Storage module temperature control system and method

Abstract

The invention provides a storage module temperature control system and method, and belongs to the technical field of storage module performance test.The system comprises a master controller, a temperature control assembly and a temperature control device, the temperature control assembly comprises a mounting cavity, a heating layer and a heat conduction fan, the mounting cavity is used for providing a test cavity for a storage module, and the heating layer is used for heating the test cavity; the heat conduction fan is arranged on the heating layer in the mounting cavity and is used for disturbing the temperature in the test cavity; the master controller is used for sending the interval target temperature to the temperature control device; the temperature control device is connected with the master control and temperature control assembly. The temperature control device is used for obtaining the temperature of the storage module, comparing the temperature of the storage module with the interval target temperature, and controlling the heating layer to stop heating or improve the heating capacity according to the comparison result. When the high-temperature test of the storage module is carried out, the automatic control of the temperature of the storage module is realized, and the test efficiency is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of storage module performance testing, and relates to a high-temperature testing technology for storage modules, in particular to a storage module temperature control system and method. Background Art

[0002] The storage module is a memory component used to store programs and various data information. It is a collection of many storage units, each of which is arranged in sequence. Each storage unit is composed of a number of binary bits to represent the data stored in the storage unit.

[0003] After the production of the storage module is completed, it must be subjected to a performance test to test whether it has any production defects. Among them, high temperature testing is also one of the important test items in the performance test of the storage module, and its purpose is to ensure the reliability of the storage module when used in a high temperature environment. In the prior art, the high temperature test process of the storage module is: the storage module is placed in a temperature control device, and the target temperature of the equipment is manually set in batches. During the test process, the test status is monitored by manual timed line patrol. After the test is completed, the high temperature control device is manually turned off. Therefore, automated testing cannot be achieved in the prior art, and there is a technical problem of low test efficiency. Summary of the invention

[0004] As described in the above background technology, in the prior art, when performing high-temperature testing of storage modules, automated testing cannot be achieved, resulting in a technical problem of low testing efficiency. To address this technical problem, the present invention proposes a storage module temperature control system and method.

[0005] The present invention sends the interval target temperature to the temperature control device through the main control, and the main control is used to obtain the storage module temperature, compare the storage module temperature with the interval target temperature, and control the heating layer to stop heating or increase the heating capacity of the heating layer according to the comparison result. When performing high-temperature testing of the storage module, automatic control of the storage module temperature is achieved, and the test efficiency is improved.

[0006] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0007] The storage module temperature control system of the present invention comprises: a main control, a temperature control component and a temperature control device.

[0008] The temperature control assembly includes: an installation chamber, a heating layer and a heat-conducting fan, wherein the installation chamber is used to provide a test chamber for the storage module, and the heating layer is used to heat the test chamber; the heat-conducting fan is placed on the heating layer in the installation chamber to disturb the temperature in the test chamber;

[0009] The master control is used to send the interval target temperature to the temperature control device;

[0010] The temperature control device is connected to the main control and the temperature control component respectively; the temperature control device is used to obtain the temperature of the storage module, compare the temperature of the storage module with the interval target temperature, and control the heating layer to stop heating or increase the heating capacity of the heating layer according to the comparison result.

[0011] It is further defined that the temperature control device is also used to control the heating layer to increase the heating capacity when it is determined that the temperature of the storage module is lower than the target temperature of the interval.

[0012] It is further defined that the temperature control assembly further includes: a heat dissipation assembly;

[0013] The temperature control device is also used to control the heat dissipation component to improve the heat dissipation capacity to cool the test cavity of the storage module when it is determined that the temperature of the storage module is greater than the target temperature of the interval;

[0014] or,

[0015] The temperature control device is also used to control the heat dissipation component and the heating layer to stop working and enter a constant temperature state when it is determined that the temperature of the storage module is within the target temperature interval.

[0016] It is further defined that the storage module temperature includes: a first temperature and / or a second temperature,

[0017] The temperature control device is further used to obtain the first temperature of the storage module through a main control;

[0018] The temperature control device is also used to obtain a second temperature through a temperature sensor in the test cavity;

[0019] The temperature control device is also used to determine whether the first temperature is obtained. If so, the first temperature is compared with the interval target temperature to control the heating layer to stop heating or increase the heating capacity of the heating layer; if not, the second temperature is compared with the interval target temperature to control the heating layer to stop heating or increase the heating capacity of the heating layer.

