Power supply and computing device

Abstract

The embodiment of the invention provides a power supply and computing equipment. The power supply comprises a circuit board and a voltage output circuit. The voltage output circuit comprises a voltage output end and a grounding end. An end portion of the circuit board has a first connector. The first connector comprises a plugging part and a first conductive sleeve, the plugging part comprises a first sub-plugging part and a second sub-plugging part, and the first sub-plugging part and the second sub-plugging part are arranged at an interval. The surface of the first sub-plugging part is provided with a first conductive contact sheet which is electrically connected with the voltage output end. And a second conductive contact piece is arranged on the surface of the second sub-plugging part and is electrically connected with the grounding end. The first conductive sleeve is sleeved on the first sub-plugging part, and the first conductive sleeve and the second sub-plugging part are arranged at an interval. The first conductive sleeve is electrically connected with the first conductive contact piece. Therefore, the cost required for improving the current through-flow capability of the connector can be reduced.

Description

Technical Field

[0001] The present application relates to the field of server technology, and in particular to a power supply and computing equipment. Background Art

[0002] The power supply and the mainboard of the electronic device can be electrically connected through a gold finger connector and a female connector that are plugged into each other, so that current can be transmitted from the power supply to the mainboard.

[0003] In the related technology, the power supply may include a circuit board, one end of which may have a gold finger connector. The gold finger connector includes a plug-in portion of the circuit board and a conductive contact arranged on the plug-in portion. The conductive contact may also be called a gold finger. After the gold finger connector is plugged into the female connector provided on the motherboard, the conductive contact may be used to electrically contact the spring terminal of the female connector so that the power supply can supply power to the motherboard.

[0004] However, in the related art, the cost of implementing a gold finger connector with a large current carrying capacity is high. Summary of the invention

[0005] The embodiments of the present application provide a power supply and a computing device. The cost required to improve the current carrying capacity of the connector can be reduced by arranging a conductive contact for electrically connecting to a voltage output terminal in a connector of the power supply on a separate sub-plug portion, and arranging a conductive sleeve on the sub-plug portion and the conductive contact so that the conductive sleeve is electrically connected to the conductive contact.

[0006] In a first aspect of an embodiment of the present application, a power supply is provided, which includes a circuit board and a voltage output circuit. The voltage output circuit is arranged on the circuit board and electrically connected to the circuit board. The voltage output circuit includes a voltage output terminal and a ground terminal. The end of the circuit board along the first direction has a first connector. The first connector includes a first conductive sleeve and a plug-in portion of the circuit board, wherein the plug-in portion includes a first sub-plug-in portion and a second sub-plug-in portion, and the first sub-plug-in portion and the second sub-plug-in portion are arranged at intervals along the second direction. A first conductive contact is arranged on the surface of the first sub-plug-in portion, and the first conductive contact is electrically connected to the voltage output terminal. A second conductive contact is arranged on the surface of the second sub-plug-in portion, and the second conductive contact is electrically connected to the ground terminal. The first conductive sleeve is arranged on the first sub-plug-in portion and is arranged at intervals from the second sub-plug-in portion. The first conductive sleeve is electrically connected to the first conductive contact, wherein the first direction is perpendicular to the thickness direction of the circuit board, and the second direction is perpendicular to the first direction.

[0007] In the power supply provided by the embodiment of the present application, the first conductive sleeve and the first conductive contact piece form a whole that can be used to transmit current. The first conductive sleeve provided at the first conductive contact piece can increase the current flow cross-section at the first conductive contact piece, so that the current flow capacity at the first conductive contact piece is improved, and there is no need to increase the thickness of the conductive pattern on the surface of the substrate, so that the cost of the power supply is low. In addition, when the first connector is plugged with the corresponding second connector, the spring terminal of the second connector is used to abut against the surface of the first conductive sleeve sleeved outside the first sub-plug-in portion and the first conductive contact piece. The surface of the first conductive sleeve has no internal angle structure, and the abutment between the first conductive sleeve and the spring terminal is not prone to jamming. Compared with the scheme in which the spring terminal of the second connector abuts against the surface of the first conductive contact piece, it is not easy to cause problems such as large plugging force and abnormal deformation of the spring terminal of the second connector due to the spring terminal abutting against the internal angle structure formed by the end face of the first conductive contact piece and the surface of the first sub-plug-in portion, so that the first connector and the second connector are relatively easy to be plugged, and the first conductive contact piece is not prone to mistaken contact with the non-corresponding spring terminal. In addition, there is no need to enlarge the area of ​​the orthographic projection of the conductive pattern on the substrate surface, which is conducive to the arrangement of various parts of the conductive pattern on the substrate surface and the electrical isolation between them. Furthermore, the current carrying capacity at the first conductive contact piece can be adjusted by adjusting the wall thickness of the first conductive sleeve, and the adjustment is more flexible.

[0008] In a possible implementation manner, the first sub-plug-in portion and the first conductive sleeve are fixed by conductive adhesive, and the first conductive sleeve is electrically connected to the first conductive contact piece by the conductive adhesive.

[0009] In a possible implementation, the circuit board in the first conductive sleeve has a via hole penetrating the first conductive contact piece along the thickness direction, and the via hole is electrically connected to the voltage output terminal. The first conductive sleeve is fixed to the first conductive contact piece and the hole wall of the via hole by conductive glue and electrically connected.

[0010] In a possible implementation, a portion of the circuit board located in the first conductive sleeve has a plurality of via holes, and all the via holes in the first conductive sleeve are distributed in a matrix along the first direction and the second direction.

[0011] In a possible implementation, at least a portion of the via hole contains conductive glue, and the conductive glue is bonded to the inner wall of the via hole and electrically connected to the inner wall of the via hole.

[0012] In a possible implementation, a conductive spring sheet is provided on the inner wall of the first conductive sleeve, the first sub-connector is fixed to the first conductive sleeve via the conductive spring sheet, and the first conductive sleeve is electrically connected to the first conductive contact sheet via the conductive spring sheet.

[0013] In a possible implementation, the first conductive sleeve includes a first side wall, a second side wall, a third side wall, a fourth side wall and a first end wall. The first side wall and the second side wall are arranged relative to each other along the thickness direction of the circuit board, the third side wall and the fourth side wall are arranged relative to each other along the second direction, the first end wall is located at the front end of the first connector along the plug-in direction, the first side wall is adjacent to and connected to the third side wall and the fourth side wall respectively, and the second side wall is adjacent to and connected to the third side wall and the fourth side wall respectively. The first end wall is arranged at one end of the first side wall, the second side wall, the third side wall and the fourth side wall, and is connected to the first side wall, the second side wall, the third side wall and the fourth side wall respectively.

[0014] In a possible implementation, the first conductive sleeve further includes two first slopes, which are inclined surfaces or curved surfaces, wherein one first slope is connected between the first side wall and the first end wall, and the other first slope is connected between the second side wall and the first end wall.

[0015] In a possible implementation, the power supply further includes a control circuit, and the first connector further includes a second conductive sleeve. The plug-in portion further includes a third sub-plug-in portion, and the first sub-plug-in portion, the second sub-plug-in portion, and the third sub-plug-in portion are sequentially spaced along the second direction. A third conductive contact is provided on the surface of the third sub-plug-in portion, and the third conductive contact is electrically connected to the control circuit, and the third conductive contact is used to output a control signal. The second conductive sleeve is sleeved on the second sub-plug-in portion, and is spaced from the first sub-plug-in portion and the second sub-plug-in portion, respectively, and the second conductive sleeve is electrically connected to the second conductive contact.

