Electroplating liquid level control equipment with defoaming function and method

Abstract

The electroplating liquid level control equipment comprises a first tank body, a second tank body and a PLC, a partition plate is formed in the first tank body and divides the first tank body into a plating liquid tank and an overflow tank, an overflow opening is transversely formed in the partition plate in a penetrating mode, and the overflow opening is communicated with the second tank body. A backflow pipeline is arranged between the overflow groove and the second groove body, and a liquid inlet pipeline is arranged between the second groove body and the plating solution groove; a first control switch is arranged on the liquid inlet pipeline; the backflow pipeline comprises a first pipeline and a second pipeline which are communicated with each other, one end of the first pipeline is communicated with the overflow groove, the second pipeline is composed of a plurality of sets of small backflow pipes, the small backflow pipes extend to the bottom side of the second groove body, the first pipeline is provided with a second control switch, and each set of small backflow pipes is provided with a third control switch. And each control switch is electrically connected with the PLC. And the generation of foams in the circulating flow of the plating solution is effectively reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating, and in particular to an electroplating liquid level control device and method with a defoaming function. Background Art

[0002] The control of the stability of the plating solution in the electroplating process is crucial to ensure the quality and uniformity of the coating, and the control of bubbles in the plating solution is an important factor affecting the quality and stability of the coating. The electroplated products will be exposed to foam and bubbles during the electroplating production process, which will cause zinc spots on the product surface, flowery coating, and poor density of the coating. Different types of electroplating solutions produce different foams due to their own characteristics, and the addition of various organic additives will make the plating solution very easy to foam under certain circumstances. In addition, during the circulation and reflux of the plating solution, due to the height difference between the tanks containing the plating solution, a large number of bubbles and foams are also easily generated. Bubbles and foams will bring the by-products of the impurities and additives of the plating solution to the surface of the plating solution, thereby affecting the coating quality of the product. In order to ensure product quality, tools are generally used to salvage the foam during production breaks, but the salvage effect is poor and unstable. Summary of the invention

[0003] The purpose of the present invention is to provide an electroplating liquid level control device and method with a defoaming function, and the technical problem to be solved is to reduce the generation of plating liquid foam and improve the quality of the plating liquid flowing into the plating liquid tank.

[0004] To achieve the above-mentioned purpose, the solution of the present invention is: an electroplating liquid level control device with a defoaming function, comprising a first tank body, a second tank body and a PLC controller, the first tank body and the second tank body are used to contain the plating solution; A partition is formed in the first tank body, and the partition divides the first tank body into two areas, a plating tank and an overflow tank. The plating tank is used for electroplating the product to be electroplated. An overflow port is formed transversely through the partition, so that the plating solution can flow from the plating tank into the overflow tank through the overflow port. A reflux pipeline for conveying the plating solution from the overflow tank to the second tank body is provided between the overflow tank and the second tank body. A liquid inlet pipeline for conveying the plating solution from the second tank body to the plating tank is provided between the second tank body and the plating tank, so that the plating solution forms a circulation loop; A first control switch is provided on the liquid inlet pipeline, and the first control switch is used to control the flow rate of the plating solution in the liquid inlet pipeline; The reflux pipeline includes a first pipeline and a second pipeline, the first pipeline and the second pipeline are connected to each other, the first pipeline is connected to the overflow tank at one end away from the second pipeline, the second pipeline is composed of a plurality of groups of reflux small tubes, the plating solution in the first pipeline is evenly distributed to the plurality of groups of reflux small tubes, the reflux small tubes extend to the bottom side of the second tank body at one end away from the first pipeline, the first pipeline is provided with a second control switch, the second control switch is used to control the flow rate of the plating solution in the first pipeline, each group of reflux small tubes is provided with a third control switch, the third control switch is used to control the flow rate of the plating solution in each group of reflux small tubes; The first control switch, the second control switch and the third control switch are electrically connected to a PLC controller respectively, and the PLC controller is used to control each switch to be turned on or off respectively.

[0005] Furthermore, one end of the liquid inlet pipeline is connected to the second tank body, and the other end extends into the overflow tank, and extends a distance below the plating liquid in the overflow tank and then passes through the partition to enter the plating liquid tank.

[0006] Furthermore, the first tank body is located above the second tank body, and the reflux pipeline transports the plating liquid in the overflow tank downward to the second tank body. A filter is also provided on the liquid inlet pipeline, and the filter is used to filter the plating liquid in the liquid inlet pipeline. A power pump is provided in the filter to pump the filtered plating liquid into the plating liquid tank when the filter is running.

[0007] Furthermore, a first liquid level sensor is provided in the overflow tank, and the first liquid level sensor is used to collect the liquid level H1 of the plating solution in the overflow tank. The first liquid level sensor is connected to the PLC controller in communication. The overflow tank has a preset liquid level H1. 溢流槽 , so that H1<H 溢流槽 When the PLC controller controls the second control switch to close or reduce the flow of the plating solution in the first pipeline.

