Polyamide-imide and polyamide-imide film

Abstract

One embodiment of the present invention relates to a polyamide-imide comprising a structure derived from a compound comprising at least one compound selected from the group consisting of diamines and diisocyanates, and a structure derived from a carboxylic acid compound comprising at least a tricarboxylic acid anhydride, at least one selected from the group consisting of the compounds and the carboxylic acid compounds contains a compound having a group containing at least one non-aromatic hydrocarbon group, the total number of carbon atoms of the at least one non-aromatic hydrocarbon group being 8 or more, and at least one selected from the group consisting of the compounds and the carboxylic acid compounds contains a compound having an aromatic hydrocarbon group.

Description

Technical Field

[0001] The present disclosure relates to a polyamideimide, a polyamideimide-containing liquid, a polyamideimide film, and a printed circuit board. Background Art

[0002] Polyamideimide is widely used in various applications due to its excellent electrical insulation, heat resistance, chemical resistance and solvent resistance. For example, polyamideimide is used as a material for varnish for enameled wire, protective film for electronic components, optical or display film, etc. (for example, Patent Document 1).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-87236 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In recent years, electronic components are required to be highly integrated and have high frequencies, and it is expected that the dielectric properties of insulating materials will be further improved in a wide frequency range including high frequencies. Therefore, the present disclosure provides a polyamide-imide having a low dielectric constant and dielectric loss tangent, and a polyamide-imide-containing liquid containing the polyamide-imide. In addition, the present disclosure provides a polyamide-imide film and a printed circuit board showing excellent insulation.

[0008] Means for solving problems

[0009] The present invention includes the following embodiments. The present invention is not limited to the following embodiments.

[0010] One embodiment relates to a polyamideimide, comprising: a structure derived from a compound containing at least one selected from the group consisting of diamines and diisocyanates and a structure derived from a carboxylic acid compound containing at least tricarboxylic anhydride, at least one selected from the above compounds and the above carboxylic acid compounds containing a compound having a group containing at least one non-aromatic hydrocarbon group and the total number of carbon atoms of the at least one non-aromatic hydrocarbon group is 8 or more, and at least one selected from the above compounds and the above carboxylic acid compounds containing a compound having an aromatic hydrocarbon group.

[0011] Another embodiment relates to a polyamide-imide-containing liquid containing the polyamide-imide and a solvent.

[0012] Another embodiment relates to a polyamide-imide film obtained using the above-mentioned polyamide-imide or the above-mentioned polyamide-imide-containing liquid.

[0013] Another embodiment relates to a printed circuit board obtained by using the above-mentioned polyamideimide or the above-mentioned polyamideimide-containing liquid.

[0014] Effects of the Invention

[0015] According to the present disclosure, a polyamideimide having a low dielectric constant and dielectric loss tangent and a polyamideimide-containing liquid containing the polyamideimide can be provided. In addition, according to the present disclosure, a polyamideimide film and a substrate having excellent insulation properties can be provided. DETAILED DESCRIPTION

[0016] The embodiments of the present invention are described. The present invention is not limited to the following embodiments. In addition, the following embodiments can be implemented individually or in combination. The combination of multiple embodiments is also included in the present invention.

[0017] In the numerical range recorded in stages in the present disclosure, the upper limit or lower limit recorded in a certain numerical range can also be replaced by the upper limit or lower limit of other numerical ranges. In addition, the upper limit or lower limit of the numerical range recorded in the present disclosure can also be replaced by the value shown in the embodiment. It is also possible to select a certain numerical value from the numerical value of the upper limit and the numerical value of the lower limit recorded in stages in the present disclosure, respectively, and set it as the numerical range of stages. In addition, the numerical value of the upper limit and the numerical value of the lower limit recorded in the present disclosure can also be replaced by the value shown in the embodiment.

[0018] In the present disclosure, each component may contain a plurality of corresponding substances. When a plurality of corresponding substances exist in a composition, the content or content of each component refers to the total content or content of the plurality of substances present in the composition unless otherwise specified.

[0019] In the present disclosure, each structure in a polymer may also include multiple structures that match. When multiple structures that match each structure exist in a polymer, the content or content of each structure refers to the total content or content of the multiple structures present in the polymer unless otherwise specified.

[0020] In the present disclosure, the term "layer" includes continuous layers and discontinuous layers. The thickness of a "layer" may be uniform or non-uniform. The outer edge of a "layer" in the surface direction and the outer edge in the thickness direction may be clear or unclear, respectively. The same applies to a "film".

[0021] <Polyamide-imide>

[0022] In an embodiment of the present invention, the polyamide-imide comprises: a structure derived from a compound comprising at least one selected from the group consisting of diamines and diisocyanates and a structure derived from a carboxylic acid compound comprising at least tricarboxylic anhydride. At least one selected from the above-mentioned compound and the above-mentioned carboxylic acid compound comprises a compound having a group comprising at least one non-aromatic hydrocarbon group and the total number of carbon atoms of the at least one non-aromatic hydrocarbon group being 8 or more. Moreover, at least one selected from the above-mentioned compound and the above-mentioned carboxylic acid compound comprises a compound having an aromatic hydrocarbon group. In the present disclosure, “a compound comprising at least one selected from the group consisting of diamines and diisocyanates” is sometimes referred to as a “diamine or diisocyanate compound”. The carboxylic acid compound may further comprise a dicarboxylic acid. In the present disclosure, “a group comprising at least one non-aromatic hydrocarbon group and the total number of carbon atoms of the at least one non-aromatic hydrocarbon group being 8 or more” is sometimes referred to as a “hydrocarbon group (X)”.

[0023] In the polyamide-imide, for example, at least the diamine or diisocyanate compound contains a compound having a hydrocarbon group (X), and at least the carboxylic acid compound contains a compound having an aromatic hydrocarbon group. Alternatively, in the polyamide-imide, for example, at least the diamine or diisocyanate compound contains a compound having an aromatic hydrocarbon group, and at least the carboxylic acid compound contains a compound having a hydrocarbon group (X). It should be noted that, when the carboxylic acid compound has a hydrocarbon group (X), the number of carbon atoms in the carboxyl group is not included in the number of carbon atoms in the hydrocarbon group (X).

[0024] According to a preferred embodiment, in the polyamideimide, the diamine or diisocyanate compound comprises a diamine or diisocyanate compound having a hydrocarbon group (X) and a diamine or diisocyanate compound having an aromatic hydrocarbon group, and the carboxylic acid compound comprises a carboxylic acid compound having an aromatic hydrocarbon group. According to another preferred embodiment, in the polyamideimide, the diamine or diisocyanate compound comprises a diamine or diisocyanate compound having an aromatic hydrocarbon group, and the carboxylic acid compound comprises a carboxylic acid compound having a hydrocarbon group (X) and a carboxylic acid compound having an aromatic hydrocarbon group.

