Semiconductor chip packaging device

Abstract

The embodiment of the invention provides a semiconductor chip packaging device, and relates to the technical field of chip packaging. A semiconductor chip packaging device comprises a bottom plate, a clamping transmission assembly, an installation driving assembly and a lifting packaging assembly, the lifting packaging assembly comprises a worm, the worm is rotatably installed on the upper portion of the interior of a connecting support, one end of the worm is fixedly connected with a second motor, and the other end of the worm is fixedly connected with a third motor. When the connecting support and the fixing plate ascend and descend, the clamping transmission assembly can be started in a matched mode to drive the sliding plates on the two sides to move in the bottom plate and the first sliding block, then the clamping transmission assembly is matched to enable the clamping plates on the two sides to move towards the inner side, and a PCB can be clamped and fixed. And then the PCB can be stabilized through a suction cup below the air extractor on the fixing plate, then the mold can be driven to be tightly attached to the upper portion of the chip through the lifting packaging assembly, and then packaging liquid can be conveyed into the mold through a conveying pipe and a conveying plate through the conveying device.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular, to a semiconductor chip packaging device. Background Art

[0002] In electronics, an integrated circuit is a way of miniaturizing circuits (mainly semiconductor devices, but also passive components, etc.), and is often manufactured on the surface of a semiconductor wafer.

[0003] After searching, the application number is CN202211538870.5, which discloses a chip packaging device, including a packaging machine and a bracket, the top of the packaging machine is fixedly installed with a bracket, the inside of the bracket is slidably connected with a sealing gun, and the bottom of the sealing gun is provided with a port; the bottom of the bracket is fixedly connected with a rectangular plate, one side of the rectangular plate is fixedly installed with an electric push rod, and the end of the electric push rod away from the rectangular plate is slidably connected with an output rod; the present invention scrapes off the glue at the port by a scraper, thereby scraping and cleaning the port of the sealing gun, reducing the glue residue at the port, causing the glue to solidify and block the port, thereby making it difficult to continue to use the sealing gun. The glue dropped at the port will be collected by the storage frame at the bottom. Since the storage frame is made of corrugated pipe material, the storage frame can move and shrink together with the connecting plate, thereby collecting the scraped glue and preventing the glue from scattering.

[0004] The problem with the above solution is that the chip carrier PCB board is fixed by a clamp during the chip packaging process, which causes certain inconveniences in the packaging process and makes it impossible to package chips at different positions on the PCB board, thereby reducing work efficiency. Summary of the invention

[0005] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor chip packaging device, wherein starting the installation drive assembly can drive the connection bracket and the fixed plate to move up and down, and when the connection bracket and the fixed plate are moved up and down, the clamping transmission assembly can be started to drive the two side slides to move along the bottom plate and the first slide block, and then the clamping transmission assembly can be used to move the two side clamps inward, so that the PCB can be clamped and fixed, and then the suction device on the fixed plate can stabilize the PCB board through the suction cup below, and then the lifting packaging assembly can drive the mold to be close to the top of the chip, and then the packaging liquid can be transported to the mold through the conveying pipe and the conveying plate by the conveying device.

[0006] The present application also proposes a semiconductor chip packaging device, including a base plate, a clamping transmission assembly, an installation drive assembly and a lifting packaging assembly, the clamping transmission assembly includes a slide plate, a clamping plate is fixedly connected to the inner side of the lower surface of the slide plate, tooth plates are fixedly connected to the two sides of the upper surface of the slide plate, transmission gears are connected to the tooth plates on both sides through locking teeth, and a protruding block is integrally connected to the upper side of the transmission gear; the installation drive assembly includes a connecting seat, two connecting seats are flatly arranged, and a No. 1 rotating shaft is rotatably installed between the two connecting seats, a number of evenly distributed clamping plates are fixedly connected to the middle part of the upper surface of the No. 1 rotating shaft, and support rods are fixedly provided at both ends of the No. 1 rotating shaft; the lifting packaging assembly includes a worm, the worm is rotatably installed on the upper part of the connecting bracket, one end of the worm is fixedly connected to the No. 2 motor, the No. 2 motor is installed on one side of the upper end of the connecting bracket, and the two ends of the worm are connected to the worm wheel through threaded meshing.

[0007] In some embodiments of the present application, two base plates are arranged in parallel, each base plate has a side plate fixedly connected to the outer side of the upper surface, the upper end of the side plate is fixedly connected to the top plate, and mounting plates are arranged above the top plates on both sides.