[0008] Furthermore, a second liquid level sensor is provided in the second tank body, and the second liquid level sensor is used to collect the liquid level H2 in the second tank body. The second liquid level sensor is connected to the PLC controller for communication. The second tank body has a preset liquid level H 第二槽体 , so that H2<H 第二槽体 When the PLC controller controls the second control switch and the third control switch to increase the plating solution flow in the reflux pipeline, or the PLC controller controls the first control switch to reduce the plating solution flow in the inlet pipeline.

[0009] Furthermore, the height of the overflow port from the bottom of the overflow tank is H 溢流口 ; △H=H 溢流口 -H 溢流槽 ; Among them, △H is the preset height difference between the preset plating solution level in the overflow tank and the overflow port, H溢流槽 Preset the liquid level height of the plating solution in the overflow tank; When the plating solution is a nickel-phosphorus plating solution, ΔH = 2-5 cm; When the plating solution is a zinc plating solution, ΔH = 10-15 cm; When the plating solution is other solutions, △H = 15-20cm.

[0010] Furthermore, the first pipeline has a zigzag structure, which can effectively slow down the flow rate of the plating solution in the first pipeline.

[0011] Furthermore, the liquid inlet pipeline includes a first liquid inlet pipe and a second liquid inlet pipe, both ends of the first liquid inlet pipe are respectively connected to the bottom of the second tank body and the filter, and both ends of the second liquid inlet pipe are respectively connected to the filter and the plating liquid tank. A first control switch is arranged on the first liquid inlet pipe for controlling the flow rate of the plating liquid in the first liquid inlet pipe. A fourth control switch is arranged on the second liquid inlet pipe, and the fourth control switch is communicatively connected to the PLC controller for controlling the flow rate of the plating liquid in the second liquid inlet pipe.

[0012] Furthermore, the portion of the liquid inlet pipeline located in the plating tank is a first liquid inlet section, the plating tank is a square structure, and the plating tank includes a first side wall arranged opposite to the partition and two second side walls arranged opposite to each other, the first liquid inlet section extends along a first horizontal direction, extending from one side of the partition to the first side wall, a plurality of second liquid inlet sections are arrayed along the first horizontal direction on the first liquid inlet section, the first liquid inlet section and the second liquid inlet section are connected, the second liquid inlet section extends along a second horizontal direction, the first horizontal direction is perpendicular to the second horizontal direction, so that the first liquid inlet section and the second liquid inlet section are arranged on the entire bottom wall of the plating tank, and a plurality of liquid outlet holes are formed on the side wall of the first liquid inlet section and the side wall of the second liquid inlet section; The liquid outlet is vertically upward or inclined upward.

[0013] The present invention also provides a method for applying the electroplating liquid level control device with defoaming function, wherein the first liquid level sensor feeds back the collected H1 to the PLC controller; the second liquid level sensor feeds back the collected H2 to the PLC controller; △H1=H 溢流口 -H1; Where: △H1 is the actual height difference between the plating solution surface in the overflow tank and the overflow port; The preset height difference △H includes the maximum value △H max and minimum value △H min ; Among them, △H max Expressed as overflow height H 溢流口 The preset liquid level H in the overflow tank 溢流槽 The maximum limit of the preset height difference between the two. When the actual height difference △H1>△H maxWhen the actual plating liquid level H1 in the overflow tank is lower than the preset liquid level H 溢流槽 The minimum limit of Among them, △H min Expressed as overflow height H 溢流口 The preset liquid level H in the overflow tank 溢流槽 The minimum limit of the preset height difference between the two. When the actual height difference △H1<△H min When the actual plating liquid level H1 in the overflow tank is higher than the preset liquid level H 溢流槽 The maximum limit of When △H1>△H max When the PLC controller controls the second control switch to close or reduce the flow rate of the plating solution in the first pipeline, the outflow of the plating solution in the overflow tank is reduced; When △H1<△H min When the PLC controller controls the second control switch to open or increase the flow rate of the plating solution in the first pipeline, the outflow of the plating solution in the overflow tank is increased; When H2<H 第二槽体 At the same time, the PLC controller controls the first control switch to close or reduce the flow rate of the plating solution in the liquid inlet pipeline and reduce the outflow of the plating solution in the second tank body.

