A polymerase amplification device for detecting African swine fever virus

Abstract

The present invention relates to the technical field of virus detection, and specifically to a polymerase amplification device for detecting African swine fever virus, comprising a device housing and a fixed eaves fixed integrally with the device housing, wherein an amplification temperature control guide block is fixedly arranged in the fixed eaves, and a first temperature conduction plate and a second pre-cooling plate are arranged below the amplification temperature control guide block, and the first temperature conduction plate and the second pre-cooling plate are on the same horizontal plane; the polymerase amplification device of the present invention can start refrigeration and cold storage during the denaturation heating process, and when entering the annealing and cooling stage, the second pre-cooling plate is controlled to be in thermal contact with the amplification temperature control guide block, so as to utilize the stored cold to quickly cool the amplification temperature control guide block.

Description

Technical Field

[0001] The present invention relates to the technical field of virus detection, and in particular to a polymerase amplification device for detecting African swine fever virus. Background Art

[0002] African swine fever virus is a large double-stranded DNA virus. Polymerase chain reaction (PCR) is one of the most commonly used detection methods. It extracts ASF virus (ASFV) DNA from samples such as pig blood, lymphatic tissue, spleen, lung, liver, and kidney, and uses PCR technology to amplify specific fragments of the virus for detection. The basic steps of polymerase amplification are: first, denaturation treatment is performed at a high temperature of about 95°C to unwind the DNA double helix structure, then annealing treatment is performed to cool down so that the primers can bind to the single-stranded DNA template, and finally, the primers are extended at an appropriate temperature. Repeat the above steps dozens of times to complete the amplification. In the prior art, the cycle is automatically performed through a polymerase amplification device, such as a polymerase chain reaction amplification device with a publication number of CN112280670A, which records: a chip carrying component for carrying a microfluidic chip so that the microfluidic chip provides the required environment for the polymerase chain reaction; a temperature regulating component, which is engaged with the chip carrying component and controls the temperature of the microfluidic chip by adjusting the temperature of the chip carrying component; a control module, which includes a logic control circuit connected to the temperature regulating component and a timer circuit connected to the logic control circuit, wherein the logic control circuit can control the temperature regulating component and use the temperature regulating component to control the temperature of the microfluidic chip, and the timer circuit can automatically restart the logic control circuit in the event of a shutdown and continue the control interrupted by the shutdown.

[0003] When annealing and cooling down after high-temperature denaturation, as recorded in the above-mentioned literature, traditional polymerase amplification devices can only be cooled by fans or naturally, and the cooling speed is slow, especially during dozens of cycles of amplification, resulting in a longer overall time and affecting detection efficiency. Summary of the invention

[0004] The purpose of the present invention is to provide a polymerase amplification device for detecting African swine fever virus to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a polymerase amplification device, comprising a device casing and a fixed eaves fixed integrally with the device casing, an amplification temperature control guide block is fixedly arranged in the fixed eaves, a first temperature conduction plate and a second pre-cooling plate are arranged below the amplification temperature control guide block, the first temperature conduction plate and the second pre-cooling plate are on the same horizontal plane, an integral fixed outer frame is fixedly arranged outside the first temperature conduction plate and the second pre-cooling plate, a track transverse ridge is fixedly arranged on the surface of the integral fixed outer frame, a track clamp is fixed outside the fixed eaves, the track transverse ridge and the track clamp are slidably limited, and a switching screw is arranged in the device casing; the switching screw can drive the first temperature conduction plate and the second pre-cooling plate to move by rotating, so that the first temperature conduction plate or the second pre-cooling plate moves to the right below the amplification temperature control guide block and makes thermal contact with the amplification temperature control guide block;

[0006] A temperature-controlled electric heating plate is attached to the lower surface of the first temperature conduction plate, and temperature sensors for temperature monitoring are respectively provided in the amplification temperature control guide block, the first temperature conduction plate and the second pre-cooling plate, and a pre-cooling system is provided below the second pre-cooling plate.

