Sonar and assembly method thereof

Abstract

The present invention discloses a sonar and an assembly method thereof, belonging to the field of underwater detection technology, wherein the sonar comprises watertight electronics, an electronic part and a cover part, the electronic part comprises a bracket and a main control circuit board, a transmitting circuit board and a receiving circuit board respectively arranged on the bracket at intervals from each other, the cover part comprises an electronic cabin and a top cover, the electronic cabin has a receiving cavity, the bracket is fixedly mounted on the inner wall of the electronic cabin, the main control circuit board, the transmitting circuit board and the receiving circuit board are received in the receiving cavity of the electronic cabin by the bracket, the top cover is mounted on the electronic cabin and closes the opening of the electronic cabin, wherein the main control circuit board is connected to the watertight terminal. When assembling the sonar, the electronic part is installed in the receiving cavity of the electronic cabin as a whole, which is convenient for operation and conducive to improving assembly efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of underwater detection, and in particular to a sonar and an assembly method thereof. Background Art

[0002] In a Chinese invention patent application with application publication number CN117930248A, the inventor disclosed a sonar, wherein the two opposite sides of the peripheral wall of the electronic compartment are respectively provided with extension columns extending in the height direction, the extension columns have screw holes and slots, the screw holes are located at the top of the extension columns, the slots extend downward from the top of the extension columns and the slots face the receiving cavity of the electronic compartment, the end of the circuit board of the electronic part is inserted into the slot of the extension column from top to bottom, the top of the circuit board is flush with the top of the extension column, and the screws are screwed into the screw holes of the extension columns in a manner of pressing the top of the circuit board, so that the screws prevent the circuit board from escaping from the extension columns upward, thereby setting the circuit board in the electronic compartment. Since the space of the electronic compartment is small and the number of circuit boards is large (the number of circuit boards is usually more than three), it is very inconvenient to install the circuit board in the small space, especially when the number of circuit boards is large, which inevitably leads to cumbersome and inefficient installation of the circuit board. In addition, after the opposite ends of the circuit board are respectively inserted into the slots of the extension column, the middle part of the circuit board is directly exposed to the receiving cavity of the electronic cabin. During operation, the heat generated by the circuit board (especially the heat generated by the chip of the circuit board) can only be radiated toward the receiving cavity of the electronic cabin and cannot be directly conducted to the electronic cabin, resulting in poor heat dissipation effect of the sonar and affecting the performance of the sonar. Summary of the invention

[0003] An object of the present invention is to provide a sonar and an assembly method thereof, wherein after the sonar is assembled with a main control circuit board, a transmitting circuit board and a receiving circuit board through a bracket, the bracket is fixedly installed on the inner wall of an electronic cabin to improve assembly efficiency.

[0004] An object of the present invention is to provide a sonar and an assembly method thereof, wherein the bracket can greatly improve the heat dissipation capacity of the sonar.

[0005] In order to achieve the above object, the technical solution adopted by the present invention is to provide a sonar, which comprises:

[0006] Watertight terminals;

[0007] An electronic part, wherein the electronic part comprises a bracket, a main control circuit board, a transmitting circuit board and a receiving circuit board, wherein the main control circuit board, the transmitting circuit board and the receiving circuit board are arranged on the bracket at intervals, wherein the main circuit board is connected to the watertight terminal;

[0008] A cover portion, wherein the cover portion includes an electronic cabin and a top cover, the electronic cabin having a receiving cavity, the bracket being fixedly mounted on the inner wall of the electronic cabin, the main control circuit board, the transmitting circuit board and the receiving circuit board being received in the receiving cavity of the electronic cabin by the bracket, the top cover being mounted on the electronic cabin and closing the opening of the electronic cabin, wherein the main control circuit board is connected to the watertight terminal.

[0009] As a further improvement of the technical solution of the present invention, the electronic part includes four groups of stud assemblies, and the four corners of the main control circuit board, the four corners of the transmitting circuit board, the four corners of the receiving circuit board and different positions of the bracket are respectively fixed by the four groups of stud assemblies.

[0010] As a further improvement of the technical solution of the present invention, the bracket includes a base plate, a first outer vertical plate, a second outer vertical plate, a first inner vertical plate and a second inner vertical plate. The first outer vertical plate, the first inner vertical plate, the second inner vertical plate and the second outer vertical plate are installed on the base plate at intervals from each other, the transmitting circuit board is clamped between the first inner vertical plate and the second inner vertical plate, and each group of the stud assemblies is respectively fixed to the second outer vertical plate.

[0011] As a further improvement to the technical solution of the present invention, the main control board chip of the main control circuit board is attached to the first outer vertical plate.

[0012] As a further improvement to the technical solution of the present invention, the transmitting board chip on one side of the transmitting circuit board is adhered to the first inner vertical plate, and the transmitting board chip on the other side is adhered to the second inner vertical plate, so that the transmitting circuit board is clamped between the first inner vertical plate and the second inner vertical plate.

[0013] As a further improvement to the technical solution of the present invention, the bottom surface of the bottom plate of the bracket is in surface contact with the bottom wall of the electronic compartment.

[0014] As a further improvement to the technical solution of the present invention, a heat-conducting layer is provided between the bottom surface of the bottom plate of the bracket and the bottom wall of the electronic cabin.

