Carrier for holding substrate, apparatus for depositing layer on substrate, and method for supporting substrate

Abstract

A carrier (100) for holding a substrate (10) in a bent state is provided. The carrier (100) comprises: a carrier body (110), the carrier body (110) having a curved substrate support surface (111); a seal (120) for providing a seal between the edge of the substrate (10) and the carrier body (110); and a substrate fixing device (130) for pressing the edge of the substrate (10) onto the seal (120). The carrier body (110) comprises one or more gas supply conduits (140) for providing a gas cushion between the back side (10B) of the substrate (10) and the curved substrate support surface (111). Further, an apparatus for depositing a layer on a substrate in a curved state and a method for supporting a substrate in a curved state in a vacuum deposition chamber are provided.

Description

Technical Field

[0001] Embodiments of the present disclosure relate to a carrier for holding a substrate, an apparatus for depositing a layer on a substrate, and a method for supporting a substrate. Embodiments of the present disclosure relate particularly to a carrier for holding a substrate in a vacuum environment, a deposition apparatus including a vacuum deposition chamber, and a method for supporting a substrate in a vacuum deposition chamber. Background Art

[0002] Techniques for depositing layers on substrates include, for example, thermal evaporation, chemical vapor deposition (CVD), and physical vapor deposition (PVD), such as sputtering deposition. Sputtering deposition processes can be used to deposit a layer of material, such as a layer of insulating material or a metal layer, on a substrate. During a sputtering deposition process, a target having a target material to be deposited on a substrate is bombarded with ions generated in a plasma region so that atoms of the target material are removed from the target surface. The removed atoms can form a material layer on the substrate. In a reactive sputtering deposition process, the removed atoms can react with a gas (e.g., nitrogen or oxygen) in the plasma region to form an oxide, nitride, or oxynitride of the target material on the substrate.

[0003] The coated materials can be used in a variety of applications and in a variety of technical fields. For example, the coated materials can be used in the field of microelectronics, for example for producing semiconductor devices. In addition, substrates for displays can be coated using the PVD process. Further applications include insulating boards, organic light emitting diode (OLED) panels, substrates with thin film transistors (TFT), color filters, etc.

[0004] During the deposition process, the substrate is typically exposed to elevated temperatures under vacuum conditions, which poses challenges to substrate handling and substrate cooling, especially for large-area thin substrates.

[0005] In light of the foregoing, there is a need to provide a carrier for holding a substrate, a deposition apparatus for depositing a material on a substrate, and a method for supporting a substrate to overcome at least some of the problems in the art. Summary of the invention

[0006] In view of the above, a carrier for holding a substrate in a bent state, an apparatus for depositing a layer on a substrate in a bent state and a method for supporting a substrate in a bent state according to the independent claims are provided. Further features, details, aspects, embodiments and examples are shown in the dependent claims, the description and the drawings.

[0007] According to an embodiment, a carrier for holding a substrate in a curved state is provided. The carrier comprises a carrier body having a curved substrate support surface. In addition, the carrier comprises a seal for providing a seal between an edge of the substrate and the carrier body. In addition, the carrier comprises a substrate fixing device for pressing an edge of the substrate against the seal. The carrier body comprises one or more gas supply conduits to provide an air cushion between the back side of the substrate and the curved substrate support surface.

[0008] According to an embodiment, an apparatus for depositing a layer on a substrate in a curved state is provided. According to any embodiment described herein, the apparatus comprises a vacuum deposition chamber, an arrangement of deposition sources, and a carrier for holding the substrate in a curved state.

[0009] According to an embodiment, a method for supporting a substrate in a curved state in a vacuum deposition chamber is provided. The method comprises providing a carrier according to any embodiment described herein. In addition, the method comprises providing an air cushion between the back side of the substrate and the curved substrate support surface.