[0007] The precooling system includes a cold storage chamber, a cold conduction column, a chamber bottom groove and an elastic sealing film. The cold storage chamber is fixedly arranged on the integrated fixed outer frame. The cold storage chamber is a cavity with upper and side openings. The upper opening of the cold storage chamber is sealed and connected to the lower surface of the second precooling plate. The cold storage chamber is filled with cold storage liquid. A cold conduction column is fixedly arranged on the lower surface of the second precooling plate. The cold conduction column is in contact with the cold storage liquid. A chamber bottom groove is opened through the bottom of the cold storage chamber. An elastic sealing film is arranged in the chamber bottom groove. A semiconductor refrigeration plate is sealed at the side opening of the cold storage chamber. The cooling surface of the semiconductor refrigeration plate is in contact with the cold storage liquid.

[0008] The heat-generating surface of the semiconductor refrigeration plate is thermally conductively provided with heat dissipation fins, a fin frame is fixedly provided outside the cold storage chamber, the heat dissipation fins are located in the fin frame, and a heat dissipation fan is provided below the heat dissipation fins.

[0009] The lower surface of the amplification temperature control guide block is integrally provided with a guide block rib, the upper surface of the first temperature conduction plate is integrally provided with a first rib, and the upper surface of the second pre-cooling plate is integrally provided with a second rib.

[0010] A fixed platform is fixedly provided on the surface of the track clamp, a cold-keeping pad is fixedly attached to the lower surface of the fixed platform, and a filling rib is integrally provided on the lower surface of the cold-keeping pad. Both the cold-keeping pad and the filling rib are made of heat-insulating material and are elastic. A rib cavity is opened inside the filling rib along its length direction. When the rib cavity is under positive pressure, the filling rib bulges outward, and when the rib cavity is under negative pressure, the filling rib is recessed inward.

[0011] The filling ribs and the second ribs can be staggered and matched with each other, a transverse cavity is opened in the cold-keeping pad, a connecting outer tube is arranged on the outside of the cold-keeping pad, the connecting outer tube is connected with the rib cavity through the transverse cavity, a table through hole is opened on the fixed table, the connecting outer tube is inserted through the table through hole, and a control seat is fixedly arranged on the fixed table.

[0012] A cylindrical cavity is provided in the control seat, and the cylindrical cavity is communicated with the connecting outer tube. A piston body is sealingly and slidingly arranged in the cylindrical cavity, a piston rack is fixedly arranged on the surface of the piston body, a support plate is fixedly arranged on the inner wall surface of the cylindrical cavity, the support plate provides position-limiting support for the piston rack, and a driving gear is meshed with the outside of the piston rack.

[0013] A transmission shaft is coaxially fixed on the driving gear, a torque-increasing worm wheel is fixedly arranged at the end of the transmission shaft, a driving worm is meshed with the outside of the torque-increasing worm wheel, a worm motor is arranged on one side of the driving worm, and the rotation of the driving worm is controlled by the worm motor.

[0014] A screw sleeve seat is fixedly arranged on the surface of the cold storage chamber, a screw motor for driving the switching screw to rotate is arranged at the end of the switching screw, and the screw sleeve seat is spirally matched with the switching screw.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] The polymerase amplification device of the present invention can start cooling and storing cold during the denaturation heating process by means of the second pre-cooling plate, the cold storage chamber, the switching screw and other structures. When entering the annealing and cooling stage, the second pre-cooling plate is controlled to be in thermal contact with the amplification temperature control guide block, so that the stored cold energy is used to quickly cool the amplification temperature control guide block to reach the low temperature required for annealing. Compared with the natural cooling and air cooling methods in the prior art, the cooling speed can be increased. In the process of dozens of cyclic amplifications, the overall duration of the cyclic amplification can be effectively reduced, thereby improving the efficiency of large-scale detection of African swine fever virus in farms.

[0017] By cooperating with the cold-insulating pad and filling ribs and other structures, the second precooling plate and the second ribs can be insulated and covered during the pre-refrigeration and cold storage process, thereby reducing the cold dissipation caused by the contact between the second precooling plate and the flowing air and improving the equipment efficiency.

[0018] By setting up structures such as the rib cavity, cross-through cavity and control seat, the filling rib can automatically shrink and deflate in advance when the second rib moves relative to the filling rib, thereby reducing the wear of the filling rib and avoiding the problem of increased gaps due to gradual wear of the filling rib with use, resulting in a decrease in the cold preservation effect; and when the second rib cooperates with the filling rib, the filling rib will automatically bulge to increase the contact tightness with the second rib, thereby avoiding the intervention of flowing air to carry away the cold. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0020] Figure 2 It is a three-dimensional cutaway schematic diagram of the casing of the device of the present invention.