[0025] (Hydrocarbon group (X))

[0026] The hydrocarbon group (X) that the diamine or diisocyanate compound and the carboxylic acid compound may have includes at least one non-aromatic hydrocarbon group. In the hydrocarbon group (X), the total number of carbons of at least one non-aromatic hydrocarbon group is 8 or more. In the case where the hydrocarbon group (X) includes one non-aromatic hydrocarbon group, the total number of carbons refers to the total number of carbons contained in the one non-aromatic hydrocarbon group. In the case where the hydrocarbon group (X) includes two or more non-aromatic hydrocarbon groups, the total number of carbons refers to the total number of carbons contained in the two or more non-aromatic hydrocarbon groups. The hydrocarbon group (X) may further include any group other than the non-aromatic hydrocarbon group. The hydrocarbon group (X) is, for example, a 1- to 4-valent group, preferably a 2- to 4-valent group, and more preferably a 2-valent group.

[0027] The non-aromatic hydrocarbon group is, for example, a saturated aliphatic hydrocarbon group, an unsaturated aliphatic hydrocarbon group, a saturated alicyclic hydrocarbon group, an unsaturated alicyclic hydrocarbon group, or a group containing two or more selected from them. The saturated aliphatic hydrocarbon group may be straight-chain or branched. The unsaturated aliphatic hydrocarbon group may be straight-chain or branched. When the hydrocarbon group (X) contains two or more non-aromatic hydrocarbon groups, the two or more non-aromatic hydrocarbon groups may be the same as or different from each other.

[0028] The carbon number of the saturated aliphatic hydrocarbon group is, for example, 1 to 50, 2 to 40, 3 to 30, 4 to 20, or 5 to 10. The saturated aliphatic hydrocarbon group is, for example, an atomic group obtained by removing 1 to 4 hydrogen atoms from a linear or branched alkane. Examples of alkanes include methane, ethane, propane, butane, pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, heptadecane, octadecane, nonadecane, eicosane, heneicosane, docosane, tricosane, tetracosane, hexacosane, octacosane, triacontan, tetracontan and pentacontan.

[0029] The carbon number of the unsaturated aliphatic hydrocarbon group is, for example, 2 to 50, 2 to 40, 3 to 30, 4 to 20, or 5 to 10. The number of carbon-carbon unsaturated bonds contained in the unsaturated aliphatic hydrocarbon group is 1 or more, for example, 5 or less, 4 or less, 3 or less, or 2 or less. The unsaturated aliphatic hydrocarbon may be an olefin containing 1 carbon-carbon double bond, or an alkyne containing 1 carbon-carbon triple bond. The unsaturated aliphatic hydrocarbon group is, for example, an atomic group obtained by removing 1 to 4 hydrogen atoms from a straight-chain or branched olefin, or an atomic group obtained by removing 1 to 4 hydrogen atoms from a straight-chain or branched alkyne. Examples of olefins include ethylene, propylene, butene, pentene, hexene, heptene, octene, nonene, decene, undecene, dodecene, tridecene, tetradecene, pentadecene, hexadecene, heptadecene, octadecene, nonadecene, eicosene, heneicosene, docosene, trieicosene, tetraeicosene, pentaeicosene, hexacosene, heptacosene, octacosene, nonacosene, triaconta ...

[0030] The carbon number of the saturated alicyclic hydrocarbon group is, for example, 3 to 20, 4 to 16, 5 to 10, or 6 to 8. The saturated alicyclic hydrocarbon group is, for example, an atomic group obtained by removing 1 to 4 hydrogen atoms from a cycloalkane. Examples of cycloalkanes include cyclopropane, cyclobutane, cyclopentane, cyclohexane, cycloheptane, cyclooctane, norbornane, decalin, bicyclobutane, bicyclohexane, bicyclooctane, spiropentane, spiroheptane, tetracycloalkane, and adamantane.

[0031] The carbon number of the unsaturated alicyclic hydrocarbon group is, for example, 4 to 20, 5 to 10, or 6 to 8. The carbon-carbon unsaturated bonds contained in the unsaturated aliphatic hydrocarbon group are one or more, for example, 5 or less, 4 or less, 3 or less, or 2 or less. The unsaturated aliphatic hydrocarbon may be a cycloolefin containing one carbon-carbon double bond, or a cycloalkyne containing one carbon-carbon triple bond. The unsaturated alicyclic hydrocarbon group is, for example, an atomic group obtained by removing 1 to 4 hydrogen atoms from a cycloolefin, or an atomic group obtained by removing 1 to 4 hydrogen atoms from a cycloalkyne. Examples of unsaturated alicyclic hydrocarbons include cyclobutene, cyclopentene, cyclopentadiene, cyclohexene, cyclohexadiene, cycloheptene, norbornene, norbornadiene, and bicyclooctadiene.

[0032] Examples of the optional group that the hydrocarbon group (X) may contain include an aromatic hydrocarbon group and a group containing a hetero atom.

[0033] The number of carbon atoms in the aromatic hydrocarbon group is, for example, 6 to 30, 6 to 20, or 6 to 10. The aromatic hydrocarbon group is, for example, an atomic group obtained by removing 1 to 4 hydrogen atoms from an aromatic hydrocarbon. Examples of aromatic hydrocarbons include benzene, naphthalene, anthracene, pyrene, and pentane.

[0034] As the group containing heteroatoms, for example, heterocyclic compound groups, linking groups containing heteroatoms, and substituents containing heteroatoms can be listed. The heterocyclic compound group is an atomic group obtained by removing 1 to 4 hydrogen atoms from a non-aromatic heterocyclic compound, or an atomic group obtained by removing 1 to 4 hydrogen atoms from an aromatic heterocyclic compound. Examples of non-aromatic heterocyclic compounds include tetrahydrofuran, tetrahydrothiophene, and dioxane. Examples of aromatic heterocyclic compounds include pyridine, benzofuran, and benzothiophene. Examples of linking groups containing heteroatoms include oxy, sulfhydryl, sulfonyl, sulfinyl, carbonyl, carbonyloxy, and imino groups. Examples of substituents containing heteroatoms include hydroxyl, mercapto, sulfo, sulfinyl, carboxyl, fluoro, and chloro groups.

[0035] The total number of carbon atoms of at least one non-aromatic hydrocarbon group contained in the hydrocarbon group (X) is 8 or more. Examples of the total number of carbon atoms of the hydrocarbon group (X) and at least one non-aromatic hydrocarbon group contained in the hydrocarbon group (X) are listed below. In addition, examples of groups that do not conform to the hydrocarbon group (X) are listed as reference examples. "*" indicates the bonding position to other atoms.

