Dielectric cavity resonator and filter

By setting the opening structure in the dielectric cavity resonator and using ceramic base and adjustment screw, the problem of coupling between the dual-mode resonator and the metal coaxial resonator is solved, and the coupling of TE mode and TM mode with high Q value is achieved, improving the improvement of The use and applicability of the equipment.

CN119153921AActive Publication Date: 2024-12-17ANHUI TATFOOK TECH CO LTD +1

Patent Information

Application Number
CN202411369571.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2024-12-17
Estimated Expiration
2044-09-27

AI Technical Summary

Technical Problem

The coupling construction of existing dual-mode resonators and metal coaxial resonators is difficult and the coupling effect is poor, resulting in poor usability and applicability.

Method used

A dielectric cavity resonator is designed, by setting an open structure on the dielectric resonator, the resonant frequency of the TE mode and the TM mode is close, and a ceramic base and adjustment screw are introduced into the dielectric cavity resonator to adjust the resonant frequency. Achieve high Q-value coupling between TE and TM modes.

Benefits of technology

The useability and applicability of the dielectric cavity resonator is improved, and the good coupling relationship with the metal coaxial resonator is achieved, which enhances the performance and space utilization of the filter.

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Abstract

The invention relates to the field of communication, and provides a dielectric cavity resonator and a filter. The dielectric cavity resonator comprises a resonator shell and a dielectric resonance piece, and the resonator shell is provided with a first plate and a second plate which are oppositely arranged; the dielectric resonance part is arranged in the resonator shell, one end of the dielectric resonance part is connected to the first plate, the other end of the dielectric resonance part and the second plate are arranged in a spaced mode, the dielectric resonance part is provided with an opening structure, and the opening structure is used for improving the resonant frequency of a TE mode so that the resonant frequency of the TE mode and the resonant frequency of a TM mode can be located in the same frequency band. The dielectric cavity resonator can be used for coupling at least two resonant modes of a TE mode and a TM mode in a single cavity, the dielectric cavity resonator is convenient to construct a coupling relationship with resonators such as a metal coaxial resonator and the like, the coupling effect is relatively good, and the usability, the applicability and the practicability of the dielectric cavity resonator are relatively good.
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Description

Technical Field

[0001] The present application belongs to the field of communication technology, and in particular, relates to a dielectric cavity resonator and a filter. Background Art

[0002] A dual-mode resonator is a resonator that can generate two frequency-stable oscillation signals at the same time. A dual-mode resonator can support two resonance modes within its passband. The most common dual-mode resonator at present is the HE dual-mode resonator. However, the HE dual-mode resonator uses two orthogonal modes, HE (Hybrid Electromagnetic Mode), and the coupling between the HE mode and the TEM (Transverse Electric and Magnetic Field) mode is difficult, which makes it difficult to construct the coupling between the HE dual-mode resonator and resonators such as metal coaxial resonators, and the coupling effect is poor, resulting in poor usability and applicability of the HE dual-mode resonator. Summary of the invention

[0003] The embodiments of the present application provide a dielectric cavity resonator and a filter, which are intended to solve the problems that the coupling construction of existing dual-mode resonators and resonators such as metal coaxial resonators is difficult and the coupling effect is poor, and the usability and applicability are poor.

[0004] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is:

[0005] In a first aspect, a dielectric cavity resonator is provided, comprising:

[0006] The resonator housing has a first plate member and a second plate member disposed opposite to each other;

[0007] A dielectric resonator is arranged in the resonator housing, one end of the dielectric resonator is connected to the first plate, the other end of the dielectric resonator is spaced apart from the second plate, and the dielectric resonator is provided with an opening structure, which is used to increase the resonant frequency of the TE mode so that the resonant frequency of the TE mode and the resonant frequency of the TM mode are in the same frequency band.

[0008] In some embodiments, the opening structure is disposed close to the outer circumference of the dielectric resonator and away from the central axis of the dielectric resonator.

[0009] In some embodiments, the opening structure includes at least one of an opening and a groove.

[0010] In some embodiments, the opening structure is connected to at least one end surface of the dielectric resonator along the axial direction of the dielectric resonator.

[0011] In some embodiments, the opening structure includes a first opening opened on the end surface of the dielectric resonator, and the first opening is provided between the outer peripheral surface of the dielectric resonator and the central axis of the dielectric resonator;

[0012] And / or, the opening structure includes a second opening opened at the periphery of the dielectric resonator, the second opening being connected to the outer peripheral surface of the dielectric resonator and at least one end surface of the dielectric resonator;

[0013] And / or, the opening structure includes a third opening opened on the outer peripheral surface of the dielectric resonator, and the third opening is arranged between two end surfaces of the dielectric resonator.

[0014] In some embodiments, the first plate has a grounding component, the opening structure includes an annular recess, the annular recess is continuously or discontinuously surrounded in an annular shape, the central axis of the annular recess coincides with the central axis of the dielectric resonator, the bottom of the annular recess is closed, and the grounding component closes the notch of the annular recess, so that the resonant frequency of the HE dual mode is in the same frequency band as the resonant frequency of the TE mode and the resonant frequency of the TM mode.

[0015] In some embodiments, the dielectric resonator comprises a plurality of dielectric layers arranged in sequence along its axial direction; along a direction approaching the first plate, a cross-sectional size of each dielectric layer is gradually reduced.

[0016] In some embodiments, the first plate member is provided with a bottom platform protruding therefrom, and the dielectric resonator is connected to the bottom platform.

[0017] In some embodiments, the opening structure is opened at the periphery of the dielectric resonator, and the opening structure is connected to the end surface of the dielectric resonator facing the first plate; or,

[0018] The opening structure is opened on the end surface of the dielectric resonator facing the first plate.

[0019] In some embodiments, the dielectric cavity resonator includes a ceramic base, and the ceramic base is separately connected between the dielectric resonator and the first plate.

[0020] In some embodiments, a receiving groove is provided on the side of the ceramic base facing the dielectric resonator, a fastening hole is passed through the bottom of the receiving groove, the ceramic base is connected to the first plate by a fastener passing through the fastening hole, the fastener does not protrude from the notch of the receiving groove, and the ceramic base abuts and is fixedly connected to the dielectric resonator.

[0021] In some embodiments, the dielectric resonator is a rotationally symmetric structure.

[0022] In some embodiments, the dielectric cavity resonator includes an adjusting screw, which is threadedly connected to the resonator housing and is used to adjust the resonant frequency of the TM mode.

[0023] In some embodiments, the dielectric cavity resonator includes a metal disk and an insulating member, the metal disk and the dielectric resonator are arranged opposite to each other along the axial direction of the dielectric resonator, the metal disk is connected to the second plate through the insulating member, and the distance between the metal disk and the dielectric resonator is adjustable for adjusting the resonant frequency of the TE mode.

[0024] In some embodiments, the metal disk is in the shape of a circular disk, the outer peripheral wall of the insulating member is provided with an external thread, the insulating member is connected to the center of the metal disk and is threadedly connected to the second plate member.

[0025] In a second aspect, a filter is provided, comprising the dielectric cavity resonator provided in an embodiment of the present application.

[0026] The dielectric cavity resonator provided by the present application has the following beneficial effects:

[0027] The dielectric cavity resonator provided in the embodiment of the present application can be provided with an opening structure in the dielectric resonator to locally thin the dielectric resonator, especially to reduce or even return the thickness of the portion of the dielectric resonator corresponding to the opening structure along the axial and radial directions thereof, thereby increasing the resonant frequency of the TE mode, making the resonant frequency of the TE mode close to the resonant frequency of the TM mode, and making the resonant frequency of the TE mode and the resonant frequency of the TM mode within the passband and close to the same frequency band. Thus, the dielectric cavity resonator can couple at least two orthogonal high-Q (Quality Factor) resonant modes of the TE mode and the TM mode in a single cavity, and can build a coupling relationship with resonators such as metal coaxial resonators based on the TE mode and the TM mode, and the coupling effect will be better, thereby making the usability, applicability and practicality of the dielectric cavity resonator better. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 A three-dimensional schematic diagram of a dielectric cavity resonator provided in some embodiments of the present application;

[0030] Figure 2 for Figure 1 A cross-sectional view of a dielectric cavity resonator is provided;

[0031] Figure 3 for Figure 2 An exploded schematic diagram of a dielectric resonator, a ceramic base, and a fastener is provided, wherein the opening structure includes a first opening, and the first opening includes a plurality of first holes;

[0032] Figure 4 A cross-sectional view of a dielectric cavity resonator provided in some other embodiments of the present application, wherein the opening structure includes a first opening and a second opening, the first opening includes a first annular groove, and the second opening includes a second annular groove;

[0033] Figure 5 for Figure 4 A three-dimensional schematic diagram of a dielectric resonator is provided;

[0034] Figure 6 A cross-sectional view of a dielectric cavity resonator provided in some other embodiments of the present application, wherein the opening structure includes a second opening, and the second opening includes a second annular groove;

[0035] Figure 7 for Figure 6 A three-dimensional schematic diagram of a dielectric resonator is provided;

[0036] Figure 8 A three-dimensional schematic diagram of a dielectric resonator provided in some other embodiments of the present application, wherein the opening structure includes a second opening, and the second opening includes a plurality of strip-shaped grooves;

[0037] Fig. 9 A cross-sectional view of a dielectric cavity resonator provided in some other embodiments of the present application, wherein the opening structure includes a third opening, and the third opening includes a second hole;

[0038] Fig.10 A cross-sectional view of a dielectric cavity resonator provided in some other embodiments of the present application, wherein the opening structure includes a third opening, and the third opening includes a third annular groove.

[0039] Among them, the reference numerals in the figure are:

[0040] 10-resonator shell, 11-first plate, 111-base, 12-second plate, 121-first threaded hole, 122-second threaded hole, 13-resonance cavity; 20-dielectric resonator, 21-opening structure, 211-first opening, 212-second opening, 213-third opening, 2111-first hole, 2112-first annular groove, 2121-second annular groove, 2122-strip groove, 2131-second hole, 2132-third annular groove, 22-dielectric layer, 23-center hole; 30-ceramic base, 31-accommodating groove, 32-fastening hole, 40-fastener, 50-adjusting screw, 60-metal disk, 61-through hole, 70-insulating member, y-first direction, L-central axis of the dielectric resonator. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clear, the present application is described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. If there is no special description, all implementation methods and optional implementation methods of the present application can be combined with each other to form a new technical solution. If there is no special description, all technical features and optional technical features of the present application can be combined with each other to form a new technical solution.

[0042] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] In the present application, "central axis" refers to a line passing through the geometrical center line of the corresponding structure.

[0046] In the present application, "axial" refers to the extension direction of the central axis of the corresponding structure, "radial" refers to any direction of the corresponding structure passing through the central axis and perpendicular to the central axis, and "circumferential" refers to the circumferential direction of the outer peripheral surface of the corresponding structure.