[0021] Figure 3 for Figure 2 A magnified schematic diagram of area A in the middle.

[0022] Figure 4 The schematic diagram of the three-dimensional cutaway view of the housing of the device of the present invention is shown at another angle.

[0023] Figure 5 for Figure 4 Enlarged schematic diagram of area B in the middle.

[0024] Figure 6 It is a three-dimensional half-section schematic diagram of the enlarged temperature control guide block.

[0025] Figure 7 for Figure 6 Enlarged schematic diagram of area C in the middle.

[0026] Figure 8 It is a three-dimensional half-section schematic diagram of the control seat.

[0027] Fig. 9 for Figure 8 Enlarged schematic diagram of area D in the middle.

[0028] Fig.10 It is a schematic diagram of the structure of parts of the present invention.

[0029] In the figure: 1, device housing; 2, fixed eaves; 3, expanded temperature control guide block; 4, first temperature conduction plate; 5, second pre-cooling plate; 6, integrated fixed outer frame; 7, track cross rib; 8, track clamping plate; 9, switching screw; 10, temperature control electric heating plate; 601, cold storage chamber; 602, cold conduction column; 603, chamber bottom groove; 604, elastic sealing film; 605, semiconductor refrigeration sheet; 606, heat dissipation fin; 607, fin frame; 608, heat dissipation fan; 801, fixed table; 802, cold insulation pad; 8 03, filling rib; 804, rib cavity; 805, transverse cavity; 806, connecting outer tube; 807, table through hole; 808, control seat; 809, cylindrical cavity; 810, piston body; 811, piston rack; 812, support plate; 813, driving gear; 814, transmission shaft; 815, torque-increasing worm gear; 816, driving worm; 817, worm motor; 301, guide block rib; 401, first rib; 501, second rib; 901, screw sleeve seat; 902, screw motor. DETAILED DESCRIPTION

[0030] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] See also Figures 1 to 10 The present invention provides a technical solution: a polymerase amplification device, such as Figure 6 As shown in , it includes a device housing 1 and a fixed eaves 2 fixed integrally with the device housing 1, an amplification temperature control guide block 3 is fixedly arranged in the fixed eaves 2, a first temperature conduction plate 4 and a second precooling plate 5 are arranged below the amplification temperature control guide block 3, the first temperature conduction plate 4 and the second precooling plate 5 are on the same horizontal plane, and an integral fixed outer frame 6 is fixedly arranged outside the first temperature conduction plate 4 and the second precooling plate 5, as shown in FIG. Figure 2 and Figure 3 As shown in the figure, a track transverse ridge 7 is fixedly arranged on the surface of the integral fixed outer frame 6, a track clamping plate 8 is fixedly arranged on the outside of the fixed eaves 2, the track transverse ridge 7 and the track clamping plate 8 are slidably limited and matched, and a switching screw rod 9 is arranged in the device casing 1; the switching screw rod 9 can drive the first heat conduction plate 4 and the second precooling plate 5 to move by rotating, so that the first heat conduction plate 4 or the second precooling plate 5 moves to the right below the amplification temperature control guide block 3 and makes thermal contact with the amplification temperature control guide block 3; the amplification temperature control guide block 3, the first heat conduction plate 4 and the second precooling plate 5 are all made of good thermal conductive materials such as copper or aluminum;

[0032] A temperature-controlled electric heating plate 10 is attached to the lower surface of the first temperature conducting plate 4 , and temperature sensors for temperature monitoring are respectively provided in the amplified temperature-controlled guide block 3 , the first temperature conducting plate 4 and the second precooling plate 5 , and a precooling system is provided below the second precooling plate 5 .

