Immersion cooling heat exchange device and immersion cooling heat exchange system

Abstract

The invention discloses an immersion cooling heat exchange device which comprises an immersion cavity used for storing cooling fluid and provided with an inlet and an outlet; the accelerating pump is arranged in the immersion cavity and used for accelerating flowing of cooling fluid in a local area of the immersion cavity, so that a pressurized heat exchange area and a normal heat exchange area are formed in the immersion cavity, and the pressurized heat exchange area and the normal heat exchange area are formed in the immersion cavity. And the liquid inlet side flow speed of the pressurized heat exchange area is higher than that of the normal heat exchange area. Through the arrangement of the acceleration pump, the flowing resistance of the cooling fluid at the high heating part can be overcome, namely, the flowing speed of the cooling fluid in the local area is changed, the high heating part is arranged in the local area, and normally, the heat exchange efficiency is increased due to fluid acceleration; therefore, the problem that the temperature of the local area of the to-be-cooled equipment is too high can be effectively solved. The invention further discloses an immersion cooling heat exchange system comprising the immersion cooling heat exchange device.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment heat dissipation, and more specifically, to an immersion cooling heat exchange device, and also to an immersion cooling heat exchange system comprising the immersion cooling heat exchange device. Background Art

[0002] Compared with traditional air cooling technology, immersion cooling mainly improves the heat dissipation capacity of the system by improving the convective heat transfer coefficient between the fluid and the heat transfer surface. However, in electronic equipment such as servers, high-power devices and low-power devices have different heat dissipation effects in the immersion area due to inconsistent heat generation power, which may cause the temperature in some local areas to be too high.

[0003] In the process of realizing the invention, the inventors found that there are at least the following problems in the prior art: the temperature of a local area of ​​the device to be cooled is too high. Summary of the invention

[0004] In view of this, the first object of the present invention is to provide an immersion cooling heat exchange device, which can effectively solve the problem of excessive temperature in local areas of the heat dissipation equipment. The second object of the present invention is to provide an immersion cooling heat exchange system including an immersion cooling heat exchange device.

[0005] In order to achieve the above first object, the present invention provides the following technical solutions:

[0006] An immersion cooling heat exchange device, comprising:

[0007] An immersion chamber, used for storing cooling fluid and having an inlet and an outlet;

[0008] An acceleration pump is arranged in the immersion chamber to accelerate the flow of cooling fluid in a local area of ​​the immersion chamber, so that a pressurized heat exchange area and a normal heat exchange area are formed in the immersion chamber, and the flow rate on the liquid inlet side of the pressurized heat exchange area is higher than the flow rate on the liquid inlet side of the normal heat exchange area.

[0009] In the above-mentioned immersion cooling heat exchange device, when in use, the immersion chamber is filled with cooling fluid, the filling degree is set according to the needs, and at least the heat-generating part of the equipment to be cooled is immersed in the cooling fluid, and the high-heat-generating part is set corresponding to the pressurized heat exchange area of ​​the acceleration pump, and the low-heat-generating part is located in the normal heat exchange area. In the above-mentioned immersion cooling heat exchange device, the flow resistance of the cooling fluid at the high-heat-generating part can be overcome by setting the acceleration pump, that is, the flow rate of the cooling fluid in the local area is changed, and the high-heat-generating part is set in this local area. Due to the acceleration of the fluid, normally, the heat exchange efficiency will increase, so that the temperature of the high-heat-generating part can be closer to the low-heat-generating part, effectively avoiding the problem of excessive temperature of the high-heat-generating part. Moreover, it only accelerates the flow rate of the local cooling fluid, which makes the operation simple and convenient, and the cost is low. In summary, the immersion cooling heat exchange device can effectively solve the problem of excessive temperature in the local area of ​​the equipment to be cooled.

[0010] In some technical schemes, a drainage device is further included in the immersion chamber, the drainage device includes a heat dissipation chamber and a drainage channel, the heat dissipation chamber is used to dissipate heat from a high-heating part of the heat dissipation device, one end of the drainage channel is connected to the heat dissipation chamber, and the other end is connected to the outlet of the acceleration pump, and the inlet of the acceleration pump corresponds to the cavity in the immersion chamber located outside the drainage device.

