Environment-friendly halogen-free printed RFID electronic tag production device and production method thereof
In the production process of RFID electronic tags, the chip pins are tilted inclined to connect parallel to the antenna contacts by using the connection position support assembly and the indenter assembly, which solves the problem of blank connection points caused by stress reset, ensures conductive stability and achieves Environmentally friendly and halogen-free production process.
CN119153344APending Publication Date: 2024-12-17SHENZHEN XINYANCHANG INFORMATION TECHNOLOGY CO LTD
Patent Information
- Application Number
- CN202411190218.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-28
- Publication Date
- 2024-12-17
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Figure CN119153344A_ABST
Abstract
The invention discloses an environment-friendly halogen-free printed RFID electronic tag production device and a production method thereof, and particularly relates to the field of electronic tag production, the device comprises a lower rack, an upper rack is installed on the lower rack, a moving platform is installed between the lower rack and the upper rack, a pressure head assembly is installed on the upper rack, and the pressure head assembly is located above the moving platform; the mobile platform comprises a processing table, a chip table is installed on the processing table, the chip table is used for bearing a chip, one side of the chip table is provided with an antenna feeding assembly, the antenna feeding assembly is used for bearing an antenna, and an antenna contact piece of the antenna is located above a pin piece of the chip. According to the invention, the moving block drives the pressing block to downwards press the antenna contact piece to enable the antenna contact piece to incline and to be in parallel butt joint with the pin piece, so that the adhesive space is reduced, the pin piece is tightly connected with the antenna contact piece, blank connection points at the adhesive space due to non-uniform coating of conductive adhesive are avoided, and the conductive stability of a chip and an antenna is ensured.
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Citation Information
Cited By
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