[0010] Embodiments are also directed to devices for performing the disclosed methods, and include device components for performing each of the described method aspects. The methods may be performed by hardware components, computers programmed by appropriate software, by any combination of the two, or in any other manner. In addition, embodiments according to the present disclosure are also directed to methods for operating the devices. It includes method aspects for performing each function of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to be able to understand in detail the manner in which the above-mentioned features of the present disclosure are implemented, the present disclosure briefly summarized above can be described in more detail with reference to the embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below:

[0012] Figure 1 shows a schematic top view of a carrier according to embodiments described herein;

[0013] Figure 2 shows a schematic front view of a carrier according to embodiments described herein;

[0014] Figures 3 to 6 shows a schematic top view of a carrier according to further embodiments described herein;

[0015] Figure 7 and Figure 8 shows a schematic top view of a deposition apparatus according to embodiments described herein; and

[0016] Fig. 9 A block diagram illustrating a method for supporting a substrate in a bent state according to embodiments described herein is shown. DETAILED DESCRIPTION

[0017] Reference will now be made in detail to various embodiments of the present disclosure, one or more examples of which are shown in the accompanying drawings. In the following description of the drawings, like reference numerals represent like parts. In general, only the differences with respect to the various embodiments are described. Each example is provided by way of explanation of the present disclosure and is not meant to be limiting of the present disclosure. In addition, features shown or described as part of one embodiment may be used on other embodiments or used in combination with other embodiments to produce yet another embodiment. This description is intended to include such modifications and variations.

[0018] In the following description of the accompanying drawings, the same reference numerals represent the same or similar components. Generally, only the differences with respect to the various embodiments are described. Unless otherwise specified, the description of a part or aspect in one embodiment also applies to the corresponding part or aspect in another embodiment.

[0019] refer to Figure 1 , describes a carrier 100 for holding a substrate 10 in a curved state according to the present disclosure. According to an embodiment, which can be combined with any other embodiment described herein, the carrier 100 comprises a carrier body 110 having a curved substrate supporting surface 111. Furthermore, the carrier 100 comprises a seal 120 for providing a seal between an edge of the substrate 10 and the carrier body 110. Furthermore, the carrier 100 comprises a substrate fixing device 130 for pressing an edge of the substrate 10 onto the seal 120. The carrier body 110 comprises one or more gas supply ducts 140 to provide gas to the back side 10B of the substrate 10, in particular to provide a gas cushion between the back side 10B of the substrate 10 and the curved substrate supporting surface 111.

[0020] Therefore, compared with the prior art, an improved carrier for holding a substrate is provided. In particular, by providing a carrier configured to hold the substrate in a bent state, the holding stability of the substrate can be improved due to the mechanical tension caused in the substrate by the bent state of the substrate. In addition, the embodiments of the carrier as described herein beneficially provide improved heat conduction performance from the substrate to the carrier, thereby improving the cooling efficiency of the substrate. In addition, it should be noted that the carrier according to the embodiments described herein is particularly suitable for cooling thin substrates with a thickness of 0.1 mm to 1.8 mm, in particular large area substrates. In other words, compared with the prior art, the carrier described herein beneficially reduces possible substrate damage. In addition, the alignment of the substrate relative to the base, i.e., the carrier, in particular the carrier body, can be improved.

[0021] Before describing various embodiments of the present disclosure in more detail, some aspects regarding some terms used herein are explained.

[0022] In the present disclosure, a "carrier for holding a substrate in a bent state" may be understood as a holder configured to hold a substrate as described herein, in particular a large-area substrate as described herein, in a bent or curved state. Figure 1 , the substrate held or supported by a carrier as described herein comprises a front surface 10F and a back surface 10B. The front surface is the surface on the substrate on which the layer is to be deposited. The back surface of the substrate is the surface of the substrate facing the carrier body. In particular, the carrier for holding the substrate is configured to hold the substrate substantially vertically. In the present disclosure, the term "substantially vertical" may be understood as being vertical within a tolerance T of T≤±15°, particularly T≤±10°, more particularly T≤±5°, such as T≤±1° relative to the absolute vertical direction. The absolute vertical direction corresponds to the direction of gravity.

[0023] In the present disclosure, a "substrate in a bent state" may be understood as a substrate that is bent about a bending axis. Thus, it should be understood that initially the substrate is substantially flat, and when the substrate is fixed to a carrier, the substrate is bent and has a bent state. Thus, in the bent or curved state of the substrate (i.e., when the substrate is fixed to a carrier), mechanical tension occurs in the substrate. Furthermore, it should be understood that typically when the substrate is removed or released from the carrier, the substrate returns to the initial substantially flat state. Thus, the substrate is typically elastic.

