Semiconductor wafer processing turnover mechanism

Abstract

The invention provides a semiconductor wafer processing turnover mechanism, and belongs to the technical field of semiconductor wafers, the semiconductor wafer processing turnover mechanism comprises a turnover motor, a support plate, a positioning plate and a wafer, the support plate is symmetrically provided with a plurality of non-contact suckers, and the semiconductor wafer processing turnover mechanism also comprises a uniform flow support assembly, a drying assembly and an induction assembly; through combination of dynamic balance and top cover supporting, a stable overturning environment is constructed, the wafer overturning precision and efficiency are improved, the damage risk is reduced, meanwhile, an elastic gasket isolates moisture, it is guaranteed that a non-contact suction cup area is dry, and the adsorption stability is enhanced; the air enters the air inlet groove through the gap between the baffle and the top cover and pushes the fan wheel to rotate, the rotation of the fan wheel is beneficial to uniformizing the air flow and guiding the moisture to the drying module for dehumidification, the wafer pollution is reduced, and the adsorption reliability is improved; the sensor monitors humidity in real time, early warns water drop accumulation, facilitates replacement of the drying module, and ensures continuous and stable operation of the system.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor wafers, and in particular to a semiconductor wafer processing flipping mechanism. Background Art

[0002] In today's era of rapid technological development, wafer flipping equipment can be used to flip wafers during semi-testing and flipping. The semiconductor industry has become an important driving force for global economic growth. As the core link of semiconductor manufacturing, the sophistication and technical level of wafer processing are directly related to the quality and efficiency of the entire industry chain. During the processing and testing of semiconductors such as wafers, multiple flippings are usually required to inspect different surfaces.

[0003] After searching, it was found that in the current wafer flipping devices, there are contact and non-contact methods to fix the wafer. The contact method usually directly contacts the wafer surface through a mechanical clamp or suction cup. This contact method may cause scratches, indentations or wear on the wafer surface during a long time or multiple flipping processes, thereby affecting the surface quality of the wafer and the performance of the final product. The performance of the non-contact suction cup is easily affected by the environmental humidity. For example, in wet etching areas, cleaning areas, etc., high humidity may cause the gas fluidity to deteriorate, affecting the stability of the suction cup adsorption, thereby reducing the stability of the wafer during the flipping process.

[0004] How to invent a semiconductor wafer processing flipping mechanism to solve these problems has become an urgent problem to be solved by technical personnel in this field. Summary of the invention

[0005] In order to make up for the above shortcomings, the present invention provides a semiconductor wafer processing flipping mechanism, aiming to solve the problems mentioned in the above background.

[0006] The present invention is achieved in that: The present invention provides a semiconductor wafer processing flip mechanism, comprising a flip motor, a support plate, a positioning plate, an external manipulator and a wafer, wherein the lower side of the flip motor is fixedly connected to the external manipulator, the output end of the flip motor is fixedly connected to a rotating shaft, the end of the rotating shaft is installed with a mounting seat, the support plate is fixedly connected to the mounting seat through the positioning plate, a plurality of non-contact suction cups are symmetrically arranged on the support plate, and further comprising: Flow-uniform support assembly: the flow-uniform support assembly is arranged on the support plate, and the flow-uniform support assembly is used to provide support for the wafer; Drying component: the drying component is arranged inside the uniform flow support component, and the drying component is used to dry the inside of the uniform flow support component; Sensing component: The sensing component is arranged on the uniform flow support component, and the sensing component can judge whether the drying component is saturated when the wafer is flipped.

[0007] Preferably, an air cylinder is fixedly installed on the bottom of the support plate, an air flow passage is provided inside the support plate, a plurality of the non-contact suction cups are connected through the air flow passage, an air delivery port is provided between the air cylinder and the air flow passage, the bottom of the air cylinder is connected to an external air delivery pipeline, an installation groove is provided on the support plate, a position sensor is installed in the installation groove, and the non-contact suction cup is a cyclone type non-contact suction cup.

[0008] Preferably, the uniform flow support assembly includes an elastic gasket and a fan wheel, the elastic gasket is fixedly arranged on the support plate and arranged around the non-contact suction cup, a side of the elastic gasket facing the corresponding non-contact suction cup is through-arranged, a side of the elastic gasket away from the corresponding non-contact suction cup is provided with a plurality of exhaust holes, and an air inlet groove is arranged inside the fan wheel.