[0020] It is further limited to include: a server;

[0021] The server is used to monitor the temperature control device through the main control to determine whether the test state of the temperature control device is normal;

[0022] The server is used to obtain the interval target temperature and send the interval target temperature to the main control;

[0023] The server is also used to send the test result to the terminal when it is determined that the test state is normal; otherwise, send test abnormality information to the terminal, and send an instruction to stop the heating layer and an instruction to stop the heat dissipation component to the main control.

[0024] It is further defined that the server is also used to obtain an over-temperature threshold and a low-temperature threshold, and send the over-temperature threshold and the low-temperature threshold to the main control;

[0025] The main control is used to compare the temperature of the storage module with the over-temperature threshold and the under-temperature threshold respectively, generate a test status according to the comparison result, and send the test status to the server.

[0026] The storage module temperature control method of the present invention is applied to the above-mentioned storage module temperature control system, comprising:

[0027] Get the target temperature of the interval;

[0028] Collect storage module temperature;

[0029] Controlling the heat-conducting fan to work and disturb the temperature in the test cavity;

[0030] Compare the storage module temperature with the interval target temperature,

[0031] If the storage module temperature is lower than the interval target temperature, controlling the heating layer to increase the heating capacity so as to increase the temperature in the test cavity;

[0032] If the storage module temperature is greater than the interval target temperature, controlling the heat dissipation component to increase the heat dissipation capacity to reduce the temperature in the test cavity;

[0033] If the temperature of the storage module is within the target temperature range, the heat dissipation component and the heating layer are controlled not to work and enter a constant temperature state.

[0034] It is further defined that the controlling the heat dissipation component to improve the heat dissipation capability comprises:

[0035] If the storage module temperature is greater than the interval target temperature and less than or equal to the first set temperature, the temperature control device controls the heat dissipation component to work at 40% of the maximum load;

[0036] If the storage module temperature is greater than the first set temperature and less than or equal to the second set temperature, the temperature control device controls the heat dissipation component to work at 60% of the maximum load;

[0037] If the storage module temperature is greater than the second set temperature, the temperature control device controls the heat dissipation component to work at full load.

[0038] It is further defined that the collecting the storage module temperature includes:

[0039] Determine whether the first temperature is obtained, and if so, use the first temperature as the storage module temperature; otherwise, obtain the second temperature and use the second temperature as the storage module temperature;

[0040] The first temperature refers to the temperature of the storage module obtained by the main control; the second temperature refers to the temperature in the test cavity obtained by the temperature sensor.

[0041] Further restrictions include:

[0042] Get the over-temperature threshold and under-temperature threshold;

[0043] Compare the storage module temperature with the over-temperature threshold and the under-temperature threshold,

[0044] If the storage module temperature is greater than the over-temperature threshold, the test state is an over-temperature state;

[0045] If the storage module temperature is less than the low temperature threshold, the test state is a low temperature state;

[0046] If the storage module temperature is between the over-temperature threshold and the under-temperature threshold, the test status is a normal status.

[0047] Compared with the prior art, the present invention has the following beneficial effects:

[0048] 1. The storage module temperature control system of the present invention sends the interval target temperature to the temperature control device through the main control, and the temperature control device is used to compare the storage module temperature with the interval target temperature, and control the heating layer to stop heating or increase the heating capacity of the heating layer according to the comparison result. When performing high-temperature testing of the storage module, the present invention realizes automatic control of the storage module temperature and improves the test efficiency.

[0049] 2. The temperature control component of the storage module temperature control system of the present invention includes a heat-conducting fan, which can accelerate the air circulation in the test cavity so as to make the temperature disturbance in the test cavity uniform, reduce the difference between the temperature in the test cavity and the temperature of the storage module, and make the temperature in the test cavity closer to the temperature of the storage module. When the temperature in the test cavity is used for high-temperature testing of the storage module, the test results of the high-temperature test can be more accurate.