[0024] The radius of curvature of the substrate in the bent or curved state may be constant or non-constant. Typically, the bending axis is substantially vertical. In the exemplary embodiment shown in the drawings, the substrate is bent around a vertical bending axis. Alternatively, the bending axis may be substantially horizontal (not explicitly shown in the figures). In the present disclosure, "substantially horizontal" may be understood as being horizontal within a tolerance T of T≤±15°, particularly T≤±10°, more particularly T≤±5°, such as T≤±1° relative to the absolute horizontal direction. The absolute horizontal direction is perpendicular to the absolute vertical direction.

[0025] In the present disclosure, the term "substrate" may particularly encompass a substantially inflexible substrate, such as a glass plate or a metal plate. The term "substantially inflexible" should be understood to be distinct from "flexible". In particular, a substantially inflexible substrate may have a degree of flexibility, such as a glass plate having a thickness of 0.5 mm or less, wherein the substantially inflexible substrate is less flexible than a flexible substrate. Typically, the substrate described herein is an elastic substrate. In addition, it should be understood that the substrate described herein can be bent into a curved state. Therefore, an initially flat or plate-like substrate can be fixed to a carrier body having a curved substrate support surface as described herein, so that the substrate remains in a curved or curved state. For example, the substrate can have a thickness of 0.1 mm to 1.8 mm. According to embodiments described herein, the substrate can be made of any material suitable for material deposition. For example, the substrate can be made of a material selected from a group consisting of glass (e.g., soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite material, carbon fiber material, or any other material or material combination that can be coated by a deposition process.

[0026] According to some embodiments, the substrate may be a "large area substrate" and may be used in display manufacturing. For example, the substrate may be a glass or plastic substrate. For example, the substrate described herein should cover substrates commonly used for LCD (liquid crystal display), PDP (plasma display panel), etc. For example, a "large area substrate" may have an area of ​​0.5 m 2 or larger, especially 1m 2 In some embodiments, the large area substrate may be GEN 4.5, which corresponds to about 0.67 m 2 Base plate (0.73×0.92m); GEN 5, which corresponds to about 1.4m 2 Base plate (1.1m x 1.3m); GEN 7.5, which corresponds to about 4.29m 2 Base plate (1.95m x 2.2m); GEN 8.5, which corresponds to about 5.7m 2 substrate (2.2m x 2.5m); or even GEN 10, which corresponds to about 8.7m 2 Substrate (2.85m x 3.05m). Even larger generations (eg, GEN 11 and GEN 12) and corresponding substrate areas can be similarly realized.

[0027] In the present disclosure, a "carrier body" may be understood as a rigid body of a carrier configured to support a substrate. Typically, the carrier body has a curved substrate supporting surface. A "substrate supporting surface" may be understood as a surface of a carrier facing a substrate, in particular the back side of a substrate. For example, a curved substrate supporting surface may be convex or concave. A curved substrate supporting surface may include a constant or non-constant radius of curvature. Typically, a curved substrate supporting surface is purely convex or purely concave. In other words, a curved substrate supporting surface may be only a convex shape with a constant or non-constant radius of curvature. Alternatively, a curved substrate supporting surface may be only a concave shape with a constant or non-constant radius of curvature. It should be understood that when an air cushion is provided between the back side 10B of the substrate 10 and the curved substrate supporting surface 111, there is no contact between the curved substrate supporting surface 111 and the back side 10B of the substrate 10. In other words, in an operating state where an air cushion is provided, the substrate may be kept contactless relative to the substrate supporting surface 111.

[0028] In the present disclosure, a "seal" may be understood as a seal configured to provide a gas-tight seal between an edge of a substrate and a carrier body as described herein, such that an air cushion may be provided between the back side of the substrate and the substrate support surface. Typically, the seal is configured to provide a line contact, in particular a closed line contact, between the back side of the substrate and the seal. Thus, typically, the seal is configured to provide a line contact, in particular a closed line contact, between the seal and the front side of the carrier body, in particular a curved substrate support surface.