[0009] Preferably, the elastic gasket is made of a flexible rubber material, and a plurality of the exhaust holes are distributed in a ring shape along the edge of the elastic gasket, and ends of the exhaust holes penetrate through the side wall of the elastic gasket.

[0010] Preferably, the impeller is located on the inner side of the elastic gasket, a limiting rod is installed on the lower side of the impeller, a positioning slot is provided on the lower side of the impeller, a positioning block matching the positioning slot is provided on the upper end of the limiting rod, the limiting rod is fixedly clamped with the impeller, and the limiting rod passes through the side wall of the support plate and is rotatably connected to the support plate.

[0011] Preferably, a top cover is provided on the top of the impeller, and the top cover is detachable and abuts against the top of the inner cavity of the elastic gasket.

[0012] Preferably, the drying component includes a placement slot and a drying module, the placement slot is located at the center of the impeller, the drying module is placed inside the placement slot, an air guide port is opened on one side of the placement slot facing the air inlet slot, and a baffle is fixedly provided at the air inlet end of the air inlet slot.

[0013] Preferably, the top of the baffle is located above the bottom of the air inlet groove, there is a gap between the baffle and the top cover, and the drying module is made of silica gel.

[0014] Preferably, the sensing component comprises a sensor, and the sensor is arranged on the top cover and located directly above the air inlet groove.

[0015] Preferably, the sensor is arranged on the inner wall of the top cover in the form of a patch, and the sensor is a micro-electromechanical system (MEMS) sensor.

[0016] The beneficial effects of the present invention are: The use of a non-contact suction cup avoids direct contact between the wafer surface and mechanical clamps or traditional suction cups. By combining the dynamic balance mechanism with the support of the top cover, a stable and reliable wafer flipping environment can be formed. In this environment, the wafer can be flipped and processed according to the predetermined trajectory and position without worrying about side tilt problems caused by uneven gas pressure or other factors. This not only improves the accuracy and efficiency of wafer flipping, but also reduces the risk of wafer damage during processing. On the other hand, the non-contact suction cup can be separated from the external processing chamber by an elastic gasket to ensure the relative dryness of the airflow near the non-contact suction cup, avoiding direct contact between the gas and external moisture, thereby improving the adsorption stability.

[0017] The gas enters the air inlet slot through the gap between the baffle and the top cover, and drives the rotation of the fan wheel. The rotation of the fan wheel helps to further even out the airflow. The airflow entering the air inlet slot enters the drying module through the air guide port, which can absorb and lock the moisture in the airflow. The dry airflow after drying is guided out from the exhaust hole, further reducing the adsorption failure or wafer contamination caused by moisture during wafer processing, thereby improving the stability and reliability of wafer adsorption. After the wafer is flipped, the sensor monitors the humidity in the air inlet slot. Once water droplets are found, the system will be reminded to facilitate the operator to replace the drying module in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the overall structure of a semiconductor wafer processing flipping mechanism provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of the structure of a semiconductor wafer processing flipping mechanism during wafer adsorption provided by an embodiment of the present invention; Figure 3 It is a schematic diagram of the right side structure of a semiconductor wafer processing flipping mechanism provided by an embodiment of the present invention when the wafer is adsorbed; Figure 4 It is a schematic diagram of the internal structure of a support plate of a semiconductor wafer processing flipping mechanism provided by an embodiment of the present invention; Figure 5It is a schematic diagram of the distribution structure of a non-contact suction cup of a semiconductor wafer processing flipping mechanism provided by an embodiment of the present invention; Figure 6 It is a schematic diagram of the bottom structure of a support plate of a semiconductor wafer processing flipping mechanism provided by an embodiment of the present invention; Figure 7 It is a schematic structural diagram of a semiconductor wafer processing flip mechanism flow-uniform support component provided by an embodiment of the present invention; Figure 8 It is a schematic diagram of a top cover structure of a semiconductor wafer processing flip mechanism provided by an embodiment of the present invention; Fig. 9 It is a schematic diagram of a partial explosion structure of a semiconductor wafer processing flipping mechanism provided by an embodiment of the present invention; Fig.10 It is a schematic diagram of the installation position structure of a sensor of a semiconductor wafer processing flip mechanism provided by an embodiment of the present invention.