[0015] According to another aspect of the present invention, the present invention further provides a sonar assembly method, wherein the assembly method comprises the following steps:

[0016] S1, arranging a main control circuit board, a transmitting circuit board and a receiving circuit board on a bracket at intervals to assemble the electronic part;

[0017] S2, after accommodating the electronic part in the accommodating cavity of the electronic compartment through the opening of the electronic compartment of the cover part, fixedly installing the bracket on the inner wall of the electronic compartment, wherein the main control circuit board is connected to the watertight terminal arranged in the electronic compartment;

[0018] S3, covering the opening of the electronic compartment with the top cover of the casing part so that the opening of the electronic compartment is closed by the top cover, thereby completing the assembly of the sonar.

[0019] As a further improvement to the technical solution of the present invention, before step S2, the assembly method further includes the step of: providing a heat-conducting layer on the bottom surface of the bottom plate of the bracket, so that after the bracket is fixedly installed on the inner wall of the electronic cabin, the heat-conducting layer is located between the bottom surface of the bottom plate of the bracket and the bottom wall of the electronic cabin.

[0020] As a further improvement to the technical solution of the present invention, before step S3, the assembly method further includes the steps of: connecting the transmitting array of the top cover to the transmitting circuit board and connecting the receiving array of the top cover to the receiving circuit board.

[0021] Compared with the prior art, the present invention has at least the following beneficial effects:

[0022] 1. After the main control circuit board, the transmitting circuit board and the receiving circuit board are fixedly mounted on the bracket respectively, the bracket is fixedly mounted on the inner wall of the electronic compartment, so that the main control circuit board, the transmitting circuit board and the receiving circuit board are accommodated in the accommodating cavity of the electronic compartment by the bracket. In this way, the operation steps in a small space can be reduced, which not only facilitates the assembly operation, but also greatly improves the assembly efficiency;

[0023] 2. During operation, the heat generated by the main control circuit board, the transmitting circuit board or the receiving circuit board can be directly conducted to the bracket, and then conducted to the electronic cabin through the bracket, so as to improve the heat dissipation capacity of the sonar;

[0024] 3. The bracket and the electronic cabin can be in surface contact, which is conducive to improving the efficiency of heat conduction from the bracket to the electronic cabin, thereby greatly improving the heat dissipation capacity of the sonar.

[0025] Other beneficial effects of the present invention will be further disclosed and explained in the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a stereoscopic schematic diagram of a sonar according to a preferred embodiment of the present invention.

[0027] Figure 2 It is a cross-sectional schematic diagram of the first position of the sonar according to the above preferred embodiment of the present invention.

[0028] Figure 3 It is a cross-sectional schematic diagram of the second position of the sonar according to the above preferred embodiment of the present invention.

[0029] Figure 4 It is a cross-sectional schematic diagram of the third position of the sonar according to the above preferred embodiment of the present invention.

[0030] Figure 5 It is a schematic diagram of an exploded view of the sonar according to the above preferred embodiment of the present invention from one perspective.

[0031] Figure 6 It is a schematic diagram of another perspective of the sonar according to the above preferred embodiment of the present invention.

[0032] Figure 7 It is a schematic diagram of an exploded view of a local position of the sonar according to the above preferred embodiment of the present invention.

[0033] Figure 8 It is a schematic diagram of another perspective of the above-mentioned local position of the sonar according to the above-mentioned preferred embodiment of the present invention.

[0034] Fig. 9 It is a schematic diagram of an exploded view of an electronic part of the sonar according to the above preferred embodiment of the present invention.

[0035] Fig.10 It is a schematic diagram of an exploded view from another perspective of the electronic part of the sonar according to the above preferred embodiment of the present invention.

[0036] Fig.11 It is a stereoscopic schematic diagram of one of the assembly processes of the sonar according to the above preferred embodiment of the present invention.

[0037] Fig.12 It is a three-dimensional schematic diagram of the second assembly process of the sonar according to the above preferred embodiment of the present invention.

[0038] Fig.13 It is a three-dimensional schematic diagram of the third assembly process of the sonar according to the above preferred embodiment of the present invention.

[0039] Fig.14 It is a three-dimensional schematic diagram of the fourth assembly process of the sonar according to the above preferred embodiment of the present invention.

[0040] Fig.15 It is a three-dimensional schematic diagram of the fifth assembly process of the sonar according to the above preferred embodiment of the present invention.

[0041] Fig.16 It is a three-dimensional schematic diagram of the sixth assembly process of the sonar according to the above preferred embodiment of the present invention.

[0042] Fig.17 It is a stereoscopic schematic diagram of the seventh assembly process of the sonar according to the above preferred embodiment of the present invention.

[0043] Fig.18 It is a three-dimensional schematic diagram of the eighth assembly process of the sonar according to the above preferred embodiment of the present invention.

[0044] Fig.19 It is a three-dimensional schematic diagram of the ninth assembly process of the sonar according to the above preferred embodiment of the present invention.

[0045] Fig. 20 It is a three-dimensional schematic diagram of the tenth assembly process of the sonar according to the above preferred embodiment of the present invention.

[0046] Fig.21 It is a three-dimensional schematic diagram of the eleventh assembly process of the sonar according to the above preferred embodiment of the present invention.

[0047] Fig. 22 It is a three-dimensional schematic diagram of the twelfth assembly process of the sonar according to the above preferred embodiment of the present invention.