[0029] In the present disclosure, "substrate edge" may be understood as the edge of the front surface of the substrate, in particular the edge region of the front surface of the substrate. In particular, "substrate edge" may be understood as the complete edge of the substrate. In other words, the term "substrate edge" may include all edges on all sides of the substrate. More specifically, in the case of a vertically held substrate, such as Figure 2 As shown in FIG. 1 , the term “substrate edge” may include an upper edge 10UE, a lower edge 10BE, and a side edge 10LE between the upper edge 10UE and the lower edge 10BE of the substrate 10. Figure 2 As shown in the example.

[0030] In the present disclosure, a "substrate fixture" may be understood as a fixture configured to fix a substrate to a carrier, in particular to a carrier body. Typically, the substrate fixture is configured to press the edge of the substrate to a seal as described herein. In other words, the substrate fixture may be configured to apply a compressive force on the edge of the substrate. Furthermore, it should be understood that, typically, the substrate fixture is configured to hold the substrate in the described bent state. In other words, typically, the substrate fixture is configured to counteract reaction forces, such as substrate tension and substrate stress, that occur when a substrate in a bent or curved state as described herein is fixed to a carrier body.

[0031] In the present disclosure, the expression "the carrier body includes one or more gas supply conduits to provide an air cushion between the back side of the substrate and the substrate support surface" can be understood as at least one gas supply conduit is provided in the carrier body, and gas can be supplied to the space between the back side of the substrate and the substrate support surface through the gas supply conduit, so that the air cushion can be provided. Figure 1 In the diagram, one or more gas supply conduits 140 are schematically indicated by arrows. Typically, the gas supply conduits comprise gas outlet openings provided in the substrate supporting surface of the carrier body.

[0032] In the present disclosure, "gas cushion" may be understood as a volume filled with gas, in particular a gas with a constant pressure. In particular, in the embodiments described herein, a volume filled with gas, i.e., a gas cushion, is provided between the back side 10B of the substrate 10 and the substrate support surface 111, wherein the back side of the substrate is sealed to the substrate support surface via the seal 120 described herein.

[0033] According to an embodiment, which can be combined with any other embodiment described herein, the substrate fixing device 130 may include a plurality of clamps. Figure 2 As shown in the exemplary embodiment, the substrate fixing device 130, in particular a plurality of clamps, can be distributed over the edge of the carrier and configured to press the edge of the substrate 10 onto the seal 120. It should be understood that, typically, the substrate fixing device 130, in particular a plurality of clamps, is connected to the carrier body 110.

[0034] According to an embodiment, which can be combined with any other embodiment described herein, the seal 120 is made of a flexible material. In particular, the seal 120 can be made of a flexible polymer material. Thus, when the edge of the substrate is pressed onto the seal 120 by the substrate fixture 130, a hermetic seal can be provided.

[0035] According to an embodiment, which can be combined with any other embodiment described herein, the carrier comprises a gas supply 150 connected to one or more gas supply conduits 140 to provide an air cushion, such as Figure 3 Schematically shown. For example, the gas supply may include a gas tank, which may be part of a deposition system as described herein. The gas supply 150 may be configured to provide a gas cushion pressure p of up to 1 bar, in particular the gas cushion pressure p may be 1Pa≤p≤1bar, in particular 5Pa≤p≤1bar. According to an example, the gas cushion pressure p may be 1Pa≤p≤50Pa, in particular 1Pa≤p≤20Pa. Furthermore, the gas supply may be configured to supply an inert gas, such as argon, helium or other inert gases.

[0036] According to an embodiment which may be combined with any other embodiment described herein, such as Figure 1 As schematically shown, the curved substrate support surface 111 is convex to hold a convex substrate. The convex substrate support surface can advantageously provide a good self-alignment of the convex substrate with the convex substrate support surface. The term "self-alignment" can be understood as the substrate being aligned substantially parallel to the substrate holding surface due to substrate tension in the curved or bent state of the substrate.