[0020] In the figure: 1. flip motor; 2. mounting base; 3. support plate; 4. positioning plate; 5. elastic gasket; 6. fan wheel; 7. top cover; 8. non-contact suction cup; 9. limit rod; 10. wafer; 11. rotating shaft; 31. mounting slot; 32. position sensor; 51. exhaust hole; 61. air inlet slot; 62. baffle; 63. placement slot; 64. air guide port; 65. positioning slot; 66. drying module; 71. sensor; 81. air cylinder; 82. air outlet; 83. air flow passage; 91. positioning block. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Embodiment 1, refer to Figure 1-Figure 8, a semiconductor wafer processing flipping mechanism, comprising a flipping motor 1, a support plate 3, a positioning plate 4, an external manipulator and a wafer 10, the lower side of the flipping motor 1 is fixedly connected to the external manipulator, which is convenient for moving the wafer 10, and the flipping motor 1 is used as a power source of the flipping mechanism to provide the rotational power required for flipping the wafer 10, the output end of the flipping motor 1 is fixedly connected to a rotating shaft 11, and a mounting seat 2 is installed at the end of the rotating shaft 11, and the support plate 3 is fixedly connected to the mounting seat 2 through the positioning plate 4, and a plurality of non-contact suction cups 8 are symmetrically arranged on the support plate 3, and the wafer 10 can be adsorbed and supported by the support plate 3 and the plurality of non-contact suction cups 8, and then the flipping of the wafer 10 can be controlled by the flipping motor 1, due to the non-contact design, the suction cup will not directly contact the surface of the wafer 10, thereby avoiding possible contamination and damage, this fixing method not only ensures the safety of the wafer 10 during the flipping process, but also allows the wafer 10 to be accurately positioned and moved during the processing process, and also includes: Flow uniformity support assembly: the flow uniformity support assembly is arranged on the support plate 3, and the flow uniformity support assembly is used to provide support for the wafer 10; Drying component: The drying component is arranged inside the uniform flow support component, and is used to dry the inside of the uniform flow support component; Sensing component: The sensing component is disposed on the uniform flow supporting component, and the sensing component can determine whether the drying component is saturated when the wafer 10 is flipped.

[0023] Furthermore, a gas cylinder 81 is fixedly installed at the bottom of the support plate 3, and an air flow passage 83 is arranged inside the support plate 3. Multiple non-contact suction cups 8 are connected through the air flow passage 83 to ensure that each suction cup can obtain a uniform and stable air flow supply. A gas delivery port 82 is arranged between the gas cylinder 81 and the air flow passage 83. These gas delivery ports 82 are channels for air flow from the gas cylinder 81 to enter the air flow passage 83. The bottom of the gas cylinder 81 is connected to an external gas delivery pipeline. The external gas delivery pipeline is responsible for introducing the air flow provided by the air source (such as a vacuum pump or a compressed air source) into the gas cylinder 81, and then transporting it to the non-contact suction cup 8 through the gas delivery port 82 and the air flow passage 83. The support plate 3 is provided with a mounting groove 31, and a position sensor 32 is installed in the mounting groove 31. The position sensor 32 can monitor the position information of the wafer 10 in real time and feed back the information to the control system. The control system adjusts the action of the flip motor 1 and other actuators according to the feedback signal of the position sensor 32 to ensure that the wafer 10 can be flipped and processed according to the predetermined trajectory and position. The non-contact suction cup 8 is a cyclone type non-contact suction cup. The cyclone type non-contact suction cup uses high-speed airflow to generate negative pressure and airflow effects, so that the suction cup can grasp and carry without contacting the target object, reducing the physical contact between the suction cup and the wafer 10 and reducing the risk of contamination.

[0024] Furthermore, the uniform flow support component includes an elastic gasket 5 and a fan wheel 6. The elastic gasket 5 is fixedly arranged on the support plate 3 and is arranged around the non-contact suction cup 8. This layout helps to ensure the uniform distribution of airflow around the suction cup, thereby improving the adsorption effect. A through hole is arranged on one side of the elastic gasket 5 corresponding to the non-contact suction cup 8, and a plurality of exhaust holes 51 are arranged on the side of the elastic gasket 5 away from the corresponding non-contact suction cup 8. An air inlet groove 61 is arranged inside the fan wheel 6. When the wafer 10 is against the elastic gasket 5, a part of the gas in the elastic gasket 5 will act on the fan wheel 6 through the air inlet groove 61, thereby driving the fan wheel 6 to rotate. The rotation of the fan wheel 6 can make the gas between the elastic gasket 5 and the wafer 10 more uniform, so as to improve the adsorption effect, and the other part of the gas will be discharged from the exhaust hole 51.