[0011] In some technical solutions, at least two entrances and exits are provided, one of the two entrances and exits is an inlet and the other is an outlet.

[0012] In some technical solutions, it also includes a flow equalizing plate extending along the inlet direction, the flow equalizing plate is used to separate the immersion chamber into a guide chamber and a working chamber, and the acceleration pump and the drainage device are both arranged in the working chamber.

[0013] In some technical solutions, the drainage channels of the plurality of drainage devices are all connected to a main channel, and the main channel is connected to the acceleration pump; along the inlet direction of the inlet, the acceleration pump is provided on a side of the immersion chamber away from the inlet.

[0014] In some technical solutions, each of the plurality of drainage devices is provided with an acceleration pump; and the inlet of each acceleration pump is aligned with the liquid outlet corresponding to the flow balancing plate.

[0015] In some technical solutions, a circulation pump is further included, and the outlet and / or the inlet are connected to the circulation pump.

[0016] In some technical solutions, a heat exchanger is provided between the inlet and the outlet.

[0017] In some technical solutions, the outlet is located at the upper part of the immersion chamber and is an overflow port, and the inlet is located at the lower part of the immersion chamber and extends in a horizontal direction.

[0018] In order to achieve the above second purpose, the present invention also provides an immersion cooling heat exchange system, which includes any of the above immersion cooling heat exchange devices, and also includes a device to be cooled, the device to be cooled includes a high-heating part and a low-heating part, and when the device to be cooled is in working state, the heating power of the low-heating part is lower than the heating power of the high-heating part; the immersion cooling heat exchange device is used to accelerate the flow of cooling fluid at the high-heating part. Since the above immersion cooling heat exchange device has the above technical effects, the immersion cooling heat exchange system having the immersion cooling heat exchange device should also have corresponding technical effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 A schematic structural diagram of an immersion cooling heat exchange device provided by an embodiment of the present invention;

[0021] Figure 2 A schematic structural diagram of another immersion cooling heat exchange device provided in an embodiment of the present invention.

[0022] The following are marked in the accompanying drawings:

[0023] Immersion chamber 1, acceleration pump 2, circulation pump 3, heat exchanger 4, external pipeline 5, drainage device 6, equipment to be cooled 7, inlet 8, outlet 9;

[0024] Flow balancing plate 11, working chamber 12, flow guide chamber 13, normal heat exchange area 14, pressurized heat exchange area 15, liquid outlet 111;

[0025] Heat dissipation cavity 61, drainage channel 62, main channel 63;

[0026] The high heat generating portion 71 and the low heat generating portion 72 . DETAILED DESCRIPTION

[0027] The embodiment of the present invention discloses an immersion cooling heat exchange device, which can effectively solve the problem of excessively high temperature in a local area of ​​a device to be cooled.

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 2 , Figure 1 A schematic structural diagram of an immersion cooling heat exchange device provided by an embodiment of the present invention; Figure 2 A schematic structural diagram of another immersion cooling heat exchange device provided in an embodiment of the present invention.

[0030] In some embodiments, an immersion cooling heat exchange device is provided, which may specifically be a single-phase immersion liquid cooling device, mainly including an immersion chamber 1 and an acceleration pump 2 .

[0031] The immersion chamber 1, when in use, stores cooling fluid, and the device 7 to be cooled can be fully or half-fully placed in the immersion chamber 1. Full placement means that the device 7 to be cooled is completely immersed in the cooling fluid in the immersion chamber 1; half placement means that part of the device 7 to be cooled (especially the heat generating part) is immersed in the cooling fluid in the immersion chamber 1. The heat generating part of the device 7 to be cooled is immersed in the cooling fluid in the immersion chamber 1, that is, surrounded by the cooling fluid, so that the heat generating part is fully in contact with the cooling fluid to efficiently exchange heat with each other.