[0008] In some embodiments of the present application, a partition is fixedly connected to the middle of the upper surface of the top plate, and a through hole No. 1 is provided near one side of the partition, and the through hole No. 1 is provided on the top plate.

[0009] In some embodiments of the present application, a No. 1 slide groove is provided on both sides of the upper surface of the base plate on both sides, and a clamping transmission assembly is installed in the No. 1 slide groove on both sides. A fixed bracket is installed above the clamping transmission assembly, and a fixed plate is installed in the fixed bracket.

[0010] In some embodiments of the present application, a No. 2 through hole is provided in the middle of the fixing plate, connecting brackets are fixedly connected to both ends of the fixing plate, and a mounting drive assembly is installed between the two sides of the connecting bracket and the side plates.

[0011] In some embodiments of the present application, a lifting packaging component is installed in the second through hole, and exhaust devices are connected to both sides of the lifting packaging component.

[0012] In some embodiments of the present application, a suction cup is installed below the vacuum device, and the suction cup is arranged on the lower surface of the fixing plate.

[0013] In some embodiments of the present application, delivery pipes are connected to both sides of the lifting packaging assembly, and a delivery device is fixedly connected to the other end of the delivery pipe.

[0014] In some embodiments of the present application, a glue storage box is fixedly connected to the lower surface of the conveying device, and the glue storage box is fixedly connected to the upper surface of the base plate.

[0015] In some embodiments of the present application, the connecting seat is fixedly connected to the side plate, and the other end of each support rod is rotatably installed with a connecting sheet metal, and the connecting sheet metal is fixedly connected to the upper surface of the connecting bracket, and the clamping plate is arranged on one side of the partition, and the lower surface of each support rod is fixedly connected to a No. 1 slide rail, and a No. 1 slider is installed in the No. 1 slide rail, and a mounting bracket is rotatably installed on one side of the No. 1 slider, and a No. 1 motor is fixedly connected to the lower surface of the mounting bracket, and the output shaft of the No. 1 motor is fixedly connected to a No. 1 screw rod, and the lower end of the No. 1 screw rod is connected to a matching bracket through threaded engagement, and the lower end of the matching bracket is installed on the No. 2 slide rail, and the No. 2 slide rail is fixedly connected to the upper surface of the base plate.

[0016] In some embodiments of the present application, a transmission plate is rotatably installed on one side of the protruding block, and a connecting piece is rotatably installed on the other end of the transmission plate. Limiting side plates are arranged on both sides of the fixed bracket, and the connecting piece is fixedly connected to one side of the limiting side plate. A No. 2 rotating shaft is fixedly connected to one side of the transmission gear, and a bearing is rotatably installed on the other end of the No. 2 rotating shaft, and the bearing is fixedly connected to the upper surface of the bottom plate. Limiting blocks are fixedly connected on both sides of the upper surface of the slide plate, and the limiting blocks are installed in the No. 1 slide groove.

[0017] In some embodiments of the present application, a rotating rod is provided on the middle fixed sleeve of the worm gear, and the rotating rod is rotatably installed on the inner surface of the connecting bracket, and a No. 2 screw rod is fixedly connected to the lower end of each rotating rod, and a threaded fixing block is rotatably installed on the lower end of the No. 2 screw rod, and a mold is fixedly connected to the inner surfaces of the threaded fixing blocks on both sides, and a No. 2 slide groove is provided on both side surfaces of the mold, and a No. 2 slide groove is installed in the No. 2 slide block, and the No. 2 slide block is fixedly connected to the two side surfaces of the No. 2 through hole, and an air-drying plate is fixedly connected to the upper end of the mold, and mounting holes are provided on both sides of the upper surface of the air-drying plate, and hot air blowers are installed in the mounting holes on both sides, and conveying plates are provided on both sides of the upper end of the mold.