[0050] 3. The storage module temperature control system of the present invention further includes a heat dissipation component. The temperature control device can also control the heat dissipation component to improve the heat dissipation capacity according to the comparison result between the storage module temperature and the interval target temperature, so as to better control the temperature in the test cavity. The temperature control device can also control the heat dissipation component and the heating layer to stop working and enter a constant temperature state according to the comparison result between the storage module temperature and the interval target temperature, so as to save energy and reduce the test cost.

[0051] 4. The storage module temperature of the present invention includes: a first temperature and / or a second temperature. When the first temperature can be obtained, the first temperature is used as the storage module temperature for comparison. The first temperature is the temperature of the storage module directly obtained by the main control, so that the test result is more accurate; when the first temperature cannot be obtained, the second temperature is used as the storage module temperature for comparison. The second temperature is the temperature in the test cavity obtained by the temperature sensor. Through the disturbance of the heat-conducting fan, the second temperature is closer to the first temperature, which improves the accuracy of the test result. The present invention improves the accuracy of the high-temperature test results of the storage module and the flexibility of temperature selection by automatically selecting the first temperature and / or the second temperature.

[0052] 5. The storage module temperature control system of the present invention has a main control unit that is further used to compare the storage module temperature with the over-temperature threshold and the low-temperature threshold, and to generate a test state according to the comparison result. On the one hand, automatic monitoring of the test state is achieved. The timeliness of abnormal state feedback is improved; on the other hand, when an abnormality is detected in the test state, the temperature control device sends a command to stop the heating layer and sends a command to stop the heat dissipation component to the heat dissipation component, so as to save energy and reduce the test cost.

[0053] 6. The storage module temperature control method of the present invention controls the heat dissipation component to improve the heat dissipation capacity, and controls the workload of the heat dissipation component according to different interval temperatures to save energy and reduce costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a schematic diagram of a temperature control system of a storage module of the present invention;

[0055] Figure 2 It is a structural schematic diagram of the temperature control component;

[0056] Figure 3 It is a schematic diagram of the temperature control component in a test state;

[0057] Figure 4 It is a schematic diagram of the temperature control component not being in a test state;

[0058] Figure 5 A schematic diagram of the working process of the storage module temperature control system of the present invention;

[0059] Figure 6 A schematic diagram of a storage module temperature control method according to the present invention;

[0060] Figure 7 A schematic diagram showing the test status of the server of the present invention;

[0061] 1-temperature control component, 101-heat conduction fan, 102-heat dissipation fan, 103-heat conduction layer, 104-heating layer, 105-thermal insulation board, 106-longitudinal baffle, 107-installation frame, 108-heat dissipation cavity, 109-installation chamber. DETAILED DESCRIPTION

[0062] In order to make the technical solution of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in combination with the embodiments and drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of protection claimed, but merely represents the selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0063] In the prior art, high temperature testing of storage modules is mainly done by manually setting the target temperature, which is prone to human error. The status monitoring of the test equipment is also mainly done by manual scheduled inspections. When problems occur, they cannot be discovered and handled in a timely and effective manner. After the test, the high temperature equipment is manually shut down. During large-scale testing, the equipment may not be shut down in time, resulting in additional energy waste.

[0064] The present invention provides a storage module temperature control system, including: a main control, a temperature control component 1 and a temperature control device, see Figure 2 , Figure 3 and Figure 4 The temperature control component 1 includes a mounting frame 107, a heat-conducting layer 103, a heating layer 104, a heat-conducting fan 101, a heat dissipation component and a longitudinal baffle 106; the mounting frame 107 encloses a mounting chamber 109, and the mounting chamber 109 serves as a test chamber. The heating layer 104 and the heat-conducting fan 101 are both placed in the mounting chamber 109; preferably, the heat-conducting fan 101 is installed on a side of the heating layer 104 close to the mounting chamber 109, and the heat-conducting fan 101 is used to make the temperature disturbance of the air in the mounting chamber 109 uniform, reduce the difference between the temperature in the test chamber and the temperature of the storage module, so that when the temperature in the test chamber is used for high-temperature testing of the storage module, the test result is more accurate. The heating layer 104 is used to heat the temperature of the air in the installation chamber 109; the heating layer 104 is installed on the top of the installation chamber 109; wherein the heating layer 104 is any device that can heat the air in the installation chamber 109, such as an electric heating plate, an electric heating tube or a liquid heater, and the present invention does not make specific restrictions; preferably, in the present invention, the heating layer 104 is an electric heating plate. The heat-conducting layer 103 is arranged between the heat-conducting fan 101 and the heating layer 104. The heat-conducting layer 103 is used to transfer the heat of the heating layer 104, so that the heat transfer is more uniform and avoids local overheating in the test chamber.

