Electrical connection device

Abstract

The invention provides an electrical connection device capable of measuring characteristics of an inspection object with high precision. An electrical connection device (1) is provided with a probe (10) as an inspection terminal, a wiring board (20), a wiring sheet (30), and a printed circuit board (40). The wiring substrate (20) includes first electrodes (21) connected to each of the probes (10), and second electrodes (22) electrically connected to each of the first electrodes (21). The wiring sheet (30) has a first connection part (31) disposed on the first main surface, a second connection part (32) disposed on a second main surface facing the first main surface, and an internal circuit electrically connected to the first connection part (31). The wiring sheet (30) is laminated on the wiring substrate (20) such that the first connection part (31) is connected to the second electrode (22). The printed circuit board (40) is disposed so as to face the wiring substrate (20) with the wiring sheet (30) interposed therebetween, and is provided with a wiring pattern (400) connected to the second connection part (32). The electrical connection device is configured so that the wiring sheet (30) can be attached and detached between the wiring substrate (20) and the printed circuit board (40).

Description

Technical Field

[0001] The present invention relates to an electrical connection device used for inspecting electrical characteristics of an inspection object. Background Art

[0002] In order to measure the electrical characteristics of an inspection object such as an integrated circuit, an electrical connection device having inspection terminals that contact the inspection object is used. In the measurement using the electrical connection device, the inspection object is electrically connected to an inspection device such as a tester via the inspection terminals.

[0003] In order to measure various characteristics of the inspection object, the electrical connection device needs to have various structures corresponding to the measurement. For example, the inspection performed by transmitting an electrical signal between the inspection object and the inspection device uses an electrical connection device including a circuit that electrically connects the inspection object and the inspection device. In addition, the inspection of inputting a signal output from the output terminal of the inspection object to the input terminal of the inspection object uses an electrical connection device including a circuit that electrically connects the output terminal and the input terminal of the inspection object. In order to perform these measurements, a structure in which a relay element that switches the circuit is configured in the electrical connection device is studied.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Korean Patent Publication No. 10-2020-0063009 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] By ensuring high quality such as reducing loss and noise of an electrical signal transmitted in an electrical connection device, the characteristics of an inspection object can be measured with high accuracy. An object of the present invention is to provide an electrical connection device capable of measuring the characteristics of an inspection object with high accuracy.

[0009] Solutions for solving problems

[0010] An electrical connection device according to a technical solution of the present invention comprises an inspection terminal, a wiring substrate, a wiring sheet, and a printed circuit board. The wiring substrate comprises a first electrode respectively connected to any one of a plurality of inspection terminals and a second electrode respectively electrically connected to any one of the first electrodes. The wiring sheet comprises a first connection portion arranged on a first main surface, a second connection portion arranged on a second main surface opposite to the first main surface, and an internal circuit electrically connected to the first connection portion, and the wiring sheet is stacked on the wiring substrate in such a manner that the first connection portion is connected to the second electrode. The printed circuit board is arranged opposite to the wiring substrate via the wiring sheet, and is provided with a wiring pattern connected to the second connection portion. The electrical connection device is configured to be able to install and remove the wiring sheet between the wiring substrate and the printed circuit board.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to provide an electrical connection device capable of measuring the characteristics of an inspection object with high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram showing the structure of the electrical connecting device according to the embodiment.

[0014] Figure 2A It is a schematic plan view showing the structure of the electrical connecting device according to the embodiment.

[0015] Figure 2B It is a schematic cross-sectional view showing the structure of the electrical connecting device according to the embodiment.

[0016] Figure 3 It is a schematic cross-sectional view showing an example of the structure of a wiring sheet of the electrical connecting device according to the embodiment.

[0017] Figure 4 It is a schematic diagram showing an example of an internal circuit of a wiring sheet of the electrical connection device according to the embodiment.

[0018] Figure 5 This is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0019] Figure 6 This is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0020] Figure 7 It is shown that the use Figure 6 A schematic diagram of an example of a loopback circuit for a wiring sheet is shown.

[0021] Figure 8 This is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0022] Fig. 9This is a schematic diagram showing another example of the internal circuit of the wiring sheet of the electrical connection device according to the embodiment.

