Manufacturing method of luminescent glass substrate and display device

Abstract

The invention discloses a manufacturing method of a luminescent glass substrate and a display device. The manufacturing method comprises the following steps: providing a glass substrate; a fixing hole is machined in the hollowed-out area, transparent colloid is poured into the fixing hole, and the transparent colloid is solidified to be in a semi-fluid state; arranging a conduction line layer in an area, corresponding to the wiring area, of the first surface, and fixing a to-be-fixed element electrically conducted with the conduction line layer on the conduction line layer; wherein the to-be-fixed element at least comprises a light-emitting unit; and coating a first transparent layer on the first surface, so that the first transparent layer is combined with the transparent colloid in the fixing hole, and the first transparent layer wraps the light-emitting unit. According to the scheme, the connection reliability between the to-be-fixed element and the glass substrate can be improved, and the risk that the to-be-fixed element falls off is reduced.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a method for manufacturing a luminous glass substrate and a display device. Background Art

[0002] At present, when making the upper and lower substrates of LCD panels, there will be glass left after cutting the large glass plate, which will generate considerable waste and increase production costs. Making the remaining glass into glass-based light strips is an effective way to utilize waste and can generate considerable income.

[0003] However, the light strips currently made from glass scraps have low fixing strength between the components (light-emitting units and connectors) bound to the glass substrate by soldering and the glass substrate, and are easily prone to falling off, which increases the rework rate of the light strips and also increases the production cost. Summary of the invention

[0004] The present application provides a method for manufacturing a luminous glass substrate and a display device to solve the problem that components bound to a glass substrate are easily detached from the glass substrate.

[0005] In order to solve the above technical problems, the technical solution provided by this application is:

[0006] A method for manufacturing a luminescent glass substrate is provided, the method comprising:

[0007] A glass substrate is provided; wherein a wiring area and a hollow area are preset on the glass substrate, the hollow area is arranged around the wiring area, and the glass substrate includes a first surface and a second surface opposite to each other;

[0008] Processing a fixing hole in the hollow area, and pouring a transparent colloid into the fixing hole, and waiting for the transparent colloid to solidify into a semi-fluid state;

[0009] Arranging a conductive circuit layer in an area of ​​the first surface corresponding to the routing area, and fixing a to-be-fixed element electrically connected to the conductive circuit layer on the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit;

[0010] A first transparent layer is coated on the first surface so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light emitting unit.

[0011] According to an embodiment of the present application, the step of coating the first transparent layer on the first surface so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light-emitting unit includes:

[0012] Applying a bottom transparent layer on the first surface so that the bottom transparent layer is combined with the transparent colloid in the fixing hole, and waiting for the bottom transparent layer to solidify into a semi-solid state;

[0013] A top transparent layer is coated on the bottom transparent layer solidified to a semi-solid state, so that the top transparent layer wraps the light-emitting unit.

[0014] According to an embodiment of the present application, after the steps of machining a fixing hole in the hollow area and pouring a transparent colloid into the fixing hole and waiting for the transparent colloid to solidify into a semi-fluid state, the manufacturing method further comprises:

[0015] A second transparent layer is coated on the second surface so that the second transparent layer is fused with the transparent colloid in the fixing hole.

[0016] According to one embodiment of the present application, the element to be fixed further includes a connector having pins; and the bottom transparent layer at least wraps the pins of the connector.

[0017] According to one embodiment of the present application, the top transparent layer is coated in a single layer or in multiple layers.

[0018] According to one embodiment of the present application, the fixing hole includes a first end and a second end, and the two ends extend to pass through the first surface and the second surface respectively; or the first end extends to pass through the first surface, and the second end extends to not pass through the second surface.

[0019] According to one embodiment of the present application, the fixing hole includes a first end and a second end, the second end is located on a side of the first end away from the element to be fixed, and the aperture of the second end is larger than the minimum aperture of the fixing hole.

[0020] According to an embodiment of the present application, the step of machining a fixing hole in the hollow area, pouring a transparent colloid into the fixing hole, and waiting for the transparent colloid to solidify into a semi-fluid state comprises:

[0021] Processing fixing holes in the hollow area;

[0022] Arranging the glass substrate with the second surface on top and the first surface on the bottom;

[0023] Pouring a transparent colloid into the fixing hole from a side of the second surface facing away from the first surface, and waiting for the transparent colloid to solidify into a semi-fluid state;

[0024] The step of arranging a conductive circuit layer in an area of ​​the first surface corresponding to the wiring area, and fixing a component to be fixed that is electrically connected to the conductive circuit layer on the conductive circuit layer comprises:

[0025] Turning the glass substrate over so that the first surface is on top and the second surface is on the bottom;

[0026] A conductive circuit layer is arranged in a region of the first surface corresponding to the routing region from a side of the first surface away from the second surface, and a component to be fixed that is electrically connected to the conductive circuit layer is fixed on the conductive circuit layer.

