Light-emitting display device

Abstract

Disclosed is a light-emitting display device including: a unit pixel group having at least two unit pixels, in which each unit pixel includes a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer respectively corresponding to three primary colors, the first light-emitting layer including two first light-emitting layers in one unit pixel, the second light-emitting layer including two second light-emitting layers in the other unit pixel, and the third light-emitting layer including two third light-emitting layers in the other unit pixel; a laser drilling position is formed in a part of the unit pixel group, the second and third light emitting layers adjacent to the laser drilling position are formed by a second and third modified light emitting layer including a groove, respectively, and the second and third light emitting layers spaced apart from the laser drilling position do not include a groove, the second modified light-emitting layer and the second normal light-emitting layer have the same area, and the third modified light-emitting layer and the third normal light-emitting layer have the same area.

Description

[0001] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0077375 filed in the Korean Intellectual Property Office on June 16, 2023, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] Aspects of some embodiments of the present disclosure relate to a light-emitting display device. Background Art

[0003] The display device is a device including a screen or a display panel that displays an image, and includes a liquid crystal display (LCD), an organic light emitting diode (OLED) display, and the like.

[0004] Such display devices are used in various electronic devices such as mobile phones, navigation devices, digital cameras, electronic books, portable game consoles, and terminals.

[0005] Unlike liquid crystal display devices, organic light emitting display devices generally have self-luminous properties and generally do not require a separate light source, so the thickness and weight can be relatively reduced. In addition, organic light emitting diode displays have relatively high quality characteristics (such as relatively low power consumption, relatively high brightness, and relatively fast response speed).

[0006] The above information disclosed in this Background section is only for enhancement of understanding of the background technology and therefore the information discussed in this Background section does not necessarily constitute prior art. Summary of the invention

[0007] Aspects of some embodiments include a light emitting display device that secures a space capable of transmitting a voltage to a cathode by a method such as using a laser.

[0008] Aspects of some embodiments include a high-resolution light-emitting display device.

[0009] Aspects of some embodiments include a light emitting display apparatus in which light emitting devices of the same color have the same lifespan.

[0010] According to some embodiments, the light-emitting display device includes a unit pixel group consisting of at least two unit pixels, and one unit pixel includes a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer corresponding to three primary colors. The first light-emitting layer includes two first light-emitting layers in one unit pixel. The laser drilling position is formed in a part of the unit pixel group, and the second light-emitting layer and the third light-emitting layer adjacent to the laser drilling position are formed by a second modified light-emitting layer and a third modified light-emitting layer including a groove, and the second light-emitting layer and the third light-emitting layer spaced apart from the laser drilling position are formed by a second normal light-emitting layer and a third normal light-emitting layer not including the groove, and an area of ​​the second modified light-emitting layer is the same as an area of ​​the second normal light-emitting layer or has an area difference of less than 10%, and an area of ​​the third modified light-emitting layer is the same as an area of ​​the third normal light-emitting layer or has an area difference of less than 10%.

[0011] According to some embodiments, the groove of the second modified light emitting layer and the groove of the third modified light emitting layer may be formed at one side of the second modified light emitting layer and one side of the third modified light emitting layer adjacent to the laser drilling position, respectively.

[0012] According to some embodiments, the second modified light-emitting layer can be extended at the side of the second normal light-emitting layer, the groove of the second modified light-emitting layer can be narrowed at the corner portion of the second normal light-emitting layer, the third modified light-emitting layer can be extended at the side of the third normal light-emitting layer, and the groove of the third modified light-emitting layer can be narrowed at the corner portion of the third normal light-emitting layer.

[0013] According to some embodiments, the planar shapes of the second normal light emitting layer and the third normal light emitting layer may have a quadrangular shape, and the corners may have chamfered corners or rounded corners.

[0014] According to some embodiments, the first light-emitting layer is formed of a first normal light-emitting layer not including a groove, and the first light-emitting layer included in the unit pixel includes a first-1 light-emitting layer and a first-2 light-emitting layer, and the first-1 light-emitting layer and the first-2 light-emitting layer have a rectangular shape in a plane shape, and corner portions of the rectangular shape are removed or have rounded corners, and the direction along which the first-1 light-emitting layer is arranged may be different from the direction along which the first-2 light-emitting layer is arranged.

[0015] According to some embodiments, a light emitting device including a first-1 light emitting layer and a light emitting device including a first-2 light emitting layer included in one unit pixel may be electrically connected to the same pixel driving unit through a connection line.

[0016] According to some embodiments, when all of the laser drilling locations are positioned in one unit pixel, a portion of the connection line may extend along the periphery of the unit pixel.

[0017] According to some embodiments, the first light-emitting layer adjacent to the laser drilling position is formed as a first modified light-emitting layer including a groove, and the aforementioned first light-emitting layer positioned away from the laser drilling position is formed as a first normal light-emitting layer not including a groove, and the area of ​​the first modified light-emitting layer and the area of ​​the first normal light-emitting layer can be the same or have an area difference of 10% or less.

[0018] According to some embodiments, each of the first normal light emitting layers has a rectangular shape with chamfered or rounded corners in a planar shape, and two first modified light emitting layers are included in one unit pixel, and the two first modified light emitting layers may have different elongated directions.

[0019] According to some embodiments, the second modified light emitting layer additionally extends even at a corner portion of the second normal light emitting layer, and the third modified light emitting layer may also additionally extend at a corner portion of the third normal light emitting layer.

[0020] According to some embodiments, one unit pixel group may include four unit pixels, and the laser drilling position may be located across all four unit pixels.

[0021] According to some embodiments, the center of the laser drilling location may be positioned at one of four unit pixels.

[0022] According to some embodiments, the center of the laser drilling location may be positioned at the point where four unit pixels meet.

[0023] According to some embodiments, one unit pixel group may include four unit pixels, and the laser drilling position may be located across two of the four unit pixels.

[0024] According to some embodiments, one unit pixel group may include four unit pixels, and the laser drilling position may be located in one of the four unit pixels.

[0025] According to some embodiments, in at least two different unit pixel groups, laser drilling positions may be different from each other.

[0026] According to some embodiments, a light-emitting display device includes: a unit pixel group including at least two unit pixels, one unit pixel including a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer corresponding to three primary colors, wherein the first light-emitting layer includes two first light-emitting layers in one unit pixel, a laser drilling position is formed in a portion of the unit pixel group, the first light-emitting layer is formed by a first normal light-emitting layer not including a groove, and the second light-emitting layer and the third light-emitting layer are formed by a second modified light-emitting layer and a third modified light-emitting layer including a groove.

[0027] According to some embodiments, in the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position, grooves may be formed at one side of the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position, respectively.

[0028] According to some embodiments, the second and third modified light emitting layers located spaced apart from the laser drilling location may include grooves located on a side different from a side where grooves in the second and third modified light emitting layers adjacent to the laser drilling location are located.

[0029] According to some embodiments, one unit pixel group includes four unit pixels, the second modified light-emitting layer and the third modified light-emitting layer have a rectangular shape except for the groove, and have chamfered or rounded corners, each of the second modified light-emitting layer and the third modified light-emitting layer is included in one unit pixel group, the second modified light-emitting layer and the third modified light-emitting layer adjacent to the laser drilling position are both one, and the number of the second modified light-emitting layers and the third modified light-emitting layers away from the laser drilling position is three respectively, and the corners with the grooves positioned in the second modified light-emitting layer and the third modified light-emitting layer adjacent to the laser drilling position and the corners with the grooves positioned in the second modified light-emitting layer and the third modified light-emitting layer away from the laser drilling position can all be different.

[0030] According to some embodiments, a structure for applying power to a cathode, such as a laser drilled hole, may be formed across adjacent unit pixels, so that light emitting devices of the same color may have the same area and the same lifetime despite a reduced area. The planar shape of at least one light emitting device may be changed.

[0031] According to some embodiments, a high-resolution light-emitting display device may be provided by preventing a user from seeing low resolution by preventing light-emitting regions or light-emitting devices of the same color from being positioned adjacent to each other in two adjacent unit pixels. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a top plan view illustrating a light emitting device and a laser drilling location in a light emitting display apparatus according to some embodiments.

[0033] Figures 2 to 5 Is used to explain the Figure 1 FIG. 1 is a diagram of an embodiment of a modification of a planar shape of a light emitting layer.

[0034] Figure 6 is a diagram explaining an interval between light emitting layers in a comparative example.

[0035] Figure 7 is the explanation Figure 1 FIG. 1 is a diagram showing the interval between light-emitting layers in an embodiment of the present invention.

[0036] Figure 8 and Fig. 9 is a table showing characteristics of each comparative example and some embodiments.

[0037] Fig.10 is a cross-sectional view of a light emitting display device according to some embodiments.

[0038] Figures 11 to 23 are diagrams showing further details according to some embodiments.

[0039] Fig.24 is a schematic top plan view of a lower portion of a light emitting device of a light emitting display apparatus according to some embodiments.

[0040] Fig.25 is a circuit diagram of a pixel of a light emitting display device according to some embodiments.

[0041] Fig.26 is a block diagram of an electronic device according to some embodiments. DETAILED DESCRIPTION

[0042] Hereinafter, aspects of some embodiments will be described in more detail with reference to the accompanying drawings so that those skilled in the art can perform the embodiments according to the present disclosure.

[0043] Embodiments in accordance with the present disclosure may be embodied in many different forms and are not limited to the embodiments set forth herein.

[0044] In order to more clearly describe the embodiments, some descriptions of some parts or components that are not necessary to enable a person of ordinary skill in the art to manufacture and use the embodiments according to the present disclosure may be omitted, and the same figure numbers are assigned to the same or similar constituent elements throughout the specification.

[0045] Furthermore, the size and thickness of each component shown in the drawings are arbitrarily represented for convenience of explanation, and thus the embodiments according to the present disclosure are not necessarily limited to the shown contents.

[0046] In the drawings, the thickness is shown exaggerated to clearly indicate each layer and region.

[0047] In the drawings, the thicknesses of some layers and regions are exaggerated for convenience of explanation.

[0048] Furthermore, when a part (component) such as a layer, film, region, panel, or component is referred to as being “on” or “over” another part (component), this includes not only the case where the part (component) is “directly on” the other part (component), but also the case where another part (component) is present between the part (component) and the other part (component).

[0049] In contrast, when a part (component) is referred to as being “directly on” another part (component), this means that there are no other parts between the part (component) and the other part (component).

[0050] In addition, “above” or “on” a reference portion (component) means positioned above or below the reference portion (component), and does not necessarily mean positioned “above” or “on” the reference portion (component) in a direction opposite to gravity.

[0051] In addition, throughout the specification, when a certain component is referred to as “comprising . . . ”, unless otherwise clarified, this means that the certain component may further include other components, rather than excluding the other components.

[0052] In addition, throughout the specification, when a “planar image” is mentioned, it means a case where the target portion is viewed from above, and when a “cross-sectional image” is mentioned, it means a case where a cross section of the vertically cut target portion is viewed from the side.

[0053] In addition, throughout the specification, when "connection" is mentioned, this not only means the case where two or more components are directly connected, but also means the case where two or more constituent elements are indirectly connected through another component, the case where they are physically connected or the case where they are electrically connected, and although they are called different names according to the position or function, it can include the case where basically integral parts are connected to each other.

[0054] In addition, throughout the specification, when a part (component) such as a line, a layer, a film, a region, a plate, or a component "extends in a first direction or a second direction", this means not only a straight line extending in the corresponding direction, but also includes a structure extending generally along the first direction or the second direction, a structure bent at one portion, a structure having a zigzag structure, or a structure extending while including a bent structure.

[0055] In addition, electronic devices (e.g., mobile phones, TVs, monitors, notebook computers) including the display devices and display panels described in this specification or electronic devices including the display devices and display panels manufactured by the manufacturing methods described in this specification are not excluded from the scope of this specification.

[0056] First, refer to Figure 1 A planar structure of four unit pixels included in a light emitting display device is described.

[0057] Figure 1 is a top plan view illustrating a light emitting device and a laser drilling location in a light emitting display apparatus according to some embodiments.

[0058] exist Figure 1, the dotted lines schematically illustrate the planar positions of the unit pixels PXU11, PXU12, PXU21, and PXU22.

[0059] Figure 1 The four unit pixels PXU11 , PXU12 , PXU21 , and PXU22 shown in may constitute one unit pixel group.

[0060] like Figure 1 As shown in FIG. 1 , each of the unit pixels PXU11, PXU12, PXU21, and PXU22 may include a Fig.24 The three pixel drive units described (refer to Fig.24 PCa, PCb and PCc in the substrate), and three pixel driving units PCa, PCb and PCc are formed on a substrate, and four light emitting devices may be located on the substrate.

[0061] Each light emitting device may include an anode, a light emitting layer and a cathode. Figure 1 , the anode and the cathode are omitted, and the planar shape of each light-emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c is shown.

[0062] Figure 1 The planar shape of each light-emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c shown in FIG. constitutes a light-emitting region. The light-emitting region may be aligned with the planar shape of the light-emitting device or the pixel defining layer (see FIG. Fig.10 380) opening (see Fig.10 The shape of OP) corresponds to that of

[0063] For example, the opening OP of the pixel defining layer 380 exposes at least a portion of the anode, and within the opening OP of the pixel defining layer 380, each light-emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c can be positioned.

[0064] As a result, the light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and EML22c are located within the opening OP of the pixel defining layer 380, and the light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and EML22c may have the same planar shape as that of the opening OP.

[0065] Here, according to some embodiments, each of the light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and EML22c is located within the opening OP and may include at least one of the quantum dot materials.

[0066] The pixel defining layer 380 and the light emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c are Fig.10 In this regard, they can be formed with an integral cathode (see Fig.10 The cathode in the

[0067] The light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and EML22c include first light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, and EML22a2, and second light-emitting layers EML11b , EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2 can be divided into a first-1 light-emitting layer EML11a1, EML12a1, EML21a1, EML22a1 and a first-2 light-emitting layer EML11a2, EML12a2, EML21a2, EML22a2 that emit light of the same color.

[0068] Here, the first light emitting layer may emit red light, the second light emitting layer may emit green light, and the third light emitting layer may emit blue light.

[0069] However, according to some embodiments, the first light emitting layer divided into two light emitting layers (the first-1 light emitting layer and the first-2 light emitting layer) may emit blue light or green light, and the remaining two lights may correspond to the second light emitting layer and the third light emitting layer, respectively.

[0070] Furthermore, according to some embodiments, light other than red light, green light, and blue light, which are lights of three primary colors, may be emitted.

[0071] In each unit pixel PXU11, PXU12, PXU21, PXU22, the second light-emitting layers EML11b, EML12b, EML21b, EML22b and the third light-emitting layers EML11c, EML12c, EML21c, EML22c are arranged in a first inclined direction, and the first-1 light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1 and the first-2 light-emitting layers EML11a2, EML12a2, EML21a2, EML22a2 may be arranged in a second inclined direction intersecting the first inclined direction.

[0072] Here, the first inclined direction is a direction between the opposite direction of the first direction DR1 and the second direction DR2 , and may have an angle of 45 degrees with the opposite direction of the first direction DR1 or the second direction DR2 .

[0073] Meanwhile, the second oblique direction is a direction between the first direction DR1 and the second direction DR2 and may have an angle of 45 degrees with the first direction DR1 or the second direction DR2.