[0018] The beneficial effects of the present application are as follows: starting the installation drive component can drive the connecting bracket and the fixing plate to move up and down. When the connecting bracket and the fixing plate are moved up and down, the clamping transmission component can be started to drive the slide plates on both sides to move along the bottom plate and the No. 1 slider. Then, the clamping transmission component can be used to move the clamping plates on both sides inward, so that the PCB can be clamped and fixed. Then, the vacuum device on the fixing plate can stabilize the PCB board through the suction cup below. Then, the lifting packaging component can drive the mold to be close to the top of the chip. Then, the packaging liquid can be transported to the mold through the conveying pipe and the conveying plate through the conveying device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 is a schematic three-dimensional diagram of the device installation structure according to an embodiment of the present application;

[0021] Figure 2 is a schematic three-dimensional diagram of the overall structure according to an embodiment of the present application;

[0022] Figure 3 is a schematic three-dimensional diagram of a local structure according to an embodiment of the present application;

[0023] Figure 4 is a schematic three-dimensional diagram of another partial structure according to an embodiment of the present application;

[0024] Figure 5 is a schematic three-dimensional diagram of the structure of a clamping transmission assembly according to an embodiment of the present application;

[0025] Figure 6 is a schematic three-dimensional diagram of the cross-sectional structure of a clamping transmission assembly according to an embodiment of the present application;

[0026] Figure 7 is a schematic three-dimensional diagram of the lifting packaging assembly structure according to an embodiment of the present application;

[0027] Figure 8 It is a schematic three-dimensional diagram of the installation drive component structure according to an embodiment of the present application.

[0028] Icons: 1. Side plate; 2. Bottom plate; 3. Top plate; 4. Mounting plate; 5. No. 1 through hole; 6. Partition plate; 7. No. 1 slideway; 8. Clamping transmission assembly; 9. Clamping plate; 10. Fixed bracket; 11. Installing drive assembly; 12. Connecting bracket; 13. Fixed plate; 14. No. 2 through hole; 15. Glue storage box; 16. Conveying device; 17. Conveying pipe; 18. Lifting and packaging assembly; 19. Vacuum device; 20. Suction cup; 101. Support rod; 102. Connecting seat; 103. No. 1 rotating shaft; 104. Card plate; 105. No. 1 slide rail; 106. No. 1 slider; 107. Connecting sheet metal; 108. Mounting bracket; 109. No. 1 No. 1 motor; 110, No. 1 screw rod; 111, matching bracket; 112, No. 2 slide rail; 201, No. 2 motor; 202, worm; 203, worm wheel; 204, rotating rod; 205, No. 2 screw rod; 206, threaded fixing block; 207, air drying plate; 208, mounting hole; 209, hot air blower; 210, mold; 211, No. 2 slide groove; 212, No. 2 slider; 213, conveying plate; 801, slide plate; 802, tooth plate; 803, connecting piece; 804, limit block; 805, transmission gear; 806, protruding block; 807, No. 2 rotating shaft; 808, bearing; 809, transmission plate; 810, limit side plate. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0030] In order to make the purpose, technical solutions and advantages of the implementation methods of this application clearer, the technical solutions in the implementation methods of this application will be clearly and completely described below in conjunction with the drawings in the implementation methods of this application. Obviously, the described implementation methods are part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0037] A semiconductor chip packaging device according to an embodiment of the first aspect of the present application is described below with reference to the accompanying drawings.

[0038] like Figure 1-Figure 8As shown, a semiconductor chip packaging device includes a base plate 2, a clamping transmission component 8, an installation drive component 11 and a lifting packaging component 18, wherein the clamping transmission component 8 includes a slide plate 801, a clamping plate 9 is fixedly connected to the inner side of the lower surface of the slide plate 801, and tooth plates 802 are fixedly connected to both sides of the upper surface of the slide plate 801, and transmission gears 805 are connected to the upper side of the tooth plates 802 by engaging with latches, and a protruding block 806 is integrally connected to one side of the upper side of the transmission gear 805; the installation drive component 11 includes a connecting seat 102, and the connecting seat 102 is flatly provided with two A No. 1 rotating shaft 103 is rotatably installed between the two connecting seats 102, and a number of evenly distributed clamping plates 104 are fixedly connected to the middle of the upper surface of the No. 1 rotating shaft 103, and support rods 101 are fixedly sleeved at both ends of the No. 1 rotating shaft 103; the lifting packaging assembly 18 includes a worm 202, and the worm 202 is rotatably installed on the upper part of the connecting bracket 12, and one end of the worm 202 is fixedly connected to a No. 2 motor 201, and the No. 2 motor 201 is installed on one side of the upper end of the connecting bracket 12, and both ends of the worm 202 are connected to a worm wheel 203 through threaded engagement.