[0032] When using, when considering the specific type of cooling fluid, liquid is generally used, of course, gas or flowable solid, or solid-liquid mixed fluid can also be used. When using liquid, high heat transfer liquid is generally used, generally an aqueous solution or a water mixture, that is, liquid water (which can be pure water) is melted into some substances to form an aqueous solution or a water mixture. Specifically, the specific material of the cooling fluid used for immersion heat exchange can also refer to the existing technology.

[0033] The shape of the immersion chamber 1 is not limited, and is generally set according to the number and type of the devices 7 to be cooled that need to be placed inside. At the same time, it is also necessary to consider the smoothness of the flow of the internal cooling fluid and the gap requirements between the devices 7 to be cooled. In a simpler way, the immersion chamber 1 can be roughly rectangular in outline, and then multiple mounting positions are evenly arranged inside to respectively mount each device 7 to be cooled. The multiple mounting positions are distributed in an array, such as a simple straight-line distribution, that is, distributed along a straight line, and can be distributed in sequence along the narrower direction of the devices 7 to be cooled.

[0034] The immersion chamber 1 has an inlet and outlet for replacing the cooling fluid inside. There are two main forms of the inlet and outlet settings: one is to have only one inlet and outlet, and to alternately introduce and export the cooling fluid, and the air pressure is balanced by the external air pressure; the other is to have at least two inlets and outlets, one as an inlet 8 and the other as an outlet 9, the inlet 8 is used to introduce the cooling fluid, and the outlet 9 is used to export the cooling fluid, and the cooling fluid can be continuously or periodically introduced and exported at the same time. Through the setting of the inlet and outlet, the cooling fluid inside the immersion chamber 1 can be replaced, so that the inside of the immersion chamber 1 always maintains a relatively low temperature.

[0035] The acceleration pump 2 is arranged in the immersion chamber 1 to accelerate the flow of the cooling fluid in a part of the immersion chamber 1. The acceleration pump 2 can also be called an acceleration device. As for the specific structure of the acceleration pump 2, as long as it can actively accelerate the flow of the cooling fluid in a part of the immersion chamber 1, it is not limited to the method of driving by an impeller, but can also be blowing, pulling, etc. The accelerated flow of the cooling fluid in a part of the immersion chamber 1 means that, on the one hand, it can be understood that the flow speed of the cooling fluid in this part of the immersion chamber 1 is accelerated, and the flow speed of the cooling fluid in another part of the immersion chamber 1 is not accelerated; on the other hand, it can also be understood that the flow speed of the cooling fluid in this part of the immersion chamber 1 is faster than the flow speed of the cooling fluid in another part of the immersion chamber 1; by accelerating the flow speed of this part of the fluid, the heat exchange efficiency of the corresponding area is improved.

[0036] To be more specific, due to the action of the acceleration pump 2, the cooling fluid in one area of ​​the immersion chamber 1 has a faster flow rate than the cooling fluid in another area; the above two areas can be appropriately separated by a barrier, but they should still be in an interconnected state, and of course they can also be not separated. In the state without the above separation, the outlet of the acceleration pump 2 can be directed toward the corresponding area to increase the flow rate of the fluid in the corresponding area. For the convenience of explanation, the area where the acceleration pump 2 accelerates is called the pressurized heat exchange area 15, and the area where the acceleration pump 2 does not accelerate but performs heat exchange is called the normal heat exchange area 14. Of course, in the immersion chamber, other areas may be formed in addition to the pressurized heat exchange area 15 and the normal heat exchange area 14, or other areas may not be formed. Of course, the acceleration of the acceleration pump 2 will also cause: when the acceleration pump 2 is accelerating, the flow rate of the normal heat exchange area 14 increases compared to when the acceleration pump 2 is not accelerating.

[0037] When in use, some high-heating parts 71 with higher heat generating power in the device to be cooled 7 are arranged in the pressurized heat exchange area 15, while some low-heating parts 72 with lower heat generating power in the device to be cooled 7 are arranged in the normal heat exchange area 14. The heat generating power of the low-heating parts 72 is lower than the heat generating power of the high-heating parts 71. In practical applications, the setting of the acceleration pump 2 should be set in accordance with the positional relationship of the high-heating parts 71 of the device to be cooled 7 in the entire device to be cooled 7.