[0047] A single-mode resonator supports only one resonant mode (e.g., TE (Transverse Electric) mode, TM (Transverse Magnetic) mode, TEM (Transverse Electric and Magnetic Field) mode, etc.) within its passband. For example, a metal coaxial resonator is a single-mode resonator, and the metal coaxial resonator supports only the TEM mode within its passband.

[0048] A dual-mode resonator is a resonator that can generate two frequency-stable oscillation signals at the same time. A dual-mode resonator can support two resonance modes within its passband. The most common dual-mode resonator at present is the HE dual-mode resonator. However, the HE dual-mode resonator uses two orthogonal modes of HE (Hybrid Electromagnetic Mode). The coupling of the HE mode with the TEM mode, TM mode, TE mode and other modes is difficult, which makes it difficult to construct the coupling between the HE dual-mode resonator and resonators such as metal coaxial resonators, and the coupling effect is poor, resulting in poor usability and applicability of the HE dual-mode resonator.

[0049] Therefore, an embodiment of the present application provides a dielectric cavity resonator, which can couple at least two orthogonal resonance modes of TE mode and TM mode in a single cavity. The dielectric cavity resonator is easy to establish a coupling relationship with resonators such as metal coaxial resonators and the coupling effect is better. The dielectric cavity resonator has better usability, applicability and practicality.

[0050] The specific implementation of this application is described in detail below in conjunction with specific embodiments:

[0051] See also Figure 1 , Figure 2 , Figure 3 Some embodiments of the present application provide a dielectric cavity resonator. The dielectric cavity resonator includes a resonator housing 10 and a dielectric resonator 20. The resonator housing 10 has a first plate 11 and a second plate 12 that are arranged opposite to each other. The dielectric resonator 20 is arranged in the resonator housing 10. One end of the dielectric resonator 20 is connected to the first plate 11. The other end of the dielectric resonator 20 is spaced apart from the second plate 12. The dielectric resonator 20 is provided with an opening structure 21. The opening structure 21 is used to increase the resonant frequency of the TE mode so that the resonant frequency of the TE mode is in the same frequency band as the resonant frequency of the TM mode.

[0052] It should be noted that the dielectric cavity resonator provided in the present application can couple at least two orthogonal resonant modes of TE mode and TM mode in a single cavity, that is, while the dielectric cavity resonator couples the TE mode and the TM mode, the dielectric cavity resonator can also couple other modes except the TE mode and the TM mode, or may not couple other modes except the TE mode and the TM mode. When the dielectric cavity resonator only couples the two resonant modes of TE mode and TM mode in a single cavity, the dielectric cavity resonator is a TE-TM dual-mode resonator; when the dielectric cavity resonator couples the two resonant modes of TE mode and TM mode in a single cavity, and also couples other resonant modes (such as HE mode), the dielectric cavity resonator is a multi-mode resonator (such as a three-mode resonator or a four-mode resonator).

[0053] It should also be noted that the resonator housing 10 has a resonant cavity 13 (which may be an air cavity) inside, and the resonant cavity 13 may be, but is not limited to, a rectangular resonant cavity, a square resonant cavity, a polygonal columnar resonant cavity, a cylindrical resonant cavity, etc. The resonant cavity 13 may contain a dielectric resonator 20. Optionally, the dielectric resonator 20 may be arranged centrally in the resonant cavity 13. The resonator housing 10 may realize a shielding function to prevent signal leakage.

[0054] The plate on one side of the resonator housing 10 is the first plate 11, and the plate on the side of the resonator housing 10 opposite to the first plate 11 is the second plate 12. In actual application scenarios, the resonator housing 10 can be placed with the second plate 12 facing upward, or with the second plate 12 facing left, right, front or back. In addition, the shape, size, material, etc. of the resonator housing 10 can be flexibly set as needed.

[0055] It should also be noted that the dielectric resonator 20 is a resonator made of dielectric material, and can be a ceramic dielectric resonator or a dielectric resonator made of other materials.

[0056] One end of the dielectric resonator 20 along its axial direction is connected to the first plate 11. The other end of the dielectric resonator 20 along its axial direction (i.e., the end of the dielectric resonator 20 close to the second plate 12) is spaced apart from the second plate 12. The dielectric resonator 20 can be directly connected and fixed to the first plate 11 by, but not limited to, welding, bonding, riveting, crimping, plugging, screwing, threading, clamping, etc., or can be indirectly connected and fixed to the first plate 11 by other structures connected thereto (e.g., base 111, ceramic base 30, coupling ribs, etc.).

[0057] The dielectric resonator 20 may be in a shape of, but not limited to, a column, a block, a rod, etc., the cross-sectional shape of the dielectric resonator 20 perpendicular to its axial direction may be in a shape of, but not limited to, a circle, a rectangle, a square, a polygon, a petal, a cross, etc., the cross-sectional shape of the dielectric resonator 20 parallel to its axial direction may also be in a shape of, but not limited to, a circle, a rectangle, a square, a polygon, a petal, a cross, etc. A center hole 23 may be provided at the center axis L of the dielectric resonator 20, or may not be provided.

[0058] It should also be noted that the spacing arrangement direction of the first plate 11 and the second plate 12 is defined as the first direction y. In the present application, after the dielectric resonator 20 is installed in the resonant cavity 13, the central axis L of the dielectric resonator 20 is parallel to or substantially parallel to the first direction y. That is, after the dielectric resonator 20 is installed in the resonant cavity 13, the axial direction of the dielectric resonator 20 is parallel to or substantially parallel to the first direction y.

[0059] It should also be noted that in the present application, the two end faces of the dielectric resonator 20 refer to two end faces opposite to each other along the axial direction of the dielectric resonator 20 , and the outer peripheral surface of the dielectric resonator 20 refers to the peripheral surface connected to the two end faces of the dielectric resonator 20 .

[0060] It should also be noted that when the dielectric resonator 20 is not provided with the opening structure 21, the resonant frequency of the TE mode will be at a low frequency, and the resonant frequency of the TM mode will be at a high frequency, that is, the resonant frequency of the TE mode is lower than the resonant frequency of the TM mode and is outside the passband range.

[0061] In order to make the resonance frequency of the TE mode close to the resonance frequency of the TM mode, in this embodiment, an opening structure 21 is provided on the dielectric resonator 20, so that the portion of the dielectric resonator 20 where the opening structure 21 is provided is hollowed out.

[0062] Since the electric field of the TE mode is distributed in a horizontal (i.e., parallel to the orientation of the first plate 11) annular shape and the magnetic field is distributed in a vertical (i.e., perpendicular to the orientation of the first plate 11) annular shape, the electric field of the TE mode will be more concentrated around the peripheral side of the dielectric resonator 20. Since the magnetic field of the TM mode is distributed in a horizontal annular shape and the electric field is distributed in a vertical annular shape, the electric field of the TM mode will be more concentrated at the central axis L of the dielectric resonator 20.

[0063] Therefore, based on the opening structure 21, the dielectric resonator 20 can be partially thinned, and in particular, the thickness (i.e., the axial dimension) of the portion of the dielectric resonator 20 corresponding to the opening structure 21 along its axial direction can be reduced or even returned to zero, thereby improving the resonant frequency of the TE mode. Correspondingly, when the size of the portion of the dielectric resonator 20 corresponding to the opening structure 21 along its axial direction is reduced, the size of the portion of the dielectric resonator 20 corresponding to the opening structure 21 along its radial direction is also reduced accordingly. Based on this, the resonant frequency of the TE mode can be finely improved by accurately designing the form (e.g., groove-shaped, hole-shaped, etc.), shape (e.g., ring-shaped, circular, rectangular, elliptical, etc.), size (e.g., depth, width, length, etc.), position, etc. of the opening structure 21, thereby causing the resonant frequency of the TE mode to be close to the resonant frequency of the TM mode, close to the same frequency band, and within the passband range.

[0064] In summary, the dielectric cavity resonator provided in the embodiment of the present application can be provided with an opening structure 21 in the dielectric resonator 20 so as to locally thin the dielectric resonator 20, especially to reduce or even return the thickness of the portion of the dielectric resonator 20 corresponding to the opening structure 21 along its axial and radial directions, thereby increasing the resonant frequency of the TE mode, and making the resonant frequency of the TE mode close to the resonant frequency of the TM mode, and making the resonant frequency of the TE mode and the resonant frequency of the TM mode within the passband and close to the same frequency band. Thus, the dielectric cavity resonator can couple at least two orthogonal high-Q resonant modes of the TE mode and the TM mode in a single cavity, and can build a coupling relationship with resonators such as metal coaxial resonators based on the TE mode and the TM mode, and the coupling effect will be better, thereby making the usability, applicability and practicality of the dielectric cavity resonator better.

[0065] Furthermore, since the dielectric cavity resonator can achieve at least two-order filtering effects, it can be equivalent to the filtering effect of at least two single-mode resonators connected in series, that is, equivalent to the filtering effect of at least two microwave resonators, thereby improving the performance and space utilization of the dielectric cavity resonator. In addition, the dielectric cavity resonator is small in size, which is conducive to miniaturization and lightweight design.

[0066] Furthermore, when the dielectric cavity resonator couples only the TE mode and the TM mode in a single cavity, that is, when the dielectric cavity resonator is a TE-TM dual-mode resonator, the opening structure 21 not only has the function of increasing the TE mode resonant frequency, but also has the function of pushing the HE mode resonant frequency away. Based on this, the resonant frequency of the HE mode originally outside the passband range can be further pushed away to reduce interference from the HE mode, thereby enabling the TE-TM dual-mode resonator to couple only the TE mode and the TM mode, but not the HE mode, and when the dielectric cavity resonator is a TE-TM dual-mode resonator, the performance of the dielectric cavity resonator can be optimized.

[0067] See also Figure 3 , Figure 4 In some embodiments of the present application, the opening structure 21 is disposed close to the outer peripheral surface of the dielectric resonator 20 and away from the central axis L of the dielectric resonator 20 .

[0068] It should be noted that the opening structure 21 is arranged relatively close to the outer circumference of the dielectric resonator 20 and relatively far from the center axis L of the dielectric resonator 20. That is, the distance between the opening structure 21 and the outer circumference of the dielectric resonator 20 is smaller than the distance between the opening structure 21 and the center axis L of the dielectric resonator 20.

[0069] Since the electric field of the TE mode will be concentrated around the peripheral side of the dielectric resonator 20, and since the electric field of the TM mode will be concentrated on the central axis L of the dielectric resonator 20. By adopting the above scheme, by making the opening structure 21 close to the outer peripheral surface of the dielectric resonator 20 and away from the central axis L of the dielectric resonator 20, the opening structure 21 can be relatively close to the main distribution area of ​​the TE mode electric field and relatively away from the main distribution area of ​​the TM mode electric field. Based on this, on the basis of improving the TE mode resonant frequency through the opening structure 21, the influence of the opening structure 21 on the TM mode resonant frequency can be reduced, so as to facilitate the precise design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", so as to improve the performance of the dielectric cavity resonator.

[0070] See also Figure 3 , Figure 4 In some embodiments of the present application, the opening structure 21 includes at least one of an opening and a groove.