[0027] According to one embodiment of the present application, after the steps of machining a fixing hole in the hollow area and filling the fixing hole with a transparent colloid and allowing the transparent colloid to solidify into a semi-fluid state, the manufacturing method further includes: cleaning the transparent colloid that overflows from the fixing hole to the first surface.

[0028] The present application also provides a display device, including a display panel and a backlight module, wherein the backlight module is electrically connected to the display panel and is used to provide a light source for the display panel; wherein the backlight module includes at least one luminous glass substrate, and the luminous glass substrate is manufactured by the above-mentioned manufacturing method.

[0029] The beneficial effects of this application are:

[0030] The light-emitting glass substrate and its manufacturing method provided by the present application, after the element to be fixed is fixed to the conductive circuit layer, the light-emitting unit of the element to be fixed is wrapped therein by coating the first transparent layer, the first transparent layer has a larger bonding area with the surface of the glass substrate, and the bonding force is greater, so the connection reliability between the light-emitting unit and the glass substrate can be increased, and the risk of the light-emitting unit falling off can be reduced, and the first transparent layer will not affect the outward emission of the light emitted by the light-emitting unit. In addition, a hole is punched on the glass substrate, and a transparent colloid is poured into the hole, so the grip between the first transparent layer coated on the surface of the glass substrate and the glass substrate can be further increased, and the risk of the light-emitting unit falling off can be further reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0032] Figure 1 is a method flow diagram of an exemplary embodiment of a method for manufacturing a luminescent glass substrate of the present application;

[0033] Figure 2 is a process flow diagram of an exemplary embodiment of a method for manufacturing a luminescent glass substrate of the present application;

[0034] Figure 3ais a schematic diagram of the regional division structure of the glass substrate of an embodiment of the present application;

[0035] Figure 3b yes Figure 3a Schematic diagram of the structure after the fixing holes are processed on the glass substrate;

[0036] Figure 4 is a method flow chart of another embodiment of the method for manufacturing a luminescent glass substrate provided by the present application;

[0037] Figure 5 yes Figure 4 A process flow chart corresponding to the method flow chart;

[0038] Figure 6a This is the first embodiment of the fixing hole in the present application;

[0039] Figure 6b This is the second embodiment of the fixing hole in the present application;

[0040] Figure 6c This is the third embodiment of the fixing hole in the present application;

[0041] Figure 6d This is the fourth embodiment of the fixing hole in the present application;

[0042] Figure 6e This is the fifth embodiment of the fixing hole in the present application;

[0043] Figure 7 yes Figure 2 A magnified view of the connector;

[0044] Figure 8 is a method flow chart of another embodiment of the method for manufacturing a luminescent glass substrate provided by the present application;

[0045] Fig. 9 yes Figure 8 A process flow chart corresponding to the method flow chart;

[0046] Fig.10 It is a structural schematic diagram of another embodiment of the glass substrate of the present application.

[0047] Description of reference numerals:

[0048] Glass substrate 100

[0049] First surface 101

[0050] Second surface 102

[0051] Routing area 103

[0052] First District 103a

[0053] District 2 103b

[0054] Hollow area 104

[0055] Fixing hole 105

[0056] First end 105a

[0057] The second end 105b

[0058] Component to be fixed 200

[0059] Light emitting unit 210

[0060] Connector 220

[0061] Pin 221

[0062] Welding foot 222

[0063] First transparent layer 300

[0064] Bottom transparent layer 310

[0065] Top transparent layer 320

[0066] The second transparent layer 400 DETAILED DESCRIPTION

[0067] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0068] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0069] This application provides a method for manufacturing a luminescent glass substrate. Figure 1 and Figure 2 , Figure 1 is a schematic diagram of a method flow of an exemplary embodiment of a method for manufacturing a luminescent glass substrate of the present application, Figure 2 1 is a process flow diagram of an exemplary embodiment of a method for manufacturing a luminescent glass substrate of the present application. Specifically, the method of the present application may include the following steps:

[0070] S1. Provide a glass substrate; wherein a wiring area and a hollow area are preset on the glass substrate, the hollow area is arranged around the wiring area, and the glass substrate includes a first surface and a second surface opposite to each other.