[0038] In the above-mentioned immersion cooling heat exchange device, when in use, the immersion chamber 1 is filled with cooling fluid, the filling degree is set as needed, and at least the heat-generating part of the device 7 to be cooled is immersed in the cooling fluid, and the high-heating part 71 is set corresponding to the pressurized heat exchange area 15 of the acceleration pump 2, and the low-heating part 72 is located in the normal heat exchange area 14. In the above-mentioned immersion cooling heat exchange device, by setting the acceleration pump 2, the flow resistance of the cooling fluid at the high-heating part 71 can be overcome, that is, the flow rate of the cooling fluid in the local area is changed, and the high-heating part 71 is set in this local area. Due to the acceleration of the fluid, the heat exchange efficiency will increase normally, so that the temperature of the high-heating part 71 can be closer to the low-heating part 72, effectively avoiding the problem of the high temperature of the high-heating part 71. And only the flow rate of the local cooling fluid is accelerated, so that the operation is simple and convenient, and the cost is low. In summary, the immersion cooling heat exchange device can effectively solve the problem of excessive temperature in the local area of ​​the device 7 to be cooled.

[0039] In some embodiments, considering that the high-heating part 71 is generally located at the center of the entire device 7 to be cooled, the cooling fluid generally cannot effectively directly contact the high-heating part 71. Based on this, it is preferred here that a drainage device 6 is provided in the immersion cooling heat exchange device, and the drainage device 6 is provided in the immersion chamber 1, so that the immersion chamber 1 is divided into an internal area of ​​the drainage device 6 and an external area of ​​the drainage device 6. The drainage device 6 mainly includes a heat dissipation chamber 61 and a drainage channel 62. The heat dissipation chamber 61 is used to dissipate the high-heating part 71 of the device 7 to be cooled, and the external area of ​​the drainage device 6 can be used to dissipate the low-heating part 72 of the device to be cooled.

[0040] One end of the drainage channel 62 is connected to the heat dissipation cavity 61, and the other end is connected to the outlet of the acceleration pump 2, and the inlet of the acceleration pump 2 corresponds to the cavity portion located outside the drainage device 6 in the immersion cavity 1. That is, the inlet of the acceleration pump 2 corresponds to the outer area of ​​the drainage device 6, and the outlet of the acceleration pump 2 corresponds to the inner area of ​​the drainage device 6, so that the cooling fluid in the outer area of ​​the drainage device 6 is supplied to the inner area of ​​the drainage device 6, that is, the heat dissipation cavity 61, in an accelerated manner.

[0041] The heat dissipation cavity 61 area is the main area of ​​the pressurized heat exchange area 15, that is, it corresponds to the high heat generation part 71. Therefore, the size and shape of the heat dissipation cavity 61 are preferably set corresponding to the high heat generation part 71, such as being set close to the high heat generation part 71 or surrounding the high heat generation part 71. The setting surrounding the high heat generation part 71 is generally a semi-enclosed setting.

[0042] The drainage channel 62 is mainly used to introduce the fluid in the lower temperature area of ​​the outer area of ​​the drainage device 6 into the heat dissipation cavity 61. The outer area of ​​the drainage device 6 is generally divided into a heat dissipation area, a liquid inlet area and a liquid outlet area. The heat dissipation area is set corresponding to the device 7 to be cooled, especially corresponding to the low-heat device in the area to be cooled. The liquid inlet area and the liquid outlet area are respectively located at the two ends of the heat dissipation area, the liquid inlet area corresponds to the liquid inlet, and the liquid outlet area corresponds to the liquid outlet. Then the drainage channel 62 can drain the cooling fluid in the liquid inlet area to the heat dissipation cavity 61, and the outlet of the heat dissipation cavity 61 can correspond to the heat dissipation area, the liquid outlet area, or even the liquid inlet area.

[0043] In some embodiments, generally, two inlets and outlets are provided, one of which is the outlet 9 and the other is the inlet 8. Preferably, the outlet 9 and the inlet 8 are arranged in parallel, which is consistent with the inlet and outlet direction of the heat dissipation cavity 61. For example, if the outlet 9 is on the top and the inlet 8 is on the bottom, then the inlet of the heat dissipation cavity 61 is on the bottom side and the outlet of the heat dissipation cavity 61 is on the top side.