[0016] The second aspect of the embodiment of the present application provides a computing device, which includes a power supply and a motherboard in any of the above embodiments. A second connector is provided on the motherboard, wherein the first connector and the second connector are plugged in, and the power supply is electrically connected to the motherboard through the first connector and the second connector. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a circuit board of a power supply provided in an embodiment of the present application;

[0018] Figure 2 A schematic diagram of a power supply from one perspective provided in an embodiment of the present application;

[0019] Figure 3 for Figure 2 A schematic diagram of another perspective of the power supply in FIG.

[0020] Figure 4 for Figure 2 An exploded diagram of the power supply in the

[0021] Figure 5 A schematic diagram of a first conductive sleeve of a power supply provided in an embodiment of the present application from one viewing angle;

[0022] Figure 6 A schematic diagram of another perspective of a first conductive sleeve of a power supply provided by an embodiment of the present application;

[0023] Figure 7 A schematic diagram of a perspective of another power supply provided in an embodiment of the present application;

[0024] Figure 8 for Figure 5 A schematic diagram of another perspective of the power supply in FIG.

[0025] Fig. 9 for Figure 5 An exploded diagram of the power supply in the

[0026] Fig.10 An exploded diagram of another power supply provided in an embodiment of the present application;

[0027] Fig.11 A cross-sectional schematic diagram of a first conductive sleeve of another power supply provided in an embodiment of the present application when assembled on a first sub-plug portion;

[0028] Fig.12 An exploded diagram of another power supply provided in an embodiment of the present application;

[0029] Fig.13 A cross-sectional schematic diagram of a first conductive sleeve of another power supply provided in an embodiment of the present application when assembled on a first sub-plug portion.

[0030] Description of reference numerals:

[0031] 10. Circuit board; 100. Substrate;

[0032] 110. Main body;

[0033] 120, plug-in unit;

[0034] 121, first sub-plug-in portion; 122, second sub-plug-in portion; 123, third sub-plug-in portion;

[0035] 130, vias;

[0036] 131, glue cavity;

[0037] 200, conductive pattern;

[0038] 210, conductive contact;

[0039] 211, first conductive contact sheet; 212, second conductive contact sheet; 213, third conductive contact sheet;

[0040] 20. first conductive sleeve; 21. first plug interface; 22. first slope;

[0041] 30. Second conductive sleeve; 31. Second plug interface;

[0042] 40. Conductive adhesive; 50. Conductive spring;

[0043] x, first direction; y, second direction; z, thickness direction of the circuit board. DETAILED DESCRIPTION

[0044] The terms used in the implementation method part of this application are only used to explain the specific embodiments of this application, and are not intended to limit this application. The implementation method of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0045] The computing device provided in the embodiment of the present application may include but is not limited to a server or an ultra-mobile personal computer (UMPC), etc. The computing device may include a motherboard and a power supply, and the motherboard needs to be powered by the power supply. Specifically, the power supply may be electrically connected to the motherboard through a first connector and a second connector, so that the power supply can deliver current to the motherboard through the first connector and the second connector. In an implementable manner, the first connector may be a gold finger connector, the second connector may be a female connector corresponding to the gold finger connector, a second connector is provided on the motherboard, and the first connector and the second connector are plugged in.

[0046] Figure 1 A schematic diagram of a circuit board of a power supply provided in an embodiment of the present application. The x direction is the first direction, the y direction is the second direction, and the z direction is the thickness direction of the circuit board. Both the first direction and the second direction are perpendicular to the thickness direction of the circuit board, the first direction is perpendicular to the second direction, and the first direction is the plugging direction of the first connector when plugging and unplugging with the second connector. It can be understood by those skilled in the art that the verticality in the present application is not absolutely vertical, and a certain error is allowed. For example, the angle between the first direction and the second direction can be 88°, 89°, etc.

[0047] like Figure 1 As shown, in an embodiment of the present application, the power supply may include a voltage conversion circuit (not shown), a voltage output circuit (not shown) and a circuit board 10. Both the voltage conversion circuit and the voltage output circuit may be provided on the circuit board 10. The voltage conversion circuit is used to convert the voltage of the input power supply. The voltage conversion circuit may be electrically connected to the voltage output circuit to transmit the converted current to the voltage output circuit. The voltage output circuit may be electrically connected to the circuit board 10. The end of the circuit board 10 along the first direction may have a first connector. The voltage output circuit may be electrically connected to the first connector to output the current through the first connector.

[0048] It can be understood that after the first connector is plugged into the second connector, the voltage output circuit of the power supply can be electrically connected to the mainboard through the first connector and the second connector, and the voltage output circuit can transmit current to the mainboard through the first connector and the second connector.

[0049] In the embodiment of the present application, the circuit board 10 includes a substrate 100 and a conductive pattern 200 . The conductive pattern 200 is provided on at least one surface of the substrate 100 in the thickness direction of the circuit board 10 .

[0050] It should be noted that the thickness direction of the substrate 100 is the same as the thickness direction of the circuit board 10 .

[0051] In one achievable manner, a conductive pattern 200 is disposed on one side surface of the substrate 100 in the thickness direction of the circuit board 10 , and a conductive pattern 200 is not disposed on the other side surface.

[0052] In another achievable manner, conductive patterns 200 are provided on both side surfaces of the substrate 100 in the thickness direction of the circuit board 10 .

[0053] In the embodiment of the present application, the substrate 100 includes a main body 110 and a plug-in portion 120, the plug-in portion 120 is disposed on one side of the main body 110 in the first direction, the plug-in portion 120 is connected to the main body 110, the voltage conversion circuit and the voltage output circuit can be disposed in the main body 110, and the voltage output circuit can be electrically connected to the main body 110. The conductive pattern 200 disposed on at least one side of the surface of the substrate 100 includes a conductive contact 210, and a plurality of conductive contacts 210 can be disposed on the surface of the plug-in portion 120. The first connector includes the plug-in portion 120 of the substrate 100 and the conductive contacts 210 disposed on the surface of the plug-in portion 120.

[0054] In one practicable manner, all the conductive contacts 210 are disposed on the same side surface of the plug-in portion 120 in the thickness direction of the circuit board 10 .

[0055] In another achievable manner, conductive contacts 210 are provided on both side surfaces of the plug-in portion 120 in the thickness direction of the circuit board 10 .

[0056] In some implementations of the present application, a plurality of conductive contacts 210 spaced apart along the second direction may be provided on the same side surface of the plug-in portion 120 in the thickness direction of the circuit board 10 .

[0057] In the embodiment of the present application, the conductive pattern 200 disposed on at least one side of the substrate 100 may include a pad (not shown), and a pad may be disposed on the surface of the main body 110 .

[0058] In the embodiment of the present application, the voltage output circuit includes a voltage output terminal and a ground terminal. The plurality of conductive contacts 210 provided on the surface of the plug-in portion 120 may include a first conductive contact 211 and a second conductive contact 212. The first conductive contact 211 and the second conductive contact 212 are arranged at intervals along the second direction. One of the first conductive contact 211 and the second conductive contact 212 is electrically connected to the voltage output terminal, and the other of the first conductive contact 211 and the second conductive contact 212 is electrically connected to the ground terminal, that is, one of the first conductive contact 211 and the second conductive contact 212 can be electrically connected to the voltage output terminal through the circuit of the main body 110, and the other of the first conductive contact 211 and the second conductive contact 212 can be electrically connected to the ground terminal through the circuit of the main body 110.