[0036] Table 1

[0037]

[0038] The total number of carbon atoms of at least one non-aromatic hydrocarbon group contained in the hydrocarbon group (X) is 8 or more. The carbon number may be, for example, 12 or more, 16 or more, 20 or more, 24 or more, 28 or more, 32 or more, or 36 or more. The total number of carbon atoms of at least one non-aromatic hydrocarbon group contained in the hydrocarbon group (X) is, for example, 50 or less. The carbon number may be, for example, 48 or less, 44 or less, 40 or less, or 36 or less. When the total number of carbon atoms of the non-aromatic hydrocarbon groups is 8 or more, a polyamide-imide having a low dielectric constant and a low dielectric loss tangent can be obtained. When the total number of carbon atoms of the non-aromatic hydrocarbon groups is 50 or less, raw material monomers are easily obtained, and polyamide-imide can be easily synthesized. Even if the polyamide-imide has a group having a total number of carbon atoms of 8 or more of aromatic hydrocarbon groups, a polyamide-imide having a low dielectric constant and a low dielectric loss tangent cannot be obtained.

[0039] The hydrocarbon group (X) preferably comprises a saturated aliphatic hydrocarbon group, and more preferably comprises a straight-chain saturated aliphatic hydrocarbon group having more than 6 carbon atoms (preferably having more than 8 carbon atoms). In the case where the polyamide-imide comprises a structure containing a straight-chain saturated aliphatic hydrocarbon group having more than 6 carbon atoms, there is a tendency that the dielectric constant is lower and the dielectric loss tangent is easy to become lower. It is believed that by having a straight-chain saturated aliphatic hydrocarbon group having more than 6 carbon atoms, the polarity (dipole moment) in the polyamide-imide molecule becomes smaller and the dielectric constant is reduced. However, the present invention is not limited by this speculation.

[0040] The hydrocarbon group (X) preferably includes at least one group selected from the group consisting of a saturated alicyclic hydrocarbon group and an unsaturated alicyclic hydrocarbon group, and more preferably includes a saturated alicyclic hydrocarbon group. When the polyamide-imide includes at least one of a saturated alicyclic hydrocarbon group and an unsaturated alicyclic hydrocarbon group, there is a tendency that the dielectric constant tends to become lower. It is believed that the reason is that the free volume increases due to the alicyclic structure of the polyamide-imide. However, the present invention is not limited by this speculation.

[0041] The hydrocarbon group (X) preferably includes at least one selected from the group consisting of a group represented by the following formula (G1) to a group represented by the following formula (G5): In the formula, "*" represents a bonding position to another atom.

[0042] [Chemical formula 1]

[0043] *-Ra-* (G1)

[0044] *-Rb-Ra-Rb-* (G2)

[0045] *-Ra-Rb-Ra-* (G3)

[0046] *-Rb-L-Rb-* (G4)

[0047]

[0048] In the formula, Ra represents a linear or branched saturated aliphatic hydrocarbon group, or a linear or branched unsaturated aliphatic hydrocarbon group. Rb represents a saturated alicyclic hydrocarbon group or an unsaturated alicyclic hydrocarbon group. L represents a single bond or a linking group containing a heteroatom. Ra and Rb may have a substituent or may not have a substituent.

[0049] In a preferred embodiment, the polyamideimide includes a structure derived from a compound having a group represented by formula (G1) (for example, Ra has 8 or more carbon atoms). Examples of such compounds include polymethylene diamine, polymethylene diisocyanate, and polymethylene dicarboxylic acid.

[0050] In other preferred embodiments, the polyamide-imide comprises at least one structure selected from the group consisting of a structure of a compound having a group represented by formula (G2) (e.g., the carbon number of Rb is independently 6 or more, preferably 8 or more), a structure of a compound having a group represented by formula (G3) (e.g., the carbon number of Ra is independently 6 or more, preferably 8 or more), and a structure of a compound having a group represented by formula (G5) (e.g., the carbon number of Rb is 6, the carbon number of Ra is independently 6 or more, preferably the carbon number of Rb is 6, and the carbon number of Ra is independently 6 or more). As these compounds, dimer acid, hydrogenated dimer acid, dimer diamine, hydrogenated dimer diamine, dimer diisocyanate, hydrogenated dimer diisocyanate, etc. can be listed.

[0051] (Aromatic hydrocarbon group)

[0052] The number of carbon atoms of the aromatic hydrocarbon group that the diamine or diisocyanate compound and the carboxylic acid compound may have is, for example, 6 to 30, 6 to 20, or 6 to 10. The aromatic hydrocarbon group is, for example, an atomic group obtained by removing 1 to 4 hydrogen atoms from an aromatic hydrocarbon. Examples of aromatic hydrocarbons include benzene, naphthalene, anthracene, pyrene, and pentane. If the polyamide-imide contains an aromatic hydrocarbon group, good heat resistance and mechanical properties are easily obtained.

[0053] (Diamine or diisocyanate compound having a hydrocarbon group (X))

[0054] Examples of the diamine or diisocyanate compound having a hydrocarbon group (X) include a diamine having the above-mentioned hydrocarbon group (X) and two amino groups bonded to the hydrocarbon group (X), or a diisocyanate having the above-mentioned hydrocarbon group (X) and two isocyanate groups bonded to the hydrocarbon group (X).

[0055] Specific examples of the diamine having a hydrocarbon group (X) include the following diamines.

[0056] Diamines having 8 or more carbon atoms and having a saturated aliphatic hydrocarbon group, such as 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane, 1,12-diaminododecane, 1,14-diaminotetradecane, and 1,16-diaminohexadecane;

[0057] Diamines having an unsaturated aliphatic hydrocarbon group and having 8 or more carbon atoms, such as 1,8-diaminooctene, 1,9-diaminononene, 1,10-diaminodecene, 1,11-diaminoundecene, 1,12-diaminododecene, 1,14-diaminotetradecene, and 1,16-diaminohexadecene;