[0065] The heat dissipation assembly includes at least two heat dissipation fans 102, and the at least two heat dissipation fans 102 are respectively arranged on opposite sides of the mounting frame 107, and are connected to the mounting chamber 109 to form a heat dissipation channel, wherein the heating layer 104 is not coplanar with the heat dissipation assembly. Specifically, there are two groups of heat dissipation assemblies, and each group of heat dissipation assemblies can be provided with multiple heat dissipation assemblies, for example: each group of heat dissipation assemblies can have 1, 2, 3 or more heat dissipation assemblies. The two groups of heat dissipation assemblies are respectively arranged on opposite sides of the mounting frame 107, and close to one side of the mounting chamber 109. As an embodiment of the present invention, each group of heat dissipation assemblies has 2 heat dissipation assemblies. In the invention, the heat dissipation assembly can be any device such as a heat dissipation fan 102 or a cooler that can realize air heat dissipation in the test chamber, and the present invention does not make specific limitations; preferably, in the present invention, the heat dissipation assembly is a heat dissipation fan 102.

[0066] There are at least two longitudinal baffles 106, and at least two longitudinal baffles 106 are connected to the mounting frame 107, and the longitudinal baffles 106 extend from the top to the bottom of the mounting chamber 109 and extend out of the bottom of the mounting chamber 109; preferably, the setting position of the longitudinal baffle 106 corresponds to the setting position of the heat dissipation component, and the longitudinal baffle 106 is used to separate the heat dissipation component from the mounting chamber 109, so that the sealing effect of the test chamber is better, the heat loss is reduced, and the overall power consumption is reduced. A heat dissipation cavity 108 is formed between the longitudinal baffle 106 and the mounting frame 107, and at least one heat dissipation fan 102 is arranged in the heat dissipation cavity 108; specifically, a group of heat dissipation components is arranged in each heat dissipation cavity 108, and the heat dissipation component includes at least one heat dissipation fan 102. Heat dissipation holes are arranged on the longitudinal baffle 106, and the heat dissipation cavity 108 is connected with the mounting chamber 109 through the heat dissipation holes, thereby forming a heat dissipation channel. Specifically, the heat dissipation holes are arranged at positions corresponding to the positions of the heat dissipation cavity 108 and the installation cavity 109, so that the heat dissipation cavity 108 is connected to the installation cavity 109 through the heat dissipation holes, and the number of heat dissipation holes can be multiple. The heat dissipation cavity 108 formed between the first longitudinal baffle and the installation frame 107 is set as the first heat dissipation cavity, and the heat dissipation cavity 108 formed between the second longitudinal baffle and the installation frame 107 is set as the second heat dissipation cavity, wherein the first heat dissipation cavity, the installation cavity 109 and the second heat dissipation cavity together form a heat dissipation channel.

[0067] A temperature sensor is provided on the heat-conducting fan 101, and the temperature sensor is used to collect the temperature in the test cavity, that is, the second temperature; or a temperature sensing line is provided on one surface of the storage module, and the main control collects the temperature of the storage module, that is, the first temperature, through the temperature sensing line.

[0068] The temperature control assembly 1 also includes a thermal insulation board 105, which is connected to the outside of the mounting frame 107, and the mounting position of the thermal insulation board 105 corresponds to the mounting position of the heating layer 104. The thermal insulation board 105 is used to isolate the heating layer 104 from the external environment to prevent the high temperature of the corresponding part of the heating layer 104 from scalding the test personnel. Preferably, the thermal insulation board 105 is connected to the outside of the mounting frame 107 through a copper column, so that there is a hollow structure between the thermal insulation board 105 and the mounting frame 107.

[0069] In the present invention, the high temperature test range of the storage module is 75°C-85°C.