[0059] In the embodiment of the present application, the power supply may further include a control circuit (not shown), which may be disposed on the circuit board 10 and electrically connected to the circuit board 10. Specifically, the control circuit may be disposed on the main body 110 and electrically connected to the main body 110. The plurality of conductive contacts 210 disposed on the surface of the plug-in portion 120 may further include a third conductive contact 213. In the second direction, the third conductive contact 213 is spaced apart from the first conductive contact 211 and the second conductive contact 212. The third conductive contact 213 is electrically connected to the control circuit, that is, the third conductive contact 213 may be electrically connected to the control circuit through the circuit of the main body 110, and the third conductive contact 213 is used to output a control signal.

[0060] Since the current carrying capacity at the first conductive contact 211 and the second conductive contact 212 limits the current carrying capacity of the first connector, and the first conductive contact 211, the second conductive contact 212, the third conductive contact 213 and the pad in the conductive pattern 200 are often formed by etching a conductive layer of the same thickness, illustratively, the conductive layer can be a copper foil disposed on the surface of the substrate 200. In the related art, a method of increasing the thickness of the conductive layer used to etch and form the conductive pattern, or a method of electroplating the original conductive pattern formed by etching can be used to increase the thickness of the conductive pattern finally obtained on the surface of the substrate, so as to increase the thickness of the first conductive contact and the second conductive contact, so that the current carrying capacity of the first conductive contact and the second conductive contact is enhanced, thereby achieving the purpose of improving the current carrying capacity of the first connector.

[0061] However, regardless of whether the method of increasing the thickness of the conductive layer used to etch to form the conductive pattern is adopted, or the method of electroplating the original conductive pattern formed by etching is adopted, in the conductive pattern finally obtained on the surface of the substrate, in addition to the first conductive contact and the second conductive contact having increased thickness, the thickness of the remaining third conductive contact, the pad and other parts will also increase unnecessarily, resulting in a higher cost for the circuit board.

[0062] In addition, there is a gap between one end of the conductive contact sheet away from the main body portion along the first direction and one end of the plug-in portion away from the main body portion, that is, a negative angle structure is formed between the end face of the conductive contact sheet away from the main body portion along the first direction and the surface of the plug-in portion. After the thickness of the conductive contact sheet increases, the step difference between the conductive contact sheet and the plug-in portion increases, and the height of the end face of the conductive contact sheet away from the main body portion along the first direction increases. After the height of the end face of the conductive contact sheet away from the main body portion along the first direction increases, during the process of plugging the first connector and the second connector, when the spring terminal of the second connector is pressed against the negative angle structure formed between the end face of the conductive contact sheet away from the main body portion along the first direction and the surface of the plug-in portion, jamming is likely to occur, which may easily cause problems such as increased plugging force and abnormal deformation of the spring terminal of the second connector. After the spring terminal of the second connector is abnormally deformed, the conductive contact sheet is likely to mistakenly contact the non-corresponding spring terminal.

[0063] In addition, when the method of electroplating the original conductive pattern formed by etching is adopted, the electroplating will also increase the area of ​​the orthographic projection of each part of the conductive pattern finally obtained on the surface of the substrate, such as the first conductive contact, the second conductive contact, the third conductive contact and the solder pad, on the surface of the substrate. After the area of ​​the orthographic projection of each part of the conductive pattern on the surface of the substrate becomes larger, it will conflict with the arrangement density of each part of the conductive pattern on the surface of the substrate and the electrical isolation between each other.

[0064] Figure 2 A schematic diagram of a power supply provided in an embodiment of the present application from one perspective, Figure 3 for Figure 2 Another view of the power supply in the diagram, Figure 4 for Figure 2 An exploded diagram of the power supply in the .

[0065] like Figure 2-Figure 4 As shown, based on this, in an embodiment of the present application, the plug-in portion 120 includes a first sub-plug-in portion 121 and a second sub-plug-in portion 122 which are separated from each other, the first sub-plug-in portion 121 and the second sub-plug-in portion 122 are arranged on the same side of the main body 110 in the first direction, the first sub-plug-in portion 121 and the second sub-plug-in portion 122 are arranged at intervals along the second direction, the first sub-plug-in portion 121 and the second sub-plug-in portion 122 are both connected to the main body 110, the first conductive contact piece 211 is arranged on the surface of the first sub-plug-in portion 121, and the second conductive contact piece 212 is arranged on the surface of the second sub-plug-in portion 122.

[0066] The first connector also includes a first conductive sleeve 20. The first conductive sleeve 20 and the second sub-connector 122 are spaced apart in the second direction, the first conductive sleeve 20 is sleeved on the first sub-connector 121, one end of the first sub-connector 121 away from the main body 110 and one end of the first conductive contact piece 211 away from the main body 110 are sleeved in the first conductive sleeve 20, the first sub-connector 121 is fixedly connected to the first conductive sleeve 20, and the part of the first conductive contact piece 211 sleeved in the first conductive sleeve 20 contacts and is electrically connected to the inner wall of the first conductive sleeve 20, so that the first conductive contact piece 211 is electrically connected to the first conductive sleeve 20.

[0067] In this way, the whole formed by the first conductive sleeve 20 and the first conductive contact 211 can be used to transmit current. The first conductive sleeve 20 arranged at the first conductive contact 211 can increase the current flow cross-section at the first conductive contact 211, so that the current flow capacity at the first conductive contact 211 is improved, and there is no need to increase the thickness of the conductive pattern 200 on the surface of the substrate 100, so that the cost of the power supply is lower. In addition, when the first connector is plugged into the second connector, the spring terminal of the second connector is used to abut against the surface of the first conductive sleeve 20 sleeved outside the first sub-plug-in portion 121 and the first conductive contact 211. The surface of the first conductive sleeve 20 has no internal angle structure, and the first conductive sleeve 20 is not prone to jamming when abutting against the spring terminal of the second connector. Compared with the scheme in which the spring terminal of the second connector abuts against the surface of the first conductive contact 211, it is not easy to cause problems such as large plugging force and abnormal deformation of the spring terminal of the second connector due to the spring terminal abutting against the internal angle structure formed by the end surface of the first conductive contact 211 and the surface of the first sub-plug-in portion 121, so that the first connector and the second connector are plugged in more easily, and the first conductive contact 211 is not prone to mistakenly contact with non-corresponding spring terminals. In addition, it is not necessary to enlarge the area of ​​the positive projection of the conductive pattern 200 on the surface of the substrate 100 on the substrate 100, which is conducive to the arrangement of various parts of the conductive pattern 200 on the surface of the substrate 100 and electrical isolation between each other. Furthermore, the current carrying capacity at the first conductive contact piece 211 can be adjusted by adjusting the wall thickness of the first conductive sleeve 20, and the adjustment is relatively flexible.

[0068] It is understandable that the wall thickness of the first conductive sleeve 20 may be determined according to the current carrying capacity requirement of the first connector. For example, the wall thickness of the first conductive sleeve 20 may be 0.06-0.5 mm.

[0069] In the embodiment of the present application, the first conductive sleeve 20, the second conductive contact piece 212 and the third conductive contact piece 213 are sequentially arranged in intervals along the second direction, the first conductive contact piece 211 is electrically connected to the voltage output terminal, and the second conductive contact piece 212 is electrically connected to the ground terminal. In this way, the second conductive contact piece 212 can play an isolating role between the first conductive sleeve 20 and the third conductive contact piece 213, which is beneficial to the transmission of the control signal.

[0070] In the embodiment of the present application, one end of the first conductive sleeve 20 away from the main body 110 is a sealing structure.

[0071] In this way, the end of the first conductive sleeve 20 away from the main body 110 can be stably abutted against the spring terminal of the second connector, and the spring terminal will not be abnormally deformed due to extending into the first conductive sleeve 20 .