[0071] In the field of liquid crystal panel manufacturing, usually, the substrates of the liquid crystal panel, i.e., the upper substrate and the lower substrate, i.e., the TFT (thin film transistor) substrate and the CF (color film) substrate, are prepared on a large glass plate. After preparing the upper and lower substrates, the remaining glass plate residues do not meet the preparation requirements of the upper and lower substrates due to their shape and size, so a large amount of waste will be caused; in the embodiment of the present application, the scraps left after the glass plate is made into a TFT substrate or a CF substrate can be used as a glass substrate, and the glass substrate is prepared into a luminous glass substrate through subsequent steps, which can not only make use of waste and improve the utilization rate of the glass residues, but also use the glass residues to prepare the luminous glass substrate, and reduce the production cost of the luminous glass substrate. The glass residues are usually in strips.

[0072] The luminous glass substrate made from glass waste can be used as a light source, for example, can be used to provide a backlight source for a display panel, and the display panel can be a panel that requires a backlight source, such as a liquid crystal panel or an electrophoretic panel.

[0073] Figure 2 (a) shows a cross-sectional view of the glass substrate, and Figure 3a , Figure 3a is a schematic diagram of the regional division structure of the glass substrate of an embodiment of the present application, and Figure 3a for Figure 2 In the top view of (a), a wiring area 103 and a hollow area 104 are preset on the glass substrate 100, and the hollow area 104 is arranged around the wiring area 103. The glass substrate 100 includes a first surface 101 and a second surface 102 opposite to each other. It should be noted that the concept of the hollow area 104 in the present application only refers to the area divided on the glass substrate 100, and the hollow area 104 forms a hollow structure with holes in the hollow area by processing and fixing holes in subsequent steps.

[0074] S2. Process a fixing hole in the hollow area, and inject a transparent colloid into the fixing hole, and wait for the transparent colloid to solidify into a semi-fluid state.

[0075] Specifically, see Figure 2 (b) and (c) and Figure 3b , Figure 2 (b) and Figure 3b 1 is a schematic structural diagram of a glass substrate 100 after a fixing hole 105 is processed in an embodiment of the present application. Figure 3b Too Figure 2The top view of (b) is shown in FIG. The fixing hole 105 is processed in the hollow area 104. The fixing hole 105 can be processed by laser cutting or mechanical processing. During mechanical processing, the fixing hole 105 is first positioned, pre-drilled, and then drilled.

[0076] The transparent colloid is a colloid with high permeability, which can melt into a liquid state at a high temperature, and gradually cool and solidify into a liquid state as the temperature decreases. The transparent colloid can be a material such as epoxy resin, or PP (polypropylene) and PC (polycarbonate) containing glass fibers can be added to the epoxy resin. It should be understood that in other embodiments, the transparent colloid is not limited to the characteristics of melting at a high temperature and solidifying at a low temperature, but can also be in a flowing state under normal conditions and gradually solidify in a certain processing environment, such as ultraviolet irradiation.

[0077] S3. Arrange a conductive circuit layer in an area of ​​the first surface corresponding to the wiring area, and fix a to-be-fixed element that is electrically connected to the conductive circuit layer on the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit.

[0078] Specifically, see Figure 2 Middle (d) and Figure 3a The wiring area 103 includes a first area 103a. The light-emitting unit 210 in the component 200 to be fixed is fixed to the conductive circuit layer in the first area 103a. The light-emitting unit 210 can be fixed to the conductive circuit layer by soldering and realize electrical conduction with the conductive circuit layer. A plurality of light-emitting units 210 can be arranged along the length direction of the glass substrate 100 to obtain the required lighting effect. The light-emitting unit 210 can be a LED (light-emitting diode) chip, and the light-emitting unit 210 has a solder foot to connect the conductive circuit layer.

[0079] The glass substrate 100 is divided into a routing area 103 and a hollow area 104. The component 200 to be fixed is installed in the routing area 103, and the fixing hole 105 is processed in the hollow area 104. The hollow area 104 avoids the routing area 103, so that the processing of the fixing hole 105 and the installation of the component 200 to be fixed can be carried out in different areas to avoid mutual influence between the two.