[0048] In the figure:

[0049] 10. cover part; 11. electronic cabin; 111. receiving chamber; 12. top cover; 121. transmitting array; 1211. transmitting flexible board; 122. receiving array; 1221. receiving flexible board;

[0050] 20. Watertight terminals;

[0051] 30. Electronic part; 31. Bracket; 311. Bracket perforation; 312. Bottom plate; 313. First outer vertical plate; 3131. Groove; 314. First inner vertical plate; 3141. First channel; 315. Second inner vertical plate; 3151. Second channel; 316. Second outer vertical plate; 32. Main control circuit board; 321. Main control board perforation; 322. Main control board chip; 33. Transmitting circuit board; 331. Transmitting board perforation; 332. Transmitting board chip; 34. Receiving circuit board; 341. Receiving board perforation; 35. Stud assembly; 351. First screw; 352. First stud; 353. Second stud; 354. Third stud; 355. Second screw; 36. Conductive connector; 361. First connector; 362. Second connector;

[0052] 40. Thermal conductive layer. DETAILED DESCRIPTION

[0053] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components described below or illustrated in the following figures. The present invention can have other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used here are for descriptive purposes and should not be considered restrictive. The use of "including" or "having" and its variations herein is intended to cover the items and their equivalents and additional items displayed below. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are widely used and cover direct installation and indirect installation, connection, support and connection. In addition, "connect" and "couple" are not limited to physical or mechanical connections or connections.

[0054] Furthermore, on the first aspect, in the disclosure of the present invention, the orientations or positional relationships indicated by terms such as “longitudinal”, “transverse”, “upper”, “lower”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside” and “outside” are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second aspect, the term “one” should be understood as “at least one” or “one or more”, that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term “one” cannot be understood as a limitation on the quantity.

[0055] With reference to the accompanying drawings of the present invention Figures 1 to 22 A sonar according to a preferred embodiment of the present invention will be disclosed and explained in the following description, wherein the sonar includes a cover part 10, a watertight terminal 20 and an electronic part 30, wherein the cover part 10 includes an electronic compartment 11 and a top cover 12, the electronic compartment 11 has a receiving cavity 111, the watertight terminal 20 is arranged in the electronic compartment 11, the top cover 12 is installed in the electronic compartment 11, and the top cover 12 closes the opening of the electronic compartment 11 to provide a watertight space by the top cover 12 and the electronic compartment 11, the electronic part 30 is received in the receiving cavity 111 of the electronic compartment 11, and the electronic part 30 is connected to the watertight terminal 20, so that the electronic part 30 and the external environment are isolated by the cover part 10.

[0056] Specifically, the electronic part 30 includes a bracket 31, a main control circuit board 32, a transmitting circuit board 33 and a receiving circuit board 34, wherein the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are arranged on the bracket 31 at intervals. The bracket 31 is fixedly mounted on the inner wall of the electronic cabin 11, so that the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are accommodated in the accommodating cavity 111 of the electronic cabin 11 by the bracket 31, wherein the main control circuit board 32 is connected to the watertight terminal 20. Preferably, in the attached Figures 1 to 22 In this specific example of the sonar of the present invention shown, the transmitting circuit board 33 is connected to the main control circuit board 32, and the receiving circuit board 34 is connected to the transmitting circuit board 33. Optionally, in other examples of the sonar of the present invention, the transmitting circuit board 33 and the receiving circuit board 34 are not directly connected, but the transmitting circuit board 33 and the receiving circuit board 34 are respectively connected to the main control circuit board 32. In addition, it can be understood that in another example of the sonar of the present invention, the transmitting circuit board 33 and the receiving circuit board 34 can be the same, that is, the transmitting circuit part and the receiving circuit part can be arranged on the same PCB board.

[0057] The top cover 12 has a transmitting array 121 and a receiving array 122. The transmitting array 121 is connected to the transmitting circuit board 33, and the receiving array 122 is connected to the receiving circuit board 34. Figure 2 and Figure 6 The transmitting flexible board 1211 of the transmitting array 121 extends to the side of the transmitting circuit board 33 and is connected to the transmitting circuit board 33, so that the transmitting array 121 is connected to the transmitting circuit board 33, and the receiving flexible board 1221 of the receiving array 122 extends to the side of the receiving circuit board 34 and is connected to the receiving circuit board 34, so that the receiving array 122 is connected to the receiving circuit board 34.

[0058] Unlike the sonar in the prior art, Figures 1 to 22In the specific example of the sonar of the present invention shown, the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are first installed on the bracket 31 in a mutually spaced manner to make the electronic part 30 modularized, and then the bracket 31 is fixedly installed on the receiving cavity 111 of the electronic cabin 11, so when assembling the sonar, the operation steps in a small space can be reduced, which not only facilitates the assembly operation of the sonar, but also greatly improves the assembly efficiency. Specifically, the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are installed on the bracket 31 outside the electronic cabin 11, so that the installation of the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 on the bracket 31 will not be limited by the size of the space, which facilitates the assembly of the electronic part 30, so when assembling the sonar, the operation steps in a small space can be reduced.

[0059] Furthermore, since the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are installed on the bracket 31 at intervals, the electronic part 30 is modularized instead of installing each circuit board separately and directly on the electronic compartment. Therefore, the main control circuit board 32 and the transmitting circuit board 33 as well as the transmitting circuit board 33 and the receiving circuit board 34 can be connected by at least one conductive connector 36, without the need for flying wires between the main control circuit board 32 and the transmitting circuit board 33 as well as between the transmitting circuit board 33 and the receiving circuit board 34. This not only ensures the reliability of the conductive relationship between the main control circuit board 32 and the transmitting circuit board 33 as well as between the transmitting circuit board 33 and the receiving circuit board 34, but also avoids the problem of desoldering of the solder joints of the flying wires during the assembly of the sonar, and also prevents the actual performance of the sonar from being reduced due to poor consistency of the solder joints.