[0025] It should be noted that the elastic gasket 5 is made of a flexible rubber material, which has good elasticity and sealing properties. It can deform when under pressure to better fit the surface of the wafer 10, while effectively isolating external impurities and gas from entering. A number of exhaust holes 51 are distributed in a ring shape along the edge of the elastic gasket 5, and the ends of the exhaust holes 51 penetrate the side wall of the elastic gasket 5. When the wafer 10 is adsorbed by the non-contact suction cup 8, as the adsorption force increases, the wafer 10 will gradually approach the non-contact suction cup 8, and finally collide with the surface of the elastic gasket 5 below it. Due to the flexibility and compressibility of the elastic gasket 5, the pressure distribution on the surface of the wafer 10 will become more uniform, which helps to reduce the deformation or damage of the wafer 10 caused by uneven pressure during the flipping process. At this time, excess gas will be discharged through the exhaust holes 51. After the wafer 10 is completely adsorbed and in contact with the elastic gasket 5, the entire system will reach a dynamic equilibrium state. At this time, factors such as adsorption force, airflow, pressure distribution and exhaust effect will coordinate with each other to ensure the stability and reliability of the wafer 10 during the flipping process.

[0026] Furthermore, the impeller 6 is located on the inner side of the elastic gasket 5, and a limiting rod 9 is installed on the lower side of the impeller 6. A positioning slot 65 is provided on the lower side of the impeller 6, and a positioning block 91 matching the positioning slot 65 is provided on the upper end of the limiting rod 9. The limiting rod 9 is fixedly engaged with the impeller 6 through the positioning block 91 and the positioning slot 65, thereby achieving the positioning of the impeller 6. The limiting rod 9 passes through the side wall of the support plate 3 and is rotatably connected to the support plate 3 to ensure that the impeller 6 can rotate.

[0027] It should be noted that a top cover 7 is provided on the top of the impeller 6, and the top cover 7 is detachable. The top cover 7 is against the top of the inner cavity of the elastic gasket 5. The top cover 7 can provide support for the elastic gasket 5, thereby supporting the wafer 10, while avoiding contact between the wafer 10 and the top cover 7.

[0028] In this embodiment, an external gas pipeline introduces an air flow from an air source (such as a vacuum pump or a compressed air source) into the gas cylinder 81. The air flow enters the air flow passage 83 inside the support plate 3 through the gas delivery port 82 at the bottom of the gas cylinder 81. These air flow passages 83 evenly distribute the air flow to each non-contact suction cup 8. Each non-contact suction cup 8 (especially a cyclone-type non-contact suction cup) uses high-speed air flow to generate negative pressure and airflow effects, thereby grasping and transporting the wafer 10 without contacting it.

[0029] When the non-contact suction cup 8 moves to under the wafer 10, the negative pressure generated by the suction cup adsorbs the wafer 10. As the adsorption force increases, the wafer 10 gradually approaches and eventually contacts the surface of the elastic gasket 5 below. Due to the flexibility and compressibility of the elastic gasket 5, when the wafer 10 contacts it, the gasket can deform to better fit the surface of the wafer 10, thereby making the pressure distribution on the surface of the wafer 10 more uniform, which helps to reduce deformation or damage caused by uneven pressure during the flipping process of the wafer 10.

[0030] When the wafer 10 is against the elastic gasket 5, a part of the gas in the gasket will act on the fan wheel 6 through the air inlet groove 61, thereby driving the fan wheel 6 to rotate. The rotation of the fan wheel 6 helps to further even the airflow between the elastic gasket 5 and the wafer 10, thereby improving the adsorption effect. In the process of the wafer 10 being adsorbed and contacting with the elastic gasket 5, the excess gas will be discharged through the exhaust holes 51 at the edge of the elastic gasket 5. These exhaust holes 51 are distributed in a ring shape along the edge of the gasket, which helps to ensure uniform discharge of the airflow.