[0074] Each of the three pixel driving units PCa, PCb and PCc includes a first light emitting device, a second light emitting device and a third light emitting device, the first light emitting device includes a first light emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2 and EML22a2, the second light emitting device includes a second light emitting layer EML11b, EML12b, EML21b and EML22b, and the third light emitting device includes a third light emitting layer EML11c, EML12c, EML21c, EML22c.

[0075] At the same time, the pixel driving unit connected to the first light emitting device is electrically connected to both the first-1 light emitting device including the first-1 light emitting layers EML11a1, EML12a1, EML21a1, EML22a1 and the first-2 light emitting device including the first-2 light emitting layers EML11a2, EML12a2, EML21a2, EML22a2, and at this time, the first-1 light emitting device and the first-2 light emitting device can be connected in parallel.

[0076] However, according to some embodiments, the first-1 light emitting device and the first-2 light emitting device may be connected in series.

[0077] Reference Figure 1 , the laser drilling position LDP is also shown.

[0078] exist Figure 1 , the laser drilling position LDP is formed around a corner where all the unit pixels PXU11 , PXU12 , PXU21 , and PXU22 meet in one unit pixel group, and is formed across all the unit pixels PXU11 , PXU12 , PXU21 , and PXU22 .

[0079] In addition, Figure 1 In the embodiment of the present invention, the center of the laser drilling position LDP does not coincide with the boundaries of the four unit pixels PXU11, PXU12, PXU21 and PXU22. Figure 1 In the embodiment of the present invention, the center of the laser drilling position LDP is located within the unit pixel PXU22.

[0080] This may be because the laser drilling position LDP is positioned away from the largest light emitting layer EML11c among the four adjacent light emitting layers EML11c, EML12a2, EML21a1, and EML22b.

[0081] The connection electrode to which the voltage supplied to the cathode is applied (see Fig.24 The CE in the figure can be positioned below the laser drilling location LDP.

[0082] The laser drilling electrically connects the connection electrode CE and the cathode formed as one body by irradiating laser to melt the insulating layer positioned between the connection electrode CE and the cathode.

[0083] At this time, when the area of ​​the portion melted by the laser is large and the laser is irradiated to the light emitting layer and / or the anode and other conductors, a short circuit may occur and the pixel may malfunction.

[0084] Therefore, a certain area needs to be allocated for laser drilling.

[0085] exist Figure 1 In the embodiment of the present invention, the two light emitting layers EML11c and EML22b located adjacent to the laser drilling position LDP are formed into a structure having a concave groove to maintain a distance from the laser drilling position LDP.

[0086] The light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c can be divided into normal light-emitting layers EML11a1, EML12a1, EML21a1, EML22a2, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML12c, EML21c, EML22c which do not include significantly concave grooves and modified light-emitting layers EML11c, EML22b which include grooves.

[0087] Here, the normal light emitting layer may be positioned away from the laser drilling position LDP, and the modified light emitting layer may be positioned adjacent to the laser drilling position LDP.

[0088] The first light emitting layer not including the groove (hereinafter referred to as the first normal light emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2) has a rectangular planar shape and may have a structure having chamfered or rounded corners.

[0089] Some of the first normal light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, and EML22a2 (first-1 normal light-emitting layers EML11a1, EML12a1, EML21a1, and EML22a1) are arranged to be elongated in the first direction DR1, and another part (first-2 normal light-emitting layers EML11a2, EML12a2, EML21a2, and EML22a2) may be arranged to be elongated in the second direction DR2.

[0090] On the other hand, the second light emitting layer not including the groove (hereinafter referred to as the second normal light emitting layer EML11b, EML12b, EML21b) has a square planar shape and may have a structure in which corners are chamfered, and according to some embodiments, the corners may also be rounded.

[0091] In the following, embodiments of chamfering will be mainly studied.

[0092] In addition, the third light emitting layer without the groove (hereinafter also referred to as the third normal light emitting layer EML12c, EML21c, EML22c) may have a square planar shape and a structure with chamfered corners.

[0093] In the following, embodiments of chamfering will be mainly studied.

[0094] exist Figure 1 In the embodiment, the second normal light emitting layers EML11b, EML12b, EML21b are formed to have a relatively smaller area than the third normal light emitting layers EML12c, EML21c, EML22c.

[0095] However, according to some embodiments, the areas of the second normal light emitting layers EML11b, 12b, EML21b and the third normal light emitting layers EML12c, 21c, EML22c may be the same, or the second normal light emitting layers EML11b, 12b, EML21b may have a larger area.

[0096] According to some embodiments, the first normal light-emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, the second normal light-emitting layer EML11b, EML12b, EML21b and the third normal light-emitting layer EML12c, EML21c, EML22c may have a polygonal shape such as a triangular shape or a circular shape or an elliptical shape, and in the case of a polygon, the edges may be chamfered or have rounded corners.

[0097] Meanwhile, the modified light emitting layer EML11c, EML22b including the groove is positioned adjacent to the laser drilling position LDP, and includes the groove sunken to maintain a distance from the position of the laser drilling position LDP.

[0098] exist Figure 1 , the third modified light emitting layer EML11c located in the unit pixel PXU11 and the second modified light emitting layer EML22b located in the unit pixel PXU22 are shown as solid lines, and dotted lines overlapping them are also shown.

[0099] Here, the dotted lines represent the sizes of the third normal light emitting layers EML12c, EML21c, EML22c and the second normal light emitting layers EML11b, EML12b, EML21b positioned in different portions; for example, by Figures 2 to 5 Research it.

[0100] Figures 2 to 5 Is used to explain the Figure 1 FIG. 1 is a diagram of an embodiment of a modification of a planar shape of a light emitting layer.

[0101] Figure 2 and Figure 3 is a view of a third modified light emitting layer EML11c located in the unit pixel PXU11, Figure 4 and Figure 5 is a view of a second modified light emitting layer EML22 b located in the unit pixel PXU22 .

[0102] First, through Figure 2 and Figure 3 A planar shape of the third modified light emitting layer EML11 c positioned in the unit pixel PXU11 is described.

[0103] exist Figure 2 , the third modified light emitting layer EML11 c positioned in the unit pixel PXU11 is illustrated as a modified light emitting layer, and the third modified light emitting layer EML11 c is illustrated as a solid line.

[0104] At the same time, Figure 2 , a normal light emitting layer is also shown by a dotted line, and the third normal light emitting layer EML12c positioned in the unit pixel PXU12 is shown as the normal light emitting layer.

[0105] exist Figure 2 , a dotted line and a solid line are shown as a solid line when the two lines overlap at a corner portion.

[0106] exist Figure 2 , reference numerals are assigned to different portions except for a corner portion at which a solid line of the third modified light emitting layer EML11c and a dotted line of the third normal light emitting layer EML12c overlap.

[0107] For example, in the third modified light emitting layer EML11c, reference numerals are assigned to the side portion EML11c-1 and the groove portion EML11c-2, and in the third normal light emitting layer EML12c, reference numerals are assigned to the side portion EML12c-1 and the corner portion EML12c-2 corresponding to the groove portion EML11c-2 of the third modified light emitting layer EML11c.

[0108] Figure 2 The arrow shown in shows the direction along which the third normal light emitting layer EML12c is deformed and changed into the third modified light emitting layer EML11c.

[0109] That is, the arrow expands from the side EML12c-1 of the third normal light emitting layer EML12c to the side EML11c-1 of the third modified light emitting layer EML11c, and shrinks from the corner portion EML12c-2 of the third normal light emitting layer EML12c to the groove portion EML11c-2 of the third modified light emitting layer EML11c.

[0110] Figure 2 The relationship between the area of ​​the third normal light emitting layer EML12c and the area of ​​the third modified light emitting layer EML11c shown in Figure 3 Shown in.

[0111] exist Figure 3 , only a portion where the third modified light emitting layer EML11c is wider than the third normal light emitting layer EML12c is shown on the left, and only a portion where the third normal light emitting layer EML12c is wider than the third modified light emitting layer EML11c is shown on the right.

[0112] lie in Figure 3 The area on the left side is the area between the side EML11c-1 of the third modified light-emitting layer EML11c and the side EML12c-1 of the third normal light-emitting layer EML12c. It is distinguished and displayed as an upper area Aus at the top, a lower area Abs at the bottom, a left area Als at the left side, and a right area Ars at the right side.

[0113] exist Figure 3 , a portion located on the right side is a region between a corner portion EML12c-2 of the third normal light emitting layer EML12c and a groove portion EML11c-2 of the third modified light emitting layer EML11c, and is shown as a groove side region Ald.

[0114] exist Figure 3 The equal sign shown in the center indicates that Figure 3 The sum of the areas shown on the left is Figure 3 The areas shown on the right side are equal to each other.

[0115] Therefore, since the third modified light-emitting layer EML11c and the third normal light-emitting layers EML12c, EML21c and EML22c have the same area and the lifetime of the light-emitting layer is proportional to the planar area of ​​the light-emitting layer, all the third light-emitting layers EML11c, EML12c, EML21c and EML22c can have the same lifetime.

[0116] Regions of the third light emitting layers EML11c, EML12c, EML21c, and EML22c may be formed in various manners according to materials constituting the light emitting layers.

[0117] Meanwhile, due to dispersion or errors that may occur in an actual manufacturing process, a difference in area between the two sides may occur.

[0118] Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and the area difference that may occur between the normal light emitting layer and the modified light emitting layer due to dispersion or error may have an area difference of up to 10%.

[0119] Although a difference in the lifetime of the light-emitting layer may occur due to the difference in area, such a difference in lifetime is negligible.

[0120] At the same time, in the following, Figure 4 and Figure 5 A planar shape of the second modified light emitting layer EML22 b positioned in the unit pixel PXU22 is described.

[0121] exist Figure 4 , the second modified light emitting layer EML22 b positioned in the unit pixel PXU22 is illustrated as a modified light emitting layer, and the second modified light emitting layer EML22 b is illustrated as a solid line.

[0122] At the same time, Figure 4 , a normal light emitting layer is also shown by a dotted line, and a second normal light emitting layer EML21 b positioned in the unit pixel PXU21 is shown.

[0123] exist Figure 4 , a dotted line and a solid line are shown as a solid line when the two lines overlap at a corner portion.

[0124] exist Figure 4 , reference numerals are assigned to different portions except for a corner portion at which a solid line of the second modified light emitting layer EML 22 b and a dotted line of the second normal light emitting layer EML 21 b overlap.

[0125] For example, reference numerals are assigned to the side EML22b-1 and the groove portion EML22b-2 of the second modified light emitting layer EML22b, and reference numerals are assigned to the side EML21b-1 of the second normal light emitting layer EML21b and the corner portion EML21b-2 corresponding to the groove portion EML22b-2 of the second modified light emitting layer EML22b.

[0126] Figure 4 The arrow shown in shows the direction along which the second normal light emitting layer EML21b is deformed and changed into the second modified light emitting layer EML22b.

[0127] That is, the arrow expands from the side EML21b-1 of the second normal light emitting layer EML21b to the side EML22b-1 of the second modified light emitting layer EML22b, and shrinks from the corner portion EML21b-2 of the second normal light emitting layer EML21b to the groove portion EML22b-2 of the second modified light emitting layer EML22b.

[0128] Figure 4 The relationship between the area of ​​the second normal light emitting layer EML21b and the area of ​​the second modified light emitting layer EML22b shown in Figure 5 Shown in.

[0129] exist Figure 5 , the second modified light emitting layer EML22b is shown on the right to be formed wider than the second normal light emitting layer EML21b, and Figure 5 , it is shown that the second normal light emitting layer EML 21 b is formed to be wider than the second modified light emitting layer EML 22 b.

[0130] lie in Figure 5 The right side portion is the area between the side EML22b-1 of the second modified light-emitting layer EML22b and the side EML21b-1 of the second normal light-emitting layer EML21b, and is divided into an upper area Aus located on the upper side, a lower area Abs located on the lower side, a left area Als located on the left side, and a right area Ars located on the right side.

[0131] lie in Figure 5 The left side portion of is a region between the corner portion EML21b-2 of the second normal light emitting layer EML21b and the groove portion EML22b-2 of the second modified light emitting layer EML22b, and is shown as a groove side region Ald.

[0132] exist Figure 5 The equal sign shown in the center indicates that Figure 5 The area shown on the left is Figure 5 The sums of the areas shown on the right are equal to each other.

[0133] Therefore, since the second modified light-emitting layer EML22b and the second normal light-emitting layers EML11b, EML12b and EML21b have the same area and the lifetime of the light-emitting layer is proportional to the plane area of ​​the light-emitting layer, all the second light-emitting layers EML11b, EML12b, EML21b and EML22b can have the same lifetime.

[0134] Regions of the third light emitting layers EML11b, EML12b, EML21b, and EML22b may be formed in various ways according to materials constituting the light emitting layers.

[0135] Meanwhile, due to dispersion or errors that may occur in an actual manufacturing process, a difference in area between the two sides may occur.

[0136] Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and an area difference that may occur between a normal light emitting layer and a modified light emitting layer due to dispersion or error may have an area difference of up to 10%.

[0137] Although a difference in the lifetime of the light-emitting layer may occur due to the difference in area, such a difference in lifetime is negligible.

[0138] Figure 3 The groove side region Ald shown in FIG. 1 (which is a region between the corner portion EML12c-2 of the third normal light emitting layer EML12c and the groove portion EML11c-2 of the third modified light emitting layer EML11c) and Figure 5 The groove side region Ald shown in FIG. 1 , which is a region between the corner portion EML21 b - 2 of the second normal light emitting layer EML21 b and the groove portion EML22 b - 2 of the second modified light emitting layer EML22 b , may have different areas.

[0139] However, according to some embodiments, Figure 3 and Figure 5 The areas of the groove side regions Ald can be set equal to each other.

[0140] like Figures 2 to 5 As shown in, due to the groove portion EML11c-2 of the third modified light-emitting layer EML11c and the groove portion EML22b-2 of the second modified light-emitting layer EML22b, a distance above a certain level can be maintained between the laser drilling position LDP and the two modified light-emitting layers EML11c and EML22b, so that the light-emitting layer, the anode and / or the light-emitting area will not be damaged even when laser drilling is performed, and therefore, the light-emitting device will not be damaged during laser drilling.

[0141] Furthermore, when the laser drilling position LDP requires a certain area, it can be formed as follows Figure 1 In the embodiment, laser drilling can be formed across a plurality of adjacent unit pixels PXU11, PXU12, PXU21, and PXU22, so that laser drilling can be formed even in a high-resolution or high-pixel-per-inch light-emitting display device.

[0142] Since the interval between adjacent light-emitting layers can be changed by modifying the light-emitting layers as described above, Figure 6 and Figure 7 The horizontal spacing between the light-emitting layers is investigated in more detail.

[0143] Figure 6 is a diagram showing the interval between light emitting layers in a comparative example, Figure 7 It is shown Figure 1 FIG. 1 is a diagram showing the interval between light-emitting layers in an embodiment of the present invention.

[0144] Figure 6 A comparative example is Figure 1 An example in which laser drilling is not performed and the laser drilling position LDP is not included in the plurality of unit pixels PXU11, PXU12, PXU21, and PXU22 in the embodiment of FIG.