[0060] In addition, since the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are respectively fixedly installed on the bracket 31, and the bracket 31 is fixedly installed on the electronic cabin 11, during operation, the heat generated by the main control circuit board 32, the transmitting circuit board 33 or the receiving circuit board 34 can be directly conducted to the bracket 31, and then conducted to the electronic cabin 11 through the bracket 31, so as to help improve the heat dissipation capacity of the sonar.

[0061] Reference Figures 7 to 10The electronic part 30 includes four groups of stud assemblies 35, and the four corners of the main control circuit board 32, the four corners of the transmitting circuit board 33, the four corners of the receiving circuit board 34 and the different positions of the bracket 31 are respectively fixed by the four groups of stud assemblies 35. In this way, the relative positions of the bracket 31, the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are fixed. When the modular electronic part 30 is subsequently transported and the modular electronic part 30 is installed in the accommodating cavity 111 of the electronic cabin 11, the relative positions of the bracket 31, the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 can be avoided from changing, thereby ensuring the reliability of the connection relationship between the main control circuit board 32 and the transmitting circuit board 33 and the connection relationship between the transmitting circuit board 33 and the receiving circuit board 34.

[0062] Specifically, each corner of the bracket 31 has a bracket through-hole 311, each corner of the main control circuit board 32 has a main control board through-hole 321, each corner of the transmitting circuit board 33 has a transmitting board through-hole 331, and each corner of the receiving circuit board 34 has a receiving board through-hole 341. Each group of the stud assemblies 35 respectively includes a first screw 351, a first stud 352, a second stud 353, a third stud 354 and a second screw 355, one end of the first stud 352 and one end of the second stud 353 are screw hole ends with screw holes, and the other end is a threaded end with threads, and the opposite ends of the third stud 354 are screw hole ends with screw holes, the size of the screw hole end is larger than the size of the threaded end, and the size of the threaded end is consistent with the size of the bracket through hole 311 of the bracket 31, the main control board through hole 321 of the main control circuit board 32, the transmitting board through hole 331 of the transmitting circuit board 33, and the receiving board through hole 341 of the receiving circuit board 34.

[0063] One end of the first screw 351 extends to the screw hole of the first stud 352 after passing through the main control board through hole 321 of the main control circuit board 32 and is screwed to the screw hole end of the first stud 352, so that the first stud 352 is installed on the main control circuit board 32. The threaded end of the first stud 352 extends to the screw hole of the second stud 353 after passing through the transmitting board through hole 331 of the transmitting circuit board 33 and is screwed to the screw hole end of the second stud 353, so that the first stud 352 and the second stud 353 are installed on the transmitting circuit board 33. The threaded end of the second stud 353 extends to the screw hole of one end of the third stud 354 after passing through the receiving board through hole 341 of the receiving circuit board 34 and is screwed to the screw hole end of the third stud 354, so that the second stud 353 and the third stud 354 are installed on the receiving circuit board 34. One end of the second screw 355 passes through the bracket through hole 311 of the bracket 31 and extends to the screw hole at the other end of the third stud 354 and is screwed to the screw hole end of the third stud 354 to install the third stud 354 on the bracket 31. Through the above structure, the four groups of stud assemblies 35 can reliably install the bracket 31, the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34.

[0064] It can be understood that the distance between the main control circuit board 32 and the transmitting circuit board 33 is related to the length dimension of the screw hole end of the first stud 352. The longer the dimension of the screw hole end of the first stud 352 is, the larger the distance between the main control circuit board 32 and the transmitting circuit board 33 is, and the shorter the dimension of the screw hole end of the first stud 352 is, the smaller the distance between the main control circuit board 32 and the transmitting circuit board 33 is. Therefore, the distance between the main circuit board 32 and the transmitting circuit board 33 can be controlled by controlling the length dimension of the screw hole end of the first stud 352. The distance between the transmitting circuit board 33 and the receiving circuit board 34 is related to the length dimension of the screw hole end of the second stud 353. The longer the screw hole end of the second stud 353 is, the larger the distance between the transmitting circuit board 33 and the receiving circuit board 34 is. The shorter the screw hole end of the second stud 353 is, the smaller the distance between the transmitting circuit board 33 and the receiving circuit board 34 is. Therefore, the distance between the transmitting circuit board 33 and the receiving circuit board 34 can be controlled by controlling the length dimension of the screw hole end of the second stud 353.

[0065] Continue to refer to the attached Figures 2 to 4 , Figures 7 to 10The bracket 31 includes a bottom plate 312, a first outer vertical plate 313, a first inner vertical plate 314, a second inner vertical plate 315 and at least one second outer vertical plate 316. The first outer vertical plate 313, the first inner vertical plate 314, the second inner vertical plate 315 and the second outer vertical plate 316 are installed on the bottom plate 312 at intervals. For example, the first outer vertical plate 313, the first inner vertical plate 314, the second inner vertical plate 315 and the second outer vertical plate 316 can be respectively locked at different positions of the bottom plate 312 by at least one screw, so that the first outer vertical plate 313, the first inner vertical plate 314, the second inner vertical plate 315 and the second outer vertical plate 316 are installed on the bottom plate 312 at intervals.

[0066] The transmitting circuit board 33 is clamped between the first inner vertical plate 314 and the second inner vertical plate 315, and each group of the stud assembly 35 is respectively fixed to the second outer vertical plate 316. That is, the bracket through hole 311 of the bracket 31 is formed on the second outer vertical plate 316, and one end of the second screw 355 extends to the screw hole of one end of the third stud 354 after passing through the bracket through hole 311 formed on the second outer vertical plate 316 of the bracket 31.