[0058] Isophorone diamine, bis(aminomethyl)norbornane, 1,3-diaminoadamantane, 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 4,4'-diaminodicyclohexylmethane, 3,3'-dimethyl-4,4'-diaminodicyclohexylmethane, 3,3'-diethyl-4,4'-diaminodicyclohexylmethane, 3,3',5,5'-tetramethyl-4,4'-diaminodicyclohexylmethane, 3,3',5,5'-tetraethyl-4,4'-diaminodicyclohexylmethane, 3,5-diethyl-3',5'-dimethyl-4,4'-diaminodicyclohexylmethane, 4,4'-diaminodicyclohexyl ether, 3,3'-dimethyl-4,4'-diaminodicyclohexyl ether, 3,3'-diethyl-4,4'-diaminodicyclohexyl Diamines having 8 or more carbon atoms and having a saturated alicyclic hydrocarbon group, such as aminodicyclohexyl ether, 3,3',5,5'-tetramethyl-4,4'-diaminodicyclohexyl ether, 3,3',5,5'-tetraethyl-4,4'-diaminodicyclohexyl ether, 3,5-diethyl-3',5'-dimethyl-4,4'-diaminodicyclohexyl ether, 2,2-bis(4-aminocyclohexyl)propane, 2,2-bis(3-methyl-4-aminocyclohexyl)propane, 2,2-bis(3-ethyl-4-aminocyclohexyl)propane, 2,2-bis(3,5-dimethyl-4-aminocyclohexyl)propane, 2,2-bis(3,5-diethyl-4-aminocyclohexyl)propane, and 2,2-(3,5-diethyl-3',5'-dimethyl-4,4'-diaminodicyclohexyl)propane;

[0059] Diamines having an unsaturated alicyclic hydrocarbon group and having 8 or more carbon atoms, such as bis(aminomethyl)norbornene and 4,4'-diaminodicyclohexenylmethane;

[0060] Dimer diamines having 8 or more carbon atoms derived from monounsaturated fatty acids such as crotonic acid, myristic acid, palmitoleic acid, sapienic acid, oleic acid, elaidic acid, vaccenic acid, gadoleic acid, eicosenoic acid, erucic acid, and nervonic acid; diunsaturated fatty acids such as linoleic acid, eicosadienoic acid, and docosadienoic acid; and dimers of unsaturated fatty acids such as triunsaturated fatty acids such as linolenic acid, pinolenic acid, elaeolic acid, mead acid, dihomo-γ-linolenic acid, and eicosatrienoic acid (also referred to as dimer acids);

[0061] The compound obtained by hydrogenating the carbon-carbon double bond contained in the molecule of the dimer diamine is a hydrogenated dimer diamine having 8 or more carbon atoms.

[0062] Specific examples of the diisocyanate having a hydrocarbon group (X) include compounds having the same structure as the compounds listed as specific examples of the above diamine except that the amino group is replaced with an isocyanate group.

[0063] (Carboxylic acid compound having a hydrocarbon group (X))

[0064] Examples of the carboxylic acid compound having a hydrocarbon group (X) include tricarboxylic anhydride having the above-mentioned hydrocarbon group (X) and one carboxyl group and one acid anhydride group bonded to the hydrocarbon group (X), and dicarboxylic acid having the above-mentioned hydrocarbon group (X) and two carboxyl groups bonded to the hydrocarbon group (X).

[0065] Furthermore, specific examples of the carboxylic acid compound having a hydrocarbon group (X) include the following compounds.

[0066] Aliphatic tricarboxylic anhydrides such as decahydronaphthalene tricarboxylic anhydride, 3,4,4'-dicyclohexane tricarboxylic anhydride, 2,3,2'-dicyclohexane tricarboxylic anhydride, and 3,4,4'-dicyclohexane methane tricarboxylic anhydride;

[0067] A dicarboxylic acid having the same structure as the compound shown as a specific example of the diamine having a hydrocarbon group (X) except that the amino group is replaced by a carboxyl group

[0068] (Diamine or diisocyanate compound having an aromatic hydrocarbon group)

[0069] Examples of the diamine or diisocyanate compound having an aromatic hydrocarbon group include a diamine having one or more of the above aromatic hydrocarbon groups and two amino groups, or a diisocyanate having one or more of the above aromatic hydrocarbon groups and two isocyanate groups.

[0070] Specific examples of the diamine having an aromatic hydrocarbon group include the following diamines.

[0071] 1,4-phenylenediamine, 1,2-phenylenediamine, 1,3-phenylenediamine, 4,4'-(biphenyl-2,5-diylbisoxy)dianiline, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 3,4'-diaminodiphenyl ether, 1,4-bis(4-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, bis(4-(4-aminophenoxy) phenyl) sulfone, bis(4-(3-aminophenoxy)phenyl) sulfone, 1,3-bis(4-aminophenoxy)neopentane, 4,4'-diamino-3,3'-dimethylbiphenyl, 4,4'-diamino-2,2'-dimethylbiphenyl, 4,4'-bis(4-aminophenoxy)biphenyl, 4,4'-diamino-3,3'-dihydroxybiphenyl, bis(4-amino-3-carboxyphenyl)methane, 4,4'-diaminodiphenyl sulfone, 3,3'-diamino diphenyl sulfone, 4,4'-diaminodiphenyl sulfide, N-(4-aminophenoxy)-4-aminoaniline, 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl, bis(3-aminophenyl) sulfone, norbornanediamine, 4,4'-diamino-2-(trifluoromethyl)diphenyl ether, 5-trifluoromethyl-1,3-phenylenediamine, 2,2-bis(4-(4-aminophenoxy)phenyl)hexafluoropropane, 4,4'-diamino-2,2 Diamines having an aromatic hydrocarbon group such as 2,4'-bis(trifluoromethyl)biphenyl, 2,2-bis[4-{4-amino-2-(trifluoromethyl)phenoxy}phenyl]hexafluoropropane, 2-trifluoromethyl-p-phenylenediamine, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane, 4,4'-(9-fluorenylene)diphenylamine, 2,7-diaminofluorene and 1,5-diaminonaphthalene (wherein the total number of carbon atoms contained in the non-aromatic hydrocarbon groups contained in the diamine is 0 to 7.)

[0072] Specific examples of the diisocyanate having an aromatic hydrocarbon group include compounds having the same structure as the compounds shown as specific examples of the above diamine except that the amino group is replaced with an isocyanate group.

[0073] (Carboxylic acid compound having an aromatic hydrocarbon group)

[0074] Examples of the carboxylic acid compound having an aromatic hydrocarbon group include dicarboxylic acids having the above aromatic hydrocarbon group and two carboxyl groups, and tricarboxylic anhydrides having the above aromatic hydrocarbon group, one carboxyl group, and one acid anhydride group.

[0075] Furthermore, specific examples of the carboxylic acid compound having an aromatic hydrocarbon group include the following compounds.