[0044] In some embodiments, a flow equalizing plate 11 extending along the inlet direction of the inlet 8 is further included, and the flow equalizing plate 11 is used to divide the immersion chamber 1 into a flow guide chamber 13 and a working chamber 12, wherein the acceleration pump 2 and the flow guide device 6 are both arranged in the working chamber 12, and the corresponding heat dissipation area also belongs to the working chamber 12. When heat is dissipated for multiple devices 7 to be cooled, multiple heat dissipation stations are arranged corresponding to the heat dissipation area, and each heat dissipation station is arranged one-to-one with each device 7 to be cooled.

[0045] The flow balancing plate 11 is provided with a plurality of liquid outlet holes 111 , and preferably each liquid outlet hole 111 is provided in one-to-one correspondence with each device 7 to be cooled, that is, the liquid outlet holes 111 and the cooling stations are provided in one-to-one correspondence.

[0046] The equalizing plate 11 mainly plays the role of drainage, so that the fluid introduced from the inlet 8 is dispersed as evenly as possible to each heat dissipation station. The equalizing plate 11 mainly distributes the liquid through the liquid outlet 111. Moreover, the extension direction of the equalizing plate 11 is consistent with the introduction direction of the inlet 8, so as to avoid the equalizing plate 11 from interfering with the fluid introduced from the inlet 8, so as to achieve a good drainage effect.

[0047] In some embodiments, when multiple heat dissipation stations are provided, multiple heat dissipation cavities 61 need to be provided accordingly, and multiple drainage devices 6 may be provided accordingly. It should be noted that, for any heat dissipation station, one or more heat dissipation cavities 61 may be provided, or no heat dissipation cavity 61 may be provided, but at least one heat dissipation station is provided with at least one heat dissipation cavity 61, that is, at least one drainage device 6 is provided.

[0048] In some embodiments, when a plurality of drainage devices 6 are provided, a plurality of acceleration pumps 2 may be provided correspondingly, and the inlet of each acceleration pump 2 is provided correspondingly to the corresponding liquid outlet 111 .

[0049] For example, each heat dissipation station is provided with an acceleration pump 2, and the flow equalizing plate 11 is provided with liquid outlets 111 corresponding to each heat dissipation station. The inlet of the acceleration pump 2 faces the liquid outlet 111, and part of the fluid flowing out of the liquid outlet 111 is drawn away by the corresponding acceleration pump 2, and the other part flows to the heat dissipation station and to the cavity of the heat dissipation station located outside the drainage device 6. The extension direction of the drainage channel 62 is consistent with the extension direction of the liquid outlet 111, and they are arranged in parallel.

[0050] In some embodiments, when multiple drainage devices 6 are provided, the drainage channels 62 of the multiple drainage devices 6 can be connected to the main channel 63, and the main channel 63 is connected to the acceleration pump 2, so that one acceleration pump 2 can accelerate the supply of cooling fluid to multiple drainage devices 6 at the same time.

[0051] The main channel 63 is preferably arranged to extend along the introduction direction of the introduction port 8, and the flow direction of the fluid in the main channel 63 is preferably opposite to the introduction direction of the introduction port 8. At this time, the acceleration pump 2 is located at the end of the main channel 63 away from the introduction port 8. At this time, the acceleration pump 2 mainly introduces the fluid on the side of the immersion chamber 1 away from the introduction port 8 into the main channel 63. The side of the immersion chamber 1 away from the introduction port 8 refers to the side in the introduction direction of the introduction port 8. Through the above arrangement, it is beneficial for the fluid at the flow equalizing plate 11 to move in the direction away from the introduction port 8, so that the fluid dispersion effect is better.

[0052] In some embodiments, in order to make the internal fluid flow in an orderly manner, a circulation pump 3 is generally provided, that is, a circulation pump 3 is connected upstream of the inlet 8 to accelerate the inflow of the cooling fluid, and / or a circulation pump 3 is connected downstream of the outlet 9 to accelerate the outflow of the cooling fluid. That is, a circulation pump 3 is connected upstream of the inlet 8 or another circulation pump 3 is connected downstream of the outlet 9; or, a circulation pump 3 is connected upstream of the inlet 8 and another circulation pump 3 is connected downstream of the outlet 9.