[0067] Preferably, the number of the second outer vertical panels 316 is two, one second outer vertical panel 316 is installed at one corner of the bottom plate 312, and the other second outer vertical panel 316 is installed at another corner of the bottom plate 312. In this way, the space between the two second outer vertical panels 316 can be used to avoid electronic components on the surface of the receiving circuit board 34, which is beneficial to reducing the size of the electronic part 30, thereby reducing the size of the sonar, so that the sonar can be lightweight.

[0068] Since the first inner vertical plate 314, the second inner vertical plate 315 and the second outer vertical plate 316 are respectively installed on the bottom plate 312, the transmitting circuit board 33 is clamped between the first inner vertical plate 314 and the second inner vertical plate 315, and the stud assembly 35 is installed on the second outer vertical plate 316, the bracket 31, the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 can form a stable modular electronic part 30. When the modular electronic part 30 is subsequently rotated and the modular electronic part 30 is installed in the accommodating cavity 111 of the electronic cabin 11, the relative positions of the bracket 31, the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 can be avoided from changing, thereby ensuring the reliability of the connection relationship between the main control circuit board 32 and the transmitting circuit board 33 and the connection relationship between the transmitting circuit board 33 and the receiving circuit board 34.

[0069] After the modular electronic part 30 is received in the receiving cavity 111 of the electronic cabin 11 through the opening of the electronic cabin 11, the first outer vertical plate 313 and the second outer vertical plate 316 can be locked to the inner wall of the electronic cabin 11 by screws, so as to fix the bracket 31 on the inner wall of the electronic cabin 11, and the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are received in the receiving cavity 111 of the electronic cabin 11 by the bracket 31.

[0070] Preferably, reference 2 to Figure 4 The sonar further includes a heat-conducting layer 40, which is arranged between the bottom surface of the bottom plate 312 of the bracket 31 and the bottom wall of the electronic cabin 11, and is used to quickly conduct the heat conducted to the bottom plate 312 of the bracket 31 to the electronic cabin 11, so as to improve the heat dissipation capacity of the sonar. In a specific example of the sonar of the present invention, the heat-conducting layer 40 can be graphene, which has a thin thickness and good thermal conductivity, so that it is not only conducive to the miniaturization of the sonar, but also conducive to improving the heat dissipation capacity of the sonar. Optionally, in other examples of the sonar of the present invention, the bottom surface of the bottom plate 312 of the bracket 31 and the bottom wall of the electronic cabin 11 can also be directly attached, that is, the bottom surface of the bottom plate 312 and the bottom wall of the electronic cabin 11 are in surface contact.

[0071] Furthermore, the main control board chip 322 of the main control circuit board 32 is attached to the first outer vertical plate 313 of the bracket 31, so that the heat generated by the main control board chip 322 of the main control circuit board 32 during operation can be directly conducted to the first outer vertical plate 313, and then conducted to the electronic cabin 11 through the bottom plate 312, and the heat is dissipated by the electronic cabin 11 to improve the heat dissipation capacity of the sonar. Preferably, heat dissipation silicone grease is provided between the main control board chip 322 of the main control circuit board 32 and the first outer vertical plate 313. Preferably, the first outer vertical plate 313 has a groove 3131, and the main control board chip 322 of the main control circuit board 32 protrudes into the groove 3131 of the first outer vertical plate 313. In this way, the overall size of the modular electronic part 30 can be reduced to facilitate the miniaturization of the sonar.

[0072] Furthermore, the transmitting board chip 332 on one side of the transmitting circuit board 33 is adhered to the first inner vertical plate 314, and the transmitting board chip 332 on the other side is adhered to the second inner vertical plate 315, so that the transmitting circuit board 33 is clamped between the first inner vertical plate 314 and the second inner vertical plate 315, and the heat generated by the transmitting board chip 332 of the transmitting circuit board 33 during operation can be directly conducted to the first inner vertical plate 314 and the second inner vertical plate 315, and then conducted to the electronic cabin 11 through the bottom plate 312, and the heat is dissipated by the electronic cabin 11 to improve the heat dissipation capacity of the sonar.

[0073] Preferably, refer to the attached Fig. 9 and Fig.10The first inner vertical plate 314 has at least one first channel 3141, the second inner vertical plate 315 has at least one second channel 3151, the conductive connector 36 includes a first connector 361 and a second connector 362, wherein one of the main control circuit board 32 and the transmitting circuit board 33 is mounted with the first connector 361, and the other is mounted with the second connector 362. For example, in a specific example, the first connector 361 is mounted on the main control circuit board 32, and the second connector 362 is mounted on the transmitting circuit board 33. The first connector 361 and the second connector 362 are plugged through the first channel 3141 of the first inner vertical plate 314, so that the first connector 361 and the second connector 362 conduct the main circuit board 32. and the transmitting circuit board 33, so that no flying wire is required between the main control circuit board 32 and the transmitting circuit board 33, wherein one of the transmitting circuit board 33 and the receiving circuit board 34 is mounted with the first connector 361, and the other is mounted with the second connector 362. For example, in a specific example, the transmitting circuit board 33 is mounted with the second connector 362, and the receiving circuit board 34 is mounted with the first connector 361, and the first connector 361 and the second connector 362 are plugged through the second channel 3151 of the second inner vertical plate 315 to connect the transmitting circuit board 33 and the receiving circuit board 34 through the first connector 361 and the second connector 362, so that no flying wire is required between the transmitting circuit board 33 and the receiving circuit board 34.