[0076] Aromatic tricarboxylic acids such as trimellitic anhydride, naphthalene tricarboxylic anhydride, 3,4,4'-biphenyl tricarboxylic anhydride, 2,3,2'-biphenyl tricarboxylic anhydride, 3,4,4'-biphenylmethane tricarboxylic anhydride, 3,4,4'-biphenyl ether tricarboxylic anhydride, 3,4,4'-benzophenone tricarboxylic anhydride, or 3,4,4'-biphenyl sulfone tricarboxylic anhydride;

[0077] A dicarboxylic acid having the same structure as the compound shown as a specific example of the diamine having an aromatic hydrocarbon group except that the amino group is replaced by a carboxyl group

[0078] (arbitrary structure)

[0079] In addition to the structure derived from at least one compound selected from the group consisting of diamines and diisocyanates and the structure derived from the carboxylic acid compound containing at least tricarboxylic anhydride, polyamide-imide can also include any structure. As examples of any structure, structures derived from trifunctional or higher amines or isocyanates, structures derived from monofunctional amines or isocyanates, etc. can be listed. In addition to tricarboxylic anhydride, the carboxylic acid compound can also include any compound. As examples of any compound, dicarboxylic acids, dicarboxylic anhydrides, tricarboxylic acids, tetracarboxylic acids, tetracarboxylic anhydrides, etc. can be listed.

[0080] (Manufacturing method)

[0081] Polyamide-imide is obtained by reacting at least a diamine or a diisocyanate compound with a carboxylic acid compound. For the reaction, these compounds can be used alone or in combination of two or more. Other arbitrary compounds can also be reacted.

[0082] The synthesis conditions of polyamideimide are various and cannot be determined in general, but for example, it can be carried out at a temperature of 80 to 180° C. In order to reduce the influence of moisture in the air, the synthesis is preferably carried out under an atmosphere of nitrogen or the like. The synthesized polyamideimide can be obtained, for example, as a polyamideimide-containing liquid obtained by dissolving it in a solvent used in the reaction.

[0083] The solvent is not particularly limited, but for example, polar solvents such as N-methyl-2-pyrrolidone (NMP), N-ethyl-2-pyrrolidone (NEP), γ-butyrolactone (GBL), 3-methoxy-N,N-dimethylpropaneamide (MPA), N,N'-dimethylformamide, N,N'-dimethylpropyleneurea [1,3-dimethyl-3,4,5,6-tetrahydropyrimidin-2(1H)-one], dimethyl sulfoxide, diethylene glycol dimethyl ether, triethylene glycol dimethyl ether, and cyclopentane sulfone; aromatic hydrocarbon solvents such as xylene and toluene; ketone solvents such as methyl ethyl ketone and methyl isobutyl ketone, etc. can be used. The solvent preferably contains at least one selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N-ethyl-2-pyrrolidone (NEP), γ-butyrolactone (GBL) and 3-methoxy-N,N-dimethylpropaneamide (MPA), and more preferably contains at least one selected from the group consisting of N-ethyl-2-pyrrolidone (NEP), γ-butyrolactone (GBL) and 3-methoxy-N,N-dimethylpropaneamide (MPA).

[0084] The amount of the solvent used during the reaction is preferably set to 100 to 300 parts by mass, and more preferably set to 150 to 250 parts by mass, relative to 100 parts by mass of the total amount of the carboxylic acid compound and the diamine or diisocyanate compound. If the amount of the solvent used is 100 parts by mass or more, there is a tendency to easily prevent the reaction accompanied by foaming. If the amount of the solvent used is 300 parts by mass or less, there is a tendency to prevent the synthesis time from becoming too long, and there is a tendency that the concentration of the polyamide-imide contained in the solution obtained after the synthesis becomes sufficient.

[0085] When a carboxyl group, an acid anhydride group, and a reactive hydroxyl group are present, the carboxylic acid compound and the diamine or diisocyanate compound are preferably reacted in such a manner that the ratio of the number of moles of the amino group and the isocyanate group to the total number of moles of these functional groups is preferably 0.6 to 1.4, more preferably 0.7 to 1.3, and further preferably 0.8 to 1.2. If the ratio is 0.6 or more, there is a tendency to easily increase the molecular weight of the polyamide-imide. If the ratio is 1.4 or less, there is a tendency to prevent the reaction accompanying foaming from becoming violent and the amount of unreacted products remaining increases, and it is easy to obtain good stability of the polyamide-imide.

[0086] (Content ratio of the structure derived from the compound having a hydrocarbon group (X), etc.)

[0087] The content of the structure derived from the compound having a hydrocarbon group (X) contained in the polyamide-imide is based on the content of the structure derived from the diamine or diisocyanate compound and the structure derived from the carboxylic acid compound (that is, when the total content of the structure derived from the diamine or diisocyanate compound and the structure derived from the carboxylic acid compound is set to 100 mol%), for example, 5 to 50 mol%, 7 to 30 mol%, or 8 to 20 mol%. The content of the structure derived from the compound having an aromatic hydrocarbon group contained in the polyamide-imide is based on the content of the structure derived from the diamine or diisocyanate compound and the structure derived from the carboxylic acid compound, for example, 50 to 95 mol%, 70 to 93 mol%, or 80 to 92 mol%.

[0088] In the polyamideimide, when the diamine or diisocyanate compound includes a diamine or diisocyanate compound having a hydrocarbon group (X) and a diamine or diisocyanate compound having an aromatic hydrocarbon group, and the carboxylic acid compound includes a carboxylic acid compound having an aromatic hydrocarbon group, the content of the structure derived from the diamine or diisocyanate compound having the hydrocarbon group (X) is, for example, 5 to 50 mol%, 8 to 40 mol%, or 10 to 30 mol%, based on the content of the structure derived from the diamine or diisocyanate compound (i.e., when the content of the structure derived from the diamine or diisocyanate compound is set to 100 mol%). The content of the structure derived from the diamine or diisocyanate compound having an aromatic hydrocarbon group is, for example, 50 to 95 mol%, 60 to 92 mol%, or 70 to 90 mol%, based on the content of the structure derived from the diamine or diisocyanate compound.

[0089] In the polyamideimide, when the diamine or diisocyanate compound includes a diamine or diisocyanate compound having an aromatic hydrocarbon group, and the carboxylic acid compound includes a carboxylic acid compound having a hydrocarbon group (X) and a carboxylic acid compound having an aromatic hydrocarbon group, the content of the structure derived from the carboxylic acid compound having the hydrocarbon group (X) is, for example, 10 to 60 mol%, 15 to 50 mol%, or 20 to 40 mol%, based on the content of the structure derived from the carboxylic acid compound (i.e., when the content of the structure derived from the carboxylic acid compound is set to 100 mol%). The content of the structure derived from the carboxylic acid compound having an aromatic hydrocarbon group is, for example, 40 to 90 mol%, 50 to 85 mol%, or 60 to 80 mol%, based on the content of the structure derived from the carboxylic acid compound.

