Thickness measuring system and measuring method
By designing a thickness measurement system for retractable measuring probes and robotic gripping workpieces, the problems of high laser measurement costs and environmental interference are solved, and high accuracy and low cost thickness measurements are achieved, which are suitable for workpieces such as wafers.
Patent Information
- Application Number
- CN202411361846.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-27
- Publication Date
- 2024-12-17
AI Technical Summary
The prior art is susceptible to environmental factors when measuring wafer thickness, and the production cost of laser automatic thickness gauge is high, resulting in an increase in equipment costs and affecting measurement accuracy and economicality.
A thickness measurement system is designed, including a base, a first measurement mechanism and a second measurement mechanism, and the retractable measurement probe is used to move oppositely, and the workpiece is grasped in combination with a robot and moved to the measurement space, through multiple measurement probes The point-taking measurement of the point-taking measurement reduces the impact of non-workpiece structure on thickness measurement and reduces equipment costs.
It improves the accuracy and economicality of thickness measurement, avoids the requirements for light quantity of laser measurement, reduces environmental interference, and is suitable for a variety of workpiece thickness measurements, especially for wafer thickness measurements.
Smart Images
Figure CN119146905A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of measuring equipment, and in particular to a wafer thickness measurement system and a measurement method. Background Art
[0002] When measuring wafer thickness, the wafer is usually placed on a wafer measurement platform, and then the wafer is manually measured in one direction. When the wafer is placed on the measurement platform for thickness measurement, the platform may have dust or debris, which can easily lead to inaccurate measurement results. Some solutions also use laser automatic thickness gauges to measure the thickness of wafers. However, the production cost of laser automatic thickness gauges is high, which will increase the cost of measurement equipment. Summary of the invention
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a thickness measurement system and a measurement method, which can effectively ensure the accuracy of workpiece thickness measurement and help reduce equipment costs.
[0004] In one aspect, an embodiment of the present application provides a thickness measurement system, comprising:
[0005] The measuring device comprises a base, a first measuring mechanism and a second measuring mechanism,
[0006] The first measuring mechanism comprises a first driving assembly and a first measuring instrument connected to the first driving assembly, the first driving assembly is mounted on the base, and the first driving assembly is used to drive the first measuring instrument to move along a first direction;
[0007] The second measuring mechanism includes a second driving assembly and a second measuring instrument connected to the second driving assembly, wherein the second driving assembly is installed on the base and located on the opposite side of the first driving assembly, and the second driving assembly is used to drive the second measuring instrument to move along the first direction.
[0008] The first measuring instrument and the second measuring instrument both include a telescopically movable measuring probe, the measuring probe of the first measuring instrument and the measuring probe of the second measuring instrument are arranged opposite to each other, and a measuring space for placing a workpiece is defined between the first measuring instrument and the second measuring instrument; and
[0009] The manipulator mechanism is used to grab the workpiece and move the workpiece to the measuring space.
[0010] Further, the first direction is a vertical direction, and a line connecting the measuring probe of the first measuring instrument and the measuring probe of the second measuring instrument is parallel to the first direction.
[0011] Furthermore, it also includes a film supporting mechanism, which is arranged on one side of the base and is located within the travel range of the manipulator mechanism, wherein the film supporting mechanism is provided with at least one placement slot.
[0012] Furthermore, the wafer supporting mechanism includes a wafer supporting platform and a support seat, the support seat is installed on the base, the wafer supporting platform is installed on the support seat, the upper end surface of the wafer supporting platform is horizontally arranged, and the placement groove is arranged on the upper end surface of the wafer supporting platform.
[0013] Furthermore, the sheet supporting platform is provided with a plurality of placement slots, and the size of each placement slot is the same or different.
[0014] Furthermore, the sizes of the placement grooves are different, wherein the placement grooves are concentrically arranged, and the sizes of the placement grooves decrease from top to bottom.