[0071] It should be noted that, in some embodiments, the opening structure 21 may include an opening. In other embodiments, the opening structure 21 may include a groove. In other embodiments, the opening structure 21 may include an opening and a groove. That is, the embodiments of the opening and the embodiments of the groove may be provided separately or in combination.

[0072] The opening can be a blind hole or a through hole. The opening can be a circular hole, a rectangular hole, a waist-shaped hole, a special-shaped hole, etc. The opening can be opened at any end surface of the dielectric resonator 20 along its own axial direction, and can also be opened at the outer peripheral surface of the dielectric resonator 20.

[0073] The groove may be a straight groove, a curved groove, an arc groove, an annular groove, etc. The groove may be provided on any end surface of the dielectric resonator 20 along its own axial direction, or on the outer peripheral surface of the dielectric resonator 20 .

[0074] By adopting the above scheme, the opening structure 21 can be in the form of openings and grooves to improve the structural regularity of the opening structure 21. Based on this, on the one hand, it is easy to design a mold, and it is easy to integrally mold the dielectric resonator 20 and its opening structure 21 in the form of openings and grooves through the mold, which can improve the molding convenience and molding accuracy of the dielectric resonator 20 and its opening structure 21. On the other hand, the opening and groove form can facilitate precise adjustment of the size, shape and position to accurately control the resonant frequency of the TE mode, thereby facilitating precise design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", which is convenient for improving the performance of the dielectric cavity resonator. In addition, the opening and groove form can accurately reduce the weight of the dielectric resonator 20, thereby reducing the weight of the dielectric cavity resonator while optimizing the performance, which is conducive to the lightweighting of the dielectric cavity resonator.

[0075] See also Figure 2 , Figure 3 , Figure 4 , Figure 5 In some embodiments of the present application, the opening structure 21 is connected to at least one end surface of the dielectric resonator 20 along the axial direction of the dielectric resonator 20 .

[0076] It should be noted that the opening structure 21 is connected to at least one end surface of the dielectric resonator 20 along the axial direction of the dielectric resonator 20, including the situation that "the opening structure 21 is opened at the end surface of the dielectric resonator 20, and the opening structure 21 is arranged between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20" (for example Figure 3 The first hole 2111 shown, for example Figure 4 The first annular groove 2112 shown in the figure also includes the case where "the opening structure 21 is opened on the periphery of the dielectric resonator 20, and the opening structure 21 is connected to the outer peripheral surface of the dielectric resonator 20 and at least one end surface of the dielectric resonator 20" (for example Figure 4 The second annular groove 2121 shown, for example Figure 8 The strip groove 2122 shown).

[0077] It should also be noted that, regardless of whether the opening structure 21 is in the form of an opening or a groove, the opening structure 21 is connected to at least one end face of the dielectric resonator 20 along the axial direction of the dielectric resonator 20, and the depth direction of the opening structure 21 (e.g., the hole depth direction of the opening, the groove depth direction of the groove) corresponds to (that is, is substantially parallel to) the axial direction of the dielectric resonator 20. The opening structure 21 may be connected to only one end face of the dielectric resonator 20 along the axial direction of the dielectric resonator 20, or the opening structure 21 may be connected to two opposite end faces of the dielectric resonator 20 along the axial direction of the dielectric resonator 20.

[0078] By adopting the above scheme, by making the opening structure 21 connected to at least one end surface of the dielectric resonator 20 along the axial direction of the dielectric resonator 20, the depth direction of the opening structure 21 can correspond to the axial direction of the dielectric resonator 20, which can facilitate the thinning of a specific area of ​​the dielectric resonator 20 directly along the axial direction of the dielectric resonator 20. In particular, based on the depth design of the opening structure 21, the thickness of the portion of the dielectric resonator 20 corresponding to the opening structure 21 in the axial direction can be directly, flexibly and accurately thinned to an expected value (even to zero), thereby conveniently, controllably and accurately improving the resonant frequency of the TE mode, improving the convenience and accuracy of adjusting the resonant frequency of the TE mode, facilitating the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", and facilitating the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0079] Furthermore, based on the arrangement of the present embodiment, the opening of the opening structure 21 can be connected to the end face of the dielectric resonator 20, and the opening structure 21 can be extended along the axial direction of the dielectric resonator 20. Based on this, it is convenient to design a mold, and it is convenient to integrally mold the dielectric resonator 20 and its opening structure 21 through the mold. In particular, the demolding convenience of the mold after the dielectric resonator 20 is molded can be improved (the demolding can be performed along the axial direction of the dielectric resonator 20), the molding convenience and molding accuracy of the dielectric resonator 20 can be improved, and the mold cost and the processing cost of the dielectric resonator 20 can be reduced.

[0080] Please refer to Figure 3 , Figure 4 and Figure 5 In some embodiments of the present application, the opening structure 21 includes a first opening 211 opened on the end surface of the dielectric resonator 20 , and the first opening 211 is provided between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20 .

[0081] It should be noted that no matter whether the first opening 211 is in the form of an opening or a groove, the first opening 211 is opened on the end surface of the dielectric resonator 20 and is located between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20. The first opening 211 can be arranged exactly in the center between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20, or can be arranged toward the outer peripheral surface of the dielectric resonator 20 or toward the central axis L of the dielectric resonator 20.

[0082] For example, Figure 2 , Figure 3 As shown, in a possible embodiment, the first opening 211 includes at least one first hole 2111, and the first hole 2111 is opened on the end surface of the dielectric resonator 20, and the hole depth direction of the first hole 2111 corresponds to the axial direction of the dielectric resonator 20. The first hole 2111 is arranged between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20. The first hole 2111 can be a through hole or a blind hole. In the case where the first hole 2111 is a blind hole, the first hole 2111 can be opened on the end surface of the dielectric resonator 20 facing the first plate 11, and can also be opened on the end surface of the dielectric resonator 20 facing the second plate 12. The first hole 2111 can be a circular hole, a rectangular hole, a waist-shaped hole, a special-shaped hole, etc. In the case where there are multiple first holes 2111, the multiple first holes 2111 can be arranged on the same circumference or flexibly arranged; in the case where the multiple first holes 2111 are arranged on the same circumference, the multiple first holes 2111 can be arranged in equal angles around the central axis L of the dielectric resonator 20, or can be arranged in unequal angles. In the case where there are multiple first holes 2111, the multiple first holes 2111 can be holes of the same type or a combination of holes of different types; in the case where the multiple first holes 2111 are holes of the same type, the sizes of the multiple first holes 2111 can be the same or different. In the case where there are multiple first holes 2111, the multiple first holes 2111 can be opened on the same end face of the dielectric resonator 20, or can be opened on two opposite end faces of the dielectric resonator 20 respectively.

[0083] The more the number of the first holes 2111 is, the higher the resonant frequency of the TE mode is; the deeper the hole depth of the first hole 2111 is, the higher the resonant frequency of the TE mode is; the larger the aperture of the first hole 2111 is, the higher the resonant frequency of the TE mode is; the closer the position of the first hole 2111 is to the outer peripheral side of the dielectric resonator 20, the higher the resonant frequency of the TE mode is. Based on this, it is convenient to accurately adjust the number, size, shape and position of the first holes 2111 to accurately control the resonant frequency of the TE mode, so as to accurately design "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", so as to improve the performance of the dielectric cavity resonator.

[0084] For example, Figure 4, Figure 5 As shown, in another possible embodiment, the first opening 211 includes at least one first annular groove 2112. The first annular groove 2112 can be opened on the end surface of the dielectric resonator 20 facing the first plate 11, or can be opened on the end surface of the dielectric resonator 20 facing the second plate 12. The first annular groove 2112 is arranged between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20. The first annular groove 2112 surrounds the outer periphery of the central axis L of the dielectric resonator 20. The central axis (i.e., the surrounding axis) of the first annular groove 2112 is parallel to the central axis L of the dielectric resonator 20. The central axis of the first annular groove 2112 can be arranged to coincide with the central axis L of the dielectric resonator 20, or can be arranged at intervals. The shape of the surrounding path of the first annular groove 2112 can be the same as or different from the cross-sectional shape of the dielectric resonator 20 perpendicular to its own central axis L. The groove depth direction of the first annular groove 2112 corresponds to the axial direction of the dielectric resonator 20. The shape of the first annular groove 2112 may be a cylindrical groove, a conical groove, a table groove, a step groove or other shapes. In the case where a plurality of first annular grooves 2112 are provided, the plurality of first annular grooves 2112 may be arranged in sequence from the inside to the outside. In the case where a plurality of first annular grooves 2112 are provided, the plurality of first annular grooves 2112 may be all provided on the same end face of the dielectric resonator 20, or may be respectively provided on two opposite end faces of the dielectric resonator 20.

[0085] The more the number of the first annular grooves 2112 is, the higher the resonant frequency of the TE mode is; the deeper the groove depth of the first annular groove 2112 is, the higher the resonant frequency of the TE mode is; the wider the groove width of the first annular groove 2112 is, the higher the resonant frequency of the TE mode is; the longer the extension path of the first annular groove 2112 along its own circumference is, the higher the resonant frequency of the TE mode is; the closer the position of the first annular groove 2112 is to the outer peripheral side of the dielectric resonator 20, the higher the resonant frequency of the TE mode is. Based on this, it is convenient to accurately adjust the number, size, shape and position of the first annular grooves 2112 to accurately control the resonant frequency of the TE mode, so as to facilitate the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", so as to improve the performance of the dielectric cavity resonator.

[0086] Of course, in other possible embodiments, the first annular groove 2112 can be changed to a straight groove, a curved groove, an arc groove, etc. The number of the straight groove, the curved groove, the arc groove and other groove structures can be one or more. In the case where the number of the straight groove, the curved groove, the arc groove and other groove structures is multiple, the multiple groove structures can be grooves of the same type or a combination of grooves of different types; in the case where the multiple groove structures are grooves of the same type, the sizes of the multiple groove structures can be the same or different.

[0087] By adopting the above solution, by opening the first opening 211 on the end surface of the dielectric resonator 20, and making the first opening 211 between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20, so that the depth direction of the first opening 211 corresponds to the axial direction of the dielectric resonator 20, it is convenient to directly thin a specific area of ​​the dielectric resonator 20 along the axial direction of the dielectric resonator 20, so that the resonant frequency of the TE mode can be conveniently, controllably and accurately improved.