[0023] Fig.10 This is a schematic diagram showing an example of an internal circuit of a wiring sheet of an electrical connection device according to another embodiment.

[0024] Description of Reference Numerals

[0025] 1. Electrical connection device; 2. Inspection object; 10. Probe; 20. Wiring substrate; 21. First electrode; 22. Second electrode; 30. Wiring sheet; 31. First connection portion; 32. Second connection portion; 34. Capacitor; 40. Printed circuit board; 41. First end portion; 42. Second end portion; 200. Connecting wiring; 301. Cover film; 302. Conductive film; 303. Insulating film; 331. Short-circuit wiring; 332. Matching circuit; 333. Loopback wiring; 334. Relay circuit; 400. Wiring pattern. DETAILED DESCRIPTION

[0026] Next, embodiments of the present invention will be described with reference to the accompanying drawings. In the following description of the accompanying drawings, identical or similar reference numerals are used for identical or similar parts. However, it should be noted that the accompanying drawings are schematic, and the ratio of the thickness of each part is different from the actual situation. In addition, the accompanying drawings also naturally include parts with different dimensional relationships and ratios. The embodiments shown below are examples of devices and methods for concretizing the technical ideas of the present invention. The materials, shapes, structures, and configurations of the structural components in the embodiments of the present invention are not specific to the following contents.

[0027] Figure 1 The electrical connection device 1 of the illustrated embodiment is used for inspecting an inspection object 2. The electrical connection device 1 includes: a plurality of probes 10 that are in contact with the inspection object 2 during the inspection of the inspection object 2; a wiring substrate 20 that is connected to the probes 10; a wiring sheet 30 that is stacked on the wiring substrate 20; and a printed circuit board 40 that is stacked on the wiring sheet 30. The plurality of probes 10 function as a plurality of inspection terminals that electrically connect the inspection object 2 and the inspection device. Figure 1 The electrical connection device 1 shown further includes a reinforcing member 50 laminated on the printed circuit board 40. In the following description, the direction in which the electrical connection device 1 is located when viewed from the inspection object 2 is referred to as an upward direction, and the direction in which the inspection object 2 is located when viewed from the electrical connection device 1 is referred to as a downward direction. In addition, in each structural component of the electrical connection device 1, the surface facing the upward direction is also referred to as an upper surface, and the surface facing the downward direction is also referred to as a lower surface.

[0028] The inspection object 2 is mounted on the table 3. The electrical connection device 1 and the table 3 can move relative to each other in the vertical direction. When inspecting the inspection object 2, the interval between the electrical connection device 1 and the table 3 is narrowed, and one end of the probe 10 (hereinafter also referred to as "front end") contacts a signal terminal (not shown) of the inspection object 2. Figure 1 The state where the probe 10 and the inspection object 2 are separated is shown. The probe 10 may also be supported by a probe head 60 through which the probe 10 passes. The probe head 60 may also be a housing having a space inside. The probe head 60 is fixed to the wiring substrate 20, for example. The other end of the probe 10 connected to the front end (hereinafter also referred to as the "base end") is connected to the wiring substrate 20.

[0029] The wiring substrate 20 includes a plurality of first electrodes 21 electrically connected to the base end of any one of the plurality of probes 10, and a plurality of second electrodes 22 electrically connected to any one of the first electrodes 21. The second electrodes 22 are electrically connected to the first electrodes 21 via a connection wiring 200. The connection wiring 200 may be, for example, an internal wiring arranged inside the wiring substrate 20. The wiring substrate 20 may also use a multilayer wiring substrate such as MLO (Multi-Layer Organic) or MLC (Multi-Layer Ceramic).

[0030] The wiring sheet 30 has a first connection portion 31 disposed on a first main surface and a second connection portion 32 disposed on a second main surface opposite to the first main surface. The first main surface of the wiring sheet 30 is the lower surface of the wiring sheet 30 opposite to the wiring substrate 20. The second main surface of the wiring sheet 30 is the upper surface of the wiring sheet 30 opposite to the printed circuit board 40. The wiring sheet 30 is stacked on the wiring substrate 20 in such a manner that the first connection portion 31 is connected to the second electrode 22 of the wiring substrate 20. The wiring sheet 30 includes an internal circuit electrically connected to the first connection portion 31 inside between the first main surface and the second main surface. Figure 1 The internal circuit is omitted in the illustration.