[0037] Alternatively, the curved substrate support surface 111 may be concave to hold a concave substrate, such as Figure 4 As shown in the exemplary embodiment, the concave substrate can also provide improved substrate self-alignment compared to the prior art. In addition, the concave substrate support surface can help reduce the risk of substrate peeling compared to a convex substrate support surface. In addition, the substrate fixing device, especially pressing the substrate onto the seal, can be simpler compared to a convex substrate support surface. In other words, in a concave configuration, the compression force used to provide an airtight seal between the substrate and the seal can be smaller than in a convex configuration.

[0038] For example, reference Figure 4 According to an embodiment, which can be combined with any other embodiment described herein, the carrier 100 may include a cooling system 190 for cooling the carrier body 110. Figure 4 The cooling system 190 system shown in is combined with a concave configuration, but it is to be understood that the cooling system 190 may be provided in any embodiment described herein. For example, the cooling system 190 may include a coolant supply for providing a coolant. For example, the cooling system 190 may be a closed-loop cooling system, in particular a closed-loop refrigeration system. Typically, the cooling system includes a pipe for the coolant. The pipe may be embedded in the carrier body. Additionally or alternatively, the pipe may be provided on the back side of the carrier body. The coolant may be understood as a cooling fluid, in particular an incompressible cooling fluid, capable of providing cooling of the substrate to a substrate temperature of 100 degrees Celsius or below, in particular 80 degrees Celsius or below. Therefore, according to an embodiment that may be combined with any other embodiment described herein, the carrier body may be a cooled carrier, such as an oil-cooled or water-cooled carrier body.

[0039] For example, reference Figure 5 According to an embodiment that can be combined with any other embodiment described herein, the carrier further includes an electrostatic chuck 160 for holding the substrate by electrostatic force. In particular, the electrostatic chuck 160 may include an electrode assembly having a plurality of electrodes 161 for providing an electrostatic force to the substrate. Typically, the electrode assembly is embedded in the carrier body 110. Therefore, it should be understood that the electrode assembly can provide an electrostatic field to act on the substrate for holding the substrate.

[0040] According to some embodiments that can be combined with other embodiments described herein, the electrostatic chuck 160 may include one or more voltage sources (not explicitly shown) configured to apply one or more voltages to the plurality of electrodes 161. In some implementations, the one or more voltage sources are configured to ground at least some of the plurality of electrodes. For example, the one or more voltage sources may be configured to apply a first voltage having a first polarity, a second voltage having a second polarity, and / or ground to the plurality of electrodes. According to some embodiments, each electrode, each second electrode, each third electrode, or each fourth electrode of the plurality of electrodes may be connected to a separate voltage source. The term "polarity" refers to the electrical polarity, i.e., negative polarity (-) and positive polarity (+). For example, the first polarity may be negative polarity, and the second polarity may be positive polarity, or the first polarity may be positive polarity, and the second polarity may be negative polarity. According to some embodiments that can be combined with other embodiments described herein, the electrostatic chuck 160 of the substrate support may be a monopolar or bipolar electrostatic chuck.

[0041] For example, reference Figure 5 According to some embodiments that may be combined with other embodiments described herein, a controller 170 may be provided, which may be configured to control one or more voltage sources to apply one or more voltages and / or ground to the plurality of electrodes 161. The controller 170 may be configured to regulate the electrostatic chuck, i.e., the controller may be configured to control the electrostatic chuck. Although not explicitly illustrated, it is understood that the controller 170 may be configured to regulate the gas supply 150. The controller 170 may be divided into separate controllers, i.e., a controller for the electrostatic chuck and an independent controller for the gas supply. It should be understood that in the absence of an electrostatic chuck, only a controller for controlling the gas supply may be provided.

[0042] Typically, the controller described herein includes a central processing unit (CPU), a memory, and, for example, support circuits. The CPU can be one of any form of general-purpose computer processors that can be used in an industrial environment to control various chambers and subprocessors. The memory is coupled to the CPU. The memory or computer-readable medium can be one or more readily available storage devices, such as random access memory, read-only memory, hard disk, or any other form of local or remote digital storage. The support circuits can be coupled to the CPU for supporting the processor in a conventional manner. The support circuits typically include caches, power supplies, clock circuits, input / output circuit systems, and related subsystems, among others. Control instructions are generally stored in the memory as software routines, commonly referred to as recipes. The software routines can also be stored and / or executed by a second CPU that is located away from the hardware controlled by the CPU.