[0088] Furthermore, since the electric field of the TE mode will be more concentrated around the peripheral side of the dielectric resonator 20, when the opening structure 21 is on the outer peripheral side of the dielectric resonator 20, the influence on the resonant frequency of the TE mode is the greatest; when the opening structure 21 is on the central axis L of the dielectric resonator 20, the influence on the resonant frequency of the TE mode is the smallest. By arranging the first opening 211 between the outer peripheral surface of the dielectric resonator 20 and the central axis L of the dielectric resonator 20, the first opening 211 can be avoided from the outer peripheral surface of the dielectric resonator 20, and the first opening 211 will not have too much influence on the resonant frequency of the TE mode, causing the frequency to increase suddenly; at the same time, the first opening 211 avoids the central axis L of the dielectric resonator 20, and the first opening 211 will not have too little influence on the resonant frequency of the TE mode, causing the frequency to be unable to be significantly increased. Based on this, it is convenient to more finely control the resonant frequency of the TE mode, that is, while increasing the resonant frequency of the TE mode, the resonant frequency of the TE mode can be increased more accurately, finely, and stably, and the resonant frequency of the TE mode can be more accurately controlled. At the same time, the electric field of the TM mode is more concentratedly distributed at the central axis L of the dielectric resonator 20. The first opening 211 avoids the central axis L of the dielectric resonator 20, and can also greatly reduce the influence of the first opening 211 on the resonant frequency of the TM mode, thereby facilitating the precise design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", and facilitating the improvement of the performance of the dielectric cavity resonator.

[0089] Furthermore, the first opening 211 is provided at the end surface of the dielectric resonator 20, which can facilitate the design of the mold, and can facilitate the integral molding of the dielectric resonator 20 and its first opening 211 through the mold, and can especially improve the demolding convenience of the mold after the dielectric resonator 20 is molded (the demolding can be performed along the axial direction of the dielectric resonator 20), can improve the molding convenience and molding accuracy of the dielectric resonator 20, and can reduce the mold cost and the processing cost of the dielectric resonator 20.

[0090] See also Figure 4 , Figure 6 , Figure 8 In some embodiments of the present application, the opening structure 21 includes a second opening 212 opened at the periphery of the dielectric resonator 20 , and the second opening 212 is connected to the outer peripheral surface of the dielectric resonator 20 and at least one end surface of the dielectric resonator 20 .

[0091] It should be noted that no matter whether the second opening 212 is in the form of an opening or a groove, the second opening 212 is opened at the circumference of the dielectric resonator 20, and the second opening 212 is simultaneously connected to the outer circumferential surface of the dielectric resonator 20 and at least one end surface of the dielectric resonator 20. The depth direction of the second opening 212 (e.g., the hole depth direction of the opening, the groove depth direction of the groove) corresponds to (i.e., is substantially parallel to) both the radial direction of the dielectric resonator 20 and the axial direction of the dielectric resonator 20. The second opening 212 can be connected to the corresponding end surface of the dielectric resonator 20 along one side of the axial direction of the dielectric resonator 20, and the second opening 212 can also be connected to the two opposite end surfaces of the dielectric resonator 20 along the opposite sides of the axial direction of the dielectric resonator 20.

[0092] For example, Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, in a possible embodiment, the second opening 212 includes a second annular groove 2121, and the second annular groove 2121 is opened on the circumference of the dielectric resonator 20, and the second annular groove 2121 is connected to the outer circumferential surface of the dielectric resonator 20 and an end surface of the dielectric resonator 20. The second annular groove 2121 surrounds the outer circumference of the central axis L of the dielectric resonator 20, and the central axis (i.e., the surrounding axis) of the second annular groove 2121 can be parallel to or intersect with the central axis L of the dielectric resonator 20. The central axis of the second annular groove 2121 and the central axis L of the dielectric resonator 20 can be arranged to coincide with each other, or they can be arranged at intervals. The shape of the second annular groove 2121 can be a cylindrical groove, a conical groove, a table groove, a step groove or other shapes, for example, in Figure 4 The second annular groove 2121 is shaped like a cylindrical groove, for example Figure 6 The shape of the second annular groove 2121 is a step surface groove.

[0093] The deeper the groove depth of the second annular groove 2121 along the axial direction of the dielectric resonator 20, the higher the resonant frequency of the TE mode; the deeper the groove depth of the second annular groove 2121 along the radial direction of the dielectric resonator 20, the higher the resonant frequency of the TE mode. Based on this, it is convenient to accurately adjust the size and shape of the second annular groove 2121 to accurately control the resonant frequency of the TE mode, so as to accurately design "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", so as to improve the performance of the dielectric cavity resonator.

[0094] For example, Figure 8As shown, in another possible embodiment, the second opening 212 includes at least one strip groove 2122, and the strip groove 2122 is opened on the circumference of the dielectric resonator 20. The strip groove 2122 is connected to the outer circumferential surface of the dielectric resonator 20 and at least one end surface of the dielectric resonator 20. The strip groove 2122 can be a linear groove, and the extension direction of the strip groove 2122 can be parallel to (or inclined to) the axial direction of the dielectric resonator 20. The two ends of the strip groove 2122 along its extension direction can be through-set, or one end can be closed and the other end can be connected to the corresponding end surface of the dielectric resonator 20. In the case where a plurality of strip grooves 2122 are provided, along the circumference of the dielectric resonator 20, the plurality of strip grooves 2122 can be arranged in an equiangular circumference, or can be arranged in an unequal angle circumference. In the case where a plurality of strip grooves 2122 are provided, the sizes of the plurality of strip grooves 2122 can be the same or different.

[0095] The more the number of strip grooves 2122 is, the higher the resonant frequency of the TE mode is; the deeper the groove depth of the strip grooves 2122 along the axial direction of the dielectric resonator 20 is, the higher the resonant frequency of the TE mode is; the deeper the groove depth of the strip grooves 2122 along the radial direction of the dielectric resonator 20 is, the higher the resonant frequency of the TE mode is; the wider the groove width of the strip grooves 2122 is, the higher the resonant frequency of the TE mode is. Based on this, it is convenient to accurately adjust the number, size and shape of the second annular grooves 2121 to accurately control the resonant frequency of the TE mode, so as to facilitate the accurate design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", so as to improve the performance of the dielectric cavity resonator.

[0096] Of course, in other possible embodiments, the strip groove 2122 can be changed to a curved groove, an arc groove, etc. The number of the curved groove, the arc groove and other groove structures can be one or more. In the case where the number of the curved groove, the arc groove and other groove structures is multiple, the multiple groove structures can be grooves of the same type or a combination of grooves of different types; in the case where the multiple groove structures are grooves of the same type, the sizes of the multiple groove structures can be the same or different.

[0097] By adopting the above solution, by opening the second opening 212 on the circumference of the dielectric resonator 20, and making the second opening 212 connected to the outer circumferential surface of the dielectric resonator 20 and at least one end surface of the dielectric resonator 20, the depth direction of the second opening 212 corresponds to the axial direction and radial direction of the dielectric resonator 20, which can facilitate the thinning of a specific area of ​​the dielectric resonator 20 along the axial direction and radial direction of the dielectric resonator 20, so that the resonant frequency of the TE mode can be conveniently, controllably and accurately improved.

[0098] Furthermore, since the electric field of the TE mode is concentrated around the peripheral side of the dielectric resonator 20, the second opening 212 is located at the peripheral edge of the dielectric resonator 20 and is connected to the outer peripheral surface of the dielectric resonator 20, and therefore, the second opening 212 has the greatest influence on the resonant frequency of the TE mode. Based on this, the resonant frequency of the TE mode can be significantly increased through the second opening 212, which is convenient and quick to adjust the resonant frequency of the TE mode, and the range of the resonant frequency of the TE mode can be increased, and the resonant frequency of the TE mode can be increased more easily to the desired range. At the same time, since the electric field of the TM mode is concentratedly distributed at the central axis L of the dielectric resonator 20, based on the arrangement of this embodiment, the influence of the second opening 212 opened at the peripheral edge of the dielectric resonator 20 on the resonant frequency of the TM mode can be greatly reduced, and the resonant frequency of the TE mode can be conveniently and controllably increased on the basis of basically stabilizing the resonant frequency of the TM mode. In this way, the adjustment convenience and accuracy of the resonant frequency of the TE mode can be improved, and it is convenient to accurately design that "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", which can facilitate improving the performance and design flexibility of the dielectric cavity resonator.

[0099] Furthermore, the second opening 212 is connected to at least one end surface of the dielectric resonator 20, which can facilitate the design of the mold, and can facilitate the integral molding of the dielectric resonator 20 and its second opening 212 through the mold, and can especially improve the demolding convenience of the mold after the dielectric resonator 20 is molded (the demolding can be performed along the axial direction of the dielectric resonator 20), can improve the molding convenience and molding accuracy of the dielectric resonator 20, and can reduce the mold cost and the processing cost of the dielectric resonator 20.

[0100] See also Fig. 9 , Fig.10 In some embodiments of the present application, the opening structure 21 includes a third opening 213 opened on the outer peripheral surface of the dielectric resonator 20 , and the third opening 213 is provided between two end surfaces of the dielectric resonator 20 .

[0101] It should be noted that, regardless of whether the third opening 213 is in the form of an opening or a groove, the third opening 213 is opened on the outer peripheral surface of the dielectric resonator 20 and is located between two opposite end surfaces of the dielectric resonator 20 along the axial direction, that is, along the axial direction of the dielectric resonator 20, the third opening 213 is not connected to any end surface of the dielectric resonator 20, and the third opening 213 is closed at both opposite ends of the axial direction of the dielectric resonator 20.

[0102] For example, Fig. 9As shown, in a possible embodiment, the third opening 213 includes at least one second hole 2131, and the second hole 2131 is opened on the outer circumferential surface of the dielectric resonator 20, and the hole depth direction of the second hole 2131 corresponds to the radial direction of the dielectric resonator 20. The second hole 2131 is arranged between the two end surfaces of the dielectric resonator 20. The second hole 2131 can be a blind hole. The second hole 2131 can be a circular hole, a rectangular hole, a waist-shaped hole, a special-shaped hole, etc. In the case where a plurality of second holes 2131 are provided, the plurality of second holes 2131 can be arranged at the same axial height, or can be arranged flexibly; in the case where the plurality of second holes 2131 are provided at the same axial height, the plurality of second holes 2131 can be arranged in equal-angle circles along the circumference of the dielectric resonator 20, or can be arranged in unequal-angle circles. When there are multiple second holes 2131, the multiple second holes 2131 may be holes of the same type or a combination of holes of different types; when the multiple second holes 2131 are holes of the same type, the sizes of the multiple second holes 2131 may be the same or different.

[0103] The more the number of the second holes 2131 is, the higher the resonant frequency of the TE mode is; the deeper the hole depth of the second hole 2131 is, the higher the resonant frequency of the TE mode is; the larger the aperture of the second hole 2131 is, the higher the resonant frequency of the TE mode is. Based on this, it is convenient to accurately adjust the number, size, shape and position of the second holes 2131 to accurately control the resonant frequency of the TE mode, so as to accurately design "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", so as to improve the performance of the dielectric cavity resonator.