[0015] Furthermore, the robot mechanism includes a first moving component, a second moving component and a gripper, the first moving component is installed on one side of the supporting mechanism, the second moving component is installed on the first moving component, the first moving component is used to drive the second moving component to rise and fall, the gripper is installed on the second moving component, the second moving component is used to drive the gripper to move horizontally, and the gripper is used to grab the workpiece.
[0016] Furthermore, the manipulator mechanism, the support mechanism and the measuring device are sequentially spaced apart along the same straight line, and the support mechanism is provided with an avoidance passage for the second moving component and the gripper to pass through.
[0017] Furthermore, it also includes a fixing seat, and the supporting mechanism and the measuring mechanism are both installed on the fixing seat.
[0018] Another aspect of the present application discloses a measurement method, which is applied to the aforementioned thickness measurement system. The measurement method comprises the following steps:
[0019] Controlling the measuring probe of the first measuring mechanism and the measuring probe of the second measuring mechanism to align and abut, and setting the readings of the first measuring instrument and the second measuring instrument as a first measurement value H0;
[0020] Controlling the manipulator mechanism to grab a workpiece and move the workpiece to the measuring space so that a thickness direction of the workpiece is parallel to a line connecting a measuring probe of the first measuring mechanism and a measuring probe of the second measuring mechanism;
[0021] Control the first measuring mechanism and the second measuring mechanism to move toward the workpiece, and make the first measuring instrument and the second measuring instrument abut against the workpiece, and read the value H1 of the first measuring instrument and the value H2 of the second measuring instrument;
[0022] The thickness H of the workpiece is calculated based on the value H1 of the first measuring instrument and the value H2 of the second measuring instrument.
[0023] It can be seen from the above technical solutions that the embodiments of the present application have at least the following beneficial effects:
[0024] In the thickness measurement system and the measurement method provided in the embodiments of the present application, the measuring probes of the first measuring instrument and the second measuring instrument are arranged opposite to each other, and the first measuring instrument and the second measuring instrument can realize relative movement driven by their respective driving components. In this way, when measuring the thickness of the workpiece, the measuring probes of the first measuring instrument and the second measuring instrument can be respectively abutted against two oppositely arranged surfaces of the workpiece, so as to measure the distance between the two measuring probes, and then measure the thickness of the measured position of the workpiece. In the embodiment of the present application, before measuring the thickness, the measuring probe of the first measuring instrument can be made to abut against the measuring probe of the second measuring instrument to ensure that the measuring probes of the two measuring instruments are facing each other, so that the positions where the measuring probes measure the workpiece are two sides of the workpiece in the same thickness direction, which helps to ensure the accuracy of the thickness measurement; using the measuring probes of the first measuring instrument and the second measuring instrument to respectively measure points on both sides of the workpiece can reduce the influence of the non-workpiece structure on the workpiece thickness measurement, which is conducive to improving the accuracy of the thickness measurement; at the same time, the embodiment of the present application uses the first driving component to drive the first measuring instrument to move along the first direction, and uses the second driving component to move the second measuring instrument along the first direction, so that the first measuring instrument and the second measuring instrument can move towards each other, so that point measurements can be performed on both sides of the workpiece to measure the thickness of the workpiece, which is helpful to reduce the equipment cost compared with the thickness measurement of the workpiece by the laser automatic thickness gauge. Laser measurement has certain requirements on the amount of light and is easily disturbed by environmental factors during measurement, while the embodiment of the present application has no requirements on the amount of light and has low environmental requirements, which effectively improves the practicality; using the manipulator mechanism to grab and move the workpiece to the measurement space for measurement, the workpiece can be kept stable during measurement, which is conducive to ensuring the accuracy of the thickness measurement. In addition, since the measuring probe of the first measuring instrument and the measuring probe of the second measuring instrument can both be extended and retracted and the retraction amount is used to reflect the measured thickness of the workpiece, the retraction amount of the measuring probes of the first measuring instrument and the second measuring instrument can be freely complementary, that is, the thickness of the workpiece can be accurately measured when the workpiece is not located at the center line position between the first measuring instrument and the second measuring instrument, thereby further ensuring the accuracy of the thickness measurement. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0026] Figure 1 A schematic diagram of the structure of a thickness measurement system provided by an embodiment of the present application;
[0027] Figure 2 for Figure 1 A partial enlarged schematic diagram of part A;
[0028] Figure 3 for Figure 1 A partial enlarged schematic diagram of part B;
[0029] Figure 4 A schematic diagram of the coordination between a sheet support mechanism and a manipulator structure in a thickness measurement system according to an embodiment of the present application.