[0014] After adopting the above scheme, the beneficial effects of the present invention are: (1) A first control switch is provided on the liquid inlet pipeline, a second control switch is provided on the first pipeline, and a third control switch is provided on each group of reflux small tubes. The first control switch, the second control switch and the third control switch are electrically connected to the PLC controller respectively. The PLC controller is used to control each switch to be turned on or off respectively, and can adjust the liquid level of the plating liquid in the overflow tank and the liquid level of the plating liquid in the second tank body to maintain the height difference between the liquid level of the plating liquid in the overflow tank and the overflow port, thereby reducing the foam generated when the plating liquid flows from the plating tank through the overflow port into the overflow tank. At the same time, when the liquid level of the plating liquid in the plating tank exceeds the overflow port, the plating liquid will flow from the plating tank into the overflow tank, thereby effectively controlling the amount of plating liquid in the plating tank and maintaining the electroplating effect in the plating tank; (2) The reflux pipeline includes a first pipeline and a second pipeline, the first pipeline and the second pipeline are connected to each other, the first pipeline is connected to the overflow tank at one end away from the second pipeline, and the second pipeline is composed of a plurality of groups of reflux small tubes. The plating solution in the first pipeline is evenly distributed to the plurality of groups of reflux small tubes. The plurality of reflux small tubes are used for diversion, thereby reducing the flow rate and impact force of the plating solution in the reflux small tubes to avoid the generation of foam. In addition, the reflux small tube extends to the bottom side of the second tank body at one end away from the first pipeline to avoid the plating solution in the reflux small tube from mixing with the original plating solution in the second tank body, thereby preventing the longitudinal flow from generating foam; (3) An overflow port is formed through the partition plate in a transverse direction, so that the plating solution can flow from the plating solution tank into the overflow tank through the overflow port. A reflux pipeline for conveying the plating solution from the overflow tank to the second tank body is provided between the overflow tank and the second tank body. A liquid inlet pipeline for conveying the plating solution from the second tank body to the plating solution tank is provided between the second tank body and the plating solution tank, so that the plating solution forms a circulation loop, the plating solution is evenly mixed, and the composition of the plating solution is ensured to be uniform and stable; at the same time, the plating solution in the circulating reflux is prevented from contacting with the air, so that the effective components in the plating solution are at risk of being oxidized by the air; (4) One end of the liquid inlet pipeline is connected to the second tank body, and the other end extends into the overflow tank. After extending a certain distance below the plating liquid in the overflow tank, the liquid inlet pipeline passes through the partition and enters the plating liquid tank. Before entering the plating liquid tank, the liquid inlet pipeline can be kept warm in the plating liquid in the overflow tank to avoid directly transporting the plating liquid into the plating liquid tank to affect the temperature of the plating liquid in the plating liquid tank, and can also reduce the energy loss caused by this. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the present invention.

[0016] Figure 2 It is a schematic diagram of the control connection relationship of the PLC controller in the present invention.

[0017] Figure 3 It is a schematic diagram of the distribution of the liquid inlet pipeline in the plating tank of the present invention.

[0018] Figure 4 It is a schematic diagram of various liquid level height parameters in the overflow tank of the present invention.

[0019] Description of labels: 1-first tank body, 2-second tank body, 3-PLC controller, 4-partition, 5-plating tank, 6-overflow tank, 7-liquid inlet pipeline, 8-first control switch, 9-reflux pipeline, 10-second control switch, 11-third control switch, 12-first liquid level sensor, 13-second liquid level sensor, 14-filter, 15-fourth control switch, 41-overflow port, 51-first side wall, 52-second side wall, 61-liquid outlet, 71-first liquid inlet section, 72-second liquid inlet section, 73-liquid outlet, 74-first liquid inlet pipe, 75-second liquid inlet pipe, 91-first pipeline, 92-second pipeline, 93-reflux small tube. DETAILED DESCRIPTION

[0020] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] In the claims, specification and the above-mentioned drawings of the present invention, unless otherwise explicitly defined, directional words, such as the use of terms such as "center", "lateral", "longitudinal", "horizontal", "vertical", "top", "bottom", "inside", "outside", "up", "down", "front", "back", "left", "right", "clockwise", "counterclockwise" and the like to indicate directions or positional relationships are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as limiting the specific protection scope of the present invention.

[0022] like Figures 1 to 4 As shown, the present invention provides an electroplating liquid level control device with a defoaming function, comprising a first tank body 1, a second tank body 2 and a PLC controller 3, wherein the first tank body 1 and the second tank body 2 are used to contain plating liquid; a partition 4 is formed in the first tank body 1, and the partition 4 divides the first tank body 1 into two areas, a plating liquid tank 5 and an overflow tank 6. Specifically, the first tank body 1 is a rectangular parallelepiped structure, the partition 4 is parallel to the short side of the first tank body 1, and the two ends of the partition 4 are respectively abutted against the inner side walls of the relatively long sides of the first tank body 1, so that the plating liquid tank 5 and the overflow tank 6 are two tank bodies with equal height and width, and the length of the plating liquid tank 5 is greater than that of the overflow tank 6, wherein the plating liquid tank 5 is used for electroplating the product to be electroplated, and an overflow port 41 is formed transversely through the partition 4, so that the plating liquid can flow from the plating liquid tank 5 through the overflow port 41 into the overflow tank 6, and a reflux pipe for transporting the plating liquid from the overflow tank 6 to the second tank body 2 is arranged between the overflow tank 6 and the second tank body 2 The first tank body 1 is located above the second tank body 2, and the reflux pipeline 9 transports the plating solution downward to the second tank body 2. A filter 14 is also provided on the liquid inlet pipeline 7. The filter 14 is used to filter impurities in the plating solution in the liquid inlet pipeline 7. The filter 14 is any existing filter that can filter impurities in the plating solution. Activated carbon filtration or other filtration methods can be used. This is a prior art and will not be described in detail. A power pump (not shown in the figure) is provided in the filter 14 to pump the filtered plating solution into the plating solution tank 5 when the filter 14 is running. The power pump is any existing circulating pump that can pump fluid.