[0104] For example, Fig.10 As shown, in another possible embodiment, the third opening 213 includes at least one third annular groove 2132. The third annular groove 2132 is opened on the outer peripheral surface of the dielectric resonator 20. The third annular groove 2132 is arranged between the two end surfaces of the dielectric resonator 20. The third annular groove 2132 surrounds the outer periphery of the central axis L of the dielectric resonator 20. The central axis (i.e., the surrounding axis) of the third annular groove 2132 can be parallel to, intersect with, or coincide with the central axis L of the dielectric resonator 20. The central axis of the third annular groove 2132 and the central axis L of the dielectric resonator 20 can be arranged to coincide with each other, or can be arranged at intervals. The groove depth direction of the third annular groove 2132 corresponds to the radial direction of the dielectric resonator 20. The shape of the third annular groove 2132 can be cylindrical groove, conical groove, table groove, step groove or other shapes. In the case where a plurality of third annular grooves 2132 are provided, the plurality of third annular grooves 2132 can be arranged at intervals along the axial direction of the dielectric resonator 20.

[0105] The more the number of the third annular grooves 2132 is, the higher the resonant frequency of the TE mode is; the deeper the groove depth of the third annular groove 2132 is, the higher the resonant frequency of the TE mode is; the wider the groove width of the third annular groove 2132 is, the higher the resonant frequency of the TE mode is. Based on this, it is convenient to accurately adjust the number, size, shape and position of the third annular grooves 2132 to accurately control the resonant frequency of the TE mode, so as to accurately design "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", so as to improve the performance of the dielectric cavity resonator.

[0106] Of course, in other possible embodiments, the third annular groove 2132 can be changed to a straight groove, a strip groove, a curved groove, an arc groove, etc. The number of the straight groove, the strip groove, the curved groove, the arc groove and other groove structures can be one or more. In the case where the number of the straight groove, the strip groove, the curved groove, the arc groove and other groove structures is multiple, the multiple groove structures can be grooves of the same type, or a combination of grooves of different types; in the case where the multiple groove structures are grooves of the same type, the sizes of the multiple groove structures can be the same or different. In the case where there are multiple straight grooves, the strip grooves, the curved grooves, the arc groove and other groove structures, along the circumference of the dielectric resonator 20, the multiple groove structures can be arranged in equal angles or in unequal angles.

[0107] By adopting the above solution, by opening the third opening 213 on the outer peripheral surface of the dielectric resonator 20, and the third opening 213 is arranged between the two end surfaces of the dielectric resonator 20, so that the depth direction of the third opening 213 corresponds to the radial direction of the dielectric resonator 20, it is convenient to thin a specific area of ​​the dielectric resonator 20 along the radial direction of the dielectric resonator 20, so that the resonant frequency of the TE mode can be conveniently, controllably and accurately improved.

[0108] Furthermore, since the electric field of the TE mode is relatively concentrated around the peripheral side of the dielectric resonator 20, when the third opening 213 is located on the outer peripheral surface of the dielectric resonator 20, the third opening 213 has the greatest influence on the resonant frequency of the TE mode. Therefore, the third opening 213 can be used to significantly increase the resonant frequency of the TE mode, which is convenient and quick to adjust the resonant frequency of the TE mode, increase the range of the resonant frequency of the TE mode, and more easily increase the resonant frequency of the TE mode to the desired range. At the same time, since the electric field of the TM mode is relatively concentrated on the central axis L of the dielectric resonator 20, based on the arrangement of this embodiment, the influence of the third opening 213 opened on the outer peripheral surface of the dielectric resonator 20 on the resonant frequency of the TM mode can be greatly reduced, and the resonant frequency of the TE mode can be conveniently and controllably increased on the basis of basically stabilizing the resonant frequency of the TM mode. In this way, the adjustment convenience and accuracy of the resonant frequency of the TE mode can be improved, and it is convenient to accurately design that "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", which can facilitate improving the performance and design flexibility of the dielectric cavity resonator.

[0109] In the present application, the above embodiments of the "first opening 211", "second opening 212" and "third opening 213" can be implemented separately, in pairs or in combination. Figure 3 In the embodiment shown, the dielectric resonator 20 may only have a first opening 211; for example, Figure 4 In the embodiment shown, the dielectric resonator 20 may be provided with a first opening 211 and a second opening 212 at the same time; Figure 6 In the illustrated embodiment, the dielectric resonator 20 may be provided with only the second opening 212 .

[0110] See also Figure 4 , Figure 5 , Fig.10 In some embodiments of the present application, the above-mentioned embodiment of the second opening 212 and / or the embodiment of the third opening 213 are implemented in combination with the embodiment of the first opening 211. That is, the opening structure 21 of the dielectric resonator 20 includes the first opening 211 and the second opening 212; or, the opening structure 21 of the dielectric resonator 20 includes the first opening 211 and the third opening 213; or, the opening structure 21 of the dielectric resonator 20 includes the first opening 211, the second opening 212 and the third opening 213.

[0111] Since the electric field of the TE mode will be concentrated around the peripheral side of the dielectric resonator 20, the second opening 212 is located at the peripheral edge of the dielectric resonator 20 and connected to the outer peripheral surface of the dielectric resonator 20, and the third opening 213 is located at the outer peripheral surface of the dielectric resonator 20. Therefore, the second opening 212 and the third opening 213 have the greatest influence on the resonant frequency of the TE mode, and the second opening 212 and the third opening 213 have a more significant influence on the resonant frequency of the TE mode; and the first opening 211 avoids the outer peripheral surface of the dielectric resonator 20. Therefore, compared with the second opening 212 and the third opening 213, the first opening 211 has a smaller influence on the resonant frequency of the TE mode; and the first opening 211 avoids the central axis L of the dielectric resonator 20, and the first opening 211 will not lose the effect of increasing the frequency due to too small influence on the resonant frequency of the TE mode.

[0112] By adopting the above scheme, the resonance frequency of the TE mode can be significantly increased through the second opening 212 and / or the third opening 213, and at the same time, the resonance frequency of the TE mode can be slightly increased through the first opening 211. Based on this, the resonance frequency of the TE mode can be more finely regulated on the basis of "facilitating convenient and quick regulation of the resonance frequency of the TE mode, increasing the range of the resonance frequency of the TE mode, and more easily increasing the resonance frequency of the TE mode to the desired range". That is, the resonance frequency of the TE mode can be greatly increased to the vicinity of the desired range through the second opening 212 and / or the third opening 213, and then the resonance frequency of the TE mode can be accurately and slightly increased to the desired range through the first opening 211. In this way, it is possible to achieve more refined control of the resonant frequency of the TE mode. While significantly increasing the resonant frequency of the TE mode, the resonant frequency of the TE mode can be increased more accurately, finely and stably. The resonant frequency of the TE mode can be more accurately controlled, thereby facilitating the precise design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", thereby facilitating the improvement of the performance and design flexibility of the dielectric cavity resonator.

[0113] In some embodiments of the present application, the first plate 11 has a grounding component, the opening structure 21 includes an annular recess, the annular recess is continuously or discontinuously surrounded in an annular shape, the central axis of the annular recess coincides with the central axis L of the dielectric resonator 20, the bottom of the annular recess is closed, and the grounding component closes the notch of the annular recess, so that the resonant frequency of the HE dual mode is in the same frequency band as the resonant frequency of the TE mode and the resonant frequency of the TM mode.

[0114] The annular recess may be a continuous or discontinuous ring along its own circumference as a whole, and the central axis (i.e., the surrounding axis) of the annular recess coincides with the central axis L of the dielectric resonator 20. In some embodiments, the annular recess may be a complete and continuous annular structure, such as an annular groove. In other embodiments, the annular recess may also be a discontinuous and overall annular structure formed by multiple parts, such as a plurality of arc grooves surrounding the axis and forming an annular recess together, a plurality of blind holes surrounding the axis and forming an annular recess together, or a plurality of linear grooves surrounding the axis and forming an annular recess together. The bottom of the annular recess is closed, that is, the annular recess does not include a through-hole structure. The annular recess may be provided on any end face, peripheral edge or outer peripheral surface of the dielectric resonator 20.

[0115] When the annular recess is a completely continuous annular groove, the notch of the annular recess is the notch of the annular groove. When the annular recess is a discontinuous structure formed by multiple parts and in an annular shape as a whole, the notch of the annular recess includes the openings of each part, for example, the notch of the annular recess includes the notches of each arc groove, for example, the annular recess includes the openings of each blind hole, for example, the notch of the annular recess includes the notches of each linear groove, and so on.

[0116] It should be noted that the opening structure 21 may include only the annular recess; the opening structure 21 may include both the annular recess and other structures other than the annular recess, for example, the opening structure 21 may also include Figure 3 When the opening structure 21 includes both the annular recess and other structures except the annular recess, it can be understood that the other structures except the annular recess may not be annular, may be connected to the opposite ends of the dielectric resonator 20, and the central axis of the structure may not coincide with the central axis L of the dielectric resonator 20.

[0117] The grounding component can be the first plate 11 itself, that is, the first plate 11 itself can be used as the grounding component, and the inner side of the first plate 11 itself closes the notch of the annular recess; the grounding component can also be a metal grounding ring, a metal grounding column or a base 111 protruding from the first plate 11, and the notch of the annular recess is closed by the inner side of the metal grounding ring, the cylindrical surface of the metal grounding column or the end surface of the base 111. The grounding component closes the notch of the annular recess, so that the grounding component and the annular recess can enclose at least one closed air cavity, in which the electric field path of the HE dual mode is vertically distributed and has no substantial transmission effect, and most of the electric field paths of the HE dual mode need to bend around the air cavity and have substantial transmission effect, based on which the electric field path of the HE dual mode can be extended, the resonant frequency of the HE dual mode can be pulled down and reduced, and the resonant frequency of the HE dual mode can be made close to the resonant frequency of the TE mode and the resonant frequency of the TM mode, and the resonant frequency of the HE dual mode, the resonant frequency of the TE mode, and the resonant frequency of the TM mode can be made to be within the passband range and close to the same frequency band. That is, the dielectric cavity resonator of this embodiment is a four-mode resonator.

[0118] The opening structure 21 includes an annular recess, that is, the annular recess has the relevant utility of the opening structure 21, and the annular recess can locally thin the dielectric resonator 20, especially can reduce the thickness of the portion of the dielectric resonator 20 corresponding to the annular recess along its axial direction, and can also reduce the size of the portion of the dielectric resonator 20 corresponding to the annular recess along its radial direction. Based on this, the resonant frequency of the TE mode can be improved, and the resonant frequency of the TE mode can be finely improved by accurately designing the specific structure (such as annular groove, multiple blind holes, multiple arc grooves, multiple straight grooves, etc.), size (such as depth, width, length, etc.), position, etc. of the annular recess, so as to make the resonant frequency of the TE mode close to the resonant frequency of the TM mode, close to the same frequency band, and within the passband range. Among them, the more blind holes and grooves included in the annular recess, the higher the resonant frequency of the TE mode; the deeper the depth of each part of the annular recess, the higher the resonant frequency of the TE mode; the wider the width of each part of the annular recess, the higher the resonant frequency of the TE mode; the longer the extension path of the annular recess, the higher the resonant frequency of the TE mode; the closer the position of the annular recess is to the outer peripheral surface of the dielectric resonator 20, the higher the resonant frequency of the TE mode; and so on.