[0030] Reference numerals:
[0031] 110, base; 120, first measuring mechanism; 121, first driving assembly; 122, first measuring instrument; 130, second measuring mechanism; 131, second driving assembly; 132, second measuring instrument; 140, measuring space;
[0032] 200, manipulator mechanism; 210, first moving assembly; 220, second moving assembly; 230, gripper;
[0033] 310, support seat; 320, sheet supporting platform; 321, first placement slot; 322, second placement slot; 323, third placement slot; 324, avoidance passage;
[0034] 400. Fixed seat. DETAILED DESCRIPTION
[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0036] See also Figure 1 As shown, one embodiment of the present application discloses a thickness measurement system for measuring the thickness of a workpiece, wherein the thickness measurement system includes a measurement device and a manipulator structure.
[0037] See also Figure 1 As shown, in some embodiments, the measuring device includes a base 110, a first measuring mechanism 120 and a second measuring mechanism 130, the first measuring mechanism 120 includes a first driving assembly 121 and a first measuring instrument 122 connected to the first driving assembly 121, the first driving assembly 121 is installed on the base 110, and the first driving assembly 121 is used to drive the first measuring instrument 122 to move along a first direction; the second measuring mechanism 130 includes a second driving assembly 131 and a second measuring instrument 132 connected to the second driving assembly 131, the second driving assembly 131 is installed on the base 110 and located on the opposite side of the first driving assembly 121, and the second driving assembly 131 is used to drive the second measuring instrument 132 to move along the first direction. Wherein, the first measuring instrument 122 and the second measuring instrument 132 both include a retractable and movable measuring probe, the measuring probe of the first measuring instrument 122 and the measuring probe of the second measuring instrument 132 are arranged opposite to each other, and a measuring space 140 for placing a workpiece is defined between the first measuring instrument 122 and the second measuring instrument 132. The robot mechanism 200 is used to grab the workpiece and move the workpiece to the measuring space 140 .
[0038] It should be noted that the first direction refers to Figure 1 The X direction is shown.
[0039] In the thickness measurement system provided in the present application, the measuring probes of the first measuring instrument 122 and the second measuring instrument 132 are arranged opposite to each other, and the first measuring instrument 122 and the second measuring instrument 132 can realize relative movement under the drive of their respective driving components. In this way, when measuring the thickness of the workpiece, the measuring probes of the first measuring instrument 122 and the second measuring instrument 132 can be respectively abutted against two oppositely arranged surfaces of the workpiece, so as to measure the distance between the two measuring probes, and then measure the thickness of the measured position of the workpiece.
[0040] In the embodiment of the present application, before measuring the thickness, the measuring probe of the first measuring instrument 122 can be made to collide with the measuring probe of the second measuring instrument 132 to ensure that the measuring probes of the two measuring instruments are facing each other, so that the positions where the measuring probes measure the workpiece are the two sides of the workpiece in the same thickness direction, which helps to ensure the accuracy of the thickness measurement. At the same time, using the measuring probes of the first measuring instrument 122 and the second measuring instrument 132 to measure points on both sides of the workpiece respectively can reduce the influence of non-workpiece structures on the workpiece thickness measurement, which is conducive to improving the accuracy of the thickness measurement.