[0080] S4. Coating a first transparent layer on the first surface so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light-emitting unit.

[0081] Specifically, see Figure 2 Middle (e), Figure 2 (e) shows the structure after coating the first transparent layer 300 on the first surface 101. The first transparent layer 300 can be made of the same material as the transparent colloid in the fixing hole 105.

[0082] It can be seen that the manufacturing method of the light-emitting glass substrate provided by the present application, after the element 200 to be fixed is fixed to the conductive circuit layer, the light-emitting unit 210 of the element 200 to be fixed is wrapped therein by coating the first transparent layer 300, and the bonding area of ​​the first transparent layer 300 and the surface of the glass substrate 100 is larger, and the bonding force is greater, so the connection reliability between the light-emitting unit 210 and the glass substrate 100 can be increased, and the risk of the light-emitting unit 210 falling off can be reduced, and the first transparent layer 300 will not affect the outward emission of the light emitted by the light-emitting unit 210. In addition, a hole is punched on the glass substrate 100, and a transparent colloid is poured into the hole, so that the grip between the first transparent layer 300 coated on the surface of the glass substrate 100 and the glass substrate 100 can be further increased, and the risk of the light-emitting unit 210 falling off can be further reduced, and the yield rate of the light-emitting glass substrate can be improved.

[0083] It should be noted that the order of steps S2 and S3 can be exchanged, that is, the conductive circuit layer and the component to be fixed 200 can be arranged first, and then the fixing hole 105 can be processed and the transparent colloid can be poured into the fixing hole 105. Of course, the two steps are not ruled out to be performed simultaneously and crosswise, but it is understandable that since the processing of the fixing hole 105 will produce debris that affects the work of the conductive circuit layer and the component to be fixed 200, it is also possible that the conductive circuit layer and the component to be fixed 200 are damaged in the process of processing the fixing hole 105. It can be chosen to perform step S2 first and then step S3.

[0084] After step S2 is completed, since debris will be generated during the process of machining the fixing holes 105 , the glass substrate 100 after the machining of the fixing holes 105 can be cleaned and dried to prevent the debris from affecting subsequent steps.

[0085] In some embodiments, after completing step S2, the transparent colloid poured into the fixing hole 105 may overflow the fixing hole 105 and remain on the first surface 101, affecting the subsequent step S3 of laying out the conductive circuit layer and the component 200 to be fixed. After step S2 is completed, the transparent colloid remaining on the first surface 101 can be cleaned and the first surface 101 can be flattened so that the first transparent layer 300 can be better laid on the first surface 101.

[0086] The luminescent glass substrate obtained by the manufacturing method of the present application can be used as a light source for a display device, and the display device can be a direct display type or an edge-entry type. When the display device is an edge-entry type, the luminescent glass substrate can be used in conjunction with a light guide plate / diffuser plate. The thickness of the first transparent layer 300 wrapped around the light-emitting unit 210 can reach a preset value. The light guide plate / diffuser plate can be isolated from the light-emitting unit 210 by the first transparent layer 300 to prevent the light guide plate / diffuser plate from directly contacting the light-emitting unit 210 and causing damage to the light-emitting unit 210.

[0087] See also Figure 4 and Figure 5 , Figure 4 is a method flow chart of another embodiment of the method for manufacturing a luminescent glass substrate provided in the present application, Figure 5 yes Figure 4 Specifically, the manufacturing method of this embodiment may include the following steps:

[0088] S1. Provide a glass substrate; wherein a wiring area and a hollow area are preset on the glass substrate, the hollow area is arranged around the wiring area, and the glass substrate includes a first surface and a second surface opposite to each other.

[0089] S2. Process a fixing hole in the hollow area, and inject a transparent colloid into the fixing hole, and wait for the transparent colloid to solidify into a semi-fluid state.

[0090] S3. Arrange a conductive circuit layer in an area of ​​the first surface corresponding to the wiring area, and fix a to-be-fixed element that is electrically connected to the conductive circuit layer on the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit.

[0091] S4. Coating a first transparent layer on the first surface so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light-emitting unit.

[0092] Steps S1 to S3 in this embodiment are the same as those in the previous embodiment and will not be described again here.

[0093] Based on the above embodiment, step S4 of this embodiment includes:

[0094] S41, coating a bottom transparent layer on the first surface so that the bottom transparent layer is combined with the transparent colloid in the fixing hole, and waiting for the bottom transparent layer to solidify into a semi-solid state.