[0039] According to some embodiments of the present application, Figure 1-Figure 4As shown, the bottom plate 2 is provided with two in parallel, each of which is fixedly connected to a side plate 1 on the outer side of the upper surface of the bottom plate 2, and a top plate 3 is fixedly connected to the upper end of the side plate 1, and mounting plates 4 are arranged above the top plates 3 on both sides, and a partition 6 is fixedly connected to the middle part of the upper surface of the top plate 3, and a No. 1 through hole 5 is arranged near the side of the partition 6, and the No. 1 through hole 5 is arranged on the top plate 3, and a No. 1 slide groove 7 is arranged on both sides of the upper surface of the bottom plate 2 on both sides, and a clamping transmission assembly 8 is installed in the No. 1 slide groove 7 on both sides, and a fixing bracket 10 is installed above the clamping transmission assembly 8, and a fixing plate 13 is installed in the fixing bracket 10, and a No. 2 through hole 14 is arranged in the middle of the fixing plate 13, and connecting brackets 12 are fixedly connected to both ends of the fixing plate 13, and a mounting drive assembly 11 is installed between the two sides of the connecting bracket 12 and the side plate 1, and a lifting packaging assembly 18 is installed in the No. 2 through hole 14, and an exhaust device 19 is connected to the two sides of the lifting packaging assembly 18, and a suction cup 20 is installed below the exhaust device 19. The suction cup 20 is arranged on the lower surface of the fixed plate 13, and the two sides of the lifting and packaging component 18 are connected with the conveying pipe 17, and the other end of the conveying pipe 17 is fixedly connected with the conveying device 16. The lower surface of the conveying device 16 is fixedly connected with the glue storage box 15, and the glue storage box 15 is fixedly connected to the upper surface of the bottom plate 2. Starting the installation drive component 11 can drive the connecting bracket 12 and the fixed plate 13 to move up and down. When the connecting bracket 12 and the fixed plate 13 are lifted up and down, the clamping transmission component 8 can be started to drive the slide plates 801 on both sides to move along the bottom plate 2 and the first slider 7, and then the clamping transmission component 8 can be used to move the clamping plates 9 on both sides inward, so that the PCB can be clamped and fixed, and then the suction device 19 on the fixed plate 13 can be used to stabilize the PCB board through the suction cup 20 below, and then the lifting and packaging component 18 can drive the mold 210 to be close to the top of the chip, and then the packaging liquid can be transported to the mold 210 through the conveying pipe 17 and the conveying plate 213 through the conveying device 16.

[0040] According to some embodiments of the present application, Figure 8As shown, the connecting seat 102 is fixedly connected to the side plate 1, and the other end of each support rod 101 is rotatably installed with a connecting sheet metal 107, and the connecting sheet metal 107 is fixedly connected to the upper surface of the connecting bracket 12. The clamping plate 104 is arranged on one side of the partition 6. The lower surface of each support rod 101 is fixedly connected to a No. 1 slide rail 105, and a No. 1 slider 106 is installed in the No. 1 slide rail 105. A mounting bracket 108 is rotatably installed on one side of the No. 1 slider 106. The lower surface of the mounting bracket 108 is fixedly connected to a No. 1 motor 109, and the output shaft of the No. 1 motor 109 is fixedly connected to a No. 1 screw rod 110. The lower end of the No. 1 screw rod 110 is connected to a matching bracket 111 through threaded engagement. The matching bracket 1 The lower end of 11 is installed on the No. 2 slide rail 112, and the No. 2 slide rail 112 is fixedly connected to the upper surface of the base plate 2. The No. 1 motor 109 can drive the No. 1 screw rod 110 to rotate. Since the No. 1 screw rod 110 is connected to the matching bracket 111 through threaded engagement, it is installed on the No. 2 slide rail 112 through the matching bracket 111, and since the No. 1 motor 109 is installed in the No. 1 slide rail 105 through the mounting bracket 108 and the No. 1 slider 106, by adjusting the distance between the support rods 101, the support rod 101 can be pushed to rotate around the No. 1 rotating shaft 103 as the center, which can drive the No. 1 rotating shaft 103 to rotate, and the middle part of the No. 1 rotating shaft 103 can drive the card plate 104 to embed into the partition plate 6, thereby fixing the mounting plate 4 in the top plate 3.