[0145] As a result, it can be confirmed that the intervals between each light-emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and EML22c are the same as Gap1.

[0146] However, when Figure 6 The comparative example is changed to include the laser drilling position LDP Figure 1 In the embodiment of the present invention, each of the light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c and EML22c is changed. Figure 7 Shown in FIG. 1 are Gap1, Gap2 and Gap3.

[0147] Reference Figure 7The first normal light emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, the second normal light emitting layers EML11b, EML12b, EML21b and the third normal light emitting layers EML12c, EML21c, EML22c may have the following characteristics: Figure 6 Gap1 in.

[0148] However, the distances between the modified light emitting layers EML11 c and EML22 b and the normal light emitting layer may have a distance different from Gap1 .

[0149] For example, the third modified light emitting layer EML11c may have Gap2 spaced apart from the adjacent normal light emitting layers EML11a1, EML11a2, EML12a2, and EML21a1, and the second modified light emitting layer EML22b may have Gap3 spaced apart from the adjacent normal light emitting layers EML12a2, EML21a1, EML22a1, and EML22a2.

[0150] Reference Figure 7 , a plane area of ​​the third modified light emitting layer EML11c is greater than a plane area of ​​the second modified light emitting layer EML22b.

[0151] Gap2, which is the distance between the third modified light-emitting layer EML11c having a larger area and the adjacent normal light-emitting layers EML11a1, EML11a2, EML12a2 and EML21a1, is greater than Gap3, which is the distance between the second modified light-emitting layer EML22b having a smaller area and the adjacent normal light-emitting layers EML12a2, EML21a1, EML22a1 and EML22a2.

[0152] Here, Gap1 may have a greater value than Gap2 and Gap3, and when Gap1 is 100, Gap2 may be about 95 (according to an embodiment, Gap2 may be 92 or more and 98 or less), and Gap3 may be about 93.

[0153] However, according to some embodiments, Gap3 may have a larger value than Gap2.

[0154] At the same time, Figure 7 In the embodiment, the groove portions ( Figure 2 EML11c-2) and the groove portion of the second modified light emitting layer EML22b ( Figure 4The gap between the EML 22 b - 2 in the modified light emitting layer 22 b - 2 (hereinafter referred to as the gap between the modified light emitting layers) may have an interval equal to twice that of Gap1, and when Gap1 is 100, the interval may be 180 or more. The interval may have a value less than or equal to 200.

[0155] Here, modifying the interval between the light emitting layers may pass through the center of the laser drilling position LDP.

[0156] At the same time, among the intervals between the modified light-emitting layers, the length corresponding to the laser drilling position LDP (that is, the length of the diameter of the laser drilling position LDP) may have an interval corresponding to Gap1, and the distance between the laser drilling position LDP and one modified light-emitting layer may have an interval equal to half of Gap1.

[0157] When Gap1 is 100, the diameter of the laser drilling position LDP may have a value of 90 or more and 100 or less, and the distance between the laser drilling position LDP and the modified light emitting layer may have a value of 50 or more and 55 or less.

[0158] Meanwhile, according to the development of laser technology, the area occupied by the laser drilling position LDP may have a value of 90 or less.

[0159] exist Figure 1 and Figure 7 In the embodiment of FIG. 1 , an embodiment in which power is applied to the cathode by laser drilling is shown, but the method for applying voltage to the cathode may not be limited thereto.

[0160] That is, the connection electrode to which the voltage to be supplied to the cathode is applied may be exposed through the opening (see Fig.24 CE in the cathode), then a cathode can be formed to apply a voltage to the cathode, which will Fig.19 Discuss.

[0161] At this time, the connection electrode to which the voltage to be supplied to the cathode is applied (see Fig.24 The area of ​​the opening through which the CE) can be exposed can be smaller than the area of ​​the laser drilling position LDP, and the length of the diameter of the opening can have a value smaller than Gap1, and when Gap1 is 100, the length of the diameter of the opening can have a value of 30 or greater and less than 100.

[0162] In the following, we will Figure 8 and Fig. 9 The characteristics of the comparative example and the embodiment are discussed numerically.

[0163] Figure 8 and Fig. 9 is a table showing characteristics of each comparative example and some embodiments.

[0164] Figure 8 and Fig. 9 Values ​​measured based on light-emitting display devices having different pixel per inch (ppi) values ​​are shown. Figure 8 is with Figure 1 and Figure 7 The same light-emitting display device, Fig. 9 is with Figure 1 and Figure 7 The light-emitting display device is different from the light-emitting display device.

[0165] here, Figure 8 It can be a 218ppi emissive display device, Fig. 9 It can be a 254ppi emissive display device.

[0166] First, through Figure 8 Comparative Example 1 and Embodiment 1 are compared and discussed.

[0167] Comparative Example 1 Figure 6 As shown in the figure, Example 1 can be used with Figure 1 and Figure 7 same.

[0168] In addition, Figure 8 and Fig. 9 In the equation, R corresponds to Figure 1 , Figure 6 and Figure 7 The first light-emitting layer corresponds to the red light-emitting layer, G corresponds to Figure 1 , Figure 6 and Figure 7 The second light-emitting layer corresponds to the green light-emitting layer, and B corresponds to Figure 1 , Figure 6 and Figure 7 The third light-emitting layer corresponds to the light-emitting layer for blue.

[0169] Reference Figure 8 , in Comparative Example 1, laser drilling was not performed, whereas in Embodiment 1, laser drilling was performed.

[0170] Figure 8 The aperture ratio of each color in the comparative example 1 is shown to be the same as the aperture ratio of each color in the embodiment 1, and at this time, the pixel defining layer (see Fig.10 The gap 380GAP (i.e., the gap between the light-emitting layers) in FIG.

[0171] Gap1 is Figure 6 The interval between the normal light-emitting layers in the embodiment 1 can be the same as the interval between the normal light-emitting layers in the embodiment 1 (normal part).

[0172] However, in Example 1, the laser drilling portion (L / D portion) may have a value of Gap2 or Gap3, and the positions of Gap2 and Gap3 may be as follows: Figure 7 as shown in .

[0173] Here, Gap1 may be about 25 μm, Gap2 may be about 24 μm, and Gap3 may be about 23.5 μm.

[0174] On the other hand, Comparative Example 2 and Example 2 are Fig. 9 As shown below.

[0175] Comparative Example 2 is similar to Figure 6 , but the size of the actual Gap1 may be different from that of Comparative Example 1 due to different ppi values, and in the case of Example 2, similar to Figure 7 , but the actual sizes of Gap1, Gap2 and Gap3 may be different due to different ppi values.

[0176] Reference Fig. 9 , showing that laser drilling was not performed in Comparative Example 2, but was performed in Example 2. In addition, the opening ratio of each color in Comparative Example 2 and the opening ratio of each color in Example 2 are not exactly the same, but it can be seen that they are formed almost the same.

[0177] Meanwhile, the pixel defining layers in the comparative example 2 and the embodiment 2 (see Fig.10 The gap 380GAP (ie, the gap between the light emitting layers) in 380 may be as follows.

[0178] Gap1 ′ is the distance between the normal light emitting layers in Comparative Example 2, and may be the same as the distance between the normal light emitting layers in Embodiment 2 (normal portion).

[0179] However, in Example 2, the laser drilled portion (L / D portion) may have a value of Gap2' or Gap3'.

[0180] The positions of Gap2' and Gap3' can be respectively Figure 7 The positions of Gap2 and Gap3 in the PCR product are the same.

[0181] Here, Gap1' may be about 21.5 μm, Gap2' may be about 20 μm, and Gap3' may be about 19.8 μm.

[0182] Reference Figure 8 and Fig. 9 , the gaps Gap1, Gap1' between the normal light emitting layers may have values ​​greater than those of the gaps Gap2, Gap3, Gap2' and Gap3' between the modified light emitting layers, and they may have the above-mentioned values.

[0183] The intervals described above may be changed according to the embodiment.

[0184] In the following, we will Fig.10 A cross-sectional structure of a light emitting display device according to some embodiments is schematically discussed.

[0185] Fig.10 is a cross-sectional view of a light emitting display device according to some embodiments.

[0186] exist Fig.10 In the cross-sectional view, the layers corresponding to the cathode, the pixel defining layer 380, the intermediate layer including the functional layer FL and the light-emitting layer, and the anode are also referred to as light-emitting device layers, and the planarization layer located below the light-emitting device layer (i.e., below the anode) and the conductive layer, semiconductor layer, and insulating layer constituting the transistor and the capacitor located below the anode may also be referred to as driving element layers.

[0187] The light emitting device may be positioned in the light emitting device layer.

[0188] Fig.10 1 shows a light emitting device, and also shows an opening OP positioned in a pixel defining layer 380 to expose a portion of an anode and a current passing therethrough from a pixel driving unit (refer to Fig.24 A transistor among PCa, PCb and PCc transmits to the opening OP2 of the anode.

[0189] In addition, Fig.10 In the figure, a laser drilling position LDP where laser drilling is performed is also schematically shown.

[0190] exist Fig.10 , the structure below the anode (ie, the structure of the driving element layer) is simply depicted with only one transistor shown.

[0191] A brief overview of the layer structure of the driving element from the substrate 110 to the interlayer insulating layer 161 is as follows.

[0192] The substrate 110 may include a rigid material that does not bend, such as glass, or may include a flexible material that can bend, such as plastic or polyimide.

[0193] In the case of a flexible substrate, a double-layer structure of polyimide and a barrier layer formed of an inorganic insulating material thereon may be repeatedly formed.

[0194] A lower shielding layer BML including metal is positioned on the substrate 110 , and the lower shielding layer BML may overlap a channel of one of transistors positioned in the pixel driving units PCa, PCb, PCc included in the pixel on a plane.

[0195] According to some embodiments, a driving low voltage ELVSS (see Fig.25 ) drives the low voltage line (see Fig.24 The 174) can be positioned on the same layer as the lower shielding layer BML.

[0196] The substrate 110 and the lower shield layer BML are covered by a buffer layer 111 .

[0197] The buffer layer 111 is used to block the impurity elements from penetrating into the semiconductor layer ACT, and may include silicon oxide SiO x 、Silicon Nitride SiN x or Silicon Oxynitride SiON x Inorganic insulating layer.

[0198] A semiconductor layer ACT formed of a silicon semiconductor (eg, a polycrystalline semiconductor (P—Si)) or an oxide semiconductor is positioned on the buffer layer 111 .

[0199] The semiconductor layer ACT is a semiconductor layer positioned in the pixel driving units PCa, PCb, and PCc included in the pixel, and may include a channel of a transistor including a driving transistor and first and second regions positioned at both sides of the channel.

[0200] Here, the channel of the transistor may be a portion of the semiconductor layer ACT overlapping the gate electrode GE, and the first region and the second region may be portions of the semiconductor layer ACT not overlapping the gate electrode GE.

[0201] That is, the first and second regions positioned on both sides of the channel of the semiconductor layer ACT are not covered by the gate electrode GE and have conductive layer characteristics by plasma treatment or doping so that they can be used as first and second electrodes of the transistor.

[0202] The first gate insulating layer 141 may be positioned on the semiconductor layer ACT.

[0203] The first gate insulating layer 141 may include silicon oxide SiO x 、Silicon Nitride SiN x or Silicon Oxynitride SiON x Inorganic insulating layer.

[0204] A first gate conductive layer including gate electrodes GE of transistors positioned in the pixel driving units PCa, PCb, and PCc may be positioned on the first gate insulating layer 141 .

[0205] The auxiliary driving low voltage line 174 - 1 is positioned in the first gate conductive layer, and may form a scan line in addition to the gate electrodes GE of transistors positioned in the pixel driving units PCa, PCb, and PCc.

[0206] Meanwhile, the first gate conductive layer may include one electrode of one capacitor positioned in the pixel driving units PCa, PCb, and PCc.

[0207] The first gate conductive layer may include a metal or a metal alloy such as aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), etc., and may be composed of a single layer or a multilayer.

[0208] After forming the first gate conductive layer, a plasma treatment or a doping process may be performed to make the exposed region of the first semiconductor layer a conductor.

[0209] That is, the semiconductor layer ACT covered by the gate electrode GE is not conductive, and a portion of the semiconductor layer ACT not covered by the gate electrode GE may have the same characteristics as a conductive layer.

[0210] The interlayer insulating layer 161 may be positioned on the first gate conductive layer and the first gate insulating layer 141 .

[0211] The interlayer insulating layer 161 may include silicon oxide SiO x 、Silicon Nitride SiN x 、Silicon Oxynitride SiON x The inorganic insulating layer may be formed to be thicker than 100 Å.

[0212] In addition, according to some embodiments, the interlayer insulating layer 161 may be formed of an organic insulating layer, and may include one or more materials selected from the group consisting of polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin.

[0213] An anode layer including an anode and a connection electrode CE is positioned on the interlayer insulating layer 161 .

[0214] The anode is connected to a second region of the semiconductor layer serving as a second electrode of the transistor through an opening OP2 (hereinafter referred to as an anode opening) located in the interlayer insulating layer 161 and the first gate insulating layer 141 .

[0215] As a result, the anode can receive the output of the transistor.

[0216] The connection electrode CE is formed of the same material as the anode, and is connected to the auxiliary driving low voltage line 174 - 1 through an opening OP1 (hereinafter referred to as a laser drilled opening) located in the interlayer insulating layer 161 .

[0217] As a result, the connection electrode CE receives the driving low voltage ELVSS. The anode layer may be composed of a single layer including a transparent conductive oxide or a metal material or a multi-layer including a transparent conductive oxide or a metal material.

[0218] The transparent conductive oxide may include indium tin oxide (ITO), poly-ITO, indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), and indium tin zinc oxide (ITZO).

[0219] The metal material may include silver (Ag), molybdenum (Mo), copper (Cu), gold (Au), and aluminum (Al).

[0220] A pixel defining layer 380 including an opening OP is formed on the anode layer.

[0221] The opening OP (hereinafter also referred to as a light emitting device opening) of the pixel defining layer 380 is a portion corresponding to the light emitting region and / or the light emitting layer EML, exposes a portion of the anode, and may have a tapered sidewall.

[0222] According to some embodiments, Fig.10 As shown in , the light emitting layer EML is positioned within the opening OP of the pixel defining layer 380 , and the light emitting layer EML may also be positioned on the pixel defining layer 380 .

[0223] According to some embodiments, the light emitting layer EML may be formed by an inkjet method, and may include at least one of quantum dot materials.

[0224] When the light emitting layer EML is formed by an inkjet method, the pixel defining layer 380 may serve to partition the injected liquid, and in this case, the light emitting layer EML may be positioned only within the opening OP of the pixel defining layer 380 .

[0225] The light emitting layer EML may include a quantum dot material, and according to some embodiments, a color conversion layer including the quantum dot material may be separately positioned over the cathode.

[0226] In this specification, a quantum dot means a crystal of a semiconductor compound, and may include any material capable of emitting light of various emission wavelengths according to the size of the crystal or by adjusting the ratio of elements in the quantum dot compound.

[0227] The diameter of a quantum dot may be, for example, about 1 nm to 10 nm.

[0228] The quantum dots can be synthesized by a wet chemical process, an organometallic chemical vapor deposition process, a molecular beam epitaxy process, or a process similar thereto.