[0023] A first control switch 8 is provided on the liquid inlet pipeline 7 , and the first control switch 8 is used to control the flow rate of the plating solution in the liquid inlet pipeline 7 .

[0024] In this specific embodiment, the reflux pipeline 9 includes a first pipeline 91 and a second pipeline 92, the first pipeline 91 and the second pipeline 92 are connected to each other, a liquid outlet 61 is formed on the bottom wall of the overflow tank 6, and the end of the first pipeline 91 away from the second pipeline 92 is connected to the liquid outlet 61, and a second control switch 10 is provided on the first pipeline 91, and the second control switch 10 is used to control the flow rate of the plating solution in the first pipeline 91. The first pipeline 91 is a zigzag structure, specifically, including a first buffer section extending laterally, a direct current section extending vertically, and a second buffer section extending laterally, which can effectively slow down the flow rate of the plating solution in the first pipeline 91. Through the design of the zigzag structure, the potential energy of the plating solution can be effectively reduced, the impact force can be reduced, the direct downward impact can be avoided, and the generation of foam can be reduced; the second pipeline 92 is composed of a plurality of groups of reflux tubes 93, each group of reflux tubes 93 includes at least two reflux tubes 93, and the inner diameter of the first pipeline 91 is The inner diameter of each reflux tube 93 is larger than that of each reflux tube 93, and the plating liquid in the first pipeline 91 is diverted to each group of reflux tubes 93. In this way, the amount of plating liquid diverted to each group of reflux tubes 93 is significantly reduced compared with the amount of plating liquid in the first pipeline 91, which can greatly reduce the impact force of the plating liquid flowing downward into the second tank body 2 and reduce the generation of foam; the reflux tube 93 extends from one end of the first pipeline 91 to the bottom side of the second tank body 2, and the bottom side refers to a distance from the bottom wall of the second tank body 2, not contacting the bottom wall, so as to avoid the sediment deposited at the bottom of the second tank body 2 from being washed up; at the same time, it is avoided that the effective ingredients in the plating liquid are oxidized by contact with the air, and at the same time, the height difference generated when the plating liquid enters the second tank body 2 relative to the original plating liquid when it flows longitudinally can be reduced, thereby reducing the generation of foam; in addition, a third control switch 11 is provided on each group of reflux tubes 93, and the third control switch 11 is used to control the flow rate of the plating liquid in each group of reflux tubes 93.

[0025] The first control switch 8, the second control switch 10 and the third control switch 11 are electrically connected to the PLC controller 3 respectively, and the PLC controller 3 is used to control each switch to be turned on or off respectively. The first control switch 8, the second control switch 10 and the third control switch 11 are all existing electric control valves. The PLC controller 3 is an existing programmable logic controller. The PLC controller 3 is electrically connected to an external power supply, which is used to power each electric control valve and accurately control the opening amount of the electric control valve through analog control to adjust the flow rate. This is a prior art and is not elaborated on. When in use, the PLC controller 3 controls each third control switch 11 to adjust the flow rate, for example, to reduce the flow rate in the reflux tube 93 close to the diversion port of the first pipeline 91, or to increase the flow rate in the reflux tube 93 away from the diversion port of the first pipeline 91. The flow in the reflux tube 93 can achieve uniform flow in each group of reflux tubes 93 and achieve uniform diversion, so that each reflux tube 93 can evenly divert the plating solution in the first pipeline 91 to various parts of the second tank body 2 and evenly mix it with the original plating solution; each group of reflux tubes 93 can independently control the flow of the plating solution, and when the equipment keeps working uninterruptedly, one of the reflux tubes 93 can be cleaned or repaired to avoid the entire equipment from shutting down, which can effectively maintain production and reduce energy consumption; in addition, when the first control switch 8 is fully opened, the plating solution flow in the liquid inlet pipeline 7 reaches a maximum, and when the first control switch 8 is fully closed, the plating solution flow in the liquid inlet pipeline 7 is minimized to zero, and it can also be adjusted between the fully opened state and the fully closed state, thereby adjusting the plating solution flow in the liquid inlet pipeline 7.

[0026] In this specific embodiment, one end of the liquid inlet pipeline 7 is connected to the second tank body 2, and a through hole is provided on the side wall of the second tank body 2 near the bottom. One end of the liquid inlet pipeline 7 is installed on the through hole and is sealed so that the plating liquid in the second tank body 2 flows into the liquid inlet pipeline 7 from the bottom. The other end of the liquid inlet pipeline 7 extends to the overflow tank 6, and extends a distance below the plating liquid in the overflow tank 6, and then passes through the partition 4 into the plating liquid tank 5. Specifically, the other end of the liquid inlet pipeline 7 extends to the top side of the overflow tank 6, and extends downward in the overflow tank 6 to below the plating liquid, so as to extend downward in the plating liquid to the bottom of the overflow tank 6, then bend, and pass through the bottom of the partition 4 to enter the plating liquid tank 5. Of course, it can also Therefore, after passing through the side wall of the overflow trough 6, it extends under the plating liquid in the overflow trough 6 to achieve the purpose of insulation. Since the plating liquid in the plating liquid tank 5 is usually maintained within a constant temperature range, this configuration enables the liquid inlet pipeline 7 to be firstly insulated in the plating liquid in the overflow trough 6 before entering the plating liquid tank 5, thereby avoiding the liquid inlet pipeline 7 directly transporting the liquid to the plating liquid tank 5 to affect the temperature of the plating liquid in the plating liquid tank 5, and avoiding the need to additionally heat the plating liquid tank 5 after being transported to the plating liquid tank 5 due to the plating liquid temperature in the liquid inlet pipeline 7 being too low, thereby effectively reducing energy consumption and time and ensuring the quality of electroplating. Therefore, maintaining the liquid level height of the plating liquid in the overflow trough 6 can effectively insulate the plating liquid in the liquid inlet pipeline 7.