[0041] According to some embodiments of the present application, Figure 5-Figure 6 As shown, a transmission plate 809 is rotatably mounted on one side of the protruding block 806, and a connecting member 803 is rotatably mounted on the other end of the transmission plate 809. Limiting side plates 810 are arranged on both sides of the fixed bracket 10, and the connecting member 803 is fixedly connected to one side of the limiting side plate 810. A second rotating shaft 807 is fixedly connected to one side of the transmission gear 805, and a bearing 808 is rotatably mounted on the other end of the second rotating shaft 807. The bearing 808 is fixedly connected to the upper surface of the bottom plate 2, and the slide plate 801 Limit blocks 804 are fixedly connected on both sides of the upper surface, and the limit blocks 804 are installed in the No. 1 slide groove 7. When the fixed bracket 10 is lifted up and down, the transmission gear 805 and the protruding block 806 can be pushed to rotate with the No. 2 rotating shaft 807 through the transmission plate 809. Since the transmission gear 805 is connected to the tooth plate 802 through the engagement of the latch teeth, the slide plate 801 can be pushed to move along the bottom plate 2, and then move inward through the clamping plate 9 on the inner side of the lower surface of the slide plate 801, so as to clamp and fix the PCB board.

[0042] According to some embodiments of the present application, Figure 7As shown, a rotating rod 204 is fixedly sleeved in the middle of the worm gear 203, and the rotating rod 204 is rotatably mounted on the inner surface of the connecting bracket 12. A No. 2 screw rod 205 is fixedly connected to the lower end of each rotating rod 204, and a threaded fixing block 206 is rotatably mounted on the lower end of the No. 2 screw rod 205. A mold 210 is fixedly connected to the inner surfaces of the threaded fixing blocks 206 on both sides. A No. 2 slide groove 211 is arranged on both sides of the mold 210, and a No. 2 slider 212 is installed in the No. 2 slide groove 211. The No. 2 slider 212 is fixedly connected to the surfaces on both sides of the No. 2 through hole 14, and an air-drying plate 207 is fixedly connected to the upper end of the mold 210. The upper surface of the air-drying plate 207 Mounting holes 208 are provided on both sides of the surface, and hot air blowers 209 are installed in the mounting holes 208 on both sides. Conveying plates 213 are provided on both sides of the upper end of the mold 210. The worm 202 is driven to rotate by the No. 2 motor 201. Since the worm 202 is connected to the worm wheel 203 through threaded engagement, the worm wheel 203 can be driven to rotate. Then, a No. 2 screw rod 205 is fixedly connected to the lower end of the rotating rod 204, and the No. 2 screw rod 205 is connected to the threaded fixing block 206 through threaded engagement, thereby driving the No. 2 slide grooves 211 on both sides of the mold 210 to move along the No. 2 slide grooves 212, so that the mold 210 moves up and down, and then cooperates with the hot air blower 209 to dry the packaging liquid.

[0043] The working principle of this embodiment is:

[0044] First, when the fixed bracket 10 is lifted up and down, the transmission plate 809 can push the transmission gear 805 and the protruding block 806 to rotate with the second rotating shaft 807. Since the transmission gear 805 is connected to the tooth plate 802 through the engagement of the latch teeth, the slide plate 801 can be pushed to move along the bottom plate 2, and then the clamping plate 9 on the inner side of the lower surface of the slide plate 801 moves inward, so as to clamp and fix the PCB board, and the worm 202 is driven to rotate by the second motor 201. Since the worm 202 is connected to the worm wheel 203 through threaded engagement, the worm wheel 203 can be driven to rotate, and then the second screw rod 205 is fixedly connected to the lower end of the rotating rod 204, and the second screw rod 205 is connected to the threaded fixing block 206 through threaded engagement, thereby driving the second slide grooves 2 on both sides of the mold 210. 11 moves along the No. 2 slide groove 212, so that the mold 210 moves up and down, and then cooperates with the hot air blower 209 to dry the packaging liquid. The No. 1 motor 109 can drive the No. 1 screw rod 110 to rotate. Since the No. 1 screw rod 110 is connected to the matching bracket 111 through threaded engagement, it is installed on the No. 2 slide rail 112 through the matching bracket 111, and since the No. 1 motor 109 is installed in the No. 1 slide rail 105 through the mounting bracket 108 and the No. 1 slider 106, by adjusting the distance between the support rods 101, the support rod 101 can be pushed to rotate around the No. 1 rotating shaft 103 as the center, which can drive the No. 1 rotating shaft 103 to rotate, and the middle part of the No. 1 rotating shaft 103 can drive the card plate 104 to be embedded in the partition plate 6, thereby fixing the mounting plate 4 in the top plate 3.