[0229] The wet chemical process is a method of growing quantum dot particle crystals after mixing an organic solvent and a precursor material.

[0230] As the crystals grow, since the organic solvent acts as a dispersant that naturally coordinates on the surface of the quantum dot crystals and controls the growth of the crystals, the growth of quantum dot particles can be controlled by a process that is easier and cheaper than vapor deposition methods such as metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE).

[0231] The quantum dots are III-VI semiconductor compounds; II-VI semiconductor compounds; III-V semiconductor compounds; I-III-VI semiconductor compounds; IV-VI semiconductor compounds; Group IV elements or compounds; or any combination thereof.

[0232] Examples of II-VI semiconductor compounds include binary element compounds such as CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, MgS, etc.; ternary element compounds such as CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZ nSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, MgZnS, etc.; quaternary element compounds such as CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, HgZnSTe, etc.; or any combination thereof.

[0233] Examples of III-V semiconductor compounds include: binary element compounds such as GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, InSb, etc.; ternary element compounds such as GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InAlP, InNAs, InNSb, InPAs, InPSb, etc.; quaternary element compounds such as GaAlNP, GaAlNAs, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, InAlPSb, etc.; or any combination thereof.

[0234] Meanwhile, the III-V semiconductor compounds may further include a II group element.

[0235] Examples of the Group III-V semiconductor compound also including the Group II element may include InZnP, InGaZnP, InAlZnP, and the like.

[0236] Examples of III-VI semiconductor compounds include binary element compounds such as GaS, Ga 2 S 3 ,GaSe,Ga 2 Se 3 、GaTe、InS、InSe、In 2 Se 3 , InTe, etc.; ternary element compounds such as InGaS 3 and InGaSe 3 ; or any combination thereof.

[0237] Examples of Group I-III-VI semiconductor compounds include ternary element compounds such as AgInS, AgInS 2 、AgInSe 2 、AgGaS、AgGaS 2 、AgGaSe 2 、CuInS、CuInS 2 、CuInSe 2 、CuGaS 2 、CuGaSe 2 、CuGaO 2 、AgGaO 2 、AgAlO 2 etc.; quaternary element compounds, such as AgInGaS 2 and AgInGaSe 2 ; or any combination thereof.

[0238] Examples of IV-VI semiconductor compounds include: binary element compounds such as SnS, SnSe, SnTe, PbS, PbSe, PbTe, etc.; ternary element compounds such as SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, SnPbTe, etc.; quaternary element compounds such as SnPbSSe, SnPbSeTe and SnPbSTe; or any combination thereof.

[0239] Group IV elements or compounds include: single element compounds, such as Si, Ge, etc.; binary element compounds, such as SiC, SiGe, etc.; or any combination thereof.

[0240] Each element included in the multi-element compound such as the binary-element compound, the ternary-element compound, and the quaternary-element compound may be present in the particle at a uniform concentration or a non-uniform concentration.

[0241] That is, the chemical formula means the types of elements included in the compound, and the ratio of elements in the compound may be different.

[0242] For example, AgInGaS 2 Can mean AgIn x Ga 1-x S 2 (x is a real number between 0 and 1).

[0243] On the other hand, the quantum dot may have a single structure or a dual core-shell structure in which the concentration of each element included in the quantum dot is uniform.

[0244] For example, the material included in the core and the material included in the shell may be different from each other.

[0245] The shell of the quantum dot may serve as a protective layer for maintaining the semiconductor properties by preventing chemical denaturation of the core and / or as a charging layer for imparting electrophoretic properties to the quantum dot.

[0246] The shell can be single-layer or multi-layer.

[0247] The interface between the core and the shell may have a concentration gradient in which the concentration of the element present in the shell decreases toward the center.

[0248] Examples of quantum dot shells include metal or non-metal oxides, semiconductor compounds, or combinations thereof.

[0249] Examples of metal or nonmetal oxides include binary element compounds such as SiO 2 、Al 2 O 3 、TiO 2 、ZnO、MnO、Mn 2 O 3 , Mn 3 O 4 , CuO, FeO, Fe 2 O 3 , Fe 3 O 4 , CoO, Co 3 O 4 , NiO, etc.; ternary element compounds such as MgAl 2 O 4 、CoFe 2 O 4 、NiFe 2 O 4、CoMn 2 O 4 etc.; or any combination thereof.

[0250] Examples of semiconductor compounds include Group III-VI semiconductor compounds as described herein; Group II-VI semiconductor compounds; Group III-V semiconductor compounds; Group I-III-VI semiconductor compounds; Group IV-VI semiconductor compounds; or any combination thereof.

[0251] For example, the semiconductor compound may include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaS, GaSe, AgGaS, AgGaS 2 , GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, or any combination thereof.

[0252] Each element included in the multi-element compound such as the binary-element compound or the ternary-element compound may be present in the particle at a uniform concentration or a non-uniform concentration.

[0253] That is, the chemical formula means the types of elements included in the compound, and the ratio of elements in the compound may be different.

[0254] The quantum dot may have a full width at half maximum (FWHM) of an emission wavelength spectrum of about 45 nm or less, specifically about 40 nm or less, more specifically about 30 nm or less, and may improve color purity or color reproducibility within this range.

[0255] In addition, since light emitted by quantum dots is emitted in all directions, the wide viewing angle can be improved.

[0256] In addition, the shape of the quantum dots can be in the form of spherical, pyramidal, multi-arm or cubic nanoparticles, nanotubes, nanowires, nanofibers, nanosheet particles, etc.

[0257] Since the energy band gap can be controlled by adjusting the size of the quantum dots or the ratio of elements in the quantum dot compound, light of various wavelengths can be obtained from the quantum dot light-emitting layer.

[0258] Therefore, by using quantum dots as described above (quantum dots of different sizes or having different element ratios in a quantum dot compound), a light emitting device emitting light of various wavelengths can be realized.

[0259] For example, the size of the quantum dots or the ratio of elements in the quantum dot compound can be selected to emit red, green, and / or blue light.

[0260] Additionally, quantum dots can be configured to emit white light by combining various colors of light.

[0261] The first functional layer FL1 may be positioned between the anode and the light emitting layer EML, and the second functional layer FL2 may be positioned on the light emitting layer EML.

[0262] Here, the first functional layer FL1 may include a hole injection layer and / or a hole transport layer, and the second functional layer FL2 may include an electron transport layer and / or an electron injection layer.

[0263] Here, the functional layer FL and the light emitting layer EML may be referred to as an intermediate layer.

[0264] A first functional layer FL1 and a second functional layer FL2 are also formed on the pixel defining layer 380 and in the opening OP.

[0265] Therefore, in Fig.10 In the embodiment of FIG. 5 , the light emitting layer EML is positioned only within the opening OP of the pixel defining layer 380 , and the functional layer FL may be formed on the pixel defining layer 380 and also within the opening OP.

[0266] However, according to some embodiments, all intermediate layers may be located over the pixel defining layer 380 and within the opening OP.

[0267] The cathode electrode is formed on the second functional layer FL2 as well as the pixel defining layer 380 and the opening OP.

[0268] The anode, the light emitting layer EML, and the cathode constitute a light emitting device, and the light emitting device may further include a functional layer FL.

[0269] The current supplied to the anode passes through the first functional layer FL1 , the light emitting layer EML, and the second functional layer FL2 and is supplied to the cathode.

[0270] At this time, the light emitting layer EML emits light due to current flowing through the light emitting layer EML, so that the light emitting device exhibits brightness.

[0271] Reference Fig.10 , the cathode is connected to the connection electrode CE at the laser drilling position LDP where the laser drilling is performed, and receives the driving low voltage ELVSS from the auxiliary driving low voltage line 174 - 1 through the connection electrode CE.

[0272] Fig.10 A cross-sectional structure of a laser drilling position LDP where laser drilling is performed is shown, and the cathode is connected to the connection electrode CE through neat openings of the functional layer FL and the pixel defining layer 380 .

[0273] However, since the intermediate layer and the pixel defining layer 380 are melted by laser, and the cathode and the connection electrode CE are electrically connected, Fig.10 Different, the cross-sectional structure can be irregular.

[0274] Meanwhile, according to some embodiments, a spacer may be further formed on the pixel defining layer 380 , and the spacer may have a tapered sidewall similar to the pixel defining layer 380 .

[0275] although Fig.10 The structures on the cathode are not shown in FIG. 1 , but an encapsulation layer may be located according to some embodiments.

[0276] The encapsulation layer may include at least one inorganic layer and at least one organic layer, and may have a three-layer structure including a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer.

[0277] The encapsulation layer may serve to protect the light emitting layer EML from moisture or oxygen that may be introduced from the outside.

[0278] According to some embodiments, the encapsulation layer may include a structure in which an inorganic layer and an organic layer are sequentially stacked.

[0279] According to some embodiments, a sensing insulating layer and a plurality of sensing electrodes may be positioned on the encapsulation layer for touch sensing.

[0280] According to some embodiments, a layer including a polarizing plate may be attached to the encapsulation layer to reduce reflection of external light.

[0281] In addition, a color filter or a color conversion layer may be further formed to improve color quality, and at this time, the polarizing plate may not be attached.

[0282] Light blocking layers may be positioned between color filters or color conversion layers.

[0283] In addition, according to some embodiments, a layer having a material capable of absorbing some wavelengths of external light (hereinafter referred to as a reflection adjusting material) may further be included, and in this case, the polarizing plate may not be attached.

[0284] In addition, according to some embodiments, the front surface of the light-emitting display device may be planarized by covering the front surface of the light-emitting display device with an additional organic layer (also referred to as a planarization layer).

[0285] Fig.10 is a cross-sectional structure according to some embodiments, and various deformable structures are possible.

[0286] In the following, we will Figures 11 to 23 Modified embodiments of the above-described embodiments are discussed.

[0287] Figures 11 to 23 are diagrams showing each modified embodiment in more detail.

[0288] First, in Fig.11 and Fig.12 In the following, the laser drilling position LDP in the light emitting display device and the Figure 1 or Figure 7 Embodiments in which the laser drilling position LDP is modified differently.

[0289] exist Fig.11 , two embodiments are shown in which the laser drilling position LDP is arranged across two unit pixels among four adjacent unit pixels PXU11, PXU12, PXU21, and PXU22.

[0290] exist Fig.11 In (A), a laser drilling position LDP is formed across two unit pixels PXU11 and PXU21, two light-emitting layers EML11c and EML21b adjacent to the laser drilling position LDP are formed as modified light-emitting layers including grooves, and the remaining light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML22b, EML12c, EML21c, and EML22c are formed as normal light-emitting layers.

[0291] Here, the groove is formed at one side of the modified light emitting layer EML11c, EML21b adjacent to the laser drilling position LDP.

[0292] At the same time, Fig.11 In (B), a laser drilling position LDP is formed across two unit pixels PXU11 and PXU12, two light-emitting layers EML11c and EML12b adjacent to the laser drilling position LDP are formed as modified light-emitting layers including grooves, and the remaining light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML21b, EML22b, EML12c, EML21c, and EML22c are formed as normal light-emitting layers.

[0293] Here, the groove is formed at one side of the modified light emitting layers EML11c and EML12b adjacent to the laser drilling position LDP.

[0294] In a light emitting display device, the laser drilling position LDP may be formed only at Fig.11 At the position shown in (A) or only formed in Fig.11 At the position shown in (B).

[0295] However, according to some embodiments, the light emitting display device may be alternately arranged. Fig.11 (A) and Fig.11 The laser drilling position LDP at the location shown in (B).

[0296] On the other hand, according to some embodiments, not only Fig.11 (A) and Fig.11 The position shown in (B) and includes the formation of Figure 1 The three positions of the laser drilling positions LDP at the positions shown in may be alternately arranged in one light emitting display device.

[0297] As described above, when the laser drilling positions LDP are variously arranged, the display quality may be uniform throughout the entire area of ​​the light emitting display device.

[0298] Specifically, even when the user rotates the light-emitting display device by 90 degrees, the laser drilling position LDP does not deviate to one side, and thus the display quality may be constant.

[0299] At the same time, Fig.12 , two examples are shown in which the laser drilling position LDP is located within one unit pixel among four adjacent unit pixels PXU11, PXU12, PXU21, and PXU22.

[0300] exist Fig.12 In (A), a laser drilling position LDP is formed in the unit pixel PXU11, two light-emitting layers EML11c and EML11b adjacent to the laser drilling position LDP are formed as modified light-emitting layers including grooves, and the remaining light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML12b, EML21b, EML22b, EML12c, EML21c, and EML22c are formed as normal light-emitting layers.

[0301] Here, the groove is formed at one side of the modified light emitting layer EML11c, EML11b adjacent to the laser drilling position LDP.

[0302] At the same time, Fig.12 In (C), a laser drilling position LDP is formed in the unit pixel PXU22, two light-emitting layers EML22c and EML22b adjacent to the laser drilling position LDP are formed as modified light-emitting layers including grooves, and the remaining light-emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML11c, EML12c, and EML21c are formed as normal light-emitting layers.

[0303] Here, the groove is formed at one side of the modified light emitting layers EML22c, EML22b adjacent to the laser drilling position LDP.

[0304] exist Fig.12 In addition, it is shown Fig.12 (B), and in Fig.12 In (B), the laser drilling position LDP is formed at Figure 1 Same location.

[0305] In a light emitting display device, the laser drilling position LDP may be formed only at Fig.12 At the position shown in (A) or only formed in Fig.12 At the position shown in (C).

[0306] However, according to some embodiments, each is formed in Fig.12 (A) to Fig.12 The three laser drilling positions LDP at the positions shown in (C) may be alternately arranged in one light-emitting display device.

[0307] As described above, when the laser drilling positions LDP are variously arranged, the display quality may be uniform throughout the entire area of ​​the light emitting display device.

[0308] Specifically, even when the user rotates the light-emitting display device by 90 degrees, the laser drilling position LDP does not deviate to one side, and thus the display quality may be constant.

[0309] Reference Fig.11 and Fig.12 , in at least two different unit pixel groups included in the light emitting display device, the laser drilling positions LDP may be different from each other.

[0310] In the following, through Fig.13 and Fig.14 Refer to the Figures 2 to 5 The embodiments of modifying the light emitting layer in different ways, Fig.13 is where PXU11 is additionally transformed based on the unit pixel Figure 2 View of the light-emitting layer EML11c.

[0311] For example, with Figure 2 The embodiments are different. Fig.13 The third modified light emitting layer EML11c in FIG. 1 extends even at the corner portion EML11-c3.

[0312] exist Fig.13, the third normal light emitting layer EML12c is indicated by a dotted line, and the third normal light emitting layer EML12c has not only a side portion EML12c-1 and a corner portion EML12c-2 corresponding to the groove portion EML11c-2 of the third modified light emitting layer EML11c, but also includes a corner portion EML12c-3.

[0313] Meanwhile, the third modified light emitting layer EML11c is shown by a solid line, and the third modified light emitting layer EML11c has not only a side portion EML11c-1 and a groove portion EML11c-2, but also includes a corner portion EML11-c3.

[0314] Fig.13 The arrow shown in shows the direction along which the third normal light emitting layer EML12c is deformed and changed into the third modified light emitting layer EML11c.