[0090] In polyamide-imide, the content of the structure derived from tricarboxylic anhydride is based on the content of the structure derived from the carboxylic acid compound as a benchmark (that is, when the content of the structure derived from the carboxylic acid compound is set to 100 mol%), for example, more than 50 mol%, 60 mol% or more, or 65 mol% or more. The upper limit can be 100 mol%, but in the case of structures comprising other carboxylic acids such as dicarboxylic acids, for example, 90 mol% or less, 80 mol% or less, or 75 mol% or less. In polyamide-imide, in the case of structures comprising dicarboxylic acids, the content of the structure derived from dicarboxylic acids is, for example, less than 50 mol%, 40 mol% or less, or 35 mol% or less.

[0091] In some embodiments, the polyamide-imide comprises a structure derived from a diamine or diisocyanate compound and a structure derived from a carboxylic acid compound; the diamine or diisocyanate compound comprises a dimer diamine having a carbon number of 8 or more or a hydrogenated dimer diamine having a carbon number of 8 or more; the carboxylic acid compound comprises a tricarboxylic anhydride having an aromatic hydrocarbon group. The compound may further comprise a diamine having an aromatic hydrocarbon group.

[0092] In some embodiments, the polyamide-imide comprises a structure derived from a diamine or diisocyanate compound and a structure derived from a carboxylic acid compound; the carboxylic acid compound comprises a dicarboxylic acid having a linear saturated aliphatic hydrocarbon group having 8 or more carbon atoms; the diamine or diisocyanate compound comprises a diamine having an aromatic hydrocarbon group. The carboxylic acid compound may further comprise a tricarboxylic anhydride having an aromatic hydrocarbon group.

[0093] (Number average molecular weight)

[0094] The number average molecular weight of the polyamideimide is preferably 3,000 to 100,000. If the number average molecular weight is 3,000 or more, there is a tendency for various properties such as strength to be improved. The number average molecular weight of the polyamideimide may be 5,000 or more, 8,000 or more, 15,000 or more, or 20,000 or more. If the number average molecular weight is 100,000 or less, there is a tendency to easily obtain good coating properties. The number average molecular weight of the polyamideimide may be 80,000 or less, 50,000 or less, 35,000 or less, 30,000 or less, or 27,000 or less.

[0095] For example, from the viewpoint of obtaining excellent insulation, the relative dielectric constant (10 GHz) of the polyamide-imide is 4.0 or less, 3.6 or less, 3.3 or less, or 3.1 or less. The relative dielectric constant of the polyamide-imide is not particularly limited, but from the viewpoint of preventing a decrease in heat resistance, tensile strength, and tensile modulus, it is, for example, 2.0 or more.

[0096] For example, from the viewpoint of suppressing transmission loss, the dielectric loss tangent (10 GHz) of polyamideimide is 0.020 or less, 0.015 or less, or 0.010 or less. The dielectric loss tangent of polyamideimide is not particularly limited, but may be 0.0001 or more, or 0.0005 or more.

[0097] For example, from the viewpoint of the strength of the molded body, the tensile strength of the polyamide-imide is 30 MPa or more, 50 MPa or more, or 80 MPa or more. The tensile strength of the polyamide-imide is not particularly limited, but, for example, from the viewpoint of the elongation during processing, it is 400 MPa or less, 300 MPa or less, or 250 MPa or less.

[0098] For example, from the viewpoint of the flexibility of the molded body, the elongation at break of the polyamide-imide is 3% or more, 5% or more, or 8% or more. The elongation at break may also be 20% or more, 30% or more, or 50% or more. The elongation at break of the polyamide-imide is not particularly limited, but is, for example, 300% or less, 200% or less, or 100% or less.

[0099] For example, from the viewpoint of the strength of the molded body, the tensile modulus of the polyamide-imide is 0.5 GPa or more, 0.7 GPa or more, 1.0 GPa or more, or 1.5 GPa or more. For example, from the viewpoint of the flexibility of the molded body, the tensile modulus of the polyamide-imide is 7 GPa or less, 6 GPa or less, or 5 GPa or less.

[0100] For example, from the viewpoint of heat resistance of the molded article, the glass transition temperature (Tg) of the polyamideimide is 120° C. or higher, 140° C. or higher, or 160° C. or higher. The upper limit is not particularly limited, but is, for example, 350° C. or lower, or 300° C. or lower.

[0101] In the present disclosure, the relative dielectric constant, dielectric loss tangent, tensile strength, elongation at break, tensile elastic modulus and glass transition temperature (Tg) of polyamideimide can be respectively prepared according to the methods described in the embodiments, and the prepared polyamideimide film can be used to measure the measured values ​​according to the methods described in the embodiments.

[0102] [use]

[0103] Polyamideimide can be used for various electronic components and mechanical components, for example, it can be used for displays, solar cells, touch panels, organic EL lighting, printed circuit boards, and the like.

[0104] <Polyamide-imide containing liquid>

[0105] The polyamide-imide-containing liquid as an embodiment of the present invention contains polyamide-imide and a solvent. As a solvent, the solvent used in the above-mentioned reaction that can be used in the synthesis of polyamide-imide can be listed. The solvent preferably includes at least one selected from the group consisting of N-methyl-2-pyrrolidone (NMP), N-ethyl-2-pyrrolidone (NEP), γ-butyrolactone (GBL) and 3-methoxy-N, N-dimethylpropaneamide (MPA), and more preferably includes at least one selected from the group consisting of N-ethyl-2-pyrrolidone (NEP), γ-butyrolactone (GBL) and 3-methoxy-N, N-dimethylpropaneamide (MPA).

[0106] The content of polyamideimide in the polyamideimide-containing liquid can be set to a range suitable for the use of the polyamideimide-containing liquid. The content of polyamideimide is, for example, 5 to 60 mass %, 10 to 50 mass %, or 20 to 45 mass % based on the mass of the polyamideimide-containing liquid.

[0107] The polyamide-imide-containing liquid can be preferably used as an insulator composition, a heat-resistant insulator composition, or a printed circuit board composition, or for the preparation of these compositions. The composition may further contain any component such as polyamide, polyethersulfone, acrylic polymer, epoxy compound, isocyanate compound, melamine compound, filler, defoamer, preservative, surfactant, etc. The composition can be prepared, for example, by mixing and stirring the polyamide-imide-containing liquid with any component used as needed.

[0108] <Polyamide-imide film>

[0109] The polyamide-imide film as an embodiment of the present invention is obtained using the polyamide-imide or polyamide-imide-containing liquid of the above embodiment, or includes the polyamide-imide film of the above embodiment. The polyamide-imide film as an embodiment of the present invention has excellent insulation properties.