[0027] Furthermore, the liquid inlet pipeline 7 includes a first liquid inlet pipe 74 and a second liquid inlet pipe 75, two ends of the first liquid inlet pipe 74 are respectively connected to the second tank body 2 and the filter 14, two ends of the second liquid inlet pipe 75 are respectively connected to the filter 14 and the plating liquid tank 5, the plating liquid in the second tank body 2 flows into the filter 14 via the first liquid inlet pipe 74, and the plating liquid filtered by the filter 14 flows into the plating liquid tank 5 via the second liquid inlet pipe 75, the first control switch 8 is arranged on the first liquid inlet pipe 74, and is used to control the flow rate of plating liquid in the first liquid inlet pipe 74, and the second liquid inlet pipe 75 is also provided with a fourth control switch 15, and the fourth control switch 15 is electrically connected to the PLC controller 3, and is used to control the flow rate of plating liquid in the second liquid inlet pipe 75.

[0028] In this specific embodiment, in the circulation loop formed by the reflux pipeline 9 and the liquid inlet pipeline 7, one end of the reflux pipeline 9 is connected to the bottom of the overflow tank 6, and the other end extends to the bottom side of the second tank body 2, and one end of the liquid inlet pipeline 7 is connected to the bottom of the second tank body 2, and the other end extends to the bottom of the plating liquid tank 5. The entire circulation loop is not in direct contact with the air, which can effectively ensure that the effective components in the circulating plating liquid are oxidized. In this circulation loop, the plating liquid in the plating liquid tank 5 flows into the overflow tank 6 through the overflow port 41, and the preset plating liquid level height in the overflow tank 6 is H. 溢流槽 , the preset plating solution level H 溢流槽 The optimal height at which the least foam is generated when the plating liquid flows from the overflow port 41 into the overflow tank 6. Therefore, controlling the liquid level of the plating liquid in the overflow tank 6 can greatly reduce the generation of plating liquid foam. At the same time, the liquid level of the plating liquid in the overflow tank 6 will also affect the insulation effect of the liquid inlet pipeline 7. In order to facilitate the collection of the liquid level of the plating liquid in the overflow tank 6, a first liquid level sensor 12 is provided in the overflow tank 6. The first liquid level sensor 12 is used to collect the actual liquid level H1 of the plating liquid in the overflow tank 6. The first liquid level sensor 12 is communicatively connected to the PLC controller 3. It can be connected by wire or wirelessly. There is no specific limitation. When H1<H 溢流槽 When the plating liquid is turned off, the PLC controller 3 controls the second control switch 10 to close or reduce the flow of the plating liquid in the first pipeline 91. The PLC controller 3 can also control the first control switch 8 on the liquid inlet pipeline 7 to increase the amount of plating liquid flowing into the plating liquid tank 5, thereby increasing the amount of plating liquid flowing into the overflow tank 6, thereby raising the liquid level of the plating liquid in the overflow tank 6.

[0029] In order to ensure the height of the plating solution in the second tank body 2, so as to avoid the plating solution level being too low, resulting in the reflux tube 93 being exposed to the air and in contact with the air, or when the reflux tube 93 is exposed a distance above the plating solution level, the height difference will also cause foam to be generated. Therefore, it is necessary to control the plating solution level in the second tank body 2. A second liquid level sensor 13 is provided in the second tank body 2. The second liquid level sensor 13 is used to collect the liquid level H2 in the second tank body 2. The second liquid level sensor 13 is connected to the PLC controller 3 for communication. The second tank body 2 has a preset liquid level H 第二槽体 , so that H2<H 第二槽体 When the plating liquid is turned on, the PLC controller 3 controls the second control switch 10 and the third control switch 11 to increase the plating liquid flow in the reflux pipeline 9, or the PLC controller 3 controls the first control switch 8 to reduce the plating liquid flow in the liquid inlet pipeline 7 and reduce the outflow of the plating liquid in the second tank body 2.