[0074] It can be understood that since the main control circuit board 32 and the transmitting circuit board 33 as well as the transmitting circuit board 33 and the receiving circuit board 34 can be connected by directly plugging the first connector 361 and the second connector 362 of the conductive connector 36, without the need for flying wires between the main control circuit board 32 and the transmitting circuit board 33 as well as between the transmitting circuit board 33 and the receiving circuit board 34, it can not only ensure the reliability of the conductive relationship between the main control circuit board 32 and the transmitting circuit board 33 as well as between the transmitting circuit board 33 and the receiving circuit board 34, avoid the problem of desoldering of solder joints caused by flying wires during the assembly of the sonar, but also avoid the problem of degradation of the actual performance of the sonar due to poor consistency of solder joints.

[0075] Attached Figures 11 to 22 The assembly process of the sonar is shown, which is as follows.

[0076] Reference Fig.11, install the first outer vertical plate 313 on the bottom plate 312. For example, a set of screws can be used to install the bottom of the first outer vertical plate 313 on one side of the bottom plate 312, so as to install the first outer vertical plate 313 on the bottom plate 312.

[0077] Reference Fig.12 The main control circuit board 32 is arranged on one side of the first outer vertical plate 313 in such a manner that the main control board chip 322 of the main control circuit board 32 protrudes into the groove 3131 of the first outer vertical plate 313 and the surface of the main control board chip 322 is in contact with the first outer vertical plate 313. Preferably, heat dissipation silicone grease is arranged between the main control board chip 322 of the main control circuit board 32 and the first outer vertical plate 313.

[0078] Reference Fig.13 , allowing one end of the first screw 351 to extend to the screw hole of the first stud 352 after passing through the main control board through hole 321 of the main control circuit board 32 and be screwed to the screw hole end of the first stud 352, so that the first stud 352 is installed at the corner of the main control circuit board 32. It can be understood that the attached Fig.13 The steps shown can also be found in the attached Fig.12 Before the steps shown, that is, the first stud 352 is first installed at the corner of the main control circuit board 32 by the first screw 351, and then the main control circuit board 32 is set on one side of the first outer vertical plate 313.

[0079] Continue to refer to the attached Fig.13 , the first inner vertical plate 314 is mounted on the bottom plate 312, wherein the first connector 361 mounted on the main control circuit board 32 passes through the first channel 3141 of the first inner vertical plate 314, or the first connector 361 extends into the first channel 3141 of the first inner vertical plate 314, or the position of the first connector 361 corresponds to the position of the first channel 3141 of the first inner vertical plate 314. For example, a set of screws can be used to mount the bottom of the first inner vertical plate 314 on the bottom plate 312, thereby mounting the first inner vertical plate 314 on the bottom plate 312.

[0080] Reference Fig.14The transmitting circuit board 33 is arranged on one side of the first inner vertical plate 314 in such a manner that the second connector 362 mounted on the transmitting circuit board 33 and the first connector 361 mounted on the main control circuit board 32 are butted against each other and the threaded end of the first stud 352 passes through the transmitting board through hole 331 of the transmitting circuit board 33, wherein the surface of the transmitting board chip 332 located on one side of the transmitting circuit board 33 is in contact with the first inner vertical plate 314. Preferably, heat dissipation silicone grease is arranged between the surface of the transmitting board chip 332 of the transmitting circuit board 33 and the first inner vertical plate 314.

[0081] Reference Fig.15 , allowing the threaded end of the first stud 352 to extend to the screw hole of the second stud 353 and be screwed on the threaded end of the second stud 353, so as to install the second stud 353 on the transmitting circuit board 33. Install the second inner vertical plate 315 on the bottom plate 312, wherein the second connector 362 mounted on the transmitting circuit board 33 penetrates the second channel 3151 of the second inner vertical plate 315, or the second connector 362 extends into the second channel 3151 of the second inner vertical plate 315, or the position of the second connector 362 corresponds to the position of the second channel 3151 of the second inner vertical plate 315, wherein the surface of the transmitting board chip 332 located on the other side of the transmitting circuit board 33 is in contact with the second inner vertical plate 315. Preferably, heat dissipation silicone grease is provided between the surface of the transmitting board chip 332 of the transmitting circuit board 33 and the second inner vertical plate 315. Similar to the installation method of the first inner vertical plate 314 and the bottom plate 312 , a set of screws can be used to install the bottom of the second inner vertical plate 315 on the bottom plate 312 , thereby installing the second inner vertical plate 315 on the bottom plate 312 .

[0082] Reference Fig.16 The receiving circuit board 34 is arranged on one side of the second inner vertical plate 315 in such a manner that the first connector 361 mounted on the receiving circuit board 34 and the second connector 362 mounted on the transmitting circuit board 33 are connected to each other and the threaded end of the second stud 353 passes through the receiving board through hole 341 of the receiving circuit board 34.

[0083] Reference Fig.17 , allowing the threaded end of the second stud 353 to extend to the screw hole of one end of the third stud 354 and be screwed to this end of the third stud 354 to install the third stud 354 on the receiving circuit board 34.

[0084] Reference Fig.18The second outer vertical plate 316 is mounted on the bottom plate 312 in a manner such that the position of the bracket through hole 311 of the bracket 31 provided on the second outer vertical plate 316 corresponds to the position of the screw hole of the third screw 354. For example, a set of screws may be used to mount the second outer vertical plate 316 on the bottom plate 312. One end of the second screw 355 is allowed to extend to the screw hole of the third screw 354 after passing through the bracket through hole 311 of the bracket 31 and be screwed to the end of the third screw 354, so as to mount the third screw 354 on the second outer vertical plate 316.