[0315] That is, the arrow extends from the side EML12c-1 of the third normal light-emitting layer EML12c to the side EML11c-1 of the third modified light-emitting layer EML11c, and from the corner portion EML12c-3 of the third normal light-emitting layer EML12c to the corner portion EML11-c3 of the third modified light-emitting layer EML11c, and the third normal light-emitting layer EML12c shrinks from the corner portion EML12c-2 to the groove portion EML11c-2 of the third modified light-emitting layer EML11c.

[0316] At the same time, Fig.14 , a relationship between an area of ​​the third normal light emitting layer EML12c and an area of ​​the third modified light emitting layer EML11c is shown.

[0317] exist Fig.14 , only a portion in which the third modified light emitting layer EML11c is formed to be wider than the third normal light emitting layer EML12c is shown on the left. Fig.14 The right side of exemplifies only a portion in which the third normal light emitting layer EML12c is formed to be wider than the third modified light emitting layer EML11c.

[0318] lie in Fig.14 The area on the left is composed of the side EML11c-1 and corner part EML11-c3 of the third modified light-emitting layer EML11c and the side EML12c-1 and corner part EML12c-3 of the third normal light-emitting layer EML12c. It is composed of an upper area Aus at the top, a lower area Abs at the bottom, a left area Als at the left side, a right area Ars at the right side, and three corner areas Ach connecting them, and they are all interconnected.

[0319] lie in Fig.14The portion on the right side of is a region between the corner portion EML12c-2 of the third normal light emitting layer EML12c and the groove portion EML11c-2 of the third modified light emitting layer EML11c, and is shown as a groove side region Ald.

[0320] exist Fig.14 The equal sign shown in the center indicates that Fig.14 The sum of the areas shown on the left is Fig.14 The areas shown on the right side are equal to each other.

[0321] Therefore, since the third modified light-emitting layer EML11c and the third normal light-emitting layers EML12c, EML21c and EML22c have the same area, the lifetime of the light-emitting layer is proportional to the plane area of ​​the light-emitting layer, and all third light-emitting layers EML11c, EML12c, EML21c and EML22c can have the same lifetime.

[0322] Regions of the third light emitting layers EML11c, EML12c, EML21c, and EML22c may be formed in various manners according to materials constituting the light emitting layers.

[0323] Meanwhile, due to dispersion or errors that may occur in an actual manufacturing process, a difference in area between the two sides may occur.

[0324] Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and an area difference that may occur between a normal light emitting layer and a modified light emitting layer due to dispersion or error may have an area difference of up to 10%.

[0325] Although a difference in the lifetime of the light-emitting layer may occur due to the difference in area, such a difference in lifetime is negligible.

[0326] when Fig.13 and Fig.14 Embodiments and Figure 2 and Figure 3 When the groove side area Ald in the embodiment is the same, Fig.13 and Fig.14 The upper region Aus located on the upper side, the lower region Abs located on the lower side, the left region Als located on the left side, and the right region Ars located on the right side of the embodiment may have a ratio of Figure 2 and Figure 3 In the embodiment, the areas of the upper region Aus located on the upper side, the lower region Abs located on the lower side, the left region Als located on the left side, and the right region Ars located on the right side are small areas.

[0327] Fig.13 and Fig.14 and Figure 2 and Figure 3 correspond, Fig.13 and Fig.14 Can also be used with Figure 4 and Figure 5 Corresponding, and Figure 4 and Figure 5 It is also possible to have a Fig.13 and Fig.14 The extended corner area Ach.

[0328] Fig.15 An embodiment is shown in which the second light emitting layers EML11b, EML12b, EML21b, and EML22b and the third light emitting layers EML11c, EML12c, EML21c, and EML22c are each formed as a modified light emitting layer having a groove.

[0329] exist Fig.15 In the embodiment, positions of the grooves of the second light emitting layers EML11b, EML12b, EML21b, and EML22b are arranged differently, and positions of the grooves of the third light emitting layers EML11c, EML12c, EML21c, and EML22c are also arranged differently.

[0330] Here, the positions of the grooves of the two light emitting layers EML11 c and EML22 b adjacent to the laser drilling position LDP are fixed to be located at one side of the laser drilling position LDP, and the positions of the grooves of the other light emitting layers are free.

[0331] That is, the grooves of the second modified light-emitting layer EML11b, EML12b and EML21b and the third modified light-emitting layer EML12c, EML21c and EML22c positioned away from the laser drilling position LDP can be respectively positioned on a side different from the side on which the grooves are positioned in the second modified light-emitting layer EML22b and the third modified light-emitting layer EML11c adjacent to the laser drilling position LDP.

[0332] Reference Fig.15, in a unit pixel group consisting of four unit pixels PXU11, PXU12, PXU21, PXU22, the second modified light emitting layers EML11b, EML12b, EML21b, EML22b and the third modified light emitting layers EML11c, EML12c, EML21c, EML22c have a rectangular shape similar to a normal light emitting layer except for the groove, and may have a corner that is cut off or rounded. A unit pixel group may include four second modified light emitting layers EML11b, EML12b, EML21b, EML22b and four third modified light emitting layers EML11c, EML12c, EML21c, EML22c, and the number of the second modified light emitting layers EML11b, EML12b, EML21b and the number of the third modified light emitting layers EML12c, EML21c, EML22c located away from the laser drilling position LDP are three each, and are aligned with the laser drilling position LDP The adjacently positioned second modified light-emitting layer EML22b and the third modified light-emitting layer EML11c are each one, and the corners with grooves positioned in the second modified light-emitting layer EML22b and the third modified light-emitting layer EML11c adjacent to the laser drilling position LDP may be different from the corners with grooves positioned in the second modified light-emitting layers EML11b, EML12b and EML21b and the third modified light-emitting layers EML12c, EML21c and EML22c away from the laser drilling position LDP.

[0333] according to Fig.15 In an embodiment, a user cannot easily identify the position of the groove for modifying the light emitting layer. Specifically, even when the user rotates the light emitting display device 90 degrees, it is difficult for the user to visually identify the position of the groove for modifying the light emitting layer. Therefore, the display quality can be constant.

[0334] At the same time, Fig.16 In, with Figure 1 Unlike the embodiment of the present invention, the first light emitting layers EML12a2 and EML21a1 positioned adjacent to the laser drilling position LDP are also formed as modified light emitting layers.

[0335] exist Fig.16 In the above, the Figure 1 The structure of the same structure as the two modified light emitting layers EML11c and EML22b is additionally described.

[0336] Reference Fig.16 Among the first light emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, and EML22a2, two first light emitting layers EML12a2 and EML21a1 located adjacent to the laser drilling position LDP are formed as modified light emitting layers having grooves.

[0337] For example, in Fig.16 , the first modified light emitting layer EML12a2 positioned in the unit pixel PXU12 and the first modified light emitting layer EML21a1 positioned in the unit pixel PXU21 are shown as solid lines, and dotted lines overlapping them are also shown.

[0338] Here, the dotted lines represent the sizes of the first normal light emitting layers EML11a1, EML12a1, EML22a1, EML11a2, EML21a2, and EML22a2 located in different parts, and Figures 2 to 5 Detailed research.

[0339] according to Fig.16 The first modified light emitting layers EML12a2 and EML21a1 of the embodiment differ only in the direction in which they extend and may have the same overall shape.

[0340] Hereinafter, a planar shape of the first modified light emitting layer EML21a1 positioned in the unit pixel PXU21 among the first modified light emitting layers EML12a2 and EML21a1 will be described in detail.

[0341] Except for the groove, the boundary of the first modified light emitting layer EML21a1 shown as a solid line is located outside the dotted line.

[0342] As a result, it can be confirmed that the first modified light emitting layer EML21a1 is more extended than the first normal light emitting layers EML11a1, EML12a1, and EML22a1 except for the groove.

[0343] However, the first normal light emitting layers EML11a1, EML12a1, and EML22a1 are formed larger in a portion corresponding to a portion where the groove of the first modified light emitting layer EML21a1 is located.

[0344] In addition, if Fig.17 As shown in FIG. 1 , the first modified light emitting layer EML21a1 and the first normal light emitting layers EML11a1 , EML12a1 , and EML22a1 may all have the same area.

[0345] For example, in Fig.17 On the right side of FIG. 1 , it is shown that the first modified light emitting layer EML21a1 is formed to be wider than the first normal light emitting layers EML11a1, EML12a1, and EML22a1. Fig.17 , it is shown that the first normal light emitting layers EML11a1, EML12a1, EML22a1 are formed wider than the first modified light emitting layer EML21a1.

[0346] exist Fig.17 , the part located on the right side is the area between the side of the first modified light-emitting layer EML21a1 and the side of the first normal light-emitting layer EML11a1, EML12a1 and EML22a1, and is divided into an upper area Aus located on the upper side, a lower area Abs located on the lower side, a left area Als located on the left side, and a right area Ars located on the right side.

[0347] lie in Fig.17 The left side portion of is a region between corner portions of the first normal light emitting layers EML11a1, EML12a1, and EML22a1 and the groove portion of the first modified light emitting layer EML21a1, and is shown as a groove side region Ald.

[0348] exist Fig.17 The equal sign shown in the center indicates that Fig.17 The sum of the areas shown on the right is Fig.17 The areas shown on the left are equal to each other.

[0349] Therefore, the first modified light emitting layer EML21a1 has the same area as the first normal light emitting layers EML11a1, EML12a1, and EML22a1.

[0350] In addition, positioning Fig.16 The first modified light emitting layer EML12a2 in the unit pixel PXU12 shown in FIG. 1 may have the same characteristics as the first modified light emitting layer EML21a1.

[0351] That is, the first modified light emitting layer EML12a2 has the same area as the first normal light emitting layers EML11a2, EML21a2, and EML22a2.

[0352] Here, since the lifetime of the light emitting layer is proportional to the plane area of ​​the light emitting layer, all the first light emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, and EML22a2 may have the same lifetime.

[0353] Regions of the first light emitting layers EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, and EML22a2 may be formed in various ways according to materials constituting the light emitting layers.

[0354] Meanwhile, due to dispersion or errors that may occur in an actual manufacturing process, a difference in area between the two sides may occur.

[0355] Here, the position of the edge of the light emitting layer may vary within 1 μm due to dispersion or error, and the area difference that may occur between the normal light emitting layer and the modified light emitting layer due to dispersion or error may have an area difference of up to 10%.

[0356] Although a difference in the lifetime of the light-emitting layer may occur due to the difference in area, such a difference in lifetime is negligible.

[0357] At the same time, Fig.18 In the embodiment of FIG. 1 , an embodiment is shown in which the laser drilling position LDP is located at the center of four adjacent unit pixels PXU11 , PXU12 , PXU21 , and PXU22 .

[0358] That is, the center of the laser drilling position LDP and a point where all four unit pixels PXU11 , PXU12 , PXU21 , and PXU22 meet may coincide with each other.

[0359] In this case, the modified light emitting layers EML11c and EML22b adjacent to the laser drilling position LDP may have the same or different distances from the laser drilling position LDP.

[0360] However, the gap between the modified light emitting layers EML11c and EML22b and the laser drilling position LDP may be formed at a certain level or higher to prevent damage to the light emitting layers during the laser drilling.

[0361] Here, a certain level may have a gap equal to half the value Gap1 of the gap between normal light emitting layers, such as Figure 7 As seen in , when Gap1 is considered to be 100, the distance between the laser drilling position LDP and the modified light emitting layer can have a value of 50 to 55.

[0362] At the same time, Fig.19 In the embodiment of the present invention, a method of connecting electrodes ( Fig.24 CE) and the cathode connection method formed throughout the ground.

[0363] Reference Fig.19 , through the opening VCP exposes the driving low voltage ELVSS transmitted to the connection electrode ( Fig.24 After CE in the cathode, the cathode is formed as a whole, and the driving low voltage ELVSS is transmitted to the cathode through the opening VCP.

[0364] Here, the opening VCP may be smaller than the area of ​​the laser drilling position LDP, the length of the diameter of the opening VCP may have a value smaller than Gap1, and when Gap1 is 100, the length of the diameter of the opening VCP may have a value of 30 or more and less than 100.

[0365] In addition, if Fig.19 As shown in , the opening VCP may have a quadrilateral planar shape.

[0366] In this case, two light emitting layers EML11c and EML22b adjacent to the opening VCP may be formed to modify the light emitting layers EML11c and EML22b, and each of the two light emitting layers EML11c and EML22b may have one side parallel to one side of the opening VCP.

[0367] Furthermore, the areas of the modified light emitting layers EML11c and EML22b may be the same as the area of ​​the normal light emitting layers displaying the same color among other normal light emitting layers.

[0368] Meanwhile, according to the embodiment, Fig.19 Different from that shown in FIG. 1 , the opening VCP may have various planar shapes such as a circular shape.

[0369] Despite Fig.19 Only one embodiment is shown in FIG. 1 , but all modifications of the embodiments in this application in which laser drilling is used can also be applied.

[0370] At the same time, Fig. 20 and Fig.21 In the embodiments of FIG. 1 , embodiments in which the laser drilling position LDP is variously changed and arranged are shown.

[0371] First, in Fig. 20 In the figure, it is shown that Figure 1 A modified embodiment of the embodiment in which the laser drilling position LDP is arranged across four adjacent unit pixels.

[0372] Reference Fig. 20 , if the laser drilling positions LDP are not arranged continuously in one direction but are arranged alternately with adjacent positions, a rhombus shape can be obtained by connecting four adjacent laser drilling positions LDP.

[0373] at the same time, Fig.21 Yes Fig.11 A modified embodiment of the embodiment in which the laser drilling position LDP spans two adjacent unit pixel positions.

[0374] Reference Fig.21 , when the laser drilling positions LDP are alternately arranged and four adjacent laser drilling positions LDP are connected, a rhombus shape can be obtained.

[0375] like Fig. 20 and Fig.21 As shown in , in an embodiment in which the laser drilling positions LDP are alternately arranged at regular intervals, there may be an advantage of not forming a light spot.

[0376] That is, connecting the electrodes ( Fig.24 The CE in the laser drilling hole and the voltage line connected to it must be formed by laser drilling. Depending on the laser drilling position LDP, a connection electrode ( Fig.24 CE in the and the row of voltage lines connected to it.

[0377] However, no connecting electrode is located therein ( Fig.24 In the case of a row of CE) and a voltage line connected thereto, stains may occur in some pixel rows.

[0378] However, as in Fig. 20 and Fig.21 In the embodiment, when the laser drilling positions LDP are arranged alternately at regular intervals, no stain occurs.

[0379] On the other hand, Fig. 22 , a schematic diagram of the structure of connection of two light-emitting layers (first-1 light-emitting layer EML11a1, EML12a1, EML21a1, EML22a1 and first-2 light-emitting layer EML11a2, EML12a2, EML21a2, EML22a2) displaying the same color positioned within one unit pixel PXU11, PXU12, PXU21, PXU22 is shown.

[0380] The first-1 light-emitting layers EML11a1, EML12a1, EML21a1 and EML22a1 and the first-2 light-emitting layers EML11a2, EML12a2, EML21a2 and EML22a2 are electrically connected to the first pixel driving unit PCa, so the first-1 light-emitting layers EML11a1, EML12a1, EML21a1 and EML22a1 and the first-2 light-emitting layers EML11a2, EML12a2, EML21a2, EML22a2 also need to be connected.