[0041] In addition, the embodiment of the present application utilizes the first drive assembly 121 to drive the first measuring instrument 122 to move along the first direction, and utilizes the second drive assembly 131 to move the second measuring instrument 132 along the first direction, so that the first measuring instrument 122 and the second measuring instrument 132 can move toward each other, so that point measurements can be taken on both sides of the workpiece to measure the thickness of the workpiece, which helps to reduce equipment costs compared to measuring the thickness of the workpiece by a laser automatic thickness gauge. Using the manipulator mechanism 200 to grab and move the workpiece to the measurement space 140 for measurement can keep the workpiece stable during measurement, which is conducive to ensuring the accuracy of thickness measurement.
[0042] In one embodiment of the present application, before measuring the thickness of the workpiece, the thickness measurement system needs to be calibrated. Specifically, the measuring probe of the first measuring instrument 122 and the measuring probe of the second measuring instrument 132 are made to face and abut against each other, and the axes of the measuring probes of the two are made to coincide. In this way, the retraction amount of the measuring probe can be made equal to the length of the measuring probe moving in the thickness direction of the workpiece, thereby ensuring the accuracy of the measurement.
[0043] It is worth understanding that in some other embodiments, the resetting and calibration of the thickness measurement system can also be completed synchronously during the equipment debugging phase, that is, the thickness measurement system does not need to be reset or calibrated before each thickness measurement.
[0044] It should be noted that, when measuring the thickness, the measuring probe of the first measuring instrument moves telescopically along the X direction; and the measuring probe of the second measuring instrument 132 moves telescopically along the X direction.
[0045] In some embodiments of the present application, the first driving assembly 121 includes a first cylinder, the first cylinder is installed on the base 110, the output end of the first cylinder is fixedly connected to the first measuring instrument 122, and the movement direction of the output end of the first cylinder is consistent with the first direction. In this way, the first measuring instrument 122 can be driven by the first cylinder to move along the first direction to complete the thickness measurement of the workpiece.
[0046] It is worth understanding that in some other embodiments, the first driving assembly 121 includes a screw slider mechanism and a driving motor, the first measuring instrument 122 is connected to the screw slider mechanism, and the driving motor drives the first measuring instrument 122 to move along the first direction through the screw slider mechanism.
[0047] In some embodiments of the present application, the second driving assembly 131 is a second cylinder, the second cylinder is installed on the base 110, the output end of the second cylinder is fixedly connected to the second measuring instrument 132, and the movement direction of the output end of the second cylinder is consistent with the first direction (i.e., the X direction). In this way, the second measuring instrument 132 can be driven by the second cylinder to move along the first direction to complete the thickness measurement of the workpiece.
[0048] It is worth understanding that in some other embodiments, the second driving assembly 131 includes a screw slider mechanism and a driving motor, the second measuring instrument 132 is connected to the screw slider mechanism, and the driving motor drives the second measuring instrument 132 to move along the first direction through the screw slider mechanism.
[0049] See also Figure 1 and Figure 2 As shown, in some embodiments of the present application, the first direction is a vertical direction, and the connecting line between the measuring probe of the first measuring instrument 122 and the measuring probe of the second measuring instrument 132 is parallel to the first direction. When measuring the thickness of the workpiece, the thickness direction of the workpiece is parallel to the first direction, that is, the connecting line is perpendicular to the two surfaces of the workpiece to be measured, and the workpiece is placed in the measuring space 140 between the first measuring instrument 122 and the second measuring instrument 132. Among them, the measuring probe of the first measuring instrument 122 abuts against the upper surface of the workpiece, and the measuring probe of the second measuring instrument 132 abuts against the lower surface of the workpiece. In this way, the distance between the measuring probe of the first measuring instrument 122 and the measuring probe of the second measuring instrument 132 is the thickness of the workpiece at the measured position. For the first measuring instrument 122 and the second measuring instrument 132, the sum of the retracted amount of the measuring probe of the first measuring instrument 122 and the retracted amount of the measuring probe of the second measuring instrument 132 is equal to the thickness of the workpiece at the measured position.