[0119] By adopting the above scheme, the notch of the annular recess can be closed by the grounding component, so that the grounding component and the annular recess can enclose at least one closed air cavity, and the electric field path of the HE dual mode in the air cavity is vertically distributed, and most of the electric fields of the HE dual mode, or even the entire electric field path, need to be bent around the air cavity, thereby extending the electric field path of the HE dual mode, lowering the resonant frequency of the HE dual mode, and making the resonant frequency of the HE dual mode close to the resonant frequency of the TE mode and the resonant frequency of the TM mode, so that the resonant frequency of the HE dual mode, the resonant frequency of the TE mode, and the resonant frequency of the TM mode are all within the passband and close to the same frequency band. Thus, the dielectric cavity resonator can realize four resonant modes of single-cavity coupling TE mode, TM mode, and HE dual mode, that is, the dielectric cavity resonator of this embodiment is a four-mode resonator. The dielectric cavity resonator of this embodiment can achieve a fourth-order filtering effect, which is equivalent to the filtering effect of four single-mode resonators connected in series, thereby optimizing and improving the performance and space utilization of the dielectric cavity resonator.

[0120] Furthermore, the annular recess can also locally thin the dielectric resonator 20, especially reduce the thickness of the dielectric resonator 20 corresponding to the annular recess along the axial and radial directions, thereby increasing the resonance frequency of the TE mode, making the resonance frequency of the TE mode close to the resonance frequency of the TM mode, and making the resonance frequency of the TE mode and the resonance frequency of the TM mode within the passband range and close to the same frequency band.

[0121] Furthermore, compared to existing multi-mode resonators, the dielectric cavity resonator achieves four modes without significantly increasing the size of the dielectric resonator 20, which is beneficial to miniaturization of the overall size of the dielectric cavity resonator, allowing the dielectric cavity resonator to meet both high performance and miniaturization requirements.

[0122] Moreover, since the dielectric cavity resonator couples four resonance modes of TE mode, TM mode, and HE dual mode in a single cavity, it is convenient for the dielectric cavity resonator to establish a coupling relationship with a resonator having any mode of TE mode, TM mode, HE mode, and TEM mode, and the coupling effect will be better, thereby making the usability, applicability, and practicality of the dielectric cavity resonator better.

[0123] Moreover, in actual application scenarios, the dielectric cavity resonator can shorten the electric field path of the HE dual mode by making the grounding component not close the notches of all annular recesses so that the electric field path of the HE dual mode can directly pass through the annular recesses, so that all annular recesses have the effect of "increasing the resonant frequency of the TE mode" and "pushing the resonant frequency of the HE dual mode away", so that the resonant frequency of the HE dual mode is pushed away outside the passband range. Based on this, the dielectric cavity resonator can switch between the quad-mode resonator and the TE-TM dual-mode resonator conveniently, quickly and flexibly. Therefore, the dielectric cavity resonator has better flexibility and convenience in use.

[0124] See also Figure 6 , Figure 7 In some embodiments of the present application, the dielectric resonator 20 includes a plurality of dielectric layers 22 arranged in sequence along the axial direction thereof. In a direction approaching the first plate 11, the cross-sectional dimensions of each dielectric layer 22 are gradually reduced.

[0125] It should be noted that the dielectric resonator 20 includes a plurality of dielectric layers 22 , and the plurality of dielectric layers 22 are sequentially and coaxially arranged along the axial direction of the dielectric resonator 20 .

[0126] Along the direction close to the first plate 11, the cross-sectional dimensions of each dielectric layer 22 of the dielectric resonator 20 are gradually reduced, that is, the end of the dielectric resonator 20 close to the first plate 11 is thinner, while the other end is thicker. Here, the "cross-sectional dimension" is a cross-sectional dimension perpendicular to the central axis of the corresponding structure. Based on this, in each dielectric layer 22 of the dielectric resonator 20, each adjacent two dielectric layers 22 will form a step. The outer periphery of each dielectric layer 22 and the end surface of each dielectric layer 22 enclose the above-mentioned second annular groove 2121.

[0127] By adopting the above scheme, by gradually reducing the cross-sectional dimensions of each dielectric layer 22 of the dielectric resonator 20 in the direction close to the first plate 11, the dielectric resonator 20 can be made thinner at one end close to the first plate 11 and thicker at the other end. Based on this, on the one hand, the thickness of the dielectric resonator 20 can be gradually reduced from its center to its peripheral side, so that the resonant frequency of the TE mode can be improved evenly and finely, and the influence on the resonant frequency of the TM mode can be reduced, and the resonant frequency of the TM mode can be basically stabilized, so that it is convenient to accurately design "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", which can facilitate the improvement of the performance and design flexibility of the dielectric cavity resonator. On the other hand, the occupied space of the end of the dielectric resonator 20 close to the first plate 11 can be reduced, and the end of the dielectric resonator 20 close to the first plate 11 can be made to leave space for setting coupling structures such as coupling ribs, so that it is convenient to plan, design and construct coupling, and it is convenient to improve the performance and design flexibility of the dielectric cavity resonator.

[0128] Of course, in other embodiments, along the direction approaching the first plate 11, the cross-sectional dimensions of each dielectric layer 22 of the dielectric resonator 20 may be gradually expanded (i.e., the end of the dielectric resonator 20 close to the first plate 11 is thicker, and the other end is thinner), or may be gradually contracted first and then gradually expanded (i.e., the middle of the dielectric resonator 20 is thinner, and the two ends are thicker), or may be gradually expanded first and then gradually contracted (i.e., the middle of the dielectric resonator 20 is thicker, and the two ends are thinner).

[0129] See also Figure 2 , Figure 4 , Figure 6In some embodiments of the present application, the first plate 11 is protrudingly provided with a base 111 , and the dielectric resonator 20 is connected to the base 111 .

[0130] It should be noted that the base 111 is convexly arranged on the side of the first plate 11 facing the second plate 12, that is, the inner side of the first plate 11. The shape and size of the base 111 can be set as required. The base 111 can be used to position and install the dielectric resonator 20, raise the position of the dielectric resonator 20, and stabilize the installation position and installation state of the dielectric resonator 20. Among them, the dielectric resonator 20 can be directly connected and fixed to the base 111 by but not limited to welding, bonding, riveting, crimping, plugging, screw fastening, threaded connection, clamping, etc., or can be indirectly connected and fixed to the base 111 by other structures connected thereto (such as a ceramic base 30, etc.).

[0131] Since the magnetic field of the TM mode is distributed in a horizontal ring shape and the electric field is distributed in a vertical ring shape, the electric field of the TM mode is concentrated near the central axis L of the dielectric resonator 20 and the second plate 12. Therefore, the base 111 can also be used to raise the resonance position of the TM mode.

[0132] By adopting the above scheme, the dielectric resonator 20 can be connected to the base 111 to conveniently, quickly and stably install the dielectric resonator 20, thereby improving the assembly convenience and assembly efficiency of the dielectric resonator 20, and improving the assembly efficiency of the dielectric cavity resonator. In addition, the base 111 can provide a precise installation position for the dielectric resonator 20 to facilitate the accurate positioning of the dielectric resonator 20 in the resonator housing 10. Based on this, the performance fluctuation caused by the inaccurate installation position of the dielectric resonator 20 can be reduced, and the stability and consistency of the performance of the dielectric cavity resonator can be improved. In addition, the position of the dielectric resonator 20 and the resonance position of the TM mode can be raised by the base 111 to enhance the resonance index and optimize the resonance characteristics of the TM mode, which is conducive to optimizing and improving the performance of the dielectric cavity resonator.

[0133] Of course, in other embodiments, the base 111 may be omitted, and the dielectric resonator 20 may be directly connected to the inner side of the first plate 11, or may be indirectly connected and fixed to the inner side of the first plate 11 by other structures connected thereto (such as a ceramic base 30, etc.). This situation is compatible with any of the above embodiments regarding the opening structure 21.

[0134] See also Figure 2 , Figure 3 , Figure 4 , Figure 6In some embodiments of the present application, when the dielectric resonator 20 is connected to the base 111, the opening structure 21 is opened on the periphery of the dielectric resonator 20, and the opening structure 21 is connected to the end surface of the dielectric resonator 20 facing the first plate 11; or, the opening structure 21 is opened on the end surface of the dielectric resonator 20 facing the first plate 11.

[0135] It should be noted that, since the bottom platform 111 is a protruding metal platform, the bottom platform 111 may affect the directionality and uniformity of the electric field.

[0136] Therefore, when the dielectric resonator 20 is connected to the base 111, the opening structure 21 can be opened on the end surface of the dielectric resonator 20 facing the first plate 11, so that the opening structure 21 has an opening facing the first plate 11. Alternatively, the opening structure 21 can be opened on the periphery of the dielectric resonator 20, and the side of the opening structure 21 close to the first plate 11 is connected to the end surface of the dielectric resonator 20 facing the first plate 11, so that the opening structure 21 has a connecting port facing the first plate 11.

[0137] Based on this, by adopting the above-mentioned scheme, the opening structure 21 can have an opening or a connecting port facing the first plate 11, and the setting position of the opening structure 21 can be close to the main distribution area of ​​the TE mode electromagnetic field and away from the main distribution area of ​​the TM mode electromagnetic field. When the base 111 affects the electric field directionality and uniformity, the distribution of the electromagnetic field and the refraction during the electromagnetic wave transmission process can be stabilized, and the risk of changes in the distribution of the electromagnetic field and the refraction during the electromagnetic wave transmission process can be reduced, so that the effect of the opening structure 21 on the enhancement of the TE mode resonant frequency can meet the expected effect, which can facilitate the precise design of "the resonant frequency of the TE mode and the resonant frequency of the TM mode are within the passband range and close to the same frequency band", and can optimize and improve the performance of the dielectric cavity resonator.

[0138] See also Figure 2 , Figure 3 , Figure 4 , Figure 6 In some embodiments of the present application, the dielectric cavity resonator includes a ceramic base 30 , and the ceramic base 30 is separately connected between the dielectric resonator 20 and the first plate 11 .

[0139] It should be noted that the ceramic base 30 is made of ceramic material and is a non-metallic part. In some embodiments, the ceramic base 30 may be an alumina base. Since the ceramic base 30 and the dielectric resonator 20 are both non-metallic parts, it is convenient to connect and fix the ceramic base 30 with the dielectric resonator 20, and the connection strength, connection reliability and connection stability between the ceramic base 30 and the dielectric resonator 20 can be improved. Among them, the ceramic base 30 and the dielectric resonator 20 can be connected by, but not limited to, bonding, welding and other methods.

[0140] Since the ceramic base 30 has good strength and good impact resistance, it is convenient to connect and fix the ceramic base 30 with the first metal plate 11, which can reduce the risk of damage to the dielectric resonator 20 due to the connection operation. The ceramic base 30 and the first plate 11 can be connected by, but not limited to, bonding, welding, riveting, screw fastening, etc.