[0381] exist Fig. 22 In the description, the unit pixel PXU11 is taken as the center. Fig. 22 In (A), the laser drilling position LDP is not located in the unit pixel PXU11, but in Fig. 22 In (B), the laser drilling position LDP is located within the unit pixel PXU11.

[0382] First, refer to Fig. 22 (A), a light emitting device including a first-1 light emitting layer EML11a1 and a light emitting device including a first-2 light emitting layer EML11a2 may be electrically connected to each other through a connection line CLa passing through a central region of the unit pixel PXU11.

[0383] The connection line CLa can connect the pixel circuit unit (see Fig.24 PCa in the figure is electrically connected to the anode positioned under the first-1 light-emitting layer EML11a1 and the anode positioned under the first-2 light-emitting layer EML11a2.

[0384] The connection line CLa may be positioned on one of the conductive layers between the substrate and the anode.

[0385] At the same time, refer to Fig. 22 (B), the light emitting device including the first-1 light emitting layer EML11a1 and the light emitting device including the first-2 light emitting layer EML11a2 may be electrically connected to each other through a connection line CLb including a portion extending along the periphery of the unit pixel PXU11.

[0386] The connection line CLb can connect the pixel circuit unit (refer to Fig.24 PCa in the figure is electrically connected to the anode positioned under the first-1 light-emitting layer EML11a1 and the anode positioned under the first-2 light-emitting layer EML11a2.

[0387] The connection line CLb may be positioned on one of the conductive layers between the substrate and the anode.

[0388] In the above, it has been described that the anode of the light-emitting device including the first-1 light-emitting layer EML11a1 and the anode of the light-emitting device including the first-2 light-emitting layer EML11a2 are connected through the connecting lines CLa and CLb, however, according to some embodiments, the anode of one light-emitting device and the cathode of another light-emitting device may be connected, or may be connected to the cathodes of two light-emitting devices.

[0389] Fig.23 An embodiment in which the laser drilling position LDP is not formed for every 4 unit pixels is shown.

[0390] The unit pixel group may refer to a group of unit pixels in which one laser drilling position LDP is formed, and will be described in more detail. Fig.23 Embodiment of the invention.

[0391] Fig.23 (A) shows an embodiment in which a unit pixel group includes 6 unit pixels, and shows an embodiment in which a laser drilling position LDP is formed across 4 adjacent unit pixels among the 6 unit pixels.

[0392] At the same time, Fig.23 (B) shows an example in which the unit pixel group includes 8 unit pixels, and shows an example in which the laser drilling position LDP is formed across four adjacent unit pixels located in the center of the 8 unit pixels.

[0393] According to some embodiments, the laser drilling position LDP may also be located within the unit pixel group at a position corresponding to Fig.11 , Fig.12 and Fig.18 At the same position in the embodiment of FIG.

[0394] According to some embodiments, the number of unit pixels included in the unit pixel group may be various other than 4, 6, and 8.

[0395] At this time, the laser drilling positions LDP may be formed for various numbers of unit pixels except for 4, 6, and 8.

[0396] Hereinabove, various embodiments of the light emitting display apparatus have been described focusing on the structure of the light emitting layer included in the light emitting device and the structure for applying a voltage to the cathode.

[0397] In the following, we will Fig.24 A schematic planar structure of a pixel driving unit positioned below a light emitting device is described.

[0398] Fig.24 is a schematic plan view of a lower portion of a light emitting device of a light emitting display apparatus according to some embodiments.

[0399] Fig.24 A portion of a display area is shown, and one pixel includes a light emitting device and a pixel driving unit.

[0400] exist Fig.24 In FIG. 1 , the light emitting device is not shown, and the structure of the pixel driving unit positioned below the light emitting device is mainly shown.

[0401] exist Fig.24 In FIG. 1 , a total of three pixel driving units PCa, PCb, PCc adjacent to each other are schematically shown by dotted lines.

[0402] Each of the three pixel driving units PCa, PCb, PCc constitutes a pixel driving unit of a unit pixel PXU. Fig.24 A total of four unit pixels PXU are shown in FIG.

[0403] In the embodiments described below, four unit pixels PXU are collectively referred to as one unit pixel group.

[0404] One unit pixel PXU may include three pixels corresponding to three primary colors.

[0405] Each of the three pixel driving units PCa, PCb and PCc belonging to one unit pixel PXU may have a structure extending in the first direction DR1, and each of the three pixel driving units PCa, PCb and PCc may be a pixel driving unit PCa, PCb and PCc corresponding to a pixel displaying light of three primary colors.

[0406] The structure of the pixel driving units PCa, PCb and PCc may vary. According to some embodiments, they may have the same Fig.25 The circuit structure is the same as the circuit structure.

[0407] exist Fig.24 In FIG. 1 , some wirings additionally connected to the pixel driving units PCa, PCb and PCc are additionally shown.

[0408] Fig.24 The first scan signal line 151 and the second scan signal line 151-1 extending in the first direction DR1 are shown, and the data lines 171a, 171b and 171c, the driving voltage lines (not shown, refer to FIG. 1 ) extending in the second direction DR2 are also shown. Fig.25 172 ), an initialization voltage line 173 and a driving low voltage line 174 (hereinafter referred to as a second driving voltage line).

[0409] Here, the pixel driving units PCa, PCb, and PCc may be commonly connected to the first scan signal line 151 , the second scan signal line 151 - 1 , the driving voltage line, the initialization voltage line 173 , and the driving low voltage line 174 .

[0410] In addition, the first pixel driving unit PCa may be connected to the first data line 171a, the second pixel driving unit PCb may be connected to the second data line 171b, and the third pixel driving unit PCc may be connected to the third data line 171c.

[0411] Each of the pixel driving units PCa, PCb, and PCc may correspond to each region in which a plane region divided by the first and second scan signal lines 151 and 151 - 1 and the driving low voltage line 174 is divided into three regions.

[0412] At the same time, Fig.24 , an auxiliary driving low voltage line 174 - 1 (hereinafter referred to as an auxiliary second driving voltage line) extending in the first direction DR1 is also shown.

[0413] The auxiliary driving low voltage line 174 - 1 is positioned on a different conductive layer than the driving low voltage line 174 , and extends in a different direction.

[0414] For example, the auxiliary driving low voltage line 174-1 is connected to the driving low voltage line 174 extending in the second direction DR2, and the driving low voltage ELVSS can be transmitted in the first direction DR1 and the second direction DR2, so that a constant level of the driving low voltage ELVSS can be applied throughout the entire display area of ​​the light-emitting display device.

[0415] The driving low voltage ELVSS should also be applied to the cathode of the light emitting device.

[0416] Reference Fig.10 , the cathode is in the pixel defining layer (see Fig.10 380) in the third direction and is positioned at the top in the third direction DR3.

[0417] In this embodiment, a laser drilling method may be used to electrically connect the uppermost cathode and the auxiliary driving low voltage line 174 - 1 .

[0418] The laser drilling method is a method of irradiating laser in a state where a cathode is formed and melting the irradiated portion so that the auxiliary driving low voltage line 174 - 1 positioned at the bottom and the cathode are electrically connected.

[0419] exist Fig.24 In the embodiment of FIG. 1 , the connection electrode CE is formed between the auxiliary driving low voltage line 174 - 1 and the cathode in cross section to facilitate electrical connection between the auxiliary driving low voltage line 174 - 1 and the cathode.

[0420] For example, in Fig.24 In the embodiment of FIG. 1 , the connection electrode CE is electrically connected to the auxiliary driving low voltage line 174 - 1 through the opening OP1 .

[0421] The connection electrode CE is electrically connected to the cathode through laser drilling.

[0422] As a result, the cathode may receive the driving low voltage ELVSS through the auxiliary driving low voltage line 174 - 1 .

[0423] According to some embodiments, the connection electrode CE may correspond to a location on a plane where laser drilling occurs.

[0424] In addition, the first scan signal line 151 and the second scan signal line 151-1 overlap with but are located below the connection electrode CE in plane and are blocked by the connection electrode CE during laser drilling so that they are not short-circuited with the connection electrode CE and the driving low voltage ELVSS is not transmitted.

[0425] Therefore, when the connection electrode CE is used, a wiring can be formed below a region where laser drilling is performed, so that the wiring and elements can be formed in a small region, thereby improving integration.

[0426] Meanwhile, according to some embodiments, a separate opening may be formed to electrically connect the cathode and the connection electrode CE.

[0427] Meanwhile, in the embodiment in which the position of the laser drilling position LDP is changed as in the above-described various embodiments, the positions of the auxiliary driving low voltage line 174 - 1 and the connection electrode CE may be changed together.

[0428] The light emitting devices (or light emitting areas) may be positioned on the pixel driving units PCa, PCb, and PCc in the third direction DR3.

[0429] exist Figure 1 In the embodiment of the light emitting device, the planar shape of each light emitting layer EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, and EML22c of the light emitting device is shown.

[0430] The first pixel driving unit PCa may be electrically connected to a first-1 light emitting device including first-1 light emitting layers EML11a1, EML12a1, EML21a1, and EML22a1 and a first-2 light emitting device including first-2 light emitting layers EML11a2, EML12a2, EML21a2, and EML22a2.

[0431] Here, the first-1 light emitting device and the first-2 light emitting device can be Fig. 22 The connection lines CLa and CLb shown in FIG.

[0432] Meanwhile, the second pixel driving unit PCb may be electrically connected to the second light emitting device including the second light emitting layers EML11b, EML12b, EML21b and EML22b, and the third pixel driving unit PCc may be electrically connected to the third light emitting device including the third light emitting layers EML11c, EML12c, EML21c and EML22c.

[0433] Will refer to Fig.25 The connection between the pixel driving units PCa, PCb, and PCc and each light emitting device and the circuit structure of each pixel driving unit PCa, PCb, and PCc are described in more detail.

[0434] Fig.25 is a circuit diagram of a pixel of a light emitting display device according to some embodiments.

[0435] Fig.25 A circuit diagram of three pixels PXa, PXb and PXc is shown.

[0436] The plurality of pixels may include a first pixel PXa, a second pixel PXb, and a third pixel PXc.

[0437] Each of the first pixel PXa, the second pixel PXb, and the third pixel PXc includes a plurality of transistors T1, T2, and T3, a storage capacitor Cst, and light emitting devices EDa1, EDa2, EDb, and EDc.

[0438] Here, one pixel PXa, PXb, PXc may be divided into light emitting devices EDa1, EDa2, EDb, EDc and pixel driving units PCa, PCb, PCc, and the pixel driving units PCa, PCb, PCc may be connected to Fig.24 It corresponds to the portion indicated by the dotted line in .

[0439] Reference Fig.25 , the pixel driving units PCa, PCb, and PCc may include a plurality of transistors T1, T2, and T3 corresponding to portions of the pixels PXa, PXb, and PXc excluding the light emitting devices EDa1, EDa2, EDb, and EDc, and a storage capacitor Cst.

[0440] In addition, according to some embodiments, the pixel driving units PCa, PCb and PCc may further include capacitors Cleda, Cledb, Cledc (hereinafter referred to as light-emitting part capacitors) connected at both ends of the light-emitting devices EDa1, EDa2, EDb, EDc, and the light-emitting part capacitors Cleda, Cledb, Cledc may not be included in the pixel driving units PCa, PCb and PCc, and may be included in the light-emitting devices EDa1, EDa2, EDb, EDc.

[0441] For example, the first pixel driving unit PCa may be electrically connected to the first-1 light emitting device EDa1 and the first-2 light emitting device EDa2, the second pixel driving unit PCb may be electrically connected to the second light emitting device EDb, and the third pixel driving unit PCc may be electrically connected to the third light emitting device EDc.

[0442] according to Fig.25 The detailed circuit structure of the pixel driving units PCa, PCb and PCc of the embodiment is as follows.

[0443] The plurality of transistors T1 , T2 and T3 are formed of one driving transistor T1 (also referred to as a first transistor) and two switching transistors T2 and T3 , and the two switching transistors are divided into an input transistor T2 (also referred to as a second transistor) and an initialization transistor T3 (also referred to as a third transistor).

[0444] Each transistor T1 , T2 , T3 includes a gate electrode, a first electrode, and a second electrode, and also includes a semiconductor layer including a channel, so that current flows through or is blocked in the channel of the semiconductor layer according to a voltage of the gate electrode.

[0445] Here, one of the first electrode and the second electrode may be a source electrode and the other may be a drain electrode according to a voltage applied to each of the transistors T1 , T2 , and T3 .

[0446] The gate electrode of the driving transistor T1 is connected to one end of the storage capacitor Cst, and is also connected to the second electrode (output side electrode) of the input transistor T2 .

[0447] In addition, a first electrode of the driving transistor T1 is connected to a driving voltage line 172 that transmits a driving voltage ELVDD, and a second electrode of the driving transistor T1 is connected to anodes of light-emitting devices EDa1, EDa2, EDb and EDc, the other end of the storage capacitor Cst, a first electrode of the initialization transistor T3, and one end of the light-emitting part capacitors Cleda, Cledb and Cledc.

[0448] The driving transistor T1 receives the data voltages DVa, DVb, and DVc to the gate electrode according to the switching operation of the input transistor T2, and supplies the driving current to the light emitting devices EDa1, EDa2, EDb, and EDc according to the voltage of the gate electrode.

[0449] At this time, the storage capacitor Cst stores and maintains the voltage of the gate electrode of the driving transistor T1.

[0450] A gate electrode of the input transistor T2 is connected to a first scan signal line 151 transmitting a first scan signal SC.

[0451] A first electrode of the input transistor T2 is connected to the data lines 171a, 171b, and 171c transmitting the data voltages DVa, DVb, and DVc, and a second electrode of the input transistor T2 is connected to one end of the storage capacitor Cst and the gate electrode of the driving transistor T1.

[0452] A plurality of data lines 171a, 171b, and 171c transmit different data voltages DVa, DVb, and DVc, respectively, and an input transistor T2 of each pixel PXa, PXb, and PXc is connected to a different data line 171a, 171b, and 171c.

[0453] The gate electrode of the input transistor T2 of each pixel PXa, PXb, and PXc is connected to the same first scan signal line 151, allowing them to receive the first scan signal SC of the same timing.

[0454] Even if the input transistors T2 of the pixels PXa, PXb and PXc are simultaneously (or concurrently) turned on by the first scan signal SC at the same timing, different data voltages DVa, DVb and DVc are transmitted to the gate electrode of the driving transistor T1 and one end of the storage capacitor Cst of the pixels PXa, PXb and PXc through different data lines 171a, 171b and 171c.

[0455] Fig.25 An embodiment is shown in which the gate electrode of the initialization transistor T3 receives a scan signal different from the scan signal input to the gate electrode of the transistor T2.

[0456] A gate electrode of the initialization transistor T3 is connected to the second scan signal line 151 - 1 transmitting the second scan signal SS.

[0457] The first electrode of the initialization transistor T3 is connected to the other end of the storage capacitor Cst, the second electrode of the driving transistor T1, the anodes of the light-emitting devices EDa1, EDa2, EDb and EDc, and one end of the light-emitting part capacitors Cleda, Cledb and Cledc, and the second electrode of the initialization transistor T3 is connected to the initialization voltage line 173 that transmits the initialization voltage VINT.