[0095] Figure 5 (e) shows the structure after coating the bottom transparent layer 310 on the first surface 101 , and the bottom transparent layer 310 is combined with the transparent colloid in the fixing hole 105 .

[0096] S42, coating a top transparent layer on the bottom transparent layer solidified to a semi-solid state, so that the top transparent layer wraps the light-emitting unit.

[0097] Figure 5 (f) shows the structure after coating the top transparent layer 320 on the bottom transparent layer 310, and the bottom transparent layer 310 and the top transparent layer 320 together constitute the first transparent layer 300. In this embodiment, the first transparent layer 300 includes the bottom transparent layer 310 and the top transparent layer 320, that is, the first transparent layer 300 is coated twice, which is convenient for controlling the coating amount of the transparent colloid to better control the overall thickness of the transparent colloid. And the top transparent layer 320 is coated after the bottom transparent layer 310 solidifies to a semi-solid state, so that the top transparent layer 320 is easier to combine with the semi-solid bottom transparent layer 310, and the bonding force between the two is better.

[0098] In some embodiments, the top transparent layer 320 can be coated in one layer or in multiple layers. In the case of multiple layers, the fixed element 200 is less likely to loosen during the coating process because if a single layer is used, the coating amount is relatively large. When the layer is coated, only the bottom transparent layer 310 contacts the fixed element 200. The contact area between the bottom transparent layer 310 and the fixed element 200 is small, and the fixed element 200 is prone to loosening. In the case of multiple layers, when the next layer is coated, the previous layer has been coated and fixed to the fixed element 200. Therefore, more parts of the fixed element 200 are fixed during coating, and the fixed element 200 is less likely to loosen.

[0099] See again Figure 3b There are multiple fixing holes 105 set around the routing area 103. The more the number of fixing holes 105 is set, the greater the bonding force between the first transparent layer 300 coated on the first surface 101 and the glass substrate 100 is. The specific number and aperture size of the fixing holes 105 can be designed according to the actual required bonding force between the first transparent layer 300 and the glass substrate 100.

[0100] See also Figures 6a to 6e , Figures 6a to 6e The fixing hole 105 has a plurality of different structures. The fixing hole 105 includes a first end 105a and a second end 105b. The first end 105a and the second end 105b extend to penetrate the first surface 101 and the second surface 102, respectively, that is, the fixing hole 105 is a through hole. Alternatively, the first end 105a extends to penetrate the first surface 101, and the second end 105b extends to not penetrate the second surface 102, that is, the fixing hole 105 is a non-through hole. It can be understood that the process of machining a through hole is simpler than that of machining a non-through hole. The cross-sectional shape of the fixing hole 105 is not limited to a circular, square, or other shapes.

[0101] Figure 6a This is the first embodiment of the fixing hole 105 in the present application. In this embodiment, the aperture of the fixing hole 105 at the first end 105a is smaller than the aperture of the fixing hole 105 at the second end 105b. The shape of the fixing hole 105 is conical, and the aperture of the fixing hole 105 gradually increases from the first end 105a to the second end 105b. Since the transparent colloid is poured into the fixing hole 105 to increase the adhesion between the first transparent layer 300 coated on the first surface 101 and the glass substrate 100, the transparent colloid in the fixing hole 105 should be difficult to be pulled out from the fixing hole 105. The conical structure of the fixing hole 105 in this embodiment makes it difficult for the transparent colloid in the fixing hole 105 to be pulled out, further increasing the connection reliability between the first transparent layer 300 and the glass substrate 100.

[0102] Figure 6b This is the second embodiment of the fixing hole 105 in the present application. In this embodiment, the aperture of the fixing hole 105 at the first end 105a is equal to the aperture of the fixing hole 105 at the second end 105b, and the shape of the fixing hole 105 is an hourglass shape, that is, the aperture of the fixing hole 105 is the smallest in the middle of the fixing hole 105, and gradually increases from the middle of the fixing hole 105 to both ends. The fixing hole 105 of this embodiment is divided into two parts, upper and lower, that is, the fixing hole 105 includes a first part and a second part, and the first part and the second part are two symmetrical frustum-shaped holes. Figure 6b The middle fixing hole 105 is wide at the top and bottom and narrow in the middle, which can ensure that the transparent colloid in the fixing hole 105 is difficult to be pulled out of the fixing hole 105, and can also expand the bonding area between the transparent colloid in the fixing hole 105 and the first transparent layer 300, thereby improving the bonding reliability.