[0030] The plating solution types generally include nickel-phosphorus solution, nickel-copper-nickel solution, nickel-copper-nickel-nickel solution, copper-nickel-phosphorus solution and zinc plating solution. 溢流槽 For example, when the nickel-phosphorus solution flows downward, it is very easy to generate foam. In this specific embodiment, the height of the overflow port 41 from the bottom of the overflow tank 6 is H. 溢流口 ; △H=H 溢流口 -H 溢流槽 ; Among them, △H is the preset height difference between the preset plating solution level in the overflow tank and the overflow port, H 溢流槽 Preset the plating solution level in the overflow tank 6; When the plating solution is a nickel-phosphorus solution, ΔH = 2-5 cm; When the plating solution is a zinc plating solution, ΔH = 10-15 cm; When the plating solution is other solutions, △H = 15-20cm.

[0031] Focus on combination Figure 3As shown, the portion of the liquid inlet pipeline 7 located in the plating tank 5 is the first liquid inlet section 71. The plating tank 5 is a square structure. The plating tank 5 includes a first side wall 51 arranged opposite to the partition 4 and two second side walls 52 arranged opposite to each other. The first liquid inlet section 71 extends along a first horizontal direction, extending from one side of the partition 4 to the first side wall 51. The first liquid inlet section 71 is provided with a plurality of second liquid inlet sections 72 arranged in an array along the first horizontal direction. The first liquid inlet section 71 and the second liquid inlet section 72 are connected. The second liquid inlet section 72 extends along a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction, so that the first liquid inlet section 71 and the second liquid inlet section 72 are arranged in a first horizontal direction. The two liquid inlet sections 72 are arranged on the bottom wall of the entire plating tank 5. Specifically, there are two first liquid inlet sections 71, and the two first liquid inlet sections 71 are arranged in parallel and spaced apart. Each first liquid inlet section 71 is correspondingly provided with a plurality of second liquid inlet sections 72. A plurality of liquid outlet holes 73 are formed on the side walls of the first liquid inlet section 71 and the second liquid inlet section 72. The liquid outlet holes 73 are vertically upward or inclined upward, so that the plating liquid in the liquid inlet pipeline 7 flows evenly into various places in the plating tank 5 and is evenly mixed with the plating liquid in the plating tank 5, so as to avoid uneven mixing of the plating liquid, resulting in different components of the plating liquid in various places, thereby affecting the electroplating effect.

[0032] In this specific embodiment, in order to ensure the quality of the plating solution, a detection device and a replenishing device are also provided in the plating solution tank 5. The detection device is used to detect the pH value of the plating solution in the plating solution tank 5, and the replenishing device is used to replenish the plating solution into the plating solution tank 5 to ensure the electroplating effect.

[0033] The present invention also provides a method for applying the electroplating liquid level control device with defoaming function, focusing on Figure 4 As shown, the first liquid level sensor 12 feeds back the collected H1 to the PLC controller 3; the second liquid level sensor 13 feeds back the collected H2 to the PLC controller 3; △H1=H 溢流口 -H1; Wherein: △H1 is the actual height difference between the actual plating solution level in the overflow tank 6 and the overflow port 41; The preset height difference △H includes the maximum value △H max and minimum value △H min ; Among them, △H max It is expressed as the overflow port 41 height H 溢流口 The preset liquid level H in the overflow tank 6 溢流槽 The maximum limit of the preset height difference between the two. When the actual height difference △H1>△H max When , it means that the actual liquid level of the plating solution in the overflow tank 6 is lower than the preset liquid level H 溢流槽 The minimum limit of Among them, △H min It is expressed as the overflow port 41 height H 溢流口The overflow tank 6 has a preset liquid level height H 溢流槽 The minimum limit of the preset height difference between the two. When the actual height difference △H1<△H min When , it means that the actual liquid level of the plating solution in the overflow tank 6 is higher than the preset liquid level H 溢流槽 The maximum limit of When △H1>△H max When the plating liquid in the first pipeline 91 is turned off or reduced, the PLC controller 3 controls the second control switch 10 to close or reduce the plating liquid flow in the first pipeline 91, thereby reducing the outflow of the plating liquid in the overflow tank 6. Of course, the PLC controller 3 can also control the first control switch 8 to increase the amount of plating liquid flowing into the plating liquid tank 5, thereby increasing the amount of plating liquid flowing into the overflow tank 6 and raising the plating liquid level in the overflow tank 6. When △H1<△H min When the PLC controller 3 controls the second control switch 10, the flow rate of the plating solution in the first pipeline 91 is turned on or increased, thereby increasing the outflow of the plating solution in the overflow tank 6; When H2<H 第二槽体 At the same time, the PLC controller 3 controls the first control switch 8 to close or reduce the flow rate of the plating solution in the liquid inlet pipeline 7, thereby reducing the outflow of the plating solution in the second tank body 2.