[0031] The printed circuit board 40 is arranged opposite to the wiring substrate 20 via the wiring sheet 30. The printed circuit board 40 includes a wiring pattern 400 that electrically connects the second connection portion 32 of the wiring sheet 30 and the inspection device. For example, the first end 41 of the wiring pattern 400 arranged inside and on the surface of the printed circuit board 40 is connected to the second connection portion 32 of the wiring sheet 30, and the second end 42 of the wiring pattern 400 is electrically connected to the inspection device (not shown). The first end 41 is arranged on the lower surface of the printed circuit board 40, and the second end 42 is arranged on the upper surface of the printed circuit board 40.

[0032] The wiring sheet 30 may also be selected from a plurality of wiring sheet candidates included in a wiring sheet group which will be described in detail later. The wiring sheet candidates each have a first connection portion 31 disposed on the first main surface, a second connection portion 32 disposed on the second main surface, and an internal circuit electrically connected to the first connection portion 31. Each wiring sheet candidate included in the wiring sheet group may internally include an internal circuit having a different structure from that of other wiring sheet candidates. One wiring sheet 30 selected from a plurality of wiring sheet candidates included in the wiring sheet group is stacked on the wiring substrate 20 in such a manner that the first connection portion 31 is connected to the second electrode 22 of the wiring substrate 20.

[0033] The electrical connection device 1 is configured to be able to attach and detach the wiring sheet 30 between the wiring substrate 20 and the printed circuit board 40. For example, the wiring sheet 30 can be attached and detached between the wiring substrate 20 and the printed circuit board 40 to replace the wiring sheet 30 stacked on the wiring substrate 20 with another wiring sheet candidate.

[0034] For example, the wiring substrate 20 may be a space transformer that expands the interval between the base ends of the probes 10 to the interval between the first ends 41 of the printed circuit board 40 when viewed from the normal direction of the main surface of the wiring substrate 20. By setting the wiring substrate 20 as a space transformer, the base ends of the probes 10 corresponding to the interval between the signal terminals arranged on the inspection object 2 can be electrically connected to the wiring pattern 400 of the printed circuit board 40 arranged at a wider interval than the interval between the base ends. As a result, the electrical connection between the wiring pattern 400 of the printed circuit board 40 and the inspection device is easier.

[0035] You can also Figure 1 As shown, a reinforcing member 50 is laminated on the printed circuit board 40. The reinforcing member 50 has a higher rigidity than the printed circuit board 40, and ensures the mechanical strength of the electrical connection device 1 in a manner such that the printed circuit board 40 does not bend. In addition, the reinforcing member 50 can be used as a support body for fixing various structural components of the electrical connection device 1. The reinforcing member 50 can also be fixed to the printed circuit board 40 using screws, for example.

[0036] Figure 2A This is a top view of the structure in which the wiring substrate 20, the wiring sheet 30, the printed circuit board 40, and the reinforcement 50 are stacked, as viewed from the Z direction (hereinafter also referred to as a "top view"). Figure 2A In the figure, the Z direction is the depth direction of the paper, the X direction is the left-right direction of the paper, and the Y direction is the up-down direction of the paper. Figure 2B This is a cross-sectional view of the side surface viewed from the Y direction of the XY plane perpendicular to the Z direction.

[0037] A reinforcing member 50 is disposed on the upper surface of the printed circuit board 40 which is circular in plan view. The reinforcing member 50 has, for example, Figure 2AThe printed circuit board 40 is a shape formed by connecting the outer circular ring and the inner rectangular ring by spokes. The wiring substrate 20 and the wiring sheet 30 are arranged near the center of the lower surface of the printed circuit board 40. The wiring substrate 20, the wiring sheet 30, the printed circuit board 40 and the reinforcement 50 are fixed to each other by screws, for example. Figure 2B An example is shown in which the wiring substrate 20 , the wiring sheet 30 , and the printed circuit board 40 are joined together using screws 70 .