[0103] Figure 6c This is the third embodiment of the fixing hole 105. In this embodiment, the aperture of the first end 105a is equal to the aperture of the second end 105b, and the shape of the fixing hole 105 is waist-shaped, that is, the aperture of the fixing hole 105 is the smallest in the middle of the fixing hole 105, and gradually increases from the middle of the fixing hole 105 to the two ends. This embodiment can also ensure that the transparent colloid in the fixing hole 105 is difficult to be pulled out of the fixing hole 105.

[0104] Figure 6d This is the fourth embodiment of the fixing hole 105 in the present application. Figure 6d The aperture of the first end 105a is smaller than the aperture of the second end 105b, and the shape of the fixing hole 105 is a step shape. This embodiment can also ensure that the transparent colloid in the fixing hole 105 is difficult to be pulled out of the fixing hole 105.

[0105] Figures 6a to 6dThe structures can achieve the effect that the transparent colloid in the fixing hole 105 is difficult to be pulled out from the fixing hole 105. It can be further expanded that as long as the aperture of the fixing hole 105 at the second end 105b is larger than the minimum aperture of the fixing hole 105.

[0106] Figure 6e This is the fifth embodiment of the fixing hole 105 in the present application. The diameter of the fixing hole 105 at the first end 105a is equal to the diameter of the fixing hole 105 at the second end 105b, and the diameter of the fixing hole 105 is the same everywhere. In this embodiment, since the diameter of the fixing hole 105 is the same everywhere, the processing of the fixing hole 105 is simpler.

[0107] When the fixing hole 105 is processed by laser cutting, the specific processing process of the fixing hole 105 is as follows: Figure 6a and Figure 6b Take this as an example to illustrate.

[0108] for Figure 6a In the processing of the fixing hole 105, since the aperture of the fixing hole 105 at the first end 105a is smaller than the aperture of the fixing hole 105 at the second end 105b, and the shape of the fixing hole 105 is conical, in order to facilitate the processing of the fixing hole 105, the glass substrate 100 can be turned over for processing, that is, the second surface 102 of the glass substrate 100 faces upward and the first surface 101 faces downward, so as to facilitate the processing and forming of the conical fixing hole 105. After the fixing hole 105 is processed and formed, the glass substrate 100 is turned over again, so that the first surface 101 of the glass substrate 100 faces upward and the second surface 102 faces downward, so as to facilitate coating the first transparent layer 300 on the first surface 101.

[0109] for Figure 6b To process the fixing hole 105, the second surface 102 of the glass substrate 100 may be facing upward and the first surface 101 may be facing downward, and a first portion of the fixing hole 105 may be laser processed. Then, the glass substrate 100 may be turned over so that the first surface 101 faces upward and the second surface 102 faces downward, and a second portion of the fixing hole 105 may be laser processed. Figure 6b The processing difficulty of the fixing hole 105 is Figure 6a The processing difficulty of the middle fixing hole 105 is greater.

[0110] In some embodiments, refer again to Figure 2 The component 200 to be fixed further includes a connector 220, the wiring area 103 further includes a second area 103b, and the connector 220 is bound to the second area 103b. Figure 5 , Figure 5It is a schematic diagram of the structure of the connector 220 in the embodiment of the present application. The connector 220 has a pin 221 and a solder foot 222. The first transparent layer 300 at least wraps the pin 221 and the solder foot 222 of the connector 220 to prevent them from falling off and loosening. The connector 220 is tightly bound to the glass substrate 100, which can meet the push-pull force requirements required for the plug-in and pull-out operations of the connector 220. In addition, the bottom first transparent layer 300 at least wraps the pin 221 and the solder foot 222 of the connector 220, and the transparent colloid is more likely to flow in the gap between the pin 221 and the solder foot 222. The pin 221 and the solder foot 222 have little resistance to the flow of the transparent colloid, which is conducive to the rapid spreading of the first transparent layer 300, and can also reduce the impact of the transparent colloid on the light-emitting unit 210 and the connector 220 when it is added.

[0111] The connector 220 is also electrically connected to the conductive circuit layer for connecting the light-emitting glass substrate of the present application to the outside. The light-emitting glass substrate of the present application can be connected to an external power source (not shown) through the connector 220 .

