; the height of the heat dissipation fins 29 should not be too high, and the height is generally between 1-3 mm; the three auxiliary heat dissipation portions 25 and the corresponding heat dissipation fins 29 are combined to significantly improve the heat dissipation effect compared to a single heat dissipation method.

[0028] In this embodiment, the built-in base island 2 is integrally formed. The integrally formed built-in base island 2 can improve the overall stability, thereby extending the service life. Of course, it can also be a split structure, specifically, the main heat dissipation part 23 is separated from other parts of the built-in base island 2, and the two are connected by welding technology.

[0029] In this embodiment, the conductive pads 3 are evenly arranged on the left and right sides and the rear side of the plastic package, and the surface is flush with the outer surface of the plastic package. The interior of the conductive pad 3 uses a half-etching process to increase the pad area, which helps to improve the bonding strength between the interior of the conductive pad 3 and the plastic package 1 and improve the anti-delamination capability; on the other hand, it helps to improve the flatness of the bonding surface and strengthen the yield requirements of the bonding process.

[0030] The above description is only used to illustrate the technical solution of the present invention rather than to limit it. Other modifications or equivalent substitutions made to the technical solution of the present invention by ordinary technicians in this field should be included in the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solution of the present invention.

Claims

1. A packaging structure of a Hall current sensor chip, comprising a plastic package, a built-in base island and a plurality of conductive pads, wherein the plastic package wraps the built-in base island and the plurality of conductive pads, and is characterized in that: The built-in base island includes a mounting portion for placing a Hall disk, the front end of the mounting portion extends obliquely upward to form a transition portion, the transition portion further extends forward and folds backward to form a main heat dissipation portion, the main heat dissipation portion is provided with a through groove for accommodating the tube core of the Hall disk, auxiliary heat dissipation portions are arranged on the left and right sides and the rear side of the mounting portion, the mounting portion is lower than the main heat dissipation portion and the auxiliary heat dissipation portion, forming a basin structure with a low middle and high surroundings.

2. The packaging structure of a Hall current sensor chip according to claim 1, characterized in that: The upper surfaces of the main heat dissipation part and the auxiliary heat dissipation part are flush with the upper surface of the plastic packaging body.

3. The packaging structure of a Hall current sensor chip according to claim 1, characterized in that: An external connection port is formed at the connection between the transition portion and the main heat dissipation portion, and a first packaging slot hole is provided on the external connection port.

4. The packaging structure of a Hall current sensor chip according to claim 1, characterized in that: Second packaging slots are provided on the outer sides of the auxiliary heat dissipation parts.

5. The packaging structure of a Hall current sensor chip according to claim 1, characterized in that: A plurality of heat dissipation fins are arranged on the upper surface of the auxiliary heat dissipation part, and the two are integrally formed.

6. The packaging structure of a Hall current sensor chip according to claim 1, characterized in that: The built-in base island is integrally formed.

7. The packaging structure of a Hall current sensor chip according to claim 1, characterized in that: The conducting pads are evenly arranged on the left and right sides and the rear side of the plastic package body, and the surfaces are flush with the outer surface of the plastic package body.

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