[0034] Taking nickel-phosphorus solution as an example, △H max 5cm, △H min 2cm, H 溢流口 The height is fixed, and the actual liquid level of the plating solution in the overflow tank 6 is H1, which is collected by the first liquid level sensor 12; When △H1 is 1cm, △H min 2cm, △H1<△H min , indicating that the liquid level in the overflow tank 6 is high and exceeds the preset liquid level height H in the overflow tank 6 溢流槽 The maximum limit of the plating solution needs to be lowered in the overflow tank 6. Therefore, the second control switch 10 is controlled by the PLC controller 3 to open or increase the flow rate of the plating solution in the first pipeline 91 to increase the outflow of the plating solution in the overflow tank 6. When △H1 is 6cm, △H max is 5cm, △H1>△H max , indicating that the liquid level in the overflow tank 6 is low and is lower than the preset liquid level height H in the overflow tank 6 溢流槽To meet the minimum limit of the flow rate, it is necessary to increase the liquid level of the plating solution in the overflow tank 6. The PLC controller 3 controls the second control switch 10 to close or reduce the flow rate of the plating solution in the first pipeline 91, thereby reducing the outflow of the plating solution in the overflow tank 6. At the same time, the amount of plating solution flowing into the overflow tank 6 can also be increased. Specifically, the PLC controller 3 can control the fourth control switch 15 to increase the flow rate of the plating solution in the second liquid inlet pipe 75, thereby increasing the amount of plating solution flowing into the plating tank 5. In this way, the amount of plating solution flowing into the overflow tank 6 from the plating tank 5 through the overflow port 41 increases accordingly, thereby increasing the liquid level of the plating solution in the overflow tank 6.

[0035] The above description is only a preferred embodiment of the present invention and is not a limitation on the design of this case. Any equivalent changes made based on the design key of this case shall fall within the protection scope of this case.

Claims

1. An electroplating liquid level control device with defoaming function, characterized in that: It comprises a first tank body (1), a second tank body (2) and a PLC controller (3), wherein the first tank body (1) and the second tank body (2) are used to contain plating solution; A partition (4) is formed in the first tank body (1), and the partition (4) divides the first tank body (1) into two areas, a plating tank (5) and an overflow tank (6). The plating tank (5) is used to electroplate the product to be electroplated. An overflow port (41) is formed transversely through the partition (4), so that the plating solution can flow from the plating tank (5) into the overflow tank (6) through the overflow port (41). A reflux pipeline (9) is provided between the overflow tank (6) and the second tank body (2) for conveying the plating solution from the overflow tank (6) to the second tank body (2). A liquid inlet pipeline (7) is provided between the second tank body (2) and the plating tank (5) for conveying the plating solution from the second tank body (2) to the plating tank (5), so that the plating solution forms a circulation loop; A first control switch (8) is provided on the liquid inlet pipeline (7), and the first control switch (8) is used to control the flow rate of the plating solution in the liquid inlet pipeline (7); The reflux pipeline (9) comprises a first pipeline (91) and a second pipeline (92), the first pipeline (91) and the second pipeline (92) are connected to each other, one end of the first pipeline (91) facing away from the second pipeline (92) is connected to the overflow tank (6), the second pipeline (92) is composed of a plurality of groups of reflux tubes (93), the plating liquid in the first pipeline (91) is evenly distributed to the plurality of groups of reflux tubes (93), one end of the reflux tubes (93) facing away from the first pipeline (91) extends to the bottom side of the second tank body (2), the first pipeline (91) is provided with a second control switch (10), the second control switch (10) is used to control the flow rate of the plating liquid in the first pipeline (91), each group of reflux tubes (93) is provided with a third control switch (11), the third control switch (11) is used to control the flow rate of the plating liquid in each group of reflux tubes (93); The first control switch (8), the second control switch (10) and the third control switch (11) are respectively electrically connected to a PLC controller (3), and the PLC controller (3) is used to control each switch to be turned on or off.

2. The electroplating liquid level control device with defoaming function according to claim 1 is characterized in that: One end of the liquid inlet pipeline (7) is connected to the second tank body (2), and the other end extends into the overflow tank (6). It extends a distance below the plating liquid in the overflow tank (6) and then passes through the partition (4) into the plating liquid tank (5).

3. The electroplating liquid level control device with defoaming function according to claim 1 is characterized in that: The first tank body (1) is located above the second tank body (2); the return pipeline (9) transports the plating liquid in the overflow tank (6) downward to the second tank body (2); a filter (14) is also provided on the liquid inlet pipeline (7); the filter (14) is used to filter the plating liquid in the liquid inlet pipeline (7); a power pump is provided in the filter (14) so ​​as to pump the filtered plating liquid into the plating liquid tank (5) when the filter (14) is in operation.

4. The electroplating liquid level control device with defoaming function according to claim 1, characterized in that: The overflow tank (6) is provided with a first liquid level sensor (12), the first liquid level sensor (12) being used to collect the liquid level height H1 of the plating solution in the overflow tank (6), the first liquid level sensor (12) being communicatively connected to the PLC controller (3), and the overflow tank (6) having a preset liquid level height H 溢流槽 , so that H1<H 溢流槽 When the PLC controller (3) controls the second control switch (10) to close or reduce the flow rate of the intermediate plating solution in the first pipeline (91).

5. The electroplating liquid level control device with defoaming function according to claim 4 is characterized in that: A second liquid level sensor (13) is provided in the second tank body (2). The second liquid level sensor (13) is used to collect a liquid level height H2 in the second tank body (2). The second liquid level sensor (13) is communicatively connected to the PLC controller (3). The second tank body (2) has a preset liquid level height H2. 第二槽体 , so that H2<H 第二槽体 When the PLC controller (3) controls the second control switch (10) and the third control switch (11) to increase the flow rate of the plating solution in the return pipeline (9), or the PLC controller (3) controls the first control switch (8) to reduce the flow rate of the plating solution in the liquid inlet pipeline (7).