[0050] It is worth to understand that in some other embodiments, the first direction may also be a horizontal direction, that is, the first measuring instrument 122 and the second measuring instrument 132 are located in the same horizontal plane, which is not limited here.
[0051] See also Figure 1 As shown, in some embodiments of the present application, the thickness measurement system further includes a support mechanism, which is disposed on one side of the base 110 and is located within the travel range of the manipulator mechanism 200, wherein the support mechanism is provided with at least one placement slot. The placement slot is used to place the workpiece whose thickness is to be measured. The number of placement slots can be set to one or more according to actual needs.
[0052] See also Figure 1 As shown, in some embodiments of the present application, the wafer supporting mechanism includes a wafer supporting platform 320 and a support seat 310, the support seat 310 is installed on the base 110, the wafer supporting platform 320 is installed on the support seat 310, the upper end surface of the wafer supporting platform 320 is horizontally arranged, and the placement groove is arranged on the upper end surface of the wafer supporting platform 320.
[0053] In some embodiments of the present application, the wafer support platform 320 is provided with a plurality of placement slots, and the size of each placement slot is the same or different. Exemplarily, the wafer support platform 320 may be provided with a plurality of placement slots of the same size to simultaneously place a plurality of workpieces of the same size.
[0054] See also Figure 1 , Figure 3 and Figure 4 As shown, in some embodiments of the present application, the sizes of the placement grooves are different. Among them, the placement grooves are concentrically arranged, and the sizes of the placement grooves decrease from top to bottom. In other words, the placement grooves of different sizes are presented as a stepped structure on the support platform 320. The placement grooves of different sizes are concentrically arranged, which can effectively reduce the plane size of the support platform 320, which is conducive to reducing the volume of the thickness measurement system.
[0055] See also Figure 1 As shown, in some embodiments of the present application, the manipulator mechanism 200 includes a first moving component 210, a second moving component 220 and a gripper 230. The first moving component 210 is installed on one side of the support mechanism, the second moving component 220 is installed on the first moving component 210, the first moving component 210 is used to drive the second moving component 220 to rise and fall, the gripper 230 is installed on the second moving component 220, the second moving component 220 is used to drive the gripper 230 to move horizontally, and the gripper 230 is used to grab the workpiece.
[0056] Further, see Figure 1 and Figure 4 As shown, the manipulator mechanism 200, the support mechanism and the measuring device are sequentially spaced along the same straight line, and the support mechanism is provided with an avoidance channel 324 for the second moving assembly 220 and the gripper 230 to pass through. When measuring the thickness of the workpiece, the second moving assembly 220 moves, driving the gripper 230 to move along the Y direction, so that the gripper 230 moves to the top of the workpiece; the first moving assembly 210 is controlled to move, driving the second moving assembly 220 and the gripper 230 to approach the workpiece, so as to facilitate the gripper 230 to grab the workpiece; then the first moving assembly 210 and the second moving assembly 220 continue to move, driving the workpiece to move into the measuring space 140, so as to facilitate the measuring device to measure the thickness of the workpiece. In this embodiment, the manipulator mechanism 200, the support mechanism and the measuring device are sequentially spaced along the same straight line, so that the gripper 230 can be moved to the measuring space 140 for thickness measurement after moving up and down and moving horizontally left and right, which can simplify the structural setting of the manipulator mechanism 200, help reduce the overall cost of the manipulator structure; at the same time, it can also improve the moving efficiency of the manipulator.
[0057] In a possible implementation, the gripper 230 includes a manipulator finger and a suction component, wherein the suction component has a negative pressure suction port, and the negative pressure suction port is connected to a vacuum suction pipe. In this way, the workpiece can be sucked by the suction component to achieve the purpose of grabbing the workpiece.