[0043] For example, reference Figure 6According to an embodiment that can be combined with any other embodiment described herein, the curved substrate support surface 111 includes a plurality of filaments 180 of a dry adhesive material for attaching the back side 10B of the substrate 10. For the purpose of illustration only, some filaments are marked with reference numbers. Typically, a plurality of filaments 180 are attached to the curved substrate support surface 111 and extend away from the curved substrate support surface 111. Therefore, it is to be understood that typically a plurality of filaments 180 have free ends to attach the substrate as described herein. More specifically, the free ends of a plurality of filaments are typically configured to adhere to the substrate by van der Waals forces. Therefore, it is to be understood that a plurality of filaments 180 can provide an adhesive arrangement that provides a permeable or porous configuration of the adhesive arrangement. In other words, the structure of the adhesive arrangement can be configured to be porous or sponge-like so that gas can reach the back side 10B of the substrate 10.

[0044] According to an example, the dry adhesive material can be a synthetic bristle material. In particular, the dry adhesive material can be a Gecko adhesive. Typically, the dry adhesive material is configured to provide adhesion through van der Waals forces. For example, the filaments can be nanotubes or carbon nanotubes.

[0045] For example, reference Figure 7 , describing an apparatus 200 for depositing a layer on a substrate 10 in a curved state according to the present disclosure. According to an embodiment that can be combined with any other embodiment described herein, the apparatus 200 comprises a vacuum deposition chamber 210, an arrangement of deposition sources 220, and a carrier 100 according to any embodiment described herein. In particular, an arrangement of deposition sources 220 and a carrier 100 for holding a substrate 10 are arranged in the vacuum deposition chamber 210.

[0046] In the present disclosure, the term "vacuum" is understood to mean a technical vacuum having a vacuum pressure less than, for example, 10 mbar. Typically, the pressure in the vacuum chamber described herein may be between 10 -5 mbar and about 10 -8 mbar, more typically between 10 -5 mbar and 10 -7 mbar, and even more typically between about 10 -6 mbar and about 10 -7 mbar.

[0047] In the present disclosure, an "arrangement of deposition sources" may be understood as an arrangement of a plurality of deposition sources. Individual deposition sources in the arrangement of deposition sources may have the same or different configurations.

[0048] In the present disclosure, a "deposition source" may be understood as a source configured for material deposition, in particular by using a sputtering deposition process, in particular a magnetron sputtering process. Typically, the deposition source is a vertical deposition source, i.e., having a longitudinal main axis extending in a substantially vertical direction. It should be understood that in order to deposit a layer on a substrate, a carrier with a substrate may be continuously moved past the deposition source during deposition ("dynamic coating"). Alternatively, a carrier with a substrate may remain substantially in a constant position during layer deposition ("static coating"). In addition, substrate scanning or substrate swinging may also be possible. The embodiments described in the present disclosure relate to dynamic coating and static coating processes. For the example of a mobile carrier, a transport system may be used, in particular including a magnetic levitation system. Typically, a magnetic levitation system is configured to suspend or hold a carrier without mechanical contact or with reduced mechanical contact. In addition, a magnetic levitation system may be configured to move the carrier by magnetic force.

[0049] According to some embodiments described herein that can be combined with other embodiments described herein, the deposition material of the deposition source can be selected according to the deposition process and the subsequent application of the coated substrate. For example, the deposition material can be a material selected from the group consisting of: metals, such as aluminum, molybdenum, titanium, copper or the like, silicon, indium tin oxide and other transparent conductive oxides. An oxide layer, a nitride layer or a carbide layer that may include these materials can be deposited by providing a material from a material deposition source or by reactive deposition, i.e., the material from the material deposition source can react with elements such as oxygen, nitride or carbon from a process gas.

[0050] According to some embodiments, which can be combined with any other embodiments described herein, the arrangement of the deposition source 220 follows the curvature of the substrate, such as Figure 8 In other words, the deposition source 220 may be substantially parallel with respect to the front surface 10F of the substrate.