[0110] The polyamide-imide film can be obtained by, for example, applying a polyamide-imide-containing liquid on a substrate such as a glass plate, drying it, and then heating it. The drying temperature can be, for example, 50 to 100° C. The heating temperature can be, for example, 230 to 350° C. The film thickness of the polyamide-imide film can be appropriately set according to the application, for example, 5 to 1,000 μm, 10 to 100 μm, or 20 to 50 μm.

[0111] <Printed substrate>

[0112] The printed circuit board as an embodiment of the present invention is obtained using the polyamideimide or polyamideimide-containing liquid of the above embodiment, or includes the polyamideimide film of the above embodiment. The printed circuit board as an embodiment of the present invention has low transmission loss and excellent heat resistance.

[0113] Examples of printed substrates include printed wiring boards and printed circuit boards. Examples of printed substrates include flexible substrates and rigid substrates. Examples of printed substrates include single-sided substrates, double-sided substrates, and multilayer substrates. For example, the materials, protective films, insulating layers, etc. of these substrates are obtained using polyamideimide or polyamideimide-containing liquids, or include polyamideimide films.

[0114] Examples of flexible substrates include substrates having a base film, a base film obtained by using polyamideimide or a polyamideimide-containing liquid, or a substrate containing a polyamideimide film. Other examples of flexible substrates include substrates having a base film and a heat-resistant insulating layer formed on the base film, at least a heat-resistant insulating layer obtained by using polyamideimide or a polyamideimide-containing liquid, or a substrate containing a polyamideimide film.

[0115] Examples of the embodiments are given below. The present invention is not limited to the following embodiments.

[0116] (1) A polyamideimide comprising: a structure derived from a compound containing at least one selected from the group consisting of diamines and diisocyanates and a structure derived from a carboxylic acid compound containing at least tricarboxylic anhydride,

[0117] At least one selected from the above compounds and the above carboxylic acid compounds contains a compound having a group containing at least one non-aromatic hydrocarbon group, wherein the total number of carbon atoms of the at least one non-aromatic hydrocarbon group is 8 or more,

[0118] At least one selected from the above compounds and the above carboxylic acid compounds includes a compound having an aromatic hydrocarbon group.

[0119] (2) The polyamideimide according to the above (1), wherein the carboxylic acid compound further contains a dicarboxylic acid.

[0120] (3) The polyamideimide according to (1) or (2) above, wherein the group including at least one non-aromatic hydrocarbon group having a total carbon number of 8 or more includes a saturated aliphatic hydrocarbon group having 8 or more carbon atoms.

[0121] (4) The polyamide-imide according to any one of (1) to (3) above, wherein the carbon number is 28 or more.

[0122] (5) The polyamide-imide according to any one of (1) to (4) above, which has a tensile strength of 80 MPa or more.

[0123] (6) The polyamide-imide according to any one of (1) to (5) above, wherein the elongation at break is 8% or more.

[0124] (7) The polyamide-imide according to any one of (1) to (6) above, wherein the polyamide-imide has a tensile modulus of 1.5 GPa or more.

[0125] (8) The polyamide-imide according to any one of (1) to (7) above, wherein the dielectric constant at 10 GHz is 3.6 or less.

[0126] (9) The polyamide-imide according to any one of (1) to (8) above, wherein the dielectric loss tangent at 10 GHz is 0.015 or less.

[0127] (10) The polyamide-imide according to any one of (1) to (9) above, wherein the compound comprises a dimer diamine having 8 or more carbon atoms or a hydrogenated dimer diamine having 8 or more carbon atoms.

[0128] The carboxylic acid compound includes a tricarboxylic anhydride having an aromatic hydrocarbon group.

[0129] (11) The polyamideimide according to the above (10), wherein the compound further contains a diamine having an aromatic hydrocarbon group.

[0130] (12) The polyamideimide according to any one of (1) to (9) above, wherein the carboxylic acid compound comprises a dicarboxylic acid having a linear saturated aliphatic hydrocarbon group having 8 or more carbon atoms,

[0131] The above-mentioned compound includes a diamine having an aromatic hydrocarbon group.

[0132] (13) The polyamideimide according to (12) above, wherein the carboxylic acid compound further includes a tricarboxylic anhydride having an aromatic hydrocarbon group.

[0133] (14) A polyamide-imide-containing liquid comprising the polyamide-imide according to any one of (1) to (13) above and a solvent.

[0134] (15) A polyamideimide film obtained using the polyamideimide according to any one of (1) to (13) above or the polyamideimide-containing liquid according to (14) above.

[0135] (16) A printed circuit board obtained by using the polyamideimide according to any one of (1) to (13) above or the polyamideimide-containing liquid according to (14) above.

[0136] The disclosure of the present application is related to the subject matter described in Japanese Patent Application No. 2022-090058 filed on June 2, 2022, and all the disclosed contents are incorporated herein by reference.

[0137] Example

[0138] The embodiments of the present invention will be specifically described by way of examples. However, the embodiments of the present invention are not limited to the following examples.

[0139] [Example 1]

[0140] (Preparation of polyamide-imide)

[0141] 19.2 g of trimellitic anhydride (TMAC), 20.0 g of 4,4'-diphenylmethane diisocyanate (MDI), 10.7 g of dimer diamine (DDA) (having a hydrocarbon group (X) with 36 carbon atoms. "PRIAMINE1075", Croda Japan Co., Ltd.)) and 60.0 g of N-methyl-2-pyrrolidone (NMP) were added to a flask equipped with a thermometer, a stirrer and a cooling tube, and the temperature was slowly raised to 130°C over 2 hours while stirring in a dry nitrogen stream. While paying attention to the rapid foaming of carbon dioxide produced by the reaction, the temperature was maintained at 130°C, and heating was continued for 6 hours in this state, and then the reaction was stopped to obtain a polyamide-imide solution. The number average molecular weight of the obtained polyamide-imide is 32,000. The number average molecular weight is determined by the following method. The PRIAMINE1075 used contains dimer diamine represented by the following structural formula.

[0142] [Chemical formula 2]

[0143]

[0144] (Number average molecular weight)

[0145] The number average molecular weight (Mn) was measured by gel permeation chromatography (GPC) and converted using a calibration curve of standard polystyrene. The calibration curve was approximated by a cubic equation using a set of five samples of standard polystyrene ("TSK standard POLYSTYRENE", manufactured by Tosoh Corporation). The conditions for GPC are shown below.

[0146] GPC device: High-efficiency GPC device HLC-8320GPC (manufactured by Tosoh Corporation)

[0147] Detector: UV-8320 ultraviolet absorption detector (manufactured by Tosoh Corporation)

[0148] Column: Gelpack GL-S300MDT-5 (2 in total) (manufactured by Showa Denko Materials Co., Ltd.)