[0058] See also Figure 1In some embodiments of the present application, the thickness measurement system further includes a fixing seat 400, and the sheet supporting mechanism and the measuring mechanism are both mounted on the fixing seat 400. In this way, the manipulator mechanism 200, the sheet supporting mechanism and the measuring device are all fixed on the fixing seat 400, which helps to ensure that the relative positions of the three are relatively fixed, thereby ensuring the measurement accuracy of the thickness measurement system and also helps to reduce the correction probability of the thickness measurement system.
[0059] In a possible implementation, the fixing seat 400 is made of marble with high flatness, the upper end surface of the fixing seat 400 is a horizontal surface, and the manipulator mechanism 200, the measuring device and the supporting mechanism are all installed on the upper end surface of the fixing seat 400. In this way, the manipulator mechanism 200, the measuring device and the supporting mechanism can be placed on the same horizontal plane, which is conducive to calibrating the thickness measurement system. The fixing seat 400 made of marble also helps to keep the manipulator mechanism 200, the measuring device and the supporting mechanism and other mechanisms and devices in a stable state, thereby ensuring the accuracy of the measurement.
[0060] In this embodiment, the workpiece whose thickness is to be measured is specifically a wafer.
[0061] It should be noted that the thickness measurement system of the embodiment of the present application can also be used to measure the thickness of other workpieces with parallel end surfaces, which is not limited here.
[0062] In some embodiments of the present application, the measurement range of the first measuring instrument 122 and the second measuring instrument 132 are both 12 mm, the resolution is both 0.1 micron, and the accuracy is both 1 micron, where 1 micron is 0.001 millimeter.
[0063] In a possible implementation, the first measuring instrument 122 and the second measuring instrument 132 may be specifically KEYENCE's GT2-P12K, which has a measuring range of 12MM, a resolution of 0.1 micron, and an accuracy of 1 micron.
[0064] It is worth to understand that the measuring range, resolution, accuracy and brand model of the first measuring instrument 122 and the second measuring instrument 132 can also be selected accordingly according to the needs and are not limited here.
[0065] Another aspect of the present application discloses a measurement method, which is applied to the thickness measurement system as described above, wherein the measurement method comprises the following steps:
[0066] Control the measuring probe of the first measuring mechanism 120 and the measuring probe of the second measuring mechanism 130 to align and abut, and set the readings of the first measuring instrument 122 and the second measuring instrument 132 to be the first measurement value H0;
[0067] Control the manipulator mechanism 200 to grab the workpiece and move the workpiece to the measuring space 140 so that the thickness direction of the workpiece is parallel to the connecting line of the measuring probe of the first measuring mechanism 120 and the measuring probe of the second measuring mechanism 130;
[0068] Control the first measuring mechanism 120 and the second measuring mechanism 130 to move toward the workpiece, and make the first measuring instrument 122 and the second measuring instrument 132 abut against the workpiece, and read the value H1 of the first measuring instrument 122 and the value H2 of the second measuring instrument 132;
[0069] The thickness H of the workpiece is calculated based on the value H1 of the first measuring instrument 122 and the value H2 of the second measuring instrument 132 .
[0070] In a possible implementation, the thickness of the workpiece is specifically H=H1+H2-H0, wherein H0 is the absolute value of the sum of the readings of the first measuring instrument 122 and the second measuring instrument 132 when the measuring probe of the first measuring mechanism 120 and the measuring probe of the second measuring mechanism 130 collide with each other.
[0071] In the above implementation, H0 may be zero or other values.
[0072] The thickness measurement system and the measurement method of the embodiment of the present application are described in detail below with a specific embodiment. It should be noted that the following embodiment is only an exemplary description and should not be understood as limiting the embodiment of the present application.
[0073] See also Figures 1 to 4 As shown, the thickness measurement system of this embodiment includes a robot mechanism 200 , a sheet supporting mechanism, a measuring device and a fixing seat 400 .