[0033] like Figure 6 As shown in , the precooling system includes a cold storage chamber 601, a cold conduction column 602, a chamber bottom groove 603 and an elastic sealing film 604. The cold storage chamber 601 is fixedly arranged on the integral fixed outer frame 6. The cold storage chamber 601 is a cavity with upper and side openings. The upper opening of the cold storage chamber 601 is sealed and docked with the lower surface of the second precooling plate 5. The cold storage chamber 601 is filled with cold storage liquid, which can be a liquid with a large specific heat capacity such as water. The lower surface of the second precooling plate 5 is fixedly provided with a cold conduction column 602, which is in contact with the cold storage liquid. A chamber bottom groove 603 is provided through the bottom of the cold storage chamber 601, and an elastic sealing film 604 is arranged in the chamber bottom groove 603. A semiconductor refrigeration plate 605 is sealed at the side opening of the cold storage chamber 601. The setting of the elastic sealing film 604 can weaken the internal pressure change of the cold storage chamber 601 through the deformation of the elastic sealing film 604 when the internal pressure of the cold storage chamber 601 changes, thereby reducing the probability of leakage between the cold storage chamber 601 and the second pre-cooling plate 5, and between the cold storage chamber 601 and the semiconductor refrigeration plate 605.

[0034] The cooling surface of the semiconductor cooling sheet 605 is in contact with the cold storage liquid. The semiconductor cooling sheet 605 is a semiconductor cooling element in the prior art. When powered on, one side cools and the other side generates heat.

[0035] The heating surface of the semiconductor refrigeration sheet 605 is thermally conductively provided with heat dissipating fins 606, a fin frame 607 is fixedly provided on the outside of the cold storage chamber 601, the heat dissipating fins 606 are located in the fin frame 607, a heat dissipating fan 608 is provided below the heat dissipating fins 606, and the heat dissipating fan 608 is running to drive the air flow to dissipate the heat from the heat dissipating fins 606, thereby dissipating the heat from the heating surface of the semiconductor refrigeration sheet 605.

[0036] The lower surface of the amplification temperature control guide block 3 is integrally provided with a guide block rib 301 , the upper surface of the first temperature conduction plate 4 is integrally provided with a first rib 401 , and the upper surface of the second pre-cooling plate 5 is integrally provided with a second rib 501 .

[0037] A fixed platen 801 is fixedly provided on the surface of the track clamp 8, a cold-keeping pad 802 is fixedly attached to the lower surface of the fixed platen 801, a filling rib 803 is integrally provided on the lower surface of the cold-keeping pad 802, both the cold-keeping pad 802 and the filling rib 803 are made of heat-insulating materials with elasticity, such as rubber, etc., a rib cavity 804 is opened inside the filling rib 803 along its length direction, when the inside of the rib cavity 804 is under positive pressure, the filling rib 803 bulges outward, and when the inside of the rib cavity 804 is under negative pressure, the filling rib 803 is recessed inward.

[0038] The filling ribs 803 and the second ribs 501 can be staggered and matched with each other, a transverse cavity 805 is opened in the cold-keeping pad 802, and a connecting outer tube 806 is arranged on the outside of the cold-keeping pad 802. The connecting outer tube 806 is connected with the rib cavity 804 through the transverse cavity 805, a table through hole 807 is opened on the fixed table 801, and the connecting outer tube 806 is inserted through the table through hole 807, and a control seat 808 is fixedly arranged on the fixed table 801.

[0039] A cylindrical cavity 809 is provided in the control seat 808, and the cylindrical cavity 809 is connected to the connecting outer tube 806. A piston body 810 is sealingly and slidingly arranged in the cylindrical cavity 809, and a piston rack 811 is fixedly arranged on the surface of the piston body 810. A support plate 812 is fixedly arranged on the inner wall surface of the cylindrical cavity 809, and the support plate 812 provides limited support for the piston rack 811. A driving gear 813 is meshed with the outside of the piston rack 811.

[0040] A transmission shaft 814 is coaxially fixed on the driving gear 813, a torque-increasing worm gear 815 is fixedly provided at the end of the transmission shaft 814, a driving worm 816 is meshed with the outside of the torque-increasing worm gear 815, a worm motor 817 is provided on one side of the driving worm 816, and the rotation of the driving worm 816 is controlled by the worm motor 817.

[0041] A screw sleeve seat 901 is fixedly provided on the surface of the cold storage chamber 601 , and a screw motor 902 for driving the switching screw rod 9 to rotate is provided at the end of the switching screw rod 9 , and the screw sleeve seat 901 is spirally matched with the switching screw rod 9 .