[0038] In the electrical connection device 1, the wiring sheet 30 can be installed and removed between the wiring substrate 20 and the printed circuit board 40, so that the wiring sheet 30 can be replaced with another wiring sheet candidate included in the wiring sheet group. For example, after the wiring substrate 20 is removed from the wiring sheet 30, the wiring sheet 30 is removed from the printed circuit board 40. Then, a new wiring sheet 30 selected from the wiring sheet candidates is installed on the printed circuit board 40. Thereafter, the wiring substrate 20 is installed on the wiring sheet 30.

[0039] The wiring sheet 30 may have a structure in which a conductive film and an insulating film are stacked. For example, an internal circuit may be formed by a conductive pattern formed on a conductive film. Figure 3 An example of the structure of the wiring sheet 30 is shown. Figure 3 The wiring sheet 30 shown has a structure in which a stack of a conductive film 302 and an insulating film 303 is sandwiched by a pair of covering films 301 of insulating materials. The number of stacks of conductive films 302 and insulating films 303 can be set arbitrarily. The conductive film 302 can also be a metal material such as copper foil. The insulating film 303 can also be an insulating material such as a polyimide sheet. The covering film 301 can also be an insulating material such as a solder resist. The conductive film 302, the insulating film 303 and the covering film 301 can also be bonded to each other using, for example, an adhesive. In addition, the wiring sheet 30 can also be a structure in which a film of insulating material (also called a "base film") is sandwiched between the stack of conductive films 302 and insulating films 303.

[0040] Hereinafter, an example of the configuration of wiring sheet candidates included in the wiring sheet group will be described. Hereinafter, wiring sheet candidates will be referred to as wiring sheets 30 when not being individually limited.

[0041] Alternatively, the internal circuit of any one of the wiring sheets 30 included in the wiring sheet group may include a circuit (hereinafter also referred to as a "relay circuit") that electrically connects the first connection portion 31 and the second connection portion 32. Figure 3 When the wiring sheet 30 having the structure shown forms a relay circuit, wiring is formed from the first main surface to the second main surface of the wiring sheet 30 through the cover film 301 , the conductive film 302 , and the insulating film 303 .

[0042] When the internal circuit of the wiring sheet 30 includes a relay circuit, Figure 4 As shown, the internal circuit of the wiring sheet 30 includes a circuit for short-circuiting the first connection portion 31 and the second connection portion 32 . Figure 4 In the internal circuit of the wiring sheet 30 shown, the first connection portion 31 and the second connection portion 32 are electrically short-circuited by the short-circuit wiring 331 .

[0043] By installing the electrical connection device 1 Figure 4 The wiring sheet 30 shown in the figure is used to short-circuit the probe 10 and the wiring pattern 400 of the printed circuit board 40 by means of the internal circuit of the wiring sheet 30. As a result, the inspection object 2 and the inspection device are electrically connected. Thus, an electrical signal is transmitted between the inspection device such as an IC tester and the inspection object 2, and the characteristics of the inspection object 2 are measured. For example, the first connection part 31 and the second connection part 32 are connected one-to-one by means of the internal circuit of the wiring sheet 30. Alternatively, by means of the internal circuit, one first connection part 31 can be connected to multiple second connection parts 32, or multiple first connection parts 31 can be connected to one second connection part 32.

[0044] When the internal circuit of the wiring sheet 30 includes a relay circuit, the internal circuit may also be Figure 5 The matching circuit 332 shown includes a first terminal connected to the first connection portion 31 and a second terminal connected to the second connection portion 32. The matching circuit 332 may be a circuit for achieving impedance matching between the first connection portion 31 and the second connection portion 32. For example, the matching circuit 332 may include a π-type filter.

[0045] The internal circuit of the wiring sheet 30 may also include a circuit that electrically connects one of the first connecting portions 31 to the other of the first connecting portions 31. In other words, the internal circuit of the wiring sheet 30 may also include a circuit that electrically connects the output terminal and the input terminal of the inspection object 2 (hereinafter also referred to as a "loopback circuit"). The two signal terminals of the inspection object 2 are electrically connected by the loopback circuit.