6. The electroplating liquid level control device with defoaming function according to claim 4, characterized in that: The height of the overflow port (41) from the bottom of the overflow tank (6) is H 溢流口 ; △H=H 溢流口 -H 溢流槽 ; Wherein, ΔH is a preset height difference between a preset plating solution surface in the overflow tank (6) and the overflow port (41), H 溢流槽 Presetting the liquid level height of the plating liquid in the overflow tank (6); When the plating solution is a nickel-phosphorus plating solution, ΔH = 2-5 cm; When the plating solution is a zinc plating solution, ΔH = 10-15 cm; When the plating solution is other solutions, △H = 15-20cm.

7. The electroplating liquid level control device with defoaming function according to claim 3 is characterized in that: The first pipeline (91) has a meandering structure, which can effectively slow down the flow speed of the plating solution in the first pipeline (91).

8. The electroplating liquid level control device with defoaming function according to claim 3 is characterized in that: The liquid inlet pipeline (7) comprises a first liquid inlet pipe (74) and a second liquid inlet pipe (75); two ends of the first liquid inlet pipe (74) are respectively connected to the bottom of the second tank body (2) and the filter (14); two ends of the second liquid inlet pipe (75) are respectively connected to the filter (14) and the plating liquid tank (5); a first control switch (8) is arranged on the first liquid inlet pipe (74) and is used to control the flow rate of the plating liquid in the first liquid inlet pipe (74); a fourth control switch (15) is arranged on the second liquid inlet pipe (75); the fourth control switch (15) is communicatively connected to the PLC controller (3) and is used to control the flow rate of the plating liquid in the second liquid inlet pipe (75).

9. The electroplating liquid level control device with defoaming function according to claim 1, characterized in that: The portion of the liquid inlet pipeline (7) located in the plating liquid tank (5) is a first liquid inlet section (71). The plating liquid tank (5) is of a square structure. The plating liquid tank (5) comprises a first side wall (51) arranged opposite to the partition plate (4) and two second side walls (52) arranged opposite to each other. The first liquid inlet section (71) extends along a first horizontal direction, extending from one side of the partition plate (4) to the first side wall (51). The first liquid inlet section (71) has a plurality of second liquid inlet sections (72) arranged in an array along the first horizontal direction. The first liquid inlet section (71) and the second liquid inlet section (72) are connected. The second liquid inlet section (72) extends along a second horizontal direction. The first horizontal direction is perpendicular to the second horizontal direction. The first liquid inlet section (71) and the second liquid inlet section (72) are arranged on the bottom wall of the entire plating liquid tank (5). A plurality of liquid outlet holes (73) are formed on the side wall of the first liquid inlet section (71) and the side wall of the second liquid inlet section (72). The liquid outlet hole (73) is vertically upward or inclined upward.

10. A method for applying the electroplating liquid level control device with defoaming function as claimed in claim 6, characterized in that: The first liquid level sensor (12) feeds back the collected H1 to the PLC controller (3); the second liquid level sensor (13) feeds back the collected H2 to the PLC controller (3); △H1=H 溢流口 -H1; Wherein: △H1 is the actual height difference between the plating solution surface in the overflow tank (6) and the overflow port (41); The preset height difference △H includes the maximum value △H max and minimum value △H min ; Among them, △H max Expressed as the overflow port (41) height H 溢流口 The preset liquid level H in the overflow tank (6) 溢流槽 The maximum limit of the preset height difference between the two. When the actual height difference △H1>△H max When , it indicates that the actual plating solution level H1 in the overflow tank (6) is lower than the preset level H 溢流槽 The minimum limit of Among them, △H min Expressed as the overflow port (41) height H 溢流口 The preset liquid level H in the overflow tank (6) 溢流槽 The minimum limit of the preset height difference between the two. When the actual height difference △H1<△H min When , it indicates that the actual plating solution level H1 in the overflow tank (6) is higher than the preset level H 溢流槽 The maximum limit of When △H1>△H max When the PLC controller (3) controls the second control switch (10) to close or reduce the flow rate of the plating solution in the first pipeline (91), thereby reducing the outflow of the plating solution in the overflow tank (6); When △H1<△H min When the PLC controller (3) controls the second control switch (10) to open or increase the flow rate of the plating solution in the first pipeline (91) to increase the outflow of the plating solution in the overflow tank (6); When H2<H 第二槽体 When the flow rate of the plating solution in the return pipe (9) is increased, the PLC controller (3) controls the third control switch (11) to open or increase the flow rate of the plating solution in the return pipe (9), thereby increasing the amount of plating solution flowing into the second tank body (2); at the same time, the PLC controller (3) controls the first control switch (8) to close or decrease the flow rate of the plating solution in the liquid inlet pipe (7), thereby reducing the outflow of the plating solution in the second tank body (2).

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