[0042] When the polymerase amplification device of the present invention is used, the reaction tube after the PCR reaction system is configured is inserted into the amplification temperature control guide block 3, as shown in FIG. Figure 6As shown in , denaturation treatment is first performed, and heating is performed by the temperature-controlled electric heating plate 10. The heat is conducted to the amplification temperature-controlled guide block 3 through the first temperature-conducting plate 4, so that the amplification temperature-controlled guide block 3 is heated, and the temperature is monitored and controlled by the temperature sensor in the amplification temperature-controlled guide block 3. At the same time, the semiconductor refrigeration plate 605 can be controlled to operate for pre-cooling, and the cold storage liquid inside the cold storage chamber 601 is used for cold storage. The semiconductor refrigeration plate 605 refrigerates so that the temperature of the cold storage liquid inside the cold storage chamber 601 is reduced. The second pre-cooling plate 5 is conducted by the cold conduction column 602, so that the second pre-cooling plate 5 is in a low-temperature state. At this time, the cold-keeping pad 802 and the filling rib 803 cooperate to seal and cover the second pre-cooling plate 5, reduce the contact area between the second pre-cooling plate 5 and the flowing air, and thus reduce the loss of cold dissipation at the end of the second pre-cooling plate 5.

[0043] After the denaturation treatment is completed, annealing and cooling are required. At this time, the switching screw rod 9 is controlled to rotate. The switching screw rod 9 cooperates with the screw sleeve seat 901, such as Figure 6 As shown in the figure, the integral fixed outer frame 6, the first heat conducting plate 4 and the second precooling plate 5 are driven to move to the left as a whole until the first heat conducting plate 4 is staggered and separated from the amplification temperature control guide block 3, and the second precooling plate 5 is matched with the amplification temperature control guide block 3 up and down. Since the position of the cold-keeping pad 802 is fixed, when the second precooling plate 5 moves, the second rib 501 will automatically separate from the filling rib 803. The low-temperature second precooling plate 5 is in thermal contact with the amplification temperature control guide block 3, which can quickly cool the amplification temperature control guide block 3. After the amplification temperature control guide block 3 reaches the required low temperature, the second precooling plate 5 is controlled to reset by switching the screw rod 9, so that the first heat conducting plate 4 and the amplification temperature control guide block 3 are matched again, and the extension process is performed at a suitable temperature.