[0141] By adopting the above scheme, the ceramic base 30 and the dielectric resonator 20, which are both non-metallic parts, can be easily connected and fixed, the connection strength, connection reliability and connection stability between the ceramic base 30 and the dielectric resonator 20 can be improved, the risk of the dielectric resonator 20 being damaged due to the connection operation can be reduced, and the connection difficulty and connection cost between the ceramic base 30 and the dielectric resonator 20 can be reduced. In addition, the ceramic base 30 with better strength and impact resistance can be easily connected and fixed with the first metal plate 11, the risk of the dielectric resonator 20 being damaged due to the connection operation can be reduced, and the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the first plate 11 can be improved. Therefore, the connection and fixation between the dielectric resonator 20 and the first plate 11 can be conveniently, quickly and reliably achieved by means of the ceramic base 30.

[0142] See also Figure 2 , Figure 3 , Figure 4 , Figure 6 In some embodiments of the present application, a receiving groove 31 is provided on the side of the ceramic base 30 facing the dielectric resonator 20, and a fastening hole 32 is passed through the bottom of the receiving groove 31. The ceramic base 30 is connected to the first plate 11 through a fastener 40 passing through the fastening hole 32. The fastener 40 does not protrude from the notch of the receiving groove 31, and the ceramic base 30 is abutted and fixedly connected to the dielectric resonator 20.

[0143] It should be noted that the ceramic base 30 is provided with a receiving groove 31 and a fastening hole 32. The notch of the receiving groove 31 is arranged toward the dielectric resonator 20. The shape and size of the receiving groove 31 can be set as required. The fastening hole 32 passes through the bottom of the receiving groove 31. The fastening hole 32 can be, but is not limited to, a circular hole. The fastener 40 is passed through the fastening hole 32 and is fastened to the first plate 11 to fasten the ceramic base 30 to the first plate 11. The fastener 40 can be, but is not limited to, a screw.

[0144] The receiving groove 31 is used to receive the fastener 40, so that the fastener 40 does not protrude from the notch of the receiving groove 31, so that the side of the ceramic base 30 facing the dielectric resonator 20 is in contact with the dielectric resonator 20 and fixedly connected. The fixed connection method between the ceramic base 30 and the dielectric resonator 20 can be, but is not limited to, bonding, welding, etc.

[0145] By adopting the above scheme, the fastener 40 can be inserted into the fastening hole 32 and fastened to the first plate 11 to conveniently, quickly and reliably build the connection between the ceramic base 30 and the first plate 11, thereby improving the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the first plate 11. In addition, the fastener 40 can be accommodated by the receiving groove 31, so that the fastener 40 does not protrude from the notch of the receiving groove 31, and it is convenient for the ceramic base 30 to abut against the dielectric resonator 20 on the side facing the dielectric resonator 20 and be fixedly connected, thereby reducing the risk of unstable connection of the dielectric resonator 20 due to the part of the fastener 40 protruding from the notch of the receiving groove 31 abutting against the dielectric resonator 20, and improving the connection convenience, connection strength, connection reliability and connection stability between the ceramic base 30 and the dielectric resonator 20.

[0146] Based on this embodiment, in a specific application example, the dielectric resonator 20 has a center hole 23. Based on this, during the assembly process, the ceramic base 30 can first be abutted against and fixedly connected to the dielectric resonator 20 on the side facing the dielectric resonator 20, and then the fastener 40 can be passed through the center hole 23 of the dielectric resonator 20 into the fastening hole 32 and fastened to the first plate 11.

[0147] In another specific application example, regardless of whether the dielectric resonator 20 has a center hole 23, during the assembly process, the fastener 40 can be first passed through the fastening hole 32 and fastened to the first plate 11, and then the ceramic base 30 is abutted against the dielectric resonator 20 and fixedly connected to the side facing the dielectric resonator 20.

[0148] Of course, in other embodiments, when the dielectric resonator 20 has a center hole 23, the receiving groove 31 can be omitted, and the fastener 40 can be directly received through the center hole 23 of the dielectric resonator 20, so that the side of the ceramic base 30 facing the dielectric resonator 20 can abut against and be fixedly connected to the dielectric resonator 20.

[0149] In other embodiments, the ceramic base 30 and the first plate 11 may be connected by other methods (such as welding, riveting, etc.).

[0150] It should be noted that the embodiment of the "ceramic base 30" is suitable for being combined with the embodiment of the "base 111", so that the ceramic base 30 is separately connected between the dielectric resonator 20 and the base 111. The embodiment of the "ceramic base 30" and the embodiment of the "base 111" can also be set selectively. Even more, the dielectric resonator 20 can be directly connected to the inner side of the first plate 11, and the base 111 and the ceramic base 30 are omitted.

[0151] See also Figure 3 , Figure 5 , Figure 7 , Figure 8 In some embodiments of the present application, the dielectric resonator 20 is a rotationally symmetric structure.

[0152] It should be noted that the dielectric resonator 20 has a rotationally symmetrical structure around its central axis L. For example, the dielectric resonator 20 may be a circular rod, a circular column, a regular polygonal rod (such as a square rod), a regular polygonal column, etc. In the case where the dielectric resonator 20 is provided with an opening structure 21, the opening structure 21 also has a rotationally symmetrical structure around the central axis L of the dielectric resonator 20.

[0153] like Figure 3 As shown, in a specific application example, the opening structure 21 includes six first holes 2111 , and the six first holes 2111 are arranged in an equiangular circular array around the central axis L of the dielectric resonator 20 .

[0154] like Figure 8 As shown, in another specific application example, the opening structure 21 includes four strip grooves 2122 , and the four strip grooves 2122 are arranged in an equiangular circular array around the central axis L of the dielectric resonator 20 .

[0155] like Figure 5 As shown, in another specific application example, the opening structure 21 includes a first annular groove 2112 and a second annular groove 2121, the central axis L of the second annular groove 2121 and the central axis L of the first annular groove 2112 both coincide with the central axis L of the dielectric resonator 20, the second annular groove 2121 is a rotationally symmetrical structure around the central axis L of the dielectric resonator 20, and the first annular groove 2112 is a rotationally symmetrical structure around the central axis L of the dielectric resonator 20.

[0156] like Figure 7 As shown, in another specific application example, the opening structure 21 includes a second annular groove 2121 , the central axis L of the second annular groove 2121 coincides with the central axis L of the dielectric resonator 20 , and the second annular groove 2121 is a rotationally symmetrical structure around the central axis L of the dielectric resonator 20 .

[0157] By adopting the above scheme, by making the dielectric resonator 20 a rotationally symmetrical structure, the structure, electromagnetic field distribution, etc. of the dielectric resonator 20 can be basically the same in different directions around the central axis L of the dielectric resonator 20, without directionality. Based on this, when the dielectric resonator 20 is assembled into the resonator housing 10, there is no need to consider the assembly angle and limit issues, and the assembly can be completed directly and quickly, thereby improving the assembly convenience and assembly efficiency of the dielectric resonator 20, and improving the assembly efficiency of the dielectric cavity resonator. In addition, the performance fluctuation caused by the inaccurate assembly angle of the dielectric resonator 20 can be reduced, and the stability and consistency of the performance of the dielectric cavity resonator can be improved.

[0158] Of course, in other embodiments, the dielectric resonator 20 may be a non-rotationally symmetric structure.

[0159] See also Figure 2 , Figure 4 , Figure 6 In some embodiments of the present application, the dielectric cavity resonator includes an adjusting screw 50, which is threadedly connected to the resonator housing 10 and is used to adjust the resonant frequency of the TM mode.

[0160] It should be noted that the number of the adjusting screw 50 may be one or more. The adjusting screw 50 may be threadedly connected to any plate of the resonator housing 10 (e.g., the second plate 12, the first plate 11, or other side plates). The adjusting screw 50 may be directly threadedly connected to a threaded hole opened in the corresponding plate (e.g., the first threaded hole 121 of the second plate 12); or, the corresponding plate may be embedded with a first mounting member (not shown in the figure), and the adjusting screw 50 may be threadedly connected to the threaded hole of the first mounting member. The adjusting screw 50 is grounded based on the connection with the resonator housing 10.

[0161] The installation position of the adjusting screw 50 is not limited. Along the axial direction of the dielectric resonator 20, the adjusting screw 50 and the dielectric resonator 20 can be arranged in a aligned position or in a staggered position.

[0162] By adopting the above scheme, it is convenient to adjust the length of the portion of the adjusting screw 50 extending into the resonator housing 10 conveniently and quickly by screwing the adjusting screw 50 in or out. Based on this, the electric field of the TM mode can be affected by adjusting the length of the portion of the adjusting screw 50 extending into the resonator housing 10, thereby achieving independent adjustment and fine adjustment of the resonant frequency of the TM mode, and the tuning is convenient, fast and accurate. That is, this embodiment can independently tune the resonant frequency of the TM mode through the grounded adjusting screw 50, and basically does not affect the resonant frequency of the TE mode. Among them, the longer the length of the portion of the adjusting screw 50 extending into the resonator housing 10, the lower the resonant frequency of the TM mode; conversely, the shorter the length of the portion of the adjusting screw 50 extending into the resonator housing 10, the higher the resonant frequency of the TM mode.

[0163] In some embodiments, the adjusting screw 50 is threadedly connected to the second plate 12. Such a configuration can optimize the tuning effect of the adjusting screw 50 on the resonant frequency of the TM mode, and can expand the tuning range of the resonant frequency of the TM mode by the adjusting screw 50. In particular, when the adjusting screw 50 is threadedly connected to the second plate 12, and the adjusting screw 50 and the dielectric resonator 20 are arranged in an axially aligned manner with the dielectric resonator 20, the tuning effect of the adjusting screw 50 on the resonant frequency of the TM mode is the best.

[0164] In some embodiments, if the dielectric resonator 20 has a central hole 23, and the adjusting screw 50 and the central hole 23 of the dielectric resonator 20 are arranged opposite to each other along the axial direction of the dielectric resonator 20, the central hole 23 of the dielectric resonator 20 can be used to allow the adjusting screw 50 to extend therein. In this way, when the length of the portion of the adjusting screw 50 extending into the resonator housing 10 is relatively long, the adjusting screw 50 is allowed to extend into the central hole 23 of the dielectric resonator 20, thereby correspondingly expanding the tuning range of the adjusting screw 50, correspondingly expanding the adjustable range of the resonant frequency of the TM mode, and correspondingly improving the performance index of the resonator.

[0165] See also Figure 2 , Figure 4 , Figure 6 In some embodiments of the present application, the dielectric cavity resonator includes a metal disk 60 and an insulating member 70. The metal disk 60 and the dielectric resonator 20 are arranged opposite to each other along the axial direction of the dielectric resonator 20. The metal disk 60 is connected to the second plate 12 through the insulating member 70. The distance between the metal disk 60 and the dielectric resonator 20 is adjustable, which is used to adjust the resonant frequency of the TE mode.