[0458] The initialization transistor T3 is turned on according to the second scan signal SS, and transmits the initialization voltage VINT to the anodes of the light emitting devices EDa1, EDa2, EDb and EDc, one end of the light emitting part capacitors Cleda, Cledb and Cledc, and the other end of the storage capacitor Cst to initialize the voltage of the anodes of the light emitting devices EDa1, EDa2, EDb and EDc.

[0459] The initialization voltage line 173 may be used as the sensing line SL by performing an operation of sensing voltages of anodes of the light emitting devices EDa1 , EDa2 , EDb, and EDc before the initialization voltage VINT is applied.

[0460] Through the sensing operation, it can be confirmed whether the voltage of the anode is maintained at the target voltage.

[0461] The sensing operation and the initialization operation of transmitting the initialization voltage VINT may be separated in time, and the initialization operation may be performed after the sensing operation is performed.

[0462] exist Fig.25 In the embodiment, the conduction periods of the initialization transistor T3 and the input transistor T2 can be distinguished, so that the writing operation performed by the input transistor T2 and the initialization operation (and / or sensing operation) performed by the initialization transistor T3 can be performed at different timings.

[0463] One end of the storage capacitor Cst is connected to the gate electrode of the driving transistor T1 and the second electrode of the input transistor T2, and the other end of the storage capacitor Cst is connected to the first electrode of the initialization transistor T3, the second electrode of the driving transistor T1, the anodes of the light-emitting devices EDa1, EDa2, EDb and EDc, and one end of the light-emitting part capacitors Cleda, Cledb and Cledc.

[0464] The light-emitting devices EDa1, EDa2, EDb and EDc receive the output current of the driving transistor T1 at the anode, the cathodes of the light-emitting devices EDa1, EDa2, EDb and EDc receive the driving low voltage ELVSS through the driving low voltage line 174, and the light-emitting devices EDa1, EDa2, EDb and EDc emit light according to the output current of the driving transistor T1 to display grayscale.

[0465] In addition, the light-emitting part capacitors Cleda, Cledb and Cledc are formed at both ends of the light-emitting devices EDa1, EDa2, EDb and EDc, so that the voltage across the light-emitting devices EDa1, EDa2, EDb and EDc can be kept constant, so that the light-emitting devices EDa1, EDa2, EDb and EDc can display constant brightness.

[0466] In the following, a brief description will be given of Fig.25 The operation of the pixel of the circuit shown in FIG.

[0467] exist Fig.25 In the embodiment, each of the transistors T1, T2 and T3 is an N-type transistor which is turned on when a high level voltage is applied to a gate electrode.

[0468] However, according to some embodiments, each of the transistors T1 , T2 , and T3 may be a P-type transistor.

[0469] When the transmission segment ends, a frame begins.

[0470] Then, a high-level second scan signal SS is supplied to turn on the initialization transistor T3.

[0471] When the initialization transistor T3 is turned on, an initialization operation and / or a sensing operation may be performed.

[0472] An embodiment in which both the initialization operation and the sensing operation are performed will be described below.

[0473] The sensing operation may be performed first before performing the initialization operation.

[0474] That is, when the initialization transistor T3 is turned on, the initialization voltage line 173 functions as the sensing line SL to sense the voltages of the anodes of the light emitting devices EDa1 , EDa2 , EDb, and EDc.

[0475] Through the sensing operation, it can be confirmed whether the voltage of the anode is maintained at the target voltage.

[0476] Thereafter, an initialization operation may be performed, and voltages of the other terminal of the storage capacitor Cst, the second electrode of the driving transistor T1, and anodes of the light emitting devices EDa1, EDa2, EDb, and EDc are changed to the initialization voltage VINT transmitted from the initialization voltage line 173 to perform initialization.

[0477] As described above, the sensing operation and the initialization operation of the transmission initialization voltage VINT are separated in time, so that the pixel can perform various operations while using a minimum number of transistors and reducing the area occupied by the pixel.

[0478] As a result, the resolution of the display panel can be improved.

[0479] Simultaneously with the initialization operation or at a separate timing, the first scan signal SC is also changed to a high level and applied to the gate electrode of the input transistor T2 , the input transistor T2 is turned on, and a write operation is performed.

[0480] That is, the data voltages DVa, DVb, and DVc from the data lines 171a, 171b, and 171c are input to the gate electrode of the driving transistor T1 and one end of the storage capacitor Cst through the turned-on input transistor T2 and are stored.

[0481] The data voltages DVa, DVb, and DVc and the initialization voltage VINT are applied to both ends of the storage capacitor Cst through the initialization operation and the write operation.

[0482] In the state where the initialization transistor T3 is turned on, even if an output current is generated by the driving transistor T1, it can be output to the outside through the initialization transistor T3 and the initialization voltage line 173 so that it may not be input to the first anodes of the first light emitting devices EDa1, EDb1 and EDc1.

[0483] In addition, according to some embodiments, during the writing period of the high-level first scan signal SC, the driving voltage ELVDD may be applied as a low-level voltage, or the driving low voltage ELVSS may be applied as a high-level voltage so that current does not flow through the light-emitting devices EDa1, EDa2, EDb, and EDc.

[0484] Then, when the first scan signal SC becomes a low level, the driving transistor T1 generates and outputs an output current according to the high-level driving voltage ELVDD applied to the driving transistor T1 and the gate voltage of the driving transistor T1 stored in the storage capacitor Cst.

[0485] The output current of the driving transistor T1 is input to the light emitting devices EDa1, EDa2, EDb, and EDc, and a light emitting period in which the light emitting devices EDa1, EDa2, EDb, and EDc emit light is performed.

[0486] The embodiments of the light emitting display device described above may be included in an electronic device, and the light emitting display device according to the given embodiments may be used in a medium-sized electronic device such as a monitor or a TV.

[0487] However, examples of the electronic device are not limited thereto.

[0488] In the following, we will Fig.26 An embodiment of an electronic device in which a light-emitting display device according to the given embodiment may be included is discussed.

[0489] Fig.26 is a block diagram of an electronic device according to an embodiment.

[0490] The electronic device 1 outputs various information via the display module MD2 in the operating system.

[0491] When the processor PROC executes an application stored in the memory MM, the display module MD2 provides application information to the user through the display panel MD21.

[0492] Here, the above-mentioned light emitting display device may be used as the display panel MD21.

[0493] The processor PROC obtains external input through the input module MD1 or the sensor module MD41 and executes an application program corresponding to the external input.

[0494] For example, when the user selects a camera icon displayed on the display panel MD21, the processor PROC acquires the user input through the input sensor MD41-2 and activates the camera module MD51.

[0495] The processor PROC transmits image data corresponding to the photographic image acquired by the camera module MD51 to the display module MD2.

[0496] The display module MD2 may display an image corresponding to the captured image through the display panel MD21 .

[0497] As another example, when personal information authentication is performed in the display module MD2, the fingerprint sensor MD41-1 acquires input fingerprint information as input data.

[0498] The processor PROC compares input data acquired through the fingerprint sensor MD41-1 with authentication data stored in the memory MM, and executes an application program according to the comparison result.

[0499] The display module MD2 may display information executed according to the application logic through the display panel MD21 .

[0500] As another example, when a music streaming icon displayed on the display module MD2 is selected, the processor PROC acquires a user input through the input sensor MD41 - 2 and activates a music streaming application stored in the memory MM.

[0501] When a music execution command is input in the music streaming application, the processor PROC activates the sound output module MD43 to provide the user with sound information corresponding to the music execution command.

[0502] In the above, the operation of the electronic device 1 has been briefly described.

[0503] Hereinafter, the configuration of the electronic device 1 will be described in detail.

[0504] Some of the components of the electronic device 1 described later may be integrated and provided as one component, or one component may be separately provided as two or more components.

[0505] Reference Fig.26 , the electronic device 1 can communicate with the external electronic device 2 through a network (eg, a short-range wireless communication network or a long-range wireless communication network).

[0506] According to some embodiments, the electronic device 1 may include a processor PROC, a memory MM, an input module MD1, a display module MD2, a power module MD3, an internal module MD4, and an external module MD5.

[0507] According to some embodiments, in the electronic device 1 , at least one of the above-mentioned components may be omitted, or one or more other components may be added.

[0508] According to some embodiments, some of the above-mentioned components (eg, the sensor module MD41 , the antenna module MD42 , or the sound output module MD43 ) may be integrated into another component (eg, the display module MD2 ).

[0509] The processor PROC may execute software to control at least one other component (eg, hardware or software component) of the electronic device 1 connected to the processor PROC, and may perform various data processing or calculations.

[0510] According to some embodiments, as at least part of data processing or operation, the processor PROC may store commands or data received from other components (e.g., input module MD1, sensor module MD41, or communication module MD53) in the volatile memory MM1, process the commands or data stored in the volatile memory MM1, and store the resulting data in the non-volatile memory MM2.

[0511] The processor PROC may include a main processor MPROC and a secondary processor SPROC.

[0512] The main processor MPROC may include one or more of a central processing unit MPROC-1 (CPU) or an application processor (AP).

[0513] The main processor MPROC may further include one or more of a graphics processing unit MPROC-2 (GPU), a communication processor (CP), and an image signal processor (ISP).

[0514] The main processor MPROC may also include a neural processing unit MPROC-3 (NPU).

[0515] A neural network processing device is a processor dedicated to processing artificial intelligence models, which can generate artificial intelligence models through machine learning.

[0516] AI models can include multiple artificial neural network layers.

[0517] The artificial neural network can be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more of the above, but is not limited to the above examples.

[0518] Additionally or alternatively, the artificial intelligence model may include a software structure as well as a hardware structure.

[0519] At least two of the above-mentioned processing unit and processor may be implemented as an integrated component (eg, a single chip), or each may be implemented as an independent component (eg, a plurality of chips).

[0520] The auxiliary processor SPROC may include a controller SPROC-1.

[0521] The controller SPROC-1 may include an interface conversion circuit and a timing control circuit.

[0522] The controller SPROC-1 receives a video signal from the main processor MPROC, converts a data format of the video signal to meet an interface specification with the display module MD2, and outputs the video data.

[0523] The controller SPROC-1 can output various control signals required to drive the display module MD2.

[0524] The auxiliary processor SPROC may further include a data conversion circuit SPROC-2, a gamma correction circuit SPROC-3, a rendering circuit SPROC-4, and the like.

[0525] The data conversion circuit SPROC-2 receives image data from the controller SPROC-1, compensates the image data so that an image is displayed at a desired brightness according to the characteristics of the electronic device 1 or user settings, or converts the image data to reduce power consumption or compensate for afterimages.

[0526] The gamma correction circuit SPROC- 3 may convert image data or a gamma reference voltage so that an image displayed on the electronic device 1 has a desired gamma characteristic.

[0527] The rendering circuit SPROC- 4 may receive image data from the controller SPROC- 1 and render the image data in consideration of a pixel arrangement of the display panel MD21 applied to the electronic device 1 .

[0528] At least one of the data conversion circuit SPROC- 2 , the gamma correction circuit SPROC- 3 , and the rendering circuit SPROC- 4 may be incorporated into other components (eg, the main processor MPROC or the controller SPROC- 1 ).

[0529] At least one of the data conversion circuit SPROC- 2 , the gamma correction circuit SPROC- 3 , and the rendering circuit SPROC- 4 may be incorporated into a data driver MD23 described later.

[0530] The memory MM may store various data used by at least one component of the electronic device 1 (eg, the processor PROC or the sensor module MD41 ) and input data or output data for commands related thereto.

[0531] The memory MM may include at least one of a volatile memory MM1 and a nonvolatile memory MM2 .

[0532] The input module MD1 may receive a command or data to be used in a component of the electronic device 1 (eg, the processor PROC, the sensor module MD41 or the sound output module MD43 ) from outside the electronic device 1 (eg, a user or an external electronic device 2 ).

[0533] The input module MD1 may include a first input module MD11 for receiving a command or data from a user and a second input module MD12 for receiving a command or data from the external electronic device 2 .

[0534] The first input module MD11 may include a microphone, a mouse, a keyboard, a key (eg, a button), or a pen (eg, a passive pen or an active pen).

[0535] The second input module MD12 may support a designated protocol capable of connecting to the external electronic device 2 by wire or wirelessly.

[0536] According to some embodiments, the second input module MD12 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, or an audio interface.

[0537] The second input module MD12 may include a connector that may be physically connected to the external electronic device 2 , for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

[0538] The display module MD2 provides visual information to the user.

[0539] The display module MD2 may include a display panel MD21 , a scan driver MD22 , and a data driver MD23 .

[0540] The display module MD2 may further include a window, a base, and a bracket for protecting the display panel MD21.

[0541] The display panel MD21 may include a liquid crystal display panel, an organic light emitting display panel, or an inorganic light emitting display panel, and the type of the display panel MD21 is not particularly limited.

[0542] The display panel MD21 may be a rigid type or a flexible type capable of being rolled or folded.

[0543] The display module MD2 may further include a support member, a bracket, or a heat dissipation portion that supports the display panel MD21 .

[0544] The scan driver MD22 may be mounted on the display panel MD21 as a driving chip.

[0545] Furthermore, the scan driver MD22 may be integrated into the display panel MD21 .

[0546] For example, the scan driver MD22 may include an amorphous silicon TFT gate driver circuit (ASG), a low temperature polysilicon TFT gate driver circuit (LTPS), or an oxide semiconductor TFT gate driver circuit (OSG) embedded in the display panel MD21 .

[0547] The scan driver MD22 receives a control signal from the controller SPROC- 1 , and outputs a scan signal to the display panel MD21 in response to the control signal.

[0548] The display panel MD21 may further include a light emitting driver.

[0549] The light emitting driver outputs a light emitting control signal to the display panel MD21 in response to a control signal received from the controller SPROC-1.

[0550] The light emitting driver may be formed separately from the scan driver MD22 or integrated into the scan driver MD22.

[0551] The data driver MD23 receives a control signal from the controller SPROC- 1 , converts the image data into an analog voltage (eg, a data voltage) in response to the control signal, and then outputs the data voltage to the display panel MD21 .

[0552] The data driver MD23 may be incorporated into other components (eg, the controller SPROC- 1 ).

[0553] The functions of the interface conversion circuit and the timing control circuit of the above controller SPROC-1 can be integrated into the data driver MD23.

[0554] The display module MD2 may further include a light driver and a voltage generator circuit.

[0555] The voltage generator circuit may output various voltages necessary for driving the display panel MD21.

[0556] The power module MD3 supplies power to the components of the electronic device 1 .

[0557] The power module MD3 may include a battery that charges the power voltage.

[0558] The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0559] The power module MD3 may include a power management integrated circuit (PMIC).

[0560] The PMIC supplies optimized power to each of the above-mentioned modules and modules to be described later.

[0561] The power module MD3 may include a wireless power transmitting / receiving part electrically connected to the battery.

[0562] The wireless power transmitting / receiving part may include a plurality of antenna radiators in the form of coils.

[0563] The electronic device 1 may further include an internal module MD4 and an external module MD5 .

[0564] The internal module MD4 may include a sensor module MD41 , an antenna module MD42 , and a sound output module MD43 .

[0565] The external module MD5 may include a camera module MD51 , a light module MD52 , and a communication module MD53 .