[0112] See again Figure 3b Since the connector 220 is more likely to fall off relative to the light-emitting unit 210 when the connector 220 is plugged in or unplugged, in this embodiment, fixing holes 105 are respectively provided at the four corners of the connector 220 to enhance the anti-dropping effect of the connector 220, and the number of fixing holes 105 around the connector 220 can be appropriately increased according to the size of the plug-in and unplug force.

[0113] See also Figure 8 , Figure 8 FIG. 1 is a method flow chart of another embodiment of the method for manufacturing a luminescent glass substrate provided in the present application. Specifically, the manufacturing method of this embodiment may include the following steps:

[0114] S1. Provide a glass substrate; wherein a wiring area and a hollow area are preset on the glass substrate, the hollow area is arranged around the wiring area, and the glass substrate includes a first surface and a second surface opposite to each other.

[0115] S2. Process a fixing hole in the hollow area, and inject a transparent colloid into the fixing hole, and wait for the transparent colloid to solidify into a semi-fluid state.

[0116] S3. Arrange a conductive circuit layer in an area of ​​the first surface corresponding to the wiring area, and fix a to-be-fixed element that is electrically connected to the conductive circuit layer on the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit.

[0117] S4. Coating a first transparent layer on the first surface so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light-emitting unit.

[0118] Steps S1 to S4 in this embodiment are the same as those in the previous embodiment and will not be described again here.

[0119] On the basis of the above embodiment, after step S2, the manufacturing method of this embodiment further includes:

[0120] S5, coating the second transparent layer on the second surface, and making the second transparent layer fuse with the transparent colloid in the fixing hole, and waiting for the second transparent layer to solidify into a solid state.

[0121] See also Figure 8 , Figure 8 is a process flow chart of the manufacturing method of the present application. In this embodiment, the second transparent layer 400 is coated on the second surface 102, and the second transparent layer 400 is fused with the transparent colloid in the fixing hole 105. After the second transparent layer 400 solidifies to a solid state, the transparent colloid is coated on both surfaces of the glass substrate 100 in this embodiment, and the transparent colloids on the two surfaces can be connected through the transparent colloid in the fixing hole 105, further increasing the anti-falling effect between the transparent colloid on the first surface 101 and the first surface 101. Step S5 can be performed after step S3, before step S3, or after step S5. It can be understood that in order to avoid affecting the fixed element 200 when coating the second transparent layer 400 on the second surface 102, it can be adopted Figure 7 and Figure 8 The process shown is performed before step S3.

[0122] In this embodiment, the second surface 102 of the glass substrate 100 can be firstly facing upward and the first surface 101 facing downward. After the fixing hole 105 of the glass substrate 100 is processed and formed, a transparent colloid is poured into the fixing hole 105. After the transparent colloid solidifies into a semi-solid state, the second transparent layer 400 is coated on the second surface 102. After the second transparent layer 400 is completely solidified, the glass substrate 100 is turned over so that the first surface 101 of the glass substrate 100 faces upward and the second surface 102 faces downward, so as to facilitate coating the first transparent layer 300 on the first surface 101.

[0123] See also Fig.10 , Figure 8 1 is a schematic diagram of the structure of another embodiment of the glass substrate in the present application. The luminous glass substrate is generally used for edge-entry display panels, which means that its width is limited, and it is difficult to process complete fixing holes 105 in the hollow area 104. In this embodiment, each fixing hole 105 is located at the edge of the glass substrate 100, and a semicircular hole structure can be adopted. In particular, for some luminous glass substrates with narrow edges, the structure of the fixing holes 105 of this embodiment can be adopted.

[0124] The present application also provides a display device, which includes a display panel and a backlight module, wherein the backlight module is electrically connected to the display panel and is used to provide a light source for the display panel; wherein the backlight module includes at least one luminous glass substrate, and the luminous glass substrate is manufactured by the manufacturing method of the above embodiment. Since the present display device adopts all the technical solutions of the above embodiment, it has at least all the beneficial effects brought by the technical solutions of the above embodiment, which will not be described one by one here. wherein, wherein, the display panel can be a panel that requires a backlight source, such as a liquid crystal panel or an electrophoretic panel.

[0125] The terms "first", "second", "third" in this application are only used for descriptive purposes and cannot be understood as indicating the quantity of the indicated technical features. Thus, the features defined as "first", "second", "third" can expressly or implicitly include at least one of these features. In the embodiments of the present application, all directional indications (such as up, down, left, right, front, back ...) are only used to explain the relative positional relationship, motion conditions, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication also changes accordingly. In addition, the terms "include" and "have" and any of their variations are intended to cover non-exclusive inclusions. The process, method, system, product or equipment such as including a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or equipment.