[0166] It should be noted that the metal disk 60 is a disk-shaped structure, and the metal disk 60 can be made of a metal material, or the metal disk 60 can be made by covering the surface of an insulating disk-shaped structure with a metal material. The metal disk 60 can be a circular disk, a polygonal disk or other shapes. Along the axial direction of the dielectric resonator 20, the metal disk 60 and the dielectric resonator 20 are arranged opposite to each other and face each other. The metal disk 60 is connected to the second plate 12 through an insulating member 70, so that the metal disk 60 is insulated from the second plate 12, so that the metal disk 60 is not grounded, so that the metal disk 60 is suspended between the second plate 12 and the dielectric resonator 20, so that the metal disk 60 can compress the magnetic field of the TE mode. Among them, the insulating member 70 can be, but is not limited to, a plastic member, a plastic member, a wooden member, a ceramic member, a quartz member, a glass member, etc.

[0167] In some embodiments, the metal plate 60 may be penetrated by a through hole 61, and the insulating member 70 may be penetrated by the through hole 61 to connect the metal plate 60. Of course, in other embodiments, the metal plate 60 may omit the through hole 61, and the insulating member 70 may be connected to the metal plate 60 by bonding, welding, clamping, etc.

[0168] The insulating member 70 is disposed through the second plate 12, and the insulating member 70 can move axially relative to the second plate 12 to drive the metal disk 60 to move in a direction close to or away from the dielectric resonator 20, thereby adjusting the distance between the metal disk 60 and the dielectric resonator 20. As the distance between the metal disk 60 and the dielectric resonator 20 decreases, the metal disk 60 can enhance its compression effect on the magnetic field of the TE mode, thereby increasing the resonant frequency of the TE mode.

[0169] By adopting the above scheme, the distance between the metal disk 60 and the dielectric resonator 20 can be conveniently and quickly adjusted by moving the insulating member 70 along the axial direction relative to the second plate 12, so as to drive the ungrounded metal disk 60 to approach or move away from the dielectric resonator 20 through the insulating member 70. Based on this, the compression effect of the metal disk 60 on the magnetic field of the TE mode can be adjusted by adjusting the distance between the metal disk 60 and the dielectric resonator 20, so as to achieve independent adjustment and fine adjustment of the resonant frequency of the TE mode, and the tuning is convenient, fast and accurate. That is, this embodiment can independently tune the resonant frequency of the TE mode through the ungrounded metal disk 60, and basically does not affect the resonant frequency of the TM mode. Among them, the smaller the distance between the metal disk 60 and the dielectric resonator 20, the more the metal disk 60 compresses the magnetic field of the TE mode, and the higher the resonant frequency of the TE mode; conversely, the larger the distance between the metal disk 60 and the dielectric resonator 20, the weaker the compression effect of the metal disk 60 on the magnetic field of the TE mode, and the lower the resonant frequency of the TE mode.

[0170] In addition, the metal disk 60 may be replaced with a larger one to enhance the compression effect of the metal disk 60 on the TE mode magnetic field, thereby increasing the resonance frequency of the TE mode.

[0171] See also Figure 2 , Figure 4 , Figure 6 In some embodiments of the present application, the metal disk 60 is shaped like a circular disk, the outer peripheral wall of the insulating member 70 is provided with an external thread, the insulating member 70 is connected to the center of the metal disk 60, and is threadedly connected to the second plate 12.

[0172] It should be noted that the metal disk 60 is in the shape of a circular disk, that is, the metal disk 60 is in a rotationally symmetrical structure around its axis.

[0173] For example, the insulating member 70 may be an insulating screw or an insulating screw rod, such as a plastic screw or a plastic screw rod. The insulating member 70 is connected to the center of the metal disk 60, so that the insulating member 70 and the metal disk 60 are rotationally symmetrical around the central axis of the metal disk 60. The insulating member 70 is threadedly connected to the second plate 12, so that the insulating member 70 can be axially moved relative to the second plate 12 by screwing the insulating member 70 in or out. Among them, the insulating member 70 can be directly threadedly connected to the second threaded hole 122 of the second plate 12; or, the second plate 12 can be embedded with a second mounting member (not shown in the figure), and the insulating member 70 can be threadedly connected to the threaded hole of the second mounting member.

[0174] By adopting the above scheme, by making the metal disk 60 into a circular disk shape and connecting the insulating member 70 to the center of the metal disk 60, the insulating member 70 and the metal disk 60 can be made to have a rotationally symmetrical structure around the central axis of the metal disk 60, which can make the structure of the metal disk 60 and the compression effect on the TE mode magnetic field basically the same in different directions around the central axis of the metal disk 60 and have no directionality. On this basis, by making the insulating member 70 threadedly connected to the second plate 12, it is convenient to adjust the axial movement stroke of the insulating member 70 by screwing in or out of the insulating member 70, so that the metal disk 60 can be conveniently and quickly driven to approach or move away from the dielectric resonator 20, and the distance between the metal disk 60 and the dielectric resonator 20 can be conveniently, quickly, smoothly, accurately and controllably adjusted. In addition, the processing convenience and processing accuracy of the circular disk are relatively high. As a result, the tuning stability, tuning controllability and tuning accuracy of the resonant frequency of the TE mode can be effectively improved.

[0175] Of course, in other embodiments, the metal disk 60 may be a non-circular disk.

[0176] In other embodiments, the insulating member 70 may be inserted into the second plate 12, that is, the insulating member 70 and the second plate 12 are not connected by threads. The insulating member 70 may directly move axially relative to the second plate 12 to drive the metal disk 60 to approach or move away from the dielectric resonator 20, thereby adjusting the distance between the metal disk 60 and the dielectric resonator 20. In this case, the second plate 12 is provided with a mounting hole, and the insulating member 70 may be snapped into the mounting hole. For example, the insulating member 70 may be deformable along its radial direction, and the insulating member 70 may be fixed and released from the mounting hole of the second plate 12 by its own radial deformation. During each operation of releasing from the mounting hole and fixing to the mounting hole, the insulating member 70 may be controlled to move axially relative to the second plate 12. For another example, the hole wall of the mounting hole is provided with a card slot, and the outer peripheral wall of the insulating member 70 is provided with a plurality of card beads arranged at intervals along its axial direction. The insulating member 70 may be directly moved axially relative to the second plate 12 by driving different card beads of the insulating member 70 to be fixed in the card slot.

[0177] See also Figure 1 Some embodiments of the present application provide a filter, including the dielectric cavity resonator provided in the embodiments of the present application.

[0178] It should be noted that the filter may include one or more resonators, at least one of which is a dielectric cavity resonator provided in an embodiment of the present application. In the case where there are multiple resonators, the multiple resonators may be arranged and designed, and a coupling relationship may be established between two adjacent resonators as required.

[0179] By adopting the above scheme, the filter can improve the performance and power capacity of the filter, reduce insertion loss, and reduce size such as volume by adopting the dielectric cavity resonator provided in the embodiment of the present application.

[0180] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A dielectric cavity resonator, characterized in that: include: The resonator housing has a first plate member and a second plate member disposed opposite to each other; A dielectric resonator is arranged in the resonator housing, one end of the dielectric resonator is connected to the first plate, the other end of the dielectric resonator is spaced apart from the second plate, and the dielectric resonator is provided with an opening structure, which is used to increase the resonant frequency of the TE mode so that the resonant frequency of the TE mode and the resonant frequency of the TM mode are in the same frequency band.

2. The dielectric cavity resonator according to claim 1, characterized in that: The opening structure is arranged close to the outer peripheral surface of the dielectric resonator and away from the central axis of the dielectric resonator.

3. The dielectric cavity resonator according to claim 1, characterized in that: The opening structure includes at least one of an opening and a groove.

4. The dielectric cavity resonator according to claim 1, characterized in that: The opening structure is connected to at least one end surface of the dielectric resonator along the axial direction of the dielectric resonator.

5. The dielectric cavity resonator according to claim 1, characterized in that: The opening structure comprises a first opening opened on the end surface of the dielectric resonator, wherein the first opening is arranged between the outer peripheral surface of the dielectric resonator and the central axis of the dielectric resonator; And / or, the opening structure includes a second opening opened at the periphery of the dielectric resonator, the second opening being connected to the outer peripheral surface of the dielectric resonator and at least one end surface of the dielectric resonator; And / or, the opening structure includes a third opening opened on the outer peripheral surface of the dielectric resonator, and the third opening is arranged between two end surfaces of the dielectric resonator.

6. The dielectric cavity resonator according to claim 1, characterized in that: The first plate has a grounding component, the opening structure includes an annular recess, the annular recess is continuously or discontinuously surrounded in an annular shape, the central axis of the annular recess coincides with the central axis of the dielectric resonator, the concave bottom of the annular recess is closed, and the grounding component closes the notch of the annular recess, so that the resonant frequency of the HE dual mode is in the same frequency band as the resonant frequency of the TE mode and the resonant frequency of the TM mode.

7. The dielectric cavity resonator according to claim 1, characterized in that: The dielectric resonator comprises a plurality of dielectric layers arranged in sequence along its axial direction; along a direction approaching the first plate, the cross-sectional size of each dielectric layer is gradually reduced.

8. The dielectric cavity resonator according to claim 1, characterized in that: The first plate component is protrudingly provided with a bottom platform, and the dielectric resonator is connected to the bottom platform.

9. The dielectric cavity resonator according to claim 8, characterized in that: The opening structure is opened at the periphery of the dielectric resonator, and the opening structure is connected to the end surface of the dielectric resonator facing the first plate; or, The opening structure is opened on the end surface of the dielectric resonator facing the first plate.

10. The dielectric cavity resonator according to any one of claims 1 to 9, characterized in that: The dielectric cavity resonator comprises a ceramic base, and the ceramic base is separately connected between the dielectric resonator and the first plate.

11. The dielectric cavity resonator according to claim 10, characterized in that: The ceramic base is provided with a receiving groove on one side facing the dielectric resonator, and a fastening hole is passed through the bottom of the receiving groove. The ceramic base is connected to the first plate by a fastener passing through the fastening hole, and the fastener does not protrude from the notch of the receiving groove. The ceramic base abuts against and is fixedly connected to the dielectric resonator.

12. The dielectric cavity resonator according to any one of claims 1 to 9, characterized in that: The dielectric resonator is a rotationally symmetrical structure.

13. The dielectric cavity resonator according to any one of claims 1 to 9, characterized in that: The dielectric cavity resonator comprises an adjusting screw, which is threadedly connected to the resonator housing and is used to adjust the resonant frequency of the TM mode.

14. The dielectric cavity resonator according to any one of claims 1 to 9, characterized in that: The dielectric cavity resonator includes a metal disk and an insulating member. The metal disk and the dielectric resonator are arranged opposite to each other along the axial direction of the dielectric resonator. The metal disk is connected to the second plate member through the insulating member. The distance between the metal disk and the dielectric resonator is adjustable, which is used to adjust the resonant frequency of the TE mode.

15. The dielectric cavity resonator according to claim 14, characterized in that The metal disk is in the shape of a circular disk, an outer peripheral wall of the insulating member is provided with an external thread, the insulating member is connected to the center of the metal disk, and is threadedly connected to the second plate member.

16. A filter, characterized in that: Comprising the dielectric cavity resonator according to any one of claims 1-15.

Citation Information

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