[0053] In some embodiments, a heat exchanger 4 is generally provided between the inlet 8 and the outlet 9 so that the cooling fluid circulates. That is, the cooling fluid flows out of the outlet 9 and enters the heat exchanger 4, dissipates heat in the heat exchanger 4, and then flows into the inlet 8 to enter the immersion chamber 1, absorbs heat from the device to be cooled 7, and then is discharged from the outlet 9, thus forming a circulating flow. The cooling fluid flows in the immersion chamber 1 due to the action of the circulation pump 3, but the acceleration pump 2 further accelerates the movement on this basis. Generally speaking, the circulation pump 3 can be set between the heat exchanger 4 and the inlet 8 at this time.

[0054] In some embodiments, the outlet 9 can be located at the upper part of the immersion chamber 1 and is an overflow port, while the inlet 8 can be located at the lower part of the immersion chamber 1 and extends in the horizontal direction. The outlet 9 is at the top and the inlet 8 is at the bottom, which is conducive to the rise of the heated cooling fluid. Correspondingly, the heat dissipation chamber 61, the drainage channel 62, and the acceleration pump 2 can be arranged in sequence from top to bottom, and the outlet of the heat dissipation chamber 61 is arranged upward. It should be noted that the up and down here refers to the up and down in the direction of gravity.

[0055] In some embodiments, the device to be cooled 7 is mainly an electronic device, such as a server, a switch. The electronic device is provided with high-power device chips such as a CPU chip, a GPU chip, an ASIC chip, etc., and other low-power devices. The high-power device is generally a high-heating part 71; the low-power device is generally a low-heating part 72.

[0056] In some embodiments, when an acceleration pump 2 is provided to supply fluid to multiple drainage devices 6 at the same time, the flow rate provided by the acceleration pump 2 needs to be under a certain temperature difference (the certain temperature difference refers to the difference between the allowable temperature of the high heat generating part 71 and the inlet temperature of the immersion chamber 1) ΔT = T max -T in Among them, T max is the allowable temperature of the high power device, where T in is the liquid inlet temperature in the immersion chamber 1, that is, the temperature of the inlet 8, which carries away the heat from the high-power device.

[0057] According to the convective heat transfer calculation formula Q=hAΔT, where Q is the power consumption of the power device, h is the convective heat transfer coefficient, A is the contact area between the fluid and the heat transfer surface, and ΔT is the temperature difference between the heat transfer surface and the fluid. The convective heat transfer coefficient required by the heat sink of the high heat generating part 71 is determined by the convective heat transfer calculation formula.

[0058] Then the required flow rate of each high-power device heat sink is calculated by the convective heat transfer coefficient formula. The convective heat transfer coefficient is related to the flow rate of the high-power device heat sink h = a*(ρu*l / μ) b (μ*c p / λ) c(λ / l) where a, b, c are constants; ρ is the density of the cooling fluid, l is the characteristic length of the heat transfer surface, μ is the viscosity of the cooling fluid, and c p is the specific heat capacity of the cooling fluid, λ is the thermal conductivity of the cooling fluid, and u is the flow rate of the cooling fluid. The flow rate q required for each high-power device heat sink can be calculated based on the calculation formula of the convection heat transfer coefficient: 1 The flow rate that the secondary pump needs to provide is Q pump2 =n*q 1 , where n is the number of devices 7 to be cooled.

[0059] Similarly, the required flow rate q for each low-power device in the electronic device to be radiated can be calculated 2 Part of the flow provided by the circulation pump 3 is delivered to the high-power device radiator via the acceleration pump 2, and part is delivered to the low-power device. The flow rate that the circulation pump 3 needs to provide is Q pump1 =n*q 1 +n*q 2 .

[0060] The flow resistance that the acceleration pump 2 needs to overcome is partly the flow resistance in the drainage channel 62 and partly the flow resistance in the heat dissipation cavity 61 at the high-power device.