[0085] By attaching Figures 11 to 18 The steps shown, the modular electronic part 30 is assembled. It can be understood that, on the one hand, the assembly of the electronic part 30 is completed outside the electronic cabin 11, so the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are not limited by the size of the space in the process of installing the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 on the bracket 31, which is convenient for assembling the electronic part 30. On the other hand, the main control circuit board 32 and the transmitting circuit board 33 are connected through the conductive connector 36, and the transmitting circuit board 33 and the receiving circuit board 34 are also connected through the conductive connector 36. Therefore, the sonar does not need to fly wires between the main control circuit board 32 and the transmitting circuit board 33 and between the transmitting circuit board 33 and the receiving circuit board 34, so that the reliability of the conductive relationship between the main control circuit board 32 and the transmitting circuit board 33 and between the transmitting circuit board 33 and the receiving circuit board 34 can be ensured, and the problem of solder joint desoldering caused by flying wires in the process of assembling the sonar can be avoided, and the actual performance of the sonar will not be reduced due to poor consistency of solder joints. In the third aspect, the surface of the main control board chip 322 of the main control circuit board 32 is attached to the first outer vertical plate 313, and the launch board chips 332 on opposite sides of the launch circuit board 33 are attached to the first inner vertical plate 314 and the second inner vertical plate 315 respectively, so that during operation, the heat generated by the main control board chip 322 and the launch board chip 332 can be quickly conducted to the bracket 31. It can be understood that the bottom plate 312, the first outer vertical plate 313, the first inner vertical plate 314, the second inner vertical plate 315 and the second outer vertical plate 316 of the bracket 31 can all be made of metal materials or alloy materials with good thermal conductivity, such as aluminum, copper, aluminum alloy or copper alloy.

[0086] Continue to refer to the attached Fig.19 and Fig. 20After the modular electronic part 30 is connected to the watertight terminal 20, the electronic part 30 is allowed to be received in the receiving cavity 111 through the opening of the electronic cabin 11, and the first outer vertical plate 313 of the bracket 31 is locked to the inner wall of the electronic cabin 11 and the second outer vertical plate 316 is locked to the inner wall of the electronic cabin 11 by at least one screw, so that the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 are received in the receiving cavity 111 of the electronic cabin 11 by the bracket 31. Preferably, before the electronic part 30 is accommodated in the accommodating cavity 111 of the electronic cabin 11, at least one of the bottom surface of the bottom plate 312 of the bracket 31 and the bottom wall of the electronic cabin 11 is provided with graphene, so that after the electronic part 30 is accommodated in the accommodating cavity 111 of the electronic cabin 11, graphene can form the thermal conductive layer 40 between the bottom surface of the bottom plate 312 of the bracket 31 and the bottom wall of the electronic cabin 11.

[0087] Reference Fig.21 and Fig. 22 After the transmitting array 121 and the receiving array 122 are connected to the transmitting circuit board 33 and the receiving circuit board 34 respectively, the top cover 12 is placed on the electronic compartment 11, and the top cover 12 closes the opening of the electronic compartment 11 to complete the assembly of the sonar. According to another aspect of the present invention, the present invention further provides a sonar assembly method, wherein the assembly method comprises the following steps:

[0088] S1, arranging the main control circuit board 32, the transmitting circuit board 33 and the receiving circuit board 34 on the bracket 31 at intervals to assemble the electronic part 30;

[0089] S2, after the electronic part 30 is received in the receiving cavity 111 of the electronic compartment 11 through the opening of the electronic compartment 11 of the housing part 10, the bracket 31 is fixedly mounted on the inner wall of the electronic compartment 11, wherein the main control circuit board 32 is connected to the watertight terminal 20 provided in the electronic compartment 11;

[0090] S3, covering the top cover 12 of the casing portion 10 on the opening of the electronic compartment 11 so that the opening of the electronic compartment 11 is closed by the top cover 12, thereby completing the assembly of the sonar.

[0091] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be modified or altered in any way without departing from the principles.

Claims

1. Sonar, characterized in that, include: Watertight terminals; A modular electronic part, wherein the electronic part includes a bracket, a main control circuit board, a transmitting circuit board, a receiving circuit board and a conductive connector, the conductive connector includes a first connector and a second connector, wherein the bracket includes a base plate and a first outer vertical plate, a first inner vertical plate, a second inner vertical plate and two second outer vertical plates installed on the base plate at intervals, the main control circuit board is arranged on one side of the first outer vertical plate and the main control board chip of the main control circuit board is attached to the first outer vertical plate, the first connector attached to the main control circuit board passes through the first channel of the first inner vertical plate, the transmitting circuit board is arranged between the first inner vertical plate and the second inner vertical plate, and the transmitting board chip on one side of the transmitting circuit board is attached to the second inner vertical plate. The first inner vertical plate, the transmitting board chip on the other side is attached to the second inner vertical plate, the second connector mounted on the transmitting circuit board is connected to the first connector mounted on the main control circuit board, the first connector mounted on the transmitting circuit board passes through the second channel of the second inner vertical plate, the receiving circuit board is arranged on one side of the second inner vertical plate, the second connector mounted on the receiving circuit board is connected to the first connector mounted on the transmitting circuit board, one second outer vertical plate is installed at a corner of the bottom plate, and the other second outer vertical plate is installed at another corner of the bottom plate, and the space between the two second outer vertical plates is used to avoid electronic components on the surface of the receiving circuit board; A casing part, wherein the casing part includes an electronic compartment and a top cover, the electronic compartment has a receiving cavity, after the electronic part is modularized, the bracket is fixedly mounted on the inner wall of the electronic compartment, the main control circuit board, the transmitting circuit board and the receiving circuit board are received in the receiving cavity of the electronic compartment by the bracket, the top cover includes a transmitting array and a receiving array, after the transmitting array is connected to the transmitting circuit board and the receiving array is connected to the receiving circuit board, the top cover is mounted on the electronic compartment and closes the opening of the electronic compartment, wherein the main control circuit board is connected to the watertight terminal; A thermally conductive layer made of graphene, wherein before the modular electronic part is accommodated in the accommodating cavity of the electronic cabin, at least one of the bottom surface of the bottom plate of the bracket and the bottom wall of the electronic cabin is provided with graphene, and after the modular electronic part is accommodated in the accommodating cavity of the electronic cabin and the first outer vertical plate and the second outer vertical plate of the bracket are locked to the inner wall of the electronic cabin, graphene forms the thermally conductive layer between the bottom surface of the bottom plate and the inner wall of the electronic cabin.