[0070] See also Figure 1 and Figure 5 The storage module temperature control system of the present invention further includes: a temperature control device is connected to the main control and the temperature control component 1 respectively; and a server is connected to the main control and the temperature control device.

[0071] The server is used to obtain the interval target temperature and send the interval target temperature to the main control; the server is also used to obtain the storage module temperature of the main control, the comparison result of the storage module temperature and the interval target temperature, and the test result, and display the storage module temperature, the comparison result of the storage module temperature and the interval target temperature, and the test result.

[0072] The master control is used to send the interval target temperature to the temperature control device.

[0073] The temperature control device is used to obtain the temperature of the storage module, compare the temperature of the storage module with the target temperature of the interval, and send a heating instruction to the heating layer 104 according to the comparison result, and control the heating layer 104 to stop heating or increase the heating capacity of the heating layer 104. Specifically, when it is determined that the temperature of the storage module is less than the target temperature of the interval, the temperature control device is used to send a heating instruction to the heating layer 104, and control the heating layer 104 to increase the heating capacity, so that the temperature in the test cavity is within the target temperature of the interval, and the interval is kept constant. Among them, increasing the heating capacity means increasing the heat per unit time.

[0074] The temperature control device is also used to send the storage module temperature, the comparison result between the storage module temperature and the interval target temperature, and the test result to the server.

[0075] In the present invention, the temperature control device is also used to determine that the temperature of the storage module is greater than the interval target temperature, send a heat dissipation instruction to the heat dissipation component, control the heat dissipation component to improve the heat dissipation capacity, so as to cool the test cavity of the storage module, so that the temperature in the test cavity is within the interval target temperature, and the interval constant temperature is maintained; or, the temperature control device is also used to control the heat dissipation component and the heating layer 104 to not work and enter a constant temperature state when determining that the temperature of the storage module is within the interval target temperature. Through the disturbance effect of the heat conduction fan 101, the second temperature is closer to the first temperature, thereby improving the accuracy of the test result.

[0076] The temperature control device controls the heating layer 104 to start heating, stop heating, and improve the heating capacity of the heating layer 104, and the temperature control device controls the heat dissipation component to start heat dissipation, stop heat dissipation, and improve the heat dissipation capacity of the heat dissipation component. Therefore, when the storage module is subjected to high temperature testing, automatic control of the storage module temperature is achieved, thereby improving the test efficiency.

[0077] In the present invention, the storage module temperature includes: a first temperature and / or a second temperature, and the temperature control device is further used to obtain the first temperature of the storage module through the main control;

[0078] The temperature control device is also used to obtain the second temperature through the temperature sensor in the test cavity; the temperature control device is also used to determine whether the first temperature is obtained, and if so, the first temperature is compared with the interval target temperature to control the heating layer 104 to stop heating or improve the heating capacity of the heating layer 104; if not, the second temperature is compared with the interval target temperature to control the heating layer 104 to stop heating or improve the heating capacity of the heating layer 104. When the main control can directly obtain the first temperature, the first temperature is used as the storage module temperature for high temperature testing; when the main control cannot directly obtain the first temperature, the second temperature is used as the storage module temperature for high temperature testing, and the second temperature is closer to the first temperature through the disturbance of the heat-conducting fan 101, thereby improving the accuracy of the test results.

[0079] Specifically, when the storage module supports temperature acquisition, that is, a temperature sensing line is set on one surface of the storage module, the temperature control device obtains the first temperature through the main control; when the storage module does not support temperature acquisition, that is, a temperature sensing line is not set on one surface of the storage module, the temperature control device obtains the second temperature through the temperature sensor.

[0080] When it is determined that the test status is normal, the test result is sent to the terminal; otherwise, the test abnormality information is sent to the terminal, and an instruction to stop the heating layer 104 and the heat dissipation component is sent to the main control.

[0081] The server is also used to obtain an over-temperature threshold and a low-temperature threshold, and send the over-temperature threshold and the low-temperature threshold to the main control; the main control is used to compare the storage module temperature with the over-temperature threshold and the low-temperature threshold, generate a test state according to the comparison result, and send the test state to the server. Through the judgment of the test state, on the one hand, automatic monitoring of the test state is realized; on the other hand, when an abnormality is detected in the test state, an instruction to stop the operation of the heating layer 104 is sent to the heating layer 104, and an instruction to stop the operation of the heat dissipation component is sent to the heat dissipation component to save energy and reduce the test cost.