[0072] In one possible implementation, the first conductive sleeve 20 may include a first side wall, a second side wall, a third side wall, a fourth side wall and a first end wall. The first side wall and the second side wall are arranged opposite to each other along the thickness direction of the circuit board 10. The third side wall and the fourth side wall are arranged opposite to each other along the second direction, and the first end wall is located at the front end of the first connector along the plug-in direction. The first side wall is adjacent to and connected to the third side wall and the fourth side wall respectively; the second side wall is adjacent to and connected to the third side wall and the fourth side wall respectively; the first end wall is arranged at one end of the first side wall, the second side wall, the third side wall and the fourth side wall, and is connected to the first side wall, the second side wall, the third side wall and the fourth side wall respectively; the first side wall, the second side wall, the third side wall, the fourth side wall and the first end wall enclose the first conductive sleeve 20. The first side wall, the second side wall, the third side wall and the other end of the fourth side wall are enclosed to form a first plug interface 21 for inserting one end of the first sub-plug part 121 away from the main body 110 and one end of the first conductive contact sheet 211 away from the main body 110 .

[0073] Exemplarily, the first conductive sleeve 20 may be a rectangular parallelepiped structure, and has a first plug port 21 at one end in the length direction of the first conductive sleeve 20 .

[0074] It can be understood that the rectangular parallelepiped structure described in the embodiments of the present application is not an absolute rectangular parallelepiped, and one or more edges of the rectangular parallelepiped structure may have a chamfered structure or a rounded structure.

[0075] In one achievable manner, the first side wall, the second side wall, the third side wall, the fourth side wall and the first end wall of the first conductive sleeve 20 are an integrally formed structure.

[0076] In one achievable manner, the first side wall, the second side wall, the third side wall, the fourth side wall and the first end wall of the first conductive sleeve 20 are separately assembled structures.

[0077] In one achievable manner, the first conductive sleeve 20 is spaced apart from the main body 110 in the first direction.

[0078] In another achievable manner, one end of the first conductive sleeve 20 facing the main body 110 abuts against the main body 110. It is understandable that one end of the first conductive sleeve 20 facing the main body 110 abuts against the side surface of the main body 110.

[0079] In an achievable manner, the first conductive contact piece 211 is partially located inside the first conductive sleeve 20 , and partially located outside the first conductive sleeve 20 .

[0080] In another achievable manner, all of the first conductive contacts 211 are located inside the first conductive sleeve 20 .

[0081] Exemplarily, the first conductive sleeve 20 can be made of a material with good conductivity, such as red copper, phosphor bronze, nickel silver, etc.

[0082] Exemplarily, the first conductive sleeve 20 may be a stamped part or a die-cast part.

[0083] In some examples, the edge of the first conductive contact piece 211 may overlap with the edge of the first sub-plug portion 121 , so that the first conductive contact piece 211 has a larger size and better current carrying capacity.

[0084] Figure 5 A schematic diagram of a first conductive sleeve of a power supply provided in an embodiment of the present application from one perspective, Figure 6 A schematic diagram of another perspective of a first conductive sleeve of a power supply provided in an embodiment of the present application.

[0085] like Figure 5 , Figure 6 As shown, in the embodiment of the present application, the first conductive sleeve 20 further includes a first slope 22, which is located at one end of the first conductive sleeve 20 away from the main body 110, and the first slope 22 is an inclined surface or an arc surface. When the first connector is plugged into the second connector, the first slope 22 is used to cause the spring terminal abutting against it to deform along the thickness direction of the circuit board 10 away from the first conductive sleeve 20. In this way, it is helpful to reduce the plugging force when the first connector and the second connector are plugged into each other.

[0086] Specifically, a first slope 22 is connected between at least one of the first side wall and the second side wall and the first end wall, so that at least one of the first side wall and the second side wall can be connected to the first end wall through the first slope 22 therebetween, and at least one of the first side wall and the second side wall transitions to the first end wall through the first slope 22.

[0087] In one possible implementation, the first slope 22 can be provided on both sides of the end of the first conductive sleeve 20 away from the main body 110 in the thickness direction of the circuit board 10. That is, the first conductive sleeve 20 includes two first slopes 22. Among them, one first slope 22 is connected between the first side wall and the first end wall, and the other first slope 22 is connected between the second side wall and the first end wall. In this way, when both sides of the first conductive sleeve 20 in the thickness direction of the circuit board 10 are used to abut against the spring terminal of the second connector, the plugging force when the first connector and the second connector are plugged in can be reduced.

[0088] In some implementations of the present application, a third conductive contact 213 is further disposed on the surface of the second sub-connection portion 122. In the second direction, the second conductive contact 212 and the third conductive contact 213 are disposed on the surface of the second sub-connection portion 122 at intervals.

[0089] Figure 7 A schematic diagram of a perspective of another power supply provided in an embodiment of the present application, Figure 8 for Figure 7 Another view of the power supply in the diagram, Fig. 9 for Figure 7 An exploded diagram of the power supply in the .

[0090] like Figure 7-Figure 9 As shown, in some other implementations of the present application, the plug-in portion 120 also includes a third sub-plug-in portion 123 separated from the first sub-plug-in portion 121 and the second sub-plug-in portion 122, and the first sub-plug-in portion 121, the second sub-plug-in portion 122 and the third sub-plug-in portion 123 are arranged on the same side of the main body 110 in the first direction. The first sub-plug-in portion 121, the second sub-plug-in portion 122 and the third sub-plug-in portion 123 are arranged at intervals along the second direction, the third sub-plug-in portion 123 is connected to the main body 110, and the third conductive contact piece 213 is arranged on the surface of the third sub-plug-in portion 123. The first connector also includes a second conductive sleeve 30. In the second direction, the second conductive sleeve 30 is spaced from the first sub-plug-in portion 121, the first conductive sleeve 20 and the third sub-plug-in portion 123. The second conductive sleeve 30 is sleeved on the second sub-plug-in portion 122. One end of the second sub-connector 122 facing away from the main body 110 and one end of the second conductive contact piece 212 facing away from the main body 110 are sleeved in the second conductive sleeve 30, the second sub-connector 122 is fixedly connected to the second conductive sleeve 30, and the part of the second conductive contact piece 212 sleeved in the second conductive sleeve 30 is in contact with and electrically connected to the inner wall of the second conductive sleeve 30, so that the second conductive contact piece 212 is electrically connected to the second conductive sleeve 30.

[0091] In this way, the whole formed by the second conductive sleeve 30 and the second conductive contact 212 can be used to transmit current. The second conductive sleeve 30 arranged at the second conductive contact 212 can increase the current flow cross-section at the second conductive contact 212, so that the current flow capacity at the second conductive contact 212 is improved, and there is no need to increase the thickness of the conductive pattern 200 on the surface of the substrate 100, so that the cost of the power supply is lower. In addition, when the first connector is plugged into the second connector, the spring terminal of the second connector is used to abut against the surface of the second conductive sleeve 30 sleeved outside the second sub-plug-in portion 122 and the second conductive contact 211. The surface of the second conductive sleeve 30 has no internal angle structure, and the second conductive sleeve 30 is not prone to jamming when abutting against the spring terminal of the second connector. Compared with the scheme in which the spring terminal of the second connector abuts against the surface of the second conductive contact 212, it is not easy to cause problems such as large plugging force and abnormal deformation of the spring terminal of the second connector due to the spring terminal abutting against the internal angle structure formed by the end face of the second conductive contact 212 and the surface of the second sub-plug-in portion 122, so that the first connector and the second connector are plugged in more easily, and the second conductive contact 212 is not prone to mistakenly contact with non-corresponding spring terminals. In addition, it is not necessary to enlarge the area of ​​the positive projection of the conductive pattern 200 on the surface of the substrate 100 on the substrate 100, which is conducive to the arrangement of various parts of the conductive pattern 200 on the surface of the substrate 100 and electrical isolation between each other. Furthermore, the current carrying capacity at the second conductive contact piece 212 can be adjusted by adjusting the wall thickness of the second conductive sleeve 30, and the adjustment is relatively flexible.