[0074] Specifically, the manipulator mechanism 200 includes a gripper 230, a first drive assembly 121, a second drive assembly 131 and a manipulator fixed seat 400, the gripper 230 is specifically a manipulator finger, the first drive assembly 121 is specifically a manipulator lifting platform, the second drive assembly 131 is specifically a manipulator telescopic platform, the manipulator telescopic platform is driven by a high-precision servo motor, and the repeatability accuracy can reach 0.01mm, and the manipulator lifting platform is driven by a high-precision servo motor, and the repeatability accuracy can reach 0.005mm. Among them, the driving motor of the manipulator lifting platform is located in the manipulator fixed seat 400, which is used to lift or lower the manipulator lifting platform, thereby driving the lifting and lowering of the manipulator telescopic platform and the manipulator fingers. A servo motor of the telescopic platform is provided in the manipulator lifting platform, which is used to drive the manipulator telescopic platform and the manipulator fingers to move. In this embodiment, the manipulator mechanism 200 can be freely lifted and retracted through the two-axis servo motor drive. It should be pointed out that the manipulator fingers have a vacuum adsorption function, which can adsorb and position the wafer to achieve the wafer grabbing work.
[0075] The wafer supporting mechanism includes a wafer supporting platform 320 and a support seat 310, wherein the wafer supporting platform 320 is a step-type tray of a specified size made according to demand, generally made into three diameter circular steps of 4 inches, 6 inches, and 8 inches; the support seat 310 is used to fix the wafer supporting platform 320 so that the wafer supporting platform 320 can be placed stably.
[0076] The measuring device includes a first cylinder, a second cylinder, a first measuring instrument 122, a second measuring instrument 132 and a base 110. The base 110 is used to fix the relative position of the first cylinder and the second cylinder. The first measuring instrument 122 is installed on the first cylinder, and the second measuring instrument 132 is installed on the second cylinder. The first measuring instrument 122 and the second measuring instrument 132 are both equipped with elastically retractable measuring probes. When the first cylinder and the second cylinder are operated simultaneously, the first measuring instrument 122 and the second measuring instrument 132 can be aligned and contacted and be in a retracted state, wherein the retracted amount is the measured value.
[0077] The fixing seat 400 is made of marble with high flatness, and is used to fix the manipulator fixing seat 400, the supporting seat 310 and the base 110, so that the manipulator mechanism 200, the support mechanism and the measuring device are in a horizontal and stable state.
[0078] In this embodiment, the steps of measuring the thickness of the wafer by the thickness measurement system are as follows:
[0079] The wafer is placed on the wafer support platform 320. After the robot lifting platform is lowered to a position below the wafer step, the robot telescopic platform drives the robot fingers to extend to the center of the wafer support platform 320, and turns on the vacuum adsorption function of the robot fingers to allow the wafer to be adsorbed on the robot fingers.
[0080] The robot lifting platform drives the wafer up to the middle position between the first measuring instrument 122 and the second measuring instrument 132 , and then the robot telescopic platform drives the wafer to extend and makes the center of the wafer at the contact point between the first measuring instrument 122 and the second measuring instrument 132 .
[0081] The first cylinder and the second cylinder operate simultaneously, so that the wafer can come into contact with the first measuring instrument 122 and the second measuring instrument 132 .
[0082] After a delay of 2 seconds, the system reads the readings of the first measuring instrument 122 and the second measuring instrument 132 and performs calculations to obtain the wafer thickness.
[0083] After obtaining the thickness value of the wafer, the first cylinder and the second cylinder are released at the same time, the robot telescopic platform drives the wafer to retract to the center of the wafer support platform 320, the robot finger vacuum is turned off, and then the robot lifting platform is lowered to a position below the wafer step, and the robot telescopic platform drives the wafer to retract to the original position, completing a thickness measurement process.
[0084] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0085] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.