[0061] Flow resistance in drainage channel 62 Among them, ΔP ll2 is the corresponding friction resistance in the drainage channel 62; 1 is the friction coefficient of the inner wall of the drainage channel 62, L 1 is the length of the drainage channel 62, D 1 is the diameter of the drainage channel 62, u 1 is the average flow velocity of the drainage channel 62, and g is the acceleration due to gravity.

[0062] Flow resistance of heat dissipation cavity 61 at high power device Among them, ΔP sp is the corresponding friction resistance in the heat dissipation cavity 61; 2 is the friction coefficient of the inner wall of the heat dissipation cavity 61, L 2 is the length of the heat dissipation cavity 61, D 2 is the diameter of the heat dissipation cavity 61, u 2 is the average flow velocity in the heat dissipation cavity 61, and g is the acceleration due to gravity.

[0063] Then the head of the accelerator pump 2 is

[0064] Similarly, the flow resistance that the circulation pump 3 needs to overcome is partly the flow resistance in the external pipeline 5 and partly the flow resistance of the external heat exchanger 4 .

[0065] Flow resistance in external pipe 5 Among them, ΔP ll1 is the corresponding friction resistance in the external pipeline 5; 3 is the friction coefficient of the external pipe 5, L 3 is the length of the external pipe 5, D 3 is the diameter of the external pipe 5.

[0066] Flow resistance of heat exchanger 4 Among them, ΔP hx is the corresponding friction resistance in the heat exchanger 4; 4 is the friction coefficient of the inner wall of heat exchanger 4, L 4 is the length of the heat exchanger 4, D 4 is the hydraulic diameter of the heat exchanger 4.

[0067] Then the head of circulating pump 3 is

[0068] In some embodiments, when each device to be cooled 7 is provided with an acceleration pump 2, firstly according to the formula Q=mc p ΔT, determine the flow rate of the circulation pump 3. Where Q is the total heat of the electronic equipment in the immersion chamber 1, m is the mass flow rate in the circulation pump 3 and the external pipeline 5, c p is the specific heat capacity of the coolant, ΔT is the temperature difference between the inlet and outlet of the immersion chamber 1, and the temperature difference is usually set to 5 degrees Celsius.

[0069] Secondly, the average temperature in the immersion chamber 1 is determined to be (Tin (liquid inlet temperature) + Tin (liquid outlet temperature)) / 2.

[0070] According to the convective heat transfer calculation formula Q = hAΔT, where Q is the power consumption of the power device, h is the convective heat transfer coefficient, A is the contact area between the fluid and the heat transfer surface, and ΔT is the temperature difference between the heat transfer surface and the fluid. The convective heat transfer coefficient required for the high-power device heat sink is determined by the convective heat transfer calculation formula.

[0071] Then the required flow rate of each high-power device heat sink is calculated by the convective heat transfer coefficient formula. The convective heat transfer coefficient is related to the flow rate of the high-power device heat sink h = a*(ρu*l / μ) b (μ*c p / λ) c (λ / l) where a, b, c are constants; ρ is the density of the coolant, l is the specific length of the heat exchange surface, m is the viscosity of the coolant, cp is the specific heat capacity of the coolant, λ is the thermal conductivity of the coolant, and μ is the flow rate of the coolant. The flow rate q required for each high-power device heat sink can be calculated based on the calculation formula of the convection heat transfer coefficient: 1 The flow rate that the accelerator pump 2 needs to provide is Q pump2 =n*q 1, where n is the number of devices 7 to be cooled.

[0072] At this time, the flow rate of the circulation pump 3 does not need to be greater than the flow rate of the acceleration pump 2, which can avoid a large flow rate in the external pipeline 5, a large flow resistance in the external pipeline 5, and reduce the system energy consumption of the circulation pump 3.