[0092] It is understandable that the wall thickness of the second conductive sleeve 30 may be determined according to the current carrying capacity requirement of the first connector. For example, the wall thickness of the second conductive sleeve 30 may be 0.06-0.5 mm.

[0093] In the embodiment of the present application, one end of the second conductive sleeve 30 away from the main body 110 is a sealing structure.

[0094] In this way, the end of the second conductive sleeve 30 away from the main body 110 can be stably abutted against the spring terminal of the second connector, and the spring terminal will not be abnormally deformed due to extending into the second conductive sleeve 30 .

[0095] It is understandable that the structure of the second conductive sleeve 30 can be set with reference to the structure of the first conductive sleeve 20 , and the specific size of the second conductive sleeve 30 can be determined according to the size of the second sub-connector 122 and the second conductive contact piece 212 .

[0096] In one possible implementation, the second conductive sleeve 30 may include a fifth side wall, a sixth side wall, a seventh side wall, an eighth side wall, and a second end wall. The fifth side wall and the sixth side wall are arranged opposite to each other along the thickness direction of the circuit board 10. The seventh side wall and the eighth side wall are arranged opposite to each other along the second direction, and the second end wall is located at the front end of the first connector along the plug-in direction. The fifth side wall is adjacent to and connected to the seventh side wall and the eighth side wall respectively; the sixth side wall is adjacent to and connected to the seventh side wall and the eighth side wall respectively; the second end wall is arranged at one end of the fifth side wall, the sixth side wall, the seventh side wall, and the eighth side wall, and is connected to the fifth side wall, the sixth side wall, the seventh side wall, and the eighth side wall respectively; the fifth side wall, the sixth side wall, the seventh side wall, the eighth side wall, and the second end wall enclose and form the second conductive sleeve 30. The other ends of the fifth side wall, the sixth side wall, the seventh side wall and the eighth side wall are enclosed to form a second plug interface 31 for inserting one end of the second sub-plug portion 122 away from the main body 110 and one end of the second conductive contact sheet 212 away from the main body 110 .

[0097] Exemplarily, the second conductive sleeve 30 may be a rectangular parallelepiped structure, and one end of the second conductive sleeve 30 in the length direction thereof is provided with a second plug port 31 .

[0098] In one achievable manner, the fifth side wall, the sixth side wall, the seventh side wall, the eighth side wall and the second end wall of the second conductive sleeve 30 are an integrally formed structure.

[0099] In one achievable manner, the fifth side wall, the sixth side wall, the seventh side wall, the eighth side wall and the second end wall of the second conductive sleeve 30 are separately assembled structures.

[0100] In one achievable manner, the second conductive sleeve 30 is spaced apart from the main body 110 in the first direction.

[0101] In another achievable manner, one end of the second conductive sleeve 30 facing the main body 110 abuts against the main body 110. It is understandable that one end of the second conductive sleeve 30 facing the main body 110 abuts against the side surface of the main body 110.

[0102] In an achievable manner, the second conductive contact piece 212 is partially located inside the second conductive sleeve 30 , and partially located outside the second conductive sleeve 30 .

[0103] In another achievable manner, the second conductive contact pieces 212 are entirely located within the second conductive sleeve 30 .

[0104] Exemplarily, the second conductive sleeve 30 may be made of a material with good conductivity, such as red copper, phosphor bronze, nickel silver, etc.

[0105] Exemplarily, the second conductive sleeve 30 may be a stamped part or a die-cast part.

[0106] In one achievable manner, in the second direction, the second sub-connector 122 is located between the first sub-connector 121 and the third sub-connector 123 , that is, the first sub-connector 121 , the second sub-connector 122 and the third sub-connector 123 are sequentially spaced apart.

[0107] In another achievable manner, in the second direction, the first sub-connector 121 is located between the second sub-connector 122 and the third sub-connector 123 , that is, the second sub-connector 122 , the first sub-connector 121 and the third sub-connector 123 are sequentially spaced apart.

[0108] In another achievable manner, in the second direction, the third sub-plug part 123 is located between the first sub-plug part 121 and the second sub-plug part 122 , that is, the first sub-plug part 121 , the third sub-plug part 123 and the second sub-plug part 122 are sequentially spaced apart.

[0109] In the embodiment of the present application, the first conductive sleeve 20, the second conductive sleeve 30 and the third sub-connector 123 are sequentially arranged in intervals along the second direction, the first conductive contact piece 211 is electrically connected to the voltage output end, and the second conductive contact piece 212 is electrically connected to the ground end. In this way, the second conductive sleeve 30 can play an isolating role between the first conductive sleeve 20 and the third conductive contact piece 213, which is beneficial to the transmission of the control signal.

[0110] In some examples where the third conductive contact 213 is disposed on the surface of the third sub-connector 123 , the edge of the second conductive contact 212 may overlap with the edge of the second sub-connector 122 , so that the second conductive contact 212 has a larger size and better current carrying capacity.

[0111] In the embodiment of the present application, the second conductive sleeve 30 further includes a second slope (not shown), which is located at one end of the second conductive sleeve 30 away from the main body 110, and the second slope is an inclined surface or an arc surface. When the first connector is plugged into the second connector, the second slope is used to cause the spring terminal abutting against it to deform along the thickness direction of the circuit board 10 away from the second conductive sleeve 30, and the second slope of the second conductive sleeve 30 can be set with reference to the first slope 22 of the first conductive sleeve. In this way, it is helpful to reduce the plugging force when the first connector and the second connector are plugged into each other.

[0112] Specifically, at least one of the fifth side wall and the sixth side wall is connected to the second end wall via a second slope, so that at least one of the fifth side wall and the sixth side wall can be connected to the second end wall via the second slope therebetween, and at least one of the fifth side wall and the sixth side wall transitions to the second end wall via the second slope.

[0113] In one achievable manner, the second conductive sleeve 30 may be provided with a second slope on both sides of the end facing away from the main body 110 in the thickness direction of the circuit board 10. In other words, the second conductive sleeve 30 includes two second slopes. Among them, one second slope is connected between the fifth side wall and the second end wall, and the other second slope is connected between the sixth side wall and the second end wall. In this way, when both sides of the first conductive sleeve 20 in the thickness direction of the circuit board 10 are used to abut against the spring terminal of the second connector, the plugging force when the first connector and the second connector are plugged in can be reduced.

[0114] Fig.10 An exploded diagram of another power supply provided in an embodiment of the present application, Fig.11 A cross-sectional schematic diagram of a first conductive sleeve of another power supply provided in an embodiment of the present application when assembled on a first sub-plug portion.

[0115] like Fig.10 , Fig.11 As shown, in some implementations of the present application, the first conductive sleeve 20 has a conductive adhesive 40, the first sub-connector 121 is bonded and fixed to the first conductive sleeve 20 by the conductive adhesive 40 in the first conductive sleeve 20, and the first conductive sleeve 20 is in contact with and electrically connected to the first conductive contact piece 211 through the conductive adhesive 40 in the first conductive sleeve 20.