[0046] It can also be, for example, Figure 6 As shown, the internal circuit of the wiring sheet 30 includes a circuit that short-circuits one of the first connection portions 31 and the other of the first connection portions 31 . Figure 6 The internal circuit of the wiring sheet 30 shown in the figure electrically short-circuits one first connection portion 31 and another first connection portion 31 by using the loopback wiring 333. Figure 6 The wiring sheet 30 shown is formed so that one of the probes 10 and the other of the probes 10 are short-circuited via the internal circuit of the wiring sheet 30. As a result, one signal terminal and the other signal terminal of the inspection target 2 are electrically connected.

[0047] Figure 7The structure in which the first signal terminal 2A of the inspection object 2 contacted by one of the probes 10 and the second signal terminal 2B of the inspection object 2 contacted by the other of the probes 10 are electrically connected via the loopback wiring 333 of the wiring sheet 30 is shown. For example, when the inspection object 2 is a receiving circuit, and the first signal terminal 2A is the output terminal of the inspection object 2, and the second signal terminal 2B is the input terminal of the inspection object 2, a transmission test can be performed by returning the output from the inspection object 2 to the input. That is, even if there is no device to be transmitted, it is possible to test whether the output part and the input part of the inspection object 2 function normally. For example, as an inspection of the receiving circuit in accordance with the jitter tolerance test, the output signal output from the first signal terminal 2A (output terminal) can also be input as an input signal to the second signal terminal 2B (input terminal) to check whether the specified error rate is ensured.

[0048] When the internal circuit of the wiring sheet 30 includes a loopback circuit, Figure 8 As shown, the internal circuit includes a circuit including a capacitor 34 connected in series between one of the first connection parts 31 and the other of the first connection parts 31. One terminal of the capacitor 34 is connected to one of the first connection parts 31, and the other terminal of the capacitor 34 is connected to the other of the first connection parts 31. The capacitor 34 can use a capacitor formed by a semiconductor manufacturing process (hereinafter also referred to as a "process capacitor") or the like.

[0049] Furthermore, the internal circuit of the wiring sheet 30 may include a relay circuit that switches so as to electrically connect one of the first connection parts 31 to either one of the second connection parts 32 and the other of the first connection parts 31. Fig. 9 The internal circuit shown includes a relay circuit 334 that constitutes either a relay circuit that connects the first connection portion 31 and the second connection portion 32 and a loopback circuit that connects the first connection portions 31 to each other.

[0050] exist Fig. 9 In the case where the relay circuit 334 shown constitutes a relay circuit, the first contact terminal 334a is connected to the second contact terminal 334b, and the third contact terminal 334c is connected to the fourth contact terminal 334d. Thus, the first connection portion 31 and the second connection portion 32 are electrically connected. In the case where the relay circuit 334 constitutes a loopback circuit, the first contact terminal 334a of the relay circuit 334 is connected to the common contact terminal 334e, and the third contact terminal 334c is connected to the common contact terminal 334e. Thus, one of the first connection portions 31 is electrically connected to the other of the first connection portions 31.

[0051] Reference Figures 4 to 9 The example of the internal circuit of the wiring sheet 30 has been described, but the structure of the internal circuit is of course not limited to the above. For example, the internal circuit may include an inductor instead of Figure 8 The capacitor 34 shown may be an internal circuit including either a capacitor or an inductor. In other words, the internal circuit of the wiring sheet 30 may include a passive circuit including any element. In addition, the internal circuit may include a switching circuit using a diode or the like instead of Fig. 9 Relay circuit 334 is shown.

[0052] The elements included in the internal circuit of the wiring sheet 30 may be formed by, for example, a MEMS (Micro Electro Mechanical Systems) process. By using the MEMS process, miniaturized elements can be formed integrally with the wiring sheet 30 .

[0053] As mentioned above, according to Figure 1 The electrical connection device 1 shown in the figure can realize, for example, Figures 4 to 9 Therefore, the electrical connection device 1 can be used to perform a variety of measurements on the inspection object 2. For example, a DC test can be performed on the inspection object 2 by mounting a wiring sheet 30 including an internal circuit that short-circuits the first connection portion 31 and the second connection portion 32 on the electrical connection device 1. In addition, a high-frequency test can be performed on the inspection object 2 by mounting a wiring sheet 30 including an internal circuit that includes a matching circuit or a loopback circuit on the electrical connection device 1.