[0073] In some embodiments, the flow rate and the speed of the acceleration pump 2 or the circulation pump 3 are adjusted according to the real-time temperature by PID negative feedback regulation. When the real-time temperature of the chip is lower than the temperature of the chip, the speed or flow rate of the acceleration pump 2 or the circulation pump 3 can be reduced. When the real-time temperature of the chip is higher than the allowable temperature of the chip, the speed and flow rate of the acceleration pump 2 or the circulation pump 3 can be increased. The speed of the circulation pump 3 is mainly based on the operating temperature of the low-power chip, while the speed of the acceleration pump 2 is mainly based on the operating temperature of the high-power chip.

[0074] Based on the immersion cooling heat exchange device provided in the above embodiment, the present invention further provides an immersion cooling heat exchange system, which includes any immersion cooling heat exchange device in the above embodiment, and also includes a device 7 to be cooled, wherein the device 7 to be cooled includes a high-heating portion 71 and a low-heating portion 72, and when the device 7 to be cooled is in working state, the heating power of the low-heating portion 72 is lower than the heating power of the high-heating portion 71, and the immersion cooling heat exchange device is used to accelerate the flow of the cooling fluid at the high-heating portion 71. Since the immersion cooling heat exchange system adopts the immersion cooling heat exchange device in the above embodiment, please refer to the above embodiment for the beneficial effects of the immersion cooling heat exchange system.

[0075] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0076] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An immersion cooling heat exchange device, It is characterized in that include: An immersion chamber, used for storing cooling fluid and having an inlet and an outlet; An acceleration pump is arranged in the immersion chamber to accelerate the flow of cooling fluid in a local area of ​​the immersion chamber, so that a pressurized heat exchange area and a normal heat exchange area are formed in the immersion chamber, and the flow rate on the liquid inlet side of the pressurized heat exchange area is higher than the flow rate on the liquid inlet side of the normal heat exchange area.

2. The immersion cooling heat exchange device according to claim 1, It is characterized in that It also includes a drainage device arranged in the immersion chamber, the drainage device includes a heat dissipation chamber and a drainage channel, the heat dissipation chamber is used to dissipate heat from a high-heating part of the heat dissipation device, one end of the drainage channel is connected to the heat dissipation chamber, and the other end is connected to the outlet of the acceleration pump, and the inlet of the acceleration pump corresponds to the cavity in the immersion chamber located outside the drainage device.

3. The immersion cooling heat exchange device according to claim 2, It is characterized in that At least two inlets and outlets are provided, one of the two inlets and outlets is an inlet and the other is an outlet.

4. The immersion cooling heat exchange device according to claim 3, It is characterized in that It also includes a flow equalizing plate extending along the inlet direction, the flow equalizing plate is used to separate the immersion chamber into a guide chamber and a working chamber, and the acceleration pump and the drainage device are both arranged in the working chamber.

5. The immersion cooling heat exchange device according to claim 4, It is characterized in that The drainage channels of the plurality of drainage devices are all connected to a main channel, and the main channel is connected to the acceleration pump; along the inlet direction of the inlet, the acceleration pump is arranged on a side of the immersion chamber away from the inlet.

6. The immersion cooling heat exchange device according to claim 4, It is characterized in that The plurality of drainage devices are respectively provided with the acceleration pumps; the inlet of each acceleration pump is respectively aligned with the liquid outlet hole corresponding to the flow balancing plate.

7. The immersion cooling heat exchange device according to any one of claims 3 to 6, It is characterized in that It also includes a circulation pump, and the outlet and / or the inlet are connected to the circulation pump.

8. The immersion cooling heat exchange device according to claim 7, It is characterized in that A heat exchanger is arranged between the inlet and the outlet.

9. The immersion cooling heat exchange device according to claim 8, It is characterized in that The outlet is located at the upper part of the immersion chamber and is an overflow port, and the inlet is located at the lower part of the immersion chamber and extends in a horizontal direction.

10. An immersion cooling heat exchange system, comprising a device to be cooled, the device to be cooled comprising a high-heating portion and a low-heating portion, and when the device to be cooled is in a working state, the heating power of the low-heating portion is lower than the heating power of the high-heating portion; It is characterized in that It comprises the immersion cooling heat exchange device as described in any one of claims 1 to 9; the immersion cooling heat exchange device is used to accelerate the flow of cooling fluid at the high heat generation part.

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