[0116] In this way, the conductive adhesive 40 in the first conductive sleeve 20 can not only realize the fixed connection between the first conductive sleeve 20 and the first sub-plug-in portion 121, but also realize the electrical connection between the first conductive contact piece 211 and the first conductive sleeve 20. The connection structure of the first conductive sleeve 20 is relatively simple, and it is relatively convenient to assemble the first conductive sleeve 20. In addition, the fixed connection between the first conductive sleeve 20 and the first sub-plug-in portion 121 and the electrical connection between the first conductive contact piece 211 and the first conductive sleeve 20 are relatively stable.

[0117] In some examples, there is a conductive adhesive 40 between the first conductive contact piece 211 and the inner wall of the first conductive sleeve 20, and the first conductive contact piece 211 and the first conductive sleeve 20 can be bonded and fixed by the conductive adhesive 40 therebetween, so that the first conductive sleeve 20 and the first conductive contact piece 211 are in contact and electrically connected by the conductive adhesive 40 therebetween. The first conductive contact piece 211 is fixedly connected to the first sub-plug part 121, and the first sub-plug part 121 can be fixedly connected to the first conductive sleeve 20 by the first conductive contact piece 211 bonded and fixed to the first conductive sleeve 20.

[0118] In some examples, there may be a conductive adhesive 40 between the first sub-connector 121 and the inner wall of the first conductive sleeve 20 . The conductive adhesive 40 between the first sub-connector 121 and the first conductive sleeve 20 may be used to bond and fix the first conductive sleeve 20 to the first sub-connector 121 .

[0119] In some implementations in which one end of the second sub-connector 122 facing away from the main body 110 and one end of the second conductive contact 212 facing away from the main body 110 are sleeved in the second conductive sleeve 30, similar to the assembly relationship of the first conductive sleeve 20 on the first sub-connector 121, the second conductive sleeve 30 may also have a conductive adhesive 40, and the second sub-connector 122 and the second conductive sleeve 30 are bonded and fixed by the conductive adhesive 40 in the second conductive sleeve 30, and the second conductive sleeve 30 is in contact with and electrically connected to the second conductive contact 212 through the conductive adhesive 40 in the second conductive sleeve 30.

[0120] In this way, the conductive adhesive 40 in the second conductive sleeve 30 can not only realize the fixed connection between the second conductive sleeve 30 and the second sub-plug-in portion 122, but also realize the electrical connection between the second conductive contact piece 212 and the second conductive sleeve 30. The connection structure of the second conductive sleeve 30 is relatively simple, and it is relatively convenient to assemble the second conductive sleeve 30. In addition, the fixed connection between the second conductive sleeve 30 and the second sub-plug-in portion 122 and the electrical connection between the second conductive contact piece 212 and the second conductive sleeve 30 are relatively stable.

[0121] In some examples, there is a conductive adhesive 40 between the second conductive contact piece 212 and the inner wall of the second conductive sleeve 30, and the second conductive contact piece 212 and the second conductive sleeve 30 can be bonded and fixed by the conductive adhesive 40 therebetween, so that the second conductive sleeve 30 and the second conductive contact piece 212 are electrically connected by the conductive adhesive 40 therebetween. The second conductive contact piece 212 is fixedly connected to the second sub-plug part 122, and the second sub-plug part 122 can be fixedly connected to the second conductive sleeve 30 by the second conductive contact piece 212 bonded and fixed to the second conductive sleeve 30.

[0122] In some examples, there may be a conductive adhesive 40 between the second sub-connector 122 and the inner wall of the second conductive sleeve 30 . The conductive adhesive 40 between the second sub-connector 122 and the second conductive sleeve 30 may be used to bond and fix the second conductive sleeve 30 to the second sub-connector 122 .

[0123] In some possible implementations, the portion of the circuit board 10 located in the first conductive sleeve 20 has a via 130 that penetrates the first conductive contact 211 along the thickness direction of the circuit board 10, and the hole wall of the via 130 located in the first conductive sleeve 20 is electrically connected to the voltage output terminal or the ground terminal that is electrically connected to the first conductive contact 211, and the conductive glue 40 in the first conductive sleeve 20 is bonded and fixed to the inner wall of the first conductive sleeve 20, the first conductive contact 211, and the hole wall of the via 130 located in the first conductive sleeve 20, so that the first conductive sleeve 20 is fixed to the first conductive contact 211 and the hole wall of the via 130 located in the first conductive sleeve 20 through the conductive glue 40 in the first conductive sleeve 20, and is electrically connected.

[0124] In this way, it is beneficial to realize the electrical connection between the first conductive sleeve 20 and the first conductive contact piece 211 and the voltage output terminal or the ground terminal, and the electrical connection between the first conductive sleeve 20 and the first conductive contact piece 211 and the voltage output terminal or the ground terminal is relatively stable.

[0125] Exemplarily, the via hole 130 in the first conductive sleeve 20 may be a through hole or a blind hole. When the via hole 130 in the first conductive sleeve 20 is a blind hole, one end of the via hole 130 in the first conductive sleeve 20 passes through the first conductive contact sheet 211 , and the other end is located in the first sub-plug portion 121 .

[0126] In some embodiments, the portion of the circuit board 10 located within the first conductive sleeve 20 has a via 130 that penetrates the first conductive contact 211 along the thickness direction of the circuit board 10, the portion of the circuit board 10 located within the first conductive sleeve 20 has a plurality of vias 130 that penetrate the first conductive contact 211 along the thickness direction of the circuit board 10, and all the vias 130 in the first conductive sleeve 20 are distributed in a matrix along the first direction and the second direction.

[0127] In this way, the current transmission between the first conductive sleeve 20 and the first conductive contact piece 211 can be more balanced, which is beneficial to the current sharing design between the first conductive sleeve 20 and the first conductive contact piece 211 .

[0128] In some embodiments where the portion of the circuit board 10 located in the first conductive sleeve 20 has a via hole 130 that penetrates the first conductive contact piece 211 along the thickness direction of the circuit board 10, the voltage output terminal or the ground terminal for being electrically connected to the first conductive contact piece 211 is electrically connected to the inner wall of the via hole 130 located in the first conductive sleeve 20, and the inner wall of the via hole 130 located in the first conductive sleeve 20 encloses to form a glue cavity 131 that penetrates the first conductive contact piece 211 along the thickness direction of the circuit board 10, and the conductive glue 40 is contained in the glue cavity 131, that is, at least a portion of the via hole 130 located in the first conductive sleeve 20 contains the conductive glue 40. The conductive glue 40 in the glue cavity 131 is bonded and fixed to the inner wall of the via hole 130 where it is located, and is electrically connected to the inner wall of the via hole 130 where it is located.

[0129] In this way, the bonding surface between the conductive adhesive 40 and the hole wall of the via hole 130 located in the first conductive sleeve 20 is larger, and the bonding and electrical connection are more stable. In addition, after the bonding surface between the conductive adhesive 40 and the hole wall of the via hole 130 located in the first conductive sleeve 20 is increased, it is also beneficial to increase the current flow cross section between the first conductive sleeve 20 and the first conductive contact piece 211 and the voltage output end or the ground end, so that the current flow capacity between the first conductive sleeve 20 and the first conductive contact piece 211 and the voltage output end or the ground end is better.

[0130] In some examples, the adhesive cavity 131 of the via hole 130 in the first conductive sleeve 20 may be filled with the conductive adhesive 40 .

[0131] In some examples, the adhesive cavity 131 of the via hole 130 in the first conductive sleeve 20 may be partially filled with the conductive adhesive 40 and partially not filled with the conductive adhesive 40 .