[0082] During the test, the server is also used to monitor the temperature control device through the main control to determine whether the test status of the temperature control device is normal and display the test status. Figure 7 , is the display of the test status during the test process, where orange (A1-2) indicates over-temperature status, purple (A1-3) indicates low-temperature status, and white (A2-2) indicates normal status.

[0083] In the present invention, the start test instruction and the stop test instruction are generated by the server. The server generates the start test instruction and sends the start test instruction to the main control, which sends the start test instruction to the temperature control device to start the high temperature test of the storage module; when the server determines that the test completion condition is reached or the server receives the over-temperature state or low-temperature state sent by the main control, it generates a stop test instruction and sends it to the main control, which sends the stop test instruction to the temperature control device, and the temperature control device controls the temperature control component 1 to stop working and be in low power consumption mode. Among them, the test completion condition refers to the time threshold of the test.

[0084] See also Figure 7 , the green color (A3-2) indicates that the test has passed, and the red color (A1-1) indicates that the test has not passed. The pass and fail are the results generated by the master controller judging whether the data written by the storage module is consistent with the data read by the storage module. If the data written by the storage module is consistent with the data read by the storage module, the test has passed; otherwise, the test has not passed.

[0085] Whether the test process is completed is determined by the main control whether the test completion conditions are met. If the test completion conditions are met, the main control sends a shutdown command to the temperature control device, and the temperature control device controls the temperature control component 1 to stop working and be in a low power consumption state; if the test completion conditions are not met, the test state is maintained until the test ends when the test completion conditions are met.

[0086] In the present invention, the temperature control device communicates with the main control through a serial port, and this communication method can also be a communication protocol supported by both the main control and the temperature control device, such as an Ethernet port, USB, i2C, SPI, etc. The server and the main control use an Ethernet port to communicate, and this communication method can also be a communication protocol supported by both the server and the main control, such as USB, i2C, SPI, etc.

[0087] See also Figure 6 The present invention also provides a storage module temperature control method, which is applied to the above storage module temperature control system, comprising:

[0088] Get the interval target temperature; specifically, start the test, the server gets the interval target temperature, generates a start test instruction, and sends the interval target temperature and the start test instruction to the main control; the main control sends the interval target temperature and the start test instruction to the temperature control device, and the temperature control device controls the operation of the temperature control component 1.

[0089] Collect the storage module temperature; specifically, the main control determines whether the first temperature is obtained. If the first temperature is obtained, the first temperature is sent to the temperature control device as the storage module temperature; otherwise, the temperature control device obtains the second temperature and uses the second temperature as the storage module temperature; wherein the first temperature refers to the temperature of the storage module obtained by the main control; the second temperature refers to the temperature in the test cavity obtained by the temperature sensor.

[0090] The temperature control device controls the heat conduction fan 101 to work, disturbing the temperature in the test cavity;

[0091] The storage module temperature is compared with the interval target temperature. Specifically, the temperature control device compares the storage module temperature with the interval target temperature. If the storage module temperature is lower than the interval target temperature, a heating instruction is sent to the heating layer 104 to control the heating layer 104 to increase the heating capacity so as to increase the temperature in the test cavity. If the storage module temperature is higher than the interval target temperature, a heat dissipation instruction is sent to the heat dissipation component to control the heat dissipation component to increase the heat dissipation capacity so as to reduce the temperature in the test cavity. If the storage module temperature is within the interval target temperature, the heat dissipation component and the heating layer 104 are controlled not to work and enter a constant temperature state.

[0092] The temperature control device sends the storage module temperature, the comparison structure of the storage module temperature and the interval target temperature, and the test results to the server; the server displays the storage module temperature, the comparison structure of the storage module temperature and the interval target temperature, and the test results.