[0031] When the wafer 10 is completely adsorbed and in contact with the elastic gasket 5, the entire system will reach a dynamic equilibrium state. At this time, factors such as the adsorption force, airflow, pressure distribution, rotation of the fan wheel 6 and the exhaust effect will coordinate with each other to ensure the stability and reliability of the wafer 10 during the flipping process; the dynamic balance mechanism ensures that the pressure distribution on the surface of the wafer 10 is uniform and stable during the adsorption process. This is mainly due to the flexibility and compressibility of the elastic gasket 5, which can be adaptively adjusted according to the shape and position of the wafer 10, thereby ensuring that the pressure at each point on the surface of the wafer 10 is roughly equal. At the same time, the rotation of the fan wheel 6 further promotes the uniform distribution of airflow between the wafer 10 and the elastic gasket 5, thereby enhancing the stability and consistency of the adsorption effect.

[0032] Supporting function of the top cover 7: The top cover 7 serves as a supporting structure above the elastic gasket 5. Its design cleverly avoids direct contact with the wafer 10 while providing sufficient supporting force for the wafer 10. This supporting force helps to maintain the stability of the wafer 10 during the flipping process and prevents it from tilting due to air flow fluctuations, mechanical vibrations or other external interference.

[0033] When the wafer 10 is stably adsorbed, the flip motor 1 starts to work, and the output end of the flip motor 1 drives the mounting base 2 and the support plate 3 to rotate together through the rotating shaft 11. As the support plate 3 rotates, the wafer 10 also flips accordingly. Since the wafer 10 is firmly adsorbed on the support plate 3 by the non-contact suction cup 8, the wafer 10 will not slip or move unnecessarily during the flipping process; the flip motor 1 can control the flipping angle according to a preset program or external instructions, which allows the wafer 10 to be flipped multiple times during the processing to meet different processing requirements. When the flip reaches a predetermined angle, the flip motor 1 stops working. At this time, the wafer 10 has completed the flipping action and is ready for the next step of processing or testing.

[0034] On the other hand, the non-contact suction cup 8 can be separated from the wafer 10 processing chamber with higher humidity (wafer 10 processing chamber with higher humidity, such as wet etching area, cleaning area, etc.) by the elastic gasket 5. The sealing effect of the elastic gasket 5 can isolate the non-contact suction cup 8 and the airflow inside it from external moisture, forming a relatively dry working environment. In this way, even if the humidity in the external processing chamber is high, it will not directly affect the airflow quality near the suction cup, thereby ensuring the stability and reliability of the adsorption process.

[0035] In summary, this embodiment combines the dynamic balancing mechanism with the supporting function of the top cover 7 to form a stable and reliable wafer 10 flipping environment. In this environment, the wafer 10 can be flipped and processed according to a predetermined trajectory and position without worrying about the side tilt problem caused by uneven gas pressure or other factors. This not only improves the accuracy and efficiency of the wafer 10 flipping, but also reduces the risk of damage to the wafer 10 during the processing, laying a solid foundation for the subsequent semiconductor manufacturing process; on the other hand, the elastic gasket 5 can be used to separate the non-contact suction cup 8 from the external processing chamber to ensure the relative dryness of the airflow near the non-contact suction cup 8, thereby avoiding the direct contact of the gas with external moisture and improving the adsorption stability.

[0036] Example 2, refer to Figure 7-Figure 9 The drying component includes a placement slot 63 and a drying module 66. The placement slot 63 is located at the center of the impeller 6. The drying module 66 is placed inside the placement slot 63. The drying module 66 can be taken out by removing the top cover 7, which is convenient for replacement. An air guide port 64 is provided on one side of the placement slot 63 facing the air inlet slot 61. The air guide port 64 serves as a channel for the air flow to enter the drying module 66. This layout enables the drying module 66 to directly act on the air flow introduced by the air inlet slot 61, thereby effectively removing moisture from the air flow. A baffle 62 is fixedly provided at the air inlet end of the air inlet slot 61.