[0045] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0046] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0047] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A semiconductor chip packaging device, comprising a base plate (2), a clamping transmission assembly (8), a mounting drive assembly (11) and a lifting packaging assembly (18), characterized in that: The clamping transmission assembly (8) comprises a slide plate (801), a clamp plate (9) is fixedly connected to the inner side of the lower surface of the slide plate (801), tooth plates (802) are fixedly connected to both sides of the upper surface of the slide plate (801), transmission gears (805) are connected above the tooth plates (802) on both sides through tooth meshing, and a protruding block (806) is integrally connected to one side above the transmission gear (805); The installation drive assembly (11) comprises a connecting seat (102), two connecting seats (102) are arranged horizontally, a first rotating shaft (103) is rotatably mounted between the two connecting seats (102), a plurality of evenly distributed clamping plates (104) are fixedly connected to the middle of the upper surface of the first rotating shaft (103), and support rods (101) are fixedly sleeved at both ends of the first rotating shaft (103); The lifting packaging assembly (18) comprises a worm (202), the worm (202) being rotatably mounted on the upper part of the connecting bracket (12), one end of the worm (202) being fixedly connected to a second motor (201), the second motor (201) being mounted on one side of the upper end of the connecting bracket (12), and both ends of the worm (202) being connected to a worm wheel (203) via threaded engagement.

2. The semiconductor chip packaging device according to claim 1, characterized in that: Two bottom plates (2) are arranged in parallel, and a side plate (1) is fixedly connected to the outer side of the upper surface of each bottom plate (2), and a top plate (3) is fixedly connected to the upper end of the side plate (1), and mounting plates (4) are arranged above the top plates (3) on both sides.

3. The semiconductor chip packaging device according to claim 2, characterized in that: A partition plate (6) is fixedly connected to the middle of the upper surface of the top plate (3), and a first through hole (5) is provided on a side close to the partition plate (6), and the first through hole (5) is provided on the top plate (3).

4. The semiconductor chip packaging device according to claim 3, characterized in that: A No. 1 slide groove (7) is provided on both sides of the upper surface of the base plate (2) on both sides, a clamping transmission assembly (8) is installed in the No. 1 slide groove (7) on both sides, a fixed bracket (10) is installed above the clamping transmission assembly (8), and a fixed plate (13) is installed in the fixed bracket (10).

5. The semiconductor chip packaging device according to claim 4, characterized in that: A second through hole (14) is provided in the middle of the fixing plate (13), and connecting brackets (12) are fixedly connected at both ends of the fixing plate (13), and a mounting drive assembly (11) is installed between the two sides of the connecting bracket (12) and the side plate (1).

6. The semiconductor chip packaging device according to claim 5, characterized in that: A lifting and lowering packaging component (18) is installed in the second through hole (14), and exhaust devices (19) are connected to both sides of the lifting and lowering packaging component (18).

7. The semiconductor chip packaging device according to claim 6, characterized in that: A suction cup (20) is installed below the air extraction device (19), and the suction cup (20) is arranged on the lower surface of the fixing plate (13).

8. The semiconductor chip packaging device according to claim 7, characterized in that: The two sides of the lifting packaging assembly (18) are connected to a delivery pipe (17), and the other end of the delivery pipe (17) is fixedly connected to a delivery device (16).

9. The semiconductor chip packaging device according to claim 8, characterized in that: The lower surface of the conveying device (16) is fixedly connected to a glue storage box (15), and the glue storage box (15) is fixedly connected to the upper surface of the bottom plate (2).

10. The semiconductor chip packaging device according to claim 1, characterized in that: The connecting seat (102) is fixedly connected to the side plate (1); a connecting sheet metal (107) is rotatably mounted on the other end of each supporting rod (101); the connecting sheet metal (107) is fixedly connected to the upper surface of the connecting bracket (12); the clamping plate (104) is arranged on one side of the partition (6); a first slide rail (105) is fixedly connected to the lower surface of each supporting rod (101); a first slider (106) is installed in the first slide rail (105); the first slider (106) is fixedly connected to the lower surface of the supporting rod (101); 06) A mounting bracket (108) is rotatably mounted on one side, a No. 1 motor (109) is fixedly connected to the lower surface of the mounting bracket (108), an No. 1 screw rod (110) is fixedly connected to the output shaft of the No. 1 motor (109), a No. 1 screw rod (110) is connected to a matching bracket (111) at the lower end through threaded engagement, a No. 2 slide rail (112) is mounted at the lower end of the matching bracket (111), and the No. 2 slide rail (112) is fixedly connected to the upper surface of the bottom plate (2).

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