[0051] For example, reference Figure 7 , a block diagram is shown, describing a method 300 for supporting a substrate in a curved state according to the present disclosure. According to an embodiment that can be combined with any other embodiment described herein, the method 300 includes providing (represented by block 310) a carrier 100 for supporting a substrate 10 according to any embodiment described herein. In addition, the method includes providing (represented by block 320) an air cushion between the back side 10B of the substrate 10 and the curved substrate supporting surface 111. Typically, providing the air cushion includes introducing a gas via one or more gas supply ducts 140 using a gas supply 150. In particular, the air cushion is at a pressure p of 1Pa≤p≤20Pa.

[0052] In view of the embodiments described herein, it can be appreciated that improved carriers, apparatus and methods for substrates are provided as compared to the prior art. In particular, by providing a carrier configured to hold a substrate in a bent or curved state, the holding stability of the substrate can be improved due to mechanical tension in the substrate caused by the bent or curved state. In addition, the embodiments described herein beneficially provide improved thermal conductivity from the substrate to the carrier, thereby improving the cooling efficiency of the substrate. In addition, it should be noted that the embodiments described herein are particularly useful for reducing possible substrate damage. In addition, the alignment of the substrate relative to the base, i.e., the carrier, can be improved, thereby improving the overall layer deposition quality.

[0053] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, the scope of which is determined by the claims that follow.

Claims

1. A carrier (100) for holding a substrate (10) in a bent state, include: a carrier body (110) having a curved substrate supporting surface (111), a seal (120) for providing a seal between an edge of the substrate (10) and the carrier body (110), and A substrate fixture (130) for pressing the edge of the substrate (10) onto the seal (120), wherein the carrier body includes one or more gas supply conduits (140) to provide an air cushion between the back side (10B) of the substrate (10) and the curved substrate supporting surface (111).

2. The carrier (100) according to claim 1, wherein the substrate fixing device (130) comprises a plurality of clamps.

3. The carrier (100) according to claim 1 or 2, wherein the sealing element (120) is made of a flexible material, in particular a flexible polymer material.

4. The carrier (100) according to any one of claims 1 to 3, further comprising a gas supply (150) connected to the one or more gas supply conduits to establish the gas cushion.

5. The carrier (100) according to claim 4, wherein the gas supply (150) is configured to provide a gas cushion pressure p of 1Pa≤p≤20Pa.

6. The carrier (100) according to any one of claims 1 to 5, wherein the curved substrate supporting surface (111) is convex for holding the substrate (10) in a convex state.

7. The carrier (100) according to any one of claims 1 to 5, wherein the curved substrate supporting surface (111) is concave for holding the substrate (10) in a concave state.

8. The carrier (100) according to any one of claims 1 to 7, further comprising a cooling system (190) for cooling the carrier body (110).

9. The carrier (100) according to any one of claims 1 to 8, further comprising an electrostatic chuck (160) for holding the substrate (10) via electrostatic force.

10. The carrier (100) according to any one of claims 1 to 9, wherein the curved substrate supporting surface (111) comprises a plurality of filaments of a dry adhesive material for attaching the back side (10B) of the substrate (10), the plurality of filaments extending away from the curved substrate supporting surface (111).

11. The carrier (100) according to claim 10, wherein the dry adhesive material is a synthetic bristle material, in particular a Gecko adhesive.

12. A device (200) for depositing a layer on a substrate (10) in a curved state, include: a vacuum deposition chamber (210), the arrangement of the deposition source (220), and A carrier (100) for holding the substrate (10) in a bent state according to any one of claims 1 to 11.

13. The apparatus (200) of claim 12, wherein the arrangement of deposition sources (220) follows the curvature of the substrate (10).

14. A method (300) for supporting a substrate (10) in a curved state in a vacuum deposition chamber (210), the method include: providing (310) a carrier (100) for holding the substrate (10) in the bent state according to any one of claims 1 to 11, and An air cushion is provided (320) between the back side (10B) of the substrate (10) and the curved substrate supporting surface (111).

15. The method according to claim 14, wherein the air cushion is provided include: Gas is introduced using a gas supply (150) via one or more gas supply conduits.

16. The method according to claim 14 or 15, wherein the air cushion is provided at a pressure p of 1Pa≤p≤20Pa.

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