[0093] In the present invention, controlling the heat dissipation component to improve the heat dissipation capacity includes:

[0094] If the storage module temperature is greater than the interval target temperature and less than or equal to the first set temperature, the temperature control device controls the heat dissipation component to work at 40% of the maximum load; if the storage module temperature is greater than the first set temperature and less than or equal to the second set temperature, the temperature control device controls the heat dissipation component to work at 60% of the maximum load; if the storage module temperature is greater than the second set temperature, the temperature control device controls the heat dissipation component to work at full load. The first set temperature refers to the sum of the interval target temperature and the first interval temperature, and the second set temperature refers to the sum of the interval target temperature and the second interval temperature.

[0095] Specifically, the first set temperature and the second set temperature are set and stored in the temperature control device, and the temperature control device is used to compare the storage module temperature, the first set temperature and the second set temperature. If the storage module temperature is greater than the interval target temperature and is less than or equal to the first set temperature, the temperature control device controls the heat dissipation component to operate at 40% of the maximum load; if the storage module temperature is greater than the first set temperature and is less than or equal to the second set temperature, the temperature control device controls the heat dissipation component to operate at 60% of the maximum load; if the storage module temperature is greater than the second set temperature, the temperature control device controls the heat dissipation component to operate at full load.

[0096] The target temperature interval is [-2°C, 2°C], which is determined based on the high temperature test requirements of the storage module; the first interval temperature is (2°C, 4°C]; the second interval temperature is (4°C, 6°C]; the first set temperature and the second set temperature are determined based on the high temperature test experience of the storage module. For those skilled in the art, they can be reasonably adjusted according to specific test conditions. The present invention does not make specific limitations on this, and only gives preferred values.

[0097] When the storage module temperature is greater than 2°C, it is necessary to start cooling; when 4°C ≥ storage module temperature > 2°C, the temperature control device controls the heat dissipation component to work at 40% of the maximum load; when 6°C ≥ storage module temperature > 4°C, the temperature control device controls the heat dissipation component to work at 60% of the maximum load; when the storage module temperature is greater than 6°C, the temperature control device controls the heat dissipation component to work at full load, thereby controlling the workload of the heat dissipation component according to different temperature intervals to save energy and reduce costs.

[0098] When the storage module temperature is less than -2°C, it is necessary to start heating, and the temperature control device controls the heating layer 104 to start heating or increase the heating capacity to heat the test cavity.

[0099] The storage module temperature control method of the present invention further includes:

[0100] Obtaining an over-temperature threshold and a low-temperature threshold; specifically, the server obtains the over-temperature threshold and the low-temperature threshold, and sends the over-temperature threshold and the low-temperature threshold to the master control;

[0101] The storage module temperature is compared with the over-temperature threshold and the low-temperature threshold respectively; specifically, the master controller compares the storage module temperature with the over-temperature threshold and the low-temperature threshold respectively,

[0102] If the storage module temperature is greater than the over-temperature threshold, the test state is an over-temperature state;

[0103] If the storage module temperature is less than the low temperature threshold, the test state is a low temperature state;

[0104] If the storage module temperature is between the over-temperature threshold and the under-temperature threshold, the test status is normal;

[0105] The master sends the test status to the server;

[0106] The server displays the test status;

[0107] The server also needs to generate a stop test instruction according to the over-temperature state or the over-cooling state and send it to the main control; the main control sends the stop test instruction to the temperature control device, and the temperature control device controls the temperature control component 1 to stop working and be in a low power consumption state based on the stop test instruction.

[0108] In the present invention, the constant temperature state refers to an interval constant temperature state, that is, the test cavity is in a constant temperature state within the interval target temperature range.

[0109] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. Storage module temperature control system, characterized in that, include: Main control, temperature control assembly (1) and temperature control device, The temperature control component (1) comprises: an installation chamber (109), a heating layer (104) and a heat-conducting fan (101); the installation chamber (109) is used to provide a test chamber for the storage module; the heating layer (104) is used to heat the test chamber; the heat-conducting fan (101) is placed on the heating layer (104) in the installation chamber (109) and is used to disturb the temperature in the test chamber; The master control is used to send the interval target temperature to the temperature control device; The temperature control device is connected to the main control and the temperature control component (1) respectively; the temperature control device is used to obtain the temperature of the storage module, compare the temperature of the storage module with the interval target temperature, and control the heating layer (104) to stop heating or increase the heating capacity of the heating layer (104) according to the comparison result.