[0132] When the first sub-connector 121 is provided with first conductive contacts 211 on both sides in the thickness direction of the circuit board 10, the via 130 located in the first conductive sleeve 20 can be a through hole, and the two ends of the glue-containing cavity 131 of the via 130 located in the first conductive sleeve 20 respectively penetrate the first conductive contacts 211 provided on both sides of the first sub-connector 121 in the thickness direction of the circuit board 10, and the portions of the glue-containing cavity 131 of the via 130 located in the first conductive sleeve 20 close to the first conductive contacts 211 on both sides of the first sub-connector 121 in the thickness direction of the circuit board 10 are filled with conductive glue 40.

[0133] Fig.12 An exploded diagram of another power supply provided in an embodiment of the present application.

[0134] like Fig.12 As shown, in some implementable embodiments in which the second conductive sleeve 30 has a conductive adhesive 40, similar to the assembly relationship of the first conductive sleeve 20 on the first sub-plug-in portion 121, the portion of the circuit board 10 located in the second conductive sleeve 30 has a through hole 130 that penetrates the second conductive contact piece 212 along the thickness direction of the circuit board 10, and the hole wall of the through hole 130 located in the second conductive sleeve 30 is electrically connected to the voltage output terminal or the ground terminal for electrically connecting to the second conductive contact piece 212, and the conductive adhesive 40 in the second conductive sleeve 30 is bonded and fixed to the inner wall of the second conductive sleeve 30, the second conductive contact piece 212, and the hole wall of the through hole 130 located in the second conductive sleeve 30, so that the second conductive sleeve 30 is fixed to the second conductive contact piece 212 and the hole wall of the through hole 130 located in the second conductive sleeve 30 through the conductive adhesive 40 in the second conductive sleeve 30, and is electrically connected.

[0135] In this way, it is beneficial to realize the electrical connection between the second conductive sleeve 30 and the second conductive contact piece 212 and the voltage output terminal or the ground terminal, and the electrical connection between the second conductive sleeve 30 and the second conductive contact piece 212 and the voltage output terminal or the ground terminal is relatively stable.

[0136] Exemplarily, the via hole 130 in the second conductive sleeve 30 may be a through hole or a blind hole. When the via hole 130 in the second conductive sleeve 30 is a blind hole, one end of the via hole 130 in the second conductive sleeve 30 passes through the second conductive contact piece 212 and the other end is located in the second sub-plug portion 122.

[0137] In some embodiments, the portion of the circuit board 10 located within the second conductive sleeve 30 has a via 130 that penetrates the second conductive contact 212 along the thickness direction of the circuit board 10, the portion of the circuit board 10 located within the second conductive sleeve 30 has a plurality of vias 130 that penetrate the second conductive contact 212 along the thickness direction of the circuit board 10, and all the vias 130 in the second conductive sleeve 30 are distributed in a matrix along the first direction and the second direction.

[0138] In this way, the current transmission between the second conductive sleeve 30 and the second conductive contact piece 212 can be more balanced, which is beneficial to the current sharing design between the second conductive sleeve 30 and the second conductive contact piece 212 .

[0139] In some embodiments where the portion of the circuit board 10 located in the second conductive sleeve 30 has a via hole 130 that penetrates the second conductive contact piece 212 along the thickness direction of the circuit board 10, the voltage output terminal or the ground terminal for being electrically connected to the second conductive contact piece 212 is electrically connected to the inner wall of the via hole 130 located in the second conductive sleeve 30, and the inner wall of the via hole 130 located in the second conductive sleeve 30 encloses to form a glue cavity 131 that penetrates the second conductive contact piece 212 along the thickness direction of the circuit board 10, and the conductive glue 40 is contained in the glue cavity 131, that is, at least a portion of the via hole 130 located in the second conductive sleeve 30 contains the conductive glue 40. The conductive glue 40 in the glue cavity 131 is bonded and fixed to the inner wall of the via hole 130 where it is located, and is electrically connected to the inner wall of the via hole 130 where it is located.

[0140] In this way, the bonding surface between the conductive adhesive 40 and the hole wall of the via hole 130 located in the second conductive sleeve 30 is larger, and the bonding and electrical connection are more stable. In addition, after the bonding surface between the conductive adhesive 40 and the hole wall of the via hole 130 located in the second conductive sleeve 30 is increased, it is also beneficial to increase the current flow cross section between the second conductive sleeve 30 and the second conductive contact piece 212 and the voltage output end or the ground end, so that the current flow capacity between the second conductive sleeve 30 and the second conductive contact piece 212 and the voltage output end or the ground end is better.

[0141] In some examples, the adhesive cavity 131 of the via hole 130 in the second conductive sleeve 30 may be filled with the conductive adhesive 40 .

[0142] In some examples, the adhesive cavity 131 of the via hole 130 in the second conductive sleeve 30 may be partially filled with the conductive adhesive 40 and partially not filled with the conductive adhesive 40 .

[0143] When the second sub-connector 122 is provided with second conductive contacts 212 on both sides in the thickness direction of the circuit board 10, the via 130 located in the second conductive sleeve 30 can be a through hole, and the two ends of the glue-containing cavity 131 of the via 130 located in the second conductive sleeve 30 respectively penetrate the second conductive contacts 212 provided on both sides of the second sub-connector 122 in the thickness direction of the circuit board 10, and the glue-containing cavity 131 of the via 130 located in the second conductive sleeve 30 close to the second conductive contacts 212 on both sides of the second sub-connector 122 in the thickness direction of the circuit board 10 is filled with conductive glue 40.

[0144] Fig.13 A cross-sectional schematic diagram of a first conductive sleeve of another power supply provided in an embodiment of the present application when assembled on a first sub-plug portion.

[0145] like Fig.13 As shown, in some other implementations of the present application, a conductive spring sheet 50 is provided on the inner wall of the first conductive sleeve 20, the first sub-connector 121 and the first conductive sleeve 20 are pressed and fixed by the conductive spring sheet 50 inside the first conductive sleeve 20, and the first conductive sleeve 20 is in contact with and electrically connected to the first conductive contact sheet 211 through the conductive spring sheet 50 inside the first conductive sleeve 20.

[0146] In this way, the conductive spring piece 50 in the first conductive sleeve 20 can not only realize the fixed connection between the first conductive sleeve 20 and the first sub-plug-in portion 121, but also realize the electrical connection between the first conductive contact piece 211 and the first conductive sleeve 20. The connection structure of the first conductive sleeve 20 is relatively simple, and it is relatively convenient to assemble the first conductive sleeve 20. In addition, it is relatively convenient to disassemble the first conductive sleeve 20 on the first sub-plug-in portion 121, so that the first conductive sleeve 20 is easy to replace.

[0147] It can be understood that there is a conductive spring 50 between the first conductive contact 211 and the inner wall of the first conductive sleeve 20, and the conductive spring 50 can be pressed on the first conductive contact 211, so that the first conductive sleeve 20 and the first conductive contact 211 are electrically connected through the conductive spring 50 therebetween, and the conductive spring 50 presses and fixes the first sub-connector 121 and the first conductive sleeve 20 through the first conductive contact 211.

[0148] In the embodiment where the conductive spring piece 50 is provided on the inner wall of the first conductive sleeve 20, the conductive spring piece 50 may be provided on the inner wall of both sides of the first conductive sleeve 20 in the thickness direction of the circuit board 10. In this way, when the first conductive contact piece 211 is provided on both sides of the first sub-connecting portion 121 in the thickness direction of the circuit board 10, it is convenient to electrically connect the first conductive sleeve 20 with the first conductive contact pieces 211 provided on both sides of the first sub-connecting portion 121 in the thickness direction of the circuit board 10.