[0566] The sensor module MD41 may detect an input from the user's body or an input from the pen among the first input module MD11 and generate an electrical signal or a data value corresponding to the input.

[0567] The sensor module MD41 may include at least one of a fingerprint sensor MD41 - 1 , an input sensor MD41 - 2 , and a digitizer MD41 - 3 .

[0568] The fingerprint sensor MD41 - 1 may generate a data value corresponding to the user's fingerprint.

[0569] The fingerprint sensor MD41 - 1 may include an optical or capacitive fingerprint sensor.

[0570] The input sensor MD41 - 2 may generate a data value corresponding to coordinate information from the user's body or from an input of a pen.

[0571] The input sensor MD41 - 2 generates the amount of change in capacitance as a data value through input.

[0572] The input sensor MD41 - 2 may detect an input from a passive pen or transmit / receive data to / from an active pen.

[0573] The input sensor MD41-2 can measure biological signals such as blood pressure, humidity, or body fat.

[0574] For example, when the user touches a body part to the sensor layer or sensing panel and does not move for a certain period of time, the input sensor MD41-2 detects a biosignal based on the change of the electric field caused by the body part and outputs the information desired by the user to the display module MD2.

[0575] The digitizer MD41 - 3 may generate data values ​​corresponding to coordinate information input by the pen.

[0576] The digitizer MD41-3 generates the amount of electromagnetic change as input as the data value.

[0577] The digitizer MD41-3 can detect input from a passive pen or transmit / receive data to / from an active pen.

[0578] At least one of the fingerprint sensor MD41 - 1 , the input sensor MD41 - 2 , and the digitizer MD41 - 3 may be implemented as a sensor layer formed on the display panel MD21 through a continuous process.

[0579] The fingerprint sensor MD41 - 1 , the input sensor MD41 - 2 , and the digitizer MD41 - 3 may be disposed above the display panel MD21 , and any one of the fingerprint sensor MD41 - 1 , the input sensor MD41 - 2 , and the digitizer MD41 - 3 (eg, the digitizer MD41 - 3 ) may be disposed below the display panel MD21 .

[0580] At least two of the fingerprint sensor MD41 - 1 , the input sensor MD41 - 2 , and the digitizer MD41 - 3 may be integrated into one sensing panel through the same process.

[0581] When integrated into one sensing panel, the sensing panel may be located between the display panel MD21 and a window located above the display panel MD21 .

[0582] According to some embodiments, the sensing panel may be located on the window, and the location of the sensing panel is not particularly limited.

[0583] At least one of the fingerprint sensor MD41 - 1 , the input sensor MD41 - 2 , and the digitizer MD41 - 3 may be embedded in the display panel MD21 .

[0584] That is, at least one of the fingerprint sensor MD41-1, the input sensor MD41-2, and the digitizer MD41-3 may be simultaneously (or concurrently) formed by a process of forming elements (eg, light emitting devices, transistors, etc.) included in the display panel MD21.

[0585] In addition, the sensor module MD41 may generate an electrical signal or a data value corresponding to an internal state or an external state of the electronic device 1 .

[0586] The sensor module MD41 may also include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0587] The antenna module MD42 may include one or more antennas for transmitting or receiving signals or power to the outside.

[0588] According to some embodiments, the communication module MD53 may transmit or receive a signal to or from an external electronic device through an antenna suitable for a communication method.

[0589] The antenna pattern of the antenna module MD42 may be integrated into one component of the display module MD2 (eg, the display panel MD21 ) or the input sensor MD41 - 2 .

[0590] The sound output module MD43 is a device for outputting a sound signal to the outside of the electronic device 1 , and may include, for example, a speaker for general purposes such as multimedia playback or recording playback, and a receiver dedicated to receiving a call.

[0591] According to some embodiments, the receiver may be formed integrally with the speaker or separately from the speaker.

[0592] The sound output pattern of the sound output module MD43 may be integrated with the display module MD2.

[0593] The camera module MD51 can capture still images and moving images.

[0594] According to some embodiments, the camera module MD51 may include one or more lenses, an image sensor, or an image signal processor.

[0595] The camera module MD51 may also include an infrared camera capable of measuring the presence or absence of a user, the position of the user, and the line of sight of the user.

[0596] The lighting module MD52 can provide light.

[0597] The lighting module MD52 may include a light emitting diode or a xenon lamp.

[0598] The light module MD52 may operate together with the camera module MD51 or independently.

[0599] The communication module MD53 may support establishment of a wired or wireless communication channel between the electronic device 1 and the external electronic device 2 and communication through the established communication channel.

[0600] The communication module MD53 may include any one or all of a wireless communication module (such as a cellular communication module, a short-range wireless communication module or a global navigation satellite system (GNSS) communication module), a local area network (LAN) communication module and a wired communication module (such as a power line communication module).

[0601] The communication module MD53 may communicate with the external electronic device 2 through a short-range communication network such as Bluetooth, WiFi Direct, or Infrared Data Association (IrDA) or a long-range communication network such as a cellular network, the Internet, or a computer network (eg, LAN or WAN).

[0602] The above-mentioned various types of communication modules MD53 may be implemented as one chip, or may be implemented as separate chips.

[0603] The input module MD1 , the sensor module MD41 , the camera module MD51 , etc. may be used to control the operation of the display module MD2 in conjunction with the processor PROC.

[0604] The processor PROC outputs commands or data to the display module MD2 , the sound output module MD43 , the camera module MD51 or the lighting module MD52 based on the input data received from the input module MD1 .

[0605] For example, the processor PROC may generate image data corresponding to input data applied through a mouse or an active pen and output the image data to the display module MD2, or generate command data corresponding to the input data and output the image data to the camera module MD51 or the lighting module MD52.

[0606] When no input data is received from the input module MD1 within a certain period of time, the processor PROC converts the operation mode of the electronic device 1 into a low power mode or a sleep mode to reduce power consumed by the electronic device 1 .

[0607] The processor PROC outputs a command or data to the display module MD2 , the sound output module MD43 , the camera module MD51 or the light module MD52 based on the sensing data received from the sensor module MD41 .

[0608] For example, the processor PROC may compare authentication data applied by the fingerprint sensor MD41-1 with authentication data stored in the memory MM and then execute an application program according to the comparison result.

[0609] The processor PROC may execute a command based on sensing data sensed by the input sensor MD41 - 2 or the digitizer MD41 - 3 or output corresponding image data to the display module MD2 .

[0610] When the sensor module MD41 includes a temperature sensor, the processor PROC may receive temperature data for temperature measured from the sensor module MD41 and further perform brightness correction on the image data based on the temperature data.

[0611] The processor PROC may receive measurement data regarding the presence or absence of a user, the position of the user, and the gaze of the user from the camera module MD51 .

[0612] The processor PROC may also perform a brightness correction on the image data based on the measurement data.

[0613] For example, the processor PROC which determines whether a user is present by the input from the camera module MD51 outputs image data whose brightness is corrected by the data conversion circuit SPROC-2 or the gamma correction circuit SPROC-3 to the display module MD2.

[0614] Some of the components may be connected to each other through a communication method between peripheral devices (e.g., a bus, a general purpose input / output (GPIO), a serial peripheral interface (SPI), a mobile industry processor interface (MIPI), or an ultrapath interconnect (UPI) link) to exchange signals (e.g., commands or data) with each other.

[0615] The processor PROC can communicate with the display module MD2 through a protocol interface. For example, any one of the above communication methods can be used, and the above communication methods are not limited thereto.

[0616] The electronic device 1 according to the embodiment disclosed in this document may be various types of devices.

[0617] The electronic device 1 may include, for example, at least one of a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, and a home appliance.

[0618] The electronic device 1 according to the embodiment of this document is not limited to the aforementioned devices.

[0619] Although the embodiments have been described in more detail above, the scope of the embodiments according to the present disclosure is not limited thereto, and various modifications and improvements of the basic concepts of the given embodiments defined in the appended claims and their equivalents by those skilled in the art are also within the scope of the embodiments according to the present disclosure.

[0620] Description of some of the reference numerals EML, EML11a1, EML12a1, EML21a1, EML22a1, EML11a2, EML12a2, EML21a2, EML22a2, EML11b, EML12b, EML21b, EML22b, EML11c, EML12c, EML21c, EML22c: light-emitting layer EML11c-1, EML12c-1, EML21b-1, EML22b-1: Side EML11-c3, EML12c-3, EML12c-2, EML21b-2: Corner section EML11c-2, EML22b-2: Groove LDP: Laser drilling position Abs: Lower area Als: Left area Ars: Right area Aus: Upper area Ach: Corner area Ald: Groove side area PXU11, PXU12, PXU21, PXU22: Unit pixel PXa, PXb, PXc: pixels PCa, PCb, PCc: pixel drive unit 151: first scanning signal line 151-1: second scanning signal line 171a, 171b, 171c: data lines 172: driving voltage line 173: Initialization voltage line 174: Drive low voltage line 174-1: Auxiliary drive low voltage line SL: sensing wiring 110: base 111: buffer layer 141: first gate insulating layer 161: interlayer insulating layer 1: Electronic devices 2: External electronic devices T1, T2, T3: transistors Cleda, Cledb, Cledc: Light-emitting part capacitors Cst: Storage capacitor EDa1, EDa2, EDb, EDc: light-emitting devices 380: pixel defining layer OP, OP1, OP2: opening ACT: Semiconductor layer BML: Lower shielding layer CE: connecting electrode CLa, CLb: connecting wire GE: gate electrode FL, FL1, FL2: functional layer.

Claims

1. A light-emitting display device, the light-emitting display device include: A unit pixel group has at least two unit pixels, The unit pixel among the at least two unit pixels includes a first light-emitting layer, a second light-emitting layer and a third light-emitting layer corresponding to three primary colors, The first light-emitting layer includes two first light-emitting layers in one unit pixel. A laser drilling position is formed in a portion of the unit pixel group, The second light emitting layer and the third light emitting layer adjacent to the laser drilling position are respectively formed by a second modified light emitting layer and a third modified light emitting layer including grooves, The second light emitting layer and the third light emitting layer spaced apart from the laser drilling position are respectively formed of a second normal light emitting layer and a third normal light emitting layer not including a groove, The area of ​​the second modified light emitting layer is the same as the area of ​​the second normal light emitting layer or has an area difference of less than 10%, and An area of ​​the third modified light emitting layer is the same as an area of ​​the third normal light emitting layer or has an area difference of less than 10%.

2. The light-emitting display device according to claim 1, in: The groove of the second modified light emitting layer and the groove of the third modified light emitting layer are respectively formed at one side of the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position.

3. The light-emitting display device according to claim 2, in: The second modified light emitting layer expands at a side portion of the second normal light emitting layer, and the groove of the second modified light emitting layer is narrowed at a corner portion of the second normal light emitting layer, and The third modified light emitting layer expands at a side portion of the third normal light emitting layer, and the groove of the third modified light emitting layer is narrowed at a corner portion of the third normal light emitting layer.

4. The light-emitting display device according to claim 3, in: A planar shape of the second normal light emitting layer and the third normal light emitting layer has a quadrangular shape, and corners of the quadrangular shape are chamfered or rounded.

5. The light-emitting display device according to claim 4, in: The first light emitting layer is formed of a first normal light emitting layer not including a groove, The first light emitting layer included in one of the unit pixels includes a first-1 light emitting layer and a first-2 light emitting layer, The first-1 light-emitting layer and the first-2 light-emitting layer each have a rectangular shape in a planar shape and have chamfered or rounded corners, The direction along which the first-1 light-emitting layer is extended is different from the direction along which the first-2 light-emitting layer is extended.

6. The light-emitting display device according to claim 5, in: The light emitting device including the first-1 light emitting layer and the light emitting device including the first-2 light emitting layer are electrically connected to the same pixel driving unit through a connection line, and are included in one of the unit pixels.

7. The light-emitting display device according to claim 6, in: When all of the laser drilling positions are positioned in the one unit pixel, a portion of the connection line extends along the periphery of the one unit pixel.

8. The light-emitting display device according to claim 4, in: The first light emitting layer adjacent to the laser drilling position is formed as a first modified light emitting layer including a groove, and the first light emitting layer located away from the laser drilling position is formed as a first normal light emitting layer without a groove, An area of ​​the first modified light emitting layer is the same as an area of ​​the first normal light emitting layer or has an area difference of less than 10%.

9. The light-emitting display device according to claim 8, in: The first normal light emitting layer has a rectangular shape in a planar shape and has chamfered or rounded corners, Two first modified light emitting layers are included in one unit pixel, and The two first modified light emitting layers are elongated and have different extending directions.

10. The light emitting display device according to claim 4, in: The second modified light emitting layer also extends at a corner portion of the second normal light emitting layer, and The third modified light emitting layer additionally expands even at a corner portion of the third normal light emitting layer.

11. The light-emitting display device according to claim 1, in: The unit pixel group includes four unit pixels, and The laser drilling positions are positioned across all of the four unit pixels.

12. The light-emitting display device according to claim 11, in: The center of the laser drilling position is positioned in one of the four unit pixels.

13. The light-emitting display device according to claim 11, in: The center of the laser drilling position is positioned at the point where the four unit pixels meet.

14. The light emitting display device according to claim 1, in: The unit pixel group includes four unit pixels, and The laser drilling position is located across two of the four unit pixels.

15. The light emitting display device according to claim 1, in: The unit pixel group includes four unit pixels, and The laser drilling position is positioned within one of the four unit pixels.

16. The light emitting display device according to claim 1, in: In at least two different unit pixel groups, the laser drilling positions are different from each other.

17. A light-emitting display device, the light-emitting display device include: A unit pixel group has at least two unit pixels, The unit pixel of the at least two unit pixels includes a first light emitting layer, a second light emitting layer and a third light emitting layer corresponding to three primary colors, The first light-emitting layer includes two first light-emitting layers in one unit pixel. A laser drilling position is formed in a portion of the unit pixel group, The first light emitting layer is formed of a first normal light emitting layer not including a groove, and The second light emitting layer and the third light emitting layer are respectively formed of a second modified light emitting layer and a third modified light emitting layer including grooves.

18. The light emitting display device according to claim 17, in: The grooves of the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position are respectively formed on one side of the second modified light emitting layer and the third modified light emitting layer adjacent to the laser drilling position.

19. The light emitting display device according to claim 18, in: The second modified luminescent layer and the third modified luminescent layer spaced apart from the laser drilling position have grooves respectively positioned on a side different from a side on which the grooves in the second modified luminescent layer and the third modified luminescent layer adjacent to the laser drilling position are positioned.

20. The light emitting display device according to claim 19, in: The unit pixel group includes four unit pixels, The second modified light emitting layer and the third modified light emitting layer have a rectangular shape except for the groove and have chamfered or rounded corners, The unit pixel group includes four second modified light emitting layers and four third modified light emitting layers, The second modified light-emitting layer and the third modified light-emitting layer adjacent to the laser drilling position are both one, The number of the second modified light emitting layer and the third modified light emitting layer spaced apart from the laser drilling position is three respectively, and Corners where the grooves are located in the second modified luminescent layer and the third modified luminescent layer adjacent to the laser drilling position are different from corners where the grooves are located in the second modified luminescent layer and the third modified luminescent layer spaced apart from the laser drilling position.

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