[0044] like Fig. 9 As shown in the figure, the worm motor 817 controls the driving worm 816 to rotate, which can make the torque-increasing worm wheel 815 increase the torque. At this time, the driving gear 813 rotates synchronously, driving the piston rack 811 and the piston body 810 to move. During the reciprocating movement of the piston body 810, the positive pressure or negative pressure can be adjusted in the connecting outer tube 806, the cross-through cavity 805 and the rib cavity 804. When the filling rib 803 corresponds to the second rib 501, the rib cavity 804 is positively pressurized, and the positive pressure makes the filling rib 803 bulge, improve the contact tightness with the second rib 501, and prevent the flowing air from intervening and taking away the cold. Before the filling rib 803 and the second rib 501 need to move relative to each other and separate, the rib cavity 804 is controlled to be in a negative pressure state, so that the filling rib 803 shrinks and becomes deflated through the negative pressure, thereby reducing the wear of the filling rib 803 and avoiding the problem of gradual wear of the filling rib 803 and increased gaps with long-term use, which leads to a decrease in the cold preservation effect.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A polymerase amplification device, comprising a device housing (1) and a fixed overhang (2) fixed integrally to the device housing (1), characterized in that: An amplification temperature control guide block (3) is fixedly arranged in the fixed eaves (2), a first temperature conduction plate (4) and a second pre-cooling plate (5) are arranged below the amplification temperature control guide block (3), the first temperature conduction plate (4) and the second pre-cooling plate (5) are on the same horizontal plane, an integral fixed outer frame (6) is fixedly arranged outside the first temperature conduction plate (4) and the second pre-cooling plate (5), a track transverse edge (7) is fixedly arranged on the surface of the integral fixed outer frame (6), a track clamping plate (8) is fixed outside the fixed eaves (2), the track transverse edge (7) and the track clamping plate (8) are slidably limited, and a switching screw (9) is arranged in the device housing (1); the switching screw (9) can drive the first temperature conduction plate (4) and the second pre-cooling plate (5) to move by rotating, so that the first temperature conduction plate (4) or the second pre-cooling plate (5) moves to the right below the amplification temperature control guide block (3) and is in thermal contact with the amplification temperature control guide block (3); A temperature-controlled electric heating plate (10) is attached to the lower surface of the first temperature conducting plate (4); temperature sensors for temperature monitoring are respectively provided in the amplified temperature-controlled guide block (3), the first temperature conducting plate (4) and the second pre-cooling plate (5); a pre-cooling system is provided below the second pre-cooling plate (5); the pre-cooling system comprises a cold storage chamber (601), a cold conduction column (602), a chamber bottom groove (603) and an elastic sealing film (604); a cold storage chamber (601) is fixedly provided on the integral fixed outer frame (6); the cold storage chamber (601) is a cavity with openings on the upper part and the side; the upper opening of the cold storage chamber (601) is sealed to the lower surface of the second pre-cooling plate (5). The cold storage chamber (601) is filled with cold storage liquid, a cold conduction column (602) is fixedly provided on the lower surface of the second pre-cooling plate (5), and the cold conduction column (602) is in contact with the cold storage liquid. A chamber bottom groove (603) is provided through the bottom of the cold storage chamber (601), and an elastic sealing film (604) is provided in the chamber bottom groove (603). A semiconductor refrigeration sheet (605) is sealed at the side opening of the cold storage chamber (601), and the cooling surface of the semiconductor refrigeration sheet (605) is in contact with the cold storage liquid; the lower surface of the amplified temperature control guide block (3) is integrally provided with a guide block rib (301), and the upper surface of the first temperature conduction plate (4) is integrally provided with a guide block rib (301). The track clamp (8) has a first rib (401), and the upper surface of the second precooling plate (5) is integrally provided with a second rib (501); a fixed platform (801) is fixedly provided on the surface of the track clamp (8), a cold-keeping pad (802) is attached and fixed to the lower surface of the fixed platform (801), and a filling rib (803) is integrally provided on the lower surface of the cold-keeping pad (802), and the cold-keeping pad (802) and the filling rib (803) are both made of heat-insulating material and are elastic, and a rib cavity (804) is opened inside the filling rib (803) along its length direction, and when the rib cavity (804) is positively pressurized, the filling rib (803) bulges outwards. When the rib cavity (804) is under negative pressure, the filling rib (803) is recessed inward; the filling rib (803) and the second rib (501) can be staggered and matched with each other; a transverse cavity (805) is provided in the cold-insulating pad (802); a connecting outer tube (806) is provided on the outside of the cold-insulating pad (802); the connecting outer tube (806) is connected to the rib cavity (804) through the transverse cavity (805); a plate through hole (807) is provided on the fixed plate (801); the connecting outer tube (806) passes through the plate through hole (807); and a control seat (808) is fixedly provided on the fixed plate (801);A cylindrical cavity (809) is provided in the control seat (808), the cylindrical cavity (809) is communicated with the connecting outer tube (806), a piston body (810) is provided in a sealing and sliding manner in the cylindrical cavity (809), a piston rack (811) is fixedly provided on the surface of the piston body (810), a support plate (812) is fixedly provided on the inner wall surface of the cylindrical cavity (809), the support plate (812) provides position-limiting support for the piston rack (811), and a driving gear (813) is provided on the outside of the piston rack (811); a transmission gear (813) is coaxially fixed on the driving gear (813). A driving shaft (814), a torque-increasing worm wheel (815) being fixedly provided at the end of the transmission shaft (814), a driving worm (816) being meshed with the outside of the torque-increasing worm wheel (815), a worm motor (817) being provided on one side of the driving worm (816), and the driving worm (816) being controlled to rotate by the worm motor (817); a screw sleeve seat (901) being fixedly provided on the surface of the cold storage chamber (601), a screw motor (902) being provided at the end of the switching screw (9) for driving the switching screw (9) to rotate, and the screw sleeve seat (901) being spirally matched with the switching screw (9). ; 2. A polymerase amplification device according to claim 1, characterized in that: The heat-generating surface of the semiconductor refrigeration sheet (605) is thermally conductively provided with heat dissipation fins (606); a fin frame (607) is fixedly provided outside the cold storage chamber (601); the heat dissipation fins (606) are located inside the fin frame (607); and a heat dissipation fan (608) is provided below the heat dissipation fins (606).

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