Apparatus for packaging wafer cassettes

Abstract

The invention relates to a device for packaging wafer cassettes in transport cases, comprising: a loading station (101) capable of receiving transport cases for semiconductor wafers; an element (102) for writing and reading an RFID tag attached to the transport case; an element (103) for optically inspecting an additional component of the transport case by means of the camera; an element (104) for equipping the transport case with a desiccant pack; an element (105) for closing a bag surrounding the transport box by means of a weld seam; an element (106) for checking the tightness of the weld seam; an element (107) for attaching the signage to the transport case; an element (108) in the form of a robotic arm for automatically transporting the transport box; an element (109) for storing packaging material; and an element (110) capable of receiving and storing a transport case for semiconductor wafers for transport.

Description

Technical Field

[0001] The subject matter of the present invention relates to the packaging (or encapsulation) of wafer boxes (or wafer cassettes), and more particularly to a wafer box packaging device (or apparatus) capable of automatically packaging wafer boxes. Background Art

[0002] A wafer refers to a thin plate (or slice) used as a raw material for an integrated semiconductor circuit (IC), and is mainly manufactured using silicon material.

[0003] The manufacturing process (or procedure) of a semiconductor wafer made of silicon includes a single crystal growth process for manufacturing a single crystal silicon block, a cutting process for obtaining a thin disk-shaped wafer by cutting the single crystal block, an edge grinding process for machining the outer peripheral portion of the wafer to prevent cracks and deformation in the wafer obtained by the cutting process, a grinding process for removing damage remaining on the wafer due to mechanical (machine) processing to improve the uniformity of the wafer, a polishing process for mirror-polished wafers, and a cleaning process for removing abrasives or foreign matter attached to the semiconductor wafer.

[0004] Semiconductor wafers manufactured using these different processes are placed in boxes, such as front opening shipping boxes (FOSBs), to avoid contamination by pollutants and protect them from external influences. Before packaging and transportation, they are sealed from the outside using packaging films.

[0005] Since the packaged semiconductor wafers need to be sent directly to the production lines of various electronic device manufacturers and identified there, the quality of the packaging plays a very important role. For example, the labels (or tags) need to be accurately and reproducibly positioned. The content of these labels also needs to match the content of each delivery exactly. In addition, the semiconductor wafers need to be in the corresponding slots of the wafer box in the correct order. In addition, the different requirements of different electronic device manufacturers need to be considered. For example, the labels need to be positioned differently depending on the customer, or the content of the labels (barcodes or characters, or both) varies depending on the customer.

[0006] US2020 219 741A1 describes a device for packaging a wafer box, wherein the device comprises:

[0007] It includes a loading section for loading wafer boxes; an accessory inspection section, which is configured to check the composition instructions (or recipes) attached to the wafer boxes and inspect the accessories of the wafer boxes; a first label pasting section, which is configured to paste the first label onto the wafer boxes after the accessory inspection has been completed; a primary film packaging (or encapsulation) section, which is configured to receive the primary film according to the composition instructions and use the primary film to package the wafer boxes; a secondary film packaging section, which is configured to receive the secondary film according to the composition instructions and use the secondary film to perform secondary packaging on the wafer boxes; a second label pasting section, which is configured to paste the second label onto the secondary film used for packaging the wafer boxes; and a discharge section, which is configured to distribute the completely packaged wafer boxes.

[0008] JP 2015 058 958 A2 describes a packaging system having a plurality of clamps for opening and closing a bag opening of a side-folded bag in a horizontal state, wherein the bag opening is formed at one end, and a carriage arm for inserting a container or a packaging object into the side-folded bag.

[0009] None of the documents mentioned fully provides a device capable of solving the problems mentioned. Summary of the invention

[0010] The object of the present invention is to provide an apparatus which minimizes the above mentioned problems and also enables to increase the throughput of a packaging facility. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 An exemplary form of the device for packaging wafer boxes according to the present invention is shown. The device comprises the following elements:

[0012] 101 is a loading station capable of receiving a shipping box for semiconductor wafers.

[0013] 102 Components for writing and reading RFID tags attached to shipping boxes

[0014] 103 Element for optically checking accessories of a transport box by means of a camera

[0015] 104 Element for equipping the transport box with a desiccant pack

[0016] 105 an element for sealing the bag around the transport box by means of a weld,

[0017] 106 Elements for verifying the impermeability of welds

[0018] 107 Elements for applying labels to transport boxes

[0019] 108 Element in the form of a robot arm for automatically transporting the transport box

[0020] 109 Elements for storing packaging materials

[0021] 110 can receive a shipping box for semiconductor wafers and can store the shipping box for components to be shipped. DETAILED DESCRIPTION

[0022] The device for packaging wafer cassettes according to the invention comprises a number of elements which will be described more precisely below.