[0037] It should be noted that the top of the baffle 62 is located above the bottom of the air inlet groove 61, and there is a gap between the baffle 62 and the top cover 7. Through such a setting, the gas can directly enter the air inlet groove 61 through the gap between the baffle 62 and the top cover 7, which will generate a certain pressure, thereby driving the fan wheel 6 to rotate, and then the moisture inside the elastic gasket 5 can be effectively absorbed in the air inlet groove 61. If there is still moisture in the air inlet groove 61, the moisture may condense into water droplets. However, due to the presence of the baffle 62, these water droplets are effectively blocked inside the air inlet groove 61 and will not flow out directly. The drying module 66 is made of silica gel. The drying module 66 made of silica gel can efficiently absorb and lock moisture in the airflow, ensure that the airflow near the suction cup is dry, and improve the stability of adsorption.

[0038] In this embodiment, external air enters the air inlet groove 61 through the gap between the baffle 62 and the top cover 7. During this process, the gas generates a certain pressure, which drives the rotation of the impeller 6. The airflow entering the air inlet groove 61 enters the drying module 66 through the air guide port 64. In the drying module 66, the silica gel material efficiently absorbs and locks the moisture in the airflow, ensuring that the airflow passing through the drying module 66 becomes dry.

[0039] If there is still moisture that has not been completely removed in the air inlet groove 61, the moisture may condense into water droplets due to temperature drop or pressure change. However, due to the presence of the baffle 62, these water droplets are effectively blocked inside the air inlet groove 61 and will not flow out directly and pollute other components. After long-term use, the drying module 66 may reach a saturated state. At this time, the drying module 66 needs to be replaced or regenerated to ensure its continued effective dehumidification capacity. The drying module 66 can be removed by disassembling the top cover 7 for easy replacement.

[0040] The dry airflow processed by the drying module 66 is guided to the vicinity of the suction cup, providing a stable and dry airflow environment for the adsorption of the wafer 10, which helps to improve the stability and reliability of the adsorption of the wafer 10 and reduce problems such as adsorption failure or wafer 10 contamination caused by moisture.

[0041] Example 3, refer to Figure 8-Figure 10 The sensing component includes a sensor 71, which is arranged on the top cover 7 and located directly above the air inlet groove 61, ensuring that when the wafer 10 is reversed (assuming that the drying module 66 is saturated at this time and a certain amount of water droplets are accumulated in the air inlet groove 61), the water droplets in the air inlet groove 61 will directly fall onto the sensor 71. At this time, the sensor 71 will send a reminder to the system to replace the drying module 66.

[0042] It should be noted that the sensor 71 is attached to the inner wall of the top cover 7 in the form of a patch, which is easy to install and suitable for various complex scenes. The sensor 71 is a micro-electromechanical system (MEMS) sensor. The MEMS sensor is a miniature sensor that integrates a micromechanical structure and an electronic circuit. It has the advantages of small size, light weight, low power consumption, and high precision. MEMS technology can achieve very high measurement accuracy and is suitable for precision detection. Due to its small size, MEMS sensors usually have lower power consumption and are very suitable for battery-powered applications. MEMS sensors can detect very small changes in moisture because their internal micromechanical structure can accurately sense changes in environmental parameters and convert these changes into measurable electrical signals.

[0043] In this embodiment, when the drying module 66 is saturated or fails, a certain amount of water droplets may accumulate in the air inlet groove 61. During the reversal of the wafer 10, these water droplets will fall onto the sensor 71 located directly above the air inlet groove 61 due to gravity. When the water droplets contact the sensor 71, the MEMS sensor immediately senses the change in moisture and generates a corresponding electrical signal. The sensor 71 transmits the detected electrical signal to the control unit of the system. The control unit processes and analyzes these signals to determine whether there are indeed water droplets in the air inlet groove 61. Once it is confirmed that there are water droplets accumulated in the air inlet groove 61 (indicating that the ambient humidity is relatively high at this time), the control unit will immediately send a reminder signal to the system. This reminder signal can appear in the form of sound, light signal or digital information, depending on the design requirements of the system. After receiving the reminder signal, the operator can replace the drying module 66 in time according to the reminder of the system. By replacing the drying module 66, the relative dry state of the gas can be restored, thereby ensuring the continuous and stable operation of the system and the stable adsorption of the wafer 10.