[0126] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A method for manufacturing a luminescent glass substrate, characterized in that: The production method comprises: A glass substrate is provided; wherein a wiring area and a hollow area are preset on the glass substrate, the hollow area is arranged around the wiring area, and the glass substrate includes a first surface and a second surface opposite to each other; Processing a fixing hole in the hollow area, and pouring a transparent colloid into the fixing hole, and waiting for the transparent colloid to solidify into a semi-fluid state; Arranging a conductive circuit layer in an area of ​​the first surface corresponding to the routing area, and fixing a to-be-fixed element electrically connected to the conductive circuit layer on the conductive circuit layer; wherein the to-be-fixed element at least includes a light-emitting unit; A first transparent layer is coated on the first surface so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light emitting unit.

2. The method for manufacturing a luminescent glass substrate according to claim 1, characterized in that: The step of coating the first transparent layer on the first surface so that the first transparent layer is combined with the transparent colloid in the fixing hole and the first transparent layer wraps the light-emitting unit includes: Applying a bottom transparent layer on the first surface so that the bottom transparent layer is combined with the transparent colloid in the fixing hole, and waiting for the bottom transparent layer to solidify into a semi-solid state; A top transparent layer is coated on the bottom transparent layer solidified to a semi-solid state, so that the top transparent layer wraps the light-emitting unit.

3. The method for manufacturing a luminescent glass substrate according to claim 1, characterized in that: After the steps of machining a fixing hole in the hollow area, pouring a transparent colloid into the fixing hole, and waiting for the transparent colloid to solidify into a semi-fluid state, the manufacturing method further comprises: A second transparent layer is coated on the second surface so that the second transparent layer is fused with the transparent colloid in the fixing hole.

4. The method for manufacturing a luminescent glass substrate according to claim 2, characterized in that: The element to be fixed further comprises a connector having pins; the bottom transparent layer at least wraps the pins of the connector.

5. The method for manufacturing a luminescent glass substrate according to claim 2, characterized in that: The top transparent layer is coated in one layer or in multiple layers.

6. The method for manufacturing a luminescent glass substrate according to claim 1, characterized in that: The fixing hole includes a first end and a second end, and the two ends extend to pass through the first surface and the second surface respectively; or the first end extends to pass through the first surface, and the second end extends to not pass through the second surface.

7. The method for manufacturing a luminescent glass substrate according to claim 1, characterized in that: The fixing hole comprises a first end and a second end, wherein the second end is located at a side of the first end away from the element to be fixed, and the aperture of the second end is larger than the minimum aperture of the fixing hole.

8. The method for manufacturing a luminescent glass substrate according to claim 3, 6 or 7, characterized in that: The step of machining a fixing hole in the hollow area, pouring a transparent colloid into the fixing hole, and waiting for the transparent colloid to solidify into a semi-fluid state comprises: Processing fixing holes in the hollow area; Arranging the glass substrate with the second surface on top and the first surface on the bottom; Pouring a transparent colloid into the fixing hole from a side of the second surface facing away from the first surface, and waiting for the transparent colloid to solidify into a semi-fluid state; The step of arranging a conductive circuit layer in an area of ​​the first surface corresponding to the wiring area, and fixing a component to be fixed that is electrically connected to the conductive circuit layer on the conductive circuit layer comprises: Turning the glass substrate over so that the first surface is on top and the second surface is on the bottom; A conductive circuit layer is arranged in a region of the first surface corresponding to the routing region from a side of the first surface away from the second surface, and a component to be fixed that is electrically connected to the conductive circuit layer is fixed on the conductive circuit layer.

9. The method for manufacturing a luminescent glass substrate according to claim 1, characterized in that: After the steps of machining a fixing hole in the hollow area, filling the fixing hole with a transparent colloid, and waiting for the transparent colloid to solidify into a semi-fluid state, the manufacturing method further comprises: cleaning the transparent colloid overflowing from the fixing hole to the first surface.

10. A display device, characterized in that: It comprises a display panel and a backlight module, wherein the backlight module is electrically connected to the display panel and is used to provide a light source for the display panel; wherein the backlight module comprises at least one luminous glass substrate, and the luminous glass substrate is manufactured by the manufacturing method described in any one of claims 1-9.

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