[0023] The shipping boxes used are containers made of plastic, for example of polycarbonate (PC), which may include components made of polybutylene terephthalate (PBT), polyolefin elastomer (POE) or poly(ethylethylene) (PEE). These shipping boxes are often referred to as "front opening shipping boxes" (FOSB).

[0024] The apparatus according to the present invention comprises an automatic loading station (101) capable of receiving (or accepting) a transport box for semiconductor wafers.

[0025] The FOSB is arranged on the loading station (101).

[0026] The device according to the invention further comprises an element (102) for automatically writing and reading an RFID tag attached to the transport box. Alternatively, it is also possible to use exactly one RFID tag. RFID tags (Radio Frequency Identification, "Identification using electromagnetic waves") denote a technology for transceiver systems for automatically and contactlessly identifying and locating objects using radio waves.

[0027] The device according to the invention also comprises an element (103) for automatically optically inspecting the accessories of the transport box by means of a camera. Any damage to the transport box needs to be prevented, so inspection in this regard is important. All inspection results, including the camera images, are stored.

[0028] The device according to the invention preferably comprises an element for automatically verifying that the wafer cassette has been correctly filled. The task of this element is, for example, to identify semiconductors that have been incorrectly stacked. The wafer cassette has a plurality of receiving slots spaced apart from one another to hold semiconductor wafers, each receiving slot being prevented from further movement by a lower pad or an upper pad. A common error may be a so-called cross slot error (in which a semiconductor wafer has been stacked on an inclined surface in the wafer cassette).

[0029] Furthermore, the device according to the invention preferably comprises a printer for printing labels for affixing to the transport boxes.

[0030] The device according to the invention also comprises means (107) for automatically applying labels to the transport boxes.

[0031] Furthermore, the device according to the invention preferably comprises an element for automatically verifying the label attached to the transport box. The check performed here is, for example, whether the label is in the correct position and / or whether the printed content is readable and whether its content matches the expected content.

[0032] After the label is applied, the position of the applied label is checked with millimeter accuracy, preferably using a camera system. The printed content of the label is also checked. All codes and characters need to be printed so that they are readable and error-free. The unprinted areas of the label must be free of printing errors. The label is compared with the image generated via the print file using an image comparison and the reproducibility factor is checked. All test results are stored.

[0033] Similarly, the device according to the invention comprises a device (105) for automatically sealing the inner bag around the transport box by means of a first weld seam.

[0034] Furthermore, the device according to the invention comprises an element (106) for automatically verifying the impermeability of the first weld. This involves, for example, applying negative pressure in order to verify the impermeability (or tightness) of the weld. The impermeability of the bag packaging the FOSB is tested in a vacuum chamber by means of a filling gas test. The test results are stored in the EDP.

[0035] The device according to the invention further comprises an element (104) for automatically equipping the transport box with a desiccant pack. The desiccant pack is usually filled with silica gel and is suitable for absorbing moisture from the air, thereby avoiding the formation of condensation. It is essential that the desiccant pack is always positioned in the same position in the transport box. The desiccant pack is glued on automatically.

[0036] The device according to the invention preferably also comprises an element for sealing an outer bag around the transport box by means of a second weld. The material used for the outer bag is usually different from the material used for the inner bag. After the bag is folded closed (closed), the air is evacuated from the bag and an adjustable, defined amount of gas is supplied. The bag is then welded. The overlapping parts of the bag are folded and glued.

[0037] The device according to the invention preferably comprises an element for automatically verifying the impermeability of the second weld. This preferably involves the use of negative pressure. The impermeability of the bag packaging the FOSB is tested in a vacuum chamber by means of a filling gas test. The test results are stored.

[0038] The device according to the invention further comprises an element (108) for automatically transporting the transport box. A transport device in the form of a robot arm (or robot arm) is suitable for this.

[0039] Furthermore, the device according to the invention comprises an element which is able to receive a transport box for semiconductor wafers and is able to store said transport box for shipment.

Claims

1. Equipment for packaging wafer boxes in shipping boxes, including: a loading station (101) capable of receiving a shipping box for semiconductor wafers, a component (102) for writing and reading an RFID tag attached to the transport box, an element (103) for optically checking the accessories of a transport box by means of a camera, means (104) for equipping the transport box with a desiccant pack, an element (105) for sealing the bag around the transport box by means of a weld, An element (106) for checking the impermeability of a weld, An element (107) for applying a label to a transport box, an element (108) in the form of a robot arm for automatically transporting the transport box, an element (109) for storing packaging material, A component (110) capable of receiving a shipping box for semiconductor wafers and storing the shipping box for shipment.

2. A method for packaging a wafer box in a transport box, characterized in that Use of the device according to claim 1.

Images