[0086] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0087] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.
[0088] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.
Claims
1. A thickness measurement system, characterized in that: include: The measuring device comprises a base, a first measuring mechanism and a second measuring mechanism, The first measuring mechanism comprises a first driving assembly and a first measuring instrument connected to the first driving assembly, the first driving assembly is mounted on the base, and the first driving assembly is used to drive the first measuring instrument to move along a first direction; The second measuring mechanism includes a second driving assembly and a second measuring instrument connected to the second driving assembly, wherein the second driving assembly is installed on the base and located on the opposite side of the first driving assembly, and the second driving assembly is used to drive the second measuring instrument to move along the first direction. Wherein, the first measuring instrument and the second measuring instrument both include a retractable measuring probe, the measuring probe of the first measuring instrument and the measuring probe of the second measuring instrument are arranged opposite to each other, and a measuring space for placing a workpiece is defined between the first measuring instrument and the second measuring instrument; as well as The manipulator mechanism is used to grab the workpiece and move the workpiece to the measuring space.
2. The thickness measurement system according to claim 1, characterized in that: The first direction is a vertical direction, and a line connecting the measuring probe of the first measuring instrument and the measuring probe of the second measuring instrument is parallel to the first direction.
3. The thickness measurement system according to claim 1 or 2, characterized in that: It also includes a film supporting mechanism, which is arranged on one side of the base and is located within the travel range of the manipulator mechanism, wherein the film supporting mechanism is provided with at least one placement slot.
4. The thickness measurement system according to claim 3, characterized in that: The film supporting mechanism comprises a film supporting platform and a supporting seat, wherein the supporting seat is mounted on the base, the film supporting platform is mounted on the supporting seat, the upper end surface of the film supporting platform is horizontally arranged, and the placement groove is arranged on the upper end surface of the film supporting platform.
5. The thickness measurement system according to claim 4, characterized in that: The sheet supporting platform is provided with a plurality of placement slots, and the sizes of each placement slot are the same or different.
6. The thickness measurement system according to claim 5, characterized in that: The sizes of the placement grooves are different, wherein the placement grooves are concentrically arranged, and the sizes of the placement grooves decrease from top to bottom.
7. The thickness measurement system according to claim 3, characterized in that: The robot mechanism includes a first moving component, a second moving component and a gripper, the first moving component is installed on one side of the supporting mechanism, the second moving component is installed on the first moving component, the first moving component is used to drive the second moving component to rise and fall, the gripper is installed on the second moving component, the second moving component is used to drive the gripper to move horizontally, and the gripper is used to grab the workpiece.
8. The thickness measurement system according to claim 7, characterized in that: The manipulator mechanism, the support mechanism and the measuring device are sequentially spaced and distributed along the same straight line, and the support mechanism is provided with an avoidance passage for the second moving component and the gripper to pass through.
9. The thickness measurement system according to claim 3, characterized in that: It also includes a fixing seat, and the sheet-supporting mechanism and the measuring mechanism are both installed on the fixing seat.
10. A measurement method, characterized in that: Applicable to the thickness measurement system according to any one of claims 1 to 9, the measurement method comprises the following steps: Controlling the measuring probe of the first measuring mechanism and the measuring probe of the second measuring mechanism to align and abut, and setting the readings of the first measuring instrument and the second measuring instrument as a first measurement value H0; Controlling the manipulator mechanism to grab a workpiece and move the workpiece to the measuring space so that a thickness direction of the workpiece is parallel to a line connecting a measuring probe of the first measuring mechanism and a measuring probe of the second measuring mechanism; Control the first measuring mechanism and the second measuring mechanism to move toward the workpiece, and make the first measuring instrument and the second measuring instrument abut against the workpiece, and read the value H1 of the first measuring instrument and the value H2 of the second measuring instrument; The thickness H of the workpiece is calculated based on the value H1 of the first measuring instrument and the value H2 of the second measuring instrument.