[0149] In the embodiment where the conductive spring sheet 50 is disposed on the inner wall of the first conductive sleeve 20, a plurality of conductive spring sheets 50 may be disposed on the inner wall of the first conductive sleeve 20 along the second direction. In this way, the current transmission between each location of the first conductive sleeve 20 in the second direction and the first conductive contact sheet 211 can be relatively balanced. In addition, the connection between the first conductive sleeve 20 and the first sub-connector 121 is relatively stable and not prone to tilting.

[0150] In some implementations in which one end of the second sub-connector 122 facing away from the main body 110 and one end of the second conductive contact 212 facing away from the main body 110 are sleeved in the second conductive sleeve 30, similar to the assembly relationship of the first conductive sleeve 20 on the first sub-connector 121, a conductive spring sheet 50 may also be provided on the inner wall of the second conductive sleeve 30, and the second sub-connector 122 and the second conductive sleeve 30 are pressed and fixed by the conductive spring sheet 50 in the second conductive sleeve 30, and the second conductive sleeve 30 is electrically connected to the second conductive contact 212 through the conductive spring sheet 50 in the second conductive sleeve 30.

[0151] In this way, the conductive spring piece 50 in the second conductive sleeve 30 can not only realize the fixed connection between the second conductive sleeve 30 and the second sub-plug-in portion 122, but also realize the electrical connection between the second conductive contact piece 212 and the second conductive sleeve 30. The connection structure of the second conductive sleeve 30 is relatively simple, and it is relatively convenient to assemble the second conductive sleeve 30. In addition, it is also relatively convenient to disassemble the second conductive sleeve 30 on the second sub-plug-in portion 122, so that the second conductive sleeve 30 can be replaced easily.

[0152] It can be understood that there is a conductive spring 50 between the second conductive contact 212 and the inner wall of the second conductive sleeve 30, and the conductive spring 50 can be pressed on the second conductive contact 212, so that the second conductive sleeve 30 and the second conductive contact 212 are electrically connected through the conductive spring 50 therebetween, and the conductive spring 50 presses and fixes the second sub-connector 122 and the second conductive sleeve 30 through the second conductive contact 212.

[0153] In the embodiment where the conductive spring piece 50 is disposed on the inner wall of the second conductive sleeve 30, the conductive spring piece 50 may be disposed on the inner wall of both sides of the second conductive sleeve 30 in the thickness direction of the circuit board 10. In this way, when the second conductive contact piece 212 is disposed on both sides of the second sub-connection part 122 in the thickness direction of the circuit board 10, it is convenient to electrically connect the second conductive sleeve 30 with the second conductive contact pieces 212 disposed on both sides of the second sub-connection part 122 in the thickness direction of the circuit board 10.

[0154] In the embodiment where the conductive spring sheet 50 is disposed on the inner wall of the second conductive sleeve 30, a plurality of conductive spring sheets 50 may be disposed on the inner wall of the second conductive sleeve 30 along the second direction. In this way, the current transmission between the second conductive sleeve 30 and the second conductive contact sheet 212 at various locations in the second direction can be more balanced. In addition, the connection between the second conductive sleeve 30 and the second sub-connector 122 is also more stable and less prone to tilting.

[0155] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0156] The terms "first", "second", "third", "fourth", etc. (if any) in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0157] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents. These modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A power supply, characterized in that: The power supply includes a circuit board and a voltage output circuit; The voltage output circuit is arranged on the circuit board and is electrically connected to the circuit board; The voltage output circuit comprises a voltage output terminal and a ground terminal; The end portion of the circuit board along the first direction has a first connector; The first connector comprises a first conductive sleeve and a plug-in portion of the circuit board; wherein the plug-in portion comprises a first sub-plug-in portion and a second sub-plug-in portion; the first sub-plug-in portion and the second sub-plug-in portion are spaced apart along the second direction; A first conductive contact is provided on the surface of the first sub-plug portion; the first conductive contact is electrically connected to the voltage output terminal; A second conductive contact piece is disposed on the surface of the second sub-plug part; the second conductive contact piece is electrically connected to the ground terminal; The first conductive sleeve is sleeved on the first sub-plug-in portion and is spaced apart from the second sub-plug-in portion; The first conductive sleeve is electrically connected to the first conductive contact piece; The first direction is perpendicular to the thickness direction of the circuit board; and the second direction is perpendicular to the first direction.

2. The power supply according to claim 1, characterized in that: The first sub-plug-in portion is fixed to the first conductive sleeve by conductive adhesive; the first conductive sleeve is electrically connected to the first conductive contact piece by the conductive adhesive.

3. The power supply according to claim 2, characterized in that: The circuit board in the first conductive sleeve has a via hole penetrating the first conductive contact piece along the thickness direction; the via hole is electrically connected to the voltage output end; the first conductive sleeve is fixed to the first conductive contact piece and the hole wall of the via hole through the conductive glue and is electrically connected.

4. The power supply according to claim 3, characterized in that: The portion of the circuit board located in the first conductive sleeve has a plurality of the via holes; all the via holes in the first conductive sleeve are distributed in a matrix along the first direction and the second direction.

5. The power supply according to claim 3 or 4, characterized in that: At least a portion of the via hole contains the conductive adhesive; the conductive adhesive is bonded to the inner wall of the via hole and is electrically connected to the inner wall of the via hole.

6. The power supply according to claim 1, characterized in that: A conductive spring is provided on the inner wall of the first conductive sleeve; the first sub-connecting portion is fixed to the first conductive sleeve via the conductive spring; and the first conductive sleeve is electrically connected to the first conductive contact piece via the conductive spring.

7. The power supply according to any one of claims 1 to 6, characterized in that: The first conductive sleeve includes a first side wall, a second side wall, a third side wall, a fourth side wall and a first end wall; wherein, the first side wall and the second side wall are arranged opposite to each other along the thickness direction of the circuit board; the third side wall and the fourth side wall are arranged opposite to each other along the second direction; the first end wall is located at the front end of the first connector along the plug-in direction; the first side wall is adjacent to and connected to the third side wall and the fourth side wall respectively; the second side wall is adjacent to and connected to the third side wall and the fourth side wall respectively; the first end wall is arranged at one end of the first side wall, the second side wall, the third side wall and the fourth side wall, and is connected to the first side wall, the second side wall, the third side wall and the fourth side wall respectively.

8. The power supply according to claim 7, characterized in that: The first conductive sleeve further comprises two first slope surfaces, wherein the first slope surfaces are inclined surfaces or arc surfaces; Among them, one of the first slope surfaces is connected between the first side wall and the first end wall; and another of the first slope surfaces is connected between the second side wall and the first end wall.

9. The power supply according to any one of claims 1 to 8, characterized in that: The power supply also includes a control circuit; The first connector also includes a second conductive sleeve; The plug-in portion further includes a third sub-plug-in portion; the first sub-plug-in portion, the second sub-plug-in portion and the third sub-plug-in portion are sequentially spaced along the second direction; A third conductive contact is provided on the surface of the third sub-plug part; the third conductive contact is electrically connected to the control circuit; the third conductive contact is used to output a control signal; The second conductive sleeve is sleeved on the second sub-plug-in portion and is spaced apart from the first sub-plug-in portion and the second sub-plug-in portion respectively; The second conductive sleeve is electrically connected to the second conductive contact piece.

10. A computing device, characterized in that The computing device comprises a power supply and a motherboard as described in any one of claims 1 to 9; The mainboard is provided with a second connector; wherein the first connector and the second connector are plugged in; and the power supply is electrically connected to the mainboard through the first connector and the second connector.

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