[0054] Furthermore, according to the electrical connection device 1, by Fig. 9 By arranging the relay circuit 334 on the wiring sheet 30 as shown, the wiring length of the relay circuit and the loopback circuit can be shortened compared to the case where the relay element is arranged on the printed circuit board 40. Thus, according to the electrical connection device 1, the transmission path of the electrical signal can be shortened to suppress the loss and noise of the electrical signal.

[0055] In addition, the electrical connection device 1 is used, by Figure 5 As shown, by arranging the matching circuit 332 on the wiring sheet 30, it is possible to shorten the wiring connected to the matching circuit 332. For example, since the matching circuit 332 can be arranged close to the wiring for which impedance matching is to be achieved, impedance matching can be performed efficiently.

[0056] In addition, the stage 3 becomes a heat generation source during the measurement of the inspection object 2. Therefore, the ambient temperature of the lower surface of the wiring substrate 20 facing the stage 3 is higher than the temperature of other areas. Therefore, by arranging the wiring sheet 30 on the upper surface of the wiring substrate 20, the increase in the ambient temperature of the electronic components constituting the internal circuit of the wiring sheet 30 can be suppressed compared with the case where the electronic components are arranged on the lower surface of the wiring substrate 20. As a result, the electronic components function at an ambient temperature that does not exceed the allowable temperature, and the inspection object 2 can be accurately measured.

[0057] As described above, the electrical connection device 1 of the embodiment has a structure in which the wiring sheet 30 including an internal circuit that can constitute an arbitrary circuit is detachably disposed between the wiring substrate 20 and the printed circuit board 40. The electrical connection device 1 can measure the characteristics of the inspection object 2 with high accuracy.

[0058] (Other Embodiments)

[0059] As described above, the present invention is described by the embodiments, but it should not be understood that the discussion and drawings constituting a part of the present disclosure limit the present invention. For those skilled in the art, various alternative embodiments, examples and application techniques are obvious based on the present disclosure.

[0060] For example, the wiring sheet 30 may also include an internal circuit in which a plurality of types of circuit structures are mixed. For example, the wiring sheet 30 may also include an internal circuit in which a short-circuit wiring 331 and a matching circuit 332 are mixed. Alternatively, the wiring sheet 30 may also include an internal circuit in which a relay circuit and a loopback circuit are mixed. For example, the internal circuit may include a short-circuit wiring 331, a matching circuit 332, and a loopback wiring 333, and may also include a relay circuit 334. In addition, the loopback circuit may also include a matching circuit 332. Fig.10 3 shows an example of an internal circuit including a short-circuit wiring 331, a matching circuit 332, and a loopback wiring 333. In this way, any circuit can be configured in the internal circuit of the wiring sheet 30.

[0061] As described above, by mounting the wiring sheet 30 including the internal circuit in which arbitrary circuit structures are mixed on the electrical connection device 1 , it is possible to perform a plurality of types of measurements on the inspection object 2 using one wiring sheet 30 .

[0062] In addition, Figure 1 FIG. 2 shows a case where the electrical connection device 1 equipped with the wiring sheet 30 includes the probe 10 that contacts the signal terminal of the inspection object 2. Figure 1The electrical connection device 1 shown in the figure can measure the electrical characteristics of the inspection object 2 in a state where it is not separated from the wafer or in a chip state. On the other hand, the wiring sheet 30 can be mounted on the electrical connection device including the test socket in correspondence with the measurement of the electrical characteristics in a state where the inspection object 2 is mounted in a package or the like. For example, it is also possible to replace Figure 1 The probe 10 of the electrical connection device 1 shown in the figure is provided with a test socket on the wiring substrate 20 , and the test socket is provided with a test terminal connectable to an external terminal of a package on which the test object 2 is mounted.