[0149] Eluent: THF / DMF=1 / 1 (volume ratio)+LiBr(0.06mol / L)+H3PO4(0.06mol / L)

[0150] Flow rate: 1mL / min

[0151] Column size: 8mm I.D.×300mm

[0152] Sample concentration: 5mg / 1mL

[0153] Injection volume: 5μL

[0154] Measurement temperature: 40℃

[0155] (Production of polyamide-imide film)

[0156] The obtained polyamide-imide solution was applied on a glass substrate to form a coating film. The coating film was dried by heating at 80°C for 30 minutes, and then heated at 270°C for 30 minutes to prepare a polyamide-imide film with a film thickness of 20 μm. The polyamide-imide film was peeled off from the glass substrate and used for various evaluations.

[0157] [Example 2 and Comparative Examples 1 and 2]

[0158] A polyamideimide solution was obtained in the same manner as in Example 1 except that the diamine compound and / or diisocyanate compound and the acid component were changed to those shown in Table 2. The number average molecular weight of the polyamideimide is shown in Table 2. A polyamideimide film was prepared in the same manner as in Example 1 using the obtained polyamideimide solution and used for various evaluations. In Table 2, SEBAC refers to sebacic acid (having a hydrocarbon group (X) having 8 carbon atoms), and TODI refers to 3,3'-dimethylbiphenyl-4,4'-diyl diisocyanate.

[0159] <Evaluation of Film>

[0160] The properties of the films produced using the varnishes of Examples 1 and 2 and Comparative Examples 1 and 2 were evaluated by the following methods. Table 2 shows the evaluation results.

[0161] (Tensile strength, tensile elastic modulus and elongation at break)

[0162] Polyamide-imide film is cut into the size of 10mm in width and 60mm in length to make test piece. According to the following measuring conditions, tensile test is carried out, and the maximum tensile stress applied in the tensile test is used as tensile strength (MPa). Elongation at break (%) is calculated by dividing the elongation of the test piece until fracture by the distance between chucks 20mm. In addition, Young's modulus (MPa) is calculated by the slope of the elastic deformation zone in the initial stage of stress rise, and the obtained value is used as tensile elastic modulus (MPa). It should be noted that in the table, the value (GPa) obtained by converting the obtained value (MPa) is recorded. Other detailed conditions and calculation methods are carried out according to international standard ISO 5271 (1993).

[0163] Device name: "Autograph AGS-100NG" manufactured by Shimadzu Corporation

[0164] Test speed: 5mm / min

[0165] Distance between chucks: 20mm

[0166] Test piece size: width 10mm, length 60mm

[0167] Set temperature: room temperature (25°C)

[0168] (Glass transition temperature)

[0169] The polyamide-imide film was cut into pieces with a width of 4 mm and a length of 25 mm to prepare a test piece. A thermomechanical analyzer ("TMA7100", manufactured by Hitachi High-Tech Science Co., Ltd.) was used for the measurement. The test piece was heated from room temperature to 350°C at a rate of 10°C / min by a tensile method with a chuck distance of 10 mm and a load of 10 g, and the temperature corresponding to the inflection point of the linear thermal expansion coefficient curve was taken as the glass transition temperature (°C).

[0170] (Relative dielectric constant and dielectric loss tangent)

[0171] The polyamide-imide film was cut into 60 mm × 60 mm size, dried at 125°C for 1 hour, and then measured. The dielectric properties (relative dielectric constant Dk and dielectric loss tangent Df) of the film were measured by the cavity resonator method (TE mode). For the measurement, "MS46122B" manufactured by ANRITSU Corporation was used. The conditions were set at a frequency of 10 GHz and a measurement temperature of 25°C.

[0172] Table 2

[0173]

Claims

1. A polyamide-imide comprising: a structure derived from a compound comprising at least one selected from the group consisting of a diamine and a diisocyanate, and a structure derived from a carboxylic acid compound comprising at least a tricarboxylic anhydride, At least one selected from the above compounds and the above carboxylic acid compounds includes: a compound having a group including at least one non-aromatic hydrocarbon group, wherein the total number of carbon atoms of the at least one non-aromatic hydrocarbon group is 8 or more, At least one selected from the above compounds and the above carboxylic acid compounds includes a compound having an aromatic hydrocarbon group.

2. The polyamide-imide according to claim 1, wherein The carboxylic acid compound further comprises a dicarboxylic acid.

3. The polyamide-imide according to claim 1 or 2, wherein The group including at least one non-aromatic hydrocarbon group and wherein the total carbon number of the at least one non-aromatic hydrocarbon group is 8 or more includes a saturated aliphatic hydrocarbon group having 8 or more carbon atoms.

4. The polyamide-imide according to any one of claims 1 to 3, wherein The carbon number is 28 or more.

5. The polyamide-imide according to any one of claims 1 to 4, wherein The tensile strength is above 80 MPa.

6. The polyamide-imide according to any one of claims 1 to 5, wherein The elongation at break is more than 8%.

7. The polyamide-imide according to any one of claims 1 to 6, wherein The tensile elastic modulus is 1.5 GPa or more.

8. The polyamide-imide according to any one of claims 1 to 7, wherein The dielectric constant at 10 GHz is less than 3.

6.

9. The polyamide-imide according to any one of claims 1 to 8, wherein The dielectric loss tangent at 10 GHz is less than 0.

015.

10. The polyamide-imide according to any one of claims 1 to 9, wherein The compound comprises a dimer diamine having 8 or more carbon atoms or a hydrogenated dimer diamine having 8 or more carbon atoms, The carboxylic acid compound includes a tricarboxylic anhydride having an aromatic hydrocarbon group.

11. The polyamideimide according to claim 10, wherein The compound further includes a diamine having an aromatic hydrocarbon group.

12. The polyamide-imide according to any one of claims 1 to 9, wherein The carboxylic acid compound includes a dicarboxylic acid having a linear saturated aliphatic hydrocarbon group having 8 or more carbon atoms, The compound includes a diamine having an aromatic hydrocarbon group.

13. The polyamideimide according to claim 12, wherein The carboxylic acid compound further includes a tricarboxylic anhydride having an aromatic hydrocarbon group.

14. A polyamide-imide-containing liquid, wherein: Contains the polyamide-imide according to any one of claims 1 to 13 and a solvent. 15 . A polyamideimide film obtained by using the polyamideimide according to claim 1 or the polyamideimide-containing liquid according to claim 14 . 16 . A printed circuit board obtained by using the polyamideimide according to claim 1 or the polyamideimide-containing liquid according to claim 14 .

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