2. The storage module temperature control system according to claim 1, characterized in that: The temperature control device is also used to control the heating layer (104) to improve the heating capacity when it is determined that the temperature of the storage module is lower than the target temperature of the interval.

3. The storage module temperature control system according to claim 1 or 2, characterized in that: The temperature control component (1) further comprises: a heat dissipation component; The temperature control device is also used to control the heat dissipation component to increase the heat dissipation capacity to cool the test cavity of the storage module when it is determined that the temperature of the storage module is greater than the target temperature of the interval; or, The temperature control device is also used to control the heat dissipation component and the heating layer (104) to stop working and enter a constant temperature state when it is determined that the temperature of the storage module is within the target temperature interval.

4. The storage module temperature control system according to claim 3, characterized in that: The storage module temperature includes: a first temperature and / or a second temperature, The temperature control device is further used to obtain the first temperature of the storage module through a main control; The temperature control device is also used to obtain a second temperature through a temperature sensor in the test cavity; The temperature control device is also used to determine whether the first temperature is obtained. If so, the first temperature is compared with the interval target temperature to control the heating layer (104) to stop heating or to increase the heating capacity of the heating layer (104); if not, the second temperature is compared with the interval target temperature to control the heating layer (104) to stop heating or to increase the heating capacity of the heating layer (104).

5. The storage module temperature control system according to claim 4, characterized in that: Also includes: Server, The server is used to monitor the temperature control device through the main control to determine whether the test state of the temperature control device is normal; The server is used to obtain the interval target temperature and send the interval target temperature to the main control; The server is also used to send the test result to the terminal when it is determined that the test state is normal; otherwise, send test abnormality information to the terminal, and send an instruction to stop the heating layer (104) and an instruction to stop the heat dissipation component to the main control.

6. The storage module temperature control system according to claim 5, characterized in that: The server is also used to obtain an over-temperature threshold and a low-temperature threshold, and send the over-temperature threshold and the low-temperature threshold to the main control; The main control is used to compare the temperature of the storage module with the over-temperature threshold and the under-temperature threshold respectively, generate a test status according to the comparison result, and send the test status to the server.

7. A storage module temperature control method, applied to the storage module temperature control system according to claim 6, characterized in that: include: Get the target temperature of the interval; Collect storage module temperature; Controlling the heat-conducting fan (101) to work, thereby disturbing the temperature in the test cavity; Compare the storage module temperature with the interval target temperature, If the storage module temperature is lower than the interval target temperature, controlling the heating layer (104) to increase the heating capacity so as to increase the temperature in the test cavity; If the storage module temperature is greater than the interval target temperature, controlling the heat dissipation component to increase the heat dissipation capacity to reduce the temperature in the test cavity; If the temperature of the storage module is within the target temperature range, the heat dissipation component and the heating layer (104) are controlled to not work and enter a constant temperature state.

8. The storage module temperature control method according to claim 7, characterized in that: The control heat dissipation component improves the heat dissipation capability, including: If the storage module temperature is greater than the interval target temperature and less than or equal to the first set temperature, the temperature control device controls the heat dissipation component to work at 40% of the maximum load; If the storage module temperature is greater than the first set temperature and less than or equal to the second set temperature, the temperature control device controls the heat dissipation component to work at 60% of the maximum load; If the storage module temperature is greater than the second set temperature, the temperature control device controls the heat dissipation component to work at full load.

9. The storage module temperature control method according to claim 7, characterized in that: The collecting and storing module temperature includes: Determine whether the first temperature is obtained, and if so, use the first temperature as the storage module temperature; otherwise, obtain the second temperature and use the second temperature as the storage module temperature; The first temperature refers to the temperature of the storage module obtained by the main control; the second temperature refers to the temperature in the test cavity obtained by the temperature sensor.

10. The storage module temperature control method according to claim 7, characterized in that: Also includes: Get the over-temperature threshold and under-temperature threshold; Compare the storage module temperature with the over-temperature threshold and the under-temperature threshold, If the storage module temperature is greater than the over-temperature threshold, the test state is an over-temperature state; If the storage module temperature is less than the low temperature threshold, the test state is a low temperature state; If the storage module temperature is between the over-temperature threshold and the under-temperature threshold, the test status is a normal status.

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