2. The sonar according to claim 1, characterized in that: The electronic part includes four groups of stud assemblies, and the four corners of the main control circuit board, the four corners of the transmitting circuit board, the four corners of the receiving circuit board and different positions of the bracket are fixed by the four groups of stud assemblies respectively.

3. The sonar according to claim 2, characterized in that: The stud assembly includes a first stud, a second stud, a third stud, a first screw and a second screw, one end of the first stud and one end of the second stud are screw hole ends, and the other end is a threaded end, the size of the screw hole end is larger than the size of the threaded end, and the opposite ends of the third stud are screw hole ends, one end of the first screw extends to the screw hole of the first stud after passing through the main control board through hole of the main control circuit board and is screwed on the screw hole end of the first stud, the threaded end of the first stud extends to the screw hole of the second stud after passing through the transmitting board through hole of the transmitting circuit board and is screwed on the screw hole end of the second stud, the threaded end of the second stud extends to a screw hole of the third stud after passing through the receiving board through hole of the receiving circuit board and is screwed on this screw hole end of the third stud, and one end of the second screw extends to the screw hole of the other end of the third stud after passing through the bracket through hole of the bracket and is screwed on this screw hole end of the third stud.

4. The sonar according to claim 1, characterized in that: The first outer vertical plate has a groove, and the main control board chip of the main control circuit board protrudes into the groove of the first outer vertical plate.

5. A sonar assembly method, characterized in that: The assembly method comprises the following steps: S1, arranging a main control circuit board, a transmitting circuit board and a receiving circuit board on a bracket at intervals to assemble a modular electronic part, wherein the step S1 further comprises the following steps: S1.1, installing the first outer vertical plate of the bracket on the bottom plate; S1.2, fixedly mounting the main control circuit board on the first outer vertical plate in a manner that allows the main control board chip of the main control circuit board to be attached to the first outer vertical plate; S1.3, mounting a first inner vertical plate of the bracket on the bottom plate, wherein a first connector mounted on the main control circuit board passes through a first channel of the first inner vertical plate; S1.4, the transmitting circuit board is arranged on one side of the first inner vertical plate in such a manner that the second connector mounted on the transmitting circuit board is connected to the first connector mounted on the main control circuit board, wherein the transmitting board chip located on one side of the transmitting circuit board is attached to the first inner vertical plate; S1.5, mounting the second inner vertical plate of the bracket on the bottom plate, wherein the transmitting board chip located on the other side of the transmitting circuit board is attached to the second inner vertical plate and the second connector attached to the transmitting circuit board passes through the second channel of the second inner vertical plate; S1.6, disposing the receiving circuit board on one side of the second inner vertical plate in such a manner that the first connector mounted on the receiving circuit board and the second connector mounted on the transmitting circuit board are connected; S1.7, installing a second outer vertical plate of the bracket at two corners of the bottom plate respectively, and the space between the two second outer vertical plates is used to avoid the electronic components on the surface of the receiving circuit board to assemble the modular electronic part; S2, graphene is laid on at least one of the bottom surface of the bottom plate of the bracket and the bottom wall of the electronic compartment of the cover part; S3, after accommodating the electronic part in the accommodating cavity of the electronic compartment through the opening of the electronic compartment of the cover part, locking the first outer vertical plate and the second outer vertical plate of the bracket to the inner wall of the electronic compartment to fix the bracket to the inner wall of the electronic compartment, wherein graphene forms a heat conductive layer between the bottom surface of the bottom plate and the inner wall of the electronic compartment, and wherein the main control circuit board is connected to a watertight terminal arranged in the electronic compartment; S4, covering the opening of the electronic compartment with the top cover of the casing part so that the opening of the electronic compartment is closed by the top cover, thereby completing the assembly of the sonar.

6. The assembly method according to claim 5, characterized in that: In the step S1, the main control board chip of the main control circuit board is allowed to protrude into the groove of the first outer vertical plate.

7. The assembly method according to claim 5, characterized in that: In the step S1, the main control circuit board, the transmitting circuit board and the receiving circuit board are fixedly mounted on the bracket by a screw assembly.

8. The assembly method according to claim 5, characterized in that: Before step S4, the assembly method further includes the steps of: connecting the transmitting array of the top cover to the transmitting circuit board and connecting the receiving array of the top cover to the receiving circuit board.

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