[0063] In the electrical connection device including the test socket, by simply replacing the wiring sheet 30, it is possible to realize, for example, Figures 4 to 10 In addition, by configuring the matching circuit 332 on the wiring sheet 30, the wiring connected to the matching circuit 332 can be shortened, or by configuring the relay circuit 334 on the wiring sheet 30, the wiring length of the relay circuit and the loopback circuit can be shortened. Therefore, in the electrical connection device including the test socket, the characteristics of the inspection object 2 can be measured with high accuracy, similarly to the electrical connection device 1 including the probe 10 described above.

[0064] As described above, the present invention naturally includes various embodiments not described above, etc. Therefore, the protection scope of the present invention is determined only by the invention specific matters according to the appropriate claims derived from the above description.

Claims

1. An electrical connection device used for inspecting an object to be inspected, wherein: The electrical connection device comprises: a plurality of inspection terminals in contact with the inspection object; a wiring substrate including a plurality of first electrodes respectively connected to any one of the inspection terminals and a plurality of second electrodes respectively electrically connected to any one of the first electrodes; a wiring sheet having a first connection portion disposed on a first main surface, a second connection portion disposed on a second main surface opposite to the first main surface, and an internal circuit electrically connected to the first connection portion, the wiring sheet being stacked on the wiring substrate in such a manner that the first connection portion is connected to the second electrode; and a printed circuit board disposed opposite to the wiring substrate via the wiring sheet, and having a wiring pattern connected to the second connecting portion, The electrical connection device is configured such that the wiring sheet can be attached and detached between the wiring substrate and the printed circuit board.

2. The electrical connection device according to claim 1, wherein: The wiring sheet is selected from a wiring sheet group including a plurality of wiring sheet candidates each having the first connection portion, the second connection portion, and the internal circuit. The wiring sheet candidates included in the wiring sheet group each include an internal circuit having a structure different from that of the other wiring sheet candidates. The electrical connection device is configured to be able to attach and detach the wiring sheet between the wiring substrate and the printed circuit board so as to replace the wiring sheet stacked on the wiring substrate with another candidate wiring sheet.

3. The electrical connection device according to claim 1, wherein: The wiring sheet has a structure in which a laminated body of a conductive film and an insulating film is sandwiched between cover films of insulating material.

4. The electrical connection device according to any one of claims 1 to 3, wherein: The internal circuit of the wiring sheet includes a circuit that electrically connects the first connection portion and the second connection portion.

5. The electrical connection device according to claim 4, wherein: The internal circuit of the wiring sheet includes a circuit for short-circuiting the first connection portion and the second connection portion.

6. The electrical connection device according to claim 4, wherein: The internal circuit of the wiring sheet includes a matching circuit, a first terminal of the matching circuit is connected to the first connection portion, a second terminal of the matching circuit is connected to the second connection portion, and the matching circuit achieves impedance matching between the first connection portion and the second connection portion.

7. The electrical connection device according to any one of claims 1 to 3, wherein: The internal circuit of the wiring sheet includes a circuit that electrically connects one of the first connecting portions and the other of the first connecting portions.

8. The electrical connection device according to claim 7, wherein: The internal circuit of the wiring sheet includes a circuit that short-circuits one of the first connection portions and the other of the first connection portions.

9. The electrical connection device according to claim 7, wherein: The internal circuit of the wiring sheet includes a capacitor connected in series between one of the first connecting portions and the other of the first connecting portions.

10. The electrical connection device according to any one of claims 1 to 3, wherein: The internal circuit of the wiring sheet includes a relay circuit that switches so as to electrically connect one of the first connection portions to either one of the second connection portions and the other of the first connection portions.

11. The electrical connection device according to any one of claims 1 to 3, wherein: The wiring substrate is a space transformer that expands the interval between the inspection terminals to the interval between the wiring patterns of the printed circuit board when viewed in the normal direction of the main surface of the wiring substrate.

12. The electrical connection device according to any one of claims 1 to 3, wherein: The inspection terminal is a probe having one end connected to the first electrode of the wiring board and the other end in contact with a signal terminal of the inspection object.

13. The electrical connection device according to any one of claims 1 to 3, wherein: The inspection terminal is disposed in a test socket, and the test socket is connected to an external terminal of a package in which the inspection target object is mounted.

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