[0044] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0045] It should be noted that the specific model and specifications of the motor need to be selected and determined based on the actual specifications of the device, and the specific selection calculation method adopts the existing technology in this field, so it will not be described in detail.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A semiconductor wafer processing flipping mechanism, comprising a flipping motor (1), a support plate (3), a positioning plate (4), an external manipulator and a wafer (10), wherein the lower side of the flipping motor (1) is fixedly connected to the external manipulator, the output end of the flipping motor (1) is fixedly connected to a rotating shaft (11), the end of the rotating shaft (11) is installed with a mounting seat (2), the support plate (3) is fixedly connected to the mounting seat (2) through the positioning plate (4), and a plurality of non-contact suction cups (8) are symmetrically arranged on the support plate (3), characterized in that: Also includes: A uniform flow support component: the uniform flow support component is arranged on the support plate (3), and the uniform flow support component is used to provide support for the wafer (10); Drying component: the drying component is arranged inside the uniform flow support component, and the drying component is used to dry the inside of the uniform flow support component; Sensing component: the sensing component is arranged on the uniform flow support component, and the sensing component can judge whether the drying component is saturated when the wafer (10) is turned over.

2. A semiconductor wafer processing flipping mechanism according to claim 1, characterized in that: A gas cylinder (81) is fixedly mounted on the bottom of the support plate (3), an air flow passage (83) is provided inside the support plate (3), a plurality of non-contact suction cups (8) are connected via the air flow passage (83), a gas delivery port (82) is provided between the gas cylinder (81) and the air flow passage (83), the bottom of the gas cylinder (81) is connected to an external gas delivery pipeline, a mounting groove (31) is provided on the support plate (3), a position sensor (32) is installed in the mounting groove (31), and the non-contact suction cup (8) is a cyclone type non-contact suction cup.

3. A semiconductor wafer processing flipping mechanism according to claim 1, characterized in that: The uniform flow support assembly comprises an elastic washer (5) and a fan wheel (6); the elastic washer (5) is fixedly arranged on the support plate (3) and arranged around the non-contact suction cup (8); a side of the elastic washer (5) facing the corresponding non-contact suction cup (8) is through-arranged; a side of the elastic washer (5) away from the corresponding non-contact suction cup (8) is provided with a plurality of exhaust holes (51); and an air intake groove (61) is arranged inside the fan wheel (6).

4. A semiconductor wafer processing flipping mechanism according to claim 3, characterized in that: The elastic gasket (5) is made of a flexible rubber material, and a plurality of the exhaust holes (51) are distributed in a ring shape along the edge of the elastic gasket (5), and the ends of the exhaust holes (51) penetrate the side wall of the elastic gasket (5).

5. The semiconductor wafer processing flipping mechanism according to claim 3, characterized in that: The impeller (6) is located on the inner side of the elastic washer (5); a limiting rod (9) is installed on the lower side of the impeller (6); a positioning slot (65) is provided on the lower side of the impeller (6); a positioning block (91) matching the positioning slot (65) is provided on the upper end of the limiting rod (9); the limiting rod (9) is fixedly engaged with the impeller (6); and the limiting rod (9) passes through the side wall of the support plate (3) and is rotatably connected to the support plate (3).

6. A semiconductor wafer processing flipping mechanism according to claim 5, characterized in that: A top cover (7) is provided on the top of the impeller (6); the top cover (7) is detachably provided, and the top cover (7) abuts against the top of the inner cavity of the elastic gasket (5).

7. The semiconductor wafer processing flipping mechanism according to claim 3, characterized in that: The drying component comprises a placement groove (63) and a drying module (66); the placement groove (63) is located at the center of the impeller (6); the drying module (66) is placed inside the placement groove (63); an air guide port (64) is provided on one side of the placement groove (63) facing the air inlet groove (61); and a baffle (62) is fixedly provided at the air inlet end of the air inlet groove (61).

8. The semiconductor wafer processing flipping mechanism according to claim 7, characterized in that: The top of the baffle (62) is located above the bottom of the air inlet groove (61), a gap exists between the baffle (62) and the top cover (7), and the drying module (66) is made of silica gel.

9. The semiconductor wafer processing flipping mechanism according to claim 6, characterized in that: The sensing component comprises a sensor (71), and the sensor (71) is arranged on the top cover (7) and is located directly above the air inlet groove (61).

10. The semiconductor wafer processing flipping mechanism according to claim 9, characterized in that: The sensor (71) is arranged in the form of a patch on the inner wall of the top cover (7), and the sensor (71) is a micro-electromechanical system sensor.

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